JP2005044967A - Electric circuit element with optical component - Google Patents

Electric circuit element with optical component Download PDF

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Publication number
JP2005044967A
JP2005044967A JP2003202447A JP2003202447A JP2005044967A JP 2005044967 A JP2005044967 A JP 2005044967A JP 2003202447 A JP2003202447 A JP 2003202447A JP 2003202447 A JP2003202447 A JP 2003202447A JP 2005044967 A JP2005044967 A JP 2005044967A
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Prior art keywords
electric circuit
circuit element
electrode
optical element
anisotropic conductive
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JP2003202447A
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Inventor
Kenji Mizobuchi
憲司 溝淵
Yoshinori Sunaga
義則 須永
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Hitachi Cable Ltd
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Hitachi Cable Ltd
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Priority to JP2003202447A priority Critical patent/JP2005044967A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Light Receiving Elements (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Semiconductor Lasers (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric circuit element with an optical component that can prevent connection failure between an electric circuit element and an optical component and can reduce leakage of electromagnetic wave resulting in crosstalk. <P>SOLUTION: An electric circuit element 1 with an optical component is provided with an electric circuit element 2 to which an optical element 4 is connected. An electrode 3 is formed on the upper surface 2u of the electric circuit element 2, an electrode 5 is formed on the lower surface 4d of the optical component 4, and the electric circuit element 2 and the electrodes 3 and 5 of the optical component 4 are pressed and connected facing each other with an anisotropic conductive member 6 in between. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電気回路素子に光素子が接続された光素子付き電気回路素子に関するものである。
【０００２】
【従来の技術】
光通信に使用される電子機器には、電気回路素子に光素子が接続された光素子付き電気回路素子が備えられている。図１０に示すような光素子付き電気回路素子１０１は、電気回路素子１０２上に電極１０３を形成し、光素子１０４が搭載された基板１０５上に電極１０６を形成し、ワイヤボンディングによって電気回路素子１０２の電極１０３と基板１０５の電極１０６とをワイヤ１０７で接続することで、電気回路素子１０２に光素子１０４を接続したものである。
【０００３】
また、図１１に示すような光素子付き電気回路素子１１１は、電気回路素子１１２上に電極１１３を形成し、半田付けによって電極１１３と光素子１０４とを接続することで、電気回路素子１１２に光素子１０４を直付けしたものである。
【０００４】
なお、この出願の発明に関連する先行技術文献情報としては、次のものがある。
【０００５】
【特許文献１】
特開平８−１１４７２８号公報
【０００６】
【発明が解決しようとする課題】
しかしながら、従来の光素子付き電気回路素子１０１は、ワイヤ１０７に高周波信号が流れると、ワイヤ１０７の周囲に電磁波が漏れてクロストークの原因になるという問題がある。
【０００７】
また、従来の光素子付き電気回路素子１１１は、電気回路素子１１２の線膨張係数と光素子１０４の線膨張係数とが互いに異なるので、半田付けの際や環境温度によって半田にクラックが入るおそれがあり、電気回路素子１１２と光素子１０４との接続不良が発生するという問題がある。
【０００８】
そこで、本発明の目的は、電気回路素子と光素子との接続不良を防止でき、クロストークの原因となる電磁波の漏れを低減できる光素子付き電気回路素子を提供することにある。
【０００９】
【課題を解決するための手段】
