JP2005032869A - Substrate treatment equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide substrate treatment equipment which can suppress the generation of dust and the leakage of a liquid by eliminating a driving section and a sealing section by a simple structure inside a treatment vessel, and which can be reduced in size as a whole. <P>SOLUTION: The substrate treatment equipment comprises the treatment vessel 10 for liquid-treating a substrate 1, substrate holders 11 which hold the peripheral edge of the substrate 1 in the treatment vessel 10 by circumferences of vertical inside shafts and rotate the substrate 1, treatment liquid supply nozzle 13 for supplying various treatment liquids to the substrate 1 held by the substrate holders 11, first partition plates 15 which are radially extended from the center via the substrate holders 11 to partition a space below the substrate 1 inside the treatment vessel 10, second partition plates 16 for partitioning spaces between the first partition plates 15, and a pair of gas nozzles 12 which blows out gas toward the substrate holders 11 in both directions. This substrate treatment equipment is so structured that the direction of rotation of the substrate 1 is changed according to the type of a treatment liquid, and the direction in which the gas nozzles 12 blow out gas toward each substrate holder 11 is also changed in conjunction with the change in rotating direction of the substrate 1, to blow down the treatment liquid into either a space R or a space L on the right and left of each of the first partition plates 15 respectively according to the type of the treatment liquid. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus. More specifically, for example, a substrate such as a semiconductor wafer, a glass for liquid crystal, a substrate for a hard disk, a photomask substrate, etc. is held and rotated in a hermetically sealed processing tank and processed on this surface. The present invention relates to a substrate processing apparatus for supplying (applying) a liquid to perform liquid processing.
[0002]
[Prior art]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-15402
Conventionally, as a substrate processing apparatus, for example, a semiconductor wafer, a glass for liquid crystal, a substrate for a hard disk, a photomask substrate, etc. are carried one by one into a sealed processing tank and rotated, and a desired liquid is applied to the surface. There is known a single-wafer type substrate processing apparatus (for example, refer to Patent Document 1) including a process of supplying a liquid and performing a drying process after a liquid process such as a cleaning process, an etching process, and a rinse process. FIG. 11 is a configuration diagram showing such a single-wafer type conventional substrate processing apparatus.
[0004]
As shown in FIG. 11, the conventional substrate processing apparatus includes a processing tank 30, a spin chuck 31 that holds the substrate 1 in the processing tank 30, a rotation motor 31 a that rotates the spin chuck 31, and the substrate 1. A nozzle 33 for supplying various processing liquids to the surface, a recovery member 35 having an inclined portion 35a for recovering the processing liquid scattered on the outer periphery of the substrate 1 as the substrate 1 rotates, and an inner bottom surface of the recovery member 35 A first discharge port 37a provided on the outside, a second discharge port 37b provided on the outer bottom surface of the recovery member 35, and an elevating mechanism 36 for raising and lowering the recovery member 35.
[0005]
The conventional substrate processing apparatus having such a configuration performs liquid processing by holding the substrate 1 on the spin chuck 31 and rotating it, supplying a predetermined processing liquid from the nozzle 33 to the surface, and applying it. At this time, the recovery member 35 is arranged in a first state (position of K1) in which the inclined portion 35a is located above the outer periphery of the spin chuck 31, and discharges the processing liquid from the first first discharge port 37a. . When the substrate 1 is subsequently subjected to liquid processing with another new processing liquid, it is necessary to prevent the first processing liquid and the next processing liquid from being mixed in the processing tank 30. Accordingly, the recovery member 35 is lowered to a second state (position K2) where the surface of the substrate 1 held by the spin chuck 31 is positioned above the inclined portion 35a, so that a new other processing liquid is first introduced. Can be distributed without being mixed with the treatment liquid and discharged from the second discharge port 37b.
[0006]
As described above, the conventional substrate processing apparatus, when processing the surface of the substrate 1 with a plurality of processing liquids in order, prevents the processing liquids from being mixed in the processing tank 30, so The liquid system (the 1st discharge port 37a and the 2nd discharge port 37b) was provided, and it formed in the structure which can raise / lower the collection | recovery member 35 with a process liquid, and can change a drainage system.
