JP2005026310A - Mounted part and method of dismounting the same - Google Patents

Mounted part and method of dismounting the same Download PDF

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Publication number
JP2005026310A
JP2005026310A JP2003187583A JP2003187583A JP2005026310A JP 2005026310 A JP2005026310 A JP 2005026310A JP 2003187583 A JP2003187583 A JP 2003187583A JP 2003187583 A JP2003187583 A JP 2003187583A JP 2005026310 A JP2005026310 A JP 2005026310A
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JP
Japan
Prior art keywords
mounting component
component
heat
energization
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003187583A
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Japanese (ja)
Inventor
Hiroyoshi Hashino
弘義 橋野
Yukari Hama
由香里 濱
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Konica Minolta Opto Inc
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Konica Minolta Opto Inc
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Publication date
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Priority to JP2003187583A priority Critical patent/JP2005026310A/en
Publication of JP2005026310A publication Critical patent/JP2005026310A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To enable to dismount only a mounted part required through a simple method. <P>SOLUTION: A heating means (3) heats up to a certain temperature solder melts when a current is applied to it, and is provided on the mounted part (1) mounted on a board by soldering. A heat control means (4) is also provided on the mounted part (1), and determines on the basis of control signals inputted from the outside whether an electric current is applied to the heating means (3) or not. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、実装部品及び実装部品の取り外し方法に関する。
【０００２】
【従来の技術】
従来、基板に半田付けされたＢＧＡ（ボール・グリッド・アレイ）や、ＬＧＡ（ランド・グリッド・アレイ）等の実装部品を取り外す場合には、取り外す対象となる実装部品を挟持部材で挟持した状態で実装部品に熱風を当てて半田を溶融させて取り外していた（例えば、特許文献１参照）。この際、取り外す実装部品の周囲の実装部品の半田を熱風で溶融させないように、通常は、カバー等によって取り外す実装部品を周囲の実装部品から隔離する。
【０００３】
【特許文献１】
特開平８−２７４４６０号公報
【０００４】
【発明が解決しようとする課題】
しかし、実装部品が基板上に高密度に実装されている場合には、取り外す実装部品のみを周囲の実装部品から隔離することは困難である。そのため、作業に取りかかる前に、取り外す実装部品の周囲の部品を取り外す必要があり、実装部品の取り外しに手間がかかるものとなっていた。
【０００５】
そこで、本発明の課題は、基板に半田付けされた後に基板から取り外す作業を簡単に行うことができる実装部品及び実装部品の取り外し方法を提供することにある。
【０００６】
【課題を解決するための手段】
以上の課題を解決するため、請求項１に記載の発明は、基板に半田付けされる実装部品であって、通電により、前記半田が溶融可能な温度で発熱する発熱手段を備えることを特徴とする。
【０００７】
請求項１に記載の発明によれば、発熱手段に通電すると、発熱手段は半田が溶融可能な温度で発熱し、実装部品と基板とを接合している半田を溶融させる。すなわち、取り外す実装部品自身が発熱するので、熱風を当てる必要もなくなり、取り外す実装部品の周囲の部品を取り外すことなく、取り外したい実装部品だけを簡単に取り外すことができる。
【０００８】
請求項２に記載の発明は、請求項１に記載の電子機器において、外部からの制御信号の入力に基づいて、前記発熱手段への通電のＯＮ／ＯＦＦを制御する発熱制御手段を備えることを特徴とする。
【０００９】
請求項２に記載の発明によれば、外部からの制御信号の入力に基づいて、発熱制御手段が発熱手段への通電のＯＮ／ＯＦＦを制御する。すなわち、発熱制御手段は、実装部品を基板から取り外すときだけ発熱手段に通電させることができるので、発熱手段を実装部品の電気回路上に設けることができ、実装部品の電源と発熱手段の電源を兼用することができる。
【００１０】
請求項３に記載の発明は、基板に半田付けされ、前記半田が溶融可能な温度で発熱する発熱手段を備える実装部品を、前記基板から取り外す実装部品の取り外し方法であって、前記基板から取り外す前記実装部品を選択する第１選択ステップと、選択された前記実装部品を取り外すための前記発熱手段への通電条件を選択する第２選択ステップと、前記第２選択ステップによって選択された通電条件に基づいた電流を前記発熱手段に通電する通電ステップと、を備えることを特徴とする。
【００１１】
請求項３に記載の発明によれば、第１選択ステップにより、基板から取り外す実装部品を選択し、第２選択ステップにより、選択された前記実装部品を取り外すための前記発熱手段への通電条件を選択する。そして、通電ステップにより、第２選択ステップによって選択された通電条件に基づいた電流を前記発熱手段に通電する。よって、取り外す実装部品の周囲の部品を取り外すことなく、取り外したい実装部品だけを簡単に取り外すことができる。また、作業者が所望する実装部品の取り外し作業に合わせて作業方法を選択することができる。
【００１２】
【発明の実施の形態】
以下、図面を参照して本発明の実装部品に係る実施の一形態について詳細に説明する。
＜実装部品の構成＞
実装部品１には、図１に示すように、データの演算処理や記憶処理を行うＩＣチップ２、通電により、半田が溶融可能な温度で発熱する発熱手段としてのニクロム線３、ニクロム線３に結線され、ニクロム線３への通電のＯＮ／ＯＦＦを制御する発熱制御手段としての半導体回路４等を備え、基板（図示省略）に、ＢＧＡ、ＬＧＡ、ＱＦＮ等により半田付けされる。
ニクロム線３は、電気抵抗値を大きくするためにできる限り細く長く成形されたものが用いられ、実装部品１内でコイル状に巻いておくことが好ましい。
また、ニクロム線３は、一端が半導体回路４に接続され、他端がＧＮＤ（アース）に接続されている。
【００１３】
ニクロム線３は、少なくとも半田が溶融可能な温度、例えば、１８３℃以上の温度で発熱するように通電され、実装部品１の半田付けが行われる場所に近い位置に設けられている。
半導体回路４としては、例えば、ｐチャンネルのＭＯＳＦＥＴ（電界効果トランジスタ）４ａを用いて構成されたものが用いられる。具体的には、半導体回路４は、ＭＯＳＦＥＴ４ａのソースＳ側にニクロム線３に通電するための電源５が接続され、ゲートＧ側に通電のＯＮ／ＯＦＦを制御する制御信号を入力する制御部６が接続され、ドレインＤ側にニクロム線３が接続されて構成されている。