本発明は上記目的を達成するために創案されたものであり、請求項１の発明は、電気回路素子に光素子が接続された光素子付き電気回路素子において、上記電気回路素子の上面に電極を形成すると共に、上記光素子の下面に電極を形成し、上記電気回路素子および上記光素子の上記電極同士を異方性導電部材を介して対向するように押圧接続した光素子付き電気回路素子である。
【００１０】
請求項２の発明は、上記電極は、信号用電極と、その信号用電極の周囲に形成されるグランド用電極とからなる請求項１記載の光素子付き電気回路素子である。
【００１１】
請求項３の発明は、上記電極は、一つの信号用電極と、その信号用電極を取り囲むように形成される複数個のグランド用電極とからなる請求項２記載の光素子付き電気回路素子である。
【００１２】
請求項４の発明は、上記電極は、一つの信号用電極と、その信号用電極を取り囲むように形成される一つのグランド用電極とからなる請求項２記載の光素子付き電気回路素子である。
【００１３】
請求項５の発明は、上記電気回路素子と、上記光素子と、上記異方性導電部材とは、筐体内に収納され、その筐体によって上下から押圧される請求項１〜４いずれかに記載の光素子付き電気回路素子である。
【００１４】
請求項６の発明は、上記光素子と上記筐体間にスペーサを設けた請求項５記載の光素子付き電気回路素子である。
【００１５】
【発明の実施の形態】
以下、本発明の好適実施の形態を添付図面にしたがって説明する。
【００１６】
図１（ａ）は、本発明の好適実施の形態を示す光素子付き電気回路素子の組み立て分解図である。図１（ｂ）は光素子の下面図である。図１（ｃ）は異方性導電部材の平面図である。図１（ｄ）は電気回路素子の平面図である。
【００１７】
図１（ａ）〜図１（ｄ）に示すように、本発明に係る光素子付き電気回路素子１は、主として、光通信に使用される伝送速度が数Ｇｂｐｓ以上の光トランシーバなどの電子機器に備えられて用いられる。
【００１８】
光素子付き電気回路素子１は、ＩＣやＬＳＩなどの電気回路素子２の上面２ｕに電極３を形成し、半導体レーザ（ＬＤ）やフォトダイオード（ＰＤ）などの光素子４の下面４ｄに電極５を形成し、電気回路素子２および光素子４の電極３，５同士を異方性導電部材としての異方性導電シート６を介して対向するように上下方向Ｕ１，Ｄ１から押圧接続することで、電気回路素子２と光素子４とを電気的に接続したものである。
【００１９】
電極３は、全体が平面視で略正方形状に形成される。この電極３は、電気回路素子２の上面２ｕから若干盛り上がって形成される平面視で正方形状の一つの信号用電極（信号パッド）３ｓと、その信号用電極３ｓから絶縁された周囲に信号用電極３ｓを取り囲むように形成され、電気回路素子２の上面２ｕから信号用電極３ｓと同じ厚さだけ若干盛り上がった平面視で正方形状の複数個（図１（ａ）および図１（ｄ）では８個）のグランド用電極（グランドパッド）３ｇとからなる。
【００２０】
一方、電極５は、全体が下面視で略正方形状に形成される。この電極５は、光素子４の下面４ｄから若干盛り上がって形成される下面視で正方形状の一つの信号用電極５ｓと、その信号用電極５ｓから絶縁された周囲に信号用電極５ｓを取り囲むように形成され、光素子４の下面４ｄから信号用電極５ｓと同じ厚さだけ若干盛り上がった下面視で正方形状の複数個（図１（ａ）および図１（ｂ）では８個）のグランド用電極５ｇとからなる。
【００２１】
電極３，５は、すなわち、信号用電極３ｓ，５ｓおよびグランド用電極３ｇ，５ｇは、例えば、Ａｕ、Ａｇ、Ｃｕ、Ａｌなどの導電性が高い金属で形成される。本例では、Ａｕで形成された電極３，５を使用した。
【００２２】
異方性導電シート６の上面６ｕおよび下面６ｄには、電気回路素子２と光素子４との位置決めの基準となるマーカーｍがそれぞれ形成される。
【００２３】
ここで、異方性導電シート６について簡単に説明する。
【００２４】
図２（ａ）および図２（ｂ）に示すように、異方性導電シート６は、絶縁性シリコーンゴムなどの絶縁性を有する絶縁性シート７内に、絶縁性シート７の厚さと同じ長さの複数本の導電性針８が、絶縁性シート７の厚さ方向と平行になるように所定ピッチｐで格子状に互いに絶縁されて設けられたものである。導電性針８は、例えば、Ａｕ、Ａｇ、Ｃｕ、Ａｌなどの導電性が高い金属で形成される。本例では、Ａｕで形成された導電性針８を使用した。
【００２５】
この異方性導電シート６は、図３に示すように、上下面６ｕ，６ｄ（両面）から例えばブロック３１，３２で押圧すると、押圧した部分の絶縁性シート７が凹み、導電性針８が絶縁性シート７外に突き出るようになっている。ただし、図３ではブロック３１の方がブロック３２よりも押圧する面積が小さいので、ブロック３１で押圧された絶縁性シート７の上面６ｕのみが凹み、導電性針８が絶縁性シート７の上面６ｕのみから突き出る。
【００２６】
次に、光素子付き電気回路素子１の使用例を説明する。
【００２７】
図４に示すように、光素子付き電気回路素子１は、下から順に電気回路素子２と、異方性導電シート６と、光素子４とが、例えば、Ａｌなどの放熱性が高い金属で形成された筐体４１内に収納され、その筐体４１によって電気回路素子２および光素子４が上下から押圧され、電気回路素子２と光素子４とが電気的に接続されて使用される。
【００２８】
筐体４１は、上部が開口された箱状のパッケージ４１ｄと、そのパッケージ４１ｄの開口を閉じる板状のカバー４１ｕとからなる。パッケージ４１ｄの内底面から上端までの高さｈ４は、信号用電極３ｓおよびグランド用電極３ｇの厚さを含む電気回路素子２の厚さと、異方性導電シート６の厚さと、信号用電極５ｓおよびグランド用電極５ｇの厚さを含む光素子４の高さとの合計（光素子付き電気回路素子１の高さ）よりも若干低くなるようにする。
【００２９】
より詳細には、まず、予め異方性導電シート６の使用する導電性針８を決めておき、異方性導電シート６の上下面６ｕ，６ｄに図１（ａ）および図１（ｃ）で説明したマーカーｍをそれぞれ形成する。
【００３０】
次に、パッケージ４１ｄの内底面上に信号用電極３ｓおよびグランド用電極３ｇが上となるように電気回路素子２を搭載固定し、その電気回路素子２上に信号用電極３ｓおよびグランド用電極３ｇがマーカーｍからはみ出さないように異方性導電シート６を重ね、その異方性導電シート６上に光素子４を、信号用電極５ｓおよびグランド用電極５ｇが下となるように、かつ信号用電極５ｓおよびグランド用電極５ｇがマーカーｍからはみ出さないように搭載する。ここでは、パッケージ４１ｄに電気回路素子２を直接搭載固定する例で説明したが、パッケージ４１ｄに基板を介して電気回路素子２を搭載固定してもよい。
