JPH09293754A - Electric circuit part, manufacture thereof, conductive ball, conductive connection member, and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an electric circuit part to be lessened in size, thickness, and manufacturing cost and enhanced in reliability by a method wherein an electric circuit element and an electric circuit board are connected together high in density, high in bonding properties, and low in connection resistance without additionally processing their electrodes. SOLUTION: An electric circuit part is equipped with an electric circuit element 1 with electrodes 2 and an electric circuit board 7 with electrodes 8 connected to the electric circuit element 1, wherein a conductive ball 6 composed of a nearly ball- shaped and rigid core 4 and a conductive coating layer 5 deposited around the surface of the core 4 is interposed between the electrodes 2 and 8. Fine and hard particles 32 are dispersed in the conductive coating layer 5 of the conductive ball 6 so as to show up partially on the surface of the coating layer 5. The conductive ball 6 is pressed against the electrodes 2 and 8, the electrode 2 of the electric circuit element 1 and the coating layer 5 of the conductive ball 6 are electrically and mechanically connected together, and furthermore the electrode 8 of the electric circuit board 7 and the coating layer 5 of the conductive ball 6 are also electrically and mechanically connected together.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric circuit component having an electric circuit element having an electrode portion and an electric circuit board having an electrode portion for connecting the electric circuit element, and an electric circuit component of the electric circuit component. The present invention relates to a manufacturing method, a conductive ball and a conductive connecting member used for connecting both electrode parts of the electric circuit component, and a manufacturing method of the conductive connecting member.

[0002]

2. Description of the Related Art Heretofore, various methods described below have been known as a manufacturing technique for an electric circuit component constituted by electrically connecting an electric circuit element to an electric circuit board. First, these manufacturing techniques will be divided.

(1) Wire Bonding Method FIG. 29 (a) schematically shows an electric circuit component including an IC 101, which is an electric circuit element, and a printed circuit board 102, which is an electric circuit board, connected by the wire bonding method. FIG. In this wire bonding method, first, the Ag paste 10 is formed on the printed circuit board 102.
4, the IC 101 is fixedly held on the printed circuit board 102, and then the electrode portion existing on the surface of the IC 101 and the wiring pattern 105 provided on the printed circuit board 102 are connected with gold or a wire having a diameter of 20 to 100 μm. It is configured to be electrically connected by using an ultrafine metal wire 103 made of aluminum.

After the connection, the resin 106 is dropped on the IC 101 by a potting method or the like to seal the IC 101 and the ultrafine metal wire 103 from the outside. In this way, the electric circuit components are finally set.

Further, this method uses a lead frame 107 as an electric circuit board as shown in FIG.
An IC 101 is formed on each lead frame 107 with an ultrafine metal wire 1
It is also used in the case of connecting via the H.O.P.O.3 and sealing with the resin 106 by the transfer molding method, and in the case of using the ceramic package as the electric circuit board.

(2) CCB (Controlled Collapse Bond)
ing) method FIGS. 30 (a) and 30 (b) and FIGS. 31 (a) and 3
1 (b) and US Pat. No. 3,292,24, respectively.
The electrical connection method of the electric circuit element and the electric circuit board described in No. 0 and 3,303,393 is shown.

First, the electrical connection method shown in FIGS. 30 (a) and 30 (b) will be described. In this method, as shown in FIG. 30A, an electrode 108 is provided on the electrode portion provided on the surface of the electric circuit element 101, and then the surface of the electric circuit element is entirely covered with glass except for the electrode 108. A metal film 110, which is covered with the protective film 109 and has good adhesion with the (wiring) material of the electrode 108 and the glass protective film 109, is provided in the electrode portion. Here, the electrode 108 is exposed at the bottom of the opening provided in the glass protective film 109. As a result, the metal film 110 becomes the electrode 10 of the electrode portion.
8 and the glass protective film 109 around it.

Next, a first alloy ball (for example, Au 75 wt% Sb 25 wt%: melting point 360 ° C.) is formed on this electrode portion.
Is placed, and the electrode portion is heated until the melting point of the first alloy ball is exceeded to melt the first alloy ball, and the metal film 110 provided on the electrode portion is connected to the first alloy ball. . Then, the electrode portion is cooled to solidify the first alloy balls. As a result, the first alloy 111 is formed on the electrode 108.
To obtain an electric circuit element having a protrusion.

On the other hand, as shown in FIG. 30B, the first alloy 111 is formed on the wiring pattern 105 of the circuit board 113.
The second alloy 112 having a melting point lower than the melting point of (eg, Pb 90 wt% Sn 10 wt%: melting point 258 ° C.
(Solid) to 301 ° C. (liquid) is provided, and the first alloy 111 corresponds in a state in which the electric circuit element 101 having the first alloy 111 protruding in the electrode portion is turned upside down in FIG. The wiring pattern 105 is arranged in contact with the wiring pattern 105. After that, the electrode portion is formed at a temperature equal to or lower than the melting point of the first alloy 111, and
By heating to above the melting point of the second alloy 112,
The second alloy 112 without melting of the first alloy 111
Only the first alloy melts and the second alloy 112 and the first alloy 111 are connected.

Here, the electric circuit element 101 has an electric circuit board 113 corresponding to the protruding height of the first alloy 111.
Connected and fixedly arranged in a state of being lifted above. Therefore, the electric circuit element 101 and the electric circuit board 1
It is possible to surely prevent an electrical short circuit with 13, and since the cleaning liquid can easily enter the connection portion when removing the flux after melting, flux cleaning was performed to reliably remove contaminants. Electric circuit parts can be obtained.

As an application of this method, the second alloy 112
A dam (not shown) that prevents the first alloy 111 from flowing out on the electric circuit board 113 without melting.
And a metal film (BLM (Ball Limited M) that limits the size of the first alloy 111 by surface tension when the first alloy 111 is first melted on the electrode 108 of the electric circuit element 101.
etal) layers, for example Ti / Cu / Ni, Cr / Cu /
Au) is provided, and the first alloy 111 provided thereon
(For example, Pb 95 wt% SN 5 wt%) is melt-bonded to form solder bumps (height 100 to 200 μm), and then the solder bumps are melted again at the time of connection with the circuit board, and are laterally moved by the dam of the board 113. The CCB method is a method in which the electric circuit element is lifted by the surface tension of the solder whose spread is limited when the solder is melted and connected to the electrode portion of the substrate.

Further, this CCB method has been recently used in BGA.
(Ball Grid Array) method,
As a method of connecting the electrode portion of the semiconductor element package and the electrode portion of the printed circuit board, for example, Pb 40% Sn 60%,
Pb36% Sn62% Ag2%, Pb81% In19
%, Pb 90% Sn 10% solder bumps are formed on the electrodes of the package and are applied to the connection with the electrodes of the substrate.

Next, the connection method shown in FIGS. 31A and 31B will be described. In this method, FIG.
As shown in (a), the electrode 10 of the electrode portion of the electric circuit element
8 to the alloy layer 115 (for example, Pb 95 wt% Sn5 wt
%, Melting point 300 ° C. (solid) to 314 ° C. (liquid), and a ball 114 (for example, oxygen-free copper, diameter 127 to 1) made of a conductive material that does not deform at the melting temperature of the alloy layer 115 thereon.
52.4 μm) is placed and heated to the melting point of the alloy layer 115 to connect to the balls 114.

Thereafter, as shown in FIG. 31B, the second alloy layer 11 having a lower melting point than the alloy layer 115 provided on the electric circuit element 101 is provided on the wiring portion 105 on the circuit board 113.
6 (eg, Pb 90% Sn 10%, melting point 268 ° C.
(Solid) to 301 ° C. (liquid) is provided. And ball 1
The electric circuit element 101 to which 14 is connected is shown in FIG.
It is arranged on the circuit board 113 in an upside-down state from the state shown in (1) so that the balls 114 contact the corresponding second alloy layer 116. Then, the electrode portion is provided with the second alloy layer 1
The second alloy layer 116 is melted by heating to the melting point of 16, and the balls 114 and the second alloy layer 116 are connected to obtain an electric circuit component.

In this method, the melting point (C
u: 1083 ° C.) is the first and second alloy layers 115, 11
Since the melting point of the second alloy layer 116 is significantly higher than the melting point of No. 6 and there is no possibility of melting at the time of heating for melting the second alloy layer 116, the heating temperature control range at the time of connection with the respective alloy layers 115 and 116 can be widened There is an advantage that connection is easy.

(3) For example, JP-A-59-13963
TAB (Tape Automated Bondin) disclosed in Japanese Patent No. 6
g) Method FIGS. 32 (b) and 32 (c) are cross-sectional views schematically showing electric circuit components connected by the TAB method.

This TAB method is an automatic bonding method using a tape carrier method. Below, this TAB
A typical example of the method will be described step by step.

First, as shown in FIG. 32 (a), IC1
No. 01 is formed on the entire surface of the semiconductor wafer. A multilayer barrier metal layer 118 (for example, Ti / W, Ti / Pt, C
(r / Cu, Cr / Ni, etc.) is formed by vapor deposition, a resist is applied thereon, and the resist is exposed and developed so as to have an opening on the electrode portion 108. Next, the barrier metal layer 11
Au bumps 119 are formed in the resist openings by electroplating using 8 as electrodes to a height of about 15 to 30 μm, and then the resist is peeled off. Further, the exposed barrier metal layer 118 is etched to form the electrode portion 108.
An Au bump 119 is formed on the top. Then, the semiconductor wafer is cut to obtain semiconductor chips with bumps.

Here, the carrier tape is shown in FIG.
As shown in FIG. 5, a lead pattern (thickness 18 to 35 μm) made of copper is formed on the insulating film 121 (for example, a polyimide film thickness 75 to 125 μm), and an opening is provided in the film at a portion connected to the semiconductor chip 101. The lead is exposed, and the surface has a thickness of 0.3 to 0.
It is formed to have an Sn-plated inner lead 120 of 5 μm.

Inner leads 12 of this carrier tape
0 and the gold bump 119 of the semiconductor chip 101 are aligned, and then the inner lead 120 and Au are thermocompression bonded by a temperature of about 500 ° C. and a pressure of 30 to 40 g / lead.
Au-Sn eutectic bonding is performed on the bumps 119 for connection. After the connection, the resin is dropped and cured to seal the semiconductor chip.

Next, as shown in FIG. 32C, the outer lead 122 is cut from the carrier tape to which the semiconductor chip 101 is connected, and the outer lead 122 and the land of the substrate are soldered 123 and anisotropically conductive. An electric circuit component is obtained by connecting with a film or the like.

Although different from the TAB method, as shown in FIG. 33, by using the Au bumps 119 used in the TAB method, the Au bumps 119 of the semiconductor chip 101 are directly connected to the electrode portions 105 of the circuit board 113 by heat. Connect by crimping,
There is also a method of obtaining electric circuit components.

(4) Resin ball method (HYBRIDS,
Vol. 8, No. 6, pp. 3-25, 1992) FIGS. 34 (a) and 34 (b) show a connection method using a conductive resin ball having a conductive coating on the surface of the resin ball. The connection method will be described below.

As shown in FIG. 34B, the conductive resin balls 124 are resin balls 126 having a diameter of 5 to 10 μm.
The surface is coated with Au to a thickness of 500 to several thousand angstroms by plating to form a conductive layer 127.
As shown in FIG. 34 (a), the conductive balls 124 are
The semiconductor chip 101 is placed on the electrode 105 of the substrate 113, and the uncured epoxy adhesive 125 is interposed on the substrate 113.
The adhesive is cured and the semiconductor chip 101 is fixed to the substrate 113 while being pressed so as to be deformed by about 20%. At this time, for electrical connection, the semiconductor chip 101 and the substrate 113 are fixed to each other at an interval after the conductive resin balls 124 are deformed, so that the elastic repulsion force due to the deformation of the resin balls 126 causes the conductive resin balls 124. By acting on the respective electrode portions 108 and 105 connected to each other, the Au layer 127 on the surface of the conductive resin ball 124 and each electrode 10
8 and 105 are obtained only by mechanical contact.

(5) Method of Connecting Anisotropic Conductive Sheets The method shown in FIGS. 35 (a), 35 (b) and 36 is the same as that of US Pat. Nos. 3,320,658 and 3,320,658, respectively.
The connection method shown in No. 541 and 222 is shown. The respective connection methods will be described below.

In each of these methods, an anisotropic conductive sheet in which a conductive material is held on a sheet made of an insulating material so that the conductive material is exposed on both sides of the sheet is arranged between the electrodes facing each other, and the electrodes are separated from each other. To connect.

In the method shown in FIGS. 35 (a) and 35 (b), a conductive material 1 is applied to a sheet 129 made of a thermoplastic insulating material (eg, polyethylene terephthalate).
By embedding 28 (for example, Cu 80% Ag 15% P 5%), it is possible to hold a plurality of conductive materials 128 on one sheet instead of disposing one conductive material on each electrode 108 (for example, Cu). , Conductive material for connection 1
It is intended to improve the handling of 28. The sheet 129 is arranged so that the conductive material 128 is sandwiched between the electrodes 108 and heated, so that the conductive material 128 is melted and connected to the electrodes 108.

The conductive material 108 may be connected by any of welding, brazing (melting temperature of 450 ° C. or higher), and soldering (melting temperature of 450 ° C. or lower). In this method, the material 128 is connected to the electrode 108 in a liquid phase. In addition, the sheet 129 holding the conductive material 128 is thermoplastic due to the heat at this time so that it is softened and covers the periphery where the conductive material 128 and the electrode 108 are connected without a gap, and is cured in that state after heating connection. And insulate between the electrodes.

As shown in FIG. 35A, this anisotropic conductive sheet is a sheet 129 made of a thermoplastic insulating material.
A ball 128 made of a conductive material (diameter 25.4 μm
˜127 μm) is heated to a temperature at which the thermoplastic resin sheet 129 does not soften and the conductive material balls 128 do not soften, and is placed at a predetermined location (for example, an opening is provided). Then, the seat 129 softens and the balls 128 can be arranged so as to project from both sides of the seat 129. When the heating is stopped, the seat 129 softens again, and the balls 128 are held as shown in FIG. 35 (b). To do. By repeating this process, one sheet 1
A ball 128 made of a plurality of conductive materials is attached to the seat 29.
29, anisotropic conductive sheets protruding from both sides are obtained.

In the method shown in FIG. 36, the sheet 1 of insulating material is used.
The conductive material 130 arranged in 31 is so small that a plurality of conductive materials 130 are arranged in one electrode portion 108, and has a size and arrangement that does not short circuit between adjacent electrodes, so The purpose is to eliminate positioning with the anisotropic conductive sheet. In addition, the conductive material 1
Since the conductive material 130 is crushed by the pressure applied during connection and electrically connected by ensuring the contact area with the electrode, the conductive material 130 is made of lead or gold alloy, which is easily changed by pressure. Furthermore, by connecting by pressurization, it is possible to attach and detach the electric circuit parts at the time of maintenance or design change.

In this anisotropic conductive sheet, the ridges of the grid are formed of an insulating material on the base sheet of the insulating material, and the metal of the conductive material is cast by using the ridges of the grid as a mold. Then, the base sheet and the ridges of the lattice are removed by etching or the like to obtain an anisotropic conductive sheet in which the conductive material is projected.

[0032]

However, the above-mentioned various conventional examples have the following problems as a technique relating to an electric circuit component constituted by electrically connecting an electric circuit element to an electric circuit board. is there.

(1) Wire Bonding Method When the connection portion of the IC 101 is designed to reach the inside of the IC 101, an extra fine metal connecting the connection portion to the wiring pattern 105 on the surface of the printed circuit board 102 holding the IC 101. The line 103 easily contacts the outer peripheral edge portion of the IC 101. When they come into contact with each other, not only the electrical characteristics are not satisfied due to electrical short circuit, but also the IC is destroyed. Therefore, if the length of the ultrafine metal wire 103 is increased and the rising height (h) from the connection portion is increased, the diameter of the ultrafine metal wire 103 is very thin and soft, and vibration or vibration during the manufacturing process may occur. There is a risk of deformation due to the resin pressure at the time of injecting the sealing resin, and the ultrafine metal wires 103 contacting or breaking.

Therefore, the connecting portion of the IC 101 is the IC 10
However, there is a problem in that it is necessary to place them around 1 and there is no choice but to be restricted by circuit design.

Al, which is usually used as an electrode film of the IC 101, is exposed to the atmosphere and therefore forms an insulating oxide film on its surface. Further, with the electrode portion exposed, various processes such as wafer back surface polishing, cutting into chips, and fixing and placement on the substrate are performed, so the exposed surface is contaminated, forming a contaminated layer. . Normally, by applying pressure and ultrasonic vibration at the time of connection, the oxide film and the contamination layer that hinder this connection are destroyed and removed, the intrinsic surface of the electrode is exposed, and this and the metal of the ultrafine metal wire 103 are diffused. By doing so, they are connected metallically. Therefore, the ultrafine metal wire 103 having a strength to which pressure and ultrasonic vibration are applied at the time of connection.
A tool (capillary) larger than the diameter of is required.
When the tool comes into contact with the adjacent ultrafine metal wire 103, the adjacent ultrafine metal wire 103 may be deformed or broken. Therefore, the ultrafine metal wire 1 adjacent to the tool
There is a constraint that the pitch dimension of the connecting portion (distance between the centers of the adjacent connecting portions) must have a certain distance so as not to contact 03.

Therefore, if the size of the IC is determined, the maximum number of connection parts is inevitably determined. In the wire bonding method, since the pitch dimension is as large as about 0.2 mm, there is a problem that the number of connecting portions must be reduced accordingly.

The height h of the ultrafine metal wire 103 measured from the connection portion on the IC 101 is usually 0.2 to 0.4 mm, but it is necessary to reduce this height to 0.2 mm or less. There is a problem that the ultrafine metal wire 103 in the vicinity of the Au ball is recrystallized due to the melting temperature at the time of forming the Au ball for connection and the height becomes high, and it is relatively difficult from the point of short-circuiting with the IC 101 described above. is there. Therefore, IC1
It is difficult to thin the mounting thickness H of 01.

In the wire bonding method, the strength of the ultrafine metal wire 103 is low and the IC 10 is formed only by the ultrafine metal wire 103.
1 cannot be held, so the ultrafine metal wire 103 is
The IC 101 must be fixedly held on the substrate 102 before being connected to. Therefore, the back surface of the IC 101 and the substrate 102 are adhered by Ag paste having a thickness of about 10 to 30 μm. The Ag paste is usually applied on the substrate 102 by a dispenser or the like, but the viscosity of the Ag paste, the protrusion pressure, the shape of the dispenser nozzle, the IC 10
1 variation in mounting pressure, and Ag during curing
The adhesive layer is not uniform due to various factors such as irregular bubble escape directions generated when the solvent in the paste volatilizes. The IC 101 has a maximum θ (=
sin-1 (a / L), diagonal length of IC101: L, paste thickness: a) Tilt and fixed.

When the IC 101 is a light receiving element, this inclination causes a deviation in the optical path length incident on the light receiving surface, and in particular, an area type CCD whose IC size has recently been reduced from about 10 mm square to about 5 mm square. In a light-receiving element having a small IC size and a large number of light-receiving parts, such as
The inclination angle becomes large and the light receiving characteristic is deteriorated.

Therefore, in the case where the IC 101 is a light receiving element, it is necessary to provide a region for mounting a component for position correction in the electric circuit component obtained by connecting, and even if the IC size is reduced, the electric circuit component is downsized. There is a problem that becomes difficult.

In the wire bonding method, the ultrafine metal wire 103 is present on the IC 101 up to a height of about 0.2 to 0.4 mm as described in the above. When the IC 101 is a light receiving element, the light incident on the light receiving portion of the light receiving element and the surface of other elements is reflected by those surfaces and is incident on the light receiving portion reflected again by the ultrafine metal wire 103, and a ghost is generated in the light receiving signal. . Therefore, in order to prevent generation of a ghost signal, it is necessary to separate the connecting portion from the light receiving portion or to reduce the height of the ultrafine metal wire 103. However, it is relatively difficult to reduce the height of the ultrafine metal wire 103, as described above.

Therefore, when the IC 101 is a light receiving element, the connecting portion must be separated from the light receiving portion, which makes it difficult to reduce the size of the light receiving element. In the wire bonding, since the connection is made for each connecting portion, the working time of the wire bonding increases as the number of connecting portions increases, and the production efficiency deteriorates.

(2) CCB Method Normally, with Al which is an electrode material of IC which is an electric circuit element, the solder is not wet by the oxide film. Therefore, a metal film having good solder wettability must be formed on the electrode. In addition, in order to have a function such as adhesion to the electrode film and prevention of solder diffusion, usually a multilayer film of 2 to 3 layers is deposited, photolithography,
It is necessary to form it by etching and to form a solder bump on it.

Therefore, there is a problem that the number of steps is large and the cost is high.

The formation of solder bumps uses the surface tension at the time of melting, so the amount of solder, the melting atmosphere, the flux, the B
LM size, BLM surface condition, heating temperature and its distribution,
Further, the shape, especially the height, is likely to be non-uniform due to variations in the melting point due to variations in the alloy ratio of the solder (± 10 wt%), and normally approximately ± 10 μm to 20 μm vary. Furthermore, if the solder bumps are made smaller, these effects are more likely to appear, and large solder bumps or small bumps can be created locally, causing a short circuit between solder bumps when connecting to the circuit board, or a connection part that cannot be connected. In extreme cases, the IC rises due to uneven surface tension of the solder, such as the Manhattan phenomenon of chip parts.

Therefore, it is not possible to connect the connection portion, which cannot be connected due to the variation of the solder bump, by applying a load because the IC is supported on the substrate by the surface tension of the solder.

Therefore, since it is difficult to control the solder bumps,
There is a problem that it is difficult to reduce the size of the connection portion.

A flux is used to improve wettability when the solder is melted at the time of forming the solder bumps and at the time of connection. Therefore, in order to secure the reliability of the IC, the flux used after connection must be removed, and cleaning and drying steps are required. Further, when the connecting portion is provided inside the IC, flux or cleaning liquid is likely to remain inside, which lowers reliability, and therefore careful cleaning is required.

Therefore, there is a problem that the number of steps is large and the cost is high.

Since the IC 101 is supported only by the surface tension when the solder bumps are melted when connecting to the substrate, there is a limit between the size and number of the solder bumps and the weight of the IC 101 to be supported. (T. Kamei and MN
akayama, "Hybrid IC Struct"
ures Using Solder ReflowT
technology ", 28th Electrici
c Comp. Conf. Proc. , Pp172-1
82, 1978). Therefore, there is a problem that the number of connections (the number of solder bumps), the size of the solder bumps, and the size (weight) of the IC are limited.

In the method shown in FIG. 31, the connection is made by using a ball that does not deform at the solder melting temperature. However, after this ball is melted and connected to the solder previously provided on the electrode on the semiconductor element, the ball is fixed. It is difficult to hold the ball between the connecting portions unless the solder and the solder (melting point lower than that of the solder on the semiconductor element) provided on the electrodes on the substrate are melted again. Further, as the number of electrodes to be connected increases, the ball placement time becomes longer, and the placed balls must be placed at a low speed so that the placed balls do not shift due to vibration or the like during placement. Therefore, the production efficiency is reduced.

Furthermore, cleaning of the flux is also required for each connection. Therefore, the number of steps is large and the production efficiency is low, resulting in high cost.

In the method shown in FIG. 31, the ball weight is very light (9.57 μm for a copper ball with d = 5 μm).
Since the solder is fused and fixed to the solder on the electrode 108 only by g), the height of the ball after the melting depends on the amount of solder and the alloy ratio on the electrode 108, the ball surface state, the ball size (weight),
Non-uniformity tends to occur due to variations in the surface tension of the solder during melting due to flux, melting atmosphere, melting temperature, distribution, and the like. This unevenness in height becomes more remarkable as the size of the ball becomes smaller.

On the other hand, the connection with the electrode 108 on the substrate is made by IC
Side heating temperature and heating time (320 ° C)
This is done by melting the solder on the electrode 108 of the substrate for -5 min). Therefore, the solder on the electrode 108 of the substrate needs to be formed thick (a large amount) so as to be in contact with the ball for connection even if the height variation exists.

Therefore, when the ball is made smaller, the weight of the ball becomes smaller, and the surface tension of the solder at the time of melting becomes relatively larger than its own weight, and the height variation becomes larger.
Therefore, thicker solder must be provided on the electrode 108 of the substrate, but it is usually difficult to form a thick film having an aspect ratio of more than 1, and it is difficult to reduce the size.

Oxygen-free copper as a ball material has a melting point of 1083 ° C. but a softening point of 190 ° C. Even if the ball is not melted and deformed only at the solder melting temperature, the weight is applied to the weight. On the other hand, it easily deforms. Therefore, to eliminate the height variation by applying pressure during fusion connection, the semiconductor element and the substrate may come into contact with each other to cause a short circuit between the semiconductor element side end portion and the substrate wiring, or a gap between the semiconductor element and the substrate. Becomes smaller and the flux remains in the meantime.

Therefore, it is difficult to reduce the size of the connecting portion only by reducing the size of the ball.

Further, in the method shown in FIG. 31, since sufficient solder to connect the balls must be supplied from each electrode, the size of the electrode on which the solder is placed is not less than the ball diameter. Will be needed. For example, if the ball diameter is 12
The land width of the substrate is 25 with respect to 7 to 152.7 μm.
4-381 μm is also required.

(3) TAB method If the connection portion of the semiconductor chip 101 is designed to be inside the semiconductor chip 101, the length of the inner lead portion becomes long and the exposed inner lead is easily deformed. Therefore, it becomes difficult to arrange all the inner leads on the Au bumps of each electrode of the semiconductor chip. Further, since the inner lead becomes long, the inner lead hangs down due to its own weight and comes into contact with the surface of the semiconductor chip other than the connection portion or the end portion on the semiconductor chip side.

Therefore, in order to prevent the length of the inner lead portion from becoming unnecessarily long, it is necessary to bring the electrodes of the semiconductor chip to the peripheral portion of the semiconductor chip, which causes a limitation in circuit design. There is.

Also in the TAB method, the connection pitch dimension is about 0.08 to 0.15 mm due to factors such as etching accuracy and strength of the inner leads and inner lead displacement due to thermal expansion of the carrier tape due to heating during connection. . Therefore, similarly to the problem of the wire bonding method, the number of electrodes that can be connected is limited depending on the size of the semiconductor chip.

A multilayer barrier metal layer and Au bumps are formed on the electrodes of the semiconductor chip by vapor deposition, photolithography, plating,
It is formed by a plurality of steps such as etching. Furthermore,
Since the Au bumps are formed in the state of the semiconductor wafer, the Au bumps are also formed on the semiconductor chip having the defective characteristic.

Therefore, since the number of steps is large and Au bumps are formed on unnecessary portions, there is a problem of high cost.

When forming Au bumps on a semiconductor chip by electrolytic plating, a barrier metal layer is used as a common electrode layer for plating. However, since the thickness thereof is as thin as several μm, the sheet resistance value is large and the semiconductor wafer In recent years, the size has increased from 6 inches to 8 inches, which causes a large potential difference between the central portion and the peripheral portion, which is one of the factors that cause variations in the growth size of Au bumps. Therefore, Au bumps on a 6-inch semiconductor wafer usually have a variation in height of about ± 5 to 10 μm, and the variation width increases as the size of the semiconductor wafer increases.

Therefore, if the barrier metal layer is made thicker, there is a problem that the under-etching under the Au bump due to the etching after plating increases, and the Al electrode of the semiconductor chip is etched during the etching.

Due to such height variations, only the high Au bumps come into contact with the inner leads and are pressed by the pressing jig (collet) at the beginning of connection. Therefore, a large weight is applied to the high-height bump, which causes a crack in the semiconductor chip, or is too crushed to short-circuit with an adjacent bump. Further, in the case of a bump having a lower height, the pressure is insufficient and the bump cannot be connected to cause an open defect.

Therefore, the size of the semiconductor wafer will be increased in the future, and the height variation of the Au bumps will be large, so that there is a problem that connection failure is likely to occur.

Further, as shown in FIG. 33, when the Au bumps are directly connected to the substrate, such Au-bump height variations cause the semiconductor chip to collet even if the pressure collet and the substrate are parallel to each other. Since it is inclined with respect to, the weight distribution becomes non-uniform, and cracks may occur in the semiconductor chip or short-circuit between adjacent bumps in the high load region. Further, in the low weight region, there is a problem that the connection becomes insufficient and an open defect occurs. These problems are exacerbated when the pressure collet is not parallel.

(4) Resin Ball Method In this method, connection is obtained by the elastic repulsion of the resin balls 124. Therefore, a change in the distance between the semiconductor chip 101 and the substrate 113 results in a change in contact pressure and a change in contact resistance value. Since the adhesive (resin) maintains this space, the coefficient of thermal expansion is larger than that of the semiconductor chip 101 or the substrate 113, which is mainly an inorganic material, and the size of the whole changes in a similar manner due to temperature change. Rather, this distance changes greatly with respect to the semiconductor chip 101 and the substrate 113.

Therefore, there is an instability in which the contact resistance fluctuates with respect to temperature changes. Further, in the case where an epoxy resin is used as the adhesive, the Tg point is 100 to tens of degrees Celsius, so that the adhesive softens especially in a high temperature environment, so that the contact portion opens and the contact resistance sharply increases. There is a point.

The thickness of the conductive layer is very thin so that the conductive layer 127 on the surface follows the deformation of the resin balls 124. Therefore, the cross-sectional area of the conductive path is very small. For example, the resin ball 124 has a diameter of 7.5 μm, Au
Ball with a thickness of 0.05 μm is deformed by 15% and height is 6.4
When the conductive path of one conductive resin ball 124 connected with 6 μm and a width of 8.74 μm is calculated approximately as a cylinder of the above size, it becomes 114 mΩ. for that reason,
If the value of the current that can be applied increases, the conductive resin ball 12
Not only does 4 heat up and soften the adhesive around it,
The softening of the resin balls 124 also lowers the contact pressure, making it impossible to electrically connect the conductive layer 127 to the electrodes.

Therefore, if the thickness of the conductive layer 127 is increased and the resistance value is reduced, the plastic deformation of the metal of the conductive layer 127 increases, which hinders the elastic repulsive force of the resin ball 124 and lowers the contact pressure. It is difficult to increase the thickness of the conductive layer 127 because it causes defects.

Therefore, the value of the energizing current for connection is limited. Therefore, there is a problem that the connectable electric circuit elements such as a liquid crystal driver IC that normally supplies almost no current are limited.

Further, when the energizing current is increased, a large number of conductive resin balls 124 are arranged in the connection and they are connected in parallel, so that there is a problem that the electrode portion cannot be downsized.

(5) Anisotropic Conductive Sheet Method In the method shown in FIGS. 35 (a) and 35 (b), 128 balls made of a conductive material are melted and connected to the electrodes 108. Therefore, a flux that removes the oxide film and the contaminated layer on the surface of the electrode and the conductive material and exposes the intrinsic surface is required for connection. However, since the sheet 129 is thermoplastic and softens due to the temperature at the time of connection and covers the electrodes without gaps, the flux cannot be washed after the connection. Therefore, since the flux remains near the connection and the electrodes are corroded, the reliability of the electric circuit component is reduced. When the flux is not used, the work is carried out in an inert gas atmosphere or a reducing gas atmosphere, which is not preferable in terms of workability and cost.