[0007]
[Problems to be solved by the invention]
However, in the conventional substrate processing apparatus, since it is necessary to provide a mechanical drive part provided with the elevating mechanism 36 in the collection member 35 that distributes different processing liquids in the processing tank 30, dust is generated from the driven part. There was a bug.
Further, in the conventional substrate processing apparatus, since the recovery member 35 is provided with the elevating mechanism 36 provided outside the processing tank 30 so as to penetrate the inside thereof, a sealing for sealing so as not to leak liquid from the through portion is always provided. It is necessary to ensure resistance to a high-concentration processing solution such as an alkali, and there is a problem that a complicated structure using many expensive parts is used.
Furthermore, in the conventional substrate processing apparatus, since it is necessary to provide the recovery member 35 for recovering the processing liquid around the spin chuck 31 in the processing tank 30, there is a problem that the processing tank 30 is enlarged in the lateral direction. .
The present invention solves such problems, and provides a substrate processing apparatus capable of reducing dust generation and liquid leakage by eliminating a driving part and a sealing part with a simple structure in a processing tank, and miniaturizing the entire apparatus. Objective.
[0008]
[Means for Solving the Problems]
In order to solve the above-described problems, a substrate processing apparatus according to the present invention includes a processing tank that performs liquid processing on a substrate that is an object to be processed with a processing liquid, and at least three vertical ends of the substrate in the processing tank. A substrate holder that is held (clamped) and rotated around the inner axis, a processing liquid supply nozzle that can supply different processing liquids to the surface of the substrate held by the substrate holder, and a lower portion of the substrate in the processing tank The first partition plate that extends radially from the center to the outside via the substrate holding portion, the second partition plate that further partitions each of the first partition plates, and the substrate toward the substrate holding portion that holds the substrate And a pair of gas nozzles that blow gas in both directions rotating in the forward and reverse directions, and changing the forward and reverse rotation directions of the substrate in accordance with different types of processing liquid in the processing tank, and the gas nozzles in each substrate holding part Spray Direction also by changing to suit the normal and reverse rotation is provided to the first partition plate with respect blow down distributes the kind of the processing solution to the left and right spaces.
[0009]
Here, it is preferable that the processing tank is provided with a drain that discharges the processing liquid that has been distributed and blown off by the injection of the gas nozzle, for each type that is distributed from the bottom. Moreover, it is preferable that the processing tank further includes a rinsing nozzle that supplies pure water to the front surface and the back surface of the substrate after the processing by the processing liquid supply nozzle. The treatment tank further includes a drying nozzle for blowing either nitrogen containing nitrogen or organic compound vapor, dry air, or dry air containing organic compound vapor on each surface of the substrate. In addition, a mechanism for scanning the drying nozzle from the center of the substrate to the outer peripheral edge of the substrate is preferably provided.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of a substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a configuration diagram showing an embodiment of a substrate processing apparatus according to the present invention. FIG. 2 is a diagram showing a state seen from the direction of arrow C shown in FIG. FIG. 3 is a diagram showing a cross section taken along line DD shown in FIG. FIG. 4 is a diagram showing an operation of the substrate processing apparatus shown in FIG. 1 by forward rotation (clockwise). FIG. 5 is a view showing a cross section taken along line EE shown in FIG. FIG. 6 is a view showing a cross section taken along line FF shown in FIG. FIG. 7 is a diagram showing the flow of the processing liquid by the operation shown in FIG. FIG. 8 is a diagram showing an operation by reverse rotation (counterclockwise) of the substrate processing apparatus shown in FIG. FIG. 9 is a diagram showing the flow of the processing liquid by the operation shown in FIG. Moreover, FIG. 10 is a figure which shows the other Example of the processing tank shown in FIG.
[0011]
As shown in FIG. 1, one embodiment of a substrate processing apparatus according to the present invention seals a substrate 1 such as a semiconductor wafer, a glass for liquid crystal, a hard disk substrate, a photomask substrate, etc., as in the prior art shown in FIG. The processing tank 10 was carried one by one and rotated, and a desired processing solution was supplied to the surface of the substrate 1 to perform a drying process after a liquid process such as a cleaning process, an etching process, or a rinsing process. It is a single wafer type device.
