JP2005039122A5 - - Google Patents

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Publication number
JP2005039122A5
JP2005039122A5 JP2003276099A JP2003276099A JP2005039122A5 JP 2005039122 A5 JP2005039122 A5 JP 2005039122A5 JP 2003276099 A JP2003276099 A JP 2003276099A JP 2003276099 A JP2003276099 A JP 2003276099A JP 2005039122 A5 JP2005039122 A5 JP 2005039122A5
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JP
Japan
Prior art keywords
light emitting
light
emitting device
sealing
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003276099A
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Japanese (ja)
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JP4238666B2 (en
JP2005039122A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2003276099A external-priority patent/JP4238666B2/en
Priority to JP2003276099A priority Critical patent/JP4238666B2/en
Priority to DE102004034166.4A priority patent/DE102004034166B4/en
Priority to US10/891,422 priority patent/US7391153B2/en
Priority to DE102004063978.7A priority patent/DE102004063978B4/en
Priority to CN2009100096747A priority patent/CN101476710B/en
Priority to CNB2004100712619A priority patent/CN100472820C/en
Publication of JP2005039122A publication Critical patent/JP2005039122A/en
Publication of JP2005039122A5 publication Critical patent/JP2005039122A5/ja
Publication of JP4238666B2 publication Critical patent/JP4238666B2/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (7)

所定の波長の光を放射するフリップチップ型の発光素子部を封止材料からなる封止部で封止して形成される発光装置において、
前記封止部の内部応力を緩和し前記発光素子部の角部を斜辺状にカットすることによって形成される応力緩和部を前記発光素子部に設けたことを特徴とする発光装置。 In a light emitting device formed by sealing a flip chip type light emitting element that emits light of a predetermined wavelength with a sealing portion made of a sealing material,
A light emitting device comprising: a stress relieving part formed in the light emitting element part by relieving an internal stress of the sealing part and cutting a corner of the light emitting element part into a hypotenuse . 前記封止部は、前記封止材料としてガラスを用いることを特徴とする請求項１記載の発光装置。   The light emitting device according to claim 1, wherein the sealing portion uses glass as the sealing material. 前記封止部は、前記光を所定の方向に放射させる光学形状を有することを特徴とする請求項１記載の発光装置。   The light emitting device according to claim 1, wherein the sealing portion has an optical shape that emits the light in a predetermined direction. 前記封止部は、少なくとも２層のガラス層を積層して形成される複合ガラスを加熱プレスすることによって前記光を放射する前記発光素子部と一体化することを特徴とする請求項１記載の発光装置。   The said sealing part is integrated with the said light emitting element part which radiates | emits the said light by heat-pressing the composite glass formed by laminating | stacking at least 2 layers of glass layers. Light emitting device. 前記複合ガラスは、前記光によって励起される薄膜状の蛍光体層を前記少なくとも２層のガラス層に介在させてなることを特徴とする請求項４記載の発光装置。   5. The light-emitting device according to claim 4, wherein the composite glass is formed by interposing a thin-film phosphor layer excited by the light in the at least two glass layers. 前記複合ガラスは、前記光によって励起される蛍光錯体を含有した蛍光錯体含有ガラス層を含むことを特徴とする請求項４記載の発光装置。   The light emitting device according to claim 4, wherein the composite glass includes a fluorescent complex-containing glass layer containing a fluorescent complex excited by the light. 前記発光素子部は、基板と、前記基板上の発光層と、を有し、
前記応力緩和部を前記発光素子部の前記基板に設けたことを特徴とする請求項１から６のいずれか１項に記載の発光装置。 The light emitting element section includes a substrate and a light emitting layer on the substrate,
The light-emitting device according to claim 1, wherein the stress relaxation portion is provided on the substrate of the light-emitting element portion .
JP2003276099A 2003-07-17 2003-07-17 Method for manufacturing light emitting device Expired - Fee Related JP4238666B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003276099A JP4238666B2 (en) 2003-07-17 2003-07-17 Method for manufacturing light emitting device
DE102004034166.4A DE102004034166B4 (en) 2003-07-17 2004-07-15 Light-emitting device
US10/891,422 US7391153B2 (en) 2003-07-17 2004-07-15 Light emitting device provided with a submount assembly for improved thermal dissipation
DE102004063978.7A DE102004063978B4 (en) 2003-07-17 2004-07-15 Light-emitting device
CN2009100096747A CN101476710B (en) 2003-07-17 2004-07-16 Illuminating device and its manufacture method
CNB2004100712619A CN100472820C (en) 2003-07-17 2004-07-16 Illuminating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003276099A JP4238666B2 (en) 2003-07-17 2003-07-17 Method for manufacturing light emitting device

Publications (3)

Publication Number Publication Date
JP2005039122A JP2005039122A (en) 2005-02-10
JP2005039122A5 true JP2005039122A5 (en) 2007-06-07
JP4238666B2 JP4238666B2 (en) 2009-03-18

Family

ID=34212528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003276099A Expired - Fee Related JP4238666B2 (en) 2003-07-17 2003-07-17 Method for manufacturing light emitting device

Country Status (2)

Country Link
JP (1) JP4238666B2 (en)
CN (1) CN101476710B (en)

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WO2006112417A1 (en) 2005-04-15 2006-10-26 Asahi Glass Company, Limited Glass-sealed light-emitting device, circuit board with glass-sealed light-emitting device, and methods for manufacturing those
JP4604819B2 (en) * 2005-04-28 2011-01-05 豊田合成株式会社 Light emitting device
JP2007201354A (en) * 2006-01-30 2007-08-09 Matsushita Electric Ind Co Ltd Light-emitting module
JP2007258466A (en) * 2006-03-23 2007-10-04 Sumita Optical Glass Inc Illuminating device, and light-emitting device
DE102008021436A1 (en) * 2008-04-29 2010-05-20 Schott Ag Optic converter system for (W) LEDs
US9634203B2 (en) * 2008-05-30 2017-04-25 Sharp Kabushiki Kaisha Light emitting device, surface light source, liquid crystal display device, and method for manufacturing light emitting device
WO2011007816A1 (en) * 2009-07-15 2011-01-20 三菱化学株式会社 Semiconductor light-emitting element, semiconductor light-emitting device, method for manufacturing semiconductor light-emitting element, and method for manufacturing semiconductor light-emitting device
JP2013077798A (en) * 2011-09-14 2013-04-25 Toyoda Gosei Co Ltd Glass sealing led lamp and manufacturing method of the same
JP5880025B2 (en) * 2011-12-26 2016-03-08 日亜化学工業株式会社 Light emitting device
KR102059030B1 (en) * 2012-09-24 2019-12-24 엘지이노텍 주식회사 Ultraviolet light emitting device
JP2015079929A (en) 2013-09-11 2015-04-23 株式会社東芝 Semiconductor light-emitting device and method of manufacturing the same
JP6477734B2 (en) * 2016-06-30 2019-03-06 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
CN110118312A (en) * 2018-02-07 2019-08-13 深圳光峰科技股份有限公司 Wavelength converter

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JPS5995652U (en) * 1982-12-18 1984-06-28 株式会社東芝 light emitting element
EP0405757A3 (en) * 1989-06-27 1991-01-30 Hewlett-Packard Company High efficiency light-emitting diode
JP2979961B2 (en) * 1994-06-14 1999-11-22 日亜化学工業株式会社 Full color LED display
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JPH1140871A (en) * 1997-07-22 1999-02-12 Mitsubishi Chem Corp Photoelectric conversion element
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JP3707279B2 (en) * 1998-03-02 2005-10-19 松下電器産業株式会社 Semiconductor light emitting device
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