In the method shown in FIGS. 35 (a) and 35 (b), the balls 128 made of a conductive material are heated one by one and placed and fixed on the sheet 129. Therefore, when the number of conductive balls 128 to be connected increases, It takes time to dispose the conductive balls 128 on one sheet 129, and the production efficiency is poor.
Therefore, if the number of connections increases, the production efficiency will deteriorate and the cost will increase.

In the method shown in FIG. 36, the conductive material 130 is also arranged in a portion other than the electrode 108 to be connected so that the anisotropic conductive sheet 131 and the electrode 108 need not be aligned with each other. Therefore, the conductive material 130 protruding from the sheet surface comes into contact with a portion other than the electrode 108.

The electric circuit board 113 that is normally connected has a wiring pattern on its surface connected to the electrodes 108.
In order to protect the wiring pattern, the connected electrode 108
Other than the above, it is usually coated with an insulating material (for example, solder resist). The thickness of the coated wiring portion is equal to the wiring thickness + the insulating coating layer thickness, which is larger than the wiring thickness of the electrode 108 to be connected.

Therefore, at the time of connection, the conductive material 130 of the anisotropic conductive sheet 131 and the insulating layer on the wiring make the first contact. In order to connect between the electrodes 108 desired to be connected, the conductive material 130 of the anisotropic conductive sheet 131 in contact with a portion other than the electrodes 108 is deformed to a greater extent,
The conductive material 130 disposed between the desired electrodes 108 must be in contact with the electrodes 108.

Therefore, the conductive material 130, which is in contact with parts other than the electrodes 108, is always applied with a larger force than the conductive material 131 provided in the connection portion, so that the insulating layer is destroyed or between the wirings of one substrate 113 and A short circuit may occur between the wirings of the two substrates 113 to be connected.

To prevent this, the insulating layer is stopped, and in the region of the anisotropic conductive sheet 131 where the conductive material 130 exists,
In addition to the connecting portions of the substrate 113, the same wiring interval as that of the connecting portions is provided, and further, not only the electrodes 108 but also the wiring of each substrate 113 must be mirror-symmetrically arranged with respect to the surface of the anisotropic conductive sheet 131. This is the connecting electrode 1
It is the same as 08 becoming larger.

Therefore, there is a problem that miniaturization is difficult because the wiring pattern is limited.

In the system shown in FIG. 36, the anisotropic conductive sheet 131 and the electrodes 108 are aligned with each other. Therefore, the number of conductive materials 130 arranged on the electrodes 108 is
You will always touch it with a certain width.

Further, when the pitch dimension of the electrodes 108 to be connected becomes small, a plurality of conductive materials 130 must be arranged on the electrodes 108, and therefore, at least half or less of the pitch dimension of the electrodes 108 is set. Pitch dimensions must be realized. Therefore, the patterning accuracy that is more than twice the patterning accuracy of the electrode 108 is required, and there is a limit to the connectable pitch dimension.

Therefore, the connection resistance value and the permissible current value between the electrodes 108 always have variations, and the size of the connection pitch is limited, which makes it difficult to reduce the size.

In the method shown in FIG. 36, the conductive material 130 is cast into the ridges of the grid of insulating material formed on the base sheet of the insulating material to form the ridges of the insulating base sheet and the grid of insulation. By etching, the ridge portions of the lattice become an insulating sheet, and the conductive material 130 is exposed from both surfaces of the insulating sheet.

Therefore, even if the conductive material 130 is exposed from the surface of the insulating sheet, covering the surface of the sheet and covering the conductive material 130 with the sheet are adjacent to each other during casting. It is difficult because the conductive materials are short-circuited and it is difficult to manufacture a grid-like ridge having a wide opening diameter with a narrow base sheet side and opening side.

Therefore, the holding of the conductive material 130 on the sheet 131 cannot be avoided only by the frictional force of the side wall of the sheet.
The conductive material is easily dropped off due to vibration or the like when the anisotropic conductive sheet 131 is transported and arranged.

Therefore, the conductive material 1 is surely deposited on the electrode 108.
It is difficult to dispose 30 and there is a problem that a connection failure occurs. The present invention has been made in view of the above-mentioned circumstances, and a first object of the present invention is to bond the electric circuit element and the electric circuit board to each other without performing special additional machining on the respective electrode portions. Is to achieve high reliability of electric circuit components by increasing the connection strength with high connection strength.

A second object of the present invention is to achieve miniaturization of electric circuit parts by increasing the bondability and connecting with high connection strength and high density. A third object of the present invention is to improve the joining property, to achieve high-density strength and high-density connection, and to achieve further miniaturization of electric circuit components.

A fourth object of the present invention is to achieve formation of solder bumps having high connection stability on the electrode portion of the electric circuit element or electric circuit board. A fifth object of the present invention is to connect to at least one of an electric circuit element or an electric circuit board to enable inspection in the middle, and to have a high stability of connection so that a higher electric circuit component can be obtained. It is to achieve reliability and cost reduction.

A sixth object of the present invention is, in addition to the above-mentioned fifth object, to further reduce the size of the electric circuit component by easily disposing the connecting members in a high density. A seventh object of the present invention is to achieve further miniaturization of an electric circuit component by preventing displacement of a connecting member at the time of connection in addition to the above fifth and sixth objects. Is.

An eighth object of the present invention is to collectively connect the electric circuit element and the electric circuit board using a member having a high connection quality, thereby shortening the working process and reducing the cost of the electric circuit component. To achieve down.

A ninth object of the present invention is, in addition to the above-mentioned eighth object, further facilitating the disposition of the connecting member on the electrode, thereby improving workability and reducing the size of the electric circuit component. To achieve high cost and low cost.

The tenth object of the present invention is, in addition to the above-mentioned eighth and ninth objects, further preventing the positional displacement of the connecting member at the time of connection, thereby achieving high density connection and further electric circuit. It is to achieve miniaturization of parts.

[0096]

According to a first aspect of the present invention, an electric circuit component according to the present invention is connected to an electric circuit element having an electrode portion and the electric circuit element. In an electric circuit component including an electric circuit board having an electrode section for electrical conductivity, a conductive material around the core is interposed between the electrode section of the electric circuit element and the electrode section of the electric circuit board and has a substantially ball-shaped rigidity. At least one conductive ball provided with a conductive coating layer, fine and hard particles are dispersed in the conductive coating layer of the conductive ball such that a part of the hard particles are exposed. The electrode portion of the element and the electrode portion of the electric circuit board are pressure-contacted to each other, and the gap between the electrode portion of the electric circuit element and the coating layer of the conductive ball, and the coating of the electrode portion of the electric circuit board and the conductive ball. Between the layers It is characterized in that is electrically and mechanically connected respectively.

The electric circuit component according to the present invention is
According to the second aspect, the electric circuit element having the electrode portion and the electric circuit board having the electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other,
In an electric circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to connect the both electrode portions, the conductive ball is a metal having high rigidity. A core having a substantially spherical shape made of at least one of a material and an inorganic material, a conductive coating layer formed of a material having electrical conductivity and coated around the core, and a part of the conductive coating layer exposed. Fine and hard particles dispersed in a state of
The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are pressed into contact with each other, between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating layer. It is characterized by metal connection between each.

The electric circuit component according to the present invention is
According to claim 3, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. Are opposed to each other, and are sandwiched between respective electrode portions, and at least one or more conductive balls electrically and mechanically connecting the both electrode portions are provided.
The conductive ball, a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a material having conductivity, which is coated around the core, and fine and hard particles dispersed in a state where a part of the conductive coating layer is exposed, The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are pressed into contact with each other, between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating. The feature is that each layer is metal-bonded.

The electric circuit component according to the present invention is
According to claim 4, in an electric circuit component including a photoelectric conversion element having an electrode portion and an electric circuit board having an electrode portion for connecting to the photoelectric conversion element, the electrode portion of the photoelectric conversion element is provided. At least one conductive ball is provided between the electrode portion of the electric circuit board and a core having a substantially ball-shaped rigidity, and a conductive coating layer is provided around the core, and the conductive coating layer of the conductive ball is provided. The fine and hard particles are dispersed in a partially exposed state, the conductive balls are pressed into contact with the electrode portion of the photoelectric conversion element and the electrode portion of the electric circuit board, and the electrode portion of the photoelectric conversion element. And the coating layer of the conductive ball, and the electrode portion of the electric circuit board and the coating layer of the conductive ball are electrically and mechanically connected, respectively.

The electric circuit parts according to the present invention are
According to claim 5, an electric circuit element having an electrode portion and an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other,
In an electric circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to connect the two electrode portions, the electric circuit element is at least one or more. A photoelectric conversion element, the electric circuit board has a light-transmitting property in at least a part thereof, and the conductive balls have a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material. And a conductive coating layer which is formed of a material having conductivity and which is coated around the core, and fine and hard particles dispersed in a state where a part of the conductive coating layer is exposed. The ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, so that the ball is between the electrode portion of the electric circuit element and the conductive coating layer and between the electrode portion of the electric circuit board and the electrode portion. Conductive cover Between the layers is characterized in that are respectively metal bonding.

The electric circuit component according to the present invention is
According to claim 6, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. Are opposed to each other, and are sandwiched between respective electrode portions, and at least one or more conductive balls electrically and mechanically connecting the both electrode portions are provided.
The electric circuit element has at least one or more photoelectric conversion elements, the electric circuit board has a light-transmitting property in at least a part thereof, and the conductive ball is at least one of a highly rigid metal material and an inorganic material. Consisting of a core having a substantially spherical shape, a conductive coating layer formed of a material having electrical conductivity and coated around the core, and fine particles dispersed in the conductive coating layer in a partially exposed state. And hard particles, the conductive ball is pressure-contacted by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, between the electrode portion of the electric circuit element and the conductive coating layer, and, The electrode portion of the electric circuit board and the conductive coating layer are metal-bonded to each other.

The electric circuit component according to the present invention is
According to claim 7, in an electric circuit component including an electric circuit element having an electrode portion and an electric circuit board having an electrode portion for connecting to the electric circuit element, an electrode portion of the electric circuit element At least one conductive ball, which is interposed between the electrode portion of the electric circuit board and has a conductive coating layer around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball. Which is formed of a material having an electrical insulation property, so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding the conductive balls, the conductive coating layer of the conductive balls, fine and hard particles are dispersed in a partially exposed state, the conductive balls, the electrode portion of the electric circuit element and The electricity Between the electrode part of the electric circuit element and a part of the covering layer of the conductive ball that is pressed against the electrode part of the circuit board and protrudes from one surface of the holding sheet, and the electrode part of the electric circuit board. And between a part of the coating layer of the conductive ball protruding from the other surface of the holding sheet,
The feature is that they are connected electrically and mechanically respectively.

The electric circuit component according to the present invention is
According to claim 8, an electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other,
A holding sheet for embedding and holding the conductive ball in an electric circuit component in which at least one conductive ball is interposed between the electrode part of the electric circuit element and the electrode part of the electric circuit board to connect the two electrode parts. Which is formed of a material having an electrical insulation property, so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding the conductive balls is provided, wherein the conductive balls are formed of a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material, and a material having electrical conductivity, A conductive coating layer is provided around the conductive coating layer, and fine and hard particles dispersed in the conductive coating layer such that a part of the conductive coating layer is exposed. Between the electrode part of the electric circuit element and the part of the conductive coating layer of the conductive ball which is pressed against the electrode part of the substrate and protrudes from one surface of the holding sheet, and the electrode part of the electric circuit substrate. And a portion of the conductive ball that protrudes from the other surface of the holding sheet and that portion of the conductive coating layer is metal-bonded to each other.

The electric circuit component according to the present invention is
According to a ninth aspect of the present invention, an electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to an electrode section of the electric circuit element, the electric circuit element and the electric circuit board face each other. In this state, at least one or more conductive balls sandwiched between the respective electrode parts and electrically and mechanically connecting the two electrode parts, and a holding sheet for embedding and holding the conductive balls are provided. A holding member which is made of an insulating material and holds the conductive ball so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A sheet, wherein the conductive ball is formed of a substantially spherical core made of at least one of a highly rigid metal material and an inorganic material, and a material having electrical conductivity, and is coated around the core. And a fine and hard particle dispersed in a state where a part of the conductive coating layer is exposed to the conductive coating layer, and the conductive ball is formed by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. Between the electrode portion of the electric circuit element and the portion of the conductive coating layer of the conductive ball that protrudes from one surface of the holding sheet by pressure contact, and between the electrode portion of the electric circuit board and the holding sheet. Each of the conductive balls protruding from the other surface is metal-bonded with a portion of the conductive coating layer.

Also, the electric circuit component according to the present invention is
According to claim 10, in an electric circuit component including a photoelectric conversion element having an electrode section and an electric circuit board having an electrode section for connecting to the photoelectric conversion element, an electrode section of the photoelectric conversion element is provided. At least one conductive ball, which is interposed between the electrode portion of the electric circuit board and has a conductive coating layer around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball. Which is formed of a material having an electrical insulation property, so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding the conductive balls, the conductive coating layer of the conductive balls, fine and hard particles are dispersed in a partially exposed state, the conductive balls, the electrode portion of the photoelectric conversion element and The above Between the electrode portion of the photoelectric conversion element and the portion of the cover layer of the conductive ball protruding from one surface of the holding sheet, which is pressed by the electrode portion of the electric circuit substrate, and the electrode portion of the electric circuit substrate. And between the portion of the coating layer of the conductive ball protruding from the other surface of the holding sheet,
The feature is that they are connected electrically and mechanically respectively.

The electric circuit component according to the present invention is
11. An electric circuit element having an electrode section and an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element are opposed to each other, and the electric circuit element and the electric circuit element are provided. A holding sheet for embedding and holding at least one or more conductive balls in an electric circuit component in which at least one or more conductive balls are interposed between the electrode parts of a circuit board and the two electrode parts are connected to each other. A holding member which is made of an insulating material and holds the conductive ball so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A sheet, the electric circuit element has at least one photoelectric conversion element, the electric circuit board has a light-transmitting property at least in part, the holding sheet is air or a sealing resin The conductive ball is formed so as to have a light transmittance lower than that of the photoelectric conversion element and has an opening at a portion corresponding to the photoelectric conversion element, and the conductive ball has a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material. A core having, a conductive coating layer formed of a material having conductivity, which is coated around the core, and fine and hard particles dispersed in the conductive coating layer in a partially exposed state. The conductive ball is pressed against the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and the conductive ball protrudes from the electrode portion of the electric circuit element and one surface of the holding sheet. Between the coating layer and
The electrode portion of the electric circuit board and the portion of the conductive coating layer of the conductive ball protruding from the other surface of the holding sheet are metal-bonded to each other.

Also, the electric circuit component according to the present invention is
According to claim 12, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. At least one conductive ball that is sandwiched between the respective electrode parts in a state of facing each other and electrically and mechanically connects the two electrode parts, and at least one conductive ball is embedded and held. A holding sheet, which is formed of a material having an electrical insulation property, such that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. ,
A holding sheet for holding the conductive balls, the electric circuit element has at least one photoelectric conversion element, and the electric circuit board has a light-transmitting property in at least a part of the holding sheet. Has a light transmittance lower than that of air or sealing resin, and is formed to have an opening in a portion corresponding to the photoelectric conversion element, and the conductive ball is made of at least a metal material and an inorganic material having high rigidity. A core having a substantially spherical shape consisting of one, a conductive coating layer formed of a material having electrical conductivity, and coated around the core,
The conductive coating layer comprises fine and hard particles dispersed in a partially exposed state, and the conductive balls are pressed against each other by an electrode portion of the electric circuit element and an electrode portion of the electric circuit board to form the electric ball. Between the electrode portion of the circuit element and the portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, and protruding from the electrode portion of the electric circuit board and the other surface of the holding sheet. It is characterized in that the conductive balls are metal-bonded to the conductive coating layer.

Also, the electric circuit component according to the present invention is
According to claim 13, in an electric circuit component including an electric circuit element having an electrode portion and an electric circuit board having an electrode portion for connecting to the electric circuit element, an electrode portion of the electric circuit element At least one conductive ball provided with a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity, which is interposed between the electrode portion of the electric circuit board and the electrode, Formed of a metal having good solder wettability, the conductive ball is pressed and heated by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and is heated by the electrode portion of the electric circuit element and the electric circuit element. It is characterized in that the electrode portion of the circuit board is electrically and mechanically connected via molten solder.

The electric circuit component according to the present invention is
According to claim 14, the electric circuit element having the electrode portion and the electric circuit board having the electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element is provided. In the electric circuit component in which at least one conductive ball is interposed between the electrode part and the electrode part of the electric circuit board to connect the two electrode parts, the conductive ball is a metal material or an inorganic material having high rigidity. Of a core having a substantially spherical shape consisting of at least one of, and a conductive coating layer formed of a solder material and coated around the core, wherein the electrode is formed of a metal having good solder wettability, The conductive ball is pressed and heated by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and the conductive ball is melted between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. It is characterized in that is electrically and mechanically connected via solder.

Also, the electric circuit component according to the present invention is
According to claim 15, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. Are opposed to each other, and are sandwiched between respective electrode parts, and at least one or more conductive balls electrically and mechanically connecting the both electrode parts are provided. The electrode is provided with a core having a substantially spherical shape made of at least one of a high metal material and an inorganic material, and a conductive coating layer formed of a solder material and coated around the core, and the electrode has good solder wettability. The conductive ball is made of metal and is pressed against and heated by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, so that the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are heated. During has features that are electrically and mechanically connected via solder melt.

Also, the electric circuit component according to the present invention is
According to claim 16, in an electric circuit component including a photoelectric conversion element having an electrode portion and an electric circuit board having an electrode portion for connecting to the photoelectric conversion element, the electrode portion of the photoelectric conversion element is provided. At least one conductive ball provided with a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity, which is interposed between the electrode portion of the electric circuit board and the electrode, Formed of a metal having good solder wettability, and the conductive ball is pressed and heated by the electrode portion of the photoelectric conversion element and the electrode portion of the electric circuit board, and is heated to the electrode portion of the photoelectric conversion element. It is characterized in that the electrode portion of the circuit board is electrically and mechanically connected via molten solder.

The electric circuit component according to the present invention is
According to claim 17, the electric circuit element having the electrode portion and the electric circuit substrate having the electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element is provided. In the electrical circuit component in which at least one or more conductive balls are interposed between the electrode portion and the electrode portion of the electrical circuit board to connect the both electrode portions, the electrical circuit element is at least one or more photoelectric conversion element. The electric circuit board has a light-transmitting property in at least a part thereof, and the conductive balls have a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material, and a solder material. And a conductive coating layer coated around the core, the electrodes are formed of a metal having good solder wettability, and the conductive balls are formed of an electrode portion of the electric circuit element and the electric circuit. It is pressed and heated by the electrode part of the plate, and the electrode part of the electric circuit element and the electrode part of the electric circuit board are electrically and mechanically connected to each other via molten solder. It has a feature.

Also, the electric circuit component according to the present invention is
According to claim 18, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. Are opposed to each other, and are sandwiched between respective electrode parts, and at least one or more conductive balls electrically and mechanically connecting the both electrode parts are provided, and the electric circuit element is at least At least a part of the electric circuit board has a light-transmitting property, and the conductive balls have a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material. A conductive coating layer formed of a solder material and coated around the core, the electrodes are formed of a metal having good solder wettability, and the conductive balls are electrodes of the electric circuit element. Department and front The electrode portion of the electric circuit board is pressed and heated, and the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are electrically and mechanically connected via molten solder. It is characterized by things.

Also, the electric circuit component according to the present invention is
According to claim 19, in an electric circuit component including an electric circuit element having an electrode portion and an electric circuit board having an electrode portion for connecting to the electric circuit element, an electrode portion of the electric circuit element, At least one conductive ball provided between the electrode portion of the electric circuit board and a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity, and the conductive ball are embedded. A holding sheet for holding, which is made of an electrically insulating material, has a part of the conductive ball protruding and exposed from one surface, and a part of the conductive ball protruding and exposed from the other surface. And a holding sheet for holding the conductive balls, the electrodes are formed of a metal having a good solder wettability, and the conductive balls are used for the electrodes of the electric circuit element and the electrodes of the electric circuit board. The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are electrically and mechanically connected to each other through molten solder by being pressed against each other and heated. .

Also, the electric circuit component according to the present invention is
According to claim 20, the electric circuit element having the electrode portion and the electric circuit substrate having the electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element is provided. A holding sheet for embedding and holding the conductive ball in an electric circuit component in which at least one conductive ball is interposed between the electrode part and the electrode part of the electric circuit board to connect the two electrode parts. Holds the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. The conductive ball is formed of a solder material and a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material, and is coated around the core. A conductive coating layer, the electrode is formed of a metal having good solder wettability, the conductive ball is pressed and heated by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are electrically and mechanically connected to each other via molten solder.

Also, the electric circuit component according to the present invention is
According to claim 21, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. And at least one conductive ball which is sandwiched between the respective electrode parts in a state of facing each other and electrically and mechanically connects the both electrode parts, and a holding sheet which embeds and holds the conductive ball. A conductive ball formed of a material having electrical insulation so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding the conductive ball is provided, wherein the conductive ball is formed from a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material, and a solder material, and is coated around the core. The electrode is formed of a metal having a good solder wettability, and the conductive ball is pressed and heated by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are electrically and mechanically connected via molten solder.

Also, the electric circuit component according to the present invention is
According to claim 22, in an electric circuit component including a photoelectric conversion element having an electrode portion and an electric circuit board having an electrode portion for connecting to the photoelectric conversion element, the electrode portion of the photoelectric conversion element is provided. At least one conductive ball provided between the electrode portion of the electric circuit board and a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity, and the conductive ball are embedded. A holding sheet for holding, which is made of an electrically insulating material, has a part of the conductive ball protruding and exposed from one surface, and a part of the conductive ball protruding and exposed from the other surface. And a holding sheet for holding the conductive balls, the electrodes are formed of a metal having a good solder wettability, and the conductive balls are used for the electrodes of the electric circuit element and the electrodes of the electric circuit board. The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are electrically and mechanically connected to each other through molten solder by being pressed against each other and heated. .

Also, the electric circuit component according to the present invention is
According to claim 23, the electric circuit element having the electrode portion and the electric circuit substrate having the electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element is provided. In an electric circuit component in which at least one conductive ball is interposed between the electrode part and the electrode part of the electric circuit board to connect the two electrode parts, a holding sheet for embedding and holding the at least one conductive ball Which is formed of a material having an electrical insulation property, so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. A holding sheet for holding the conductive balls is provided, the electric circuit element has at least one or more photoelectric conversion elements, the electric circuit board has a light-transmitting property at least in part, and the holding sheet is It has a light transmittance lower than that of air or a sealing resin, and is formed to have an opening in a portion corresponding to the photoelectric conversion element, and the conductive ball is made of at least one of a highly rigid metal material and an inorganic material. A core having a substantially spherical shape and a conductive coating layer formed of a solder material and coated around the core, the electrode is formed of a metal having good solder wettability, and the conductive ball is The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are pressed together and heated, and the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are electrically connected via molten solder. It is characterized by being mechanically and mechanically connected.

Also, the electric circuit component according to the present invention is
According to claim 24, an electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, the electric circuit element and the electric circuit board. At least one conductive ball that is sandwiched between the respective electrode parts in a state of facing each other and electrically and mechanically connects the two electrode parts, and at least one conductive ball is embedded and held. A holding sheet, which is formed of a material having an electrical insulation property, such that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. ,
A holding sheet for holding the conductive balls, the electric circuit element has at least one photoelectric conversion element, and the electric circuit board has a light-transmitting property in at least a part of the holding sheet. Has a light transmittance lower than that of air or sealing resin, and is formed to have an opening in a portion corresponding to the photoelectric conversion element, and the conductive ball is made of at least a metal material and an inorganic material having high rigidity. A core having a substantially spherical shape made of one side, and a conductive coating layer formed of a solder material and covering the periphery of the core are provided, and the electrodes are formed of a metal having good solder wettability. Is heated while being pressure-contacted by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and the molten solder is interposed between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. Electricity And it is characterized in that is mechanically connected.

Also, the electric circuit component according to the present invention is
According to the twenty-fifth aspect, the distance between the electrode portions connected by the conductive balls is a distance substantially equal to the diameter of the core. According to claim 26, the electric circuit component according to the present invention is
The outer peripheral surface of the conductive coating layer is characterized by being formed into a smooth curved surface.

Also, the electric circuit component according to the present invention is
According to a twenty-seventh aspect, the outer peripheral surface of the core is formed into a smooth curved surface. According to a twenty-eighth aspect of the present invention, the electric circuit component according to the present invention is characterized in that the outer peripheral surface of the conductive coating layer is formed in an uneven shape.

The electric circuit component according to the present invention is
According to a twenty-ninth aspect, the inner peripheral surface of the conductive coating layer is formed in an uneven shape. According to a thirtieth aspect of the electric circuit component of the present invention, the outer peripheral surface of the core is formed in an uneven shape.

The electric circuit component according to the present invention is
According to a thirty-first aspect, a plurality of conductive balls are provided between the both electrode portions. According to a thirty-second aspect of the present invention, the electric circuit component according to the present invention is characterized in that the space between the substrate and the element is resin-sealed.

The electric circuit component according to the present invention is
According to a thirty-third aspect of the present invention, the holding sheet is formed with a notch and / or a slit so that it can be torn.

The electric circuit component according to the present invention is
According to a thirty-fourth aspect of the present invention, the conductive coating layer is formed of a substance having an electric resistivity of 1.6E-8 to 10E-8Ω · m. According to a thirty-fifth aspect of the electric circuit component of the present invention, the conductive coating layer has a thickness set to 1 to 50 μm.

The electric circuit component according to the present invention is
According to a thirty-sixth aspect, the conductive coating layer has a thickness set to 3 to 20 μm. According to a thirty-seventh aspect of the electric circuit component of the present invention, the core has a diameter of 3 to 5;
It is characterized by being set to 00 μm.

The electric circuit component according to the present invention is
According to claim 38, the core has a diameter of 1
It is characterized by being set to 0 to 200 μm. Further, the electric circuit component according to the present invention is defined in claim 3.
According to the statement of 9, the core has a displacement of 5% in diameter when a load required for connection between both electrodes is applied.
It is characterized by having the following rigidity.

The electric circuit component according to the present invention is
According to claim 40, the core has rigidity such that the displacement amount of the diameter thereof is 1% or less when a load required for connection between both electrodes is applied. Is characterized by. According to claim 41, in the electric circuit component according to the present invention, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrode connected at Rmax, and the conductive coating layer is formed. Is less than twice the film thickness of

Also, the electric circuit component according to the present invention is
According to a 42nd aspect, the particles are characterized in that the fine and hard metal material is also formed of an inorganic material.

The electric circuit component according to the present invention is
According to claim 43, the size of the particles is set to be larger than one-tenth of the thickness of the electrode and smaller than the sum of the thickness of the conductive coating layer and the thickness of the electrode. It is characterized by being.

The electric circuit component according to the present invention is
According to claim 44, the size of the particles is set to be larger than 1/10 of the thickness of the electrode and smaller than half of the total thickness of the conductive coating layer and the electrode. It is characterized by being done.

The electric circuit component according to the present invention is
According to a forty-fifth aspect of the present invention, the particles are embedded in a partially exposed state over the entire circumference of the conductive coating layer. According to a forty-sixth aspect of the present invention, in the electric circuit component according to the present invention, the particles are embedded in a state where the particles are partially exposed only in a portion of the conductive coating layer to which a corresponding electrode is connected. It is characterized by things.

Also, the electric circuit component according to the present invention is
According to a 47th aspect, the particles are embedded in the surface of the conductive coating layer in a partially exposed state. According to a forty-eighth aspect of the present invention, in the electric circuit component according to the present invention, the particles are embedded in the surface of the conductive coating layer in a partially exposed state, and
The feature is that it is buried inside without being exposed at all.

According to a forty-ninth aspect of the invention, there is provided an electric circuit component manufacturing method according to the invention, wherein the electric circuit device has an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a conductive coating layer is provided around a core having a substantially ball-shaped rigidity, and fine hard particles are dispersed in the conductive coating layer in a partially exposed state. Conductive balls,
A first step of interposing at least one or more between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board;
A second step of pressing the conductive balls with the electrode portions of the electric circuit element and the electrode portions of the electric circuit board; and a third step of heating the conductive coating layer of the conductive balls to a predetermined temperature.
And the conductive coating layer between the electrode portion of the electric circuit element and the conductive ball and the conductive coating layer between the electrode portion of the electric circuit board and the conductive ball are respectively moved by the step and the pressing and heating. And a fourth step of bringing the core into contact with the electrode portions, and cooling the conductive coating layer to maintain contact between the core and the electrode portions so that the conductive coating layer and the electrode portions are metalized. And a fifth step of joining.

According to a fiftyth aspect of the present invention, there is provided an electric circuit component manufacturing method according to the present invention, wherein the electric circuit device has an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a conductive coating layer is provided around a core having a substantially ball-shaped rigidity, and fine hard particles are dispersed in the conductive coating layer in a partially exposed state. Conductive balls,
A first step of placing at least one or more on one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; and the other of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. A second step of stacking the conductive ball on the conductive ball and sandwiching the conductive ball by both electrodes; and a third step of pressing the conductive ball by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. The fourth step of heating the conductive coating layer of the conductive ball to a predetermined temperature, the conductive coating layer between the electrode portion of the electric circuit element and the conductive ball by the pressing and heating, A fifth step of moving the conductive coating layer between the electrode portion of the electric circuit board and the conductive ball, respectively, to bring the core and both electrode portions into contact with each other, and cooling the conductive coating layer, Contact between the core and both electrode parts Said conductive covering layer and both electrode sections by lifting is characterized by comprising a sixth step of metal bonding.

Further, according to a method of manufacturing an electric circuit component according to the present invention, an electric circuit having an electric circuit element having an electrode section and an electrode section for connecting to the electric circuit element is provided. In the method for manufacturing an electric circuit component including a substrate, a conductive coating layer is provided on one of the electric circuit element and the electric circuit substrate around a core having a substantially ball-shaped rigidity, and the conductive coating layer is provided with a fine pattern. In a mask member in which hard particles are formed thinner than the diameter of the conductive balls dispersed in a state where a part of them are exposed, and an opening is formed at a position corresponding to the electrode, In the first step of mounting and in the opening of the mask member,
A second step of accommodating the conductive balls and mounting the conductive balls on at least one of the electrode portions of the electric circuit element and the electric circuit board; The third step of placing the other on the conductive ball so that the conductive ball overlaps the conductive ball, and sandwiching the conductive ball between the electrodes; the electrode part of the electric circuit element and the electrode of the electric circuit board; Part to press the conductive ball, a fifth step to heat the conductive coating layer of the conductive ball to a predetermined temperature, and the pressing and heating to form an electrode part of the electric circuit element and By moving the conductive coating layer between the conductive balls and the conductive coating layer between the electrode portion of the electric circuit board and the conductive balls, respectively,
Sixth step of contacting the core with both electrode parts, and cooling the conductive coating layer to maintain contact between the core and both electrode parts to metal-bond the conductive coating layer and both electrode parts. It is characterized by comprising a seventh step and an eighth step of removing the mask member.

