JPH09293753A - Electric circuit part, manufacture thereof, conductive ball, conductive connecting member, and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an electric circuit part to be lessened in size, thickness, and manufacturing cost and enhanced in reliability by a method wherein an electric circuit element and an electric circuit board are connected together high in density, high in bonding properties, and low in connection resistance without additionally processing their electrodes. SOLUTION: An electric circuit part is equipped with an electric circuit element 1 with electrodes 2 and an electric circuit board 7 with electrodes 8 connected to the electric circuit element 1, wherein a conductive ball 6 composed of a nearly ball-shaped and rigid core 4 and a conductive coating layer 5 deposited around the surface of the core 4 is interposed between the electrodes 2 and 8. The conductive ball 6 is pressed against the electrode 2 of the electric circuit element 1 with the electrode 8 of the electric circuit board 7, and at least either the electrode 2 of the electric circuit element 1 or the electrode 8 of the electric circuit board 7 and the coating layer 5 of the conductive ball 6 are electrically and mechanically connected together.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric circuit component having an electric circuit element having an electrode portion and an electric circuit board having an electrode portion for connecting the electric circuit element, and an electric circuit component of the electric circuit component. The present invention relates to a manufacturing method, a conductive ball and a conductive connecting member used for connecting both electrode parts of the electric circuit component, and a manufacturing method of the conductive connecting member.

[0002]

2. Description of the Related Art Heretofore, various methods described below have been known as a manufacturing technique for an electric circuit component constituted by electrically connecting an electric circuit element to an electric circuit board. First, these manufacturing techniques will be divided.

(1) Wire Bonding Method FIG. 20 (a) schematically shows an electric circuit component including an IC 101, which is an electric circuit element, and a printed circuit board 102, which is an electric circuit board, connected by the wire bonding method. FIG. In this wire bonding method, first, the Ag paste 10 is formed on the printed circuit board 102.
4, the IC 101 is fixedly held on the printed circuit board 102, and then the electrode portion existing on the surface of the IC 101 and the wiring pattern 105 provided on the printed circuit board 102 are connected with gold or a wire having a diameter of 20 to 100 μm. It is configured to be electrically connected by using an ultrafine metal wire 103 made of aluminum.

After the connection, the resin 106 is dropped on the IC 101 by a potting method or the like to seal the IC 101 and the ultrafine metal wire 103 from the outside. In this way, the electric circuit components are finally set.

Further, this method uses a lead frame 107 as an electric circuit board as shown in FIG.
An IC 101 is formed on each lead frame 107 with an ultrafine metal wire 1
It is also used in the case of connecting via the H.O.P.O.3 and sealing with the resin 106 by the transfer molding method, and in the case of using the ceramic package as the electric circuit board.

(2) CCB (Controlled Collapse Bond)
ing) method FIGS. 21 (a) and 21 (b) and FIGS. 22 (a) and 2
2 (b) means U.S. Pat. No. 3,292,24, respectively.
The electrical connection method of the electric circuit element and the electric circuit board described in No. 0 and 3,303,393 is shown.

First, the electrical connection method shown in FIGS. 21A and 21B will be described. In this method, as shown in FIG. 21A, an electrode 108 is provided on the electrode portion provided on the surface of the electric circuit element 101, and then the surface of the electric circuit element is entirely covered with glass except for the electrode 108. A metal film 110, which is covered with the protective film 109 and has good adhesion with the (wiring) material of the electrode 108 and the glass protective film 109, is provided in the electrode portion. Here, the electrode 108 is exposed at the bottom of the opening provided in the glass protective film 109. As a result, the metal film 110 becomes the electrode 10 of the electrode portion.
8 and the glass protective film 109 around it.

Next, a first alloy ball (for example, Au 75 wt% Sb 25 wt%: melting point 360 ° C.) is formed on this electrode portion.
Is placed, and the electrode portion is heated until the melting point of the first alloy ball is exceeded to melt the first alloy ball, and the metal film 110 provided on the electrode portion is connected to the first alloy ball. . Then, the electrode portion is cooled to solidify the first alloy balls. As a result, the first alloy 111 is formed on the electrode 108.
To obtain an electric circuit element having a protrusion.

On the other hand, as shown in FIG. 21B, the first alloy 111 is formed on the wiring pattern 105 of the circuit board 113.
The second alloy 112 having a melting point lower than the melting point of (eg, Pb 90 wt% Sn 10 wt%: melting point 258 ° C.
(Solid) to 301 ° C. (liquid) is provided, and the first alloy 111 corresponds in a state in which the electric circuit element 101 having the first alloy 111 protruding in the electrode portion is turned upside down in FIG. The wiring pattern 105 is arranged in contact with the wiring pattern 105. After that, the electrode portion is formed at a temperature equal to or lower than the melting point of the first alloy 111, and
By heating to above the melting point of the second alloy 112,
The second alloy 112 without melting of the first alloy 111
Only the first alloy melts and the second alloy 112 and the first alloy 111 are connected.

Here, the electric circuit element 101 has an electric circuit board 113 corresponding to the protruding height of the first alloy 111.
Connected and fixedly arranged in a state of being lifted above. Therefore, the electric circuit element 101 and the electric circuit board 1
It is possible to surely prevent an electrical short circuit with 13, and since the cleaning liquid can easily enter the connection portion when removing the flux after melting, flux cleaning was performed to reliably remove contaminants. Electric circuit parts can be obtained.

As an application of this method, the second alloy 112
A dam (not shown) that prevents the first alloy 111 from flowing out on the electric circuit board 113 without melting.
And a metal film (BLM (Ball Limited M) that limits the size of the first alloy 111 by surface tension when the first alloy 111 is first melted on the electrode 108 of the electric circuit element 101.
etal) layers, for example Ti / Cu / Ni, Cr / Cu /
Au) is provided, and the first alloy 111 provided thereon
(For example, Pb 95 wt% SN 5 wt%) is melt-bonded to form solder bumps (height 100 to 200 μm), and then the solder bumps are melted again at the time of connection with the circuit board, and are laterally moved by the dam of the board 113. The CCB method is a method in which the electric circuit element is lifted by the surface tension of the solder whose spread is limited when the solder is melted and connected to the electrode portion of the substrate.

Further, this CCB method has been recently used in BGA.
(Ball Grid Array) method,
As a method of connecting the electrode portion of the semiconductor element package and the electrode portion of the printed circuit board, for example, Pb 40% Sn 60%,
Pb36% Sn62% Ag2%, Pb81% In19
%, Pb 90% Sn 10% solder bumps are formed on the electrodes of the package and are applied to the connection with the electrodes of the substrate.

Next, the connection method shown in FIGS. 22A and 22B will be described. In this method, as shown in FIG.
As shown in (a), the electrode 10 of the electrode portion of the electric circuit element
8 to the alloy layer 115 (for example, Pb 95 wt% Sn5 wt
%, Melting point 300 ° C. (solid) to 314 ° C. (liquid), and a ball 114 (for example, oxygen-free copper, diameter 127 to 1) made of a conductive material that does not deform at the melting temperature of the alloy layer 115 thereon.
52.4 μm) is placed and heated to the melting point of the alloy layer 115 to connect to the balls 114.

After that, as shown in FIG. 22B, the second alloy layer 11 having a lower melting point than the alloy layer 115 provided in the electric circuit element 101 on the wiring portion 105 on the circuit board 113.
6 (eg, Pb 90% Sn 10%, melting point 268 ° C.
(Solid) to 301 ° C. (liquid) is provided. And ball 1
22A shows the electric circuit element 101 to which 14 is connected.
It is arranged on the circuit board 113 in an upside-down state from the state shown in (1) so that the balls 114 contact the corresponding second alloy layer 116. Then, the electrode portion is provided with the second alloy layer 1
The second alloy layer 116 is melted by heating to the melting point of 16, and the balls 114 and the second alloy layer 116 are connected to obtain an electric circuit component.

In this method, the melting point (C
u: 1083 ° C.) is the first and second alloy layers 115, 11
Since the melting point of the second alloy layer 116 is significantly higher than the melting point of No. 6 and there is no possibility of melting at the time of heating for melting the second alloy layer 116, the heating temperature control range at the time of connection with the respective alloy layers 115 and 116 can be widened There is an advantage that connection is easy.

(3) For example, JP-A-59-13963
TAB (Tape Automated Bondin) disclosed in Japanese Patent No. 6
g) Method FIGS. 23B and 23C are cross-sectional views schematically showing electric circuit components connected by the TAB method.

This TAB method is an automatic bonding method using a tape carrier method. Below, this TAB
A typical example of the method will be described step by step.

First, as shown in FIG. 23 (a), IC1
No. 01 is formed on the entire surface of the semiconductor wafer. A multilayer barrier metal layer 118 (for example, Ti / W, Ti / Pt, C
(r / Cu, Cr / Ni, etc.) is formed by vapor deposition, a resist is applied thereon, and the resist is exposed and developed so as to have an opening on the electrode portion 108. Next, the barrier metal layer 11
Au bumps 119 are formed in the resist openings by electroplating using 8 as electrodes to a height of about 15 to 30 μm, and then the resist is peeled off. Further, the exposed barrier metal layer 118 is etched to form the electrode portion 108.
An Au bump 119 is formed on the top. Then, the semiconductor wafer is cut to obtain semiconductor chips with bumps.

Here, the carrier tape is shown in FIG.
As shown in FIG. 5, a lead pattern (thickness 18 to 35 μm) made of copper is formed on the insulating film 121 (for example, a polyimide film thickness 75 to 125 μm), and an opening is provided in the film at a portion connected to the semiconductor chip 101. The lead is exposed, and the surface has a thickness of 0.3 to 0.
It is formed to have an Sn-plated inner lead 120 of 5 μm.

Inner leads 12 of this carrier tape
0 and the gold bump 119 of the semiconductor chip 101 are aligned, and then the inner lead 120 and Au are thermocompression bonded by a temperature of about 500 ° C. and a pressure of 30 to 40 g / lead.
Au-Sn eutectic bonding is performed on the bumps 119 for connection. After the connection, the resin is dropped and cured to seal the semiconductor chip.

Next, as shown in FIG. 23C, the outer lead 122 is cut from the carrier tape to which the semiconductor chip 101 is connected, and the outer lead 122 and the land of the substrate are soldered 123 and anisotropically conductive. An electric circuit component is obtained by connecting with a film or the like.

Although different from the TAB method, as shown in FIG. 24, by using the Au bump 119 used in the TAB method, the Au bump 119 of the semiconductor chip 101 is directly connected to the electrode portion 105 of the circuit board 113 by heat. Connect by crimping,
There is also a method of obtaining electric circuit components.

(4) Resin ball method (HYBRIDS,
Vol. 8, No. 6, pp. 3-25, 1992) FIGS. 25 (a) and 25 (b) show a connection method using a conductive resin ball in which a conductive coating is provided on the surface of the resin ball. The connection method will be described below.

As shown in FIG. 25B, the conductive resin balls 124 are resin balls 126 having a diameter of 5 to 10 μm.
The surface is coated with Au to a thickness of 500 to several thousand angstroms by plating to form a conductive layer 127.
As shown in FIG. 25A, the conductive balls 124 are
The semiconductor chip 101 is placed on the electrode 105 of the substrate 113, and the uncured epoxy adhesive 125 is interposed on the substrate 113.
The adhesive is cured and the semiconductor chip 101 is fixed to the substrate 113 while being pressed so as to be deformed by about 20%. At this time, for electrical connection, the semiconductor chip 101 and the substrate 113 are fixed to each other at an interval after the conductive resin balls 124 are deformed, so that the elastic repulsion force due to the deformation of the resin balls 126 causes the conductive resin balls 124. By acting on the respective electrode portions 108 and 105 connected to each other, the Au layer 127 on the surface of the conductive resin ball 124 and each electrode 10
8 and 105 are obtained only by mechanical contact.

(5) Method for Connecting Anisotropic Conductive Sheets The methods shown in FIGS. 26 (a) and 26 (b) and FIG. 27 are the same as those in US Pat. Nos. 3,320,658 and 3,320,658, respectively.
The connection method shown in No. 541 and 222 is shown. The respective connection methods will be described below.

In each of these methods, an anisotropic conductive sheet in which a conductive material is held on a sheet made of an insulating material so that the conductive material is exposed on both sides of the sheet is arranged between the electrodes facing each other, and the electrodes are separated from each other. To connect.

In the method shown in FIGS. 26A and 26B, the conductive material 1 is applied to the sheet 129 made of a thermoplastic insulating material (eg, polyethylene terephthalate).
By embedding 28 (for example, Cu 80% Ag 15% P 5%), it is possible to hold a plurality of conductive materials 128 on one sheet instead of disposing one conductive material on each electrode 108 (for example, Cu). , Conductive material for connection 1
It is intended to improve the handling of 28. The sheet 129 is arranged so that the conductive material 128 is sandwiched between the electrodes 108 and heated, so that the conductive material 128 is melted and connected to the electrodes 108.

The conductive material 108 may be connected by any of welding, brazing (melting temperature of 450 ° C. or higher), and soldering (melting temperature of 450 ° C. or lower). In this method, the material 128 is connected to the electrode 108 in a liquid phase. In addition, the sheet 129 holding the conductive material 128 is thermoplastic due to the heat at this time so that it is softened and covers the periphery where the conductive material 128 and the electrode 108 are connected without a gap, and is cured in that state after heating connection. And insulate between the electrodes.

As shown in FIG. 26A, this anisotropic conductive sheet is a sheet 129 made of a thermoplastic insulating material.
A ball 128 made of a conductive material (diameter 25.4 μm
˜127 μm) is heated to a temperature at which the thermoplastic resin sheet 129 does not soften and the conductive material balls 128 do not soften, and is placed at a predetermined location (for example, an opening is provided). Then, the seat 129 softens, and the ball 128 can be arranged so as to project from both sides of the seat 129. When the heating is stopped, the seat 129 softens again, and the ball 128 is retained as shown in FIG. 26 (b). To do. By repeating this process, one sheet 1
A ball 128 made of a plurality of conductive materials is attached to the seat 29.
29, anisotropic conductive sheets protruding from both sides are obtained.

In the method shown in FIG. 27, the sheet 1 of insulating material is used.
The conductive material 130 arranged in 31 is so small that a plurality of conductive materials 130 are arranged in one electrode portion 108, and has a size and arrangement that does not short circuit between adjacent electrodes, so The purpose is to eliminate positioning with the anisotropic conductive sheet. In addition, the conductive material 1
Since the conductive material 130 is crushed by the pressure applied during connection and electrically connected by ensuring the contact area with the electrode, the conductive material 130 is made of lead or gold alloy, which is easily changed by pressure. Furthermore, by connecting by pressurization, it is possible to attach and detach the electric circuit component at the time of maintenance or design change.

In this anisotropic conductive sheet, the ridges of the grid are formed of an insulating material on the base sheet of the insulating material, and the metal of the conductive material is cast by using the ridges of the grid as a mold. Then, the base sheet and the ridges of the lattice are removed by etching or the like to obtain an anisotropic conductive sheet in which the conductive material is projected.

[0032]

However, the above-mentioned various conventional examples have the following problems as a technique relating to an electric circuit component constituted by electrically connecting an electric circuit element to an electric circuit board. is there.

(1) Wire Bonding Method When the connection portion of the IC 101 is designed to reach the inside of the IC 101, an extra fine metal connecting the connection portion to the wiring pattern 105 on the surface of the printed circuit board 102 holding the IC 101. The line 103 easily contacts the outer peripheral edge portion of the IC 101. When they come into contact with each other, not only the electrical characteristics are not satisfied due to electrical short circuit, but also the IC is destroyed. Therefore, if the length of the ultrafine metal wire 103 is increased and the rising height (h) from the connection portion is increased, the diameter of the ultrafine metal wire 103 is very thin and soft, and vibration or vibration during the manufacturing process may occur. There is a risk of deformation due to the resin pressure at the time of injecting the sealing resin, and the ultrafine metal wires 103 contacting or breaking.

Therefore, the connecting portion of the IC 101 is the IC 10
However, there is a problem in that it is necessary to place them around 1 and there is no choice but to be restricted by circuit design.

Al, which is usually used as an electrode film of the IC 101, is exposed to the atmosphere and therefore forms an insulating oxide film on its surface. Further, with the electrode portion exposed, various processes such as wafer back surface polishing, cutting into chips, and fixing and placement on the substrate are performed, so the exposed surface is contaminated, forming a contaminated layer. . Normally, by applying pressure and ultrasonic vibration at the time of connection, the oxide film and the contamination layer that hinder this connection are destroyed and removed, the intrinsic surface of the electrode is exposed, and this and the metal of the ultrafine metal wire 103 are diffused. By doing so, they are connected metallically. Therefore, the ultrafine metal wire 103 having a strength to which pressure and ultrasonic vibration are applied at the time of connection.
A tool (capillary) larger than the diameter of is required.
When the tool comes into contact with the adjacent ultrafine metal wire 103, the adjacent ultrafine metal wire 103 may be deformed or broken. Therefore, the ultrafine metal wire 1 adjacent to the tool
There is a constraint that the pitch dimension of the connecting portion (distance between the centers of the adjacent connecting portions) must have a certain distance so as not to contact 03.

Therefore, if the size of the IC is determined, the maximum number of connection parts is inevitably determined. In the wire bonding method, since the pitch dimension is as large as about 0.2 mm, there is a problem that the number of connecting portions must be reduced accordingly.

The height h of the ultrafine metal wire 103 measured from the connection portion on the IC 101 is usually 0.2 to 0.4 mm, but it is necessary to reduce this height to 0.2 mm or less. There is a problem that the ultrafine metal wire 103 in the vicinity of the Au ball is recrystallized due to the melting temperature at the time of forming the Au ball for connection and the height becomes high, and it is relatively difficult from the point of short-circuiting with the IC 101 described above. is there.

Therefore, it is difficult to reduce the mounting thickness H of the IC 101.

In the wire bonding method, the strength of the ultrafine metal wire 103 is low, and the IC 10 is formed only by the ultrafine metal wire 103.
1 cannot be held, so the ultrafine metal wire 103 is
The IC 101 must be fixedly held on the substrate 102 before being connected to. Therefore, the back surface of the IC 101 and the substrate 102 are adhered by Ag paste having a thickness of about 10 to 30 μm. The Ag paste is usually applied on the substrate 102 by a dispenser or the like, but the viscosity of the Ag paste, the protrusion pressure, the shape of the dispenser nozzle, the IC 10
The adhesive layer is not uniform due to various factors such as variations in the mounting pressure of No. 1 and the irregular bubble escape direction generated when the solvent in the Ag paste volatilizes during curing. The IC 101 has a maximum θ (= s on the substrate 102.
in-1 (a / L), diagonal length of IC 101: L, paste thickness: a) Tilt and fixed.

When the IC 101 is a light receiving element, this inclination causes a deviation in the optical path length incident on the light receiving surface, and in particular, the area type CCD whose IC size has recently been reduced from about 10 mm square to about 5 mm square. In a light-receiving element having a small IC size and a large number of light-receiving parts, such as
The inclination angle becomes large and the light receiving characteristic is deteriorated.

Therefore, when the IC 101 is a light receiving element, it is necessary to provide a region for mounting the position correcting component in the electric circuit component obtained by connecting, and even if the IC size is reduced, the electric circuit component is downsized. There is a problem that becomes difficult.

In the wire bonding method, the ultrafine metal wire 103 is present on the IC 101 to a height of about 0.2 to 0.4 mm as described in the above. When the IC 101 is a light receiving element, the light incident on the light receiving portion of the light receiving element and the surface of other elements is reflected by those surfaces and is incident on the light receiving portion reflected again by the ultrafine metal wire 103, and a ghost is generated in the light receiving signal. . Therefore, in order to prevent generation of a ghost signal, it is necessary to separate the connecting portion from the light receiving portion or to reduce the height of the ultrafine metal wire 103. However, it is relatively difficult to reduce the height of the ultrafine metal wire 103, as described above.

Therefore, when the IC 101 is a light receiving element, the connecting portion must be separated from the light receiving portion, which makes it difficult to reduce the size of the light receiving element.

In wire bonding, since connection is made for each connecting portion, the work time for wire bonding increases as the number of connecting portions increases, and production efficiency deteriorates.

(2) CCB Method Normally, with Al, which is the electrode material of the IC, which is an electric circuit element, the solder does not get wet due to the oxide film. Therefore, a metal film with good solder wetting must be formed on the electrode. In addition, it is usually necessary to form a multilayer film of 2 to 3 layers by vapor deposition, photolithography, and etching, and to form solder bumps on it, in order to further have a function of adhesion to the electrode film and prevention of solder diffusion. .

Therefore, there is a problem that the number of steps is large and the cost is high.

Since the formation of the solder bumps utilizes the surface tension at the time of melting, the amount of solder, the melting atmosphere, the flux, the B
LM size, BLM surface condition, heating temperature and its distribution,
Further, the shape, especially the height, tends to become non-uniform due to variations in the melting point due to variations in the alloy ratio of the solder (± 10 wt%), and usually approximately ± 10 μm to 20 μm vary. Furthermore, if the solder bumps are made smaller, these effects are more likely to appear, and large solder bumps or small bumps can be created locally, causing a short circuit between solder bumps when connecting to the circuit board, or a connection part that cannot be connected. In extreme cases, the IC rises due to uneven surface tension of the solder, such as the Manhattan phenomenon of chip parts.

Therefore, it is not possible to connect the connection portion, which cannot be connected due to the variation of the solder bump, by applying a load, because the IC is supported on the substrate by the surface tension of the solder.

Therefore, since it is difficult to control the solder bumps,
There is a problem that it is difficult to reduce the size of the connection portion.

A flux is used to improve wettability when the solder is melted at the time of forming the solder bumps and at the time of connection. Therefore, in order to secure the reliability of the IC, the flux used after connection must be removed, and cleaning and drying steps are required. Further, when the connecting portion is provided inside the IC, flux or cleaning liquid is likely to remain inside, which lowers reliability, and therefore careful cleaning is required.

Therefore, there is a problem that the number of steps is large and the cost is high.

Since the IC 101 is supported only by the surface tension when the solder bumps are melted during connection with the substrate, there is a limit between the size and number of the solder bumps and the weight of the IC 101 to be supported. (T. Kamei and MN
akayama, "Hybrid IC Struct"
ures Using Solder ReflowT
technology ", 28th Electrici
c Comp. Conf. Proc. , Pp172-1
82, 1978). Therefore, there is a problem that the number of connections (the number of solder bumps), the size of the solder bumps, and the size (weight) of the IC are limited.

In the method shown in FIG. 22, the connection is made by using a ball that does not deform at the solder melting temperature. However, after this ball is melted and connected with the solder previously provided on the electrode on the semiconductor element, the ball is fixed. It is difficult to hold the ball between the connecting portions unless the solder and the solder (melting point lower than that of the solder on the semiconductor element) provided on the electrodes on the substrate are melted again. Further, as the number of electrodes to be connected increases, the ball placement time becomes longer, and the placed balls must be placed at a low speed so that the placed balls do not shift due to vibration or the like during placement. Therefore, the production efficiency is reduced.