【００３１】
最後に、パッケージ４１ｄにカバー４１ｕを被せると、パッケージ４１ｄの内底面によって電気回路素子２が上方に押圧され、カバー４１ｕの下面によって光素子４が下方に押される。すなわち、異方性導電シート６の下面６ｄが信号用電極３ｓおよびグランド用電極３ｇによって上方向Ｄ４に押されて上方に凹み、異方性導電シート６の上面６ｕが信号用電極５ｓおよび信号用電極５ｇによって下方向Ｕ４に押されて下方に凹む。
【００３２】
これにより、異方性導電シート６の凹んだ部分の上下面６ｕ，６ｄから導電性針８が突き出るので、信号用電極３ｓ，５ｓ同士、各グランド用電極３ｇ，５ｇ同士が異方性導電シート６を介して対向するように押圧接続され、電気回路素子２と光素子４とが電気的に接続される。
【００３３】
また、図５に示すように、光素子４と筐体４１のカバー４１ｕ間に高さ調整用のスペーサ５１を設けてもよい。スペーサ５１としては、例えば、光素子４が損傷しないように樹脂などの軟らかい材質からなるものを使用する。スペーサ５１を使用すれば、パッケージ４１ｄの内底面から上端までの高さｈ５と、光素子付き電気回路素子１の高さｈとの差を調整できる。つまり、光素子付き電気回路素子１の筐体４１による押圧をより確実に行うことができ、電気回路素子２と光素子４とを電気的により確実に接続できる。
【００３４】
スペーサ５１として、フィンが形成されたものや、二つに分割形成されたものを用いれば、スペーサに放熱の機能を持たせることもできる。
【００３５】
このように、本発明に係る光素子付き電気回路素子１は、電気回路素子２の電極３と光素子４の電極５とを異方性導電シート６を介して対向するように押圧接続しており、ワイヤボンディングや半田付けを行わない点に特徴がある。
【００３６】
したがって、電気回路素子２の線膨張係数と光素子４の線膨張係数とが互いに異なっていても、電気回路素子２および光素子４の環境温度によるひずみの影響を異方性導電性シート６が吸収して緩和するので、電気回路素子２と光素子４との接続不良を防止できる。
【００３７】
特に、本例では、電極３，５および導電性針８をＡｕで形成しているので、電気回路素子２と光素子４とをＡｕ−Ａｕ接続によって、Ａｇ、Ｃｕ、Ａｌなどの金属に比べてより確実に電気的に接続できる。
【００３８】
また、電極３は一つの信号用電極３ｓとその周囲に形成される複数個のグランド用電極３ｇとからなり、電極５は一つの信号用電極５ｓとその周囲に形成される複数個のグランド用電極５ｇとからなっている。つまり、光素子付き電気回路素子１は、信号用電極３ｓ，５ｓ間を接続する複数本の導電性針８の周囲を、グランド用電極３ｇ，５ｇ間を接続する複数本の導電性針８で囲んだ構造である。グランド用電極３ｇ，５ｇ間を接続する複数本の導電性針８はグランド電位なので、信号用電極３ｓ，５ｓ間を接続する複数本の導電性針８を電磁的に遮蔽することになる。
【００３９】
したがって、電気回路素子２と光素子４間に高周波信号が流れても、電極３、電極５および異方性導電シート６内に電磁波を閉じ込めることができ、クロストークの原因となる電磁波の漏れを低減できる。
【００４０】
上記実施の形態では、全体が平面視で略正方形状に形成した電極３，５の例で説明したが、電極３，５の形状は特に限定されるものではなく、例えば、電極３，５を全体が平面視で略同心円状に形成してもよい。
【００４１】
信号用電極３ｓ，５ｓやグランド用電極３ｇ，５ｇについても同様であり、信号用電極３ｓ，５ｓやグランド用電極３ｇ，５ｇを平面視で正方形状ではなく、例えば、長方形状や円状に形成してもよい。
【００４２】
例えば、電極３，５としては、図６に一点鎖線で示したように、中心に平面視で円状に形成される一つの信号用電極６１ｓと、その信号用電極６１ｓから絶縁された周囲に信号用電極６１ｓを取り囲むように形成され、平面視で環状の一つのグランド用電極６１ｇとからなる同心円状の電極６１を使用してもよい。
【００４３】
この場合、信号用電極６１ｓの外径φｓ、グランド用電極６１ｇの内径φｇｉおよび外径φｇｏを適宜決定すると共に、異方性導電シート６の絶縁性シート７の誘電率εｒ、導電性針８の外径φおよびピッチｐを適宜決定すれば、信号用電極６１ｓ、グランド用電極６１ｇおよび異方性導電シート６で同軸ケーブルと類似の同軸構造を形成することができる。
【００４４】
特性インピーダンスが５０Ωの同軸ケーブルと類似の同軸構造を形成する場合、φｓ：０．０６ｍｍ、φｇｉ：０．３ｍｍ、εｒ：３．７３、φ：０．０２ｍｍ、ｐ：０．０４５ｍｍとする。
【００４５】
さらに、図１（ｄ）で説明した電極３の代わりに、図７に示すように、一つの信号用電極３ｓと、その信号用電極３ｓから絶縁された周囲に信号用電極３ｓを取り囲むように形成され、平面視で矩形枠状の一つのグランド用電極７３ｇとからなる電極７３を使用してもよい。
【００４６】
この電極７３を使用する場合には、図１（ｂ）で説明した電極５の代わりに、図８に示すように、一つの信号用電極５ｓと、その信号用電極５ｓから絶縁された周囲に信号用電極５ｓを取り囲むように形成され、下面視で矩形枠状の一つのグランド用電極８５ｇとからなる電極８５を使用する。
【００４７】
上記実施の形態では、予め異方性導電シート６の使用する導電性針８を決めた上で、異方性導電シート６の上下面６ｕ，６ｄに図１（ａ）および図１（ｃ）で説明したマーカーｍをそれぞれ形成したが、導電性針８の外径φおよびピッチｐが小さい異方性導電シート６を用いれば、使用する導電性針８を決めておく必要がなく、異方性導電シート６の上下面６ｕ，６ｄのどこにでもマーカーｍを形成できるので、電気回路素子２および光素子４の位置決めが容易になる。
【００４８】
また、図９に示すように、一つの電気回路素子２上に一枚の異方性導電シート６を重ね、その異方性導電シート６上に光素子４を複数個並列に所定間隔で搭載し、電気回路素子２と複数個の光素子４を押圧接続して光素子付き電気回路素子９１を構成すれば、一枚の異方性導電シート６で多数の光素子４を用いたパラレル伝送を行うことができ、複数個の光素子４が隣接することによるクロストークの増加を抑圧できる。
【００４９】
【発明の効果】
以上説明したことから明らかなように、本発明によれば、次のような優れた効果を発揮する。
【００５０】
（１）電気回路素子と光素子との接続不良を防止できる。
【００５１】
（２）クロストークの原因となる電磁波の漏れを低減できる。
【図面の簡単な説明】