According to the 52nd aspect of the present invention, there is provided an electric circuit device having an electric circuit element having an electrode portion and an electrode portion for connecting to the electric circuit element. In the method for manufacturing an electric circuit component including a substrate, a conductive coating layer is provided on one of the electric circuit element and the electric circuit substrate around a core having a substantially ball-shaped rigidity, and the conductive coating layer is provided with a fine pattern. The first mask member is formed to have a diameter smaller than the diameter of the conductive balls dispersed with the hard particles partially exposed, and a first opening is formed at a position corresponding to the electrode. The first step of placing in a state corresponding to the electrodes, and the total thickness of the first mask member and the first mask member is more than 1.5 times the diameter of the conductive ball. While being formed to be thin, A second mask member which second opening is formed at a position corresponding to the serial electrode, a second step of the first and second openings superposed so as to communicate, the first
And the conductive balls are housed in the first and second openings of the second mask member, and at least one conductive ball is mounted on one of the electrode portions of the electric circuit element and the electric circuit board. The third step of placing the second mask member, the fourth step of removing the second mask member, and the other of the electric circuit element and the electric circuit board are placed such that their electrode portions overlap the conductive balls. And a fifth step of sandwiching the conductive ball between the electrodes, a sixth step of pressing the conductive ball by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and A seventh step of heating the conductive coating layer of the ball to a predetermined temperature, the conductive coating layer between the electrode portion of the electric circuit element and the conductive ball, and the electrode portion of the electric circuit board by the pressing and heating. Conduction between the conductive balls Eighth step of moving the covering layer respectively to bring the core and the electrode portions into contact with each other, and cooling the conductive coating layer to maintain contact between the core and the electrode portions to provide the conductive coating. The method is characterized by including a ninth step of metal-bonding the layer and both electrode portions, and a tenth step of removing the first mask member.

[0138] Further, in the method for manufacturing an electric circuit component according to the present invention, according to claim 53, an electric circuit having an electric circuit element having an electrode section and an electrode section for connecting to the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a conductive coating layer is provided around a core having a substantially ball-shaped rigidity, and fine hard particles are dispersed in the conductive coating layer in a partially exposed state. Conductive balls,
A first step of bringing the electrode portion of the electric circuit element into contact with one of the electrode portions of the electric circuit board; a second step of pressing the one electrode portion and the conductive ball against each other; The third step of heating the conductive coating layer of the ball to a predetermined temperature, and the conductive coating layer between the one electrode portion and the conductive ball is moved by the pressurization and heating so that the core and the one And a fourth step of contacting the electrode portion with the conductive coating layer, cooling the conductive coating layer to maintain contact between the core and the one electrode portion, and the conductive coating layer and the one electrode portion are made of metal. A fifth step of alloying or alloying,
A conductive ball connected to the one electrode, the electrode portion of the electric circuit element and the other electrode portion of the electric circuit board are brought into contact with each other, and the conductive ball is sandwiched by both electrodes;
(7), a seventh step of pressing the conductive balls by the electrode section of the electric circuit element and the electrode section of the electric circuit board, and an eighth step of heating the conductive coating layer of the conductive balls to a predetermined temperature. And a step of moving the conductive coating layer between the other electrode part and the conductive ball by the step and the pressing and heating to bring the core and the other electrode part into contact with each other.
And a tenth step of cooling the conductive coating layer to maintain contact between the core and the other electrode portion to metal-bond the conductive coating layer and the other electrode portion. It is characterized by that.

[0139] According to a forty-fifth aspect of the present invention, there is provided an electric circuit component manufacturing method according to the invention, wherein the electric circuit device has an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a conductive coating layer is provided around a core having a substantially ball-shaped rigidity in a mold having a concave portion corresponding to the electrode on the upper surface, and the conductive coating layer is provided. A first step of accommodating a conductive ball in which a part of fine and hard particles are dispersed in the coating layer in an exposed state; the conductive ball; the electrode part of the electric circuit element; A second step of contacting one of the electrode parts of the circuit board, a third step of pressing the conductive ball with the one electrode part and the recess, and a predetermined temperature of the conductive coating layer of the conductive ball. Heated to And a fourth step of moving the conductive coating layer between the one electrode portion and the conductive ball by the pressurization and heating to bring the core and the one electrode portion into contact with each other. And a sixth step of cooling the conductive coating layer to maintain contact between the core and the one electrode portion to metallize or alloy the conductive coating layer and the one electrode portion. A seventh step of taking out one of the electric circuit element and the electric circuit board to which the conductive ball is connected from the mold, a conductive ball connected to the one electrode, and an electrode portion of the electric circuit element The eighth step of bringing the other side of the electrode portion of the electric circuit board into contact with each other to sandwich the conductive ball between the electrodes, and the conductive ball by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. The ninth step of pressurizing A tenth step of heating the conductive coating layer of the ball to a predetermined temperature, and moving the conductive coating layer between the other electrode part and the conductive ball by the pressing and heating to move the core and the other side. Eleventh step of bringing the conductive coating layer into contact with the other electrode portion by cooling the conductive coating layer to maintain contact between the core and the other electrode portion. And a twelfth step.

Further, according to the 55th aspect of the present invention, there is provided an electric circuit device having an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In the method of manufacturing an electric circuit component including a substrate, at least one or more conductive balls having a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity and an electrode portion of the electric circuit element are provided. A first step of interposing between the electrode portion of the electric circuit board and a second step of pressing the conductive ball by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; A third step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and the pressing and heating bring the core into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, respectively. And the fifth step of cooling the conductive coating layer to maintain contact between the core and both electrode parts and electrically and mechanically connecting both electrode parts through molten solder. It is characterized by having and.

Further, according to a 56th aspect of the present invention, there is provided an electric circuit device having an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a conductive ball including a conductive coating layer formed of a solder material is provided around a core having a substantially ball-shaped rigidity, the electrode portion of the electric circuit element and the electric circuit board. A first step of placing at least one or more electrode portions on one of the electrode portions, and the other of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are overlapped on the conductive ball, and the conductive ball A second step of sandwiching the conductive ball with both electrodes, a third step of pressing the conductive ball by the electrode part of the electric circuit element and the electrode part of the electric circuit board, and conductive coating of the conductive ball A fourth step of heating the core to a predetermined temperature, a fifth step of bringing the core into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board by the pressing and heating, and Cool the coating layer,
A sixth step of maintaining contact between the core and both electrode portions and electrically and mechanically connecting the both electrode portions through a molten solder.

According to the 57th aspect of the present invention, there is provided an electric circuit device having an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a conductive ball provided with a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity on one of the electric circuit element and the electric circuit board. A first step of placing a mask member having a diameter smaller than that of the mask member and having an opening formed at a position corresponding to the electrode in a state where the opening corresponds to the electrode; A second step of accommodating the conductive balls and mounting the conductive balls on at least one of the electrode portions of the electric circuit element and the electric circuit board; and the electric circuit element and the electric circuit board. The other step is placed so that the electrode portion thereof overlaps the conductive ball, and the conductive ball is sandwiched by both electrodes; and the electrode portion of the electric circuit element and the electric circuit board A fourth step of pressing the conductive balls with the electrode portion, a fifth step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and the pressing and heating of the core and the electric circuit element. And a sixth step of bringing the electrode part of the electric circuit board into contact with the electrode part of the electric circuit board, and cooling the conductive coating layer to maintain contact between the core and the electrode parts, and The method is characterized by including a seventh step of electrically and mechanically connecting via molten solder and an eighth step of removing the mask member.

[0143] According to a forty-eighth aspect of the present invention, in the method for manufacturing an electric circuit component, the electric circuit having an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element is provided. In a method of manufacturing an electric circuit component including a substrate, a conductive ball having a conductive coating layer formed of a solder material on one of the electric circuit element and the electric circuit board around a core having a substantially ball-shaped rigidity. A first mask member having a diameter smaller than that of the first mask member and having a first opening formed at a position corresponding to the electrode, the first step of mounting the first mask member with the opening corresponding to the electrode; On the first mask member, the total thickness with the first mask member is
The second mask member is formed to be thinner than 1.5 times the diameter of the conductive ball and has a second opening at a position corresponding to the electrode. And a second step of stacking the conductive balls so that they communicate with each other, and the conductive balls are housed in the first and second openings of the first and second mask members, and the conductive balls are connected to the electric circuit element. And a third step of placing at least one or more electrodes on one of the electrode parts of the electric circuit board, a fourth step of removing the second mask member, and the other of the electric circuit element and the electric circuit board. A fifth step of placing the electrode part on the conductive ball so as to overlap the conductive ball and sandwiching the conductive ball between the electrodes; an electrode part of the electric circuit element and an electrode part of the electric circuit board; The sixth step of pressing the conductive ball by And a seventh step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and contacting the core with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board by the pressing and heating. And an eighth step of cooling the conductive coating layer to maintain contact between the core and both electrode portions and electrically and mechanically connecting both electrode portions via molten solder. And a tenth step of removing the first mask member.

According to a fifty-ninth aspect of the present invention, in the method of manufacturing an electric circuit component according to the present invention, the electric circuit has an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In a method of manufacturing an electric circuit component including a substrate, a conductive ball including a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity, an electrode portion of the electric circuit element, and the electric circuit board. A first step of bringing one of the electrode portions into contact with each other, a second step of pressing the one electrode portion and the conductive ball against each other, and a step of heating the conductive coating layer of the conductive ball to a predetermined temperature. 3 step, a fourth step of electrically and mechanically connecting the one electrode part and the conductive ball through the molten solder by the pressurization and heating, and cooling the conductive coating layer. The above A fifth step of maintaining contact between the one electrode part and the one electrode part, a conductive ball connected to the one electrode, the electrode part of the electric circuit element and the other electrode part of the electric circuit board. A sixth step of bringing the conductive balls into contact with each other and sandwiching the conductive balls between the electrodes; a seventh step of pressing the conductive balls by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; An eighth step of heating the conductive coating layer of the ball to a predetermined temperature, and a ninth step of bringing the core and the electrode portion of the electric circuit element into contact with the electrode portion of the electric circuit board by the pressing and heating, respectively. And a tenth step of cooling the conductive coating layer to maintain contact between the core and both electrode portions and electrically and mechanically connecting both electrode portions via molten solder. It is characterized by having .

Further, according to the 60th aspect of the present invention, there is provided an electric circuit component manufacturing method according to the invention, wherein the electric circuit device has an electric circuit element having an electrode section and an electrode section for connecting the electric circuit element. In a method for manufacturing an electric circuit component including a substrate, a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity in the recess of a mold having a recess corresponding to the electrode on the upper surface. And a second step of bringing the conductive ball into contact with one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. ,
The third step of pressing the conductive ball with the one electrode portion and the recess, the fourth step of heating the conductive coating layer of the conductive ball to a predetermined temperature, the pressing and heating, A fifth step of electrically and mechanically connecting one electrode portion and the conductive ball through a molten solder; cooling the conductive coating layer; and the core and the one electrode portion. Step of maintaining the contact between the conductive ball and the seventh step of taking out one of the electric circuit element and the electric circuit board to which the conductive ball is connected from the mold, and a conductive ball connected to the one electrode. And an eighth step of bringing the electrode portion of the electric circuit element and the other electrode portion of the electric circuit board into contact with each other to sandwich the conductive ball between the electrodes, and the electrode portion of the electric circuit element and the electric circuit. By the electrode part of the substrate, The ninth step of pressing the conductive balls, the tenth step of heating the conductive coating layer of the conductive balls to a predetermined temperature, the pressing and heating, the core and the electrode portion of the electric circuit element and the An eleventh step of bringing the electrode portions of the electric circuit board into contact with each other, and cooling the conductive coating layer to maintain the contact between the core and both electrode portions, and at the same time, to put the both electrode portions through molten solder. And a twelfth step of electrically and mechanically connecting.

According to a sixty-first aspect of the method for manufacturing an electric circuit component according to the present invention, the electric circuit element is provided with at least one photoelectric conversion element. According to a 62nd aspect of the method for manufacturing an electric circuit component according to the present invention, the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface.

According to a sixty-third aspect of the method for manufacturing an electric circuit component of the present invention, the outer peripheral surface of the core is formed into a smooth curved surface. According to a sixty-fourth aspect of the method for manufacturing an electric circuit component according to the present invention, the outer peripheral surface of the conductive coating layer is formed in an uneven shape.

According to a sixty-fifth aspect of the method for manufacturing an electric circuit component according to the present invention, the inner peripheral surface of the conductive coating layer is formed in an uneven shape.

According to a sixty-sixth aspect of the method for manufacturing an electric circuit component according to the present invention, the outer peripheral surface of the core is formed in an uneven shape.
According to a sixty-seventh aspect of the method for manufacturing an electric circuit component according to the present invention, in the first step, a plurality of conductive balls are provided between both electrode portions.

According to a sixty-eighth aspect of the present invention, the method of manufacturing an electric circuit component is characterized in that, in the second step, a plurality of conductive balls are provided between both electrode portions. There is. According to a sixty-ninth aspect of the method for manufacturing an electric circuit component according to the present invention, in the third step, a plurality of conductive balls are provided between both electrode portions.

Further, according to the method of manufacturing an electric circuit component according to the present invention, according to claim 70, in the first step, a plurality of conductive balls are brought into contact with the one electrode portion at a time. It has a feature. According to a seventy-first aspect of the invention, the method for manufacturing an electric circuit component is characterized in that, in the first step, a plurality of conductive balls are housed in the recess at once.

The method for manufacturing an electric circuit component according to the present invention is characterized by further comprising a step of sealing between the substrate and the element with a resin according to the 72nd aspect. . Further, according to a method of manufacturing an electric circuit component according to the present invention, according to claim 73, a notch and / or a slit is formed in the mask member so that the mask member can be torn. There is.

According to a seventy-fourth aspect of the present invention, in the method for producing an electric circuit component, the conductive coating layer is made of a material having an electric resistivity of 1.6E-8 to 10E-8Ω · m. It is characterized by being formed. Also,
A method of manufacturing an electric circuit component according to the present invention is defined in claim 7.
According to the description of 5, the conductive coating layer is characterized in that its film thickness is set to 1 to 50 μm.

According to a 76th aspect of the method for manufacturing an electric circuit component according to the present invention, the conductive coating layer has a thickness of 3 to 20 μm. According to a 77th aspect of the method for manufacturing an electric circuit component according to the present invention, the core has a diameter set to 3 to 500 μm.

[0155] According to a 78th aspect of the method for manufacturing an electric circuit component of the present invention, the core has a diameter set to 10 to 200 µm. According to a 79th aspect of the present invention, in the method of manufacturing an electric circuit component, the core is
It is characterized by having rigidity such that the displacement amount of the diameter becomes 5% or less when a load required for connection between both electrodes is applied.

[0156] According to the 80th aspect of the present invention, in the method for manufacturing an electric circuit component, the core has a diameter which is smaller than that of the core when a load required for connection between the two electrodes is applied. It is characterized by having rigidity such that the amount of displacement is 1% or less.

Further, in the method for manufacturing an electric circuit component according to the present invention, according to claim 81, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrode connected with Rmax. And is less than or equal to twice the film thickness of the conductive coating layer.

Further, according to the manufacturing method of the electric circuit component according to the present invention, according to the 82nd aspect, the pressing of the conductive balls in the second step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

Further, according to the manufacturing method of the electric circuit component according to the present invention, according to claim 83, the pressing of the conductive ball in the third step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

Further, according to the manufacturing method of the electric circuit component according to the present invention, according to claim 84, the pressing of the conductive ball in the fourth step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

Further, according to a method of manufacturing an electric circuit component according to the present invention, according to claim 85, the pressing of the conductive ball in the sixth step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

Further, according to a method of manufacturing an electric circuit component according to the present invention, according to claim 86, the pressing of the conductive ball in the seventh step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

Further, according to the method of manufacturing an electric circuit component according to the present invention, according to claim 87, the pressing of the conductive ball in the ninth step is performed by the electric circuit element and the electric circuit board. By bringing the electrodes of the electric circuit element and the electrode of the electric circuit board into contact with each other, the proximity operation is stopped when the distance between the electrode of the electric circuit element and the electrode of the electric circuit board becomes substantially equal to the diameter of the core of the conductive ball. Then, the pressurizing operation is finished.

[0164] Further, the manufacturing method of the electric circuit component according to the present invention is characterized in that, according to claim 88, the particles are fine and hard metal materials and inorganic materials. According to the description of claim 89, in the method for manufacturing an electric circuit component according to the present invention, the size of the particles is larger than one tenth of the thickness of the electrode, and the thickness of the conductive coating layer is And the thickness of the electrode is set to be smaller than the sum of the thickness of the electrode and the thickness of the electrode.

[0165] Further, in the method for manufacturing an electric circuit component according to the present invention, according to claim 90, the size of the particles is larger than one tenth of the thickness of the electrode, and the conductive coating is formed. It is characterized in that it is set to be less than half of the total of the layer thickness and the electrode thickness.

Further, according to the method of manufacturing an electric circuit component according to the present invention, according to claim 91, the particles are embedded in a partially exposed state over the entire circumference of the conductive coating layer. Is characterized by. Further, in the method for manufacturing an electric circuit component according to the present invention, according to claim 92, the particles are embedded in a state in which the conductive coating layer is partially exposed only in a portion to which a corresponding electrode is connected. It is characterized by being done.

Further, according to the method of manufacturing an electric circuit component according to the present invention, according to claim 93, the particles are embedded in the surface of the conductive coating layer in a partially exposed state. It has a feature. According to Claim 94, the method of manufacturing an electric circuit component according to the present invention is
The particles are embedded in the surface of the conductive coating layer in a partially exposed state, and are embedded in the inside in a state of not being exposed at all.

According to the 95th aspect, the conductive ball according to the present invention is for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit substrate having the electrode portion to each other. The conductive ball includes a core having a substantially ball-shaped rigidity, a conductive coating layer coated around the core, and fine and hard particles dispersed in a state where a part of the conductive coating layer is exposed. It is characterized by doing.

In the conductive ball according to the present invention, the conductive coating layer of the conductive ball may be pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. It is characterized in that it is electrically and mechanically connected to at least one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board.

According to claim 97, the conductive ball according to the present invention is for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion to each other. In the conductive ball, a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material, and formed of a material having electrical conductivity,
It is characterized by comprising a conductive coating layer coated around the core, and fine and hard particles dispersed in a state where a part of the core is exposed to the conductive coating layer.

Further, in the conductive ball according to the present invention, according to claim 98, the conductive coating layer of the conductive ball is brought into pressure contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. It is characterized in that the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are respectively metal-bonded.

According to the 99th aspect, the conductive ball according to the present invention is for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit substrate having the electrode portion to each other. The conductive ball is characterized by including a substantially ball-shaped rigid core and a conductive coating layer formed of a solder material, which is coated around the core.

The conductive ball according to the present invention, according to claim 100, is for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion to each other. The conductive ball includes a core having a substantially spherical shape made of at least one of a highly rigid metallic material and an inorganic material, and a conductive coating layer formed of a solder material and coated around the core. I am trying.

In the conductive ball according to the present invention, according to claim 101, the conductive coating layer of the conductive ball is sandwiched between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. It is characterized in that the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are electrically and mechanically connected to each other by being melted by being heated in the state.

The conductive ball according to the present invention, according to claim 102, is characterized in that the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface.

The conductive ball according to the present invention is characterized in that, according to claim 103, the outer peripheral surface of the core is formed into a smooth curved surface. According to claim 104, the conductive ball according to the present invention is characterized in that the outer peripheral surface of the conductive coating layer is formed in an uneven shape.

According to the description of claim 105, the conductive ball according to the present invention is characterized in that the inner peripheral surface of the conductive coating layer is formed in an uneven shape. According to claim 106, the conductive ball according to the present invention is characterized in that the outer peripheral surface of the core is formed in an uneven shape.

In the conductive ball according to the present invention, according to claim 107, the conductive coating layer is made of a material having an electric resistivity of 1.6E-8 to 10E-8Ω · m. It is characterized by that. According to claim 108, the conductive ball according to the present invention is characterized in that the conductive coating layer has a thickness of 1 to 50 μm.

The conductive ball according to the present invention, according to claim 109, is characterized in that the conductive coating layer has a thickness of 3 to 20 μm. Further, the conductive ball according to the present invention is defined by claim 1.
According to the description of 10, the core has a diameter of 3 to 5
It is characterized by being set to 00 μm.

Further, according to the conductive ball of the present invention, according to claim 111, the core has a diameter of 1 mm.
It is characterized by being set to 0 to 200 μm. Further, the conductive ball according to the present invention is characterized in that
According to the description of 2, the core has a displacement of 5% in diameter when a load required for connection between both electrodes is applied.
It is characterized by having the following rigidity.

Further, in the conductive ball according to the present invention, according to claim 113, the core has a displacement amount of a diameter of 1 when a load required for connection between both electrodes is applied. It is characterized by having rigidity such that it is less than or equal to%. According to claim 114, in the conductive ball according to the present invention, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrode connected at Rmax, It is characterized in that it is less than twice the film thickness.

The conductive ball according to the present invention is characterized in that, according to claim 115, the particles are fine and hard metal material made of inorganic material. According to claim 116, in the conductive ball according to the present invention, the size of the particles is larger than 1/10 of the thickness of the electrode, and the thickness of the conductive coating layer and the thickness of the electrode are It is characterized by being set smaller than the total thickness.

In the conductive ball according to the present invention, according to claim 117, the size of the particles is larger than 1/10 of the thickness of the electrode, and the thickness of the conductive coating layer is It is characterized in that it is set smaller than half the total thickness of the electrodes. According to claim 118, the conductive ball according to the present invention is characterized in that the particles are embedded in a partially exposed state over the entire circumference of the conductive coating layer.

[0184] Further, in the conductive ball according to the present invention, according to claim 119, the particles are embedded in a state in which the particles are partially exposed only in a portion of the conductive coating layer to which the corresponding electrode is connected. It is characterized by that.

The conductive ball according to the present invention is characterized in that, according to claim 120, the particles are embedded in a partially exposed state on the surface of the conductive coating layer.

According to the structure described in Item 121, the conductive ball according to the present invention is such that the particles are embedded in the surface of the conductive coating layer in a partially exposed state and are not exposed at all inside. It is characterized by being buried in a state.

Further, the conductive connecting member according to the present invention is
According to the description of claim 122, in the electrically conductive connecting member used for connecting the mutual electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion,
A conductive coating layer is provided around a core having a substantially ball-shaped rigidity, and at least one conductive ball having fine and hard particles dispersed in a state where a part of the conductive coating layer is exposed, and the conductive ball. A holding sheet for embedding and holding, which is made of a material having an electrical insulating property, a part of the conductive ball is projected and exposed from one surface, and a part of the conductive ball is projected and exposed from the other surface. Therefore, a holding sheet for holding the conductive balls is provided.

Further, the conductive connecting member according to the present invention is
According to claim 123, the conductive ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, so that the electrode portion of the electric circuit element and the one surface of the holding sheet are contacted with each other. Electrically and mechanically between the protruding portion of the conductive ball covering layer and between the electrode portion of the electric circuit board and the protruding portion of the conductive ball covering layer from the other surface of the holding sheet. The feature is that they are connected to each other.

Further, the conductive connecting member according to the present invention is
According to the description of claim 124, in the electrically conductive connecting member used for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion,
A core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material, a conductive coating layer formed of a material having electrical conductivity and coated around the core, and a conductive coating layer A conductive ball comprising fine and hard particles dispersed in a state where a part is exposed, and a holding sheet for holding at least one conductive ball embedded therein.
Holds the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. And a holding sheet for holding the sheet.

Further, the conductive connecting member according to the present invention is
According to claim 125, the conductive ball is pressure-contacted by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, so that the electrode portion of the electric circuit element and one surface of the holding sheet are contacted with each other. Between the protruding portion of the conductive ball covering layer and between the electrode portion of the electric circuit board and the protruding portion of the conductive ball covering layer from the other surface of the holding sheet are electrically and It is characterized by being mechanically connected to each other.

Further, the conductive connecting member according to the present invention is
According to claim 126, the conductive coating layer of the conductive ball is metal-bonded to the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, respectively.

The conductive connecting member according to the present invention is
According to the description of claim 127, in the conductive connecting member used for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion,
At least one conductive ball provided with a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball, which have electrical insulation properties. And a holding sheet for holding the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. It is characterized by having.

Further, the conductive connecting member according to the present invention is
According to the description of claim 128, in the electrically conductive connecting member used for connecting the electrode portions of the electric circuit element having the electrode portion and the electric circuit board having the electrode portion,
A conductive ball having a core having a substantially spherical shape made of at least one of a highly rigid metallic material and an inorganic material, a conductive coating layer formed of a solder material and coated around the core, and the conductive ball, A holding sheet for embedding and holding at least one or more, which is formed of a material having an electrical insulating property, in which a part of the conductive ball projects and is exposed from one surface, and a part of the conductive ball is formed from the other surface. And a holding sheet for holding the conductive balls so as to project and expose.

The conductive connecting member according to the present invention is
According to claim 129, the conductive ball is pressed against and heated by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to heat the electrode portion of the electric circuit element and the electric circuit board. It is characterized in that it is electrically and mechanically connected to the electrode portion of the above through a molten solder.

The conductive connecting member according to the present invention is
According to claim 130, the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface.

Further, the conductive connecting member according to the present invention is
According to claim 131, the outer peripheral surface of the core is formed into a smooth curved surface.
A conductive connecting member according to the present invention has a structure according to claim 132.
According to the above description, the outer peripheral surface of the conductive coating layer is formed in an uneven shape.

The conductive connecting member according to the present invention is
According to claim 133, the inner peripheral surface of the conductive coating layer is formed in an uneven shape. According to claim 134, the conductive connecting member according to the present invention is characterized in that the outer peripheral surface of the core is formed in an uneven shape.

Further, the conductive connecting member according to the present invention is
According to a 135th aspect, the conductive coating layer is formed of a material having an electric resistivity of 1.6E-8 to 10E-8Ω · m. According to a 136th aspect, the conductive connecting member according to the present invention is characterized in that the conductive coating layer has a thickness of 1 to 50 μm.

Further, the conductive connecting member according to the present invention is
According to claim 137, the conductive coating layer has a thickness set to 3 to 20 μm. The conductive connecting member according to the present invention is characterized in that, according to claim 138, the core has a diameter set to 3 to 500 μm.

Further, the conductive connecting member according to the present invention is
According to claim 139, the core is characterized in that its diameter is set to 10 to 200 μm. According to claim 140, in the conductive connecting member according to the present invention, the core has a diameter displacement of 5% or less when a load required for connection between the two electrodes is applied. It is characterized by having rigidity such that

Further, the conductive connecting member according to the present invention is
According to claim 141, the core has a rigidity such that the displacement amount of the diameter thereof is 1% or less when a load required for connection between both electrodes is applied. Is characterized by. In addition, the conductive connecting member according to the present invention,
According to claim 142, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrodes connected at Rmax, and is not more than twice the film thickness of the conductive coating layer. It has a feature.

The conductive connecting member according to the present invention is
According to claim 143, the particles are characterized in that the fine and hard metal material is also formed of an inorganic material. In addition, the conductive connecting member according to the present invention,
According to claim 144, the size of the particles is set to be larger than one tenth of the thickness of the electrode and smaller than the sum of the thickness of the conductive coating layer and the thickness of the electrode. It is characterized by being.

The conductive connecting member according to the present invention is
According to claim 145, the size of the particles is set to be larger than 1/10 of the thickness of the electrode and smaller than half of the total thickness of the conductive coating layer and the thickness of the electrode. It is characterized by being done. Further, according to claim 146, the conductive connecting member according to the present invention is characterized in that the particles are embedded in a partially exposed state over the entire circumference of the conductive coating layer.

Further, the conductive connecting member according to the present invention is
According to claim 147, the particles are embedded in a state in which only a portion of the conductive coating layer to which the corresponding electrode is connected is exposed.

Further, the conductive connecting member according to the present invention is
According to claim 148, the particles are embedded in the surface of the conductive coating layer in a partially exposed state.

Further, the conductive connecting member according to the present invention is
According to claim 149, the particles are embedded in the surface of the conductive coating layer in a partially exposed state, and are embedded in the inside in a state of not being exposed at all.

According to the method of manufacturing a conductive connecting member according to the present invention, there is provided an electric circuit element having an electrode portion and an electric circuit board having an electrode portion.
In a method for manufacturing a conductive connecting member used for connecting electrode portions to each other, a conductive coating layer is provided around a core having a substantially ball-shaped rigidity, and a part of the conductive coating layer is exposed. A first step of sandwiching at least one conductive ball in which fine and hard particles are dispersed with the lower mold and the upper mold separated from each other by a predetermined distance, and a synthetic resin between the lower mold and the upper mold. And a third step of releasing the molding material from the lower mold and the upper mold, and etching both upper and lower surfaces of the molded material released from the mold to form upper and lower surfaces of the synthetic resin holding sheet. From the above, a fourth step of exposing the upper and lower portions of the conductive ball so as to project therefrom is provided.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 151, an electric circuit element having an electrode portion and an electric circuit board having an electrode portion are formed.
In a method for manufacturing a conductive connecting member used for connecting electrode portions to each other, a conductive coating layer is provided around a core having a substantially ball-shaped rigidity, and a part of the conductive coating layer is exposed. A first step of placing a lower part of at least one conductive ball having fine and hard particles dispersed therein in a first recess of the lower mold; and a second recess corresponding to the first recess of the lower mold. A second mold for covering the upper mold having the recess so that the upper part of the conductive ball is housed in the second recess;
And a third step of filling a synthetic resin between the lower mold and the upper mold, a fourth step of releasing the molding material from the lower mold and the upper mold, and A fifth step of etching the upper and lower surfaces to expose the upper and lower portions of the conductive ball so as to project from the upper and lower surfaces of the synthetic resin holding sheet, respectively.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 152, an electric circuit element having an electrode portion and an electric circuit board having an electrode portion are formed.
In a method of manufacturing a conductive connecting member used for connecting electrode portions of each other, at least one conductive ball having a conductive coating layer formed of a solder material provided around a core having a substantially ball-shaped rigidity, A first step of sandwiching the lower mold and the upper mold in a state where they are separated by a predetermined distance, a second step of filling a synthetic resin between the lower mold and the upper mold, and the lower mold and the upper mold. And a third step of releasing the molding material from the mold, and etching the upper and lower surfaces of the released molding material to expose the upper and lower parts of the conductive ball protruding from the upper and lower surfaces of the synthetic resin holding sheet, respectively. And a fourth step.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 153, an electric circuit element having an electrode portion and an electric circuit board having an electrode portion are formed.
In a method for manufacturing a conductive connecting member used for connecting electrode portions to each other, a lower part of at least one conductive ball in which a conductive coating layer formed of a solder material is provided around a core having a substantially ball-shaped rigidity. In the first recess of the lower mold and the upper mold in which the second recess corresponding to the first recess of the lower mold is formed in the second recess. A second step of covering the upper part of the conductive ball so as to be housed therein, a third step of filling a synthetic resin between the lower mold and the upper mold, and a molding material from the lower mold and the upper mold. A fourth step of releasing the mold, and etching the upper and lower surfaces of the released molding material to remove it from the upper and lower surfaces of the synthetic resin holding sheet.
A fifth step of exposing the upper and lower portions of the conductive ball so as to project therefrom is provided.

Further, in the method for manufacturing a conductive connecting member according to the present invention, according to claim 154, the first and second recesses have a depth smaller than the radius of the conductive ball. It is characterized by being formed.

According to the method of manufacturing a conductive connecting member of the present invention, the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface. Further, according to the method of manufacturing a conductive connecting member according to the present invention, according to claim 156, the outer peripheral surface of the core is formed in a smooth curved surface shape.