Furthermore, cleaning of the flux is also required for each connection.

Therefore, the number of steps is large and the production efficiency is low, resulting in high cost.

In the method shown in FIG. 22, the ball weight is very light (9.57 μ when the copper ball has d = 5 μm).
Since the solder is fused and fixed to the solder on the electrode 108 only by g), the height of the ball after the melting depends on the amount of solder and the alloy ratio on the electrode 108, the ball surface state, the ball size (weight),
Non-uniformity tends to occur due to variations in the surface tension of the solder during melting due to flux, melting atmosphere, melting temperature, distribution, and the like. This unevenness in height becomes more remarkable as the size of the ball becomes smaller.

On the other hand, the connection with the electrode 108 of the substrate is made by IC
Side heating temperature and heating time (320 ° C)
This is done by melting the solder on the electrode 108 of the substrate for -5 min). Therefore, the solder on the electrode 108 of the substrate needs to be formed thick (a large amount) so as to be in contact with the ball for connection even if the height variation exists.

Therefore, when the ball is made smaller, the weight of the ball becomes smaller, and the surface tension of the solder at the time of melting becomes relatively larger than its own weight, and the height variation becomes larger.
Therefore, thicker solder must be provided on the electrode 108 of the substrate, but it is usually difficult to form a thick film having an aspect ratio of more than 1, and it is difficult to reduce the size.

Oxygen-free copper, which is a ball material, has a melting point of 1083 ° C. but a softening point of 190 ° C. Even if the ball is not melted and deformed only at the solder melting temperature, a weight is applied. On the other hand, it easily deforms. Therefore, to eliminate the height variation by applying pressure during fusion connection, the semiconductor element and the substrate may come into contact with each other to cause a short circuit between the semiconductor element side end portion and the substrate wiring, or a gap between the semiconductor element and the substrate. Becomes smaller and the flux remains in the meantime.

Therefore, it is difficult to reduce the size of the connecting portion only by reducing the size of the ball.

Further, in the method shown in FIG. 22, since sufficient solder to connect the balls must be supplied from each electrode, the size of the electrode on which the solder is placed is larger than the ball diameter. Will be needed. For example, if the ball diameter is 12
The land width of the substrate is 25 with respect to 7 to 152.7 μm.
4-381 μm is also required.

(3) TAB Method If the connecting portion of the semiconductor chip 101 is designed to be inside the semiconductor chip 101, the length of the inner lead portion becomes long, and the exposed inner lead is easily deformed. Therefore, it becomes difficult to arrange all the inner leads on the Au bumps of each electrode of the semiconductor chip. Further, since the inner lead becomes long, the inner lead hangs down due to its own weight and comes into contact with the surface of the semiconductor chip other than the connection portion or the end portion on the semiconductor chip side.

Therefore, in order to prevent the length of the inner lead portion from becoming unnecessarily long, it is necessary to bring the electrodes of the semiconductor chip to the peripheral portion of the semiconductor chip, which causes a limitation in circuit design. There is.

Also in the TAB method, the connection pitch dimension is about 0.08 to 0.15 mm due to factors such as etching accuracy and strength of the inner leads and inner lead displacement due to thermal expansion of the carrier tape due to heating at the time of connection. .

Therefore, similarly to the problem of the wire bonding method, there is a problem that the number of electrodes that can be connected is limited depending on the size of the semiconductor chip.

A multilayer barrier metal layer and Au bumps are formed on the electrodes of the semiconductor chip by vapor deposition, photolithography, plating,
It is formed by a plurality of steps such as etching. Furthermore,
Since the Au bumps are formed in the state of the semiconductor wafer, the Au bumps are also formed on the semiconductor chip having the defective characteristic.

Therefore, the number of steps is large, and Au bumps are formed on unnecessary portions, which causes a problem of high cost.

When forming Au bumps on a semiconductor chip by electrolytic plating, a barrier metal layer is used as a common electrode layer for plating. Since the thickness thereof is as thin as several μm, the sheet resistance value is large, and the semiconductor wafer In recent years, the size has increased from 6 inches to 8 inches, which causes a large potential difference between the central portion and the peripheral portion, which is one of the factors that cause variations in the growth size of Au bumps. Therefore, Au bumps on a 6-inch semiconductor wafer usually have a variation in height of about ± 5 to 10 μm, and the variation width increases as the size of the semiconductor wafer increases.

Therefore, if the thickness of the barrier metal layer is increased, there is a problem that the under-etching under the Au bump due to the etching after plating increases, and the Al electrode of the semiconductor chip is etched during the etching.

Due to such height variations, only the high Au bumps come into contact with the inner leads and are pressed by the pressing jig (collet) at the beginning of connection. Therefore, a large weight is applied to the high-height bump, which causes a crack in the semiconductor chip, or is too crushed to short-circuit with an adjacent bump. In the case of a bump having a lower height, the pressure is insufficient and the bump cannot be connected, resulting in an open defect.

Therefore, the size of the semiconductor wafer will be increased in the future, and the variation in the height of the Au bumps will be large, so that there is a problem that connection failure is likely to occur.

Further, as shown in FIG. 24, when the Au bumps are directly connected to the substrate, such variation in height of the Au bumps causes the semiconductor chip to collet even if the pressure collet and the substrate are parallel to each other. Since it is inclined with respect to, the weight distribution becomes non-uniform, and cracks may occur in the semiconductor chip or short-circuit between adjacent bumps in the high load region. Further, in the low weight region, there is a problem that the connection becomes insufficient and an open defect occurs. These problems are exacerbated when the pressure collet is not parallel.

(4) Resin Ball Method In this method, connection is obtained by the elastic repulsive force of the resin balls 124. Therefore, a change in the distance between the semiconductor chip 101 and the substrate 113 results in a change in contact pressure and a change in contact resistance value. Since the adhesive (resin) maintains this space, the coefficient of thermal expansion is larger than that of the semiconductor chip 101 or the substrate 113, which is mainly an inorganic material, and the size of the whole changes in a similar manner due to temperature change. Rather, this distance changes greatly with respect to the semiconductor chip 101 and the substrate 113.

Therefore, there is instability in which the contact resistance fluctuates with respect to temperature changes. Further, in the case where an epoxy resin is used as the adhesive, the Tg point is 100 to tens of degrees Celsius, so that the adhesive softens especially in a high temperature environment, so that the contact portion opens and the contact resistance sharply increases. There is a point.

The thickness of the conductive layer is very thin so that the conductive layer 127 on the surface follows the deformation of the resin balls 124. Therefore, the cross-sectional area of the conductive path is very small. For example, the resin ball 124 has a diameter of 7.5 μm, Au
Ball with a thickness of 0.05 μm is deformed by 15% and height is 6.4
When the conductive path of one conductive resin ball 124 connected with 6 μm and a width of 8.74 μm is calculated approximately as a cylinder of the above size, it becomes 114 mΩ. for that reason,
If the value of the current that can be applied increases, the conductive resin ball 12
Not only does 4 heat up and soften the adhesive around it,
The softening of the resin balls 124 also lowers the contact pressure, making it impossible to electrically connect the conductive layer 127 to the electrodes.

Therefore, if the thickness of the conductive layer 127 is increased and the resistance value is reduced, the plastic deformation of the metal of the conductive layer 127 becomes large, which hinders the elastic repulsive force of the resin ball 124 and lowers the contact pressure. It is difficult to increase the thickness of the conductive layer 127 because it causes defects.

Therefore, the value of the energizing current for connection is limited. Therefore, there is a problem that the connectable electric circuit elements such as a liquid crystal driver IC that normally supplies almost no current are limited.

Further, when the energizing current is increased, a large number of conductive resin balls 124 are arranged in the connection and they are connected in parallel, so that there is a problem that the electrode portion cannot be downsized.

(5) Anisotropic Conductive Sheet Method In the method shown in FIGS. 26A and 26B, 128 balls made of a conductive material are melted and connected to the electrodes 108. Therefore, a flux that removes the oxide film and the contaminated layer on the surface of the electrode and the conductive material and exposes the intrinsic surface is required for connection. However, since the sheet 129 is thermoplastic and softens due to the temperature at the time of connection and covers the electrodes without gaps, the flux cannot be washed after the connection. Therefore, since the flux remains near the connection and the electrodes are corroded, the reliability of the electric circuit component is reduced. When the flux is not used, the work is carried out in an inert gas atmosphere or a reducing gas atmosphere, which is not preferable in terms of workability and cost.

In the method shown in FIGS. 26 (a) and 26 (b), the balls 128 made of a conductive material are heated one by one and placed and fixed on the sheet 129. Therefore, when the number of conductive balls 128 to be connected increases, It takes time to dispose the conductive balls 128 on one sheet 129, and the production efficiency is poor.

Therefore, when the number of connections increases, there is a problem that the production efficiency becomes poor and the cost becomes high.

In the method shown in FIG. 27, the conductive material 130 is also arranged in a portion other than the electrode 108 to be connected so that the anisotropic conductive sheet 131 and the electrode 108 need not be aligned with each other. Therefore, the conductive material 130 protruding from the sheet surface comes into contact with a portion other than the electrode 108.

The normally connected electric circuit board 113 has a wiring pattern connected to the electrodes 108 on its surface,
In order to protect the wiring pattern, the connected electrode 108
Other than the above, it is usually coated with an insulating material (for example, solder resist). The thickness of the coated wiring portion is equal to the wiring thickness + the insulating coating layer thickness, which is larger than the wiring thickness of the electrode 108 to be connected.

Therefore, at the time of connection, the conductive material 130 of the anisotropic conductive sheet 131 and the insulating layer on the wiring make the first contact. In order to connect between the electrodes 108 desired to be connected, the conductive material 130 of the anisotropic conductive sheet 131 in contact with a portion other than the electrodes 108 is deformed to a greater extent,
The conductive material 130 disposed between the desired electrodes 108 must be in contact with the electrodes 108.

Therefore, the conductive material 130 in contact with parts other than the electrodes 108 is always applied with a force larger than that of the conductive material 131 provided in the connection portion, thereby destroying the insulating layer or between the wirings of one substrate 113 and A short circuit may occur between the wirings of the two substrates 113 to be connected.

To prevent this, the insulating layer is stopped, and in the region of the anisotropic conductive sheet 131 where the conductive material 130 exists,
In addition to the connecting portions of the substrate 113, the same wiring interval as that of the connecting portions is provided, and further, not only the electrodes 108 but also the wiring of each substrate 113 must be mirror-symmetrically arranged with respect to the surface of the anisotropic conductive sheet 131. This is the connecting electrode 10.
This is the same as the size of No. 8 becoming larger.

Therefore, there is a problem that miniaturization is difficult because the wiring pattern is limited.

In the system shown in FIG. 27, the anisotropic conductive sheet 131 and the electrodes 108 are aligned with each other. Therefore, the number of conductive materials 130 arranged on the electrodes 108 is
You will always touch it with a certain width.

Further, when the pitch dimension of the electrodes 108 to be connected becomes smaller, a plurality of conductive materials 130 must be arranged on the electrodes 108, and therefore, at least half or less of the pitch dimension of the electrodes 108 is set. Pitch dimensions must be realized. Therefore, the patterning accuracy that is more than twice the patterning accuracy of the electrode 108 is required, and there is a limit to the connectable pitch dimension.

Therefore, since the connection resistance value and the allowable current value between the electrodes 108 always have variations and the connection pitch size is limited, there is a problem that miniaturization is difficult.

In the method shown in FIG. 27, the conductive material 130 is cast into the ridges of the grid of insulating material formed on the base sheet of the insulating material to form the ridges of the insulating base sheet and the grid of insulation. By etching, the ridge portions of the lattice become an insulating sheet, and the conductive material 130 is exposed from both surfaces of the insulating sheet.

Therefore, even if the conductive material 130 is exposed from the surface of the insulating sheet, covering the surface of the sheet and covering the conductive material 130 with the sheet are adjacent to each other during casting. It is difficult because the conductive materials are short-circuited and it is difficult to manufacture a grid-like ridge having a wide opening diameter with a narrow base sheet side and opening side.

Therefore, the conductive material 130 must be held on the sheet 131 only by the frictional force of the side wall of the sheet.
The conductive material is easily dropped off due to vibration or the like when the anisotropic conductive sheet 131 is transported and arranged.

Therefore, the conductive material 1 is surely deposited on the electrode 108.
It is difficult to dispose 30 and there is a problem that a connection failure occurs. A first object of the invention according to this application is to connect an electric circuit element and an electric circuit board at high density with a low connection resistance, without performing special additional processing on each electrode portion. This makes the electric circuit parts smaller,
Achieving thinness, high reliability, and cost reduction.

A second object of the invention according to this application is to achieve small size, thin shape, high reliability and low cost of electric circuit parts by improving the bondability.

A third object of the invention according to this application is to further reduce the size and thickness of electric circuit parts by reducing the size and density of the conductive balls.

A fourth object of the invention according to this application is to prevent the occurrence of defective bonding due to uneven pressure distribution at the time of connection by keeping the semiconductor elements parallel to each other at a high density. .

A fifth object of the invention according to this application is to achieve the connection of the light-emitting element and the light-receiving element with high accuracy, whereby the mounting adjustment of the electric circuit parts can be significantly eased.

A sixth object of the invention according to this application is to arrange the light receiving surface of the light receiving element serving as the optical reference and the substrate serving as the assembly reference with high accuracy, thereby reducing the size of the electric circuit component and the light receiving characteristics. To achieve improvement and stability.

A seventh object of the invention according to this application is to improve the density by arranging a plurality of conductive members that are connected to the electrodes of the electric circuit element and the electric circuit board with high accuracy to increase the density. It is to achieve further miniaturization and thinning.

An eighth object of the invention according to this application is to reduce the ghost light incident on the light receiving element and improve the light receiving characteristics of the electric circuit component.

A ninth object of the invention according to this application is to provide a method of manufacturing an electric circuit component which realizes further miniaturization of the electric circuit component.

The tenth object of the invention related to this application is to:
An object of the present invention is to provide a method of connecting electric circuit components having different connection conditions by individually connecting an electric circuit element and a conductive member that connects an electrode of an electric circuit board.

[0104]

According to a first aspect of the present invention, an electric circuit component according to the present invention is connected to an electric circuit element having an electrode portion and the electric circuit element. In an electric circuit component provided with an electric circuit board having an electrode portion for, the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are interposed, and are provided around a core having a substantially ball-shaped rigidity. At least one conductive ball provided with a conductive coating layer is provided, and the conductive ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to form an electrode portion of the electric circuit element. And the coating layer of the conductive ball, and between the electrode portion of the electric circuit board and the coating layer of the conductive ball are electrically and mechanically connected.

Also, the electric circuit component according to the present invention is
According to the second aspect, the electric circuit element having the electrode portion and the electric circuit board having the electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other,
In an electric circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to connect the both electrode portions, the conductive ball is a metal having high rigidity. A substantially spherical core made of at least one of a material and an inorganic material, and a conductive coating layer formed of a material having electrical conductivity and coated around the core. Between the electrode portion of the circuit element and the electrode portion of the electric circuit board, and between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating layer. The spaces are characterized by being connected by metalizing and / or alloying the materials forming each.

The electric circuit component according to the present invention is
According to claim 3, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. Are opposed to each other, and are sandwiched between respective electrode portions, and at least one or more conductive balls electrically and mechanically connecting the both electrode portions are provided.
The conductive ball, a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
The conductive ball is formed of a material having electrical conductivity, and is provided with a conductive coating layer that is coated around the core, wherein the conductive ball is pressure-contacted by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, Between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating layer, the materials constituting each are metalized and / or alloyed. It is characterized by being connected by.

Also, the electric circuit component according to the present invention is
According to claim 4, in an electric circuit component including a photoelectric conversion element having an electrode portion and an electric circuit board having an electrode portion for connecting to the photoelectric conversion element, the electrode portion of the photoelectric conversion element is provided. At least one conductive ball is provided between the electrode portion of the electric circuit board and a core having a substantially ball-shaped rigidity, and a conductive coating layer is provided around the core. The electrode portion of the conversion element and the electrode portion of the electric circuit board are pressure-contacted to each other, and between the electrode portion of the photoelectric conversion element and the coating layer of the conductive ball, and between the electrode portion of the electric circuit board and the conductive ball. It is characterized in that it is electrically and mechanically connected to the coating layer.

Also, the electric circuit component according to the present invention is
According to claim 5, an electric circuit element having an electrode portion and an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other,
In an electric circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to connect the two electrode portions, the electric circuit element is at least one or more. A photoelectric conversion element, the electric circuit board has a light-transmitting property in at least a part thereof, and the conductive balls have a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material. And a conductive coating layer formed of a material having electrical conductivity and covering the periphery of the core, wherein the conductive ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. And metalizing and / or metalizing the materials forming the electrode portion of the electric circuit element and the conductive coating layer, and the electrode portion of the electric circuit substrate and the conductive coating layer, respectively. Alloyed Is characterized in that has been continued.

The electric circuit component according to the present invention is
According to claim 6, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. Are opposed to each other, and are sandwiched between respective electrode portions, and at least one or more conductive balls electrically and mechanically connecting the both electrode portions are provided.
The electric circuit element has at least one or more photoelectric conversion elements, the electric circuit board has a light-transmitting property in at least a part thereof, and the conductive ball is at least one of a highly rigid metal material and an inorganic material. Comprising a core having a substantially spherical shape and a conductive coating layer formed of a material having electrical conductivity and covering the periphery of the core, wherein the conductive ball has an electrode portion of the electric circuit element and the The electrode portion of the electric circuit board is pressure-contacted, and the electrode portion of the electric circuit element and the conductive coating layer, and the electrode portion of the electric circuit board and the conductive coating layer respectively constitute. It is characterized in that the materials are connected by metalizing and / or alloying.

Also, the electric circuit component according to the present invention is
According to claim 7, in an electric circuit component including an electric circuit element having an electrode portion and an electric circuit board having an electrode portion for connecting to the electric circuit element, an electrode portion of the electric circuit element At least one conductive ball, which is interposed between the electrode portion of the electric circuit board and has a conductive coating layer around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball. Which is formed of a material having an electrical insulation property, so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding the conductive balls, wherein the conductive balls are pressed against each other by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and one of the holding sheet and the electrode portion of the electric circuit element is pressed. Between a part of the coating layer of the conductive ball protruding from the surface of the electric circuit board, and between the electrode part of the electric circuit board and a part of the coating layer of the conductive ball protruding from the other surface of the holding sheet. Is characterized by being electrically and mechanically connected.

Also, the electric circuit component according to the present invention is
According to claim 8, an electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other,
A holding sheet for embedding and holding the conductive ball in an electric circuit component in which at least one conductive ball is interposed between the electrode part of the electric circuit element and the electrode part of the electric circuit board to connect the two electrode parts. Which is formed of a material having an electrical insulation property, so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding the conductive balls is provided, wherein the conductive balls are formed of a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material, and a material having electrical conductivity, With a conductive coating layer coated around,
The conductive ball is pressure-contacted by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and the conductive coating of the conductive ball protruding from the electrode portion of the electric circuit element and one surface of the holding sheet. The material forming the respective portions between the layer portion and between the electrode portion of the electric circuit board and the portion of the conductive coating layer of the conductive ball protruding from the other surface of the holding sheet. It is characterized in that they are connected by being metallized and / or alloyed.

The electric circuit component according to the present invention is
According to claim 9, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. And at least one conductive ball which is sandwiched between the respective electrode parts in a state of facing each other and electrically and mechanically connects the both electrode parts, and a holding sheet which embeds and holds the conductive ball. A conductive ball formed of a material having electrical insulation so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. And a holding sheet for holding the conductive ball, wherein the conductive ball is formed of a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material, and a material having electrical conductivity. A conductive coating layer that is coated around the conductive ball, and the conductive balls are pressed against each other by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to form one of the electrode portion of the electric circuit element and the holding sheet. Between the portion of the conductive coating layer of the conductive ball protruding from the surface of,
The electrode portion of the electric circuit board and the portion of the conductive coating layer of the conductive ball protruding from the other surface of the holding sheet are connected by metallizing and / or alloying the material forming each of them. It is characterized by being done.

Also, the electric circuit component according to the present invention is
According to claim 10, in an electric circuit component including a photoelectric conversion element having an electrode section and an electric circuit board having an electrode section for connecting to the photoelectric conversion element, an electrode section of the photoelectric conversion element is provided. At least one conductive ball, which is interposed between the electrode portion of the electric circuit board and has a conductive coating layer around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball. Which is formed of a material having an electrical insulation property, so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding a conductive ball, wherein the conductive ball is pressed into contact with the electrode portion of the photoelectric conversion element and the electrode portion of the electric circuit board, the electrode portion of the photoelectric conversion element and the holding sheet Between the part of the coating layer of the conductive ball protruding from one surface, and between the electrode part of the electric circuit board and the part of the coating layer of the conductive ball protruding from the other surface of the holding sheet. It is characterized by being connected electrically and mechanically.

Also, the electric circuit component according to the present invention is
According to claim 11, the electric circuit element having the electrode portion and the electric circuit substrate having the electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element is provided. In an electric circuit component in which at least one conductive ball is interposed between the electrode part and the electrode part of the electric circuit board to connect the two electrode parts, a holding sheet for embedding and holding the at least one conductive ball Which is formed of a material having an electrical insulation property, so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. A holding sheet for holding the conductive balls is provided, the electric circuit element has at least one or more photoelectric conversion elements, the electric circuit board has a light-transmitting property at least in part, and the holding sheet is It has a light transmittance lower than that of air or a sealing resin, and is formed to have an opening in a portion corresponding to the photoelectric conversion element, and the conductive ball is made of at least one of a highly rigid metal material and an inorganic material. And a conductive coating layer that is formed of a material having electrical conductivity and that is coated around the core, and the conductive ball includes an electrode portion of the electric circuit element and the electrical circuit. Between the electrode portion of the electric circuit element and the portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, which is pressed by the electrode portion of the circuit board, and the electrode of the electric circuit board. The portion and the portion of the conductive coating layer of the conductive ball protruding from the other surface of the holding sheet are connected by metalizing and / or alloying the material forming each of them. As .

Also, the electric circuit component according to the present invention is
According to claim 12, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. At least one conductive ball that is sandwiched between the respective electrode parts in a state of facing each other and electrically and mechanically connects the two electrode parts, and at least one conductive ball is embedded and held. A holding sheet, which is formed of a material having an electrical insulation property, such that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. ,
A holding sheet for holding the conductive balls, the electric circuit element has at least one photoelectric conversion element, and the electric circuit board has a light-transmitting property in at least a part of the holding sheet. Has a light transmittance lower than that of air or sealing resin, and is formed to have an opening in a portion corresponding to the photoelectric conversion element, and the conductive ball is made of at least a metal material and an inorganic material having high rigidity. A core having a substantially spherical shape composed of one side, and a conductive coating layer formed of a material having electrical conductivity and covering the periphery of the core, the conductive ball being an electrode portion of the electric circuit element. Between the electrode portion of the electric circuit element and the portion of the conductive coating layer of the conductive ball that is pressed against the electrode portion of the electric circuit board and protrudes from one surface of the holding sheet, and the electric circuit board The electrode portion and the portion of the conductive coating layer of the conductive ball protruding from the other surface of the holding sheet are connected by metallizing and / or alloying the material forming each of them. It has a feature.