【図１】図１（ａ）は、本発明の好適実施の形態を示す組み立て分解図である。図１（ｂ）は光素子の一例を示す下面図である。図１（ｃ）は異方性導電部材の平面図である。図１（ｄ）は電気回路素子の一例を示す平面図である。
【図２】図２（ａ）は異方性導電部材の平面図である。図２（ｂ）は図２（ａ）の２Ｂ−２Ｂ線断面図である。
【図３】異方性導電部材の使用例を示す断面図である。
【図４】光素子付き電気回路素子の一例を示す断面図である。
【図５】光素子付き電気回路素子の一例を示す断面図である。
【図６】図２（ａ）で示した異方性導電部材の使用例を示す平面図である。
【図７】電気回路素子の一例を示す平面図である。
【図８】光素子の一例を示す下面図である。
【図９】光素子付き電気回路素子の一例を示す斜視図である。
【図１０】従来の光素子付き電気回路素子の一例を示す斜視図である。
【図１１】従来の光素子付き電気回路素子の一例を示す斜視図である。
【符号の説明】
１ 光素子付き電気回路素子
２ 電気回路素子
２ｕ 電気回路素子の上面
３ 電極
３ｓ 信号用電極
３ｇ グランド用電極
４ 光素子
４ｄ 光素子の下面
５ 電極
５ｓ 信号用電極
５ｇ グランド用電極
６ 異方性導電シート（異方性導電部材）[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electric circuit element with an optical element in which an optical element is connected to the electric circuit element.
[0002]
[Prior art]
An electronic device used for optical communication includes an electric circuit element with an optical element in which the optical element is connected to the electric circuit element. An electric circuit element 101 with an optical element as shown in FIG. 10 has an electrode 103 formed on the electric circuit element 102, an electrode 106 formed on a substrate 105 on which the optical element 104 is mounted, and an electric circuit element by wire bonding. The optical element 104 is connected to the electric circuit element 102 by connecting the electrode 103 of 102 and the electrode 106 of the substrate 105 with a wire 107.
[0003]
Further, the electric circuit element 111 with an optical element as shown in FIG. 11 is formed on the electric circuit element 112 by forming the electrode 113 and connecting the electrode 113 and the optical element 104 by soldering. The optical element 104 is directly attached.
[0004]
The prior art document information related to the invention of this application includes the following.
[0005]
[Patent Document 1]
JP-A-8-114728 [0006]
[Problems to be solved by the invention]
However, the conventional electric circuit element 101 with an optical element has a problem that when a high-frequency signal flows through the wire 107, electromagnetic waves leak around the wire 107 and cause crosstalk.
[0007]
Further, in the conventional electric circuit element with optical element 111, since the linear expansion coefficient of the electric circuit element 112 and the linear expansion coefficient of the optical element 104 are different from each other, there is a risk that the solder may crack during soldering or due to environmental temperature. There is a problem that poor connection between the electric circuit element 112 and the optical element 104 occurs.
[0008]
Accordingly, an object of the present invention is to provide an electric circuit element with an optical element that can prevent a connection failure between the electric circuit element and the optical element and reduce leakage of electromagnetic waves that cause crosstalk.