【００１４】
電源５は、ニクロム線３を発熱させるために電流を発生させ、制御部６によって制御された電流値を出力する。
制御部６は、ＭＯＳＦＥＴ４ａのゲートＧにニクロム線３への通電のＯＮ／ＯＦＦに関する制御信号を入力するとともに、作業者によって選択された通電条件に基づいて電源５がニクロム線３に流す電流を制御する。ここで、通電条件とは、実装部品１の半田を短時間で溶融させて取り外し時間を短縮する、周囲の実装部品に熱影響を与えることなく実装部品１を取り外す、等の取り外し条件を指す。
入力部８は、作業者が基板から取り外す実装部品１を選択する機能を有するとともに、選択された実装部品１を取り外すためのニクロム線３への通電条件を選択する機能を有する。
【００１５】
＜実装部品の取り外し方法＞
次に、実装部品１を基板から取り外す方法について説明する。
実装部品１を基板から取り外す場合には、基板上から作業者が取り外す実装部品１を選択する（第１選択ステップ）。
次いで、電源５からの入力よりも低い電圧をゲートＧにかける。すると、電源５からの電流はＭＯＳＦＥＴ４ａのソースＳからドレインＤに流れるので、ニクロム線３に電流が流れて発熱し、実装部品１の半田を溶融させる。
【００１６】
この際、ユーザは、周囲の部品への熱による影響を無視してでも短時間で半田を溶融させて実装部品１を取り外すのか、周囲の部品への熱による影響を考慮して必要最低限の電流で取り外す実装部品１の半田を溶融させるのかを選択し、入力する（第２選択ステップ）。
次いで、第２選択ステップによって選択された取り外し方法に応じた電流をニクロム線３に通電する（通電ステップ）。
【００１７】
一方、実装部品１を基板から取り外さない場合には、制御部６からの制御信号を遮断するか、あるいは、電源５からの入力よりも高い電圧をゲートＧにかける。すると、電源５からの電流はＭＯＳＦＥＴ４ａで遮断されるので、ニクロム線３に電流が流れず、実装部品１の半田を溶融させることがない。
【００１８】
本実施の形態の実装部品１によれば、ニクロム線３に通電すると、ニクロム線３は半田が溶融可能な温度で発熱し、実装部品１と基板とを接合している半田を溶融させる。すなわち、取り外す実装部品１自身が発熱するので、熱風を当てる必要もなくなり、取り外す実装部品１の周囲の部品を取り外すことなく、取り外したい実装部品１だけを簡単に取り外すことができる。
【００１９】
また、半導体回路４により、実装部品１を基板から取り外すときだけニクロム線３に通電させることができるので、ニクロム線３を実装部品１の回路上に設けることができ、実装部品１の電源とニクロム線３の電源を兼用することができる。但し、共通の電源ラインに接続される部品が他にある場合は、十分に考慮する必要がある。また、予め基板の配線パターンにも電流を十分に流すことができるように設計しておく必要があり、また、電流供給能力が十分にある電源を用いる必要がある。
【００２０】
更に、上記のような実装部品１の取り外し方法によれば、作業者が所望する実装部品１の取り外し作業に合わせて作業方法を選択することができる。
【００２１】
なお、本発明は、上記実施の形態に限定されるものではなく、例えば、発熱手段として用いるものはニクロム線３に限らず、ニクロム線３に比較的近い電気抵抗値を有するカーマロイ、鉄クロムのような材料を用いてもよい。また、基板に形成したパターンの一部を発熱手段として用いてもよい。更に、半導体回路４を構成するトランジスタは、ｐチャンネルのＭＯＳＦＥＴ４ａに限らず、ｎチャンネルのＭＯＳＦＥＴ等の他の種類のトランジスタを用いてもよい。
その他、本発明は、発明の要旨を逸脱しない範囲内で自由に変更、改良が可能である。
【００２２】
【発明の効果】
請求項１に記載の発明によれば、発熱手段に通電すると、発熱手段は半田が溶融可能な温度で発熱し、実装部品と基板とを接合している半田を溶融させる。すなわち、取り外す実装部品自身が発熱するので、熱風を当てる必要もなくなり、取り外す実装部品の周囲の部品を取り外すことなく、取り外したい実装部品だけを簡単に取り外すことができる。
【００２３】
請求項２に記載の発明によれば、外部からの制御信号の入力に基づいて、発熱制御手段が発熱手段への通電のＯＮ／ＯＦＦを制御する。すなわち、発熱制御手段は、実装部品を基板から取り外すときだけ発熱手段に通電させることができるので、発熱手段を実装部品の電気回路上に設けることができ、実装部品の電源と発熱手段の電源を兼用することができる。
【００２４】
請求項３に記載の発明によれば、第１選択ステップにより、基板から取り外す実装部品を選択し、第２選択ステップにより、選択された前記実装部品を取り外すための前記発熱手段への通電条件を選択する。そして、通電ステップにより、第２選択ステップによって選択された通電条件に基づいた電流を前記発熱手段に通電する。よって、取り外す実装部品の周囲の部品を取り外すことなく、取り外したい実装部品だけを簡単に取り外すことができる。また、作業者が所望する実装部品の取り外し作業に合わせて作業方法を選択することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態における実装部品の構造を示す概略平面図である。
【符号の説明】
１ 実装部品
３ ニクロム線（発熱手段）
４ 半導体回路（発熱制御手段）
５ 電源[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting component and a method for removing the mounting component.
[0002]
[Prior art]
Conventionally, when a mounting component such as a BGA (ball grid array) or LGA (land grid array) soldered to a substrate is removed, the mounting component to be removed is sandwiched between clamping members. A hot air was applied to the mounted component to melt the solder and remove it (for example, see Patent Document 1). At this time, the mounting component to be removed is usually isolated from the surrounding mounting component by a cover or the like so as not to melt the solder of the mounting component around the mounting component to be removed by hot air.
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 8-274460
[Problems to be solved by the invention]
However, when the mounting components are mounted on the substrate with high density, it is difficult to isolate only the mounting component to be removed from the surrounding mounting components. For this reason, it is necessary to remove components around the mounted component to be removed before starting work, and it takes time to remove the mounted component.
[0005]
Accordingly, an object of the present invention is to provide a mounting component and a method for removing the mounting component that can be easily removed from the substrate after being soldered to the substrate.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the invention according to claim 1 is a mounting component soldered to a substrate, comprising heating means that generates heat at a temperature at which the solder can be melted by energization. To do.