Also, the electric circuit component according to the present invention is
According to the thirteenth aspect, the distance between the electrode portions connected by the conductive balls is substantially equal to the diameter of the core.

Also, the electric circuit component according to the present invention is
According to claim 14, the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface.

Also, the electric circuit component according to the present invention is
According to the fifteenth aspect, the outer peripheral surface of the core is formed into a smooth curved surface.

Also, the electric circuit component according to the present invention is
According to a sixteenth aspect, the outer peripheral surface of the conductive coating layer is formed in an uneven shape.

Also, the electric circuit component according to the present invention is
According to a seventeenth aspect, the inner peripheral surface of the conductive coating layer is formed in an uneven shape.

Also, the electric circuit component according to the present invention is
According to the eighteenth aspect, the outer peripheral surface of the core is formed in an uneven shape.

The electric circuit component according to the present invention is
According to a nineteenth aspect, a plurality of conductive balls are provided between the both electrode portions.

The electric circuit component according to the present invention is
According to the description of claim 20, between the substrate and the element,
It is characterized by being resin-sealed.

The electric circuit component according to the present invention is
According to a twenty-first aspect of the present invention, the holding sheet is formed with a notch and / or a slit so that it can be torn.

The electric circuit component according to the present invention is
According to a twenty-second aspect, the conductive coating layer is formed of a substance having an electric resistivity of 1.6E-8 to 10E-8Ω · m.

The electric circuit component according to the present invention is
According to a twenty-third aspect, the conductive coating layer has a film thickness set to 1 to 50 μm.

The electric circuit component according to the present invention is
According to a twenty-fourth aspect, the conductive coating layer has a thickness set to 3 to 20 μm.

The electric circuit component according to the present invention is
According to claim 25, the core has a diameter of 3
To 500 μm.

Also, the electric circuit component according to the present invention is
According to claim 26, the core has a diameter of 1
It is characterized by being set to 0 to 200 μm.

The electric circuit component according to the present invention is
According to claim 27, the core has a rigidity such that the displacement amount of the diameter thereof is 5% or less when a load required for connection between both electrodes is applied. Is characterized by.

The electric circuit component according to the present invention is
According to claim 28, the core has rigidity such that the displacement amount of the diameter thereof is 1% or less when a load required for connection between both electrodes is applied. Is characterized by.

The electric circuit component according to the present invention is
According to claim 29, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrodes connected at Rmax, and is not more than twice the film thickness of the conductive coating layer. It has a feature.

According to a thirtieth aspect of the present invention, there is provided an electric circuit component manufacturing method according to the present invention, which has an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In the method of manufacturing an electric circuit component including a substrate, at least one or more conductive balls having a coating layer having conductivity around a core having a substantially ball-shaped rigidity, the electrode portion of the electric circuit element and the electric circuit. A first step of interposing it between the electrode part of the substrate and a second step of pressing the conductive ball by the electrode part of the electric circuit element and the electrode part of the electric circuit board; The third step of heating the conductive coating layer to a predetermined temperature, the conductive coating layer between the electrode portion of the electric circuit element and the conductive ball, and the electrode portion of the electric circuit board and the front by the pressing and heating. And a conductive coating layer between the conductive balls by respectively moving, fourth contacting said core and two electrode portions
And a fifth step of cooling the conductive coating layer to maintain contact between the core and both electrode portions to metallize or alloy the conductive coating layer and both electrode portions. Is characterized by.

According to the 31st aspect of the present invention, there is provided an electric circuit device having an electrode part for connecting the electric circuit element having the electrode part and the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a conductive ball having a conductive coating layer around a core having a substantially ball-shaped rigidity is provided in the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. A first step of mounting at least one or more on one of the electrodes, and the other of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are overlapped on the conductive ball, and the conductive ball is placed on both electrodes. And a third step of pressing the conductive balls by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and a predetermined temperature of the conductive coating layer of the conductive balls. And a conductive coating layer between the electrode portion of the electric circuit element and the conductive ball, and between the electrode portion of the electric circuit board and the conductive ball by the pressing and heating. Moving the conductive coating layer respectively to contact the core and the electrode portions with each other; and cooling the conductive coating layer to maintain contact between the core and the electrode portions. And a sixth step of metallizing or alloying the conductive coating layer and both electrode portions.

According to a thirty-second aspect of the present invention, there is provided an electric circuit component manufacturing method according to the present invention, wherein the electric circuit device has an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In a method for manufacturing an electric circuit component including a substrate, a diameter of a conductive ball having a conductive coating layer around a core having a substantially ball-shaped rigidity is provided on one of the electric circuit element and the electric circuit board. A thin film is formed, and a mask member having an opening formed at a position corresponding to the electrode is placed in a state in which the opening corresponds to the electrode; A second step of accommodating the balls and placing the conductive balls on at least one of the electrode portions of the electric circuit element and the electric circuit board; and the other step of the electric circuit element and the electric circuit board. The third step of placing the electrode part of the electric ball on the conductive ball so that the conductive ball is sandwiched between the electrodes, and the electrode part of the electric circuit element and the electrode part of the electric circuit board. A fourth step of pressing the conductive balls, a fifth step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and an electrode portion of the electric circuit element and the conductive balls by the pressing and heating. A sixth step of moving the conductive coating layer between them and the conductive coating layer between the electrode portion of the electric circuit board and the conductive balls to bring the core into contact with both electrode portions; and the conductive coating layer. Cooling the core to maintain the contact between the core and both electrode parts to metallize or alloy the conductive coating layer and both electrode parts, and an eighth process for removing the mask member. Characterized by having

Further, according to a thirty-third aspect of the present invention, there is provided an electric circuit component manufacturing method, wherein an electric circuit element having an electrode portion and an electrode portion for connecting to the electric circuit element are provided. In a method for manufacturing an electric circuit component including a substrate, a diameter of a conductive ball having a conductive coating layer around a core having a substantially ball-shaped rigidity is provided on one of the electric circuit element and the electric circuit board. A first step of placing a first mask member, which is also thin and has a first opening formed at a position corresponding to the electrode, in a state where the opening corresponds to the electrode; It is formed on the mask member so that the total thickness of the first mask member and the first mask member is less than 1.5 times the diameter of the conductive ball, and the second mask is formed at a position corresponding to the electrode. Second mask with openings formed The wood, a second step of the first and second openings superposed so as to communicate the first and second
A first electrically conductive ball is housed in the first and second openings of the mask member, and at least one electrically conductive ball is placed on one of the electrode portions of the electric circuit element and the electric circuit board. Step 3, the fourth step of removing the second mask member, and the other of the electric circuit element and the electric circuit board are placed so that their electrode portions overlap the conductive balls. A fifth step of sandwiching the conductive ball between both electrodes, a sixth step of pressing the conductive ball by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and conductivity of the conductive ball A seventh step of heating the coating layer to a predetermined temperature, a conductive coating layer between the electrode portion of the electric circuit element and the conductive ball, and an electrode portion of the electric circuit board and the conductive ball by the pressing and heating. Between the conductive coating layer Eighth step of moving each to bring the core and the electrode portions into contact with each other; cooling the conductive coating layer to maintain contact between the core and the electrode portions to provide the conductive coating layer and the electrode portions. It is characterized by including a ninth step of metallizing or alloying the portion and a tenth step of removing the first mask member.

According to a thirty-fourth aspect of the present invention, there is provided an electric circuit component manufacturing method, wherein the electric circuit component has an electric circuit element having an electrode portion and an electrode portion for connecting the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a conductive ball including a conductive coating layer around a core having a substantially ball-shaped rigidity, an electrode portion of the electric circuit element, and an electrode portion of the electric circuit board. A first step of bringing one of the electrodes into contact with each other, a second step of pressing the one electrode part and the conductive ball against each other, and a third step of heating the conductive coating layer of the conductive ball to a predetermined temperature. A fourth step of moving the conductive coating layer between the one electrode part and the conductive ball by the pressure and heating to bring the core and the one electrode part into contact with each other; Cold coating Then, a fifth step of metallizing or alloying the conductive coating layer and the one electrode portion while maintaining contact between the core and the one electrode portion was connected to the one electrode. A conductive ball, the electrode portion of the electric circuit element and the other of the electrode portion of the electric circuit board are brought into contact with each other,
A sixth step of sandwiching the conductive ball between both electrodes,
A seventh step of pressing the conductive balls with the electrode portions of the electric circuit element and the electrode portions of the electric circuit board; and an eighth step of heating the conductive coating layer of the conductive balls to a predetermined temperature.
And a ninth step of moving the conductive coating layer between the other electrode portion and the conductive ball by the pressure and heating to bring the core and the other electrode portion into contact with each other,
Cooling the conductive coating layer to maintain contact between the core and the other electrode portion to metallize or alloy the conductive coating layer and the other electrode portion. Is characterized by.

According to a thirty-fifth aspect of the present invention, there is provided an electric circuit device having an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a mold having a concave portion corresponding to the electrode on an upper surface, wherein a conductive coating layer is provided in the concave portion around a core having a substantially ball-shaped rigidity. A first step of storing the ball in a partially projected state; a second step of bringing the conductive ball into contact with one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; A third step of pressurizing the conductive balls with the electrode part and the recess, a fourth step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and the pressurization and heating,
A fifth step of moving the conductive coating layer between the one electrode portion and the conductive ball to bring the core into contact with the one electrode portion, and cooling the conductive coating layer to form the core. A metallization or alloying of the conductive coating layer and the one electrode part by maintaining contact between the one electrode part and the one electrode part.
And the step of taking out one of the electric circuit element and the electric circuit board to which the conductive ball is connected from the mold.
And a conductive ball connected to the one electrode,
An eighth step of bringing the electrode portion of the electric circuit element and the other of the electrode portions of the electric circuit board into contact with each other to sandwich the conductive ball between the electrodes, and the electrode portion of the electric circuit element and the electric circuit board. A ninth step of pressing the conductive ball with an electrode portion, a tenth step of heating the conductive coating layer of the conductive ball to a predetermined temperature, and the other electrode portion and the An eleventh step of moving the conductive coating layer between the conductive balls and bringing the core and the other electrode part into contact with each other, and cooling the conductive coating layer,
A twelfth step of maintaining the contact between the core and the other electrode part to metallize or alloy the conductive coating layer and the other electrode part.

According to a thirty-sixth aspect of the method for manufacturing an electric circuit component of the present invention, the electric circuit element includes at least one photoelectric conversion element.

According to a thirty-seventh aspect of the method for manufacturing an electric circuit component of the present invention, the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface.

According to a thirty-eighth aspect of the method for manufacturing an electric circuit component of the present invention, the outer peripheral surface of the core is formed into a smooth curved surface.

According to a 39th aspect of the method for manufacturing an electric circuit component of the present invention, the outer peripheral surface of the conductive coating layer is formed in an uneven shape.

According to a 40th aspect of the method for manufacturing an electric circuit component according to the present invention, the inner peripheral surface of the conductive coating layer is formed in an uneven shape.

Further, the manufacturing method of the electric circuit component according to the present invention is characterized in that, according to claim 41, the outer peripheral surface of the core is formed in an uneven shape.

According to a forty-second aspect of the present invention, the method of manufacturing an electric circuit component is characterized in that, in the first step, a plurality of conductive balls are interposed between both electrode portions. There is.

According to a forty-third aspect of the present invention, the method of manufacturing an electric circuit component is characterized in that, in the second step, a plurality of conductive balls are provided between both electrode portions. There is.

Further, according to the method of manufacturing an electric circuit component according to the present invention, in the third step, a plurality of conductive balls are provided between both electrode portions. There is.

Further, according to the method of manufacturing an electric circuit component according to the present invention, according to claim 45, in the first step, a plurality of conductive balls are brought into contact with the one electrode portion at a time. It has a feature.

According to a forty-sixth aspect of the present invention, the method of manufacturing an electric circuit component is characterized in that, in the first step, a plurality of conductive balls are housed in the recess at once. There is.

According to the forty-seventh aspect of the present invention, the method of manufacturing an electric circuit component further comprises a step of sealing the space between the substrate and the element with a resin. .

According to a forty-eighth aspect of the method for manufacturing an electric circuit component according to the present invention, notches and / or slits are formed in the mask member so that the mask member can be torn. Is characterized by.

According to the method of manufacturing an electric circuit component according to the present invention, the conductive coating layer is made of a material having an electric resistivity of 1.6E-8 to 10E-8Ω · m. It is characterized by being formed.

The method of manufacturing an electric circuit component according to the present invention is characterized in that, in claim 50, the conductive coating layer has a thickness of 1 to 50 μm.

According to a fifty-first aspect of the invention, the method of manufacturing an electric circuit component is characterized in that the conductive coating layer has a thickness of 3 to 20 μm.

According to a 52nd aspect of the method for manufacturing an electric circuit component of the present invention, the core has a diameter set to 3 to 500 μm.

[0156] Further, the manufacturing method of the electric circuit component according to the present invention is characterized in that, in the claim 53, the core has a diameter set to 10 to 200 µm.

[0157] Further, according to the method of manufacturing an electric circuit component according to the present invention, according to claim 54, the core has a diameter which is smaller than that of the core when a load required for connection between both electrodes is applied. It is characterized by having rigidity such that the displacement amount is 5% or less.

[0158] According to the 55th aspect of the present invention, in the method for manufacturing an electric circuit component, the core has the same diameter as that of the core when a load required for connection between both electrodes is applied. It is characterized by having rigidity such that the amount of displacement is 1% or less.

Further, in the method for manufacturing an electric circuit component according to the present invention, according to claim 56, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrode connected with Rmax. And is less than or equal to twice the film thickness of the conductive coating layer.

According to a 57th aspect of the present invention, in the method of manufacturing an electric circuit component, the pressing of the conductive ball in the second step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

According to a fifty-eighth aspect of the present invention, in the method of manufacturing an electric circuit component, the pressing of the conductive balls in the third step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other substantially at the same time as the diameter of the core of the conductive ball, the proximity operation is stopped Then, the pressurizing operation is finished.

Further, according to the manufacturing method of the electric circuit component according to the present invention, according to claim 59, the pressing of the conductive ball in the fourth step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

According to a 60th aspect of the present invention, in the method of manufacturing an electric circuit component, the pressing of the conductive balls in the sixth step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

According to a sixty-first aspect of the present invention, in the method of manufacturing an electric circuit component, the pressing of the conductive balls in the seventh step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

According to the method of manufacturing an electric circuit component according to the present invention, according to claim 62, the pressing of the conductive ball in the ninth step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

According to the sixty-third aspect, the conductive ball according to the present invention is for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion to each other. The conductive ball is characterized by including a core having a substantially ball-shaped rigidity and a conductive coating layer coated around the core.

According to a sixty-fourth aspect of the present invention, in the conductive ball according to the sixty-fourth aspect, the conductive coating layer of the conductive ball is pressed against the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. It is characterized in that it is electrically and mechanically connected to the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, respectively.

According to the sixty-fifth aspect, the conductive ball according to the present invention is for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion to each other. In the conductive ball, a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material, and formed of a material having electrical conductivity,
And a conductive coating layer coated around the core.

According to a sixty-sixth aspect of the present invention, in the conductive ball, the conductive coating layer of the conductive ball includes an electrode portion of the electric circuit element and an electrode portion of the electric circuit board, respectively. It is characterized in that the constituent materials are metalized and / or alloyed to be connected.

According to the sixty-seventh aspect of the present invention, in the conductive ball according to the present invention, the outer peripheral surface of the conductive coating layer is:
It is characterized by being formed into a smooth curved surface.

According to a sixty-eighth aspect of the present invention, the conductive ball according to the present invention is characterized in that the outer peripheral surface of the core is formed into a smooth curved surface.

According to a sixty-ninth aspect of the present invention, in the conductive ball according to the present invention, the outer peripheral surface of the conductive coating layer is:
The feature is that it is formed in an uneven shape.

The conductive ball according to the present invention is characterized in that, according to claim 70, the inner peripheral surface of the conductive coating layer is formed in an uneven shape.

According to a seventy-first aspect of the present invention, the conductive ball according to the present invention is characterized in that the outer peripheral surface of the core is formed in an uneven shape.

In the conductive ball according to the present invention, according to claim 72, the conductive coating layer is made of a material having an electric resistivity of 1.6E-8 to 10E-8Ω · m. It is characterized by that.

The conductive ball according to the present invention, according to claim 73, is characterized in that the conductive coating layer has a thickness of 1 to 50 μm.

According to the seventy-fourth aspect of the present invention, the conductive ball according to the present invention is characterized in that the conductive coating layer has a thickness of 3 to 20 μm.

According to a seventy-fifth aspect of the present invention, in the conductive ball according to the present invention, the core has a diameter set to 3 to 500 μm.

According to the 76th aspect of the present invention, in the conductive ball according to the present invention, the core has a diameter of 10 mm.
To 200 μm.

According to the 77th aspect of the present invention, in the conductive ball according to the 77th aspect, the core has a displacement amount of 5 when the load required for connection between the two electrodes is applied. It is characterized by having rigidity such that it is less than or equal to%.

According to the 78th aspect of the present invention, according to the 78th aspect of the present invention, the core has a displacement amount of 1 when the load required for connection between the two electrodes is applied. It is characterized by having rigidity such that it is less than or equal to%.

According to claim 79, in the conductive ball according to the present invention, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrode connected at Rmax, It is characterized in that it is not more than twice the film thickness of the coating layer.

The conductive connecting member according to the present invention is
According to claim 80, in the conductive connection member used for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion, a substantially ball-shaped rigidity is provided. At least one conductive ball having a conductive coating layer provided around the core, and a holding sheet for embedding and holding the conductive ball, the holding sheet being formed of a material having electrical insulation, A holding sheet for holding the conductive balls is provided so that a part of the conductive balls projects and is exposed and a part of the conductive balls projects and is exposed from the other surface.

Further, the conductive connecting member according to the present invention is
According to claim 81, the conductive ball is pressure-contacted by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and the conductive ball is pressed from the electrode portion of the electric circuit element and one surface of the holding sheet. Electrically and mechanically between the protruding portion of the conductive ball covering layer and between the electrode portion of the electric circuit board and the protruding portion of the conductive ball covering layer from the other surface of the holding sheet. The feature is that they are connected to each other.

Further, the conductive connecting member according to the present invention is
According to claim 82, in the conductive connecting member used for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion, a metal material having high rigidity and A conductive ball having a substantially spherical core made of at least one of inorganic materials, and a conductive coating layer formed of a material having electrical conductivity and covering the core, and at least one conductive ball. A holding sheet for embedding and holding as described above, which is formed of a material having an electrical insulating property, in which a part of the conductive ball projects and is exposed from one surface, and a part of the conductive ball projects from the other surface. And a holding sheet for holding the conductive balls so as to be exposed.

Further, the conductive connecting member according to the present invention is
According to claim 83, the conductive ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and the conductive ball is pressed from the electrode portion of the electric circuit element and one surface of the holding sheet. Electrically and mechanically between the protruding portion of the conductive ball covering layer and between the electrode portion of the electric circuit board and the protruding portion of the conductive ball covering layer from the other surface of the holding sheet. The feature is that they are connected to each other.

Further, the conductive connecting member according to the present invention is
According to the description of claim 84, the conductive coating layer of the conductive balls is formed by metallizing and / or alloying the material forming the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. It is characterized by being connected by.

Further, the conductive connecting member according to the present invention is
According to claim 85, the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface.

Further, the conductive connecting member according to the present invention is
According to claim 86, the outer peripheral surface of the core is formed into a smooth curved surface.

Further, the conductive connecting member according to the present invention is
According to claim 87, the outer peripheral surface of the conductive coating layer is formed in an uneven shape.

Further, the conductive connecting member according to the present invention is
According to claim 88, the inner peripheral surface of the conductive coating layer is formed in an uneven shape.

The conductive connecting member according to the present invention is
According to claim 89, the outer peripheral surface of the core is formed in an uneven shape.

Further, the conductive connecting member according to the present invention is
According to a 90th aspect, the conductive coating layer is formed of a material having an electric resistivity of 1.6E-8 to 10E-8Ω · m.

The conductive connecting member according to the present invention is
According to claim 91, the conductive coating layer has a thickness set to 1 to 50 μm.

The conductive connecting member according to the present invention is
According to claim 92, the conductive coating layer has a thickness set to 3 to 20 μm.

Further, the conductive connecting member according to the present invention is
According to claim 93, the core has a diameter of 3
To 500 μm.

The conductive connecting member according to the present invention is
According to claim 94, the core has a diameter of 1
It is characterized by being set to 0 to 200 μm.

Further, the conductive connecting member according to the present invention is
According to claim 95, the core has a rigidity such that the displacement amount of the diameter thereof is 5% or less when a load required for connection between both electrodes is applied. Is characterized by.

Further, the conductive connecting member according to the present invention is
According to claim 96, the core has rigidity such that the displacement amount of the diameter thereof is 1% or less when a load required for connection between both electrodes is applied. Is characterized by.

Further, the conductive connecting member according to the present invention is
According to claim 97, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrodes connected at Rmax, and is not more than twice the film thickness of the conductive coating layer. It has a feature.

Further, according to the method of manufacturing a conductive connecting member according to the present invention, the electric circuit element having the electrode portion and the electric circuit board having the electrode portion are provided with a mutual electrode portion. In a method of manufacturing a conductive connecting member used for connecting, at least one conductive ball provided with a conductive coating layer around a core having a substantially ball-shaped rigidity, and a lower mold and an upper mold are both predetermined. A first step of sandwiching in a state of being separated by an interval, a second step of filling a synthetic resin between the lower mold and the upper mold, and a third step of releasing a molding material from the lower mold and the upper mold. And a fourth step of etching the upper and lower surfaces of the released molding material to expose the upper and lower portions of the conductive ball so as to project from the upper and lower surfaces of the synthetic resin holding sheet, respectively. Is characterized by.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 99, the electric circuit element having the electrode portion and the electric circuit board having the electrode portion are provided with the respective electrode portions. In a method of manufacturing a conductive connecting member used for connecting, a lower portion of at least one conductive ball provided with a conductive coating layer around a core having a substantially ball-shaped rigidity is placed in a first recess of a lower mold. A first step of mounting the upper mold on which a second recess corresponding to the first recess of the lower mold is formed, and the upper part of the conductive ball is housed in the second recess. And a third step of filling a synthetic resin between the lower mold and the upper mold,
A fourth step of releasing the molding material from the lower mold and the upper mold, and etching the upper and lower surfaces of the released molding material to form upper and lower parts of the conductive ball from the upper and lower surfaces of the synthetic resin holding sheet. And a fifth step of exposing each of them so as to be exposed.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 100, the first and second recesses have a depth smaller than a radius of the conductive ball. It is characterized by being formed.