[0009]
[Means for Solving the Problems]
The present invention has been devised to achieve the above object, and the invention of claim 1 is an electric circuit element with an optical element in which an optical element is connected to the electric circuit element, and an electrode is formed on the upper surface of the electric circuit element. And an electrode is formed on the lower surface of the optical element, and the electric circuit element with an optical element is press-connected so that the electrodes of the electric circuit element and the optical element are opposed to each other through an anisotropic conductive member It is.
[0010]
A second aspect of the present invention is the electrical circuit element with an optical element according to the first aspect, wherein the electrode comprises a signal electrode and a ground electrode formed around the signal electrode.
[0011]
The invention according to claim 3 is the electric circuit element with an optical element according to claim 2, wherein the electrode comprises one signal electrode and a plurality of ground electrodes formed so as to surround the signal electrode. is there.
[0012]
The invention according to claim 4 is the electric circuit element with an optical element according to claim 2, wherein the electrode comprises one signal electrode and one ground electrode formed so as to surround the signal electrode. .
[0013]
According to a fifth aspect of the present invention, the electrical circuit element, the optical element, and the anisotropic conductive member are housed in a housing and pressed from above and below by the housing. It is an electric circuit element with an described optical element.
[0014]
The invention according to claim 6 is the electric circuit element with an optical element according to claim 5, wherein a spacer is provided between the optical element and the housing.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings.
[0016]
FIG. 1A is an exploded view of an electric circuit element with an optical element showing a preferred embodiment of the present invention. FIG. 1B is a bottom view of the optical element. FIG. 1C is a plan view of the anisotropic conductive member. FIG. 1D is a plan view of the electric circuit element.
[0017]
As shown in FIG. 1A to FIG. 1D, an electric circuit element with an optical element 1 according to the present invention is mainly an electronic device such as an optical transceiver having a transmission rate of several Gbps or more used for optical communication. Used in preparation.
[0018]
In the electric circuit element 1 with an optical element, an electrode 3 is formed on an upper surface 2u of an electric circuit element 2 such as an IC or LSI, and an electrode 5 is formed on a lower surface 4d of the optical element 4 such as a semiconductor laser (LD) or a photodiode (PD). And the electrodes 3 and 5 of the electric circuit element 2 and the optical element 4 are pressed and connected from the up and down directions U1 and D1 so as to face each other through the anisotropic conductive sheet 6 as an anisotropic conductive member. The electric circuit element 2 and the optical element 4 are electrically connected.
[0019]
The electrode 3 is formed in a substantially square shape as a whole in plan view. The electrode 3 has a signal electrode (signal pad) 3s having a square shape in a plan view formed slightly rising from the upper surface 2u of the electric circuit element 2, and a signal insulator around the signal electrode 3s. A plurality of square shapes (in FIGS. 1A and 1D) are formed so as to surround the electrode 3s and slightly rise from the upper surface 2u of the electric circuit element 2 by the same thickness as the signal electrode 3s. 8) ground electrodes (ground pads) 3g.
[0020]
On the other hand, the electrode 5 is formed in a substantially square shape as viewed from the bottom. The electrode 5 is formed so as to surround the signal electrode 5 s around a signal electrode 5 s having a square shape in a bottom view formed slightly rising from the lower surface 4 d of the optical element 4 and insulated from the signal electrode 5 s. A plurality of squares (eight in FIG. 1 (a) and FIG. 1 (b)) that are formed in the bottom surface 4d of the optical element 4 and slightly raised from the lower surface 4d by the same thickness as the signal electrode 5s. It consists of an electrode 5g.
[0021]
The electrodes 3 and 5, that is, the signal electrodes 3 s and 5 s and the ground electrodes 3 g and 5 g are formed of a metal having high conductivity such as Au, Ag, Cu, and Al, for example. In this example, electrodes 3 and 5 made of Au were used.
[0022]
On the upper surface 6 u and the lower surface 6 d of the anisotropic conductive sheet 6, a marker m serving as a reference for positioning the electric circuit element 2 and the optical element 4 is formed.
[0023]
Here, the anisotropic conductive sheet 6 will be briefly described.
[0024]
As shown in FIGS. 2A and 2B, the anisotropic conductive sheet 6 has the same length as the thickness of the insulating sheet 7 in the insulating sheet 7 having insulating properties such as insulating silicone rubber. The plurality of conductive needles 8 are provided so as to be insulated from each other in a lattice shape at a predetermined pitch p so as to be parallel to the thickness direction of the insulating sheet 7. The conductive needle 8 is formed of a metal having high conductivity such as Au, Ag, Cu, and Al, for example. In this example, a conductive needle 8 made of Au is used.
[0025]
As shown in FIG. 3, when the anisotropic conductive sheet 6 is pressed from the upper and lower surfaces 6u, 6d (both sides) by, for example, the blocks 31, 32, the pressed insulating sheet 7 is recessed, and the conductive needle 8 is It protrudes out of the insulating sheet 7. However, in FIG. 3, the block 31 has a smaller pressing area than the block 32, so that only the upper surface 6 u of the insulating sheet 7 pressed by the block 31 is recessed, and the conductive needle 8 has the upper surface 6 u of the insulating sheet 7. Only stick out.