[0007]
According to the first aspect of the present invention, when the heat generating means is energized, the heat generating means generates heat at a temperature at which the solder can be melted, and melts the solder joining the mounting component and the substrate. That is, since the mounted component to be removed generates heat, it is not necessary to apply hot air, and it is possible to easily remove only the desired mounted component without removing the components around the removed mounted component.
[0008]
According to a second aspect of the present invention, in the electronic device according to the first aspect, the electronic apparatus includes a heat generation control unit that controls ON / OFF of energization to the heat generation unit based on an input of an external control signal. Features.
[0009]
According to the second aspect of the present invention, the heat generation control means controls ON / OFF of energization to the heat generation means based on the input of the control signal from the outside. That is, since the heat generation control means can energize the heat generation means only when the mounting component is removed from the board, the heat generation means can be provided on the electric circuit of the mounting component, and the power supply of the mounting component and the power supply of the heat generation means are connected. Can also be used.
[0010]
The invention according to claim 3 is a method of removing a mounting component that is removed from the substrate, wherein the mounting component includes heating means that is soldered to the substrate and generates heat at a temperature at which the solder can be melted. A first selection step for selecting the mounting component, a second selection step for selecting a power supply condition for the heating means for removing the selected mounting component, and a power supply condition selected by the second selection step. An energizing step of energizing the heat generating means with a current based thereon.
[0011]
According to the third aspect of the present invention, the mounting component to be removed from the board is selected in the first selection step, and the energization condition to the heat generating means for removing the selected mounting component in the second selection step is set. select. In the energization step, the heating means is energized with a current based on the energization condition selected in the second selection step. Therefore, it is possible to easily remove only the mounted component to be removed without removing the components around the mounted component to be removed. In addition, the work method can be selected in accordance with the removal work of the mounted component desired by the worker.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment according to a mounting component of the present invention will be described in detail with reference to the drawings.
<Configuration of mounted parts>
As shown in FIG. 1, the mounted component 1 includes an IC chip 2 that performs data calculation processing and storage processing, a nichrome wire 3 as a heating means that generates heat at a temperature at which solder can be melted by energization, and a nichrome wire 3. The semiconductor circuit 4 is connected as a heat generation control means for controlling ON / OFF of energization to the nichrome wire 3 and is soldered to a substrate (not shown) by BGA, LGA, QFN or the like.
The nichrome wire 3 is formed as thin and long as possible in order to increase the electric resistance value, and is preferably wound in a coil shape within the mounting component 1.