Further, in the present embodiment, unlike the prior art shown in FIG. 11, a processing tank 10 for processing a substrate 1 as a processing object with a processing liquid, and an outer peripheral end of the substrate 1 in the processing tank 10. At least three or more (four in FIG. 1) substrate holding portions 11 that are held (sandwiched) around a vertical inner axis and rotated, and various treatments differing on the surface of the substrate 1 held by the substrate holding portions 11 A treatment liquid supply nozzle 13 capable of supplying a liquid; a first partition plate 15 extending radially from the center to the outside at a lower portion of the substrate 1 in the treatment tank 10 via the substrate holding portion 11; and the first partition plate And a pair of two gas nozzles 12 for blowing gas in both directions of forward and reverse rotation of the substrate 1 toward the substrate holding portion 11 holding the substrate 1. . That is, in the present embodiment, the forward / reverse rotation direction of the substrate 1 is changed according to different types of treatment liquid in the treatment tank 10, and the direction in which the gas nozzle 12 sprays each substrate holding unit 11 is also matched to the forward / reverse rotation. By changing the type of the treatment liquid, the types of the treatment liquid are distributed to the left and right spaces R and L with reference to the first partition plate 15 so as to be blown off (see FIGS. 7 and 9).
[0012]
Here, the processing tank 10 is sealed with a hollow inside a box-like shape, and the substrate 1 is provided in the sealed inside so that it can be loaded by opening and closing a side door that is not shown. . In the processing tank 10, the processing liquid supply nozzle 13, the gas nozzle 12, and the substrate holding unit 11 described above are provided, and pure water is supplied to the front surface and the back surface of the substrate 1 after the processing liquid supply nozzle 13 is processed to rinse. A rinse nozzle 14 is further provided. Then, as shown in FIG. 2, a treatment liquid such as a chemical liquid A, a chemical liquid B, or pure water is selectively supplied from the treatment liquid supply nozzle 13 to the substrate 1, and a gas such as nitrogen or dry air is supplied from the gas nozzle 12. Each is arranged so that it is ejected and pure water is supplied from the rinse nozzle 14. At this time, the gas nozzles 12 are arranged in pairs on both sides of the substrate holding unit 11 shown in FIG. 1, and a right gas nozzle that ejects gas toward the substrate holding unit 11 in the clockwise (forward rotation) direction of the substrate 1. 12a and a left gas nozzle 12b that ejects gas in the counterclockwise (reverse rotation) direction of the substrate 1 are provided to enable injection from both directions. Further, the substrate holding unit 11 includes a rotation motor 11a below the processing tank 10 shown in FIG. 2, and is rotatably supported by the rotation motor 11a so as to penetrate three or more into the processing tank 10. An existing shaft 11b, a mounting portion 11c that extends in a disc shape at the tip of the shaft 11b, and mounts the substrate 1, and a substrate 1 that has a small diameter perpendicular to the center of the mounting portion 11c in a cylindrical shape. A contact portion 11d that rotates by holding (holding) the outer periphery thereof around the axis.
[0013]
Further, for example, when four substrate holding portions 11 are provided, the processing tank 10 is provided with a first partition plate 15 extending diagonally from the center to the four corners inside the square as shown in FIG. The substrate holding portions 11 are provided between the center and the four corners of the partition plate 15, respectively. In this processing tank 10, the second partition plate 16 extends in a cross shape so as to partition the first partition plate 15, and a triangle is formed on the right side through the first partition plate 15 around the lower portion of the substrate holder 11. Space R and a triangular space L on the left side are respectively arranged on the left and right sides. Here, the embodiment in which the processing tank 10 is box-shaped inside and formed into a square has been described. However, the present invention is not limited thereto. For example, the first tank 15 and the first partition plate 15 that are cylindrical and radiate from the center in the bottom of the hollow. It is also possible to partition in a fan shape by the second partition plate 16. In the processing tank 10, either the right gas nozzle 12 a or the left gas nozzle 12 b shown in FIG. 1 is ejected according to the rotation direction, so that either the left or right of the processing liquid on the substrate 1 is partitioned by the first partition plate 15. It is possible to distribute and blow off the spaces R and L. Further, as shown in FIG. 3, the treatment tank 10 is provided with drains 17 for discharging the treatment liquid distributed and blown off by the gas nozzle 12 from the bottoms in the spaces R and L as shown in FIG. ing. That is, the drain 17 has a discharge path divided between the left drain 17a provided in the left space L with the first partition plate 15 interposed therebetween and the right drain 17b provided in the right space R, so that different types of processing liquids are provided. We discharge so as not to mix.