According to the method of manufacturing a conductive connecting member of the present invention, the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface.

According to the method of manufacturing a conductive connecting member of the present invention, the outer peripheral surface of the core is formed into a smooth curved surface.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 103, the outer peripheral surface of the conductive coating layer is formed in an uneven shape.

Further, according to the method of manufacturing a conductive connecting member according to the present invention, the inner peripheral surface of the conductive coating layer is formed in an uneven shape.

Further, according to the method of manufacturing a conductive connecting member according to the present invention, the outer peripheral surface of the core is formed in an uneven shape.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 106, the conductive coating layer has an electric resistivity of 1.6E-8 to 10E-8Ω · m.
It is characterized by being formed from the substance of.

[0210] The method for manufacturing a conductive connecting member according to the present invention is characterized in that, in claim 107, the conductive coating layer has a thickness of 1 to 50 µm.

[0211] Further, the manufacturing method of the conductive connecting member according to the present invention is characterized in that, in claim 108, the conductive coating layer has a thickness of 3 to 20 µm.

According to the method of manufacturing a conductive connecting member according to the present invention, the core is
The feature is that the diameter is set to 3 to 500 μm.

According to the method of manufacturing a conductive connecting member of the present invention, the core is
The feature is that the diameter is set to 10 to 200 μm.

Further, according to the method of manufacturing a conductive connecting member according to the present invention, according to claim 111, the core is
It is characterized by having rigidity such that the displacement amount of the diameter becomes 5% or less when a load required for connection between both electrodes is applied.

Further, according to the method of manufacturing a conductive connecting member according to the present invention, according to claim 112, the core is
It is characterized by having rigidity such that the displacement amount of the diameter becomes 1% or less when a load required for connection between both electrodes is applied.

Further, in the method for manufacturing a conductive connecting member according to the present invention, according to claim 113, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrode connected with Rmax. And is less than or equal to twice the film thickness of the conductive coating layer. The gist of the invention related to this application will be described in detail below.

As an electric circuit element in the present invention,
For example, a semiconductor element (diode, IC, LSI, etc.) in which an electric circuit is formed in a semiconductor material, a package incorporating these, and the like can be given.

If the semiconductor element has a photoelectric conversion function (a photodetector, a light receiving sensor such as a CCD, a light emitting element such as an LED, an LD, a surface emitting LD, or a composite thereof), the present invention can be used. The effect of appears remarkably.

Each of these electric circuit elements has an electrode portion for electrically connecting to the outside, and the number and shape of the electrode portions are not limited in the present invention. However, the greater the number, the more remarkable the effect of the present invention. Further, the existence position of the electrode portion does not matter, but the effect of the present invention becomes more remarkable as it exists inside the electric circuit element.

As the electric circuit board, for example, a printed circuit board, a ceramic board, a glass board, a metal core board, a flexible board, in which a wiring pattern made of an electrically conductive material is provided on an insulating material or a metal surface of which is insulation-treated, Examples include glass epoxy substrates and silicon substrates. Furthermore, if the substrate has a portion that transmits light, the effect of the present invention becomes more remarkable by combining it with a light receiving element or a light emitting element as an electric circuit element.

The wiring pattern is provided with electrode portions for connecting to the positions corresponding to the arrangement of the electrode portions of the electric circuit element. Further, even if a protective film made of an insulating material is provided on the wiring pattern other than the electrode portion, the present invention does not cause a problem. Further, even if the electric circuit board has a multilayer wiring pattern therein, there is no problem in the present invention.

Since the electrode material of these electrode portions provided on the electric circuit element and the electric circuit board is exposed to the atmosphere, the electrode surface is exposed to the oxide film of the electrode material and the adsorbed contaminants. The contamination film (for example, dust, organic matter, sulfide, etc.) is deformed. These films serve as a barrier to prevent the movement of electrons and atoms, hinder the connection by metallization and / or alloying with the connecting material, and cause a connection failure. Therefore, these films must be destroyed at the time of connection.

However, in the present invention, the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are set to be connected by metalization and / or alloying using the conductive balls as the connecting material. Here, the connection by metalization and / or alloying is a connection for joining at a temperature equal to or lower than the melting point of the metal, that is, a joint having at least a solid solution phase at the time of joining. The heating temperature during connection is 100
The temperature is up to 400 ° C, and a known method can be used as the heating method. For example, a thermocompression bonding method, an ultrasonic combined thermocompression bonding method,
A high frequency heating method, an induction heating method and the like can be used.

The conductive ball according to the present invention comprises a core having a substantially spherical shape made of one or both of a metal material having a high rigidity and / or an inorganic material, and a material having a conductive surface at least exposing the periphery of the core. It is composed of a conductive coating layer coated with.

The core is made of a material having high rigidity. The rigidity (stiffness) is u = αP, where u is a displacement position u where the object moves when a load P is applied to the object.
In an elastic body, u is proportional to P. Reciprocal 1 of this proportional constant α
/ Α is called rigidity. (Pp.291, Dictionary of Machine Terms, Corona Co., Ltd., 1972) That is, the smaller the amount of deformation with respect to the load, the higher the rigidity (large).
Will be.

The rigidity of the present invention is such that, when a load required for connection is applied, for example, assuming that it is an elastic body, its displacement amount is 5% with respect to the initial core diameter dimension.
It means that only the following changes. In the case of this invention,
The less the core is deformed, the more preferable, and the displacement amount is more preferably 1% or less.

For example, the diameter of the core is φ10 to 100 μm
, The load per conductive ball required for connection (1 g
˜200 g) and heating (100 to 400 ° C.), the following materials are highly rigid materials that deform less than 1% with respect to the initial shape and size. .

For example, as the metal material, carbon steel, molybdenum steel, manganese molybdenum steel, manganese molybdenum nickel steel, nickel steel, chrome molybdenum steel, nickel chrome molybdenum steel, manganese steel, manganese chrome steel, stainless steel, W, Mo is used. , Ti, Ta, and one or more alloys.

On the other hand, as the inorganic material, Si or SiO
2, Al2O3, AlN, c-BN, diamond, blue glass (soda glass), white glass, carbides such as W, Mo, Ti, Ta, etc., nitrides, borides, silicides, and the like. Furthermore, these composites can also be used as the material of the core.

When the core is made of a metal material, the core can also serve as a conductive path, so that the allowable current can be increased by reducing the connection resistance. When the core is made of an inorganic material, the electric circuit element and the electric circuit can be made. Since the thermal expansion coefficient is close to the thermal expansion coefficient of the substrate, the thermal stress related to the connection portion can be relaxed.

As the shape of the core, a sphere is desirable for the following reasons. (1) Always make point contact with a plane.
(2) Since there is a three-dimensional target shape, there are no restrictions when arranging. (3) Since there is no edge portion, the surface can be covered uniformly. (4) The central part has the largest cross-sectional area and is less likely to buckle when pressed.

[0232] The size of the core can be selected from a diameter of 3 to 500 µm, depending on the size of the electrode portion to be connected, but a diameter of 10 to 200 µm.
μm is the pitch between the electrodes of the semiconductor element (80 μm to 300 μm
It is more desirable from the point of m).

With the minimum size of 3 μm, the thickness of the insulating layer made of SiO 2 or Six N 1 -x that normally covers the surface of the semiconductor element is about 1 μm, and the electrode surface is depressed from the surface of the semiconductor element by at least this thickness. Therefore, in the case of joining to a circuit board having the same structure, a distance of at least 1 μm is provided between the surface of the semiconductor element and the surface of the circuit board to prevent the semiconductor element from being short-circuited at its side end.

On the other hand, for the maximum size of 500 μm,
When a printed circuit board is used as a substrate to be connected to the semiconductor element, the size is such that wiring can be easily formed and connection can be made.

As the variation in the diameter of the core, one having a diameter of about 1% to 10% of the diameter is usually selected and used in a design matching the connection symmetry. Furthermore, by classifying this core with higher accuracy, a core having a very sharp particle size distribution of ± 1 μm to ± 2 μm or less with respect to the diameter of the selected core can be realized.

The conductive coating layer for coating the surface of the core is in contact with the electrode portion on the surface of the conductive coating layer for electrical connection, and at the same time, metallized and / or alloyed with the electrode material for mechanical connection. Made of material. Furthermore, this conductive coating layer is easily deformed by pressure and heat during connection,
Friction with the electrode due to the movement destroys the natural oxide film and the contaminated film on the surface of the electrode and exposes the intrinsic surface of the electrode, so a soft metal that is easily deformed by pressure is preferable.

As such a metal material, gold is preferable in terms of electric resistivity, stability and softness, but any metal or alloy other than gold can be used. Examples thereof include Cu, Al, In, Sn, Pb, Ag, and alloys containing these as the main components.

Further, the conductive coating layer may be formed of a plurality of layers as long as the layer exposed on the surface has the above characteristics. For example, Pd, Ti, Cr, Ni and alloys containing these as the main components as an adhesion layer for achieving adhesion with the core, and further as a barrier layer for preventing diffusion of the adhesion layer and the metal layer exposed on the surface. Ni, Pt, AgW, P
There is no problem even if d and an alloy containing them as a main component are provided.

These materials form a conductive coating layer on the surface of the core by electrolytic or electroless plating or vapor deposition. In the area other than the area connected to each electrode part, even if there are some defects in the conductive coating layer provided on the core surface due to variations in coating, it is possible to conduct electricity between the electrodes connected as conductive paths. If it doesn't matter. The electric resistivity of this conductive coating layer is 1.6E-
It is preferably 8 to 10E-8Ω · m.

The thickness of this conductive coating layer is from 1 μm to
The thickness up to 50 μm can be arbitrarily selected depending on the structure of the electrode part to be connected, the diameter of the core used, and the metal material to be coated. In order to make a connection with a semiconductor element, about 3 to 20 μm is more desirable from the viewpoint of the electrode portion film thickness of the semiconductor element and the core diameter to be used. However, the thickness is preferably thicker than the width of variation in the diameter of the core in order to prevent the semiconductor element from being tilted and not being sufficiently connected when the connection is made due to the variation in the core diameter.

Here, the minimum film thickness of the conductive coating layer is 1 μm.
Is usually 1 μm in thickness of aluminum, which is the electrode part of the semiconductor element.
This is because the metallization and alloying require the same or more thickness. On the other hand, the maximum film thickness of 5
The reason for 0 μm is to prevent a temperature rise during energization by having a sufficient cross-sectional area as a conductive path even if the inter-electrode distance becomes long when the maximum core diameter is 500 μm.

The conductive balls having such a structure have a very uniform shape by classification of the core and, if necessary, classification after forming the conductive coating layer.

By sandwiching the uniform conductive balls between the electrodes to be connected and applying pressure, first, a large pressure is generated at the point contact point of the conductive coating layer which is in point contact with the electrodes, and the conductive coating layer and the electrodes are Begins to deform. At this time, since the core has high rigidity and is hardly deformed, the pressing force is concentrated on the deformation of the conductive coating layer and the electrode. Furthermore, since the spherical core has an angle that is always open to the outside (around the contact point) with respect to the plane having the electrode portion, the pressed conductive coating layer is directed outward from the contact point. Easy to move (discharge).

During the deformation process of the conductive coating layer and the electrode, which expands the contact surface in a concentric circle centering on the contact point, the oxide film and the contamination film existing on the electrode surface and the conductive coating layer surface are destroyed by the deformation, And the intrinsic surface of the conductive coating layer is exposed and contacts.

In this state, heating to 100 to 400 ° C. causes diffusion of atoms in the solid state in the joint portion, and a joint layer made of a solid solution or an intermetallic compound is formed on the surface of the joint portion to form an electrode portion. The conductive coating layer is alloyed and connected. For example, as the material forming the conductive coating layer, A
When u and Al, which are used in ordinary semiconductor elements, are used as the material for the electrode portion, the heating temperature is 20
They are connected by alloying at 0 to 350 ° C.

As described above, the main feature of the present invention is that, in this connection process, the conductive balls further destroy the oxide film and the contaminated film on the electrode surface and expose the intrinsic surface more widely. As a result, the bondability due to metallization and / or alloying is improved.

As a specific method, the conductive balls may be formed in a substantially spherical shape, or fine protrusions and valleys may be provided on the outer surface of the conductive balls to destroy the oxide film and the contaminated film. Is to raise.

There are three ways to provide the protrusion and the valley. The first aspect is provided on the surface of the conductive coating layer, the second aspect is provided on the surface of the core, and the third aspect is provided on both the surface of the conductive coating layer and the surface of the core.

First, the case where the conductive coating layer is provided on the surface of the first embodiment will be described.

In the connection process in which the conductive coating layer destroys the oxide film on the electrode surface, the oxide film is destroyed because the projection on the surface of the conductive coating layer exerts a large force on the electrode surface. In addition, in this connection process, the protrusions are crushed in a direction that spreads around the contact point with the electrode, so that the deformation direction becomes random. Therefore, the oxide film is finely broken.

The size of such protrusions and valleys is as follows.
It may be thicker than the oxide film and the contaminated film. More specifically, from the maximum roughness Rmax, which is the maximum value of the size of the protrusion and the valley, the desirable Rmax is from 10% or more of the thickness of the electrode to be connected to 4 times or less of the thickness of the conductive coating layer. is there. More desirable Rmax is from 10% of the electrode film thickness to twice the film thickness of the conductive coating layer or less.

If Rmax is 10% or less of the electrode film thickness, similarly, the size of the protrusion and the valley is smaller than the film thickness of the oxide film and the contamination film on the electrode surface, and the destruction effect of the oxide film and the contamination film is hard to appear. Become. If Rmax is four times or more as large as that of the conductive coating layer, unbonded portions due to the influence of large valleys and large protrusions are generated after connection, and the connection area is reduced, which is not preferable. Also, if it is less than twice as large as the conductive coating layer, even if the largest protrusion and the valley are adjacent to each other, the valley can be embedded by the deformed protrusion, preventing the occurrence of unbonded regions and ensuring a wide connection area. It is possible and more preferable.

For example, the Al electrode, which is the electrode portion of the semiconductor element, has a film thickness of about 1 μm, but the oxide film thickness on the surface is several hundred angstroms, so 10% of the film thickness of 1 μm = 0.1 μm. With the above Rmax, the effect of the protrusion and the valley can be obtained. In connection with such a semiconductor element, Rmax is more preferably about 0.1 μm.

The area portion where these protrusions and troughs are provided will be described later in the section of contact area of conductive balls.

Since the conductive balls are spherical, R
Regarding max, the value obtained by subtracting the curvature component of the spherical surface of the conductive ball from the measured value was used. The same applies to Rmax thereafter.

Next, description will be given of the case where the protrusion and the valley are provided on the surface of the core as the second embodiment.

In this case, there are two effects in the connection process, one is related to the destruction of the oxide film, and the other is 2
The claw is related to the contact area.

Regarding the first destruction of the oxide film, there are cases where the material forming the conductive coating layer is soft and the oxide film cannot be sufficiently destroyed only by the deformation of the conductive coating layer. In this case, if protrusions and valleys are provided on the core surface, the influence of the protrusions and valleys on the underlying core surface (projections (High pressure at the tip) appears on the connection surface, making it easy to destroy the oxide film. This effect becomes remarkable especially when the electrode material is hard.

As the second contact area, the conductive coating layer may be peeled from the core due to the pressure applied at the time of connection, and a sufficient contact area may not be obtained. In this case, by providing the protrusions and the valleys on the surface of the core, the adhesion with the conductive coating layer is improved, and it is possible to prevent the conductive coating layer from peeling from the core at the time of connection.

The sizes of such protrusions and valleys are as follows.
A sufficient effect can be obtained with Rmax of the same size as the case of the surface of the conductive coating layer. The area portion where these protrusions and valleys are provided will be described later in the section of contact area of conductive balls.

Further, as a third mode, a case where a projection and a valley are provided on both the conductive coating layer and the core surface will be described.

In this case, the effect on the surface of the conductive coating layer and the effect on the surface of the core become more remarkable. Further, it becomes particularly remarkable when the electrode is hard. However, since the protrusion and the valley are provided in the two portions, it may take time and effort to manufacture the conductive ball.

In the selection of the portions where the protrusions and valleys are provided in these three modes, the object to be connected, for example, the electrode material,
It can be performed by an electrode structure, a conductive coating layer material, a conductive ball structure, or the like.

Here, the contact area between the conductive balls and the electrodes is as follows. That is, the change in the thickness of the conductive coating layer at the connection portion due to the pressure gradually decreases from the initial thickness along with the deformation movement from the contact point, until the electrode reaches a thickness of zero at which it contacts the core. Ends with. Therefore, the theoretical maximum contact area excluding the swelling around the moved conductive coating layer is the cross section of the conductive ball, where R is the radius of the core, a is the thickness of the conductive coating layer, and rmax is the maximum contact circle radius. From the shape, rmax = SQR (a2 + 2aR)
And the circle with this radius becomes the maximum contact area calculated.

Further, the area portion where the protrusion and the valley are provided is as follows. That is, the area portion of the surface of the conductive coating layer to be connected is r from the contact point in this cross-sectional shape.
It can be seen that it is on an arc until it reaches max. Further, it can be seen that the region related to the connection of the core surface is on an arc from just below the contact point to the intersection of the straight line extending from the center of the conductive ball to rmax and the core, similarly to the conductive coating layer.

The larger the number of protrusions and valleys provided in these two regions is within the range satisfying the size, the more the effect is provided. Further, even if a protrusion and a valley are provided in a region other than these regions, this invention does not pose a problem.

The intervals between the electrodes to be connected are as follows. That is, since the shape of the conductive ball is symmetrical,
The deformation of each conductive coating layer at the connection portion with the electric circuit element and the connection portion with the electric circuit board is also substantially symmetrical.

The semiconductor element to be normally connected has a plurality of electrode portions. If the number of electrode parts of this semiconductor element is n, the number of conductive balls used for connection is n or more,
The diameters of the cores of these conductive balls are d1, d2 and
Let d3, ..., dn. The minimum and maximum core diameters are dmin and dmax.

Due to the rigidity of the core, the conductive coating layer is largely deformed and moved due to the core rigidity as described above due to the pressure applied at the time of connection, and the thickness at the connection portion is reduced, so that the electrodes of the electric circuit element are reduced. Distance between the electrode and the electrode part of the electric circuit board,
It is the sum of the diameter of the core that hardly deforms and the thickness of the slight alloyed bonding layer that remains between the core and the electrode part after deformation. The distance between the n electrodes is the minimum dmin to dm.
Although it is about ax, it may be slightly larger than dmax.

Further, in the present invention, the height of the protrusion may be added due to the provision of the protrusion and the valley on the surface of the core. Therefore, in the present invention, the distance between the electrodes is about the diameter of the core, which includes the variation of the core and the height of the protrusion as described above. Therefore, the more accurate the shape of the core, the more accurate the distance between the electrodes,
As a result, the distance between the semiconductor element and the substrate becomes parallel with high accuracy.

In the present invention, since the conductive balls are manufactured separately from the electric circuit element, it is possible to classify only the conductive balls with extremely high accuracy. Therefore, it is possible to form the gap between the electric circuit element and the electric circuit board with an accuracy of 1 to 2 μm or less with high accuracy.

When manufacturing an electric circuit part, a method of disposing the conductive balls at positions corresponding to the electrode parts is as follows.
There are two ways.

The first method is to use a holding sheet. In this case, the sheet is held in close contact with the sheet material at the position where the conductive balls are arranged. Therefore, the conductive ball and the holding sheet can be integrally handled. The second method is
In this case, the arrangement member does not hold the conductive balls in close contact with each other at the position where the conductive balls are arranged, and the arrangement member and the conductive balls are treated as separate parts.

After arranging the conductive balls on the electrodes by these two methods, a holding sheet or arranging member is used.
By connecting the conductive balls while keeping that position,
It is possible to prevent the conductive balls from being displaced during connection. The method of using these two methods is not particularly limited, but the method of using the holding sheet is suitable for arranging and connecting the conductive balls with higher accuracy because the conductive balls are closely held. The method of using the arrangement member is more suitable for arranging and connecting the medium-sized to large-sized conductive balls having low positional accuracy at low cost.

First, the holding sheet used in the first method will be described.

The holding sheet holds the conductive balls such that the conductive balls project and are exposed from both sides of the sheet at a predetermined position where the conductive balls are arranged. Since the holding sheet closely holds the side surfaces of the conductive balls toward both sides of the sheet, the holding sheets prevent the conductive balls from falling off the sheet and are integrated with the conductive balls.
Further, when the protrusions and the valleys provided on the surface of the conductive balls are also present in the portion in close contact with the sheet, the adhesion is further improved.

The holding sheet is positioned so that the electrodes of the electric circuit element or the electric circuit board and the held conductive balls face each other, and then the holding sheet is arranged on the electric circuit element or the electric circuit board, so that the conductive balls can be formed. It can be placed on the electrode.

The thickness of the holding sheet is 1 μm to 50 μm.
Any size up to 0 μm can be used. However, it is desirable that the diameter is equal to or smaller than the diameter of the core in order to carry out without disturbing the deformation movement in the direction of increasing the contact area of the conductive coating layer material with the electrode portion at the time of connection. Therefore, the maximum thickness is the same as the maximum diameter of the core, and
The minimum thickness can be 1 μm or less, but there is a problem of strength at the time of arrangement, and therefore the minimum diameter is set to be the same.

In the case of the present invention, the thickness of the holding sheet is more preferably 10 μm to 200 μm. The holding sheet may be made of any material as long as it has electrical insulation. For example, an insulating resin may be used. Furthermore, when a resin is used, the type of the resin does not matter. Either a thermosetting resin or a thermoplastic resin may be used. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polysulfone resin, silicone resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzyl imidazole resin, phenol resin, urea resin, melamine Resins, alkyd resins, epoxy resins, polyamideimide resins, polypropylene resins, polyvinyl chloride resins, polystyrene resins and other resins can be used.

Furthermore, if a resin having a good thermal conductivity or a resin mixed with a powder of an inorganic material having a good thermal conductivity (for example, diamond, c-BN, AlN, etc.) is used among these resins, an electric circuit can be obtained. Even if the element has heat, the heat can be dissipated through the resin, which is more preferable.

Further, if the resin having the same or similar coefficient of thermal expansion as that of the electric circuit element or the electric circuit board is selected as the resin, the reliability of the electric circuit component is further reduced due to the thermal expansion and contraction. It becomes possible to prevent it.