[0026]
Next, the usage example of the electric circuit element 1 with an optical element is demonstrated.
[0027]
As shown in FIG. 4, in the electric circuit element 1 with an optical element, the electric circuit element 2, the anisotropic conductive sheet 6, and the optical element 4 are made of a metal having high heat dissipation, such as Al, in order from the bottom. The electric circuit element 2 and the optical element 4 are pressed from above and below by the casing 41 so that the electric circuit element 2 and the optical element 4 are electrically connected and used.
[0028]
The housing 41 includes a box-shaped package 41d having an upper opening, and a plate-shaped cover 41u that closes the opening of the package 41d. The height h4 from the inner bottom surface to the upper end of the package 41d is the thickness of the electric circuit element 2 including the thickness of the signal electrode 3s and the ground electrode 3g, the thickness of the anisotropic conductive sheet 6, and the signal electrode 5s. In addition, the total height of the optical element 4 including the thickness of the ground electrode 5g (the height of the electric circuit element 1 with an optical element) is made slightly lower.
[0029]
More specifically, first, the conductive needle 8 to be used for the anisotropic conductive sheet 6 is determined in advance, and the upper and lower surfaces 6u and 6d of the anisotropic conductive sheet 6 are shown in FIGS. 1 (a) and 1 (c). Each of the markers m described in (1) is formed.
[0030]
Next, the electric circuit element 2 is mounted and fixed so that the signal electrode 3s and the ground electrode 3g are on the inner bottom surface of the package 41d, and the signal electrode 3s and the ground electrode 3g are mounted on the electric circuit element 2. The anisotropic conductive sheet 6 is overlaid so that it does not protrude from the marker m, and the optical element 4 is placed on the anisotropic conductive sheet 6 so that the signal electrode 5s and the ground electrode 5g are on the bottom. The electrode 5s for ground and the electrode 5g for ground are mounted so as not to protrude from the marker m. Here, the example in which the electric circuit element 2 is directly mounted and fixed on the package 41d has been described. However, the electric circuit element 2 may be mounted and fixed on the package 41d via a substrate.
[0031]
Finally, when the cover 41u is put on the package 41d, the electric circuit element 2 is pressed upward by the inner bottom surface of the package 41d, and the optical element 4 is pressed downward by the lower surface of the cover 41u. That is, the lower surface 6d of the anisotropic conductive sheet 6 is pushed upward by the signal electrode 3s and the ground electrode 3g to be recessed upward, and the upper surface 6u of the anisotropic conductive sheet 6 is the signal electrode 5s and the signal electrode. The electrode 5g is pushed downward U4 and dents downward.
[0032]
Thereby, since the conductive needle 8 protrudes from the upper and lower surfaces 6u, 6d of the recessed portion of the anisotropic conductive sheet 6, the signal electrodes 3s, 5s and the ground electrodes 3g, 5g are connected to the anisotropic conductive sheet. The electric circuit element 2 and the optical element 4 are electrically connected to each other through the pressure connection.
[0033]
As shown in FIG. 5, a height adjusting spacer 51 may be provided between the optical element 4 and the cover 41 u of the housing 41. As the spacer 51, for example, a spacer made of a soft material such as a resin is used so that the optical element 4 is not damaged. If the spacer 51 is used, the difference between the height h5 from the inner bottom surface to the upper end of the package 41d and the height h of the electric circuit element with optical element 1 can be adjusted. That is, the electric circuit element 1 with an optical element 1 can be more reliably pressed by the housing 41, and the electric circuit element 2 and the optical element 4 can be more reliably connected electrically.
[0034]
If the spacer 51 is formed with fins or divided into two, the spacer can have a heat dissipation function.
[0035]
Thus, the electric circuit element with an optical element 1 according to the present invention is formed by pressing and connecting the electrode 3 of the electric circuit element 2 and the electrode 5 of the optical element 4 with the anisotropic conductive sheet 6 facing each other. It is characterized in that wire bonding and soldering are not performed.
[0036]
Therefore, even if the linear expansion coefficient of the electric circuit element 2 and the linear expansion coefficient of the optical element 4 are different from each other, the anisotropic conductive sheet 6 is affected by the distortion caused by the environmental temperature of the electric circuit element 2 and the optical element 4. Since it absorbs and relaxes, the connection failure of the electric circuit element 2 and the optical element 4 can be prevented.
[0037]
In particular, in this example, since the electrodes 3 and 5 and the conductive needle 8 are made of Au, the electric circuit element 2 and the optical element 4 are connected to a metal such as Ag, Cu, and Al by Au—Au connection. Can be connected more securely.
[0038]
The electrode 3 is composed of one signal electrode 3s and a plurality of ground electrodes 3g formed around it, and the electrode 5 is one signal electrode 5s and a plurality of ground electrodes formed around it. It consists of an electrode 5g. In other words, the electric circuit element with an optical element 1 has a plurality of conductive needles 8 connecting the ground electrodes 3g and 5g around the plurality of conductive needles 8 connecting the signal electrodes 3s and 5s. It is an enclosed structure. Since the plurality of conductive needles 8 connecting the ground electrodes 3g and 5g are ground potential, the plurality of conductive needles 8 connecting the signal electrodes 3s and 5s are electromagnetically shielded.