[0014]
When the substrate 1 is processed with the processing liquids of the chemical liquid A and the chemical liquid B using the embodiment of the substrate processing apparatus according to the present invention formed as described above, the substrate 1 is first held as shown in FIG. The substrate 1 is rotated by being held by the contact portion 11d of the portion 11 and rotating the substrate holding portion 11 by the rotation motor 11a (see FIG. 2). In FIG. 4, the substrate holding part 11 is rotated counterclockwise, and at this time, the substrate 1 is rotated clockwise (forward rotation). Further, in the processing tank 10, the left drain 17b provided in the left space L with the first partition plate 15 interposed therebetween is closed, and the right drain 17a provided in the right space R is opened, and the processing liquid supply nozzle 13 (FIG. 2), an appropriate amount of the chemical solution A is supplied to the surface of the rotating substrate 1.
[0015]
Here, in the present embodiment, the substrate holder 11 rotates the substrate 1 at 100 rpm to 300 rpm. In this case, as shown in FIG. 5, on the surface where the outer peripheral edge of the substrate 1 is not in contact with the substrate holder 11, the chemical solution A stays on the substrate 1 due to the surface tension of the processing liquid and does not scatter from the outer peripheral edge. To maintain. On the other hand, when the outer peripheral edge of the substrate 1 is in contact with the contact part 11d of the substrate holding part 11, the processing liquid on the substrate 1 is attracted to the contact part 11d of the substrate holding part 11 as shown in FIG. It will be in the state. In such a state, by setting the diameter I of the contact portion 11d shown in FIG. 6 to be smaller than the diameter J of the substrate 1, and increasing the centrifugal force (rotational speed) of the contact portion 11d with respect to the substrate 1, The processing liquid can be scattered in the direction of the arrow H shown in FIG. However, if the diameter I of the contact portion 11d is extremely small, it becomes difficult to rotate the substrate 1 at a predetermined speed, and therefore setting the diameter ratio between the substrate 1 and the contact portion 11d becomes important.
[0016]
Here, it has been found that it is most preferable that the diameter I of the contact portion 11d is about 1/10 of the diameter J of the substrate 1 and the rotational speed of the contact portion 11d is 10 times that of the substrate 1. That is, the centrifugal force at the outer peripheral end of the contact portion 11d is most preferably about 10 times the centrifugal force at the outer peripheral end of the substrate 1. Further, in the contact portion 11d of the substrate holding portion 11 under such conditions, as shown in FIG. 4, the processing liquid adhered to the outer portion (outer portion not in contact with the substrate 1) far from the center of the processing bath 10. As a result, nitrogen or dry air is blown from the gas nozzle 12 so that the processing liquid is scattered in the direction of the arrow G so that it does not fly to the space L side of the processing tank 10. That is, when the substrate 1 is rotating clockwise (forward rotation), the gas nozzle 12 sprays only the right gas nozzle 12a as shown in FIG. 7, thereby blowing the processing liquid adhering to the outer portion of the contact portion 11d into the space R. Operates to drop. Therefore, when the substrate 1 is liquid-treated with the chemical solution A, the drainage is collected in the space R of the processing tank 10 and drained by the right drain 17a shown in FIG.
[0017]
Thereafter, in the treatment tank 10, the supply of the chemical liquid A by the treatment liquid supply nozzle 13 shown in FIGS. 1 and 2 is stopped, and the rinse nozzle 14 supplies pure water to the front surface and the back surface of the substrate 1 to perform a rinsing (cleaning) process. Execute. At this time, the right drain 17a and the left drain 17b of the spaces R and L shown in FIG. 3 are both opened, and the rinsing process is continued for a predetermined period of time as in the above-described operation. Further, the processing liquid supply nozzle 13 may stop the supply of the chemical liquid A shown in FIG. 2 and may switch to the supply of pure water to improve the efficiency of the rinsing process.