When a photoelectric conversion element is used as the electric circuit element, the light transmittance of these resin materials is made lower than that of air or glass or a transparent resin for sealing the photoelectric conversion element, and the light receiving portion or the light emitting portion of the photoelectric conversion element is used. If an opening is provided in a portion corresponding to the above or a portion necessary for optical design, unnecessary light is cut and the S / N of the optical signal is improved. For example, with respect to the ghost light reflected on the surface of the light receiving element, even if the transmittance of the sheet material is only 10% lower, the ghost light intensity can be reduced by 19% by passing through the sheet twice at the time of incidence and at the time of reflection. You can

Similarly, in the case of a light-emitting element, for example, in the light distribution emitted from the light-emitting portion of an LED, ambient light unnecessary for optical design is attenuated or cut by using a holding sheet material as a slit or a light-shielding portion of a pinhole. However, it is possible to improve the S / N when the light receiving element receives an optical signal.
Further, since the resin covers the periphery of the conductive balls, it is possible to suppress the ghost light that causes the conductive balls to reflect even if gold having a high reflectance is used.

Next, the arrangement member used in the second method will be described.

The arranging member is a sheet (mask sheet) having an opening (hole) penetrating therethrough at a position corresponding to the position where the conductive balls are arranged. The size of this opening is such that the desired number of conductive balls can be set to n by arranging in the opening.
When the diameter of the conductive balls is D, by setting the diameter larger than nD and smaller than (n + 1) D, a desired number of conductive balls can be arranged in the opening.

The mask sheet is positioned and arranged on the surface of the electric circuit element or electric circuit component so that the opening is located above the electrode portion, and after the arrangement, conductive balls are inserted into the opening to form the electrode. A conductive ball is placed on the part. Further, the thickness of the mask sheet is preferably equal to or smaller than the diameter of the core similarly to the holding sheet.
That is, 1 μm to 500 μm can be used, but 10
μm to 200 μm is more desirable.

As the mask sheet material, the same material as the above holding sheet material can be used. After the connection, the conductive sheet may be connected, and then the holding sheet or the arrangement member (mask sheet) may be removed. In this case, the holding sheet or the mask sheet does not protrude beyond the size of the electric circuit element, and a smaller electric circuit component can be obtained. At that time, the holding sheet or the mask sheet may be completely removed or only a part of the holding sheet or the mask sheet, for example, a peripheral portion of the electric circuit element may be removed.

To remove the holding sheet or the mask sheet, after the connection, the holding sheet or the mask sheet is pulled in the horizontal direction to cause cracks in the holding sheet or the mask sheet and remove the sheet. Here, slits or notches may be formed in the holding sheet or the mask sheet. The slits and notches may be provided in a portion other than the contact holding portion of the conductive ball of the holding sheet or the opening portion of the mask sheet, or the contact holding portion or opening of the conductive ball or the outer peripheral portion of the holding sheet or mask sheet. May be provided. Furthermore, the number, shape, and arrangement of them are not particularly limited.

By providing these slits and notches, when the holding sheet or mask sheet is removed, first, cracks are generated from the tips of the slits and notches. When the cracks reach and reach the conductive balls and the openings, the holding sheet or the mask sheet can be separated and removed.

Therefore, the holding sheet or the mask sheet can be removed without applying excessive stress to the connected conductive balls and the connecting portion.

In the case of removing after connection, a conductive material can be used as the material of the holding sheet or the mask sheet. For example, carbon resin, aluminum, phosphor bronze,
Beryllium copper, 42 alloy, stainless steel, etc. Furthermore, a film of a conductive material may be provided on the surface of the holding sheet or the mask sheet made of an insulating material.

By imparting a conductive function to a part of the holding sheet or the mask sheet to be grounded, the destruction of the electric circuit element due to the static electricity accumulated until the connection is prevented, and the mask sheet. In Case of,
Furthermore, when the conductive balls are arranged, the conductive balls are prevented from aggregating due to the generation of static electricity due to friction with the conductive balls,
The placement can be done reliably.

When either the electric circuit element or the electric circuit board cannot withstand the heating temperature at the time of alloying, one of the electrode portions and the conductive ball are arranged so as to face each other. Connection is made by applying pressure and heat and metallizing and / or alloying. In this case, as a method of disposing the conductive balls on the electrodes, in addition to the holding sheet and the mask sheet, a material that does not alloy with the conductive coating layer has an opening larger than the diameter of the conductive balls and a recess smaller than the diameter of the core. You may use the type | mold provided in the place which arrange | positions a conductive ball. For example, if the conductive coating layer is Au, glass, quartz, alumina, diamond or the like may be used as the mold material.
Even if a material that alloys with the conductive coating layer is used as the mold material, it can be used by coating the surface with a material that does not alloy with these conductive coating layers.

After connecting only one side of the conductive ball with the electrode by alloying, the electrode portions connecting the electric circuit element and the electric circuit board are arranged so as to face each other and connected by pressing or the like.

According to the present invention, the electrode parts of the electric circuit element and the electric circuit component are connected to each other by using the conductive ball composed of the spherical core made of a highly rigid material and the conductive coating layer covering the periphery thereof. Therefore, even if no special treatment is applied to the electrode portion, it is possible to destroy the oxide film or the contaminated coating film existing on the surface of the electrode portion, and to achieve low connection resistance and high strength connection by alloying.

Since the conductive coating layer has a large thickness,
It is possible to achieve a low connection resistance value and increase the allowable current.

Further, it becomes possible to arrange the conductive balls inside the electric circuit element at a high density through the holding sheet or the arrangement member, and further, in the state where the conductive balls are held on the holding sheet or the mask sheet. Since it is connected, it becomes possible to prevent the positional deviation at the time of connection. As a result, it is possible to increase the density and size of the electric circuit component.

Further, since the core serves as a deformation stopper for the conductive balls at the time of connection, the conductive balls can be arranged close to each other without causing a short circuit between adjacent conductive balls due to the deformation of the conductive balls at the time of connection. , High density is achieved.

Further, the contact area with the electrode portion is also determined by the diameter of the core and the thickness of the conductive coating layer when the core serves as the deformation stopper, so that the size can be reduced.

Further, since the conductive balls can control the size with high accuracy and the core functions as a deformation stopper at the time of connection, the interval between connection words of the electric circuit element to be connected and the electric kairo board should be maintained with high accuracy. Is possible. Therefore,
For an element such as a photoelectric conversion element in which the arrangement position is a problem, it is possible to improve the optical signal characteristics, simplify and omit a complicated position adjusting member, and achieve miniaturization and stabilization.

Further, the volume of the sealing resin can be reduced by the presence of the holding sheet between the electric circuit element and the electric circuit board which are sealed when the electric circuit element is satirized. As a result, it is possible to reduce the contraction stress related to the connecting portion of the sealing resin and reduce the amount of bubbles existing in the sealing resin, and as a result, it is possible to obtain a highly reliable electric circuit component. .

Also, by reducing the transmittance of the holding sheet, it is possible to reduce unnecessary light emitted in the case of a light receiving element, which can improve the S / N ratio of the optical signal. Become.

By removing the holding sheet or the mask sheet after connection, it is possible to obtain a smaller electric circuit component.

Furthermore, by providing slits or notches in the holding sheet or mask sheet, it is possible to remove the connected conductive balls with low stress.

If only one side is alloyed and the connective is connected and the other side is pressed and connected, it is possible to easily remove this during maintenance.

Further, according to the present invention, by forming fine protrusions and valleys on the surface of the conductive ball formed of a spherical core made of a highly rigid material and a conductive coating layer covering the periphery thereof, an electric circuit element is formed. Further, it becomes possible to further destroy the oxide film or the contaminated film existing on the surface of the electrode portion of the electric circuit component, expose a wider intrinsic surface, and achieve low connection resistance and high strength connection by alloying.

Further, by providing the protrusions and valleys on the surface of the core, the oxidation and the contamination film can be easily destroyed even for a hard electrode material, and the conductive coating layer can be prevented from peeling from the core. Therefore, it is possible to improve the bondability.
By arranging and connecting the conductive balls having the protrusions and the valleys using the holding sheet, it is possible to achieve a more compact and high-density connection.

[0308]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

(First Embodiment) FIG. 1 is a sectional view schematically showing the construction of a first embodiment of an electric circuit component according to the present invention, and FIG. 2 is a conductive ball used in the present invention. FIG. 6 is a cross-sectional view showing 6 in FIG.
FIG. 4D is a cross-sectional view schematically showing a method for manufacturing an electric circuit component according to the present invention, and FIG. 4 is a perspective view of an arrangement member used in the present invention.

In FIG. 1, reference numeral 1 indicates a semiconductor chip which is an electric circuit element. An electrode portion 2 is provided on the surface of the semiconductor chip 1, and the surface of the semiconductor chip 1 other than the electrode portion 2 is covered with an insulating protective film 3.

Reference numeral 6 indicates a conductive ball for mechanically and electrically connecting the semiconductor chip 1 and the ceramic substrate 7. The conductive ball 6 is located at the center of the core 4.
And a conductive coating layer 5 provided on the outer periphery of the core 4.

On the ceramic substrate 7 which is an electric circuit substrate, a plurality of electrode portions 8 are arranged in a state corresponding to the electrode portions 2, and the surface of the substrate 7 other than the electrode portions 8 has an insulating protective film. It is covered with 9. It should be noted that in a state where the semiconductor chip 1 and the ceramic substrate 7 are connected via the conductive balls 6, a sealing resin 10 seals between the two.

On the other hand, in FIGS. 3 (a) to 3 (d), reference numeral 11 indicates a first mask sheet which is an arrangement member, and reference numeral 12 indicates a second mask sheet. And, on the second mask sheets 11 and 12,
The openings 13 are formed so as to communicate with each other. Further, reference numeral 24 indicates a blade. Further, as shown in FIG. 4, the first mask sheet 11 has
The slit 14 and the notch 15 are formed.

In the first embodiment, the conductive balls 6 specifically shown in FIG. 2 are interposed between the electrode portion 2 of the semiconductor chip 1 and the electrode portion 8 of the ceramic substrate 7 to apply pressure and heat. As a result, the conductive coating layer 5 of the conductive balls 6 is formed.
The natural oxide film and / or the contaminated film present on the surfaces of the electrode part 2 of the semiconductor chip 1 and the electrode part 8 of the ceramic substrate 7 are destroyed by the deformation and friction when the electrode part 2 and the electrode part 8 are deformed. The intrinsic surface is exposed and the conductive coating layer 5 and the electrode portion 2 and the electrode portion 8 are alloyed and connected, and after this connection, the sealing resin 10 is provided between the semiconductor chip 1 and the ceramic substrate 7 if necessary. It is set to be injected and cured to obtain the electric circuit component shown in FIG.

A method of manufacturing the conductive balls 6 will be described below, and then a method of manufacturing an electric circuit component using the conductive balls 6 will be described.

First, as shown in FIG.
Is composed of a spherical core 4 and a conductive coating layer 5 covering the periphery of the core 4. This core 4
Is made of steel in this first embodiment, and is set to have a spherical shape by precision polishing. The surface of the core 4 is subjected to a palladium treatment, and then electroless plating is performed to coat the surface of the core 4 with gold to be the conductive coating layer 5. The diameter (2R) of the core 4 is set to 40 μm, and the thickness (a) of the conductive coating layer 5 is set to 5 μm.

Next, a method of manufacturing an electric circuit component using the conductive balls 6 will be described with reference to FIGS. 3 (a) to 3 (d).

First, as shown in FIG. 3A, first and second mask sheets 11 and 12 are formed on the ceramic substrate 7.
And arrange them. The first and second mask sheets 1
The openings 1 and 12 are provided with openings 13 in advance at positions corresponding to the electrode portions 8 to be respectively connected, and the first and second masks are arranged so that the openings 13 are located on the electrode portions 8. The sheets 11 and 12 and the ceramic substrate 7 are positioned.

The diameter of the opening 13 is tapered to be slightly larger than the diameter of the conductive ball 6 to enhance the insertability. Further, the thickness h1 of the first mask sheet 11 is set to 30 μm, which is thinner than the diameter of the core.
The thickness h2 of 2 is such that h1 + h2 is smaller than 1.5 times the diameter D of the conductive ball 6 and larger than D.
It is set to 0 μm. Furthermore, the first mask sheet 1
In FIG. 1, a slit 14 is provided around the opening 13 and a notch 15 is provided at the end of the first mask sheet 11 as shown in FIG.

The arrangement of the conductive balls 6 on the electrode portion 8 is the second.
A large number of conductive balls 6 are arranged on the mask sheet 12, and the conductive balls 6 are dropped into the respective opening portions 13 by sweeping using the blade 24, thereby collectively performing the steps.

At this time, by using the second mask sheet 12, the conductive balls 6 arranged are separated by the blade 24.
The second mask sheet 12 covers the slits 14 provided in the first mask sheet 11, so that the conductive balls 6 are prevented from being scratched by the slits 14 when the blade is swept. . As a result, the conductive balls 6 not arranged on the electrode portion 8 can be arranged again.

Further, the first and second mask sheets 1
Since the thicknesses of 1 and 12 are thinner than 1.5 times the diameter of the conductive balls 6, the conductive balls 6 placed on the arranged conductive balls 6
However, since the mask sheet step is lower than its center of gravity, it is easily discharged by sweeping the blade.

After the conductive balls 6 are arranged on the electrode portion 8, the second mask sheet 12 is removed. Then, as shown in FIG. 3B, positioning is performed so that the electrode portion 2 of the semiconductor chip 1 is placed on the exposed conductive ball 6.

Next, the semiconductor chip 1 and the ceramic substrate 7
By applying pressure to and, pressure is also applied to the conductive balls 6 that are in point contact with the respective electrode portions 2 and 8. Then
In the conductive balls 6, the core 4 at the central portion is made of steel having high rigidity, and the conductive coating layer 5 covering the periphery is soft and easily stretched. Therefore, the core 4 itself is not deformed by this pressure, Only the conductive coating layer 5 is deformed. in this way,
Since the conductive ball 6 has the spherical core 4 which is hardly deformed at the center, the conductive coating layer 5 gradually deforms and moves outward in a concentric circle centered on the point that was in point contact. .

As the conductive coating layer 5 is deformed and moved, friction is generated between the electrode portions 2 and 8 in contact with each other. Due to this friction, the natural oxide film having a thickness of several hundred angstroms covering the surface of the aluminum electrode portion 2 of the semiconductor chip 1 can be destroyed and the intrinsic surface can be exposed. Further, the contaminated film covering the surface of the gold-plated electrode portion 8 of the ceramic substrate 7 is also destroyed.

Further, as shown in FIG. 3 (c), the exposed intrinsic surfaces of the electrode portions 2 and 8 and the conductive coating layer 5 are in contact with each other and heated to 200 to 350.degree. Convert and connect. By performing the pressurization and the heating at the same time, the gold (softening temperature 100 ° C.) of the conductive coating layer 5 is softened more easily and the deformation and movement can be easily performed, so that the connection by alloying is more reliable. And

Although not shown in detail in the first embodiment, a press machine (that is, a hot press machine) having a built-in heater is used to perform the above-mentioned pressurization and heating. To do. In this pressurizing and heating operation, the oxide film or the contaminated film present on the surface of the electrode part 2 of the semiconductor chip 1 and the electrode part 8 of the ceramic substrate 7 is generated by friction caused by the movement of the conductive coating layer 5 of the conductive ball 6. It is destroyed, and the true surfaces of the electrodes 2 and 8 (pure surfaces such as gold and aluminum) are exposed. As a result, the conductive coating layer 5 and the electrode portions 2 and 8 are easily diffused in the solid state of metal atoms, and are electrically / mechanically connected to each other by alloying / metallizing. Become.

Further, since the conductive balls 6 are held in the openings 13 of the first mask sheet 11 which is a disposing member, even if there is vibration during the connecting process, inclination of the pressing jig, etc.
It is possible to connect the conductive balls 6 without causing a displacement at the position. Then, after the conductive coating layer 5 and the respective electrode portions 2 and 8 are connected, the first mask sheet 11 is formed.
By pulling in the horizontal direction, the first mask sheet starts to tear from the notch 15, and the slit 14 advances the tear toward the opening 13 in which the conductive ball 6 exists.
By reaching the opening 13, as shown in FIG.
The first mask sheet 11 is removed from between the semiconductor chip 1 and the ceramic substrate 7 to complete an electric circuit component.

By removing the first mask sheet 11 in this way, there is no portion protruding laterally from the semiconductor chip 1 and the mounting area is small.

Then, if necessary, a sealing resin 10 for sealing the semiconductor chip 1 is injected between the semiconductor chip 1 and the ceramic substrate 7 and cured to finally obtain an electric circuit component. The method of sealing the semiconductor chip 1 may be another method. For example, a hollow seal with a metal or ceramic lid may be used.

According to the first embodiment, by using the two mask sheets 11 and 12, the effect that the conductive balls 6 can be arranged at once and without deforming the conductive coating layer 5 is achieved. Become.

The present invention is not limited to the above-described first embodiment, and various modifications can be made without departing from the spirit of the present invention. Various other embodiments of the present invention will be described below, but in the following description, the same parts as those in the first embodiment described above will be denoted by the same reference numerals, and the description thereof will be omitted.

(Second Embodiment) FIGS. 5A to 5
FIG. 6C is a cross-sectional view schematically showing the configuration and manufacturing method of the second embodiment of the electric circuit component according to the present invention, and FIGS. 6A to 6D show the second embodiment. FIG. 6 is a cross-sectional view schematically showing a method of manufacturing a conductive connecting member including a conductive ball and a holding sheet that holds the conductive ball, which is used in the embodiment.

In this second embodiment, FIG.
As shown in (a), as the conductive connecting member, the same conductive balls 6 as described in the first embodiment and the holding sheet 16 that holds the conductive balls 6 at a predetermined position are used. Therefore, first, an example of a method for manufacturing the conductive connecting member will be described with reference to FIGS. 6A to 6D.

First, as shown in FIG. 6A, a mold 17 having a recess 18 at a position corresponding to the position of the electrode part to be connected.
The conductive balls 6 are arranged in the. The shape of the recess 18 may be any shape such as a quadrangular prism shape, a conical shape, and a hemispherical shape.

When the conductive balls 6 are arranged in the recesses 18 of the mold 17, if the mask sheets 11 and 12 used in the first embodiment are used on the mold 17, they are arranged in a batch. can do.

After arranging the conductive balls 6 in the recesses 18 of the mold 17, as shown in FIG. 6B, similar molds 17 'are arranged on the recesses 18 at intervals so as not to crush the conductive balls 6. As a method for achieving the space between the upper die 17 'and the lower die 17, control is performed by a device for moving the die up or down, or one or both of the upper die 17' and the lower die 17 is projected from the die surface. A spacer part (not shown) is provided, the upper mold 17 ′ and the lower mold 17 are aligned with each other, and when the spacers come into contact with each other, the concave parts 1 of the upper mold 17 ′ and the lower mold 17
The protrusion amount of the spacer may be determined in advance so that the distance between 8'and 18 is equal to or slightly larger than the diameter of the conductive ball 6.

Then, as shown in FIG. 6C, the upper mold 1
Inject polyimide resin between 7'and lower mold 17,
Heat-cure to 400 ° C. and release. In this state,
Since the polyimide resin has adhered to the surface of the conductive ball 6 protruding from the surface of the holding sheet 16, both surfaces are etched (for example, ashing with O2 plasma for dry, hydrazine, ethylene diacine for wet) is used. As shown in d), the conductive balls 6 are projected and exposed from both surfaces of the holding sheet 16. for that reason,
The film thickness of the holding sheet 316 is thinner than that after molding. The film thickness of the holding sheet after this etching is preferably equal to or smaller than the diameter of the core so as not to hinder the deformation movement of the conductive coating layer 5 when the conductive balls 6 are connected.

Conductive balls 6 manufactured as described above
And a holding sheet 16 for holding the same (shown in FIG. 5 (a))
And a semiconductor chip 1 and a substrate 17
And so that the conductive balls 6 are located between the electrode portion 2 of the semiconductor chip 1 and the electrode portion 8 of the substrate 7, as shown in FIG. 5B.

Then, the conductive balls 6 are pressed and heated between the two electrode parts 2 and 8 by the above-mentioned hot press machine, and the conductive coating layer 5 of the conductive balls 6 exposed from the holding sheet 16 is respectively removed. The electrode portions 2 and 8 are alloyed and connected. After that, the holding sheet 16 is cut around the semiconductor chip 1, and subsequently, the sealing resin 10 is injected between the semiconductor chip 1 and the substrate 7 to be cured, as shown in FIG. Obtain electrical circuit components. The effect of this joining process is the same as that of the first embodiment.

As described above, according to the second embodiment, in addition to the effect of the first embodiment described above, since the conductive connecting member is used, the conductive balls 6 are held in close contact with the holding sheet 16. As a result, it is possible to further prevent the positional deviation of the conductive balls 6 with higher accuracy and to achieve an effect that the conductive balls 6 can be arranged with higher density. Further, since the conductive balls 6 are held in close contact with the holding sheet 14, there is no need for a clearance for insertion as in the case of a mask sheet, and it is possible to achieve an effect that the conductive balls 6 can be arranged with higher accuracy. become.

Further, the area of the conductive balls 6 in contact with the sealing resin 10 is small, the stress applied to the conductive balls 6 when the sealing resin is cured and contracted can be reduced, and the effect of improving the connection reliability is further achieved. It will be. (Third Embodiment) In the third embodiment, the holding sheet 16 has a slit 14 similar to that provided in the first mask sheet 11 used in the first embodiment described above, The configuration is similar to that of the second embodiment described above except that the notch 15 is provided.

The holding sheet 16 thus formed is
After the conductive coating layer 5 of the conductive balls 6 protruding and exposed from both sides of the conductive ball 6 and the respective electrode portions 2 and 8 are connected by alloying, the holding sheet 16 is pulled in the horizontal direction to It is possible to cause a tear. As a result, the slit of the holding sheet 16 reaches the conductive ball 6 through the slit 14, and the holding sheet 16 is cut.
However, the conductive balls 6 are no longer held, and the holding sheet 16 can be removed without applying stress to the conductive balls 6 and the respective connecting portions, and an electric circuit component can be obtained.

As described above, the slit 14 is formed in the holding sheet 16.
As a method for providing the notch 15 and the notch 15, the spacer provided on the mold in the second embodiment described above is used as the slit 14 and the notch 1.
If it is formed in the shape of 5 and arranged at a desired position, the portion is not filled with the resin, and the slit 14 and the notch 15 can be obtained when the mold is released.

According to the third embodiment, in addition to the effect achieved in the above-described second embodiment, the holding sheet 16 can be easily and surely removed, which allows the semiconductor chip 1 to be removed. Since there is no projecting portion, the effect of obtaining a smaller electric circuit component can be achieved. (Fourth Embodiment) FIG. 7 is a sectional view schematically showing the configuration of a fourth embodiment of an electric circuit component according to the present invention. In FIG. 7, reference numeral 19 denotes a CCD which is a light receiving element, and the light receiving portion 20 is provided on the surface of this CCD.
Is provided. Further, reference numeral 21 indicates a colorless and transparent glass substrate, and reference numeral 22 indicates a wiring pattern on the glass substrate 21.