According to the method of manufacturing a conductive connecting member according to the present invention, the outer peripheral surface of the conductive coating layer is formed in an uneven shape. According to claim 158, the method of manufacturing a conductive connecting member according to the present invention is characterized in that the inner peripheral surface of the conductive coating layer is formed in an uneven shape.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 159, the outer peripheral surface of the core is formed in an uneven shape. Further, according to a method of manufacturing a conductive connecting member according to the present invention, according to claim 160, the conductive coating layer comprises:
It is characterized by being formed of a substance having an electric resistivity of 1.6E-8 to 10E-8Ω · m.

[0215] Further, the manufacturing method of the conductive connecting member according to the present invention is characterized in that, in claim 161, the film thickness of the conductive coating layer is set to 1 to 50 µm. Further, the conductive connecting member manufacturing method according to the present invention is characterized in that, in claim 162, the conductive coating layer has a thickness of 3 to 20 μm.

According to the 163rd aspect of the present invention, there is provided a method of manufacturing a conductive connecting member according to the
The feature is that the diameter is set to 3 to 500 μm. According to claim 164, the method of manufacturing a conductive connecting member according to the present invention is characterized in that the core has a diameter set to 10 to 200 μm.

According to a 165th aspect of the present invention, there is provided a method of manufacturing a conductive connecting member according to the invention,
It is characterized by having rigidity such that the displacement amount of the diameter becomes 5% or less when a load required for connection between both electrodes is applied. According to claim 166 of the method for manufacturing a conductive connecting member according to the present invention, the core has a displacement amount of a diameter when a load required for connection between both electrodes is applied. It is characterized by having a rigidity of 1% or less.

Further, in the method for manufacturing a conductive connecting member according to the present invention, according to claim 167, the size of the unevenness of the conductive coating layer is 10% or more of the film thickness of the electrode connected with Rmax. And is less than or equal to twice the film thickness of the conductive coating layer. According to claim 168, the method for manufacturing a conductive connecting member according to the present invention is
The particles are characterized in that the fine and hard metallic material is also formed from an inorganic material.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 169, the size of the particles is larger than 1/10 of the thickness of the electrode, and the conductive coating is formed. It is characterized in that it is set smaller than the total of the thickness of the layer and the thickness of the electrode.

According to the method of manufacturing a conductive connecting member according to the present invention, the size of the particles is larger than one tenth of the thickness of the electrode, and the conductive coating is used. It is characterized in that it is set to be less than half of the total of the layer thickness and the electrode thickness.

Further, according to the method of manufacturing a conductive connecting member according to the present invention, according to claim 171, the particles are
It is characterized in that the conductive coating layer is embedded so as to be partially exposed over the entire circumference. According to claim 172, in the method for manufacturing a conductive connecting member according to the present invention, the particles are embedded in a state in which only a part of the conductive coating layer to which a corresponding electrode is connected is exposed. It is characterized by being done.

According to the method of manufacturing a conductive connecting member according to the present invention, according to claim 173, the particles are
It is characterized in that it is embedded in a partially exposed state on the surface of the conductive coating layer.

According to the 174th aspect of the present invention, in the method for producing a conductive connecting member, the particles are
It is characterized in that it is embedded in a partially exposed state on the surface of the conductive coating layer, and is embedded inside in a completely unexposed state. The gist of the first invention of this application will be described in detail below.

As the electric circuit element in the present invention,
For example, a semiconductor element (diode, IC, LSI, etc.) in which an electric circuit is formed in a semiconductor material, a package including these elements, and the like are used.

Examples of the semiconductor package include a metal tube, a ceramic and a plastic package, and a package in which at least one semiconductor element is connected to a small substrate.

Furthermore, if the semiconductor element has a photoelectric conversion element (for example, a photodetector, a light receiving sensor such as a CCD, a light emitting element such as an LED, an LD, a surface emitting LD, or a composite thereof), The effect of the present invention is remarkable.

Each of these electric circuit elements has an electrode portion for electrically connecting to the outside, and the number and shape of the electrode portions are not limited in the present invention. However, the greater the number, the more remarkable the effect of the present invention. Further, the existence position of the electrode portion does not matter, but the effect of the present invention becomes more remarkable as it exists inside the electric circuit element.

As the electric circuit board, for example, a printed circuit board in which a wiring pattern made of an electrically conductive material is provided on an insulating material or a substrate whose metal surface is subjected to insulation treatment
Examples include ceramic substrates, glass substrates, metal core substrates, flexible substrates, glass epoxy substrates, and silicon substrates.

Furthermore, if this electric circuit board has a portion that transmits light, the effect of the present invention becomes more remarkable by combining it with a light receiving element or a light emitting element as an electric circuit element.

The wiring pattern is provided with electrode portions for connecting to the positions corresponding to the arrangement of the respective electrode portions of the electric circuit element. Further, even if a protective film made of an insulating material is provided on the wiring pattern other than the electrode portion, the present invention does not cause a problem. Further, even if the electric circuit board has a multilayer wiring pattern therein, there is no problem in the present invention.

These electrode portions provided on the electric circuit element and the electric circuit board have their electrode materials exposed to the atmosphere, so that the surface of the electrodes is not affected by the oxide film of the electrode materials and the adsorbed contaminants. A contamination film (for example, dust, organic matter, sulfide, etc.) is formed. These films serve as a barrier to prevent the movement of electrons and atoms, hinder the connection by metallization and / or alloying with the connecting material, and cause a connection failure. Therefore, these films must be destroyed at the time of connection.

However, in the first aspect of the invention, the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are connected by metalization and / or alloying using the conductive balls as the connecting material.

There are two forms of connection. A mode in which a conductive part path is interposed between the electrode part of the electric circuit element and the electrode part of the electric circuit board so as to be connected at once, and after connecting either one of the electrode parts and the conductive part path, the other electrode It is a form of connecting with a section.

Connection by metallization and / or alloying means
This is a connection for joining at a temperature equal to or lower than the melting point of a metal, that is, a joint having at least a solid solution phase at the time of joining. The heating temperature at the time of connection is 100 to 400 ° C., and a known method can be used as a heating method. For example, the thermocompression bonding method,
A thermocompression bonding method using ultrasonic waves, a high frequency heating method, an induction heating method and the like can be used.

In the conductive ball according to the first aspect of the present invention, a core having a substantially spherical shape made of one or both of a highly rigid metal material and / or an inorganic material, and at least the surface of the periphery of the core, which is exposed, is conductive. And a conductive coating layer coated with a material having

The core is made of a material having high rigidity. The rigidity (stiffness) is u = αP when the displacement P of the object is displaced when a load P is applied to the object.
Thus, in the elastic body, the displacement amount u is proportional to the load P.
The reciprocal (1 / α) of this proportional constant α is called stiffness (pp. 291, Machine Term Dictionary, Corona Co., Ltd.,
1972). That is, the smaller the amount of deformation with respect to the load, the higher the rigidity (large).

The rigidity of the first aspect of the invention is such that, when a load necessary for connection is applied, for example, assuming that it is an elastic body, its displacement amount is 5% or less with respect to the initial core diameter dimension. It does not change. In the case of the present invention, the smaller the deformation of the core, the more preferable, and the displacement amount is more preferably 1% or less.

For example, the core diameter is φ10 to 100 μm.
, The load per conductive ball required for connection (1 g
˜200 g) and heating (100 to 400 ° C.), the following materials are highly rigid materials that deform less than 1% with respect to the initial shape and size. .

For example, as the metal material, carbon steel, molybdenum steel, manganese molybdenum steel, manganese molybdenum nickel steel, nickel steel, chrome molybdenum steel, nickel chrome molybdenum steel, manganese steel, manganese chrome steel, stainless steel, W, Mo is used. , Ti, Ta, and one or more alloys.

As inorganic materials, Si, SiO2, Al2
O3, AlN, c-BN, diamond, blue glass (soda glass), white glass and carbides such as W, Mo, Ti and Ta,
There are nitrides, borides, silicides and the like. Furthermore, these composites can also be used as the material of the core.

When the core is made of a metal material, the core can also serve as a conductive path, so that the allowable current can be increased by reducing the connection resistance. When the core is made of an inorganic material, the electric circuit element and the electric circuit can be made. Since the thermal expansion coefficient is close to the thermal expansion coefficient of the substrate, the thermal stress related to the connection portion can be relaxed.

As the shape of the core, a sphere is desirable for the following reasons. (1) Always make point contact with a plane.
(2) Since it has a three-dimensionally symmetric shape, there are no restrictions when arranging it. (3) Since there is no edge portion, the surface can be covered uniformly. (4) The central part has the largest cross-sectional area and is less likely to buckle when pressed.

The size of the core can be selected from any size up to a diameter of 3 to 500 μm depending on the size of the electrode portion to be connected, but the diameter is 10 μm to 20 μm.
0 μm is the pitch between the electrodes of the semiconductor element (80 μm to 300 μm).
μm) is more desirable.

With the minimum size of 3 μm, the thickness of the insulating layer made of SiO 2 or Six N 1 -x covering the surface of the semiconductor element is usually about 1 μm.
It has fallen from the surface of the semiconductor element at least. Therefore,
When joining to a circuit board having the same configuration, at least a space of 1 μm is provided between the semiconductor element surface and the circuit board surface,
The minimum size is required to prevent the semiconductor element from short-circuiting at its side end. The above-mentioned numerical values are values that can at least satisfy this requirement.

The maximum size of 500 μm is required to be large enough to easily form and connect wiring when a printed circuit board is used as a substrate to be connected to a semiconductor element. The above-mentioned numerical values are values that can at least satisfy this requirement.

Regarding the variation in the diameter of the core, one having a diameter of 1% to 10% of the normal diameter is arbitrarily selected and used in the design according to the object to be connected.

Furthermore, by classifying this core with higher accuracy, the diameter of the selected core is ± 1.
It is possible to realize a core having a very sharp particle size distribution of μm to ± 2 μm or less.

The conductive coating layer for coating the surface of the core is made of a metal material in order to contact the electrode portion on the surface of the conductive coating layer for electrical connection, and to metalize and / or alloy with the electrode material for connection. It is formed. This conductive coating layer is easily deformed by pressure and heating at the time of connection, and the friction with the electrode due to its movement destroys the natural oxide film and the contaminated film on the electrode surface to expose the intrinsic surface of the electrode. ,
A soft metal that is easily deformed by pressure is preferable.

As such a metal material, gold is preferable in terms of stability and softness, but any metal or alloy other than gold can be used. For example, C
Examples thereof include u, Al, In, Sn, Pb, Ag and alloys containing these as the main components.

Further, the conductive coating layer may be formed of a plurality of layers as long as the layer exposed on the surface has the above characteristics. For example, Pd, Ti, Cr, Ni and alloys containing these as the main components as an adhesion layer for achieving adhesion with the core, and further as a barrier layer for preventing diffusion of the adhesion layer and the metal layer exposed on the surface. Ni, Pt, AgW, P
There is no problem even if d and an alloy containing them as a main component are provided in areas other than the exposed surface layer.

These materials form a conductive coating layer on the surface of the core by electrolytic or electroless plating or vapor deposition. In the area other than the area connected to each electrode part, even if there are some defects in the conductive coating layer provided on the core surface due to variations in coating, it is possible to conduct electricity between the electrodes connected as conductive paths. If it doesn't matter. The electric resistivity of this conductive coating layer is 1.6E-
It is preferably 8 to 10E-8Ω · m.

Depending on the manufacturing method of the holding sheet and the core material, the thickness of the conductive coating layer of the conductive balls in contact with the holding sheet may be thinner than that of the other layer, or may not be necessary.
If not, the holding sheet and core are in contact. In this case, the core material needs to be electrically conductive.

The thickness of this conductive coating layer is from 1 μm to
The thickness up to 50 μm can be arbitrarily selected depending on the structure of the electrode part to be connected, the diameter of the core used, and the metal material to be coated. In order to make a connection with a semiconductor element, about 3 to 20 μm is more desirable from the viewpoint of the electrode portion film thickness of the semiconductor element and the core diameter to be used. However, the thickness is preferably thicker than the width of variation in the diameter of the core in order to prevent the semiconductor element from being tilted and not being sufficiently connected when the connection is made due to the variation in the core diameter.

The minimum thickness of the conductive coating layer is 1 μm.
Is usually 1 μm in thickness of aluminum, which is the electrode part of the semiconductor element.
It is a value that is required in order to carry out metallization and alloying, and to require the same or more thickness.

On the other hand, the maximum thickness of the conductive coating layer is 50 μm.
Is a value required to prevent a temperature rise during energization by having a sufficient cross-sectional area as a conductive path even when the inter-electrode distance becomes long when the maximum core diameter is 500 μm.

It is more preferable that the conductive balls having such a structure have extremely uniform shapes by classification of the core and, if necessary, classification after forming the conductive coating layer.

By sandwiching this uniform conductive ball between the electrodes to be connected and applying pressure, first, a large pressure is generated at the point contact point of the conductive coating layer which is in point contact with the electrode,
The conductive coating layer and the electrodes start to deform. At this time, since the core has a high rigidity and is hardly deformed, the pressing force concentrates on the deformation of the conductive coating layer and the electrode.
Furthermore, since the spherical core has an angle that is always open to the outside (around the contact point) with respect to the plane having the electrode portion, the pressed conductive coating layer is directed outward from the contact point. Easy to move (discharge).

In the process of deforming the conductive coating layer and the electrode which concentrically expands the contact surface around the contact point, the oxide film and the contaminated film existing on the electrode surface and the conductive coating layer surface are destroyed by the deformation, And the intrinsic surface of the conductive coating layer are exposed,
Will contact each other.

By heating at 100 to 400 ° C. in this state, atoms are diffused in the solid state at the joint between the two, and a joint layer composed of a solid solution or an intermetallic compound is formed on the joint surface. The electrode portion and the conductive coating layer are alloyed and connected. For example, when Au is used as the material of the conductive coating layer and Al used in the ordinary semiconductor element is used as the material of the electrode portion, the heating temperature is 200 to 350 ° C. and the two are connected by alloying. It will be.

As described above, the main feature of the first invention is that the conductive ball further destroys the oxide film and the contaminated film on the electrode surface in the connection process to expose the intrinsic surface more widely. As a result, the bondability due to metallization and / or alloying is improved.

A concrete method is to provide fine and hard particles in the conductive coating layer to enhance the destructiveness of the oxide film and the contaminated film. The fine and hard particles may be present inside the conductive coating layer, may be exposed from the conductive coating layer and protrude, or may be both. Furthermore,
The fine and hard particles may be present only in the region that contributes to the connection of the conductive coating layer.

In the connection process in which the conductive coating layer destroys the oxide film on the electrode surface, first, the fine and hard particles of the conductive coating layer are
The oxide film is destroyed because a large force is exerted on the electrode surface. Further, in this connection process, the particles pressurize at the contact point with the electrode, so that the deformation direction of the electrode becomes random. Therefore, the oxide film is broken down more finely.

In the connection process described above, in order to exert a large force on the electrode surface, the hardness of the particles is preferably harder than that of the electrode material and the conductive coating layer material.

As the material of fine and hard particles, for example,
Iron, carbon steel, molybdenum steel, manganese molybdenum steel, manganese molybdenum nickel steel, nickel steel, chrome molybdenum steel, nickel chrome steel, nickel chrome molybdenum steel, manganese steel, manganese chrome steel, stainless steel,
A metal material that is an alloy of one or more of W, Mo, Ti, and Ta can be used.

Furthermore, as the material of the fine and hard particles, as the inorganic material, Si, SiO2, AlO3, AlN, c
-BN, diamond, blue glass (soda glass), white glass, and carbides such as W, Mo, Ti, and Ta, nitrides, borides, silicides, and the like can be given.

Such fine and hard particles have a certain distribution in their size. Therefore, in the first invention, the maximum particle size is used as the size of the fine and hard particles. Assuming that the maximum particle size of the fine and hard particles is c, the film thickness of the conductive coating layer is a, and the film thickness of the electrode portion is b, the size of the fine and hard particles is preferably b / 10 <c <a + b. Preferably b /
10 <c <(a + b) / 2.

The maximum particle diameter c is 10% of the film thickness b of the electrode portion.
When it is below, the effect of destroying the oxide film by the fine and hard particles becomes weak. This is a size that can be stably destroyed because the oxide film is usually several% of the film thickness of the electrode portion.

On the contrary, when the maximum particle diameter c becomes larger than the sum of the film thickness a of the conductive coating layer and the film thickness b of the electrode portion, the electrode film and the conductive coating layer are respectively penetrated to form an electric circuit element. High pressure may be applied to the existing board and the electric circuit board to break them. More preferably, fine and hard particles having a large particle size, when remaining in the connection portion, in order to avoid a decrease in the bonding area, the maximum particle of half or less of the total thickness of the conductive coating layer and the electrode film thickness. Diameter is desirable.

Further, in the case of connecting an electric circuit element using a substrate which is weak against pressure, for example, an LED using a GaAs substrate, a surface emitting LD or a strain gauge using a Si substrate, in order to avoid damage to the substrate, an electrode film is formed. A maximum particle size of less than or equal to the thickness is preferred.

For example, the Al electrode, which is the electrode portion of the semiconductor element, has a film thickness of about 1 μm, but the oxide film thickness on the surface is several hundred angstroms, so 10% of the film thickness of 1 μm = 0.1 μm. If the particles have the above grain size, the effect of destroying the oxide film can be obtained.

In connection with such a semiconductor element, the particle size is more preferably about 0.1 to 2 μm. The area distribution in which these particles are provided will be described in the contact area of the conductive balls described later.

The contact area between the conductive balls and the electrodes is as follows. That is, the change in the thickness of the conductive coating layer at the connection portion due to pressure gradually decreases from the initial thickness along with the deformation movement from the contact point, until the electrode reaches a thickness of zero at which it contacts the core. Ends with Therefore, the theoretical maximum contact area excluding the swelling around the moved conductive coating layer is the cross section of the conductive ball, where R is the radius of the core, a is the thickness of the conductive coating layer, and rmax is the maximum contact circle radius. From the shape, rmax = SQR (a ^ 2 + 2aR)
{Here, the notation a ^ 2 indicates a square of a. The same applies hereinafter, and the circle with this radius becomes the maximum contact area calculated.

It can be seen that the region portion of the surface of the conductive coating layer where at least the particles are to be connected is a circular arc from the contact point to rmax in this sectional shape. The larger the number of particles provided in this region is within the range of satisfying the size, the more effectively the particles are provided. Further, even if particles are provided on the surface of the conductive coating layer other than this area portion, there is no problem in the present invention.

The intervals between the electrodes to be connected are as follows. That is, since the shape of the conductive balls is symmetrical, the deformation of each conductive coating layer at the connecting portion with the electric circuit element and the connecting portion with the electric circuit board is also substantially symmetrical. Usually, the semiconductor element to be connected has a plurality of electrode portions. When the number of electrode portions of this semiconductor element is n, the number of conductive balls used for connection is n or more, and the diameters of the cores of these conductive balls are d1, d2, d3, ..., dn, respectively. The minimum and maximum of these core diameters are dmin,
Let dmax.

Due to the rigidity of the core, the conductive coating layer is largely deformed and moved due to the rigidity of the core as described above due to the pressure applied at the time of connection, and the thickness at the connection portion is reduced. The distance between the part and the electrode part of the electric circuit board is the sum of the diameter of the core which hardly deforms and the thickness of the slightly alloyed joining layer remaining between the core and the electrode part after deformation,
The distance between the n electrodes is dmin to dmax at the minimum, but may be slightly larger than dmax.

Further, in the present invention, the size of the particles may be added by providing the particles on the surface of the conductive coating layer. Therefore, the distance between the electrodes in the present invention means that the diameter of the core includes the above-mentioned variation of the core and the size of the sandwiched particles.

Therefore, the higher the shape and size of the core, the higher the distance between the electrodes, and the more accurately the distance between the semiconductor element and the substrate becomes.

In the first aspect of the invention, since the conductive balls are manufactured separately from the electric circuit element, it is possible to classify only the conductive balls with extremely high accuracy. Therefore, the distance between the electric circuit element and the electric circuit board can be formed with high accuracy with an accuracy of 1 μm or less. As a result, it becomes possible to form the gap between the electric circuit element and the electric circuit board with an accuracy of 1 to 2 μm or less with high accuracy.

When manufacturing an electric circuit part, a method for disposing the conductive balls at positions corresponding to the electrode parts is as follows.
There are two ways.

The first method is a method of arranging each conductive ball on the electrode with tweezers or the like.

The second method is to use a holding sheet. In this case, the sheet is held in close contact with the sheet material at the position where the conductive balls are arranged. Therefore, the conductive ball and the holding sheet can be integrally handled. Further, in the case of the second method, the conductive sheet is connected by the holding sheet while maintaining its position, so that the positional deviation of the conductive ball at the time of connection can be prevented. Therefore, the holding sheet used in the second method will be described in more detail.

The holding sheet holds the conductive balls so that the conductive balls are projected and exposed on both sides of the sheet at the predetermined positions where the conductive balls are arranged. This holding sheet holds the side surfaces of the conductive balls in a close contact with each other so as to be recessed toward both sides of the sheet, so that the conductive balls are prevented from falling off the sheet and are integrated with the conductive balls. Furthermore, when the protrusions and valleys provided on the surface of the conductive ball are also present in the portion in close contact with the sheet,
Adhesion will be improved.

The holding sheet is positioned so that the electrodes of the electric circuit element or the electric circuit board and the held conductive balls face each other, and then the holding sheet is arranged on the electric circuit element or the electric circuit board, so that the conductive balls are formed. Place on the electrode. At that time, the reference positioning pin is a jig or
It is possible to more easily arrange the conductive balls on the electrodes if they are provided on the electric circuit element or the electric circuit board and the holding sheet is provided with holes for receiving the positioning pins.

The thickness of the holding sheet is 1 μm to 50 μm.
Any size up to 0 μm can be used. However, it is desirable that the diameter is equal to or smaller than the diameter of the core in order to carry out without disturbing the deformation movement in the direction of increasing the contact area of the conductive coating layer material with the electrode portion at the time of connection. Therefore, the maximum thickness is the same as the maximum diameter of the core, and
The minimum thickness can be 1 μm or less, but there is a problem of strength at the time of arrangement, and therefore the minimum diameter is set to be the same.

In the case of the first invention, the thickness of the holding sheet is more preferably 10 μm to 200 μm. The holding sheet may be made of any material as long as it has electrical insulation. For example, an insulating resin may be used. Furthermore, when a resin is used, the type of the resin does not matter. Either a thermosetting resin or a thermoplastic resin may be used. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyethermide resin, polysulfone resin, silicone resin, fluorine resin, polycarbonate resin, polydiphenyl ether resin, polybenzyl imidazole resin,
Phenolic resin, urea resin, melamine resin, alkyd resin, epoxy resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin, polystyrene resin and other resins can be used.

Furthermore, if a resin having a good thermal conductivity or a resin containing a powder of an inorganic material having a good thermal conductivity (for example, diamond, c-BN, AlN, etc.) is mixed among these resins, an electric circuit can be obtained. Even if the element has heat, the heat can be dissipated through the resin, which is more preferable.

Furthermore, if a resin having the same or similar coefficient of thermal expansion as that of the electric circuit element or the electric circuit board is selected as the resin, slight displacement of the conductive balls at the time of connection due to thermal expansion and contraction is caused. It is also possible to prevent the deterioration of the reliability of the electric circuit component.

When a photoelectric conversion element is used as the electric circuit element, the light transmittance of these resin materials is made lower than that of air or glass or the transparent resin for sealing the photoelectric conversion element, and the light receiving portion or the light emitting portion of the photoelectric conversion element is used. If an opening is provided in a portion corresponding to (1) or a portion necessary for optical design, unnecessary light can be cut and the S / N of the optical signal can be improved. For example, with respect to the ghost light reflected on the surface of the light receiving element, even if the transmittance of the sheet material is only 10% lower, the ghost light intensity can be reduced by 19% by passing through the sheet twice at the time of incidence and at the time of reflection. You can

Similarly, in the case of a light emitting element, for example, in the light distribution emitted from the light emitting portion of an LED, peripheral light unnecessary for optical design is attenuated or cut by using a holding sheet material as a slit or a light blocking portion of a pinhole. However, it is possible to improve the S / N when the light receiving element receives an optical signal.
Further, since the resin covers the periphery of the conductive balls, it is possible to suppress the ghost light that causes the conductive balls to reflect even if gold having a high reflectance is used.

After connecting, the holding sheet may be removed after connecting the conductive balls. Furthermore, at this time, 2
There are two cases. One is after connecting with the electrode portion of either the electric circuit element or the electric circuit board, and in the other case after connecting with the electrode portion of both the electric circuit element and the electric circuit board.

In this case, the holding sheet may be completely removed or only a part thereof, for example, the vicinity of the peripheral portion of the electric circuit element may be removed. By removing it, the holding sheet does not protrude beyond the size of the electric circuit element, and a smaller electric circuit component can be obtained.

In the case of removing after connection, a conductive material can be used as the material of the holding sheet or the mask sheet. For example, carbon resin, aluminum, phosphor bronze,
Beryllium copper, 42 alloy, stainless steel, etc. Furthermore, a film of a conductive material may be provided on the surface of the holding sheet or the mask sheet made of an insulating material.

By giving a conductive function to ground a part of the holding sheet or the mask sheet, it is possible to prevent destruction of the electric circuit element due to static electricity accumulated until the connection, and to prevent the mask sheet from being damaged. In Case of,
Furthermore, when the conductive balls are arranged, the conductive balls are prevented from aggregating due to the generation of static electricity due to friction with the conductive balls,
The placement can be done reliably.

As described above, the gist of the first invention is that fine hard particles are formed in the conductive coating layer of the conductive ball including the spherical core made of a highly rigid material and the conductive coating layer surrounding the spherical core. By providing this, the oxide film or the contamination film existing on the surface of the electrode part of the electric circuit element and the electric circuit component is further destroyed, and a wider intrinsic surface is exposed to metallize and / or alloy to bond strength. Increased,
It is possible to improve the reliability of the connection.

Further, when a holding sheet that holds the positions of the conductive balls with high accuracy at the time of arrangement and connection is used, a higher density connection is possible, and when the holding sheet is removed after connection, a smaller size is achieved. An electric circuit component can be obtained.

Next, the gist of the second invention of this application will be described in detail only with respect to the points different from the gist of the first invention described above.

In the second aspect of the invention, the size of the electrode portion is preferably smaller than the cross-sectional area of the conductive balls used for the connection, which will be described later, from the viewpoint of the flow of solder during connection.
Further, for the same reason, the shape of the electrode portion is preferably a regular polygonal shape or a circular shape which is a target shape.

The position of the electrode portion does not matter, but the effect of the second invention becomes more remarkable as the electrode portion is located inside the electric circuit element.

As the structure of the electrode portion, since connection is made by solder, at least the surface layer of the electrode portion needs to be made of a material having good wettability. As the material having good wettability, for example, Cu, Ni, Sn, Pb, Ag, PbSn, brass,
Bronze, etc. For example, in the case of a semiconductor chip, since a normally used aluminum electrode has poor wettability with respect to solder, these metals are provided thereon. Further, these materials may be provided in multiple layers. For example, PbSn, Ni / Cu on Cu,
In some cases, a combination such as Ni / Cu / PbSn is used.

Further, the size of the electrode portion is preferably smaller than the cross section of the conductive ball used for the connection which will be described later from the viewpoint of the solder flow at the time of connection as in the case of the electric circuit element, and the shape of the electrode portion is The target shape is preferably a regular polygon or a circle. Further, in the structure of the electrode portion, at least the surface layer is made of a metal having a good solder wettability, like the electric circuit element.

Further, even if a protective film made of an insulating material is provided on the wiring pattern other than the electrode portion, this second
Invention does not cause a problem. Further, even if the electric circuit board has a multilayer wiring pattern therein, there is no problem in the second invention.

In the second aspect of the invention, the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are connected using the conductive ball as a connecting material. The connection is performed by heating above the melting point of the conductive coating layer material of the conductive balls to melt the conductive coating layer and metallize or alloy with the electrode portion. As a heating method, a known direction can be used. For example, hot plate heating method, hot tool heating method, hot gas heating method, laser heating method, infrared heating method, VPS
A heating method, a high frequency heating method, an induction heating method and the like can be used.

There are two cases for connection. A case where a conductive ball is interposed between the electrode part of the electric circuit element and the electrode bump of the electric circuit board to connect at one time, or when one of the electrode parts and the conductive ball is connected and then the other electrode part is connected This is the case when connecting. In the second aspect of the invention, since the conductive coating layer (solder) of the conductive balls is melted for connection, at least the surface layer of the electrode portion is a material having good wettability to the conductive coating layer material.

However, since the surface of the electrode and the surface of the conductive ball are exposed to the atmosphere, the polluted film (for example, dust, organic matter, sulfide, etc.) adsorbed on the oxide film of the electrode material and the conductive coating layer material is not formed. Has been formed. These films must be destroyed and removed because they impair the wettability and hinder the bonding. Therefore, at the time of connection, flux is used to remove these films for connection. As the flux, for example, WW rosin, weakly activated rosin or activated rosin flux can be used as the organic flux, or hydrogen gas, forming gas (H2-N2) or the like can be used as the inorganic flux.

When an organic flux is used, the flux may be washed in order to improve reliability.

The structure of the conductive ball in the second invention is substantially the same as that of the conductive ball in the second invention. However, the core forming the central portion of the conductive ball has a wettability with the solder material in order to coat the conductive coating layer material (solder material) described below on the spherical surface made of a material having high rigidity as described above. Sometimes a good metal layer is provided. Especially in the case of an inorganic material, this metal layer must be provided. This wettable metal is
For example, Cu, Ni, Sn, Pb, Ag, Zn, PbS
n, brass, bronze and the like.

The metal can be coated by a known method such as an electrolytic or electroless plating method, vapor deposition or the like. Its thickness is 0.01 μm to 1
About 0 μm is preferable. Further, more preferably, it is 0.5 in view of stability of wettability of the solder material (coverability of the conductive coating layer).
A thickness of μm to 5 μm is preferable.

The minimum thickness of 0.01 μm is because if the thickness is less than this, the coverage of the sphere surface is lowered and the coverage of the conductive coating layer becomes unstable. On the other hand, the maximum thickness of 10 μm is
This is because if the thickness is made larger than this, there is no effect on the coverage of the conductive coating layer.

The conductive coating layer for coating the surface of the core is melted by heating at the time of connection and metalized or alloyed with the electrode material for connection, and after connection, it becomes a conductive path between the electrodes. Therefore, the conductive coating layer is made of a conductive solder material. The solder material in the second invention is
It refers to an alloy or metal material having a melting point of 450 ° C. or lower. Examples of such a solder material include PbSn and Pb.
Ag, PbIn, PbCd, BiPb, BiSn, Bi
Cd, SnCd, SnZn, SnSb, SnAg, In
Sn, InPb, ZnCd, ZnAl, AuBi, Au
Sn, AuGe, AuSb, AuSi, AuIn, G
a, In, Sn, Bi, Cd, Pb, Zn, PbSnB
i, PbSnAg, BiPbSnCd, BiPbIn,
BiPbCd, BiPbSn, PbSnIn, BiPb
SnIn, BiPbSnInCd, etc. can be used.