[0039]
Therefore, even if a high frequency signal flows between the electric circuit element 2 and the optical element 4, the electromagnetic wave can be confined in the electrode 3, the electrode 5 and the anisotropic conductive sheet 6, and leakage of the electromagnetic wave causing the crosstalk can be prevented. Can be reduced.
[0040]
In the embodiment described above, the example of the electrodes 3 and 5 that are formed in a substantially square shape in plan view has been described. However, the shape of the electrodes 3 and 5 is not particularly limited. The whole may be formed substantially concentrically in a plan view.
[0041]
The same applies to the signal electrodes 3s and 5s and the ground electrodes 3g and 5g. The signal electrodes 3s and 5s and the ground electrodes 3g and 5g are not formed in a square shape in a plan view, for example, in a rectangular shape or a circular shape. May be.
[0042]
For example, as the electrodes 3 and 5, as shown by a one-dot chain line in FIG. 6, one signal electrode 61 s formed in a circle in a plan view at the center, and a periphery insulated from the signal electrode 61 s A concentric electrode 61 formed so as to surround the signal electrode 61s and including a single ground electrode 61g in plan view may be used.
[0043]
In this case, the outer diameter φs of the signal electrode 61s, the inner diameter φgi and the outer diameter φgo of the ground electrode 61g are appropriately determined, the dielectric constant εr of the insulating sheet 7 of the anisotropic conductive sheet 6, and the conductive needle 8 If the outer diameter φ and the pitch p are appropriately determined, the signal electrode 61s, the ground electrode 61g, and the anisotropic conductive sheet 6 can form a coaxial structure similar to a coaxial cable.
[0044]
When a coaxial structure similar to a coaxial cable having a characteristic impedance of 50Ω is formed, φs: 0.06 mm, φgi: 0.3 mm, εr: 3.73, φ: 0.02 mm, and p: 0.045 mm.
[0045]
Further, instead of the electrode 3 described with reference to FIG. 1D, as shown in FIG. 7, the signal electrode 3s is surrounded by one signal electrode 3s and the periphery insulated from the signal electrode 3s. It is also possible to use an electrode 73 that is formed and is composed of one ground electrode 73g that is rectangular in frame shape.
[0046]
When this electrode 73 is used, instead of the electrode 5 described in FIG. 1B, as shown in FIG. 8, there is one signal electrode 5s and a periphery insulated from the signal electrode 5s. An electrode 85 is used which is formed so as to surround the signal electrode 5s and is composed of one ground electrode 85g having a rectangular frame shape in a bottom view.
[0047]
In the above embodiment, the conductive needle 8 to be used for the anisotropic conductive sheet 6 is determined in advance, and the upper and lower surfaces 6u and 6d of the anisotropic conductive sheet 6 are shown in FIGS. 1 (a) and 1 (c). However, if the anisotropic conductive sheet 6 having a small outer diameter φ and pitch p of the conductive needle 8 is used, there is no need to determine the conductive needle 8 to be used. Since the marker m can be formed anywhere on the upper and lower surfaces 6u, 6d of the conductive sheet 6, the electric circuit element 2 and the optical element 4 can be easily positioned.
[0048]
Further, as shown in FIG. 9, one anisotropic conductive sheet 6 is stacked on one electric circuit element 2, and a plurality of optical elements 4 are mounted on the anisotropic conductive sheet 6 in parallel at a predetermined interval. When the electric circuit element 2 and the plurality of optical elements 4 are pressed and connected to form the electric circuit element 91 with an optical element, parallel transmission using a large number of optical elements 4 with a single anisotropic conductive sheet 6 is performed. And an increase in crosstalk due to the adjacent optical elements 4 can be suppressed.
[0049]
【The invention's effect】
As is apparent from the above description, according to the present invention, the following excellent effects are exhibited.
[0050]
(1) Connection failure between the electric circuit element and the optical element can be prevented.
[0051]
(2) Leakage of electromagnetic waves causing crosstalk can be reduced.
[Brief description of the drawings]
FIG. 1 (a) is an exploded view showing a preferred embodiment of the present invention. FIG. 1B is a bottom view showing an example of the optical element. FIG. 1C is a plan view of the anisotropic conductive member. FIG.1 (d) is a top view which shows an example of an electric circuit element.
FIG. 2 (a) is a plan view of an anisotropic conductive member. FIG. 2B is a cross-sectional view taken along line 2B-2B of FIG.
FIG. 3 is a cross-sectional view showing an example of use of an anisotropic conductive member.
FIG. 4 is a cross-sectional view showing an example of an electric circuit element with an optical element.
FIG. 5 is a cross-sectional view showing an example of an electric circuit element with an optical element.
6 is a plan view showing an example of use of the anisotropic conductive member shown in FIG.
FIG. 7 is a plan view showing an example of an electric circuit element.
FIG. 8 is a bottom view showing an example of an optical element.
FIG. 9 is a perspective view showing an example of an electric circuit element with an optical element.
FIG. 10 is a perspective view showing an example of a conventional electric circuit element with an optical element.