In this fourth embodiment, silica (SiO 2) spheres having a diameter of 40 μm are used as the cores 4 of the conductive balls 6, the surface of which is treated with palladium, and then 5 μm of gold is coated by electroless plating. The conductive coating layer 5 is formed. Further, as the electric circuit board 21, the wiring pattern 22 is formed on a glass having a light transmitting property.
As the structure of the wiring pattern 22, Mo is used as a base layer and gold is provided thereon.

Then, using this conductive ball 6, CC
The electrode portion 2 of D19 and the electrode portion 8 of the wiring pattern 22 are formed by any of the methods of the above-described various embodiments.
They are alloyed and connected to obtain electrical circuit parts.

In the fourth embodiment, the cores 4 of the conductive balls 6 are dispersed so that the variation in the diameter thereof is ±.
The accuracy is kept extremely high at about 1μ. Further, at the time of connection, the core 4 is not substantially deformed at the time of connection, only the surrounding conductive coating layer 5 is deformed and moved, and further, the core 4 functions as a deformation stopper, so that the electrode portion 2 of the CCD 19 and the glass substrate. The distance between the electrode 21 and the electrode portion 8 is the total of the diameter of the core 4 and the conductive coating layer having a slight thickness due to the deformation movement, and is approximately the diameter of the core.

Therefore, the surface of the CCD 19 and the surface of the glass substrate 21 are connected in parallel with each other with high precision. Therefore, in this electric circuit component, it is possible to omit adjusting the inclination (angle) with respect to two axes such as tilt and pan of the CCD light receiving surface. Further, regarding the Z axis (depth of focus), the surface of the glass substrate 21 can be used as an optical reference.

Therefore, according to the fourth embodiment, C
Y, Y, which is necessary for mounting and adjustment of electric circuit parts including CD
With respect to the six adjustment directions of Z, tilt, pan, and rotation, it is possible to omit two or three adjustment directions. Therefore, not only the mounting adjustment time is shortened, but also the structure of the mounting member is simplified and the rigidity is increased, whereby the effect of improving the stability of the light receiving characteristics (registration stability) is achieved.

Furthermore, according to the fourth embodiment, the material of the core of the conductive balls 6 is silica (α = 2.6 × 10 −6 /
℃), the substrate material of CCD16 is Si
(Α = 2.8 × 10 −6 / ° C.) and Pyrex glass used as the glass substrate material (α = 3.6 × 10 −6 / ° C.)
By reducing the difference in the coefficient of thermal expansion, the thermal stress on the connection portion is reduced, and the deviation due to the temperature of the light receiving unit 20 after position adjustment is also reduced, so that the light receiving characteristics are stabilized.

In the fourth embodiment, colorless and transparent glass is used as the substrate material of the electric circuit board 21, but colored glass or glass provided with a film having filter characteristics is used as the substrate material. It is obvious that the same effect can be obtained even if there is.

When an LED or a surface emitting LD is used as an electric circuit element instead of a CCD, the element surface (light emitting surface) and the substrate are kept in parallel with each other with high accuracy. The effect that it is possible to simplify the adjustment for the deflection of the emitted light is achieved. (Fifth Embodiment) FIG. 8 is a sectional view schematically showing a fifth embodiment of the electric circuit component according to the present invention.

In the fifth embodiment, the holding sheet 16 in the above-mentioned fourth embodiment is further used. Here, an opening 23 is provided in the holding sheet 16 at a position corresponding to the light receiving portion 20 of the CCD 19. By using the conductive balls 6 held by the holding sheet 16 having the openings 23 as described above, the electrode portion 2 of the CCD 19 and the electrode portion 8 of the wiring pattern 22 of the glass substrate 21 are alloyed and connected to each other. There is.

In this fifth embodiment, the holding sheet 16
To reduce the light transmittance, a colored polyimide resin (for example, CPU tone B series, Toray
Dupont Co., Ltd. is used. Therefore, of the light incident from the back surface side of the glass substrate 21, as signal light,
The light incident on the light receiving portion 20 of the CCD 19 is not attenuated because it passes through the opening 23 of the holding sheet 16, but the intensity of light that is about to enter the CCD surface other than the light receiving portion 20 is attenuated by the holding sheet 16. It will be a matter.

Furthermore, the light is transmitted through the holding sheet 16, and the CCD 1
Even if the light is reflected on the surface 9, the light passes through the holding sheet 16 again and then goes to the glass substrate side, so that the strength also decreases at that time. Therefore, according to the fifth embodiment, the CCD
The effect that the intensity of the ghost light due to the reflected light other than the light receiving portion of 19 can be significantly reduced is achieved. Further, since the holding sheet 16 covers a considerable part of the back surface of the conductive ball 6, the effect of suppressing generation of reflected ghost light via the conductive ball 6 is achieved. Thus, in this fifth embodiment,
In addition to the effects of the fourth embodiment described above, the CCD 1
It is possible to improve the S / N of the light-receiving property of No. 9.

Further, in addition to the CCD as an electric circuit element,
When LEDs and surface emitting LDs are used, noise light is prevented from being emitted and the S / N of the optical signal is increased by cutting a portion of the output boom distribution that is not used as an optical signal with a holding sheet. It becomes possible. (Sixth Embodiment) FIG. 9 is a sectional view schematically showing a sixth embodiment of the electric circuit component according to the present invention.

In the sixth embodiment, a plurality of conductive balls 6 are arranged in one electrode portion 2, and the two electrode portions 2 and 8 are alloyed and connected via the plurality of conductive balls 6. There is.

A plurality of such conductive balls 6 are provided in the electrode portion 2
The mask sheet 11 used in the above-described first embodiment is used as the method for arranging
The size of the opening may be set to be (diameter × number of conductive balls arranged here) × (number of conductive balls).

According to the sixth embodiment, in addition to the effect of the first embodiment described above, the electrode portions 2 and 8 to be connected are connected by a plurality of conductive balls 6, thereby providing a parallel connection. Connection is achieved, and the effect of further reducing the connection resistance can be achieved. (Seventh Embodiment) FIGS. 10A to 10D are
It is sectional drawing which shows typically the manufacturing method in 7th Embodiment of the electric circuit component concerning this invention. In the figure, reference numeral 25 indicates a recess formed on the surface of a mold 26 made of quartz.

In this seventh embodiment, FIG.
As shown in (a), on the surface of the mold 26 made of quartz, a recess 2 is formed at a position corresponding to the electrode 2 of the semiconductor chip 1 to be connected.
5 are provided. By placing a plurality of conductive balls 6 on the surface of the mold 26 and sweeping the conductive balls 6 with the blade 24, the conductive balls 6 are housed and arranged in the recess 25. At this time, the arranged conductive balls 6 come into contact with the peripheral wall portion and the bottom portion in the recess 25, and are held so that the core 4 has a positional relationship in which the core 4 projects from the surface of the mold 26. If the conductive balls 6 can be held in this manner, the shape of the concave portion 25
There is no particular limitation.

After the placement of the conductive balls 6 is completed in this way, as shown in FIG. 10B, the electrode portion 2 of the semiconductor chip 1 and the placed conductive balls 6 are positioned, and thereafter, the semiconductor chip is placed. By pressing and heating 1 and the quartz mold 26, only the conductive coating layer 6 and the electrode portion 2 of the semiconductor chip 1 are alloyed and connected. After the connection is completed, the semiconductor chip 1 is picked up to obtain the semiconductor chip 1 in which the conductive balls 6 are connected to the electrode portions 2 as shown in FIG. 10C (and in FIG. 10D). As shown in the figure, after the semiconductor chip 1 and the resin substrate 27 are positioned so that the connected conductive balls 6 are on the electrode portions 8 of the wiring pattern 22 of the resin substrate 27, a spring (not shown) is used. The semiconductor chip 1 is pressed against the resin substrate 27 for connection.

According to the seventh embodiment, since only the electrode on one side in contact with the conductive ball 6 is connected by alloying, the semiconductor chip 1 is easily separated from the resin substrate 7 by releasing the pressure of the spring. It can be removed.

(Eighth Embodiment) FIG. 11 is a sectional view schematically showing the construction of an eighth embodiment of an electric circuit component according to the present invention, and FIG. 12 shows the structure of the eighth embodiment. FIG. 13 is a cross-sectional view schematically showing the used conductive balls taken out, and FIGS. 13 (a) to 13 (c) show FIG.
FIG. 14 is a cross-sectional view schematically showing a method for manufacturing the electric circuit component shown in FIG. 14, and FIG. 14 is a perspective view showing a mask sheet as an arrangement member used when manufacturing the electric circuit component taken out.

As shown in FIG. 11, the basic configuration of the electric circuit element 1 in the eighth embodiment is the same as that of the electric circuit element in the first embodiment shown in FIG. The difference is that, as shown in FIG. 12, a large number of recesses 28 are provided on the surface of the conductive balls 6 '.

That is, in the eighth embodiment, as shown in FIG. 12, a conductive ball 6'having a plurality of concave portions 28 and convex portions 29 alternately formed on the surface thereof is used as the electrode portion 2 of the semiconductor chip 1. The ceramic substrate 7 is interposed between the electrode portion 8 and the ceramic substrate 7, and pressure and heat are applied between them. Then, the recess 28 is formed when the conductive coating layer 5'of the conductive ball 6'is deformed and moved.
By the deformation and friction of the convex portion 29, the natural oxide film and the contaminated film existing on the surface of the aluminum pad 2 of the semiconductor chip 1 and the electrode portion 8 of the ceramic substrate 7 are destroyed, and the concave portion 28
The oxide film and the contaminated film are moved to a greater extent by the depression formed by the convex portion 29 and the convex portion 29. Thereby, the intrinsic surface of the metal material forming the electrode portions 2 and 8 is exposed more widely, and the conductive coating layer 5 and the electrode portions 2 and 8 are alloyed and connected,
After the connection, the sealing resin 10 is injected between the semiconductor chip 1 and the ceramic substrate 7 and cured to obtain the electric circuit component shown in FIG.

Below, a concave portion 28 and a convex portion 29 are formed on this surface.
A method of manufacturing the conductive ball 6 having the above and the electric circuit component will be described.

First, as shown in FIG. 12, the conductive ball 6 ′ is composed of the core 4 and the conductive coating layer 5 ′ covering the core 4 as in the first embodiment. A plurality of concave portions 28 and convex portions 29 are provided on the surface of the layer 5 '.

In the eighth embodiment, the core 4
Is a sphere made of steel and is formed into a spherical shape by precision polishing. After activating the surface of the core 4 with palladium, electroless plating is performed to cover the surface of the core 4 with gold to be the conductive coating layer 5. The diameter of the core 4 is set to 40 μm, and the film thickness of the conductive coating layer 5 ′ is set to 5 μm.

With the conductive coating layer 5'covered,
Since the surface of the core 4 is spherical, the surface of the conductive coating layer 5'is also smooth. Therefore, in order to provide the concave portion 28 and the convex portion 29 on the surface of the conductive coating layer 5 ', polishing using fine abrasive grains is performed. As this polishing method, for example,
It is possible to easily form the unevenness by pressing the conductive balls 6 against a lapping machine having desired abrasive grains first and lapping the conductive balls 6. Further, as another method, the unevenness can be provided by a so-called blast method in which the conductive balls 6 are hit with abrasive particles against air pressure, water pressure, or the like. Alternatively,
A method of forming unevenness by pressing a search belt provided with abrasive grains against the conductive balls 6 or a so-called barrel polishing method of forming unevenness by putting the conductive balls 6 in a beneficial insect containing abrasive grains and stirring .

If desired recesses 28 and protrusions 29 are provided on the surface of the conductive coating layer 5 ', the material of the abrasive grains,
The size and the polishing method are not limited. For example,
Abrasive grains include diamond, boron carbide, SiC, T
iC, Al2O3, WC, or the like is used, and the abrasive grain size can be any size from 0.25 μm to 50 μm. Further, as the polishing method, a grinding belt method, a buff polishing method, a barrel polishing method, a plasting method or the like can be used.

Alternatively, as the abrasive grains, fine metal particles such as Ni, W, Mo, and carbides and sulfides containing these as the main components were slightly pressed onto the surface of the conductive balls to cause them to bite. It is also possible to use a method in which by etching with an acid later, the fine metal particles are dissolved to form concave portions and convex portions on the surface of the conductive balls. For example, when Mo is used as the metal particles, nitric acid, oxidizing acids such as aqua regia, and molten oxidizing salts can be used as the etching solution, and in the case of W, nitric acid-hydrofluoric acid, molten oxide salts, It can be dissolved with a peroxide.

In the eighth embodiment, 1 μ-3
By rotating the conductive balls 6'on a polishing plate using diamond abrasive grains having a size of μm, the conductive coating layer 5 '
A concave portion 28 and a convex portion 29 are provided on the surface of the. The maximum difference Rm between the heights of the peaks and the valley bottoms of the recesses 28 and the protrusions 29 provided is Rm.
The ax was 0.2 to 6 μm.

Next, a method of manufacturing an electric circuit component using the conductive balls 6'will be described with reference to FIG.

First, the first and second mask sheets 11 and 12 are placed on the ceramic substrate 7 in an overlapping manner. The first and second mask sheets 11 and 12 have the above-mentioned first
Similar to the above embodiment, the opening portions 13 are provided at the positions corresponding to the electrode portions 8 to be respectively connected, and the mask sheets 11, 1 are placed so that the opening portions 13 are located on the electrode portions 8.
2 and the ceramic substrate 7 are positioned. The diameter of the opening 13 is slightly larger than the diameter of the conductive ball 6 ', and a taper is provided to improve the insertability. Also, the first
The thickness h1 of the mask sheet is 30μ, which is thinner than the diameter of the core.
m, and the thickness h2 of the second mask sheet 12 is h1 + h
2 is smaller than 1.5 times the diameter D of the conductive ball 6 ',
Further, it is set to 30 μm so as to be larger than D.

Further, as shown in FIG.
As shown in FIG. 4, a slit 14 is provided around the opening 13 and a notch 15 is provided at the end of the first mask sheet 11.
As shown in FIG. 13A, the conductive balls 6 are arranged on the electrode portion 8 by arranging a large number of conductive balls 6 ′ on the second mask sheet 12 and sweeping them by using a blade 24. The conductive balls 6'are dropped into the respective openings 13 to carry out collectively. At this time, by using the second mask sheet 12, the arranged conductive balls 6 ′ are prevented from being damaged by the blade 24, and the second mask sheet 12 becomes the first mask sheet 11. Since the slit 14 provided is covered, it is also possible to prevent the conductive ball 6 ′ from being caught by the slit 14 and being damaged when the blade is swept.

Therefore, the conductive balls 6'which have not been arranged in the electrode portion 8 can be arranged again. Further, since the thickness of the first and second mask sheets 11 and 12 is thinner than 1.5 times the diameter of the conductive ball 6 ', the conductive ball 6'mounted on the arranged conductive ball 6'is also Since the mask sheet step is lower than the center of gravity, it is easily discharged by sweeping the blade.

After the conductive balls 6'are arranged on the electrode portion 8, the second mask sheet 12 is removed. Then, as shown in FIG. 13B, the electrodes are positioned and arranged so that the electrode portions 2 of the semiconductor chip 1 are placed on the exposed conductive balls 6 '.

Next, the semiconductor chip 1 and the ceramic substrate 7
By pressurizing and, pressure is also applied to the conductive balls 6'which are in point contact with the respective electrode portions 2 and 8. Then, in the conductive ball 6 ', the core 4 at the central portion is made of steel having high rigidity, and the conductive coating layer 5'covering the periphery is made of soft and easy-to-stretch gold. Does not deform, and the conductive coating layer 5'deforms. Furthermore,
Since the conductive ball 6'has a spherical core 4 which is hardly deformed in the central portion, the conductive coating layer 5'deforms and moves outward concentrically around the point of point contact. .

As the conductive coating layer 5'deforms and moves, the contact with the electrode portions 2 and 8 also changes from point contact to surface contact. At this contact surface, the electrode portions 2 and 8 also deform and further deform and move. Friction occurs between the conductive coating layer 5 ′ and the conductive coating layer 5 ′. Due to this deformation and friction, the natural oxide film having a thickness of several hundred angstroms covering the surface of the electrode portion 2 of the semiconductor chip 1 is destroyed and the intrinsic surface is exposed. In addition, the contaminated film covering the surface of the gold-plated electrode portion 8 of the ceramic substrate 7 is also destroyed.

As described above, in the eighth embodiment, the minute recesses 28 and the protrusions 29 are formed on the surface of the conductive ball 6 '.
By having, in the connection process, each convex portion microscopically generates a high pressure at the time of contact, and further, the frictional force when the convex portion is deformed further promotes the destruction of the oxide film. A wide intrinsic surface is exposed. The larger exposed area of the intrinsic plane, the larger the area to be alloyed in the connection described later, the higher the connection strength, the lower the connection resistance, and the smaller the conventional bonding area, resulting in a smaller connection area. However, since the same connection characteristics (mechanical and electrical) as in the past can be obtained, the connection portion can be further downsized. With the exposed intrinsic surfaces of the electrodes 2 and 8 in contact with the conductive coating layer 5 ', 200 to 35
By heating to 0 ° C, they are alloyed and
It will be connected as shown in (c).

By applying pressure and heating at the same time,
The gold (softening temperature 100 ° C.) of the conductive coating layer 5 ′ is made softer, the deformation movement is facilitated, and the connection by alloying is made more reliable. Further, since the conductive balls 6'are held in the openings 13 of the first mask sheet 11 which is a disposing member, even if there is vibration during the connecting process, tilt of the pressing jig, etc. It is possible to connect without generating the positional deviation of 6 '.

After the conductive coating layer 5'is connected to the respective electrode portions 2 and 8, the first mask sheet 1 is formed.
By pulling 1 in the horizontal direction, the first mask sheet starts to tear from the notch 15, and the slit 14 advances the tear toward the opening 13 in which the conductive ball 6 exists and reaches the opening 13. 1 mask sheet 1
1 is removed from between the semiconductor chip 1 and the ceramic substrate 7. By removing the first mask sheet 11 in this manner, there is no portion protruding laterally from the semiconductor chip 1 and the mounting area is small.

Then, a sealing resin for sealing the semiconductor chip 1 is injected between the semiconductor chip 1 and the ceramic substrate 7 and cured to obtain an electric circuit component.

As described above, in the electric circuit component of the eighth embodiment, by utilizing the conductive balls 6'provided with the concave portions 28 and the convex portions 29 on the surface, the conductive balls 6 having no concave portions or convex portions are formed. Compared with the first to seventh embodiments used, the effect of obtaining higher connection strength and bonding rate is achieved.

(Ninth Embodiment) FIG. 15 is a sectional view schematically showing the configuration of a ninth embodiment of an electric circuit component according to the present invention, and FIG. 16 shows the structure of the ninth embodiment. 17 is a schematic cross-sectional view showing a conductive ball 6 ″ used. In FIG. 16, reference numeral 30 denotes a recess provided on the surface of the core 4 ″, and reference numeral 31 has been provided on the surface of the core 4 ″. The convex portion is shown.

In the ninth embodiment, the conductive ball 6 "is provided with a plurality of fine recesses 30 and protrusions 31 on the surface of the spherical core 4", as shown in FIG.
The core 4 ″ is made of steel, and the recesses 30 and the protrusions 31 on the surface thereof may be formed into a spherical shape and then may be re-polished with rough abrasive grains, or finely ground to a final shape. It may be provided by omitting the polishing with different abrasive grains.As in the eighth embodiment described above, any abrasive grain and polishing method can be used. In the above, the core diameter is 40 μm, and the maximum Rmax of the height difference between the crests and the valley bottoms of the concave portions 30 and the convex portions 31 is 0.5.
It is set to be ~ 3 μm.

As described above, the surface of the core 4 ″ having the concave portion 30 and the convex portion 31 on the surface is subjected to the activation treatment in the same manner as in the eighth embodiment, and then coated with gold to a thickness of about 5 μm to make it conductive. A coating layer 5 ″ is provided.

Here, since it is desired to provide the concave portion 30 and the convex portion 31 on the surface of the core 4 ″, the concave portion 30 and the convex portion 31 of the core 4 ″ are also formed on the surface of the conductive coating layer 5 ″ covering the surface. The concave portion 28 and the convex portion 29 corresponding to the above are provided.

This conductive ball 6 ″ is arranged on the electrode 8 of the ceramic substrate 7 by the same method as in the eighth embodiment, and the semiconductor chip 1 is placed on the conductive ball 6 thus arranged so that the electrode portion 2 is formed. So that the conductive coating layer 5 and the electrode portion 2 and the gold-plated electrode 8 are alloyed and connected by pressing and heating.

According to the ninth embodiment, since the concave portion 30 and the convex portion 31 are provided on the surface of the core 4 ″, the concave portion 28 and the convex portion 29 are automatically provided on the surface of the conductive coating layer 5 ″. In addition to the same effects as the above-described eighth embodiment, the following effects can be obtained.

That is, when the conductive coating layer 5 is deformed and moved by the pressure applied during connection, the concave portion 30 and the convex portion 3 are formed.
Since 1 is provided, internal friction is large, and it is difficult for deformation and movement to occur at the portion where the conductive coating layer 5 ″ and the core 4 ″ are in contact with each other. Therefore, the deformation movement of the conductive coating layer 5 due to the pressurization is performed exclusively on the outer peripheral surface side. That is, the conductive coating layer 5 is larger and deforms and moves on the contact surface side with the electrode, so that the destruction of the oxide film and the exposure of the electrode intrinsic surface are further promoted and the connection characteristics are further improved. Will be achieved.

Further, since the concave portion 30 and the convex portion 31 are provided on the surface of the core 4 ″, the adhesion between the conductive coating layer 5 ″ and the core 4 ″ is increased by the anchor effect, so that the conductive material at the time of pressurization is pressed. The effect of preventing the core 4 and the conductive coating layer 5 ″ from peeling off due to the deformation movement of the coating layer 5 ″ is further achieved. Due to the progress and swelling of the conductive coating layer 5 ″, a sufficient connection area with the electrode cannot be obtained, and
The peeled conductive coating layer 5 ″ may be broken by an external force, which is not preferable.

Further, the recess 2 is formed in the formed conductive coating layer 5 ″.
Since there is no processing for forming the projections 8 and the projections 29, there is less risk of contaminating the surface of the conductive coating layer 5 ″, and there is an effect that the connection characteristics can be stabilized.

(Tenth Embodiment) FIG. 17 is a sectional view schematically showing the configuration of a tenth embodiment of an electric circuit component according to the present invention, and FIG. 18 shows the structure of the tenth embodiment. FIG. 19 is a schematic enlarged cross-sectional view of a conductive connecting member including a conductive ball 6 ′ and a holding sheet 16 that holds the conductive ball 6 ′, which is used.
19A to 19D are cross-sectional views schematically showing the method for manufacturing the conductive connecting member.