The method for coating the core surface with these materials is as follows:
There are many. For example, an alloy or a metal layer may be directly provided on the surface of the core by electrolytic or electroless plating, or vapor deposition. Further, in the case of an alloy, each metal is preliminarily alloyed on the surface of the core by these methods. The layers may be provided in layers so that each has a specific volume, and then heated to melt. Further, when the atomizing method is applied and the solder particles are manufactured from the molten solder material in which the core is mixed and stirred, the core surface can be coated with the solder layer. Also, in the area other than the area connected to each electrode part, even if there are some defects in the conductive coating layer provided on the core surface due to variations in coating, it is possible to conduct electricity between the electrodes connected as conductive paths. If so, it does not matter.

The thickness of this conductive coating layer is from 1 μm to
The thickness up to 50 μm can be arbitrarily selected depending on the structure of the electrode part to be connected, the diameter of the core used, and the metal material to be coated. In order to make a connection with a semiconductor element, about 3 to 20 μm is more desirable from the viewpoint of the electrode portion film thickness of the semiconductor element and the core diameter to be used.

However, the thickness is thicker than the width of variation in the diameter of the core in order to prevent the semiconductor element from tilting and not being sufficiently connected when the connection is made due to the variation in the core diameter. preferable.

The minimum film thickness of 1 μm is because the aluminum film thickness of the electrode portion of the semiconductor element is usually about 1 μm, and the same or more thickness is required for metallization and alloying. On the other hand, the maximum membrane pressure of 50 μm is to prevent the temperature rise during energization by having a sufficient cross-sectional area as a conductive path even if the distance between the electrodes becomes long when the maximum core diameter of 500 μm is used. is there.

In the conductive ball having such a structure, the amount of solder can be controlled by the thickness of the conductive coating layer. Furthermore, if necessary, the amount of solder can be controlled with higher accuracy by performing classification after forming the conductive coating layer.

By heating and pressurizing by sandwiching the uniform conductive balls between the connected electrodes, first, the conductive coating layer in point contact with the electrodes is melted and easily moved. At this time, since the spherical core has an angle that is always open to the outside (around the contact point) with respect to the plane having the electrode portion, the conductive coating layer of the pressurized liquid layer is initially formed. Easy to move outward from the contact point. Since the core has high rigidity and is hardly deformed by pressure, there is no possibility of moving the core further outward after contact with the electrode.

In the moving process of the conductive coating layer which concentrically expands the contact surface around the contact point, the oxide film and the contaminant coating existing on the electrode surface and the conductive coating layer surface are removed by the flux, and the intrinsic surface of the electrode is removed. Are exposed and come into contact with the conductive coating layer of the liquid layer. In this state, atom diffusion or the like occurs in the joint portion, a joint layer made of a solid solution or a metal compound is formed on the joint surface, and the electrode portion and the conductive coating layer are alloyed and connected.

As described above, the main feature of the second invention is that in the connection process, the oxide film and the contaminated film on the electrode surface are removed by the flux to expose the intrinsic surface more widely. As a result, the bondability due to metallization and / or alloying is improved.

For example, as a material for the conductive coating layer, Pb
When Cu and Sn are used as the materials for the electrodes, the heating temperature is 180 to 350 ° C., and alloying is used for connection.

Further, by making the size of the electrode smaller than the cross-sectional layer of the conductive ball, the spread of the molten solder is suppressed, and the molten solder is prevented from entirely falling on the electrode portion. Therefore, the molten conductive coating layer other than the contact portion,
Continue to coat the periphery of the core due to the wettability with the core and the surface tension. Therefore, it can be a conductive path between the electrodes after solidification.

The intervals between the electrodes to be connected are as follows. A semiconductor element that is normally in contact has a plurality of electrode portions. If the number of electrode parts of this semiconductor element is n, the number of conductive balls used for connection is n or more,
The diameters of the cores of these conductive balls are d1, d2 and d, respectively.
3, ..., dn. The minimum and maximum core diameters are dmin and dmax.

Due to the heating and pressurization at the time of connection, these n conductive balls are melted by the rigidity of the core as described above, the conductive coating layer moves to the surroundings, and the thickness at the connection portion is reduced. The distance between the electrode part of the circuit element and the electrode part of the electric circuit board is the sum of the diameter of the core which is hardly deformed and the thickness of the slightly alloyed connection layer remaining between the core and the electrode part after the deformation. The minimum distance between electrodes is d
Although it is about min to dmax, it may be slightly larger than dmax.

Therefore, the distance between the electrodes in the second aspect of the invention is about the diameter of the core, which includes the variation of the core described above. Therefore, the higher the shape of the core is, the more accurate the distance between the electrodes is, and the more accurate the distance between the semiconductor element and the substrate becomes.

In the second invention, since the conductive balls are manufactured separately from the electric circuit element, it is possible to classify only the conductive balls with extremely high accuracy. Therefore, it is possible to form the gap between the electric circuit element and the electric circuit board with an accuracy of 1 to 2 μm or less with high accuracy.

When the electric circuit parts are manufactured, the conductive balls may be arranged at the positions corresponding to the electrodes.
In addition to the first and second methods described in the first invention, there is a third method.

The third method is a method using a mask sheet. In this case, a mask sheet having an opening at a position where conductive balls are arranged is positioned and arranged on an electric circuit element or an electric circuit strip. However, the conductive balls can be collectively arranged on each electrode. In this case, the mask sheet is not held in close contact with the conductive ball at the position where the conductive ball is arranged, and the mask sheet and the conductive ball are treated as separate parts.

In the case of the second and third methods, the conductive balls are connected by the respective sheet materials while maintaining their positions, so that the conductive balls can be prevented from being displaced at the time of connection.

The proper use of these three arrangement methods is not particularly limited. However, when the number of conductive balls to be arranged is large, the second and third methods are preferable from the viewpoint of the work time for arrangement, and the method of using the holding sheet is because the conductive balls are closely held. , More suitable for arranging and connecting conductive balls with higher accuracy,
The method of using the mask sheet is more suitable for arranging and connecting the medium-sized to large-sized conductive balls having loose positional accuracy at low cost.

Next, the mask sheet used in the third method will be described. The mask sheet is a sheet provided with an opening (hole) penetrating at a position corresponding to the position where the conductive balls are arranged. With respect to the size of the opening, when the number of conductive balls to be arranged in the opening is n and the diameter of the conductive ball is D, the size of the opening is set to be larger than nD and smaller than (n + 1) D so that a desired number of conductive balls can be formed. Can be placed at.

This mask sheet is positioned and arranged on the surface of the electric circuit element or the electric circuit component so that the opening is located above the electrode portion. In that case, positioning can be performed more easily if a positioning pin serving as a reference is provided on the jig, the electric circuit element, or the electric circuit board, and a hole is formed in the mask sheet to receive the positioning pin. In this way, after the mask sheet is arranged, the conductive balls are inserted into the openings by squeegee or vibration to arrange the conductive balls on the electrode portions.

The thickness of the mask sheet is preferably equal to or smaller than the diameter of the core, like the holding sheet. That is, 1 μm to 500 μm can be used, but 10 μm to 200 μm is more preferable. As the mask sheet material, the same material as the material for the holding sheet in the above-mentioned second method can be used.

According to the third method, it is possible to remove the mask sheet for cleaning flux after connecting the conductive balls. Furthermore, there are two cases at this time. One is after connecting with an electrode portion of either one of the electric circuit element or the electric circuit board, and in the other case after connecting with both electrode portions of the electric circuit element and the potential circuit board. .

Such a mask sheet can be removed by pulling the mask sheet in the horizontal direction or the vertical direction after connection so that the mask sheet is cracked and removed. Here, the mask sheet may be provided with slits or notches. The slits and notches are
It may be provided in a portion other than the opening portion of the mask sheet, or may be provided in the close contact holding portion or opening portion of the conductive ball or the outer peripheral portion of the mask sheet. Furthermore, the number, shape, and arrangement of them are not particularly limited.

By providing these slits and notches, when the mask sheet is removed, first cracks are generated from the tips of the slits and notches. The cracks reach the conductive balls and the openings and reach the openings, so that the mask sheet can be easily separated and removed. As a result, the mask sheet can be removed without applying an excessive stress to the connected conductive balls and the connecting portion.

As described above, the gist of the second invention is as follows.
By using the conductive coating layer of the conductive ball composed of a spherical core made of a highly rigid material and the conductive coating layer covering the periphery of the core as a solder material, the amount of solder can be controlled with high accuracy and further pressure is applied at the time of connection. Therefore, even if there is a variation in the amount of solder, it is possible to improve the reliability of the connection without causing the unbonding of the connection part or the short circuit between the adjacent electrode parts.

Furthermore, when a holding sheet or a mask sheet that holds the positions of the conductive balls in the configuration at the time of arrangement and connection is used, the connection can be performed with higher accuracy, and a smaller electric circuit component can be obtained.

[0336]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

(First Embodiment) FIG. 1A to FIG.
FIG. 3C is a sectional view schematically showing the configuration and manufacturing method of the first embodiment of the electric circuit component according to the present invention,
FIG. 2 is a cross-sectional view schematically showing the conductive balls shown in FIGS. 1A to 1C taken out, and FIG. 3 is a schematic view showing an example of a method for manufacturing the conductive balls shown in FIG. FIG.

In FIGS. 1B and 1B, reference numeral 1 indicates a semiconductor chip which is an electric circuit element. A plurality of aluminum electrodes 2 which are electrode portions are formed on one surface (lower surface in FIG. 1B) of the semiconductor chip 1. On the other hand, FIGS.
In (c), reference numeral 6 indicates a conductive ball. The conductive ball 6 includes a spherical core 4, a conductive coating layer 5 coated on the outer periphery of the core 4, and a large number of alumina particles 32 embedded in the conductive coating layer 5 as particles. Has been done.

Reference numeral 7 indicates a ceramic substrate which is an electric circuit substrate to which the semiconductor chip 1 is connected via the conductive balls 6, and the ceramic substrate 7 corresponds to the aluminum electrode 2. In this state, a plurality of gold-plated electrode portions 8 are provided. The surface of the ceramic substrate 7 on the side where the electrode portion 8 is provided is covered with the insulating protective film 3 except for the electrode portion 8.

In this first embodiment, FIG.
As shown in (c), the aluminum electrode 2 of the semiconductor chip 1 and the electrode portion 8 of the ceramic substrate 7 are connected using the conductive ball 6 in which a large number of alumina particles 32 are embedded in the surface of the conductive coating layer 5. It is done like this.

Therefore, first, a method of manufacturing the conductive balls 6 will be described, and then a method of manufacturing an electric circuit component formed by connecting the semiconductor chip 1 and the ceramic substrate 7 will be described.

As shown in FIG. 2, the conductive ball 6 has a spherical core 4 located at the center, a conductive coating layer 5 made of a conductive material for coating the outer periphery of the core 4, and the conductive coating layer 5. And alumina particles 32 dispersed in a state where a part of the particles are exposed on the surface of the.

First, the core 4 is a spherical body made of steel in the first embodiment, and has a diameter of 40 μm by precise polishing.
It is formed to have a spherical shape having a diameter of m. The surface (outer peripheral surface) of the core 4 is subjected to activation treatment with palladium, and then the surface of the core 4 is coated with gold to be the conductive coating layer 5 to a thickness of 5 μm by electroless plating.

Next, as shown in FIG. 3, alumina particles 32 having a particle diameter of 0.1 to 2 μm are arranged on a plate 33,
Then, the core 4 having the conductive coating layer 5 on the outer periphery is rotated on the plate 33 by the above-described method, or is slightly pressurized as necessary to rotate the core 4 so that the surface of the conductive coating layer 5 is alumina. The conductive balls 6 are manufactured by embedding the particles 32 in a dispersed state.

Next, a method of manufacturing an electric circuit part will be described. First, as shown in FIG. 1A, the conductive coating layer 5
The conductive balls 6 in which the alumina particles 32 are embedded on the surface of are placed on the electrode portion 8 on the ceramic substrate 7 by vacuum tweezers (not shown). Next, as shown in FIG. 1B, the semiconductor chip 1 and the conductive balls 6 are arranged on the electrodes 8 so that the aluminum electrodes 2 of the semiconductor chip 1 and the electrodes 8 of the ceramic substrate 7 face each other. The ceramic substrate 7 is positioned and arranged. After the semiconductor chip 1 has been arranged in this manner, the semiconductor chip 1 and the ceramic substrate 7 are positioned and arranged.

After the placement of the semiconductor chip 1 is completed, the semiconductor chip 1 and the ceramic substrate 7 are pressed and heated. By this pressure, the aluminum electrode 2 of the semiconductor chip 1
Then, the electrodes 8 of the ceramic substrate 7 and the conductive balls 6 in contact with both are deformed. Here, in the conductive ball 6, since the core 4 is made of steel having high rigidity, the core 4 is hardly deformed, and the conductive coating layer 5 made of gold that is soft and easily extends around the core 4 is deformed. At that time, the alumina particles 32 on the surface of the conductive coating layer 5 and the respective electrodes 2, 8
A large pressing force is generated at the contact portion with the oxide film and the contaminated film on the surfaces of the electrodes 2 and 8 are randomly destroyed, and the intrinsic surface of the electrode material forming the electrodes 2 and 8 is exposed. .

When the pressure is further applied, the conductive coating layer 5 is deformed, the exposed area of the intrinsic surface is expanded, and the thickness of the conductive coating layer is reduced, so that the aluminum electrode 2 of the semiconductor chip 1 and the ceramic substrate 7 are reduced. The distance from the electrode 8 is a distance corresponding to about the diameter of the core 4 of the conductive ball 6 existing therebetween.

This is because the core 4 has a high rigidity and is not deformed, and therefore acts as a deformation stopper for the conductive balls. On the other hand, when the applied pressure is monitored, the applied pressure increases as the deformation of the conductive coating layer 5 progresses and the core 4 approaches the electrodes 2 and 8, and when the core 4 reaches the electrodes 2 and 8, the applied pressure is It can be seen that the temperature further rises, indicating that the deformation of the conductive coating layer 5 has stopped. Therefore, by monitoring the distance between the semiconductor chip 1 and the ceramic substrate 7 or the applied pressure, the deformed state of the conductive ball 6 can be known and an optimum connection can be obtained.

However, at the time of manufacturing, it is desirable to press with a slight margin due to variations in the diameter of the core 4 and the like. As described above, when the exposed intrinsic surfaces of the electrodes 2 and 8 and the conductive coating layer 5 are in contact with each other by the pressure, 200 to 2
By heating to 50 ° C., as shown in FIG. 1C, the aluminum electrode 2 is alloyed and the gold-plated electrode 8 is metalized and connected to obtain an electric circuit component.

Furthermore, by performing the pressurization and the heating at the same time, the gold (softening temperature 100 ° C.) of the conductive coating layer 5 is made softer and easily deformed, so that the connection characteristics are further improved.

Although not shown in detail in the first embodiment, a press machine (that is, a hot press machine) having a built-in heater is used to execute the above-mentioned pressurization and heating. To do. In this pressurizing and heating operation, the oxide film or the contaminated film present on the surface of the electrode part 2 of the semiconductor chip 1 and the electrode part 8 of the ceramic substrate 7 is generated by friction caused by the movement of the conductive coating layer 5 of the conductive ball 6. It is destroyed, and the true surfaces of the electrodes 2 and 8 (pure surfaces such as gold and aluminum) are exposed. As a result, the conductive coating layer 5 and the electrode portions 2 and 8 are easily diffused in the solid state of metal atoms, and are electrically / mechanically connected to each other by alloying / metallizing. Become.

In the production of electric circuit parts, the order of arrangement of the conductive balls does not matter. For example, after positioning the semiconductor chip 1 and the ceramic substrate 7 at a certain interval, the conductive balls are either You may arrange | position on an electrode.

According to the first embodiment, the particles 32 are provided on the conductive coating layer 5, that is, the particles 3 are provided in the conductive coating layer 5.
By embedding 2 in a partially exposed state, it is possible to widen the bonding area between the electrodes 2 and 8 of the semiconductor chip 1 and the ceramic substrate 7 (that is, the electric circuit element and the electric circuit substrate), and thus both It is possible to improve the connection characteristics of the.

The present invention is not limited to the above-described first embodiment, but can be variously modified without departing from the spirit of the present invention. Various other embodiments of the present invention will be described below, but in the following description, the same parts as those in the first embodiment described above will be denoted by the same reference numerals, and the description thereof will be omitted.

(Second Embodiment) FIGS. 4A to 4
FIG. 5C is a cross-sectional view schematically showing the configuration and manufacturing method of the electric circuit component according to the second embodiment of the present invention, and FIGS. 5A to 5D show the second embodiment. 6A to 6C are cross-sectional views schematically showing a method of manufacturing a conductive connecting member including a conductive ball used in the embodiment and a holding sheet that holds the conductive ball.
[FIG. 7] is a cross-sectional view schematically showing a modified example of the conductive connecting member that achieves the same effects as those of the second embodiment.

In the conductive connecting member of the second embodiment, the particles 3 are formed in the same manner as described in the first embodiment.
The conductive ball 6 in which 2 is embedded in the conductive coating layer 5 is handled while being held by the holding sheet 16. Therefore, first, a method for manufacturing a conductive connecting member will be described, and then a method for manufacturing an electric circuit component using the conductive connecting member will be described.

First, the conductive balls 6 are made of silica.
The conductive coating layer 5 is composed of a 40 μm sphere and has a thickness of 5 μm.
The gold particles 32 of m and the particles 32 are each composed of Mo having a particle diameter of 0.1 to 2 μm. The manufacturing method of the conductive ball 6 is as follows.
This is the same as the first embodiment described above.

First, as shown in FIG. 5A, the lower mold 1 is provided with a recess 18 at a position corresponding to the position of the electrode part to be connected.
The conductive balls 6 are arranged at 7. The shape of the recess 18 may be any shape such as a quadrangular prism, a cylinder, a cone, and a hemisphere.

After arranging the conductive balls 6 in the recesses 18 of the lower mold 17, as shown in FIG. 5B, a similar upper mold 17 ′ is placed on the lower mold 17 so that the conductive balls 6 are not crushed. To place. As a method for achieving the space between the upper mold 17 'and the lower mold 17, the vertical separation distance is controlled by a device for moving both molds vertically, or the upper mold 17' and the lower mold 1
A spacer (not shown) protruding from the mold surface is provided on either or both of 7, and the upper mold 17 ′ and the lower mold 17 are aligned, and when the spacers come into contact with each other, the upper mold 17 ′ and the lower mold 17
Alternatively, the amount of protrusion of the spacer may be determined in advance so that the space between the recesses 18 is equal to or slightly larger than the diameter of the conductive balls.

Then, as shown in FIG. 5C, the upper mold 1
Inject the polyimide resin 16 between 7'and the lower mold 17,
It is heated and cured at 200 to 400 ° C. and released. In this state, the conductive balls 6 protruding from the surface of the holding sheet 16
Since the polyimide resin has adhered to the surface of, the both sides are etched (for example, ashing with O2 plasma is used for dry, hydrazine and ethylene diacine are used for wet), and conductive balls are formed as shown in FIG. 5 (d). 6 is exposed from both sides of the holding sheet 16.

For this reason, the film thickness of the holding sheet 16 becomes thinner than that after molding. The thickness of the holding sheet after the etching is preferably equal to or smaller than the diameter of the core so that the conductive coating layer 5 cannot be deformed and moved when the conductive balls 6 are connected. Next, this conductive ball 6
A method of manufacturing an electric circuit component using a conductive connecting member composed of the holding sheet 16 and the holding sheet 16 will be described.

First, as shown in FIG. 4A, the holding sheet 16 and the ceramic substrate 7 are positioned so that the conductive balls 6 held by the holding sheet 16 are placed on the electrodes 8 of the ceramic substrate 7. To do.

Next, as shown in FIG. 4B, the semiconductor chip 1 is held on the electrode 8 so that the aluminum electrode 2 of the semiconductor chip 1 and the electrode 8 of the ceramic substrate 7 face each other. It is positioned with respect to the ceramic substrate 7 on which the conductive balls 6 held by are arranged.

Then, similarly to the above-described first embodiment, by pressurizing and heating, the aluminum electrode 2 and the conductive coating layer 5 are alloyed, and the gold-plated electrode 8 and the conductive coating layer 5 are separated from each other. Metallized and connected.

After connection, the holding sheet 16 is attached to the semiconductor chip 1
An electric circuit component is obtained by appropriately cutting around the periphery of the substrate with a cutting tool (not shown) such as a cutter. That is, in the second embodiment, the holding sheet 1 is included in the electric circuit component.
6 will be provided in a state of being left unremoved. Also in this second embodiment, the order of arrangement of the conductive balls 6 held by the holding sheet 16 does not matter, and for example,
At a certain interval, the semiconductor chip 1 and the ceramic substrate 7 are
After positioning, the conductive balls 6 held by the holding sheet 16 are inserted into the gap between the semiconductor chip 1 and the ceramic substrate 7, and the holding sheet 16 is positioned so that the conductive balls come on either electrode. You may heat-press.

According to this second embodiment, by using the holding sheet 16 for holding the conductive balls 6,
Since the handling of the conductive balls 6 is improved and the positional deviation at the time of connection can be prevented, the effect that finer connection and higher density connection can be achieved is achieved. Other effects are the same as those of the first embodiment.

Further, in FIG. 6A, a conductive connecting member that achieves the same effect as that of the second embodiment is shown in FIG.
The conductive balls 6'are shown in the state of being held. The conductive balls 6 ′ are embedded in a state in which the particles 32 are dispersed only in the portion exposed from the holding sheet 16.

Such a conductive ball 6'is shown in FIG. 6 (b).
As shown in FIG. 5, after the holding sheet 16 for holding the conductive balls having no particles is manufactured as shown in FIGS. 5 (a) to 5 (d), it is placed on the plate 33 in which a large number of particles 32 are dispersed and lightly By applying pressure, the particles 32 are made to bite into the conductive coating layer 5 to be manufactured.

When the particles 32 are provided on both sides, although not shown, the particle-free conductive balls are sandwiched between the plates 33 in which a large number of particles 32 are dispersed from above and below, and the operation is carried out simultaneously on both sides. Or FIG. 6
As shown in (c), the conductive ball 6 ′ having the particles 32 bite is turned upside down on one surface (lower surface), and again,
It is sufficient to perform the operation of biting into one surface (lower surface). When the particles 32 are embedded only on one side of the conductive ball 6 ', this biting operation may be performed on only one side.

(Third Embodiment) FIGS. 7A to 7
(D) is sectional drawing which shows typically the structure and manufacturing method in 3rd Embodiment of the electric circuit component concerning this invention, and FIG. 8 shows the conductive connection member used in 3rd Embodiment. It is a perspective view.

As shown in FIGS. 7A to 7C,
The third embodiment is the same as the above-described second embodiment up to the step of alloying and metalizing the conductive balls 6 and the respective electrodes 2 and 8 for connection.

However, in the third embodiment, after the connection is completed as shown in FIG. 7C, the holding sheet 16 is pulled in the horizontal direction to cause cracks in the holding sheet 16, and It is set so as to be removed from between the chip 1 and the ceramic substrate 7. Therefore, the holding sheet 16 used in the third embodiment is
The tear strength is set weakly, or it is formed of a material having a weak tear strength.

According to the third embodiment, in addition to the effect achieved by the second embodiment described above, the holding sheet 16 can be easily and surely removed, which allows the semiconductor chip 1 to be removed. Since there is no projecting portion, the effect of obtaining a smaller electric circuit component can be achieved.

In the third embodiment, as shown in FIG.
By forming a large number of slits 14 and notches 15 in the holding sheet 16, as shown as a modified example in FIG.
When the holding sheet 16 is removed, it is possible to easily generate cracks, reduce the stress applied to the connection portion, and further achieve the effect of obtaining high reliability.

(Fourth Embodiment) FIGS. 9A to 9
(C) is sectional drawing which shows typically the structure and manufacturing method in 4th Embodiment of the electric circuit component concerning this invention.

In the fourth embodiment, the conductive ball 6 shown in the first embodiment is mounted on the aluminum electrode 2 of the semiconductor chip 1 with vacuum tweezers or the like (not shown).
Then, as shown in FIG. 9A, the conductive balls 6 and the semiconductor chip 1 are pressed through a plate 34 made of flat quartz, and the particles 32 on the surface of the conductive balls 6 are pressed.
However, they are temporarily fixed by biting into the aluminum electrode. If necessary, part of the alloy may be alloyed by heating.

Next, as shown in FIG. 9B, the semiconductor chip 1 having the conductive balls 6 on the aluminum electrodes 2 and the ceramic substrate 7 are positioned so that the electrodes 2 and 8 face each other. ,Deploy. After this placement is completed,
As shown in (c), by pressing and heating the semiconductor chip 1 and the ceramic substrate 7, the conductive balls 6 and the respective electrodes 2 and 8 are alloyed and metalized to be connected to each other to form an electric circuit component. obtain.

According to the fourth embodiment, in addition to the effects achieved by the first embodiment described above, the conductive balls 6 are temporarily connected to the semiconductor chip 1 before the main connection is made. The effect that the connection between the conductive ball 6 and the semiconductor chip 1 can be inspected can be achieved during the connection.

As a method of obtaining the same effect as that of the fourth embodiment, a mold having a recess at the position where the conductive balls 6 are arranged is used instead of a flat pressure plate, and a conductive member is provided in the recess. It is also possible to arrange balls and position the semiconductor chips 1 and then temporarily connect them. Furthermore, the electrode 8 of the ceramic substrate 7 may be used instead of the electrode 2 of the semiconductor chip 1 as a target for temporary connection.

(Fifth Embodiment) FIG. 10A to FIG.
0 (c) is a cross-sectional view schematically showing the configuration and manufacturing method of the electric circuit component according to the fifth embodiment of the present invention.

In the fifth embodiment, the holding sheet 16 holding the conductive balls 6 used in the second embodiment described above is used to bring the conductive balls 6 onto the aluminum electrodes 2 of the semiconductor chip 1. 10A, the conductive balls 6 and the semiconductor chip 1 are pressed through a plate 34 made of flat quartz so that the particles 32 on the surface of the conductive balls 6 become aluminum electrodes. By digging in, both are temporarily fixed. If necessary, part of the alloy may be alloyed by heating.

Next, the holding sheet 16 is removed by pulling it horizontally or vertically. The holding sheet 16 may be provided with slits 14 and notches 15 as shown in FIG.

Next, as shown in FIG. 10B, the semiconductor chip 1 having the conductive balls 6 on the aluminum electrodes 2 and the ceramic substrate 7 are positioned so that the electrodes 2 and 8 face each other. ,Deploy. After this placement is completed,
As shown in 0 (c), the semiconductor chip 1 and the ceramic substrate 7 are pressed and heated to alloy and metalize the conductive balls 6 and the respective electrodes 2 and 8 to connect the conductive balls 6 to the electric circuit parts. To get

According to the fifth embodiment, in addition to the effect of the above-described fourth embodiment, the use of the holding sheet 16 has the effect of improving the handling when the conductive balls 6 are arranged. Will be achieved.

(Sixth Embodiment) FIG. 11A to FIG.
FIG. 1C is a sectional view schematically showing the structure and manufacturing method of the electric circuit component according to the sixth embodiment of the present invention.

In this sixth embodiment, FIG.
As shown in (a), the conductive balls 6 and the semiconductor chip 1 are provisionally connected using a conductive connecting member including a holding sheet 16 holding the conductive balls 6 as in the fifth embodiment. . However, in the sixth embodiment, after such temporary connection is performed, the state shown in FIG.
As shown in FIG.
Then, the holding sheet 16 is left without being removed. Then, as shown in FIG. 11C, the semiconductor chip 1 and the ceramic substrate 7 are positioned with the holding sheet 16 present, and thermocompression bonding is performed. , The electrode portions 2 and 8 and the conductive balls 6 are alloyed and metalized to be connected.

After this connection, the holding sheet 16 is cut around the semiconductor chip 1 to obtain an electric circuit component.

According to the sixth embodiment, in addition to the effect of the above-described fourth embodiment, the holding sheet 16 holds the conductive balls 6 until the main connection as well as the temporary connection. The effect that the positional deviation does not effectively occur is achieved. Therefore, finer connection is possible.

Further, as shown in FIGS. 12A to 12D, after the main connection, as described in the third embodiment, if the holding sheet 16 is removed, the holding sheet 16 becomes a semiconductor chip. Since it does not protrude beyond 1, the electric circuit component can be made smaller.

(Seventh Embodiment) FIG. 13 is a sectional view schematically showing a conductive ball according to a seventh embodiment of the present invention.

In the seventh embodiment, the conductive balls 6'used in the core 4'are provided with protrusions 31 and valleys 3 on the surface thereof.
It has 0 and is formed in a so-called uneven shape. The core 4'is made of steel and has a diameter of about 40 .mu.m, and the surface roughness of the protrusions 31 and the valleys 30 is Rmax 0.5 to 3 .mu.m.
It is. Such protrusions 31 and valleys 30 can be formed by polishing the core 4 into a spherical shape and then polishing it again with rough abrasive grains. Alternatively, it can be provided by omitting polishing with fine abrasive grains for final finishing into a spherical shape.

The surface of the core 4'is coated with gold in the same manner as in the first embodiment to form the conductive coating layer 5, and then the alumina particles 32 are provided on the surface of the conductive coating layer 5. The subsequent steps are the same as in the first embodiment.

According to the seventh embodiment, in addition to the effect of the above-described first embodiment, the conductive coating layer 5 is deformed so that the particles 32 provided on the surface of the particle 32 are connected to the electrode. When the oxide film is sent to the periphery and the oxide film in the central portion is less likely to be destroyed, the protrusion 31 on the surface of the core 4 ′ again causes
The effect of destroying the oxide film can be achieved. The effect becomes remarkable especially when the electrode film is hard.

Furthermore, by increasing the close contact with the conductive coating layer 5, the peeling of the conductive coating layer 5 from the core 4'can be effectively prevented.

(Eighth Embodiment) FIG. 14 is a sectional view schematically showing an eighth embodiment of a conductive ball according to the present invention.

In this eighth embodiment, the particles 32
Other than the point that spherical silica having a particle diameter of 0.1 to 2 μm is used, the other configuration is the same as that of the first embodiment.

According to the eighth embodiment, in addition to the effects of the first embodiment described above, since the shape of the particles 32 is spherical, the particles 32 are sandwiched between the core 4 and the electrode. Even in this case, the effect of being easily discharged to the outside can be achieved. Therefore, the distance between the electrode 2 of the semiconductor chip 1 and the electrode 8 of the ceramic substrate 7 is as close as possible to the diameter of the core 4. Therefore, the semiconductor chips are surely pressed in parallel,
Non-uniformity of pressure distribution such as uneven contact does not easily occur.

(Ninth Embodiment) FIG. 15 is a sectional view schematically showing a conductive ball according to a ninth embodiment of the present invention. In this ninth embodiment, the particles 32 '
However, it is further provided in a state of being completely embedded in the conductive coating layer 5, that is, in a state of not protruding to the outside.

The conductive balls 6 are made of silica, and the surface of the core 4 having a diameter of 40 μm is coated with about 2 μm of gold. After that, it is formed by performing activation treatment again, coating with 3 μm gold, and again providing Mo particles 32 thereon.

The subsequent structure is the same as that of the first embodiment. According to the ninth embodiment, in addition to the effects of the first embodiment described above, the effect of increasing the density of the particles 32, 32 'is to increase the destructiveness of the oxide film and to improve the bondability. Is achieved.

In the ninth embodiment, the particle layer is 2
Although it is a layer, more layers may be used if necessary. Alternatively, after the particles 32 are provided on the surface of the conductive coating layer,
By coating the conductive material again, the particles can be prevented from falling off.