[0018]
Next, after the rinsing process is completed, as shown in FIG. 8, the liquid process using the chemical solution B is performed by rotating the substrate 1 in the reverse direction (counterclockwise) at a speed of 100 rpm to 300 rpm. That is, in the processing tank 10, the substrate holding part 11 is rotated clockwise, and thereby the substrate 1 is rotated counterclockwise (reversely rotated). Further, in the processing tank 10, the right drain 17 a provided in the right space R with the first partition plate 15 interposed therebetween is closed, and the left drain 17 b provided in the left space L is opened and rotated from the processing liquid supply nozzle 13. The chemical solution B is supplied to the surface of the substrate 1 to be performed (see FIG. 2). Then, as shown in FIG. 9, the gas nozzle 12 scatters the processing liquid toward the space L by ejecting only the left gas nozzle 12 b toward the counterclockwise direction of the substrate 1. Therefore, in the processing tank 10, the chemical solution B is collected in the space L during reverse rotation and does not scatter in the space R from which the chemical solution A is discharged. Therefore, the chemical solution A and the chemical solution B are mixed and chemically reacted. Can be prevented. As described above, in the processing tank 10, after the substrate 1 is liquid-treated with the chemical solution B, the drainage is drained by the left drain 17 b at the bottom of the space L.
[0019]
Then, when the liquid treatment with the chemical solution B is completed, the pure water rinse treatment with the chemical solution supply nozzle 13 and the rinse nozzle 14 described above is finally performed, and then the supply of pure water is stopped and dried by centrifugal force. Then, the substrate 1 is removed from the substrate holder 11 and transferred to the next step. Thereafter, the plurality of substrates 1 are liquid-treated by repeating the above-described operation.
[0020]
As described above, according to an embodiment of the substrate processing apparatus of the present invention, the driving part of the mechanism for draining and separating the processing liquid other than rotating the substrate 1 by the simple structure in which the bottom of the processing tank 10 is partitioned is provided in the tank. Since it is not necessary to provide inside, the dust generation in the processing tank 10 can be reduced to the maximum.
In addition, according to one embodiment of the substrate processing apparatus of the present invention, since the mechanism for draining and separating the processing liquid has a simple structure in which the bottom of the processing tank 10 is partitioned as described above, the draining and separating mechanism is sealed and sealed. It is not necessary to ensure complicated conditions such as durability, and the cost of parts can be sufficiently reduced.
Furthermore, according to one embodiment of the substrate processing apparatus according to the present invention, because of the simple structure in which the inside of the processing tank 10 is partitioned by the first partition plate 15 and the second partition plate 16, as in the prior art shown in FIG. There is no need to provide a recovery member for separating the processing liquid around the substrate, and the entire processing tank 10 can be downsized.
[0021]
Incidentally, in the processing tank 10 shown in FIG. 1, the embodiment in which the pure water adhered after rinsing the substrate 1 is dried by centrifugal force has been described in detail. However, the present invention is not limited to this. It is also possible to further provide a drying nozzle 18 for blowing the air. As shown in FIG. 10, another embodiment of the processing tank provided with the drying nozzle 18 as described above includes a gas nozzle 12, a processing liquid supply nozzle 13, and a rinse nozzle 14 in the tank. A drying nozzle 18 for spraying on the surface is provided. Here, the processing tank 20 shown in FIG. 10 is the same component as the processing tank shown in FIG. 1 except for the drying nozzle 18, and the same components are denoted by the same reference numerals and redundant description is omitted. To do.
[0022]
The drying nozzle 18 is provided so that either nitrogen or nitrogen containing an organic compound vapor, or dry air or dry air containing an organic compound vapor can be injected. The drying nozzle 18 includes a mechanism capable of scanning from the center of the substrate 1 to the outer peripheral end of the substrate 1 inside the processing tank 20. Therefore, in another embodiment of the processing tank, after the final rinsing process of the substrate 1, the surface of the substrate 1 can be quickly dried by scanning the drying nozzle 18 from the center of the substrate 1 to the outer end of the substrate 1.
[0023]
Thus, according to the other Example of a processing tank, since all are the same components as the processing tank shown in FIG. 1 except the drying nozzle 18, the effect similar to the processing tank shown in FIG. 1 can be acquired. At the same time, after the rinsing process of the substrate 1, the drying nozzle 18 can be scanned and dried quickly, so that the production efficiency can be improved.
[0024]
As mentioned above, although the embodiment of the substrate processing apparatus according to the present invention has been described in detail, the present invention is not limited to the above-described embodiment, and can be changed without departing from the gist thereof.