The nichrome wire 3 has one end connected to the semiconductor circuit 4 and the other end connected to GND (ground).
[0013]
The nichrome wire 3 is energized so as to generate heat at least at a temperature at which the solder can be melted, for example, at a temperature of 183 ° C. or higher, and is provided at a position close to a place where the mounting component 1 is soldered.
As the semiconductor circuit 4, for example, a circuit configured using a p-channel MOSFET (field effect transistor) 4 a is used. Specifically, in the semiconductor circuit 4, a power source 5 for energizing the nichrome wire 3 is connected to the source S side of the MOSFET 4a, and a control unit 6 that inputs a control signal for controlling ON / OFF of energization to the gate G side. Are connected, and the nichrome wire 3 is connected to the drain D side.
[0014]
The power supply 5 generates a current to generate heat from the nichrome wire 3 and outputs a current value controlled by the control unit 6.
The control unit 6 inputs a control signal related to ON / OFF of energization to the nichrome wire 3 to the gate G of the MOSFET 4a, and controls the current that the power source 5 flows to the nichrome wire 3 based on the energization condition selected by the operator. To do. Here, the energization conditions refer to removal conditions such as melting the solder of the mounted component 1 in a short time to shorten the removal time, and removing the mounted component 1 without affecting the surrounding mounted components.
The input unit 8 has a function of selecting a mounting component 1 to be removed from the board by an operator and a function of selecting a condition for energizing the nichrome wire 3 for removing the selected mounting component 1.
[0015]
<How to remove mounted parts>
Next, a method for removing the mounting component 1 from the substrate will be described.
When removing the mounting component 1 from the substrate, the operator selects the mounting component 1 to be removed from the substrate (first selection step).
Next, a voltage lower than the input from the power supply 5 is applied to the gate G. Then, since the current from the power supply 5 flows from the source S to the drain D of the MOSFET 4a, the current flows through the nichrome wire 3 to generate heat, and the solder of the mounting component 1 is melted.
[0016]
At this time, even if the user ignores the influence of the heat on the surrounding parts, the user can remove the mounting part 1 by melting the solder in a short time, or consider the influence of the heat on the surrounding parts. Whether to melt the solder of the mounting component 1 to be removed with an electric current is selected and input (second selection step).
Next, the nichrome wire 3 is energized with a current corresponding to the removal method selected in the second selection step (energization step).
[0017]
On the other hand, when the mounting component 1 is not removed from the substrate, the control signal from the control unit 6 is cut off, or a voltage higher than the input from the power supply 5 is applied to the gate G. Then, since the current from the power source 5 is interrupted by the MOSFET 4a, the current does not flow through the nichrome wire 3 and the solder of the mounting component 1 is not melted.
[0018]
According to the mounting component 1 of the present embodiment, when the nichrome wire 3 is energized, the nichrome wire 3 generates heat at a temperature at which the solder can be melted, and melts the solder joining the mounting component 1 and the substrate. That is, since the mounted component 1 to be removed generates heat, it is not necessary to apply hot air, and it is possible to easily remove only the mounted component 1 to be removed without removing the components around the removed mounted component 1.