(Tenth Embodiment) FIGS. 16 (a) to 16 (c) show a tenth embodiment of an electric circuit component according to the present invention.
17 is a cross-sectional view schematically showing the configuration and manufacturing method of the embodiment of FIG. 17, and FIG. 17 is a cross-sectional view schematically showing the conductive balls shown in FIGS. 16 (a) to 16 (c).

16 (a) to 16 (c),
In the tenth embodiment, the electrode portion 2 of the semiconductor chip 1 is composed of an aluminum electrode 21 directly attached to the surface of the semiconductor chip 1 and a Cu electrode 22 attached to the aluminum electrode 21. There is. Further, a Cu electrode 8 as an electrode portion is arranged on the printed circuit board 7 which is an electric circuit board.

In this tenth embodiment, FIG.
As shown in FIG. 3, a central sphere 41 made of steel and an adhesion layer 42 in which the surface of the central sphere 41 is coated with Ni as a metal having good solder wettability
The core 4 is formed from and the conductive balls 6 are
And Pb-Sn (37 wt%-) coated on the surface of
63 wt%) and a conductive coating layer 5 and is configured to connect the electrode portion 2 of the semiconductor chip 1 and the electrode portion 8 of the printed board 7 via the conductive balls 6. .

Therefore, first, a method of manufacturing the conductive ball 6 will be described, and then the conductive ball 6 will be used to
A method of manufacturing an electric circuit component in which the semiconductor chip 1 and the printed board 7 are connected will be described.

As shown in FIG. 17, the conductive balls 6 include a core 4 composed of a central sphere 41 and an adhesion layer 42, and a conductive coating layer 5.
It is composed of The central sphere 41 of the core 4 is a sphere made of steel (carbon steel) and has a diameter of φ4 by precise polishing.
It has a spherical shape of 0 to 50 μm. After the surface of the central sphere 41 is subjected to activation treatment with palladium, electroless plating is performed to achieve good solder wettability and form an adhesion layer of Ni.
To a thickness of 1 to 3 μm to form the core 4. Further, as the adhesion layer 42, Cu or Sn may be used in addition to Ni. Further, there are cases where a multilayer structure such as Cu on Ni and Sn on Ni is formed.

Then, solder (Pb-S
n, 37 wt% -63 wt%) with a thickness of 5 to 20 μm to form the conductive coating layer 5. As one of the methods for forming the conductive coating layer 5, the core 4 is put in the tub in which the above-mentioned solder is melted, the agitated one is sprayed from the nozzle, and the compressed gas or the water jet is made to act on it. Fine conductive balls 6 having a conductive coating layer 5 formed of solder on the surface of the core 4 may be formed.

Next, a method of manufacturing an electric circuit component using the conductive balls 6 will be described. First, in the semiconductor chip 1 which is an electric circuit element, in the electrode part 2, a Cu electrode 22 including an adhesion layer of Cr or Ni and a barrier layer made of Cu is vapor-deposited on a normal aluminum electrode 21, and a Fetriso , Is formed by etching. Also,
When gold is provided on the surface to prevent the exposed Cu electrode 22 from being oxidized, or Pb-Sn is used to improve wettability.
Solder may be provided.

In the tenth embodiment, the size of the exposed electrode portion 2 is preferably smaller than the conductive ball in order to further control the flow of solder at the time of connection.
From the viewpoint of solder wettability and flow, a target shape is preferable, such as a square regular polygon or a circle. Specifically, in the body of the tenth embodiment, the shape of the electrode portion 2 is a square having one side of 20 to 40 μm.

FIG. 16 is formed on the surface of the semiconductor chip 1.
As shown in (a), the flux 21 is applied to a thickness of 1 to 10 μm, and then the conductive balls 6 are arranged on the electrode portions 2 using vacuum tweezers. At this time, the conductive balls 6
Are held on the electrode portion 2 due to the adhesiveness of the flux 21.

Next, the semiconductor chip 1 is replaced with 183-250.
By heating to ℃, the conductive coating layer 5 of the conductive balls 6
Melts and is connected to the Cu electrode 22. At this time, the solder, which is the conductive coating layer 5, falls toward the semiconductor chip 1 due to gravity, but the exposed surface of the Cu electrode 22 becomes
Since it is smaller, after the Cu electrode 22 is wet with the solder, the surface tension of the solder stops the dropping of the solder. Therefore, even after connection, the solder covers the core 4 and the conductive coating layer 5
Becomes

Also, when making this connection, the conductive balls 6
There is also a case where the connection is performed by applying a pressure with a pressure tool made of a material that does not get wet with solder, such as glass or Teflon. In this case, the height of the conductive balls 6 after connection becomes extremely uniform due to the pressure.

Then, the conductive balls 6 are connected to the electrodes 2 like individual pieces.
16B, the flux 21 is removed by washing as shown in FIG.

Next, the Cu electrode 8 of the printed circuit board 7 to which the flux has been applied in advance and the electrode portion 2 of the semiconductor chip 1 provided with the conductive balls are positioned and arranged so as to face each other. The size of the Cu electrode 8 of the printed circuit board 7 is set to a square having one side of 30 to 40 μm, as described above.

After the arrangement as described above, the printed board 7 and the semiconductor chip 1 are heated to 180 to 250 ° C., the conductive coating layer 5 is melted again, and the Cu electrode 8 is connected.
Further, by pressing at this time, the gap between the electrode 2 of the semiconductor chip 1 and the electrode 8 of the printed board 7 becomes about the diameter of the core 4 because the core 4 serves as the deformation stopper 10. As a result, even if there is a variation in the amount of solder or a variation in the heating distribution, each connecting portion is reliably connected without short circuit.

This pressurization may be carried out at the same time as the heating, or may be carried out after the solder which is the conductive coating layer 5 is melted and the solder is wet and the self-alignment due to the surface tension is carried out. After such connection, the flux is removed by washing to obtain an electric circuit component.

Although the semiconductor chip 1 is used as the electric circuit element in the tenth embodiment, the conductive balls 6 may be provided on the electrodes of the electric circuit element in a wafer state. In this case, the conductive balls 6 are connected to the electrodes and then cut into semiconductor chips by dicing. The subsequent steps are the same as described above.

As described above, according to the tenth embodiment, the conductive balls having the conductive coating layer made of solder provided on the surface of the spherical core having high rigidity are used for connection. Since the amount of solder supplied to each electrode portion can be controlled and the connection can be made by applying pressure, the effect of improving the connectivity can be achieved.

(Eleventh Embodiment) FIG. 18 is a sectional view schematically showing a manufacturing method of an electric circuit component according to an eleventh embodiment of the present invention.

In the eleventh embodiment, the conductive balls 6
The mask sheet 10 is used for the disposition on the electrode 2. Here, the mask sheet 10 is a polyimide sheet that is arranged at a position corresponding to the electrode portion 2 of the semiconductor chip 1 and has an opening 13 larger than the diameter of the conductive ball 6. Thickness b of this mask sheet 10
Is 10 to 10 from the diameter (50 to 100 μm) of the conductive ball.
It is set to be 20 μm thick.

The mask sheet 10 is applied to the semiconductor chip 1
After aligning the electrode portions 2 of the above so as to be positioned in the openings 13, the conductive balls 6 are placed on the mask sheet 10 and swept by the blade 24, so that the conductive balls 6 are collectively opened. It is placed in the section 13. By setting the thickness of the mask sheet 10 to be equal to or larger than the diameter of the conductive balls 6 and equal to or smaller than 1.5 times the diameter, it is possible to prevent the conductive balls 6 from overlapping in the openings 13, and The blade 24 can prevent the blade 24 from being scratched or running out.

After placing the conductive balls 6, the mask sheet 10 is formed.
Then, flux is applied and heated to 180 to 250 ° C. to melt the solder of the conductive coating layer 5 and connect with the electrode 2. After connection, the mask sheet is pulled up and removed, and the flux is washed and removed. The subsequent steps are the same as in the tenth embodiment.

A plurality of conductive balls 6 are provided on one electrode portion 2.
, D is the diameter of the conductive ball, and n is the number of conductive balls to be arranged in one electrode part 2, and nD or more (n + 1) D.
Mask sheet 1 provided with opening 13 having the following size
You can use 0.

According to the eleventh embodiment, by using the mask sheet 10, the effect that the conductive balls 6 can be collectively arranged on the electrode portion 2 is achieved. Furthermore,
The number of conductive balls 6 arranged for each electrode portion 2 can be arbitrarily changed.

(Twelfth Embodiment) FIG. 19 is a sectional view schematically showing a part of the manufacturing method in the twelfth embodiment of the electric circuit component according to the present invention. In FIG. 19, reference numeral 26 indicates a mold having a concave portion 25 formed on the upper surface.

The manufacturing method according to the twelfth embodiment uses the mold 26 in which the recess 25 is provided at the position corresponding to the position of the electrode portion connected to the mold material which is not wet with solder, for example, quartz. The conductive ball 6 and the electrode portion 2 of the semiconductor chip 1 are connected to each other. Where type 2
The recess 25 provided in 6 is formed by etching. The size and shape of the recess 25 have an opening of nD or more and (n + 1) D or less, where D is the diameter of the conductive ball 6, 2r is the core diameter, and n is the number of conductive balls arranged in one electrode portion. , The depth is set to be shallower than 2r. By doing so, a desired conductive ball 6 can be arranged in one recess 25, and even if the conductive coating layer 5 is melted by the heating of the connection, the core 4 contacts the electrode 2 and the conductive ball after the connection is formed. 6
The effect that the height is uniform will be achieved.

A conductive ball 6 is placed in the recess 25 of the mold 26 as described above.
Is swept by a blade (not shown) or the mold 26
The conductive balls 6 are placed on the upper side, and the mold 26 is vibrated or tilted, and the conductive balls 6 are arranged by rolling.

Next, after applying the flux 10 on the mold 26, the semiconductor chip 1 and the mold 26 are positioned and arranged so that they are on the conductive balls 6 on which the electrode portions 2 of the semiconductor chip 1 are arranged. .

After disposing the semiconductor chip 1 in this way,
The semiconductor chip 1 and the mold 26 are heated to 183 to 250 ° C.,
The conductive coating layer 5 is melted and connected to the electrode portion 2. At this time, by pressing the semiconductor chip 1, the height of the conductive balls 6 after connection becomes uniform. After the connection, the semiconductor chip 1 is removed from the mold 26 and flux cleaning is performed.

The subsequent steps are the same as in the tenth embodiment. In the twelfth embodiment, the mold 26 made of quartz is used.
However, as the mold, as long as the concave portion and the peripheral portion thereof are made of a material that does not wet the solder, the base material does not pose a problem. For example, it is possible to use a steel in which a recess is provided and the surface of which is coated with glass.

According to the twelfth embodiment, by using the rigid mold 26 for the arrangement and connection of the conductive balls 6, the effect of facilitating the handling up to the connection is achieved.

(Thirteenth Embodiment) FIGS. 20 (a) and 20 (b) show a thirteenth embodiment of an electric circuit component according to the present invention.
FIG. 6 is a cross-sectional view schematically showing the manufacturing method in the embodiment of FIG.

In FIG. 20A, reference numeral 19 indicates a package substrate, and on the package substrate 19,
The Cu electrode 20 is provided. 20B, reference numeral 23 indicates a semiconductor package which is an electric circuit element, and reference numeral 27 indicates a mother board which is an electric circuit board. On this mother substrate 27, Cu
An electrode 28 is provided.

In the thirteenth embodiment, the semiconductor chip 1 has Pb as the conductive coating layer 5 for coating the core 4.
It is connected to the package substrate 19 via the conductive balls 6 made of -Sn (90 wt% -10 wt%) solder.
Then, the conductive ball 6 is used to connect the Cu electrode 20 of the semiconductor package 23 and the Cu electrode 28 of the mother substrate 7. The conductive balls used to connect the electrodes 20 of the package substrate 19 have a core diameter of 100 to 200 μm, and the conductive coating layer 5 is 10 to 50 μm of Pb-Sn (37 wt%).
-63 wt%), and each Cu electrode 20, 2
8 is a square having one side of 100 to 200 μm. Other configurations are the same as those of the tenth embodiment.

(Fourteenth Embodiment) FIGS. 21A to 21C show a fourteenth embodiment of an electric circuit component according to the present invention.
22 (a) to 22 (d) are sectional views schematically showing the manufacturing method of the conductive connecting member according to the fourteenth embodiment. is there.

In the method of manufacturing the conductive connecting member according to the fourteenth embodiment, the conductive balls 6 are held in advance at predetermined positions by the holding sheet 16. Therefore, the holding sheet 16 is used to arrange the conductive balls 6 on the electrode 20 in a collective state.

Therefore, the method of manufacturing the conductive connecting member will be described first, and then the method of manufacturing the electric circuit component will be described.

As the conductive balls 6, φ10 made of steel is used.
1 to 5 adhesion layers made of Cu on the central sphere of 0 to 200 μm
μm, and eutectic solder (Pb-Sn37-63
The conductive coating layer of 10% to 50 μm is used. The manufacturing method of this conductive ball 6 is the tenth
Is the same as that shown in the embodiment.

Next, as shown in FIG. 22A, the conductive ball 6 is placed in the lower mold 17 having the recess 18 at a position corresponding to the position of the electrode portion to be connected. The shape of the recess 18 may be any shape such as a quadrangular prism, a cylinder, a cone, and a hemisphere. Then, as shown in FIG. 22B, after placing the conductive balls 6 in the recesses 18 of the lower mold 17,
A similar upper mold 17 'is placed on top of it so that the conductive balls 6 are not crushed.

As a method for achieving the distance between the upper mold 17 'and the lower mold 17, control is performed by a device for moving the mold vertically, or one or both of the upper mold 17' and the lower mold 17 is provided with a mold. It suffices to provide a spacer portion protruding from the surface. When the spacers are provided, when the spacers come into contact with each other, the recesses 18 'and 18
The amount of protrusion of the spacer is determined so that the distance between and is equal to or slightly larger than the diameter of the conductive ball.

Then, as shown in FIG. 22C, with the conductive balls 6 sandwiched between the upper mold 17 ′ and the lower mold 17, epoxy resin is injected between them and heated to 100 to 180 ° C. Cure the epoxy resin. After the epoxy resin is cured, it is released from the mold. In this state, since the epoxy resin has adhered to the surface of the conductive ball 6 protruding from the surface of the holding sheet 16, both surfaces are etched, for example, ashed by O2 plasma, and as shown in FIG.
The conductive balls 6 are exposed from both upper and lower surfaces of the holding sheet 16. Therefore, the film thickness t ′ of the holding sheet 16
Is thinner than the film thickness t after molding.

Next, a method of manufacturing an electric circuit component using this conductive connecting member will be described.

First, as shown in FIG. 21A, the conductive balls 6 held by the holding sheet 16 are attached to the package substrate 1
The holding sheet 16 and the package substrate 19 are positioned so as to come on the Cu electrode 20 of 9. The flux may be applied on the package substrate 19 or the surface of the holding sheet 16.

Next, the semiconductor package 23 is replaced with 183
By heating to ˜250 ° C., the conductive coating layer 5 is melted and connected to the Cu electrode 20, as shown in FIG. At this time, the conductive coating layer 5 is melted and flows down to the package substrate side to some extent due to gravity when melted, so that a gap may be slightly formed between the holding sheet 16 and the conductive ball 6 which are in close contact with each other. After such connection, the holding sheet 16 is pulled and removed vertically or horizontally, and then flux cleaning is performed. After that, through the same steps as those in the fourth embodiment, the electric circuit component shown in FIG. 21C is obtained.

According to the fourteenth embodiment, by using the holding sheet 16 for closely holding the conductive balls 6 as the conductive connecting member, the conductive balls can be arranged and connected at a higher density. Will be achieved.

(Fifteenth Embodiment) FIGS. 23 (a) to 23 (c) show a fifteenth embodiment of an electric circuit component according to the present invention.
FIG. 24 is a cross-sectional view schematically showing the manufacturing method in the embodiment, and FIG. 24 is a perspective view showing a conductive connecting member used in the fifteenth embodiment.

In the conductive connecting member of the fifteenth embodiment, the conductive balls 6 held by the holding sheet 16 and the Cu electrodes 20 of the package substrate 19 are connected by the same method as in the fourteenth embodiment and then held. The sheet 16 is set so as not to be removed.

That is, as shown in FIG. 23A, with the holding sheet 16 attached, the Cu electrode 28 of the mother substrate 27 to which the flux is applied and the conductive ball 6 connected thereto are positioned and arranged. . Next, as shown in FIG. 23B, the mother substrate 27 and the semiconductor package 23 are separated by 18
The conductive coating layer 5 is melted again by heating to 3 to 250 ° C. and pressurized to press the Cu electrode 20 of the package substrate 19.
And the Cu electrode 28 of the mother substrate 27 is connected so that the distance between them is about the diameter of the core.

After such connection, as shown in FIG. 23C, the holding sheet 16 is pulled in the horizontal direction to remove the holding sheet 16 and wash the flux to obtain an electric circuit component.

If the holding sheet 16 is provided with the slits 14 and the notches 15 as shown in FIG. 24, cracks can be easily generated at the time of removal and the stress applied to the connecting portion can be reduced. . Such slits 14 and notches can be easily formed by punching with a mold or by providing a protrusion on the mold when molding the holding sheet.

According to the fifteenth embodiment, by performing the second connection with the holding sheet 16 attached, the flow of the melted solder is restricted, and further the positional deviation at the time of connection is prevented. Therefore, it is possible to achieve the effect of enabling higher density connection.

(Sixteenth Embodiment) FIGS. 25 (a) to 25 (c) show a sixteenth embodiment of an electric circuit component according to the present invention.
FIG. 6 is a cross-sectional view schematically showing the manufacturing method in the embodiment of FIG.

In the sixteenth embodiment, FIG. 25 (a)
As shown in FIG. 5, the conductive balls 6 are arranged by vacuum tweezers on the Cu electrodes 28 of the mother substrate 27 coated with the flux 10. Here, the conductive ball 6 and the Cu electrode 2
0 is the same as that in the 13th embodiment described above.

Next, as shown in FIG. 25B, the Cu electrode 20 of the semiconductor package 23 to which the semiconductor chip 1 is connected and the Cu electrode 28 of the mother substrate 27 are positioned and arranged so as to face each other. . At that time, the semiconductor package 2
The flux 10 is applied to the surface of the package substrate 19 of No. 3 in advance.

This semiconductor package 23 and mother board 2
7 and 183 to 250 ℃, and the Cu electrode 2
The connection is made by pressurizing until the distance between 0 and 28 is about the diameter of the core.

After connection, as shown in FIG. 25 (c), flux cleaning is performed to obtain electric circuit parts. According to the sixteenth embodiment, by using the conductive balls 6,
Even if they are connected in a lump, since the core 4 functions as a deformation stopper, a pressing operation can be used together, and an effect that a highly stable connection can be obtained is achieved. Therefore, the process can be shortened and the cost can be reduced.

(Seventeenth Embodiment) FIGS. 26A to 26D show a seventeenth embodiment of an electric circuit component according to the present invention.
FIG. 6 is a cross-sectional view schematically showing the manufacturing method in the embodiment of FIG.

In FIG. 26, reference numeral 11 is a first mask sheet, reference numeral 12 is a second mask sheet,
Reference numeral 29 is a positioning pin, and reference numeral 30
Indicates the positioning holes, respectively.

In the seventeenth embodiment, two mask sheets made of a polyimide resin in which the openings 13 are previously provided at the positions where the conductive balls 6 are arranged are used. Further, the two mask sheets 11 and 12 have positioning holes 35
Are connected to each other.

First, the first mask sheet 11 and the second mask sheet 12 are placed on the mother substrate 27 in an overlapping manner. At that time, the positioning pins 29 are provided on the mother substrate 27, and the first and second positioning pins 29 are inserted into the respective positioning holes 35 of the first and second mask sheets 11 and 12. Positioning is facilitated by stacking the mask sheets 11 and 12. Furthermore, the mother board 2
7, the first and second mask sheets 11 and 12 arranged on
Does not shift, and the accuracy of arrangement of the conductive balls 6 is improved.

Openings 13 of the first and second mask sheets 11 and 12 arranged on the Cu electrodes of the mother substrate 27.
Is slightly larger than the diameter of the conductive ball and is provided with a taper to improve the insertability. Further, the thickness t1 of the first mask sheet is preferably thinner than the core diameter 2r of the conductive ball 6, and the thickness t2 of the second mask sheet.
It is desirable that t1 + t2 be D or more and 1.5D or less with respect to the diameter D of the conductive ball 6.

In the seventeenth embodiment, the conductive balls 6 have a core diameter of 100 μm and a conductive ball diameter of 14 μm.
Since the conductive balls of 0 μm are used, the first mask sheet thickness t1 is 80 μm and the second mask sheet thickness t2 is 100.
μm. Further, the height of the positioning pin 29 described above is
It is preferable that the total thickness of the first and second mask sheets is lower than the total thickness of the first and second mask sheets.
It is set as m.

The conductive balls 6 are arranged on the Cu electrodes 28 as shown in FIG.
A plurality of conductive balls 6 are arranged at one end on the blade 2 and the blade 24
The conductive balls 6 are dropped into the respective opening portions 13 by sweeping with.

At this time, due to the sheet thickness of the two mask sheets, the arranged conductive balls 6 are prevented from being damaged or coming off after the arrangement. Further, the conductive balls placed on the arranged conductive balls can be easily discharged because the gap between the mask sheets is lower than the center of gravity of the conductive balls.

Then, after the conductive balls 6 are arranged on the respective Cu electrodes 28, only the second mask sheet 12 is removed. After removing, apply flux.

Next, as shown in FIG. 26B, the Cu electrode 20 of the semiconductor package 23 and the C of the mother substrate 27 are formed.
The u electrode 28 is positioned and arranged so as to face it.
Then, as shown in FIG. 26C, Pb-Sn-Ag (36 wt% -62) which is the conductive coating layer 5 of the conductive ball 6 is formed.
wt% -2wt%) above the melting temperature (180-25
After heating to 0 ° C.), the Cu electrodes 28 and 20 are pressed and connected so that the distance between them is about the diameter of the core 4.

At this time, since the first mask sheet thickness t1 is smaller than the core diameter, it is impossible to prevent the conductive balls from being deformed at the time of pressing. After connection, the first mask sheet 1
By pulling 1 horizontally, the semiconductor package 23
And the mother board 27, and the flux is washed to obtain an electric circuit component as shown in FIG.

If the first mask sheet 11 is provided with the slits and notches shown in FIG. 24, the removal of the first mask sheet 11 becomes easier.

According to the seventeenth embodiment, the conductive balls 6 are arranged by using the mask sheet 11 and are collectively connected, so that the conductive balls 6 can be easily arranged.
Further, it is possible to prevent displacement of the conductive balls 6 at the time of connection and achieve an effect that high-density connection is possible. Furthermore, by using the positioning pin 29, the effect of facilitating the alignment when the mask sheets 11 and 12 are arranged is also achieved.

Further, as shown in FIG. 27, the positioning pin 29
Is provided in a portion where the semiconductor package 23 is arranged, and the positioning hole 3 is formed in the package substrate 19 of the semiconductor package 23.
By providing 6, the effect of facilitating the alignment at the time of disposing the semiconductor package 23 is further achieved.

(Eighteenth Embodiment) FIGS. 28 (a) to 28 (c) show an eighteenth embodiment of an electric circuit component according to the present invention.
FIG. 6 is a cross-sectional view schematically showing the manufacturing method in the embodiment of FIG.

In the eighteenth embodiment, the Cu balls 20 of the semiconductor package 23 and the Cu electrodes 28 of the mother substrate 27 are connected by using the conductive balls 6 held by the holding sheet 16. The same components as those used in the fourteenth embodiment are used as the respective components. Further, in the eighteenth embodiment, positioning pins 29,
Positioning holes 35 in the holding sheet 16 and the package substrate 19
A positioning hole 35 is provided in the.

First, the position of the holding sheet 16 is adjusted so that the positioning pins 29 of the mother board 27 fit into the positioning holes 35 of the holding sheet 16, and the positioning holes 36 of the holding sheet 16 and the positioning holes 36 of the semiconductor package 23 are placed on the dish. The position is adjusted so that the positioning pin 29 penetrating through is inserted.

Here, as shown in FIG. 28 (a), Cu
Since the positional relationship between the electrode 28 and the positioning pin 29, the conductive ball 6 and the positioning hole 35, and the Cu electrode 20 and the positioning hole 36 is determined in advance, the Cu electrode 28, 20 is inserted into the positioning pin and arranged. The conductive balls are interposed between them. The flux may be applied to both sides of the holding sheet 16, or may be applied to the surfaces of the package substrate 19 and the mother substrate 27.

Next, as shown in FIG. 28 (b), 183
It is heated to ˜250 ° C., and further pressed so that the distance between the Cu electrodes 20 and 28 becomes about the diameter of the core 4, and the conductive ball 6 and the Cu electrodes 20 and 28 are connected together. After the connection, the holding sheet 16 is pulled horizontally to remove the holding sheet 16. Then, flux cleaning is performed, and FIG.
An electric circuit component is obtained as shown in (c).

According to the eighteenth embodiment, since the holding sheet 16 that holds the conductive balls 6 in close contact is used for the arrangement and connection, the effect that higher density connection can be achieved is achieved. It will be.

Further, if the holding sheet 16 is provided with slits and notches as shown in FIG. 24, the holding sheet 1
Removal of 6 will be easier.

The present invention can be applied to a modified or modified version of the above embodiment without departing from the spirit of the present invention.

[0479]

As described above, the first aspect of the present application
According to the invention, there are two major effects.

[0480] That is, the first effect is that the core of the conductive ball which is the connecting member is made of a material having high rigidity, so that the core is hard to be deformed even when a load more than a desired load is applied, and it functions as a stopper. The electric circuit element and the electric circuit board are connected while maintaining high parallelism. Therefore, the pressure distribution becomes uniform, and a reliable and stable connection can be obtained.
Furthermore, when the electric circuit element is a photoelectric conversion element, since it is connected with high parallelism, the optical characteristics are improved,
The effect becomes more remarkable.

The second effect is that even if the electrode portion of the electric circuit element and the electric circuit board is not subjected to a special film treatment, the hard particles of the conductive covering layer destroy the oxide film and the contaminated film on the surface of the electrode film. The metallization and alloying enables high-density and high-connection strength connections, and reliable and stable connections can be obtained. Therefore, it is possible to manufacture an electric circuit component having a connection method that replaces the conventionally used wire bonding method, CCB method, TAB method, resin ball method, or anisotropic conductive sheet method.

According to the first invention of this application, in addition to the effects described above, the following effects are further obtained.

That is, by holding the conductive balls on the holding sheet, the conductive balls are arranged and connected to the electrodes in this holding state, so that the conductive balls are not displaced. Therefore, higher precision and higher density connection is possible.

Further, when the electric circuit is sealed with resin, the holding sheet exists between the electrodes,
The volume of the sealing resin that seals the electric circuit element is reduced, and since the conductive ball has a small area to connect with the sealing resin because it is embedded and held in the center of the holding sheet, the conductive ball is applied to the conductive ball during curing shrinkage. The effect that the stress value can be obtained in lichen lyrics and high connection reliability is also achieved.

Further, since the volume of the sealing resin is reduced, it is possible to reduce the amount (number) of bubbles contained in the sealing resin at a certain rate. Therefore, moisture absorption of the sealing resin can be reduced and an electric circuit component with high reliability can be obtained. Further, according to the first invention of this application, in addition to the first and second effects described above, the following effects are further obtained.

That is, by removing the holding sheet for holding the conductive balls after connection, a smaller electric circuit component can be obtained. Further, according to the first invention of this application, in addition to the first effect described above, the following effect is further provided.

That is, by temporarily connecting to either one of the electrodes of the electric circuit element or the electric circuit board, it is possible to perform an inspection during the connection and manufacture an electric circuit component with a high yield. . Further, according to the first invention of this application, in addition to the above-described first and fourth effects, there are the following effects.

That is, since a holding sheet holding the conductive balls is used and the conductive balls are arranged on either one of the electrodes and the temporary connection is performed, a high density connection is possible. Furthermore, after the temporary connection, the holding sheet is removed to make the main connection, so that a small electric circuit component can be obtained.

Further, according to the second invention of this application, there are the following four effects.

(1) The first effect is that the core of the conductive ball, which is the connecting member, is made of a material having high rigidity, so that the core is less likely to be deformed even if a load more than a desired load is applied, and it functions as a stopper. The electric circuit element and the electric circuit board are connected while maintaining high parallelism. Therefore, even if the conductive coating layer is melted and there is unevenness in the melting amount and heating temperature, a uniform connection can be obtained without causing unbonding due to floating connection parts or short circuit between adjacent electrodes due to excessive crushing. And a reliable connection can be obtained.

Furthermore, when the electric circuit element is a photoelectric conversion element, since it is connected with a high degree of parallelism, the optical characteristics are improved and the effect becomes more remarkable.

(2) As a second effect, since the solder material is used as the conductive coating layer, the passive component (chip component) which is conventionally connected with the solder material on the electric circuit board is electrically connected to the passive component (chip component). Not only can the circuit element and the circuit element be connected at the same time, the manufacturing process can be shortened, but also the amount of solder can be controlled with high accuracy and pressure can be applied, so that even high-density connection is easy. A reliable and stable connection can be obtained by control.

(3) As a third effect, the electric circuit element can be repaired by melting the connecting material by heating. Moreover, since the conductive balls that are the connecting materials can be pressed, stable connection can be achieved even if there is a variation in the solder remaining on the electrodes during re-bonding.

(4) As a fourth effect, by connecting the conductive ball to either one of the electrodes of the electric circuit element or the electric circuit board in advance, the inspection during the connection becomes possible and the yield is high. It becomes possible to manufacture electric circuit components. Therefore, it becomes possible to manufacture an electric circuit component having a connection method that replaces the conventionally used wire bonding method, CCB method, TAB method, resin ball method, and anisotropic conductive sheet method.

According to the second invention of this application, the following effects can be further obtained.

That is, since the sheet holding the conductive balls is used, the conductive balls can be easily arranged and the working time can be shortened. Furthermore, since the conductive balls are held in close contact with each other, a high density connection can be achieved, and the electric circuit component can be downsized. Further, according to the second invention of this application, the following effects can be further obtained. That is, since the holding sheet holding the conductive balls is used for the connection, when the conductive coating layer is melted, the core of the conductive balls is prevented from flowing, and high-density connection is possible.

Further, according to the second invention of this application, in addition to the above effects (1) to (3), the following effects are further obtained. That is, since the electric circuit element and the electric circuit board are collectively connected, the cost can be reduced by shortening the process. Further, according to the second invention of this application, the following effects can be further obtained.

That is, the conductive balls can be collectively placed on the electrodes by using a mask sheet and held at that position, so that the electrode density can be increased and workability can be improved by preventing the conductive balls from being displaced during connection. Planned. Therefore, miniaturization and cost reduction of electric circuit parts can be achieved.

Further, according to the second invention of this application, since the conductive balls are held in close contact with the holding sheet, it is possible to arrange and connect the conductive balls at a higher density than in the above fifth invention. Therefore, there is an effect that further miniaturization of electric circuit parts can be achieved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view schematically showing a configuration and manufacturing method of an electric circuit component according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view schematically showing a conductive ball used in the electric circuit component according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view schematically showing a method of manufacturing the conductive ball shown in FIG.