In the tenth embodiment, the core 4
Silica (SiO2) was used as the material. The surface of the core 4 is activated in the same manner as in the above-described eighth embodiment and then covered with gold plating. The diameter of the core 4 is 20 μm, and the thickness of the conductive coating layer 5 is 3 μm.
And The surface of the conductive ball 6'is provided with the concave portion 28 and the convex portion 29 by the same method as that used in the above-described eighth embodiment. The maximum Rmax of the difference between the peak and the valley bottom of the concave portion 28 and the convex portion 29 is set to 0.1 to 2 μm.

Furthermore, in the tenth embodiment,
A conductive connecting member is used to hold the conductive ball 6 ′ at a predetermined position by the holding sheet 16. Therefore, first, one manufacturing example of this conductive connecting member is shown in FIGS.
This will be described using 9 (d).

First, as shown in FIG. 19 (a), the mold 1 is provided with a recess 18 at a position corresponding to the position of the electrode part to be connected.
A conductive ball 6 ′ is arranged at 7. The shape of the recess 18 may be any shape such as a quadrangular prism, a cylinder, a cone, and a hemisphere. In addition, the conductive balls 6'in the recess 18 of the mold 17.
When arranging, the mask sheet as used in the above-described eighth embodiment may be used on the mold 17 to collectively dispose.

After arranging the conductive balls in the recesses 18 of the mold 17, as shown in FIG. 19B, similar molds 17 'are arranged on the information at intervals so as not to crush the conductive balls 6'. To do. As a method for achieving the space between the upper mold 17 'and the lower mold', control is performed by a device for moving the mold up and down, or one or both of the upper mold 17 'and the lower mold 17 is controlled from the mold surface. Providing a protruding spacer portion, the upper die 17 'and the lower die 17 are aligned, and when the spacers come into contact with each other, the distance between the recesses 18', 18 between the upper die 17 'and the lower die 17 is equal to the diameter of the conductive ball 6'. The protrusion amount of the spacer should be determined so that it is equal or slightly larger.

Then, a polyimide resin is injected between the upper mold 17 'and the lower mold 17, and as shown in FIG.
It is heated and cured at 00 to 400 ° C. and released.

In this state, since the polyimide resin adheres to the surface of the conductive ball 'protruding from the surface of the holding sheet 16, both surfaces are etched (for example, ashing by O 2 plasma in dry, hydrazine in ethylene, ethylene diamine in wet). Then, as shown in FIG. 19D, the conductive balls 6 ′ are projected and exposed from both sides of the holding sheet 16. Therefore, the film thickness of the holding sheet 16 becomes thinner than that after molding.

The film thickness of the holding sheet 16 after the etching is equal to or smaller than the diameter of the core 4 so as not to prevent the deformation movement of the conductive coating layer 5 at the time of connecting the conductive balls 6 '. desirable.

Conductive balls 6'produced as described above
The conductive ball 6 ', the semiconductor chip 1, the substrate 7 and the conductive connecting member including the holding sheet 16 for holding the same.
Are aligned and arranged so that they are located between the electrode portion 2 of the semiconductor chip 1 and the electrode portion 8 of the substrate 7. Then, by the hot press device described above, the conductive balls 6 '
By pressing and heating between the electrodes 2 and 8, the conductive coating layer 5'of the conductive ball 6 exposed from the holding sheet 16 is alloyed with the respective electrode portions 2 and 8 to be connected, After cutting the holding sheet 16 around the semiconductor chip 1, the sealing resin 10 is injected between the semiconductor chip 1 and the substrate 7 and cured to obtain an electric circuit component. The effect of this joining process is the same as the effect of the eighth embodiment described above.

Furthermore, in the tenth embodiment,
Since the concave portion 28 and the convex portion 29 are also provided on the surface of the conductive coating layer 5 which is in contact with the holding sheet 16, the contact area between the holding sheet 16 and the conductive coating layer 5 ′ is increased, and the anchor effect is obtained. The strength of holding the conductive balls 6'of the holding sheet 16 is increased. That is, it is possible to obtain a contact area (holding strength) larger than the contact area (holding strength) formed by the square of the ball diameter. Therefore, it is possible to secure sufficient holding strength even with a smaller conductive ball 6 '. Therefore, by further downsizing the electrode portion, it is possible to downsize the electric circuit component.

Further, since the conductive balls 6'are held in close contact with the holding sheet 16, the conductive balls 6'can be more accurately prevented from being displaced and can be arranged at a higher density. Further, the conductive balls 6'that are in contact with the sealing resin 10
Has a small area, the stress applied to the conductive balls 6'when the sealing resin is cured and contracted can be reduced, and the connection reliability is improved.

The present invention can be applied to a modified or modified version of the above embodiment without departing from the spirit of the present invention.

For example, as the conductive balls 6'to be used,
The conductive ball 6 ″ having the concave portion 30 and the convex portion 31 on the surface of the core 4 ″ and the concave portion 28 and the convex portion 29 on the surface of the conductive coating layer 5 ″ used in the above-described ninth embodiment is used. However, it goes without saying that the same effect can be obtained.

[0408]

As described above, according to the present invention,
There are various effects described below.

That is, even if no special film treatment is applied to the electrode parts of the electric circuit element and the electric circuit board, the oxide film and the contaminated film on the electrode surface are destroyed by the pressure deformation movement of the conductive covering layer and the electrode, The metal and / or alloying enables a connection with low connection resistance and high connection strength, resulting in a highly reliable connection. Therefore, conventionally used wire bonding method, CCB method, TAB method, resin ball method,
It is possible to replace the anisotropic conductive sheet method.

Further, since the electrical connection is obtained by metalizing and / or alloying the connecting portion, the connecting resistance may change in addition to the temperature coefficient of the conductive material depending on the temperature like the resin ball method. In addition, stable connection characteristics can be obtained, and since the conductive layer can be thickened, the allowable current can be increased.

Further, since the core acts as a deformation stopper and does not melt (liquid layer) to make a connection, a short circuit between adjacent electrodes unlike the TAB method and the CCB method does not occur. Therefore, it is possible to connect the electrode portions with higher density (smaller connection pitch dimension).

Further, it is possible to connect the light emitting portion or the light receiving portion on the surface of the light emitting element or the light receiving element and the electric circuit board with high accuracy. Therefore, it becomes possible to dispose the light emitting portion or the light receiving portion at the optimum position in the optical design, and not only the optical characteristics can be improved but also the position adjusting member for disposing and fixing the light emitting element or the light receiving element can be greatly simplified or It is possible to omit the number of movable parts of the position adjusting member and increase the strength,
The positional shift of the light emitting part or the light receiving part due to temperature changes and vibrations in the use environment is prevented, and the optical characteristics are stabilized.
Further, since the area where the position adjusting member is attached can be reduced, the electric circuit component and the device using the electric circuit component can be downsized.

Since the holding sheet holds the conductive balls, the conductive balls can be arranged and connected at any position. Therefore, it is possible to connect more points than the wire bonding method and the TAB method, and it is possible to connect a large number of pins.

Further, since the holding sheet exists between the electrodes, the volume of the sealing resin for sealing the electric circuit element is reduced, and the conductive balls are held by embedding the central portion in the holding sheet. Since the area in contact with the sealing resin is small, the stress value applied to the conductive balls at the time of shrinkage upon curing can be reduced, and high connection reliability can be obtained.

By further reducing the amount of sealing resin deposited, it is possible to reduce the amount (number) of bubbles contained in the sealing resin at a certain rate. Therefore, moisture absorption of the sealing resin is reduced, and a highly reliable electric circuit component can be obtained.

Further, by lowering the transmittance of the holding sheet to be lower than that of air or sealing resin, in the case of a light receiving element, it is possible to prevent light incident on other than the light receiving section from being diffusely reflected on the element and reentering the light receiving section. This makes it possible to increase the S / N ratio of the received light signal. In the case of the light emitting element, it is possible to increase the S / N ratio of the optical signal by preventing unnecessary peripheral light of the light emitted from the light emitting portion from being emitted outside the electric circuit component. Further, since the holding sheet covers the periphery of the conductive balls, it is possible to eliminate the ghost light due to the connecting portion as in the wire bonding method, and it is possible to downsize the electric circuit component having the light receiving element.

Further, since the conductive balls having excellent connection characteristics are arranged on the electrodes all together by using a holding sheet that holds the conductive balls in close contact, the conductive balls are connected in a held state. It becomes possible to connect.

Further, after connecting the conductive balls held by the holding sheet and then removing the holding sheet, a smaller electric circuit component can be manufactured.

Furthermore, by providing the holding sheet with slits and notches, the holding sheet starts to separate from these at the time of removal, so that the stress applied to the conductive balls is reduced and a highly reliable electric circuit component is provided. can get.

By using the arranging member, the conductive balls having excellent connection characteristics can be arranged and connected at any place. Furthermore, by removing the placement member after connection, there is no portion projecting from the electric circuit element, so that the electric circuit component can be downsized.

Furthermore, by disposing slits and notches in the disposing member, the disposing member starts separating from these at the time of removal, so that the stress applied to the conductive balls is reduced, and a highly reliable electric circuit component is provided. can get.

Further, even when one of the electric circuit element and the electric circuit board deteriorates the characteristics in connection by metalization and / or alloying, one conductive ball is metalized and / or alloyed with high density. Can be connected.

Furthermore, it becomes possible to detachably connect the electric circuit element and the electric circuit component.

Furthermore, according to the invention of this application, in addition to the above-mentioned effects, the pressing of the conductive coating layer can be performed without applying a special film treatment to the electrode portions of the electric circuit element and the electric circuit board. The friction caused by the deformation and movement destroys the natural oxide film and the contaminated film on the electrode surface, and the connection with low connection resistance and high connection strength is made possible by alloying. Since the natural oxide film and the contaminated film are improved in the destructiveness by having the portions and the valleys and the connection reliability is improved, even if the connection area is smaller, it is possible to reliably connect by metalization or alloying. Therefore, it is possible to cope with a connection having a small connection area, and it is possible to further increase the density of the connection.

Further, since the oxide film and the contaminated film can have high destructiveness even for a hard electrode material, high connection characteristics can be obtained regardless of the object to be connected. Furthermore, the contact surface can be reliably ensured by improving the adhesion between the core of the conductive ball and the conductive coating layer. The connection characteristics are stable. Therefore, it is possible to obtain stable connection characteristics regardless of the connection target, and it is possible to further reduce the size and reliability of the electric circuit component.

Since the protrusions and the troughs are provided on one or both of the surface of the conductive balls and the surface of the core, it is possible to arrange the conductive balls at any position to make a compact and high-density connection. . Therefore, it is possible to connect more points than the wire bonding method and the TAB method, and it is possible to connect a large number of pins.

[0427]

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing the configuration of a first embodiment of an electric circuit component according to the present invention.

FIG. 2 is a cross-sectional view schematically showing the configuration of conductive balls used in the electric circuit component shown in FIG.

FIG. 3 is a cross-sectional view schematically showing the method of manufacturing the electric circuit component according to the first embodiment.

FIG. 4 is a perspective view showing a mask sheet used in the method for manufacturing an electric circuit component according to the first embodiment.

FIG. 5 is a cross-sectional view schematically showing a configuration and a manufacturing method of a second embodiment of an electric circuit component according to the present invention.

FIG. 6 is a cross-sectional view schematically showing a manufacturing method of a holding sheet used for the electric circuit component of the second embodiment.

FIG. 7 is a sectional view schematically showing a configuration of a fourth embodiment of an electric circuit component according to the present invention.

FIG. 8 is a sectional view schematically showing a configuration of a fifth embodiment of an electric circuit component according to the present invention.

FIG. 9 is a sectional view schematically showing the configuration of a sixth embodiment of an electric circuit component according to the present invention.

FIG. 10 is a sectional view schematically showing a configuration of a seventh embodiment of an electric circuit component according to the present invention.

FIG. 11 is a sectional view schematically showing the configuration of an eighth embodiment of an electric circuit component according to the present invention.

FIG. 12 is a cross-sectional view schematically showing a configuration of conductive balls used in the electric circuit component shown in FIG.

FIG. 13 is a cross-sectional view schematically showing the manufacturing method of the electric circuit component according to the eighth embodiment.

FIG. 14 is a perspective view showing a mask sheet used in the method for manufacturing an electric circuit component according to the eighth embodiment.

FIG. 15 is a sectional view schematically showing a configuration of a ninth embodiment of an electric circuit component according to the present invention.

16 is a cross-sectional view schematically showing a configuration of a conductive ball used in the electric circuit component shown in FIG.

FIG. 17 is a sectional view schematically showing a configuration of a tenth embodiment of an electric circuit component according to the present invention.

18 is a sectional view schematically showing a conductive ball and a holding sheet used in the electric circuit component shown in FIG.

FIG. 19 is a cross-sectional view that schematically shows the manufacturing method of the holding sheet according to the tenth embodiment.

FIG. 20 is a schematic cross-sectional view illustrating a conventional wire bonding method.

FIG. 21 is a schematic cross-sectional view illustrating a CCB method of a conventional example.

FIG. 22 is a schematic sectional view illustrating a CCB method of a conventional example.

FIG. 23 is a schematic cross-sectional view illustrating a TAB method of a conventional example.

FIG. 24 is a schematic cross-sectional view illustrating a face-down connection using gold bumps in a conventional example.

FIG. 25 is a schematic cross-sectional view illustrating a conventional resin ball method.

FIG. 26 is a schematic cross-sectional view illustrating a conventional anisotropic conductive sheet method.

FIG. 27 is a schematic cross-sectional view illustrating a conventional anisotropic conductive sheet method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 semiconductor chip 2 electrode part 3 insulating protective film 4 (4 ″) core 5 (5 ′, 5 ″) conductive coating layer 6 (6 ′, 6 ″) conductive ball 7 substrate 8 electrode (wiring pattern) 9 insulating protective film 10 Encapsulating resin 11 First mask sheet 12 Second mask sheet 13 Opening 14 Slit 15 Notch 16 Holding sheet 17 type (lower type) 17 'type (upper type) 18 Recess 19 Semiconductor chip 20 Light receiving part 21 Substrate (glass ) 22 wiring pattern 23 opening of holding sheet 24 blade 25 concave portion 26 type 28 resin substrate 28 concave portion (conductive ball surface) 29 convex portion (conductive ball surface) 30 concave portion (core surface) 31 convex portion (core surface)

Claims (113)