FIG. 11 is a perspective view showing an example of a conventional electric circuit element with an optical element.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electric circuit element with an optical element 2 Electric circuit element 2u Upper surface of an electric circuit element 3 Electrode 3s Signal electrode 3g Ground electrode 4 Optical element 4d Optical element lower surface 5 Electrode 5s Signal electrode 5g Ground electrode 6 Anisotropic conduction Sheet (anisotropic conductive member)

Claims (6)

電気回路素子に光素子が接続された光素子付き電気回路素子において、上記電気回路素子の上面に電極を形成すると共に、上記光素子の下面に電極を形成し、上記電気回路素子および上記光素子の上記電極同士を異方性導電部材を介して対向するように押圧接続したことを特徴とする光素子付き電気回路素子。In the electric circuit element with an optical element in which the optical element is connected to the electric circuit element, an electrode is formed on the upper surface of the electric circuit element, and an electrode is formed on the lower surface of the optical element. The electric circuit element and the optical element An electric circuit element with an optical element, wherein the electrodes are pressed and connected to face each other through an anisotropic conductive member. 上記電極は、信号用電極と、その信号用電極の周囲に形成されるグランド用電極とからなる請求項１記載の光素子付き電気回路素子。2. The electric circuit element with an optical element according to claim 1, wherein the electrode includes a signal electrode and a ground electrode formed around the signal electrode. 上記電極は、一つの信号用電極と、その信号用電極を取り囲むように形成される複数個のグランド用電極とからなる請求項２記載の光素子付き電気回路素子。3. The electric circuit element with an optical element according to claim 2, wherein the electrode includes one signal electrode and a plurality of ground electrodes formed so as to surround the signal electrode. 上記電極は、一つの信号用電極と、その信号用電極を取り囲むように形成される一つのグランド用電極とからなる請求項２記載の光素子付き電気回路素子。3. The electric circuit element with an optical element according to claim 2, wherein the electrode comprises one signal electrode and one ground electrode formed so as to surround the signal electrode. 上記電気回路素子と、上記光素子と、上記異方性導電部材とは、筐体内に収納され、その筐体によって上下から押圧される請求項１〜４いずれかに記載の光素子付き電気回路素子。The electric circuit with an optical element according to claim 1, wherein the electric circuit element, the optical element, and the anisotropic conductive member are housed in a housing and pressed from above and below by the housing. element. 上記光素子と上記筐体間にスペーサを設けた請求項５記載の光素子付き電気回路素子。6. The electric circuit element with an optical element according to claim 5, wherein a spacer is provided between the optical element and the housing.
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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353796A (en) * 1976-10-27 1978-05-16 Toray Industries Anisotropic conductive sheet and method of manufacture thereof
JPS57130382A (en) * 1981-02-05 1982-08-12 Shinetsu Polymer Co Conductive member
JPS6088574U (en) * 1983-11-24 1985-06-18 日本電気株式会社 Chip carrier type package connection structure
JPS62234804A (en) * 1986-04-03 1987-10-15 富士ゼロックス株式会社 Anisotropic conductive film
JPH0226082A (en) * 1988-07-15 1990-01-29 Sumitomo Electric Ind Ltd Photodiode
JPH04167553A (en) * 1990-10-31 1992-06-15 Matsushita Electric Ind Co Ltd Semiconductor device
JPH09293753A (en) * 1996-04-24 1997-11-11 Canon Inc Electric circuit part, manufacture thereof, conductive ball, conductive connecting member, and manufacture thereof
JPH11186670A (en) * 1997-12-22 1999-07-09 Canon Inc Surface type optical device and its manufacture
JP2000049414A (en) * 1998-07-27 2000-02-18 Canon Inc Optical function element device and optical transmitter- receiver, optical interconnection device and optical recorder using the same
JP2001059923A (en) * 1999-06-16 2001-03-06 Seiko Epson Corp Optical module, production thereof, semiconductor device and light transmission device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353796A (en) * 1976-10-27 1978-05-16 Toray Industries Anisotropic conductive sheet and method of manufacture thereof
JPS57130382A (en) * 1981-02-05 1982-08-12 Shinetsu Polymer Co Conductive member
JPS6088574U (en) * 1983-11-24 1985-06-18 日本電気株式会社 Chip carrier type package connection structure
JPS62234804A (en) * 1986-04-03 1987-10-15 富士ゼロックス株式会社 Anisotropic conductive film
JPH0226082A (en) * 1988-07-15 1990-01-29 Sumitomo Electric Ind Ltd Photodiode
JPH04167553A (en) * 1990-10-31 1992-06-15 Matsushita Electric Ind Co Ltd Semiconductor device
JPH09293753A (en) * 1996-04-24 1997-11-11 Canon Inc Electric circuit part, manufacture thereof, conductive ball, conductive connecting member, and manufacture thereof
JPH11186670A (en) * 1997-12-22 1999-07-09 Canon Inc Surface type optical device and its manufacture
JP2000049414A (en) * 1998-07-27 2000-02-18 Canon Inc Optical function element device and optical transmitter- receiver, optical interconnection device and optical recorder using the same
JP2001059923A (en) * 1999-06-16 2001-03-06 Seiko Epson Corp Optical module, production thereof, semiconductor device and light transmission device

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