FIG. 4 is a cross-sectional view schematically showing the configuration and manufacturing method of the electric circuit component according to the second embodiment of the present invention.

FIG. 5 is a cross-sectional view schematically showing an example of a method for manufacturing a holding sheet used for manufacturing the electric circuit component according to the second embodiment of the present invention.

FIG. 6 is a cross-sectional view schematically showing another example of the method for manufacturing the holding sheet used for manufacturing the electric circuit component according to the second embodiment of the present invention.

FIG. 7 is a sectional view schematically showing a method for manufacturing an electric circuit component according to a third embodiment of the present invention.

FIG. 8 is a perspective view showing a holding sheet used for an electric circuit component according to a third embodiment of the present invention.

FIG. 9 is a cross-sectional view schematically showing the method of manufacturing the electric circuit component according to the fourth embodiment of the present invention.

FIG. 10 is a cross-sectional view schematically showing the method of manufacturing the electric circuit component according to the fifth embodiment of the present invention.

FIG. 11 is a cross-sectional view schematically showing the method of manufacturing the electric circuit component according to the sixth embodiment of the present invention.

FIG. 12 is a sectional view schematically showing a method for manufacturing an electric circuit component according to the sixth embodiment of the present invention.

FIG. 13 is a cross-sectional view schematically showing the method of manufacturing the electric circuit component according to the seventh embodiment of the present invention.

FIG. 14 is a cross-sectional view schematically showing the manufacturing method of the electric circuit component according to the eighth embodiment of the present invention.

FIG. 15 is a cross-sectional view schematically showing the manufacturing method of the electric circuit component according to the ninth embodiment of the present invention.

FIG. 16 is a cross-sectional view schematically showing the configuration and manufacturing method of the electric circuit component according to the tenth embodiment of the present invention.

FIG. 17 is a cross-sectional view schematically showing a conductive ball used in an electric circuit component according to a tenth embodiment of the present invention.

FIG. 18 is a cross-sectional view schematically showing the manufacturing method of the electric circuit component according to the eleventh embodiment of the present invention.

FIG. 19 is a sectional view schematically showing a method of manufacturing an electric circuit component according to a twelfth embodiment of the present invention.

FIG. 20 is a sectional view schematically showing a method for manufacturing an electric circuit component according to a thirteenth embodiment of the present invention.

FIG. 21 is a cross-sectional view schematically showing the manufacturing method of the electric circuit component according to the fourteenth embodiment of the present invention.

FIG. 22 is a cross-sectional view schematically showing another example of the method for manufacturing the holding sheet used for the electric circuit component according to the fourteenth embodiment of the invention.

FIG. 23 is a cross-sectional view schematically showing the manufacturing method of the electric circuit component according to the fifteenth embodiment of the present invention.

FIG. 24 is a perspective view showing a holding sheet according to a fifteenth embodiment of the present invention.

FIG. 25 is a cross-sectional view schematically showing the manufacturing method of the electric circuit component according to the sixteenth embodiment of the present invention.

FIG. 26 is a sectional view schematically showing a method for manufacturing an electric circuit component according to the seventeenth embodiment of the present invention.

FIG. 27 is a sectional view schematically showing an electric circuit component according to a seventeenth embodiment of the present invention.

FIG. 28 is a cross-sectional view schematically showing the manufacturing method of the electric circuit component according to the eighteenth embodiment of the present invention.

FIG. 29 is a schematic cross-sectional view illustrating a conventional wire bonding method.

FIG. 30 is a schematic sectional view illustrating a CCB method of a conventional example.

FIG. 31 is a schematic cross-sectional view illustrating a CCB method of a conventional example.

FIG. 32 is a schematic sectional view illustrating a TAB method of a conventional example.

FIG. 33 is a schematic cross-sectional view illustrating a face-down connection using gold bumps in a conventional example.

FIG. 34 is a schematic cross-sectional view illustrating a conventional resin ball method.

FIG. 35 is a schematic cross-sectional view illustrating a conventional anisotropic conductive sheet method.

FIG. 36 is a schematic cross-sectional view illustrating a conventional anisotropic conductive sheet method.

[Explanation of reference numerals] 1 semiconductor chip 2 electrode part 21 aluminum electrode 22 copper electrode 3 insulating protective film 4 core 41 core 42 adhesion layer 5 conductive coating layer 6 conductive ball 7 substrate 8 electrode 9 insulating protective film 10 mask sheet 11 first Mask sheet 12 Second mask sheet 13 Opening 14 Slit 15 Notch 16 Holding sheet 17 Type 18 Recess 19 Package substrate 20 Electrode 21 Flux 23 Semiconductor package 24 Blade 25 Recess 26 Type 27 Mother substrate 28 Electrode 29 Positioning pin 30 Valley ( Core surface) 31 Convex portion (core surface) 32 Particles 33 Plate 34 Pressure plate 35 Positioning hole 36 Positioning hole

Claims (174)