[Claims] 1. An electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein the electrode section of the electric circuit element and the electric circuit board are provided. And at least one conductive ball having a conductive coating layer around a core having a substantially ball-shaped rigidity, the conductive ball being an electrode of the electric circuit element. Between the electrode section of the electric circuit element and the coating layer of the conductive ball, and between the electrode section of the electric circuit element and the coating layer of the conductive ball, and between the electrode section of the electric circuit board and the coating layer of the conductive ball. Electrical circuit parts characterized by electrical and mechanical connections between them. 2. An electric circuit element having an electrode portion and an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element has an electrode portion. In an electric circuit component in which at least one conductive ball is interposed between the electrode part of the electric circuit board and the two electrode parts are connected to each other, the conductive ball is made of at least one of a highly rigid metal material and an inorganic material. And a core having a substantially spherical shape,
A conductive coating layer formed of a material having electrical conductivity and coated around the core, wherein the conductive balls are pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; Between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating layer, the materials constituting each are metalized and / or alloyed. Electrical circuit parts characterized by being connected together. 3. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, and the electric circuit element and the electric circuit board are opposed to each other. In the state, it is sandwiched between the respective electrode parts, and between the both electrode parts,
At least one or more conductive balls electrically and mechanically connected to each other, wherein the conductive balls have a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a material having electrical conductivity and coated around the core, wherein the conductive balls are pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; Between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating layer, the materials constituting each are metalized and / or alloyed. Electrical circuit parts characterized by being connected together. 4. An electric circuit component comprising a photoelectric conversion element having an electrode section and an electric circuit board having an electrode section for connecting to the photoelectric conversion element, wherein the electrode section of the photoelectric conversion element and the electric circuit board are provided. And at least one conductive ball provided with a conductive coating layer around a core having a substantially ball-shaped rigidity, the conductive ball being an electrode of the photoelectric conversion element. Between the electrode portion of the photoelectric conversion element and the coating layer of the conductive ball, and between the electrode portion of the photoelectric conversion element and the coating layer of the conductive ball, and between the electrode portion of the photoelectric conversion element and the coating layer of the conductive ball. Electrical circuit parts characterized by electrical and mechanical connections between them. 5. An electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element has an electrode portion. In an electric circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit board and the two electrode portions are connected to each other, the electric circuit element has at least one photoelectric conversion element, The electric circuit board has a light-transmitting property in at least a portion thereof, and the conductive ball has a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a material having electrical conductivity and coated around the core, wherein the conductive balls are pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; Between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating layer, the materials constituting each are metalized and / or alloyed. Electrical circuit parts characterized by being connected together. 6. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, and the electric circuit element and the electric circuit board facing each other. In the state, it is sandwiched between the respective electrode parts, and between the both electrode parts,
At least one or more conductive balls electrically and mechanically connected to each other, the electric circuit element has at least one or more photoelectric conversion elements, and the electric circuit substrate has a light-transmitting property at least in part. The conductive ball has a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a material having electrical conductivity and coated around the core, wherein the conductive balls are pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; Between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating layer, the materials constituting each are metalized and / or alloyed. Electrical circuit parts characterized by being connected together. 7. An electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein the electrode section of the electric circuit element and the electric circuit board are provided. An at least one conductive ball which is interposed between the electrode part of, and has a conductive coating layer around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball, Holds the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. A holding sheet for holding the conductive ball, the conductive ball is pressed against the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and the electrode portion of the electric circuit element and one surface of the holding sheet are Between the part of the coating layer of the conductive ball protruding and between the electrode part of the electric circuit board and the part of the coating layer of the conductive ball protruding from the other surface of the holding sheet are electrically connected. And an electrical circuit part characterized by being mechanically connected. 8. An electric circuit element having an electrode portion and an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element has an electrode portion. An electrical circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit board and the two electrode portions are connected to each other. A holding sheet for holding the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. And a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a material having electrical conductivity and coated around the core, wherein the conductive balls are pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; Between the electrode portion of the electric circuit element and the portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, and from the electrode portion of the electric circuit board and the other surface of the holding sheet. An electrical circuit component, characterized in that the protruding conductive balls are connected to the conductive coating layer by metallizing and / or alloying the materials forming each of them. 9. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, and the electric circuit element and the electric circuit board facing each other. In the state, at least one or more conductive balls sandwiched between the respective electrode parts and electrically and mechanically connecting the both electrode parts, and a holding sheet for embedding and holding the conductive balls are provided. A holding member which is made of an insulating material and holds the conductive ball so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A sheet, the conductive ball, a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a material having electrical conductivity and coated around the core, wherein the conductive balls are pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; Between the electrode portion of the electric circuit element and the portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, and from the electrode portion of the electric circuit board and the other surface of the holding sheet. An electrical circuit component, characterized in that the protruding conductive balls are connected to the conductive coating layer by metallizing and / or alloying the materials forming each of them. 10. An electric circuit component comprising a photoelectric conversion element having an electrode section and an electric circuit board having an electrode section for connecting to the photoelectric conversion element, wherein the electrode section of the photoelectric conversion element and the electric circuit board are provided. An at least one conductive ball which is interposed between the electrode part of, and has a conductive coating layer around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball, Holds the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. And a holding sheet for holding the conductive ball, wherein the conductive ball is pressure-contacted by the electrode portion of the photoelectric conversion element and the electrode portion of the electric circuit board, and the conductive ball is formed from the electrode portion of the photoelectric conversion element and one surface of the holding sheet. Between the protruding portion of the conductive ball covering layer and between the electrode portion of the electric circuit board and the covering layer portion of the conductive ball protruding from the other surface of the holding sheet. Electrical circuit parts characterized by being mechanically connected. 11. An electric circuit element having an electrode portion and an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other to form an electrode portion of the electric circuit element. An electric circuit component in which at least one conductive ball is interposed between the electrode part of the electric circuit board and the two electrode parts are connected to each other, the holding sheet embedding and holding the at least one conductive ball, Holds the conductive ball so that it is formed of an electrically insulating material and a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for the electric circuit element, the electric circuit element has at least one or more photoelectric conversion elements, the electric circuit board has a light-transmitting property at least in part, the holding sheet is air or sealed. It has a light transmittance lower than that of a stop resin and is formed to have an opening at a portion corresponding to the photoelectric conversion element, and the conductive ball is a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material. A core having the shape of
A conductive coating layer formed of a material having electrical conductivity and coated around the core, wherein the conductive balls are pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; Between the electrode portion of the electric circuit element and the portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, and from the electrode portion of the electric circuit board and the other surface of the holding sheet. An electrical circuit component, characterized in that the protruding conductive balls are connected to the conductive coating layer by metallizing and / or alloying the materials forming each of them. 12. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, the electric circuit element and the electric circuit board facing each other. In this state, there are at least one conductive ball which is sandwiched between the respective electrode parts and electrically and mechanically connects the both electrode parts, and a holding sheet which embeds and holds the at least one conductive ball. And a conductive ball formed of a material having electrical insulation so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. And a holding sheet for holding the electric circuit element, the electric circuit element has at least one or more photoelectric conversion element, the electric circuit substrate has a light-transmitting property at least in part, the holding sheet is air Has a light transmittance lower than that of the sealing resin and is formed to have an opening in a portion corresponding to the photoelectric conversion element, and the conductive ball is made of at least one of a highly rigid metal material and an inorganic material. A core having a substantially spherical shape,
A conductive coating layer formed of a material having electrical conductivity and coated around the core, wherein the conductive balls are pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; Between the electrode portion of the electric circuit element and the portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, and from the electrode portion of the electric circuit board and the other surface of the holding sheet. An electrical circuit component, characterized in that the protruding conductive balls are connected to the conductive coating layer by metallizing and / or alloying the materials forming each of them. 13. The electricity according to claim 1, wherein a distance between the electrode portions connected by the conductive balls is a distance substantially equal to a diameter of the core. Circuit parts. 14. The outer peripheral surface of the conductive coating layer is formed into a smooth curved surface shape.
The electric circuit component according to any one of 3 above. 15. The electric circuit component according to claim 1, wherein the outer peripheral surface of the core is formed into a smooth curved surface. 16. The electric circuit component according to claim 1, wherein an outer peripheral surface of the conductive coating layer is formed in an uneven shape. 17. The inner peripheral surface of the conductive coating layer is formed in an uneven shape.
The electric circuit component according to any one of 6 above. 18. The electric circuit component according to claim 1, wherein the outer peripheral surface of the core is formed in an uneven shape. 19. The electric circuit component according to claim 1, wherein a plurality of conductive balls are provided between the both electrode portions. 20. The electric circuit component according to claim 1, wherein a space between the substrate and the element is resin-sealed. 21. The electric circuit component according to claim 7, wherein the holding sheet is formed with notches and / or slits so that the holding sheet can be torn. 22. The conductive coating layer has an electric resistivity of 1.6.
The electric circuit component according to any one of claims 1 to 12, wherein the electric circuit component is formed of a material having a thickness of E-8 to 10E-8Ω · m. 23. The conductive coating layer has a thickness of 1 to 5
23. The electric circuit component according to claim 22, wherein the electric circuit component is set to 0 μm. 24. The conductive coating layer has a thickness of 3 to 2
The electric circuit component according to claim 23, wherein the electric circuit component is set to 0 μm. 25. The core has a diameter of 3 to 500 μm.
It is set to m.
The electric circuit component according to any one of 1. 26. The core has a diameter of 10 to 200.
26. The electric circuit component according to claim 25, wherein the electric circuit component is set to μm. 27. The core has rigidity such that a displacement amount of a diameter thereof is 5% or less when a load required for connection between both electrodes is applied. Claim 1
13. The electric circuit component according to any one of 1 to 12. 28. The core has rigidity such that a displacement amount of a diameter thereof is 1% or less when a load required for connection between both electrodes is applied. Claim 2
The electric circuit component according to 7. 29. The size of the unevenness of the conductive coating layer is Rm.
The electric circuit component according to any one of claims 16 to 18, which is 10% or more of a film thickness of an electrode connected by ax and is 2 times or less of a film thickness of a conductive coating layer. 30. A method of manufacturing an electric circuit component, comprising: an electric circuit element having an electrode section; and an electric circuit board having an electrode section for connecting to the electric circuit element, comprising: A first step of interposing at least one or more conductive balls having a coating layer having conductivity around the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; A second step of pressing the conductive balls with an electrode part and an electrode part of the electric circuit board; a third step of heating the conductive coating layer of the conductive balls to a predetermined temperature; Moving the conductive coating layer between the electrode portion of the electric circuit element and the conductive ball and the conductive coating layer between the electrode portion of the electric circuit board and the conductive ball to move the core and both electrode portions. Contact A fourth step of touching, and a fifth step of cooling the conductive coating layer to maintain contact between the core and both electrode portions to metallize or alloy the conductive coating layer and both electrode portions. A method of manufacturing an electric circuit component, comprising: 31. A method of manufacturing an electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein a core having a substantially ball-shaped rigidity is used. A first step of mounting at least one or more conductive balls having a conductive coating layer on the periphery thereof on one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; Second step of stacking the other electrode part of the electric circuit board and the electrode part of the electric circuit board on the conductive ball and sandwiching the conductive ball between the electrodes, and the electrode part of the electric circuit element and the electric circuit board. And a fourth step of heating the conductive coating layer of the conductive ball to a predetermined temperature; and the pressing and heating of the electric circuit element. A conductive coating layer between the electrode portion and the conductive ball and a conductive coating layer between the electrode portion of the electric circuit board and the conductive ball are respectively moved to bring the core into contact with both electrode portions. Fifth
And a sixth step of cooling the conductive coating layer to maintain contact between the core and both electrode portions to metallize or alloy the conductive coating layer and both electrode portions. And a method for manufacturing an electric circuit component. 32. A method of manufacturing an electric circuit component, comprising: an electric circuit element having an electrode section; and an electric circuit board having an electrode section for connecting to the electric circuit element. On one side, a mask member formed to be thinner than a diameter of a conductive ball having a coating layer having conductivity around a core having a substantially ball-shaped rigidity, and having an opening formed at a position corresponding to the electrode, A first step of placing the opening in a state corresponding to the electrode; and containing the conductive ball in the opening of the mask member, and setting the conductive ball to the electrode of the electric circuit element and the electric circuit board. A second step of placing at least one or more on one of the parts, and placing the other of the electric circuit element and the electric circuit board so that the electrode parts thereof overlap the conductive balls, the ball A third step of sandwiching the conductive balls by the electrodes, a fourth step of pressing the conductive balls by the electrode portions of the electric circuit element and the electrode portions of the electric circuit board, and a predetermined temperature of the conductive coating layer of the conductive balls. And a conductive coating layer between the electrode portion of the electric circuit element and the conductive ball and a conductive coating layer between the electrode portion of the electric circuit board and the conductive ball by the pressing and heating. And a sixth step of bringing the core and the electrode portions into contact with each other, and cooling the conductive coating layer to maintain contact between the core and the electrode portions, and the conductive coating layer and 7. A method of manufacturing an electric circuit component, comprising: a seventh step of metallizing or alloying both electrode parts; and an eighth step of removing the mask member. 33. A method of manufacturing an electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, the method comprising: On one side, a diameter is formed smaller than the diameter of a conductive ball having a conductive coating layer around a substantially ball-shaped rigid core, and a first opening is formed at a position corresponding to the electrode. A first step of mounting the first mask member in a state where the opening corresponds to the electrode, and a total thickness of the first mask member and the first mask member is equal to the conductive layer. The second mask member is formed so as to be thinner than 1.5 times the diameter of the ball and has a second opening formed at a position corresponding to the electrode.
And a second step of superimposing so that the second openings communicate with each other, and the conductive balls are housed in the first and second openings of the first and second mask members, respectively. A third step of mounting at least one or more of the electric circuit element and one of the electrode portions of the electric circuit board, a fourth step of removing the second mask member, the electric circuit element and the electric circuit A fifth step of placing the other side of the substrate so that the electrode portion thereof overlaps the conductive ball and sandwiching the conductive ball between the electrodes, and the electrode portion of the electric circuit element and the electric circuit. A sixth step of pressing the conductive balls with the electrode portion of the substrate, a seventh step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and the pressing and heating of the electric circuit element Electrode part and the conductive ball And a conductive coating layer between the electrode portion of the electric circuit board and the conductive ball, to move the conductive coating layer between the core and both electrode portions, and the conductive coating layer A ninth step of cooling to maintain the contact between the core and both electrode portions to metallize or alloy the conductive coating layer and both electrode portions; and a tenth step of removing the first mask member. And a method for manufacturing an electric circuit component. 34. A method of manufacturing an electric circuit component including an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein a core having a substantially ball-shaped rigidity is used. A first step of bringing a conductive ball having a conductive coating layer around the electrode into contact with one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; the one electrode portion; A second step of pressing the balls against each other; a third step of heating the conductive coating layer of the conductive balls to a predetermined temperature; and a step of pressing between the one electrode portion and the conductive balls by the pressing and heating. Moving the conductive coating layer to contact the core with the one electrode portion, and cooling the conductive coating layer to maintain contact between the core and the one electrode portion. The conductive coating layer And a fifth step of metallizing or alloying the one electrode part, a conductive ball connected to the one electrode, the electrode part of the electric circuit element and the other of the electrode parts of the electric circuit board. Contacting and holding the conductive ball between both electrodes
The step of pressing the conductive balls with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; and an eighth step of heating the conductive coating layer of the conductive balls to a predetermined temperature. A step of moving the conductive coating layer between the other electrode portion and the conductive ball by the pressure and heating to bring the core and the other electrode portion into contact with each other; Cooling the conductive coating layer to maintain contact between the core and the other electrode portion to metallize or alloy the conductive coating layer and the other electrode portion. A method for manufacturing a characteristic electric circuit component. 35. A method of manufacturing an electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein a concave portion corresponding to the electrode is provided on an upper surface. A first step of accommodating a conductive ball having a conductive coating layer around a core having a substantially ball-shaped rigidity in the recess of the mold, the conductive ball being included; A second step of bringing the electrode portion of the electric circuit element and one of the electrode portions of the electric circuit board into contact with each other; and a third step of pressing the conductive ball with the one electrode portion and the recess. A fourth step of heating the conductive coating layer of the conductive ball to a predetermined temperature; and by moving the conductive coating layer between the one electrode portion and the conductive ball by the pressing and heating, One of the above A fifth step of contacting an electrode portion, cooling the conductive coating layer to maintain contact between the core and the one electrode portion, and metalizing the conductive coating layer and the one electrode portion. Or a sixth step of alloying, a seventh step of taking out one of the electric circuit element and the electric circuit board to which the conductive ball is connected from the mold, and a conductive ball connected to the one electrode An electrode part of the electric circuit element and the other of the electrode parts of the electric circuit board are brought into contact with each other, and the conductive ball is sandwiched by both electrodes.
And a ninth step of pressing the conductive balls with the electrode portions of the electric circuit element and the electrode portions of the electric circuit board, and a tenth step of heating the conductive coating layer of the conductive balls to a predetermined temperature. A step of moving the conductive coating layer between the other electrode portion and the conductive ball by the pressing and heating to bring the core and the other electrode portion into contact with each other; A twelfth step of cooling the conductive coating layer to maintain contact between the core and the other electrode portion to metallize or alloy the conductive coating layer and the other electrode portion. A method for manufacturing a characteristic electric circuit component. 36. The method of manufacturing an electric circuit component according to claim 30, wherein the electric circuit element comprises at least one photoelectric conversion element. 37. The method of manufacturing an electric circuit component according to claim 30, wherein the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface. 38. The method of manufacturing an electric circuit component according to claim 30, wherein the outer peripheral surface of the core is formed into a smooth curved surface. 39. The method of manufacturing an electric circuit component according to claim 30, wherein an outer peripheral surface of the conductive coating layer is formed in an uneven shape. 40. The method of manufacturing an electric circuit component according to claim 30, wherein the inner peripheral surface of the conductive coating layer is formed in a concave-convex shape. 41. The method of manufacturing an electric circuit component according to claim 30, wherein the outer peripheral surface of the core is formed in an uneven shape. 42. In the first step, a plurality of conductive balls are provided between both electrode portions.
0. The manufacturing method of the electric circuit component of 31. 43. In the second step, a plurality of conductive balls are provided between both electrode portions.
2. The method for manufacturing an electric circuit component according to 2. 44. In the third step, a plurality of conductive balls are provided between both electrode portions.
3. The method for manufacturing an electric circuit component according to item 3. 45. The method of manufacturing an electric circuit component according to claim 34, wherein in the first step, a plurality of conductive balls are brought into contact with the one electrode portion at a time. 46. The method of manufacturing an electric circuit component according to claim 35, wherein in the first step, a plurality of conductive balls are housed in the recess at one time. 47. The method of manufacturing an electric circuit component according to claim 30, further comprising a step of sealing between the substrate and the element with a resin. 48. The method of manufacturing an electric circuit component according to claim 32, wherein the mask member is formed with a notch and / or a slit so that it can be torn. 49. The conductive coating layer has an electric resistivity of 1.6.
The method for manufacturing an electric circuit component according to any one of claims 30 to 35, characterized in that the electric circuit component is formed of a material having a thickness of E-8 to 10E-8Ω · m. 50. The conductive coating layer has a thickness of 1 to 5
The method of manufacturing an electric circuit component according to claim 49, wherein the thickness is set to 0 μm. 51. The conductive coating layer has a thickness of 3 to 2
The method of manufacturing an electric circuit component according to claim 50, wherein the thickness is set to 0 μm. 52. The core has a diameter of 3 to 500 μm.
m is set to m.
5. The method for manufacturing an electric circuit component according to any one of 5 above. 53. The core has a diameter of 10 to 200.
53. The method for manufacturing an electric circuit component according to claim 52, wherein the method is set to μm. 54. The core has a rigidity such that a displacement amount of a diameter thereof is 5% or less when a load required for connection between both electrodes is applied. Claim 3
The method for manufacturing an electric circuit component according to any one of 0 to 35. 55. The core has rigidity such that a displacement amount of a diameter thereof is 1% or less when a load required for connection between both electrodes is applied. Claim 5
4. The method for manufacturing the electric circuit component according to 4. 56. The size of the unevenness of the conductive coating layer is Rm.
42. The electric circuit component according to claim 39, wherein the thickness is 10% or more of the film thickness of the electrodes connected by ax and is 2 times or less the film thickness of the conductive coating layer. Production method. 57. The pressing of the conductive balls in the second step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 31. The electric device according to claim 30, wherein the proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Method of manufacturing circuit parts. 58. The pressing of the conductive balls in the third step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 32. The electrical device according to claim 31, wherein the proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Method of manufacturing circuit parts. 59. The pressing of the conductive balls in the fourth step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 33. The electrical device according to claim 32, wherein the proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Method of manufacturing circuit parts. 60. The pressing of the conductive balls in the sixth step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 34. The electrical device according to claim 33, wherein the proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Method of manufacturing circuit parts. 61. The pressing of the conductive balls in the seventh step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. The electricity according to claim 34, wherein when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball, the proximity operation is stopped and the pressurizing operation is ended. Method of manufacturing circuit parts. 62. The pressing of the conductive balls in the ninth step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 36. The electric device according to claim 35, wherein the proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Method of manufacturing circuit parts. 63. A conductive ball for connecting an electrode part of an electric circuit element having an electrode part and an electric circuit board having an electrode part to each other, wherein a core having a substantially ball-shaped rigidity and a core of this core are provided. A conductive ball having a conductive coating layer coated on the periphery thereof. 64. The conductive coating layer of the conductive ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to form an electrode portion of the electric circuit element and an electrode portion of the electric circuit board. The conductive ball according to claim 63, which is electrically and mechanically connected to each other. 65. An electrically conductive ball for connecting an electrode portion of an electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion to each other is made of at least one of a metal material and an inorganic material having high rigidity. A conductive ball comprising: a core having a substantially spherical shape; and a conductive coating layer formed of a material having electrical conductivity and coated around the core. 66. The conductive coating layer of the conductive balls includes an electrode portion of the electric circuit element and an electrode portion of the electric circuit board,
66. The conductive balls according to claim 65, which are metal-bonded to each other. 67. The conductive ball according to claim 63, wherein the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface. 68. The conductive ball according to claim 63, wherein the outer peripheral surface of the core is formed into a smooth curved surface. 69. The conductive ball according to claim 63, wherein the outer peripheral surface of the conductive coating layer is formed in an uneven shape. 70. The conductive ball according to any one of claims 63 to 66 and 69, wherein an inner peripheral surface of the conductive coating layer is formed in an uneven shape. 71. The conductive ball according to any one of claims 1 to 63 to 66 and 69, wherein the outer peripheral surface of the core is formed in an uneven shape. 72. The conductive coating layer has an electric resistivity of 1.6.
67. The conductive ball according to claim 63, wherein the conductive ball is made of a material having a thickness of E-8 to 10E-8 [Omega] m. 73. The conductive coating layer has a thickness of 1 to 5
The conductive ball according to claim 72, wherein the conductive ball is set to 0 μm. 74. The conductive coating layer has a thickness of 3 to 2
The conductive ball according to claim 73, wherein the conductive ball is set to 0 μm. 75. The core has a diameter of 3 to 500 μm.
63. The method according to claim 63, wherein m is set to m.
6. The conductive ball according to any one of 6 above. 76. The core has a diameter of 10 to 200.
76. The conductive ball according to claim 75, wherein the conductive ball is set to μm. 77. The core has a rigidity such that a displacement amount of a diameter thereof is 5% or less when a load required for connection between both electrodes is applied. Claim 6
The conductive ball according to any one of 3 to 66. 78. The core has a rigidity such that a displacement amount of a diameter thereof is 1% or less when a load required for connection between both electrodes is applied. Claim 7
7. The conductive ball according to 7. 79. The size of the unevenness of the conductive coating layer is Rm.
72. The conductive ball according to claim 69, wherein the conductive ball has a thickness of 10% or more of an electrode connected by ax and a thickness of 2 times or less of a thickness of the conductive coating layer. 80. A conductive connecting member used for connecting electrode parts of an electric circuit element having an electrode part and an electric circuit board having an electrode part to each other, wherein the core has a substantially ball-shaped rigidity. At least one conductive ball having a conductive coating layer formed thereon, and a holding sheet for embedding and holding the conductive ball, the holding sheet being formed of a material having an electrical insulation property. And a holding sheet for holding the conductive balls so that a part of the conductive balls projects and is exposed from the other surface of the conductive ball. 81. The conductive ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board,
Between the electrode portion of the electric circuit element and the portion of the coating layer of the conductive ball protruding from one surface of the holding sheet, and
81. The electrical and mechanical connection between the electrode portion of the electric circuit board and the portion of the coating layer of the conductive ball protruding from the other surface of the holding sheet. Conductive connection member. 82. In a conductive connecting member used for connecting the electrode parts of an electric circuit element having an electrode part and an electric circuit board having an electrode part to each other, at least a metallic material and an inorganic material having high rigidity are used. A conductive ball having one substantially spherical core and a conductive coating layer formed of a conductive material and coated around the core, and at least one conductive ball is embedded and retained. A holding sheet, which is formed of a material having an electrical insulation property, such that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. And a holding sheet for holding the conductive balls, the conductive connecting member. 83. The conductive ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board,
Between the electrode portion of the electric circuit element and the portion of the coating layer of the conductive ball protruding from one surface of the holding sheet, and
The electrode part of the electric circuit board and the part of the coating layer of the conductive ball protruding from the other surface of the holding sheet are electrically and mechanically connected to each other. Conductive connection member. 84. The conductive coating layer of the conductive ball includes an electrode portion of the electric circuit element and an electrode portion of the electric circuit board,
The conductive connecting member according to claim 81 or 83, characterized in that the respective constituent materials are metalized and / or alloyed for connection. 85. The conductive connecting member according to claim 80, wherein the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface. 86. The conductive connecting member according to claim 80, wherein the outer peripheral surface of the core is formed into a smooth curved surface. 87. The conductive connecting member according to claim 80, wherein an outer peripheral surface of the conductive coating layer is formed in an uneven shape. 88. The conductive connecting member according to any one of claims 80 to 84 and 87, wherein an inner peripheral surface of the conductive coating layer is formed in an uneven shape. 89. The conductive connecting member according to any one of claims 80 to 84 and 87, wherein the outer peripheral surface of the core is formed in an uneven shape. 90. The conductive coating layer has an electric resistivity of 1.6.
85. The electrically conductive connecting member according to claim 80, wherein the electrically conductive connecting member is formed of a substance of E-8 to 10E-8 [Omega] m. 91. The conductive coating layer has a thickness of 1 to 5
The conductive connecting member according to claim 90, wherein the conductive connecting member is set to 0 μm. 92. The conductive coating layer has a thickness of 3 to 2
The conductive connecting member according to claim 91, wherein the conductive connecting member is set to 0 μm. 93. The core has a diameter of 3 to 500 μm.
80 is set to m.
4. The conductive connecting member according to any one of 4 above. 94. The core has a diameter of 10 to 200.
94. The conductive connecting member according to claim 93, wherein the conductive connecting member has a thickness of [mu] m. 95. The core has a rigidity such that a displacement amount of a diameter thereof is 5% or less when a load required for connection between both electrodes is applied. Claim 8
The conductive connecting member according to any one of 0 to 84. 96. The core has a rigidity such that a displacement amount of a diameter thereof is 1% or less when a load required for connection between both electrodes is applied. Claim 9
5. The conductive connecting member according to item 5. 97. The size of the unevenness of the conductive coating layer is Rm.
89. The conductive connecting member according to claim 87, which is 10% or more of a film thickness of an electrode connected by ax and is 2 times or less of a film thickness of a conductive coating layer. 98. A method for manufacturing a conductive connecting member used for connecting an electric circuit element having an electrode portion and an electric circuit board having an electrode portion to each other, wherein the electric connecting element has substantially ball-shaped rigidity. A first step of sandwiching at least one conductive ball having a conductive coating layer around the core with the lower mold and the upper mold separated from each other by a predetermined distance; In the meantime, a second step of filling the synthetic resin, a third step of releasing the molding material from the lower mold and the upper mold, and etching the upper and lower surfaces of the released molding material, And a fourth step of exposing the upper and lower parts of the conductive ball from both upper and lower surfaces of the holding sheet so that the conductive ball is exposed. 99. A method of manufacturing a conductive connecting member used for connecting an electrode of an electric circuit element having an electrode portion and an electric circuit board having an electrode portion to each other, wherein the conductive connecting member has substantially ball-shaped rigidity. Corresponding to the first step of placing the lower part of at least one conductive ball having a conductive coating layer around the core in the first recess of the lower mold, and the first recess of the lower mold. And a second step of covering the upper mold having the second recess formed therein so that the upper part of the conductive ball is housed in the second recess, and combining the lower mold and the upper mold with each other. The third step of filling the resin, the fourth step of releasing the molding material from the lower mold and the upper mold, and etching the upper and lower surfaces of the molded material released from the mold, the upper and lower sides of the synthetic resin holding sheet. The upper and lower parts of the conductive ball are projected and exposed from both surfaces. Method for producing a conductive connection member, characterized by comprising a fifth step. 100. The method of manufacturing a conductive connecting member according to claim 99, wherein the first and second recesses are formed to have a depth smaller than a radius of the conductive ball. . 101. The method of manufacturing a conductive connecting member according to claim 98, wherein an outer peripheral surface of the conductive coating layer is formed into a smooth curved surface. 102. The outer peripheral surface of the core is formed in a smooth curved surface shape.
1. The method for manufacturing a conductive connecting member according to any one of 1. 103. The method of manufacturing a conductive connecting member according to claim 98, wherein the outer peripheral surface of the conductive coating layer is formed in a concave-convex shape. 104. The inner peripheral surface of the conductive coating layer is formed in an uneven shape.
103. The method for manufacturing a conductive connecting member according to any one of items 103 and 103. 105. The outer peripheral surface of the core is formed in an uneven shape.
0. A method for manufacturing a conductive connecting member according to any one of 0 and 103. 106. The conductive coating layer has an electrical resistivity of 1.
The method for manufacturing a conductive connecting member according to claim 98, wherein the conductive connecting member is formed of a material having a density of 6E-8 to 10E-8Ω · m. 107. The conductive coating layer has a thickness set to 1 to 50 μm.
7. The method for manufacturing the conductive connecting member according to 6. 108. The conductive coating layer has a thickness set to 3 to 20 μm.
7. The method for manufacturing the conductive connecting member according to 7. 109. The core has a diameter of 3 to 500.
The method for manufacturing a conductive connecting member according to claim 98, wherein the conductive connecting member is set to μm. 110. The core has a diameter of 10 to 20.
109. The thickness is set to 0 μm.
A method for manufacturing the conductive connecting member according to. 111. The core has rigidity such that a displacement amount of a diameter thereof is 5% or less when a load required for connection between both electrodes is applied. A method for manufacturing a conductive connecting member according to any one of claims 98 to 100. 112. The core has a rigidity such that a displacement amount of a diameter thereof is 1% or less when a load required for connection between both electrodes is applied. A method for manufacturing a conductive connecting member according to claim 111. 113. The size of the unevenness of the conductive coating layer is R
106. The conductive connecting member according to any one of claims 103 to 105, wherein the film thickness is 10% or more of a film thickness of an electrode connected at max and is twice or less the film thickness of a conductive coating layer. Production method.