For example, although the example which distributes the process liquid of the chemical | medical solution A and the chemical | medical solution B each was demonstrated in detail, when performing liquid processing only with a single chemical | medical solution, it is not limited to this, This chemical | medical solution and pure water are used. It is also possible to distribute them.
[0025]
【The invention's effect】
As described above, according to the substrate processing apparatus of the present invention, it is necessary to provide a driving part of the mechanism for draining and separating the processing liquid in addition to rotating the substrate by a simple structure in which the bottom of the substrate in the processing tank is partitioned. Therefore, it is possible to reduce dust generation in the treatment tank to the maximum.
In addition, according to the substrate processing apparatus of the present invention, the above-described processing liquid drain separation mechanism has a simple structure in which the bottom of the processing tank is partitioned, so that the drain separation mechanism has complicated conditions such as sealing and resistance. Therefore, it is possible to sufficiently reduce the cost of parts.
Furthermore, according to the substrate processing apparatus of the present invention, it is necessary to provide a processing liquid separating member around the substrate in the processing tank because of the simple structure in which the inside of the processing tank is partitioned by the first partition plate and the second partition plate. There is no, and the whole tank can be reduced in size.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing an embodiment of a substrate processing apparatus according to the present invention.
FIG. 2 is a diagram showing a state viewed from the direction of arrow C shown in FIG.
FIG. 3 is a view showing a cross section taken along line DD shown in FIG. 2;
4 is a diagram showing an operation of the substrate processing apparatus shown in FIG. 1 by forward rotation.
FIG. 5 is a view showing a cross section taken along line EE shown in FIG. 4;
6 is a cross-sectional view taken along line FF shown in FIG.
7 is a view showing a flow of a processing liquid by the operation shown in FIG. 4;
FIG. 8 is a view showing an operation by reverse rotation of the substrate processing apparatus shown in FIG. 1;
FIG. 9 is a view showing a flow of processing liquid by the operation shown in FIG. 8;
FIG. 10 is a view showing another embodiment of the treatment tank shown in FIG.
FIG. 11 is a configuration diagram showing a conventional substrate processing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 10 Processing tank 11 Substrate holding part 11a Rotating motor 11b Shaft 11c Placement part 11d Contact part 12 Gas nozzle 12a Right gas nozzle 12b Left gas nozzle 13 Treatment liquid supply nozzle 14 Rinse nozzle 15 First partition plate 16 Second partition plate 17 Drain 17a Right drain 17b Left drain

Claims (4)

A treatment tank for treating a substrate to be treated with a treatment liquid;
A substrate holding unit for rotating (holding) and rotating the outer peripheral edge of the substrate around at least three vertical inner axes in the processing tank;
A treatment liquid supply nozzle capable of supplying various different treatment liquids to the surface of the substrate held by the substrate holding unit;
A first partition plate extending radially from the center to the outside at the lower part of the substrate in the processing tank via the substrate holding part;
A second partition plate further partitioning each of the first partition plates;
A pair of gas nozzles each blowing gas in both directions of forward and reverse rotation of the substrate toward the substrate holding portion holding the substrate;
By changing the direction of forward and reverse rotation of the substrate according to different types of the processing liquid in the processing tank, and also changing the direction in which the gas nozzle sprays each substrate holding part in accordance with the forward and reverse rotation, A substrate processing apparatus, wherein a type of the processing liquid is distributed and blown off in left and right spaces with reference to the first partition plate. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the processing tank is provided with a drain for discharging each processing liquid distributed and blown off from the bottom by the gas nozzle. The substrate processing apparatus according to claim 1 or 2,
The substrate processing apparatus, wherein the processing tank is further provided with a rinsing nozzle for supplying pure water to the front and back surfaces of the substrate after the processing of the processing liquid supply nozzle. 4. The substrate processing apparatus according to claim 1, wherein the processing tank is either nitrogen, nitrogen containing an organic compound vapor, dry air, or dry air containing an organic compound vapor. 5. A substrate processing apparatus, further comprising: a drying nozzle that sprays the substrate to the front and back surfaces of the substrate, and a mechanism for scanning the drying nozzle from the center of the substrate to the outer peripheral edge of the substrate.

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