[0019]
Further, since the nichrome wire 3 can be energized only when the mounting component 1 is removed from the substrate by the semiconductor circuit 4, the nichrome wire 3 can be provided on the circuit of the mounting component 1, and the power source of the mounting component 1 and the nichrome The power source of the line 3 can also be used. However, if there are other parts connected to the common power supply line, it is necessary to fully consider them. In addition, it is necessary to design in advance so that a sufficient amount of current can flow through the wiring pattern of the substrate, and it is necessary to use a power supply having a sufficient current supply capability.
[0020]
Furthermore, according to the method for removing the mounting component 1 as described above, the operation method can be selected in accordance with the removal operation of the mounting component 1 desired by the operator.
[0021]
In addition, this invention is not limited to the said embodiment, For example, what is used as a heat_generation | fever means is not restricted to the nichrome wire 3, The carmalloy and iron chromium which have an electrical resistance value comparatively close to the nichrome wire 3 are used. Such a material may be used. Moreover, you may use a part of pattern formed in the board | substrate as a heat | fever means. Further, the transistors constituting the semiconductor circuit 4 are not limited to the p-channel MOSFET 4a, and other types of transistors such as an n-channel MOSFET may be used.
In addition, the present invention can be freely changed and improved without departing from the gist of the invention.
[0022]
【The invention's effect】
According to the first aspect of the present invention, when the heat generating means is energized, the heat generating means generates heat at a temperature at which the solder can be melted, and melts the solder joining the mounting component and the substrate. That is, since the mounted component to be removed generates heat, it is not necessary to apply hot air, and it is possible to easily remove only the desired mounted component without removing the components around the removed mounted component.
[0023]
According to the second aspect of the present invention, the heat generation control means controls ON / OFF of energization to the heat generation means based on the input of the control signal from the outside. That is, since the heat generation control means can energize the heat generation means only when the mounting component is removed from the board, the heat generation means can be provided on the electric circuit of the mounting component, and the power supply of the mounting component and the power supply of the heat generation means are connected. Can also be used.
[0024]
According to the third aspect of the present invention, the mounting component to be removed from the board is selected in the first selection step, and the energization condition to the heat generating means for removing the selected mounting component in the second selection step is set. select. In the energization step, the heating means is energized with a current based on the energization condition selected in the second selection step. Therefore, it is possible to easily remove only the mounted component to be removed without removing the components around the mounted component to be removed. In addition, the work method can be selected in accordance with the removal work of the mounted component desired by the worker.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing a structure of a mounting component in an embodiment of the present invention.
[Explanation of symbols]
1 Mounting parts 3 Nichrome wire (heating means)
4 Semiconductor circuit (heat generation control means)
5 Power supply