[Claims] 1. An electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein the electrode section of the electric circuit element and the electric circuit board are provided. And at least one conductive ball provided around the core having a substantially ball-shaped rigidity and provided with a conductive coating layer, the conductive coating layer of the conductive ball being fine. The hard particles are dispersed in a state where a part thereof is exposed, and the conductive balls are pressed against each other by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to form an electrode portion of the electric circuit element and the conductive ball. An electric circuit component characterized in that an electric circuit and an electric circuit board are electrically and mechanically connected to a cover layer and between an electrode portion of the electric circuit board and the cover layer of the conductive ball, respectively. 2. An electric circuit element having an electrode portion and an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element has an electrode portion. In an electric circuit component in which at least one conductive ball is interposed between the electrode part of the electric circuit board and the two electrode parts are connected to each other, the conductive ball is made of at least one of a highly rigid metal material and an inorganic material. And a core having a substantially spherical shape,
The conductive ball comprises a conductive coating layer formed of a material having conductivity and coated around the core, and fine and hard particles dispersed in the conductive coating layer in a partially exposed state. The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are pressed into contact with each other, between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating. An electric circuit component characterized by being metal-bonded to each layer. 3. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, and the electric circuit element and the electric circuit board are opposed to each other. In the state, it is sandwiched between the respective electrode parts, and between the both electrode parts,
At least one or more conductive balls electrically and mechanically connected to each other, wherein the conductive balls have a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
The conductive ball comprises a conductive coating layer formed of a material having conductivity and coated around the core, and fine and hard particles dispersed in the conductive coating layer in a partially exposed state. The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are pressed into contact with each other, between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating. An electric circuit component characterized by being metal-bonded to each layer. 4. An electric circuit component comprising a photoelectric conversion element having an electrode section and an electric circuit board having an electrode section for connecting to the photoelectric conversion element, wherein the electrode section of the photoelectric conversion element and the electric circuit board are provided. And a conductive coating layer provided around a core having a substantially ball-shaped rigidity, the conductive ball being interposed between the conductive ball and the electrode portion of the conductive ball. The hard particles are dispersed in a state where a part thereof is exposed, and the conductive balls are pressure-contacted by the electrode portion of the photoelectric conversion element and the electrode portion of the electric circuit board, and the electrode portion of the photoelectric conversion element and the conductive ball The electrical circuit component is characterized in that the electrode layer of the electric circuit board and the coating layer of the conductive ball are electrically and mechanically connected to each other, respectively. 5. An electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element has an electrode portion. In an electric circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit board and the two electrode portions are connected to each other, the electric circuit element has at least one photoelectric conversion element, The electric circuit board has a light-transmitting property in at least a portion thereof, and the conductive ball has a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
The conductive ball comprises a conductive coating layer formed of a material having conductivity and coated around the core, and fine and hard particles dispersed in the conductive coating layer in a partially exposed state. The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are pressed into contact with each other, between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating. An electric circuit component characterized by being metal-bonded to each layer. 6. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, and the electric circuit element and the electric circuit board facing each other. In the state, it is sandwiched between the respective electrode parts, and between the both electrode parts,
At least one or more conductive balls electrically and mechanically connected to each other, the electric circuit element has at least one or more photoelectric conversion elements, and the electric circuit substrate has a light-transmitting property at least in part. The conductive ball has a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
The conductive ball comprises a conductive coating layer formed of a material having conductivity and coated around the core, and fine and hard particles dispersed in the conductive coating layer in a partially exposed state. The electrode portion of the electric circuit element and the electrode portion of the electric circuit board are pressed into contact with each other, between the electrode portion of the electric circuit element and the conductive coating layer, and between the electrode portion of the electric circuit board and the conductive coating. An electric circuit component characterized by being metal-bonded to each layer. 7. An electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein the electrode section of the electric circuit element and the electric circuit board are provided. An at least one conductive ball which is interposed between the electrode part of, and has a conductive coating layer around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball, Holds the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. And a holding sheet for carrying out, in the conductive coating layer of the conductive ball, fine and hard particles are dispersed in a state of exposing a part, the conductive ball, the electrode portion of the electric circuit element and the electric circuit substrate. Between the electrode portion of the electric circuit element and a part of the coating layer of the conductive ball protruding from one surface of the holding sheet, and the electrode portion of the electric circuit board and the electrode portion of the electric circuit element. An electric circuit component, wherein a part of the coating layer of the conductive ball protruding from the other surface of the holding sheet is electrically and mechanically connected to each other. 8. An electric circuit element having an electrode portion and an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element has an electrode portion. An electrical circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit board and the two electrode portions are connected to each other. A holding sheet for holding the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. And a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
The conductive ball comprises a conductive coating layer formed of a material having conductivity and coated around the core, and fine and hard particles dispersed in the conductive coating layer in a partially exposed state. The electrode portion of the electric circuit element and the electrode portion of the electric circuit substrate are pressed into contact with each other, and the electrode portion of the electric circuit element and a portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, And an electrode portion of the electric circuit board and a portion of the conductive coating layer of the conductive ball protruding from the other surface of the holding sheet are metal-bonded, respectively. Circuit parts. 9. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, and the electric circuit element and the electric circuit board facing each other. In the state, at least one or more conductive balls sandwiched between the respective electrode parts and electrically and mechanically connecting the both electrode parts, and a holding sheet for embedding and holding the conductive balls are provided. A holding member which is made of an insulating material and holds the conductive ball so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A sheet, the conductive ball, a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
The conductive ball comprises a conductive coating layer formed of a material having conductivity and coated around the core, and fine and hard particles dispersed in the conductive coating layer in a partially exposed state. The electrode portion of the electric circuit element and the electrode portion of the electric circuit substrate are pressed into contact with each other, and the electrode portion of the electric circuit element and a portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, And an electrode portion of the electric circuit board and a portion of the conductive coating layer of the conductive ball protruding from the other surface of the holding sheet are metal-bonded, respectively. Circuit parts. 10. An electric circuit component comprising a photoelectric conversion element having an electrode section and an electric circuit board having an electrode section for connecting to the photoelectric conversion element, wherein the electrode section of the photoelectric conversion element and the electric circuit board are provided. An at least one conductive ball which is interposed between the electrode part of, and has a conductive coating layer around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball, Holds the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. And a holding sheet for the conductive ball, the conductive coating layer of the conductive ball, fine and hard particles are dispersed in a partially exposed state, the conductive ball, the electrode portion of the photoelectric conversion element and the electric circuit. Between the electrode portion of the photoelectric conversion element and the portion of the coating layer of the conductive ball protruding from one surface of the holding sheet, which is pressed by the electrode portion of the plate, and between the electrode portion of the electric circuit board and the electrode portion. An electric circuit component characterized in that the conductive ball is electrically and mechanically connected to a portion of the conductive ball which is projected from the other surface of the holding sheet. 11. An electric circuit element having an electrode portion and an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other to form an electrode portion of the electric circuit element. An electric circuit component in which at least one conductive ball is interposed between the electrode part of the electric circuit board and the two electrode parts are connected to each other, the holding sheet embedding and holding the at least one conductive ball, Holds the conductive ball so that it is formed of an electrically insulating material and a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for the electric circuit element, the electric circuit element has at least one or more photoelectric conversion elements, the electric circuit board has a light-transmitting property at least in part, the holding sheet is air or sealed. It has a light transmittance lower than that of a stop resin and is formed to have an opening at a portion corresponding to the photoelectric conversion element, and the conductive ball is a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material. A core having the shape of
The conductive ball comprises a conductive coating layer formed of a material having conductivity and coated around the core, and fine and hard particles dispersed in the conductive coating layer in a partially exposed state. The electrode portion of the electric circuit element and the electrode portion of the electric circuit substrate are pressed into contact with each other, and the electrode portion of the electric circuit element and a portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, And an electrode portion of the electric circuit board and a portion of the conductive coating layer of the conductive ball protruding from the other surface of the holding sheet are metal-bonded, respectively. Circuit parts. 12. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, the electric circuit element and the electric circuit board facing each other. In this state, there are at least one conductive ball which is sandwiched between the respective electrode parts and electrically and mechanically connects the both electrode parts, and a holding sheet which embeds and holds the at least one conductive ball. And a conductive ball formed of a material having electrical insulation so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. And a holding sheet for holding the electric circuit element, the electric circuit element has at least one or more photoelectric conversion element, the electric circuit substrate has a light-transmitting property at least in part, the holding sheet is air Has a light transmittance lower than that of the sealing resin and is formed to have an opening in a portion corresponding to the photoelectric conversion element, and the conductive ball is made of at least one of a highly rigid metal material and an inorganic material. A core having a substantially spherical shape,
The conductive ball comprises a conductive coating layer formed of a material having conductivity and coated around the core, and fine and hard particles dispersed in the conductive coating layer in a partially exposed state. The electrode portion of the electric circuit element and the electrode portion of the electric circuit substrate are pressed into contact with each other, and the electrode portion of the electric circuit element and a portion of the conductive coating layer of the conductive ball protruding from one surface of the holding sheet, And an electrode portion of the electric circuit board and a portion of the conductive coating layer of the conductive ball protruding from the other surface of the holding sheet are metal-bonded, respectively. Circuit parts. 13. An electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein the electrode section of the electric circuit element and the electric circuit board are provided. And a conductive coating layer formed of a solder material is provided around a core having a substantially ball-shaped rigidity, and the conductive ball is provided between the electrode portion and The conductive balls are pressed into contact with and heated by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and the conductive ball is heated by the electrode portion of the electric circuit element and the electrode of the electric circuit board. An electric circuit component characterized in that the parts are electrically and mechanically connected to each other via molten solder. 14. An electric circuit element having an electrode portion and an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element has an electrode portion. In an electric circuit component in which at least one conductive ball is interposed between the electrode part of the electric circuit board and the two electrode parts are connected to each other, the conductive ball is made of at least one of a highly rigid metal material and an inorganic material. And a core having a substantially spherical shape,
A conductive coating layer formed of a solder material and coated around the core; the electrodes are formed of a metal having good solder wettability; It is pressed and heated by the electrode part of the circuit board,
An electric circuit component, wherein an electrode portion of the electric circuit element and an electrode portion of the electric circuit board are electrically and mechanically connected to each other via a molten solder. 15. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, and the electric circuit element and the electric circuit board facing each other. In the state, it is sandwiched between the respective electrode parts, and between the both electrode parts,
At least one or more conductive balls electrically and mechanically connected to each other, wherein the conductive balls have a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a solder material and coated around the core; the electrodes are formed of a metal having good solder wettability; It is pressed and heated by the electrode part of the circuit board,
An electric circuit component, wherein an electrode portion of the electric circuit element and an electrode portion of the electric circuit board are electrically and mechanically connected to each other via a molten solder. 16. An electric circuit component comprising a photoelectric conversion element having an electrode section and an electric circuit board having an electrode section for connecting to the photoelectric conversion element, wherein the electrode section of the photoelectric conversion element and the electric circuit board are provided. And a conductive coating layer formed of a solder material is provided around a core having a substantially ball-shaped rigidity, and the conductive ball is provided between the electrode portion and Formed of a good metal, the conductive ball is pressed and heated by the electrode portion of the photoelectric conversion element and the electrode portion of the electric circuit board, and is heated, and the electrode portion of the photoelectric conversion element and the electrode of the electric circuit board are heated. An electric circuit component characterized in that the parts are electrically and mechanically connected to each other via molten solder. 17. An electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other, and the electric circuit element has an electrode portion. In an electric circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit board and the two electrode portions are connected to each other, the electric circuit element has at least one photoelectric conversion element, The electric circuit board has a light-transmitting property in at least a portion thereof, and the conductive ball has a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a solder material and coated around the core; the electrodes are formed of a metal having good solder wettability; It is pressed and heated by the electrode part of the circuit board,
An electric circuit component, wherein an electrode portion of the electric circuit element and an electrode portion of the electric circuit board are electrically and mechanically connected to each other via a molten solder. 18. An electric circuit element having an electrode part, an electric circuit board having an electrode part provided at a position corresponding to the electrode part of the electric circuit element, and the electric circuit element and the electric circuit board facing each other. In the state, it is sandwiched between the respective electrode parts, and between the both electrode parts,
At least one or more conductive balls electrically and mechanically connected to each other, the electric circuit element has at least one or more photoelectric conversion elements, and the electric circuit substrate has a light-transmitting property at least in part. The conductive ball has a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a solder material and coated around the core; the electrodes are formed of a metal having good solder wettability; It is pressed and heated by the electrode part of the circuit board,
An electric circuit component, wherein an electrode portion of the electric circuit element and an electrode portion of the electric circuit board are electrically and mechanically connected to each other via a molten solder. 19. An electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein the electrode section of the electric circuit element and the electric circuit board are provided. At least one conductive ball provided with a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball. Which is formed of a material having an electrical insulation property, so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding the conductive balls, wherein the electrodes are formed of a metal having good solder wettability, and the conductive balls are formed by an electrode portion of the electric circuit element and an electrode portion of the electric circuit board. An electric circuit characterized in that the electrode part of the electric circuit element and the electrode part of the electric circuit board are electrically and mechanically connected via a molten solder by being pressed and heated. parts. 20. An electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other to form an electrode portion of the electric circuit element. An electrical circuit component in which at least one conductive ball is interposed between the electrode portion of the electric circuit board and the two electrode portions are connected to each other. A holding sheet for holding the conductive ball so that a part of the conductive ball is projected and exposed from one surface and a part of the conductive ball is projected and exposed from the other surface. And a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a solder material and coated around the core; the electrodes are formed of a metal having good solder wettability; It is pressed and heated by the electrode part of the circuit board,
An electric circuit component, wherein an electrode portion of the electric circuit element and an electrode portion of the electric circuit board are electrically and mechanically connected to each other via a molten solder. 21. An electric circuit element having an electrode portion, an electric circuit board having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element, and the electric circuit element and the electric circuit board facing each other. In the state, at least one or more conductive balls sandwiched between the respective electrode parts and electrically and mechanically connecting the both electrode parts, and a holding sheet for embedding and holding the conductive balls are provided. A holding member which is made of an insulating material and holds the conductive ball so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A sheet, the conductive ball, a core having a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material,
A conductive coating layer formed of a solder material and coated around the core; the electrodes are formed of a metal having good solder wettability; It is pressed and heated by the electrode part of the circuit board,
An electric circuit component, wherein an electrode portion of the electric circuit element and an electrode portion of the electric circuit board are electrically and mechanically connected to each other via a molten solder. 22. An electric circuit component comprising a photoelectric conversion element having an electrode portion and an electric circuit board having an electrode portion for connecting to the photoelectric conversion element, wherein the electrode portion of the photoelectric conversion element and the electric circuit board are provided. At least one conductive ball provided with a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity, and a holding sheet for embedding and holding the conductive ball. Which is formed of a material having an electrical insulation property, so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding the conductive balls, wherein the electrodes are formed of a metal having good solder wettability, and the conductive balls are formed by an electrode portion of the electric circuit element and an electrode portion of the electric circuit board. An electric circuit characterized in that the electrode part of the electric circuit element and the electrode part of the electric circuit board are electrically and mechanically connected via a molten solder by being pressed and heated. parts. 23. An electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion provided at a position corresponding to the electrode portion of the electric circuit element are opposed to each other to form an electrode portion of the electric circuit element. An electric circuit component in which at least one conductive ball is interposed between the electrode part of the electric circuit board and the two electrode parts are connected to each other, the holding sheet embedding and holding the at least one conductive ball, Holds the conductive ball so that it is formed of an electrically insulating material and a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for the electric circuit element, the electric circuit element has at least one or more photoelectric conversion elements, the electric circuit board has a light-transmitting property at least in part, the holding sheet is air or sealed. It has a light transmittance lower than that of a stop resin and is formed to have an opening at a portion corresponding to the photoelectric conversion element, and the conductive ball is a substantially spherical shape made of at least one of a highly rigid metal material and an inorganic material. A core having the shape of
A conductive coating layer formed of a solder material and coated around the core; the electrodes are formed of a metal having good solder wettability; It is pressed and heated by the electrode part of the circuit board,
An electric circuit component, wherein an electrode portion of the electric circuit element and an electrode portion of the electric circuit board are electrically and mechanically connected to each other via a molten solder. 24. An electric circuit element having an electrode section, an electric circuit board having an electrode section provided at a position corresponding to the electrode section of the electric circuit element, the electric circuit element and the electric circuit board facing each other. In this state, there are at least one conductive ball which is sandwiched between the respective electrode parts and electrically and mechanically connects the both electrode parts, and a holding sheet which embeds and holds the at least one conductive ball. And a conductive ball formed of a material having electrical insulation so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. And a holding sheet for holding the electric circuit element, the electric circuit element has at least one or more photoelectric conversion element, the electric circuit substrate has a light-transmitting property at least in part, the holding sheet is air Has a light transmittance lower than that of the sealing resin and is formed to have an opening in a portion corresponding to the photoelectric conversion element, and the conductive ball is made of at least one of a highly rigid metal material and an inorganic material. A core having a substantially spherical shape,
A conductive coating layer formed of a solder material and coated around the core; the electrodes are formed of a metal having good solder wettability; It is pressed and heated by the electrode part of the circuit board,
An electric circuit component, wherein an electrode portion of the electric circuit element and an electrode portion of the electric circuit board are electrically and mechanically connected to each other via a molten solder. 25. The electricity according to claim 1, wherein a distance between the electrode portions connected by the conductive balls is a distance substantially equal to a diameter of the core. Circuit parts. 26. The outer peripheral surface of the conductive coating layer is formed into a smooth curved surface shape.
The electric circuit component according to any one of 5 above. 27. The electric circuit component according to claim 1, wherein the outer peripheral surface of the core is formed into a smooth curved surface. 28. The electric circuit component according to claim 1, wherein an outer peripheral surface of the conductive coating layer is formed in an uneven shape. 29. The inner peripheral surface of the conductive coating layer is formed in an uneven shape.
8. The electric circuit component according to any one of 8. 30. The electric circuit component according to claim 1, wherein the outer peripheral surface of the core is formed in an uneven shape. 31. The electric circuit component according to claim 1, wherein a plurality of conductive balls are provided between the both electrode portions. 32. The electric circuit component according to claim 1, wherein a resin is sealed between the substrate and the element. 33. The holding sheet is formed with notches and / or slits so that it can be torn.
The electric circuit component according to any one of 1. 34. The conductive coating layer has an electric resistivity of 1.6.
The electric circuit component according to any one of claims 1 to 24, wherein the electric circuit component is formed of a substance having a thickness of E-8 to 10E-8Ω · m. 35. The conductive coating layer has a thickness of 1 to 5
The electrical circuit component according to claim 34, wherein the electrical circuit component is set to 0 μm. 36. The conductive coating layer has a thickness of 3 to 2
36. The electric circuit component according to claim 35, wherein the electric circuit component is set to 0 μm. 37. The core has a diameter of 3 to 500 μm.
25. It is set to m. 25.
The electric circuit component according to any one of 1. 38. The core has a diameter of 10 to 200.
38. The electric circuit component according to claim 37, wherein the electric circuit component is set to .mu.m. 39. The core has a rigidity such that a displacement amount of its diameter becomes 5% or less when a load required for connection between both electrodes is applied. Claim 1
25. The electric circuit component according to any one of items 24 to 24. 40. The core has a rigidity such that a displacement amount of its diameter becomes 1% or less when a load required for connection between both electrodes is applied. Claim 3
The electric circuit component according to item 9. 41. The size of the unevenness of the conductive coating layer is Rm.
31. The electric circuit component according to claim 28, which is 10% or more of a film thickness of an electrode connected by ax and twice or less of a film thickness of a conductive coating layer. 42. The particle is characterized in that the fine and hard metallic material is also formed of an inorganic material.
13. The electric circuit component according to any one of 1 to 12. 43. The size of the particles is set to be larger than 1/10 of the thickness of the electrode and smaller than the total thickness of the conductive coating layer and the electrode. The electric circuit component according to any one of claims 1 to 12. 44. The size of the particles is set to be larger than 1/10 of the thickness of the electrode and smaller than half of the total thickness of the conductive coating layer and the electrode. 44. The electric circuit component according to claim 43. 45. The electric circuit component according to claim 1, wherein the particles are embedded in a partially exposed state over the entire circumference of the conductive coating layer. 46. The particle according to claim 1, wherein the particle is embedded in a state that a part of the conductive coating layer is connected to a corresponding electrode and is exposed.
The electric circuit component according to the item. 47. The particles, on the surface of the conductive coating layer,
The electric circuit component according to claim 1, wherein the electric circuit component is embedded in a partially exposed state. 48. The particles are embedded in a partially exposed state on the surface of the conductive coating layer, and are embedded in the inside in a state where they are not exposed at all. The electric circuit component according to any one of items. 49. A method for manufacturing an electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein a core having substantially ball-shaped rigidity is provided. At least one conductive ball is provided around the conductive coating layer, and the conductive balls are dispersed in the conductive coating layer in a state where fine and hard particles are partially exposed.
As described above, the conductive ball is formed by the first step of interposing between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and the electrode portion of the electric circuit element and the electrode portion of the electric circuit board. A second step of applying pressure, a third step of heating the conductive coating layer of the conductive ball to a predetermined temperature, and a conductive coating between the electrode portion of the electric circuit element and the conductive ball by the pressing and heating. A fourth step of moving the layer and the conductive coating layer between the electrode portion of the electric circuit board and the conductive balls to bring the core and both electrode portions into contact with each other; and cooling the conductive coating layer. And a fifth step of maintaining the contact between the core and both electrode parts and metal-bonding the conductive coating layer and both electrode parts. 50. A method of manufacturing an electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting the electric circuit element, wherein a core having a substantially ball-shaped rigidity is provided. One of the electrode part of the electric circuit element and the electrode part of the electric circuit board is provided with a conductive coating layer provided around the conductive ball, in which fine and hard particles are dispersed in the conductive coating layer in a partially exposed state. A first step of placing at least one on the above, and the other of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board is superposed on the conductive ball, and the conductive ball is sandwiched by both electrodes. A second step of pressing the conductive balls with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; and heating the conductive coating layer of the conductive balls to a predetermined temperature. And a conductive coating layer between the electrode portion of the electric circuit element and the conductive ball, and a conductive layer between the electrode portion of the electric circuit board and the conductive ball by the pressing and heating. A fifth step of moving the covering layer and bringing the core into contact with both electrode parts, respectively.
And a sixth step of cooling the conductive coating layer to maintain contact between the core and both electrode portions to metal-bond the conductive coating layer and both electrode portions. Method for manufacturing electric circuit component. 51. A method of manufacturing an electric circuit component, comprising: an electric circuit element having an electrode section; and an electric circuit board having an electrode section for connecting to the electric circuit element, the method comprising: On one side, a conductive coating layer is provided around a core having a substantially ball-shaped rigidity, and the diameter is smaller than the diameter of the conductive balls dispersed in the conductive coating layer with fine and hard particles partially exposed. A first step of placing a mask member that has been formed and has an opening formed at a position corresponding to the electrode, with the opening corresponding to the electrode; and placing the conductive ball in the opening of the mask member. A second step of housing and placing the conductive ball on at least one of the electrode parts of the electric circuit element and the electric circuit board; and the other step of setting the other of the electric circuit element and the electric circuit board. Electrodes Is placed on the conductive balls so that the conductive balls are sandwiched between the electrodes, and the conductive balls are sandwiched between the electrodes of the electric circuit element and the electric circuit board. A fifth step of heating the conductive coating layer of the conductive ball to a predetermined temperature, and a conductive coating between the electrode portion of the electric circuit element and the conductive ball by the pressing and heating. A sixth step of moving the layer and the conductive coating layer between the electrode portion of the electric circuit board and the conductive balls to bring the core and both electrode portions into contact with each other; and cooling the conductive coating layer. And a seventh step of maintaining the contact between the core and both electrode portions to metal-bond the conductive coating layer and both electrode portions, and an eighth step of removing the mask member. Method for manufacturing electric circuit components . 52. A method of manufacturing an electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, the method comprising: On one side, a conductive coating layer is provided around a core having a substantially ball-shaped rigidity, and the diameter is smaller than the diameter of the conductive balls dispersed in the conductive coating layer with fine and hard particles partially exposed. A first step of placing a formed first mask member having a first opening at a position corresponding to the electrode in a state where the opening corresponds to the electrode; and the first mask member. The first mask member is formed so that the total thickness thereof is smaller than 1.5 times the diameter of the conductive ball, and the second opening is formed at a position corresponding to the electrode. The formed second mask member is replaced with the first mask member.
And a second step of superimposing so that the second openings communicate with each other, and the conductive balls are housed in the first and second openings of the first and second mask members, respectively. A third step of mounting at least one or more of the electric circuit element and one of the electrode portions of the electric circuit board, a fourth step of removing the second mask member, the electric circuit element and the electric circuit A fifth step of placing the other side of the substrate so that the electrode portion thereof overlaps the conductive ball and sandwiching the conductive ball between the electrodes, and the electrode portion of the electric circuit element and the electric circuit. A sixth step of pressing the conductive balls with the electrode portion of the substrate, a seventh step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and the pressing and heating of the electric circuit element Electrode part and the conductive ball And a conductive coating layer between the electrode portion of the electric circuit board and the conductive ball, to move the conductive coating layer between the core and both electrode portions, and the conductive coating layer A ninth step of cooling and maintaining the contact between the core and both electrode portions to metal-bond the conductive coating layer and both electrode portions; and a tenth step of removing the first mask member. A method of manufacturing an electric circuit component, comprising: 53. A method of manufacturing an electric circuit component including an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting the electric circuit element, wherein a core having a substantially ball-shaped rigidity is used. One of a conductive ball, which is provided with a conductive coating layer around the conductive ball and in which fine and hard particles are dispersed in the conductive coating layer in a partially exposed state, and an electrode portion of the electric circuit element and an electrode portion of the electric circuit board. A first step of bringing the one electrode portion and the conductive ball into contact with each other, a third step of heating the conductive coating layer of the conductive ball to a predetermined temperature, A fourth step of moving the conductive coating layer between the one electrode portion and the conductive ball by the pressure and heating to bring the core and the one electrode portion into contact with each other; Cool down before A fifth step of maintaining contact between the core and the one electrode portion to metallize or alloy the conductive coating layer and the one electrode portion, and a conductive ball connected to the one electrode, A sixth method of bringing the electrode portion of the electric circuit element and the other electrode portion of the electric circuit board into contact with each other to sandwich the conductive ball between the electrodes.
The step of pressing the conductive balls with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; and an eighth step of heating the conductive coating layer of the conductive balls to a predetermined temperature. A step of moving the conductive coating layer between the other electrode portion and the conductive ball by the pressure and heating to bring the core and the other electrode portion into contact with each other; A tenth step of cooling the conductive coating layer to maintain contact between the core and the other electrode portion to metal-bond the conductive coating layer and the other electrode portion. Manufacturing method of electric circuit parts. 54. A method for manufacturing an electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein a concave portion corresponding to the electrode is provided on an upper surface. A conductive coating layer is provided around the core having a substantially ball-shaped rigidity in the concave portion of the mold, and conductive balls in which fine and hard particles are partially exposed are dispersed in the conductive coating layer. A first step of accommodating in a partially projected state; a second step of bringing the conductive ball into contact with one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; and the one electrode A third step of applying pressure to the conductive ball by the portion and the concave portion, a fourth step of heating the conductive coating layer of the conductive ball to a predetermined temperature, and the one electrode portion by the pressing and heating. And said conductivity A fifth step of moving the conductive coating layer between the core and the one electrode part, and cooling the conductive coating layer, and the core and the one electrode part. A step of metallizing or alloying the conductive coating layer and the one electrode part by maintaining the contact between the electric circuit element and the electric circuit board to which the conductive ball is connected from the mold. A seventh step of taking out one of the electrodes, the conductive ball connected to the one electrode, the electrode portion of the electric circuit element and the other of the electrode portions of the electric circuit board are brought into contact with each other, and the conductive ball is connected by both electrodes. 8th to be clamped
And a ninth step of pressing the conductive balls with the electrode portions of the electric circuit element and the electrode portions of the electric circuit board, and a tenth step of heating the conductive coating layer of the conductive balls to a predetermined temperature. A step of moving the conductive coating layer between the other electrode portion and the conductive ball by the pressing and heating to bring the core and the other electrode portion into contact with each other; A twelfth step of cooling the conductive coating layer to maintain contact between the core and the other electrode portion to metal-bond the conductive coating layer and the other electrode portion. Manufacturing method of electric circuit parts. 55. A method of manufacturing an electric circuit component including an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting the electric circuit element, wherein a core having a substantially ball-shaped rigidity is used. A first step of interposing at least one or more conductive balls having a conductive coating layer formed of a solder material on the periphery between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; A second step of pressurizing the conductive balls by an electrode part of the circuit element and an electrode part of the electric circuit board; a third step of heating the conductive coating layer of the conductive balls to a predetermined temperature; And a fourth step of bringing the core into contact with the electrode part of the electric circuit element and the electrode part of the electric circuit board by heating, respectively, and cooling the conductive coating layer to form the core and the two electrode parts. Contact Causes the lifting method of electrical circuit components, characterized by comprising a fifth step of connecting the two electrode portions through the solder melted electrically and mechanically. 56. A method of manufacturing an electric circuit component including an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein a core having a substantially ball-shaped rigidity is used. A first step of placing at least one or more conductive balls having a conductive coating layer formed of a solder material on one side thereof on one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; A second step of superposing the other of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board on the conductive ball, and sandwiching the conductive ball between both electrodes; A third step of pressing the conductive balls with the electrode portion of the electric circuit board, a fourth step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and the pressing and heating of the conductive balls. And a fifth step of bringing the electrode portion of the electric circuit element and the electrode portion of the electric circuit board into contact with each other, and cooling the conductive coating layer to maintain contact between the core and both electrode portions, And a sixth step of electrically and mechanically connecting the both electrode parts via a molten solder. 57. A method of manufacturing an electric circuit component comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, the method comprising: A mask, which is formed on one side to be thinner than the diameter of a conductive ball and has a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity, and an opening is formed at a position corresponding to the electrode. A first step of mounting a member in a state where the opening corresponds to the electrode; and storing the conductive ball in the opening of the mask member, and setting the conductive ball to the electric circuit element and the electric circuit. A second step of placing at least one or more electrodes on one of the electrode portions of the substrate; and placing the other of the electric circuit element and the electric circuit substrate so that the electrode portions of the electric circuit element and the electric circuit substrate overlap with the conductive balls. , The guide A third step of sandwiching the ball between the electrodes, a fourth step of pressing the conductive ball with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, and a conductive coating layer of the conductive ball A fifth step of heating the core to a predetermined temperature, a sixth step of bringing the core and the electrode portion of the electric circuit element into contact with the electrode portion of the electric circuit board by the pressurization and heating, respectively. A seventh step of cooling the coating layer to maintain contact between the core and both electrode portions, and electrically and mechanically connecting both electrode portions through molten solder, and removing the mask member 8. A method for manufacturing an electric circuit component, comprising: an eighth step. 58. A method of manufacturing an electric circuit component, comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting to the electric circuit element, the method comprising: A conductive ball having a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity is formed on one side and has a diameter smaller than that of a conductive ball, and a first opening is formed at a position corresponding to the electrode. A first step of placing the formed first mask member in a state where the opening corresponds to the electrode, and a total thickness of the first mask member and the first mask member is A second mask member formed to be thinner than 1.5 times the diameter of the conductive ball and having a second opening formed at a position corresponding to the electrode,
And a second step of superimposing so that the second openings communicate with each other, and the conductive balls are housed in the first and second openings of the first and second mask members, respectively. A third step of mounting at least one or more of the electric circuit element and one of the electrode portions of the electric circuit board, a fourth step of removing the second mask member, the electric circuit element and the electric circuit A fifth step of placing the other side of the substrate so that the electrode portion thereof overlaps the conductive ball and sandwiching the conductive ball between the electrodes, and the electrode portion of the electric circuit element and the electric circuit. A sixth step of pressing the conductive balls with the electrode portion of the substrate, a seventh step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and the pressing and heating of the core and the electric layer. Electrode part of circuit element and the above Eighth step of respectively contacting the electrode portion of the air circuit board, and cooling the conductive coating layer to maintain the contact between the core and both electrode portions, the both electrode portions through the molten solder A method of manufacturing an electric circuit component, comprising a ninth step of electrically and mechanically connecting and a tenth step of removing the first mask member. 59. A method of manufacturing an electric circuit component, comprising an electric circuit element having an electrode section and an electric circuit board having an electrode section for connecting the electric circuit element, wherein a core having a substantially ball-shaped rigidity is used. A first step of contacting a conductive ball having a conductive coating layer formed of a solder material on the periphery with one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; and the one electrode portion. A second step of pressing the conductive balls against each other, a third step of heating the conductive coating layer of the conductive balls to a predetermined temperature, and the pressing and heating of the one electrode portion and the conductive balls. And a fourth step of electrically and mechanically connecting them via molten solder, and a fifth step of cooling the conductive coating layer to maintain contact between the core and the one electrode portion. , One of the above And connected to the conductive ball into contact with the other electrode portion of the electric circuit board and the electrode portion of the electrical circuit element, a to sandwich the conductive balls by the electrodes 6
The step of pressing the conductive balls with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; and an eighth step of heating the conductive coating layer of the conductive balls to a predetermined temperature. A ninth step of bringing the core into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board by pressing and heating, and cooling the conductive coating layer to form the core. And a tenth step of maintaining contact between the two electrode parts and electrically and mechanically connecting the two electrode parts through a molten solder. 60. A method of manufacturing an electric circuit component, comprising: an electric circuit element having an electrode section; and an electric circuit board having an electrode section for connecting to the electric circuit element, wherein a recess corresponding to the electrode is provided on an upper surface. A first step of accommodating a conductive ball having a conductive coating layer formed of a solder material around a core having a substantially ball-shaped rigidity in the recess of the mold, the conductive ball being partially projected; A second step of bringing the ball into contact with one of the electrode portion of the electric circuit element and the electrode portion of the electric circuit board; and a third step of pressing the conductive ball with the one electrode portion and the recess. And a fourth step of heating the conductive coating layer of the conductive ball to a predetermined temperature, and electrically and electrically between the one electrode portion and the conductive ball by molten solder by the pressing and heating. And mechanical A fifth step of connecting, a sixth step of cooling the conductive coating layer to maintain contact between the core and the one electrode part, and the electrical connection of the conductive ball from the mold. A seventh step of taking out one of the circuit element and the electric circuit board; bringing the conductive ball connected to the one electrode into contact with the electrode part of the electric circuit element and the other of the electrode parts of the electric circuit board; Eighth holding the conductive ball between both electrodes
And a ninth step of pressing the conductive balls with the electrode portions of the electric circuit element and the electrode portions of the electric circuit board, and a tenth step of heating the conductive coating layer of the conductive balls to a predetermined temperature. An eleventh step of bringing the core into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board by pressing and heating, and cooling the conductive coating layer to form the core. And a twelfth step of maintaining the contact between the two electrode portions and electrically and mechanically connecting the both electrode portions through a molten solder. 61. The method of manufacturing an electric circuit component according to claim 49, wherein the electric circuit element includes at least one photoelectric conversion element. 62. The method of manufacturing an electric circuit component according to claim 49, wherein an outer peripheral surface of the conductive coating layer is formed into a smooth curved surface. 63. The method of manufacturing an electric circuit component according to claim 49, wherein the outer peripheral surface of the core is formed into a smooth curved surface. 64. The method of manufacturing an electric circuit component according to claim 49, wherein an outer peripheral surface of the conductive coating layer is formed in a concave-convex shape. 65. The method of manufacturing an electric circuit component according to claim 49, wherein an inner peripheral surface of the conductive coating layer is formed in an uneven shape. 66. The method of manufacturing an electric circuit component according to claim 49, wherein the outer peripheral surface of the core is formed in an uneven shape. 67. In the first step, a plurality of conductive balls are provided between both electrode portions.
The manufacturing method of an electric circuit component according to any one of 9, 50, 55, and 56. 68. In the second step, a plurality of conductive balls are provided between both electrode portions.
57. A method for manufacturing an electric circuit component according to 1 or 57. 69. In the third step, a plurality of conductive balls are provided between both electrode portions.
The manufacturing method of the electric circuit component according to 2 or 58. 70. The method of manufacturing an electric circuit component according to claim 53 or 59, wherein in the first step, a plurality of conductive balls are brought into contact with the one electrode portion at a time. 71. The method of manufacturing an electric circuit component according to claim 54 or 60, wherein in the first step, a plurality of conductive balls are housed in the recess at once. 72. The method for manufacturing an electric circuit component according to claim 49, further comprising a step of sealing between the substrate and the element with a resin. 73. The mask member according to claim 51, 52, 57 or 58, wherein a notch and / or a slit is formed in the mask member so that the mask member can be torn. Manufacturing method of electric circuit parts. 74. The conductive coating layer has an electric resistivity of 1.6.
The method of manufacturing an electric circuit component according to any one of claims 49 to 60, characterized in that the electric circuit component is formed of a material of E-8 to 10E-8Ω · m. 75. The conductive coating layer has a thickness of 1 to 5
The manufacturing method of the electric circuit component according to claim 74, wherein the thickness is set to 0 μm. 76. The conductive coating layer has a thickness of 3 to 2
76. The method of manufacturing an electric circuit component according to claim 75, wherein the thickness is set to 0 μm. 77. The core has a diameter of 3 to 500 μm.
m is set to m.
0. The method for manufacturing an electric circuit component according to any one of 0. 78. The core has a diameter of 10 to 200.
78. The method for manufacturing an electric circuit component according to claim 77, wherein the manufacturing method is set to μm. 79. The core has rigidity such that a displacement amount of a diameter thereof is 5% or less when a load required for connection between both electrodes is applied. Claim 4
A method for manufacturing an electric circuit component according to any one of 9 to 60. 80. The core has rigidity such that a displacement amount of a diameter thereof is 1% or less when a load required for connection between both electrodes is applied. Claim 7
9. The method for manufacturing an electric circuit component according to item 9. 81. The size of the unevenness of the conductive coating layer is Rm.
67. The electric circuit component according to claim 64, wherein the thickness is 10% or more of a film thickness of an electrode connected by ax and is 2 times or less of a film thickness of a conductive coating layer. Production method. 82. The pressing of the conductive balls in the second step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 56. The proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Manufacturing method of electric circuit parts. 83. The pressing of the conductive balls in the third step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 57. The proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. 57. Manufacturing method of electric circuit parts. 84. The pressing of the conductive balls in the fourth step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 58. The proximity operation is stopped and the pressurizing operation is ended when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Manufacturing method of electric circuit parts. 85. The pressing of the conductive balls in the sixth step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 59. The proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Manufacturing method of electric circuit parts. 86. The pressing of the conductive balls in the seventh step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 60. The proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Manufacturing method of electric circuit parts. 87. The pressing of the conductive balls in the ninth step is performed by bringing the electric circuit element and the electric circuit board close to each other, and the electrodes of the electric circuit element and the electric circuit board are pressed. 61. The proximity operation is stopped and the pressurizing operation is terminated when the distance from the electrode becomes substantially equal to the diameter of the core of the conductive ball. Manufacturing method of electric circuit parts. 88. The particle according to claim 4, wherein the fine and hard metal material is also formed of an inorganic material.
55. The method for manufacturing an electric circuit component according to any one of 9 to 54. 89. The size of the particles is set to be larger than 1/10 of the thickness of the electrode and smaller than the sum of the thickness of the conductive coating layer and the thickness of the electrode. 55. The method for manufacturing an electric circuit component according to claim 49. 90. The size of the particles is set to be larger than one tenth of the thickness of the electrode and smaller than half of the total thickness of the conductive coating layer and the electrode. 90. The method for manufacturing an electric circuit component according to claim 89. 91. The electric circuit component according to claim 49, wherein the particles are embedded in a partially exposed state over the entire circumference of the conductive coating layer. Production method. 92. The particle according to claim 49, wherein the particle is embedded in a state in which only a portion of the conductive coating layer to which a corresponding electrode is connected is exposed. A method of manufacturing an electric circuit component according to. 93. The particles, on the surface of the conductive coating layer,
55. The method for manufacturing an electric circuit component according to claim 49, wherein the method is embedded in a partially exposed state. 94. The particle is embedded in the surface of the conductive coating layer in a partially exposed state, and is embedded in the inside in a state of not being exposed at all.
55. A method for manufacturing an electric circuit component according to any one of items 54 to 54. 95. A conductive ball for connecting an electrode part of an electric circuit element having an electrode part and an electric circuit board having an electrode part to each other, wherein a core having a substantially ball-shaped rigidity and a core of this core are provided. A conductive ball comprising a conductive coating layer coated on the periphery and fine and hard particles dispersed in a state where a part of the conductive coating layer is exposed. 96. The conductive coating layer of the conductive ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to form an electrode portion of the electric circuit element and an electrode portion of the electric circuit board. The conductive ball according to claim 95, which is electrically and mechanically connected to at least one of them. 97. A conductive ball for connecting an electrode part of an electric circuit element having an electrode part and an electric circuit board having an electrode part to each other is made of at least one of a metal material and an inorganic material having high rigidity. A core having a substantially spherical shape, a conductive coating layer formed of a material having electrical conductivity and coated around the core, and fine and hard particles dispersed in a state where a part of the conductive coating layer is exposed. An electrically conductive ball comprising: 98. The conductive coating layer of the conductive ball is pressed into contact with the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to form an electrode portion of the electric circuit element and an electrode portion of the electric circuit board. The conductive ball according to claim 97, wherein the conductive balls are metal-bonded to each other. 99. An electric circuit element having an electrode portion and an electric circuit board having the electrode portion, which are conductive balls for connecting the electrode portions to each other, have a substantially ball-shaped core and a core having rigidity. A conductive ball having a conductive coating layer which is coated on the periphery and is formed of a solder material. 100. An electrically conductive ball for connecting an electrode portion of an electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion, which is made of at least one of a metal material and an inorganic material having high rigidity. A conductive ball comprising: a core having a substantially spherical shape; and a conductive coating layer formed of a solder material and coated around the core. 101. The conductive coating layer of the conductive ball is melted by being heated by being sandwiched between the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, thereby melting the electric circuit element. The conductive ball according to claim 99 or 100, wherein the electrode portion and the electrode portion of the electric circuit board are electrically and mechanically connected. 102. The conductive ball according to claim 95, wherein the outer peripheral surface of the conductive coating layer is formed into a smooth curved surface. 103. The outer peripheral surface of the core is formed in a smooth curved surface shape.
The conductive ball according to any one of 2 above. 104. The conductive ball according to claim 95, wherein an outer peripheral surface of the conductive coating layer is formed in an uneven shape. 105. The conductive coating layer according to claim 95, wherein an inner peripheral surface of the conductive coating layer is formed in an uneven shape.
And the conductive ball according to any one of 104. 106. The outer peripheral surface of the core is formed in a concave-convex shape.
And the conductive ball according to any one of 104. 107. The conductive coating layer has an electrical resistivity of 1.
The conductive ball according to any one of claims 95 to 101, which is formed of a material having a density of 6E-8 to 10E-8Ω · m. 108. The conductive coating layer is set to have a thickness of 1 to 50 μm.
7. The conductive ball according to 7. 109. The conductive coating layer has a thickness set to 3 to 20 μm.
8. The conductive ball according to item 8. 110. The core has a diameter of 3 to 500.
102. The conductive ball according to claim 95, wherein the conductive ball is set to have a thickness of μm. 111. The core has a diameter of 10 to 20.
110. The size is set to 0 .mu.m.
The conductive ball according to. 112. The core has a rigidity such that a displacement amount of a diameter thereof is 5% or less when a load required for connection between both electrodes is applied. The conductive ball according to any one of claims 95 to 101. 113. The core has a rigidity such that a displacement amount of a diameter thereof is 1% or less when a load required for connection between both electrodes is applied. The conductive ball according to claim 112. 114. The size of the unevenness of the conductive coating layer is R
107. The conductive ball according to claim 104, which is 10% or more of a film thickness of an electrode connected at max and is 2 times or less of a film thickness of a conductive coating layer. 115. The conductive ball according to any one of claims 95 to 98, wherein the particles are made of a fine and hard metal material made of an inorganic material. 116. The size of the particles is set to be larger than 1/10 of the thickness of the electrode and smaller than the total thickness of the conductive coating layer and the electrode. The conductive ball according to any one of claims 95 to 98. 117. The size of the particles is set to be larger than 1/10 of the thickness of the electrode and smaller than half of the total thickness of the conductive coating layer and the electrode. The conductive ball according to claim 116, wherein: 118. The conductive ball according to any one of claims 95 to 98, wherein the particles are embedded in a partially exposed state over the entire circumference of the conductive coating layer. 119. The particle is embedded in a state in which a part of the particle is exposed only in a portion of the conductive coating layer to which the corresponding electrode is connected. The conductive ball according to. 120. The conductive ball according to claim 95, wherein the particles are embedded in the surface of the conductive coating layer in a partially exposed state. 121. The particle is embedded in the surface of the conductive coating layer in a partially exposed state, and is embedded in the inside in a state of not being exposed at all.
The conductive ball according to any one of 5 to 98. 122. A conductive connecting member used for connecting electrode portions of an electric circuit element having an electrode portion and an electric circuit board having an electrode portion to each other, the periphery of a core having a substantially ball-shaped rigidity. A conductive coating layer is provided on the conductive coating layer, and at least one conductive ball in which fine and hard particles are dispersed in a state where a part of the conductive coating layer is exposed; Formed of a material having a static insulating property, and holding the conductive ball so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A conductive connecting member, comprising: a holding sheet. 123. The conductive ball, which is pressed against the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to project from the electrode portion of the electric circuit element and one surface of the holding sheet. An electrical and mechanical connection is made between the cover layer portion of the ball and the electrode portion of the electric circuit board and the cover layer portion of the conductive ball protruding from the other surface of the holding sheet. 13. The method according to claim 12, wherein
2. The conductive connecting member according to 2. 124. In a conductive connecting member used for connecting an electrode portion of an electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion to each other, at least a metallic material and an inorganic material having high rigidity are used. A core having a substantially spherical shape consisting of one side, a conductive coating layer formed of a material having electrical conductivity and coated around the core, and fine particles dispersed in a state where a part of the conductive coating layer is exposed. And a holding sheet for embedding and holding at least one or more conductive balls, the conductive balls being formed of a material having electrical insulation, and a part of the conductive balls protruding from one surface. A holding sheet for holding the conductive ball so that the conductive ball is exposed and a part of the conductive ball is projected from the other surface to be exposed. 125. The conductive ball is pressed against the electrode portion of the electric circuit element and the electrode portion of the electric circuit board to project from the electrode portion of the electric circuit element and one surface of the holding sheet. Between the cover layer portion of the ball, and between the electrode portion of the electric circuit board and the cover layer portion of the conductive ball protruding from the other surface of the holding sheet,
The electrically conductive connecting member according to claim 124, which is electrically and mechanically connected to each other. 126. The conductive material according to claim 123, wherein the conductive coating layer of the conductive ball is metal-bonded to the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, respectively. Connection member. 127. In a conductive connecting member used for connecting an electrode portion of an electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion to each other, the periphery of a core having a substantially ball-shaped rigidity. And at least one conductive ball provided with a conductive coating layer formed of a solder material, and a holding sheet for embedding and holding the conductive ball, the holding sheet being formed of a material having an electrical insulation property. A holding sheet for holding the conductive ball so that a part of the conductive ball is projected and exposed and a part of the conductive ball is projected and exposed from the other surface. . 128. In a conductive connecting member used for connecting electrode portions of an electric circuit element having an electrode portion and an electric circuit board having an electrode portion, at least a metallic material and an inorganic material having high rigidity are used. A conductive ball having a core having a substantially spherical shape composed of one side, a conductive coating layer formed of a solder material and covering the periphery of the core, and a holding sheet for holding at least one conductive ball embedded therein. A conductive ball formed of a material having electrical insulation so that a part of the conductive ball projects and is exposed from one surface and a part of the conductive ball projects and is exposed from the other surface. A holding sheet for holding the conductive connecting member. 129. The conductive ball is pressed against and heated by the electrode portion of the electric circuit element and the electrode portion of the electric circuit board, so that the electrode portion of the electric circuit element and the electrode portion of the electric circuit board are heated. 127 or 12 is characterized in that the two are electrically and mechanically connected via a molten solder.
8. The conductive connecting member according to item 8. 130. The outer peripheral surface of the conductive coating layer is formed in a smooth curved surface shape.
130. The conductive connecting member according to any one of 1 to 129. 131. The outer peripheral surface of the core is formed in a smooth curved surface shape.
The conductive connecting member according to any one of 30. 132. The outer peripheral surface of the conductive coating layer is formed in an uneven shape.
The conductive connecting member according to any one of 1. 133. The inner peripheral surface of the conductive coating layer is formed in a concave-convex shape.
The conductive connecting member according to any one of 9 and 132. 134. The conductive connecting member according to any one of claims 122 to 129 and 132, wherein the outer peripheral surface of the core is formed in an uneven shape. 135. The conductive coating layer has an electrical resistivity of 1.
130. The device according to claim 122, which is made of a material having a density of 6E-8 to 10E-8Ω · m.
The conductive connecting member according to item. 136. The conductive coating layer has a thickness set to 1 to 50 μm.
5. The conductive connecting member according to item 5. 137. The conductive coating layer has a thickness set to 3 to 20 μm.
6. The conductive connecting member according to item 6. 138. The core has a diameter of 3 to 500.
130. The conductive connecting member according to claim 122, wherein the conductive connecting member is set to μm. 139. The core has a diameter of 10 to 20.
138. It is set to 0 μm.
The conductive connecting member according to. 140. The core has a rigidity such that a displacement amount of a diameter thereof is 5% or less when a load required for connection between both electrodes is applied. The conductive connecting member according to any one of claims 122 to 129. 141. The core has rigidity such that a displacement amount of a diameter thereof is 1% or less when a load required for connection between both electrodes is applied. The conductive connecting member according to claim 140. 142. The size of the unevenness of the conductive coating layer is R.
The conductive connecting member according to any one of claims 132 to 134, wherein the conductive connecting member has a thickness of 10% or more of a thickness of an electrode to be connected and a thickness of 2 times or less of a thickness of the conductive coating layer. 143. The conductive connecting member according to any one of claims 122 to 126, wherein the particles are made of a fine and hard metal material made of an inorganic material. 144. The size of the particles is set to be larger than 1/10 of the thickness of the electrode and smaller than the total thickness of the conductive coating layer and the electrode. The conductive connecting member according to any one of claims 122 to 126. 145. The size of the particles is set to be larger than one tenth of the thickness of the electrode and smaller than half of the total thickness of the conductive coating layer and the electrode. The conductive connecting member according to claim 144, wherein: 146. The conductive connecting member according to any one of claims 122 to 126, wherein the particles are embedded in a partially exposed state over the entire circumference of the conductive coating layer. 147. The particle according to claim 122, wherein the particle is embedded in a state in which only a portion of the conductive coating layer to which a corresponding electrode is connected is exposed. The conductive connecting member according to. 148. The conductive connecting member according to any one of claims 122 to 126, wherein the particles are embedded in the surface of the conductive coating layer in a partially exposed state. 149. The particle is embedded in the surface of the conductive coating layer in a partially exposed state, and is embedded in the inside in a state of not being exposed at all.
122. The conductive connecting member according to any one of 22 to 126. 150. A method for manufacturing a conductive connecting member used for connecting an electrode portion of an electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion to each other, the method having a substantially ball-shaped rigidity. A conductive coating layer is provided around the core, and at least one conductive ball in which fine and hard particles are dispersed in a state where a part of the conductive coating layer is exposed is provided at a predetermined interval between the lower mold and the upper mold. A first step of sandwiching in a separated state, a second step of filling a synthetic resin between the lower die and the upper die, and a third step of releasing a molding material from the lower die and the upper die. And a fourth step of etching the upper and lower surfaces of the released molding material so that the upper and lower portions of the conductive balls project and are exposed from the upper and lower surfaces of the synthetic resin holding sheet, respectively. Conductive connection member Manufacturing method. 151. A manufacturing method of a conductive connecting member used for connecting an electrode portion of an electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion to each other, which has substantially ball-shaped rigidity. A conductive coating layer is provided around the core, and the lower portion of at least one conductive ball in which fine and hard particles are dispersed with the conductive coating layer partially exposed is placed in the first recess of the lower mold. A first step of placing the upper mold having a second recess corresponding to the first recess of the lower mold, and an upper part of the conductive ball is housed in the second recess. A third step of filling a synthetic resin between the lower mold and the upper mold, a fourth step of releasing the molding material from the lower mold and the upper mold, and a mold release The upper and lower surfaces of the formed molding material are etched to create a synthetic resin holding sheet From below sided, manufacturing method of the conductive connection member, characterized by comprising a fifth step of the upper and lower portion of the conductive balls is exposed by each protrusion. 152. A method of manufacturing a conductive connecting member used for connecting an electric circuit element having an electrode portion and an electric circuit board having an electrode portion to each other, wherein the electric connecting element has substantially ball-shaped rigidity. A first step of sandwiching at least one conductive ball having a conductive coating layer formed of a solder material around a core with the lower mold and the upper mold separated from each other by a predetermined distance; And a second step of filling a synthetic resin between the upper mold, a third step of releasing the molding material from the lower mold and the upper mold, and etching the upper and lower surfaces of the released molding material, A fourth step of exposing the upper and lower portions of the conductive balls from the upper and lower surfaces of a synthetic resin holding sheet so that the conductive balls project and are exposed, respectively. 153. A manufacturing method of a conductive connecting member used for connecting an electrode portion of an electric circuit element having an electrode portion and an electric circuit substrate having an electrode portion to each other, the method having a substantially ball-shaped rigidity. A first step of placing a lower part of at least one conductive ball having a conductive coating layer formed of a solder material around a core in a first recess of the lower mold; A second step of covering an upper mold having a second recess corresponding to the recess so that the upper part of the conductive ball is housed in the second recess; In between, a third step of filling a synthetic resin, a fourth step of releasing the molding material from the lower mold and the upper mold, and etching the upper and lower surfaces of the released molding material to make a synthetic resin. From the upper and lower sides of the holding sheet, the upper and lower parts of the conductive ball are respectively Method for producing a conductive connection member, characterized by comprising a fifth step of exposing out. 154. The method of manufacturing a conductive connecting member according to claim 153, wherein the first and second recesses are formed to have a depth smaller than a radius of the conductive ball. . 155. The outer peripheral surface of the conductive coating layer is formed into a smooth curved surface.
154. The method for manufacturing a conductive connecting member according to any one of 1 to 154. 156. The outer peripheral surface of the core is formed in a smooth curved surface shape.
55. The method for manufacturing a conductive connecting member according to any one of 55. 157. The outer peripheral surface of the conductive coating layer is formed in an uneven shape.
The method for manufacturing a conductive connecting member according to any one of 1. 158. The inner peripheral surface of the conductive coating layer is formed in an uneven shape.
158. The method for manufacturing a conductive connecting member according to any one of 5 and 157. 159. The outer peripheral surface of the core is formed in a concave-convex shape.
55. A method for manufacturing a conductive connecting member according to any one of 55 and 157. 160. The conductive coating layer has an electrical resistivity of 1.
156. Any one of claims 150 to 155, characterized in that it is formed from a substance of 6E-8 to 10E-8 Ω · m.
Item 8. A method for manufacturing a conductive connecting member according to item. 161. The conductive coating layer has a thickness set to 1 to 50 μm.
0. The method for manufacturing a conductive connecting member according to item 0. 162. The conductive coating layer has a thickness set to 3 to 20 μm.
1. The method for manufacturing the conductive connecting member according to 1. 163. The core has a diameter of 3 to 500.
The method for producing a conductive connecting member according to any one of claims 150 to 155, wherein the conductive connecting member is set to have a thickness of μm. 164. The core has a diameter of 10 to 20.
163. It is set to 0 μm.
A method for manufacturing the conductive connecting member according to. 165. The core has a rigidity such that a displacement amount of a diameter thereof is 5% or less when a load required for connection between both electrodes is applied. The method for manufacturing a conductive connecting member according to any one of claims 150 to 155. 166. The core has a rigidity such that a displacement amount of a diameter thereof is 1% or less when a load required for connection between both electrodes is applied. The manufacturing method of the conductive connecting member according to claim 165. 167. The size of the irregularities of the conductive coating layer is R.
160. The conductive connecting member according to any one of claims 157 to 159, wherein the film thickness is 10% or more of a film thickness of an electrode connected at max and is twice or less the film thickness of a conductive coating layer. Production method. 168. The method for producing a conductive connecting member according to claim 150 or 151, wherein the particles are fine and hard metal materials formed of inorganic materials. 169. The size of the particles is set to be larger than one tenth of the thickness of the electrode and smaller than the total thickness of the conductive coating layer and the electrode. The method for manufacturing a conductive connecting member according to claim 150 or 151. 170. The size of the particles is set to be larger than 1/10 of the thickness of the electrode and smaller than half of the total thickness of the conductive coating layer and the electrode. 169. The method of manufacturing a conductive connecting member according to claim 169. 171. The method for producing a conductive connecting member according to claim 150 or 151, wherein the particles are embedded in a partially exposed state over the entire circumference of the conductive coating layer. 172. The conductive connection according to claim 150 or 151, wherein the particles are embedded in a state in which only a portion of the conductive coating layer to which a corresponding electrode is connected is exposed. A method of manufacturing a member. 173. The method for producing a conductive connecting member according to claim 150 or 151, wherein the particles are embedded in the surface of the conductive coating layer in a partially exposed state. 174. The particle is embedded in a partially exposed state on the surface of the conductive coating layer, and is embedded inside in a completely unexposed state.
50. The manufacturing method of the conductive connecting member according to 50 or 151.