Claims (3)

基板に半田付けされる実装部品であって、
通電により、前記半田が溶融可能な温度で発熱する発熱手段を備えることを特徴とする実装部品。A mounting component that is soldered to a board,
A mounting component comprising heat generating means for generating heat at a temperature at which the solder can be melted by energization. 外部からの制御信号の入力に基づいて、前記発熱手段への通電のＯＮ／ＯＦＦを制御する発熱制御手段を備えることを特徴とする請求項１に記載の実装部品。The mounted component according to claim 1, further comprising a heat generation control unit that controls ON / OFF of energization to the heat generation unit based on an input of a control signal from the outside. 基板に半田付けされ、前記半田が溶融可能な温度で発熱する発熱手段を備える実装部品を、前記基板から取り外す実装部品の取り外し方法であって、
前記基板から取り外す前記実装部品を選択する第１選択ステップと、
選択された前記実装部品を取り外すための前記発熱手段への通電条件を選択する第２選択ステップと、
前記第２選択ステップによって選択された通電条件に基づいた電流を前記発熱手段に通電する通電ステップと、
を備えることを特徴とする実装部品の取り外し方法。A mounting component having a heating means that is soldered to a substrate and generates heat at a temperature at which the solder can be melted is a method for removing the mounting component from the substrate,
A first selection step of selecting the mounting component to be removed from the substrate;
A second selection step of selecting a condition for energizing the heat generating means for removing the selected mounted component;
An energization step of energizing the heat generating means with an electric current based on the energization condition selected in the second selection step;
A method for removing a mounting component, comprising:
JP2003187583A 2003-06-30 2003-06-30 Mounted part and method of dismounting the same Pending JP2005026310A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003187583A JP2005026310A (en) 2003-06-30 2003-06-30 Mounted part and method of dismounting the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003187583A JP2005026310A (en) 2003-06-30 2003-06-30 Mounted part and method of dismounting the same

Publications (1)

Publication Number Publication Date
JP2005026310A true JP2005026310A (en) 2005-01-27

Family

ID=34186389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003187583A Pending JP2005026310A (en) 2003-06-30 2003-06-30 Mounted part and method of dismounting the same

Country Status (1)

Country Link
JP (1) JP2005026310A (en)

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