JPH10321107A - Mounting method of thermal fuse and alloy type thermal fuse - Google Patents
Mounting method of thermal fuse and alloy type thermal fuseInfo
- Publication number
- JPH10321107A JPH10321107A JP15008597A JP15008597A JPH10321107A JP H10321107 A JPH10321107 A JP H10321107A JP 15008597 A JP15008597 A JP 15008597A JP 15008597 A JP15008597 A JP 15008597A JP H10321107 A JPH10321107 A JP H10321107A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic field
- fuse
- fuse element
- circuit board
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/04—Bases; Housings; Mountings
- H01H2037/046—Bases; Housings; Mountings being soldered on the printed circuit to be protected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Fuses (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は回路基板に合金型温
度ヒュ−ズをフロ−またはリフロ−はんだ付け法により
実装する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an alloy type temperature fuse on a circuit board by a flow or reflow soldering method.
【０００２】[0002]
【従来の技術】回路基板に回路部品を実装するには、フ
ロ−またはリフロ−はんだ付け法が使用されている。フ
ロ−はんだ付け法では、回路基板のスルホ−ルに回路部
品のリ−ド線を仮固定し、次いで、フラックス塗布装置
（フラクサ）及びはんだ浴槽、例えば噴流はんだ浴槽に
順次に通過させてリ−ド線と回路導体との間にはんだを
付着させ、而るのち、冷却装置に通過させてはんだを凝
固させている。リフロ−法では、回路基板に回路部品を
クリ−ムはんだで仮固定し、次いで加熱炉、例えば、赤
外線電気加熱炉に通してクリ−ムはんだを溶融させ、而
るのち、冷却装置に通過させてはんだを凝固させてい
る。2. Description of the Related Art A flow or reflow soldering method is used for mounting a circuit component on a circuit board. In the flow soldering method, a lead wire of a circuit component is temporarily fixed to a through hole of a circuit board, and then sequentially passed through a flux coating device (fluxer) and a solder bath, for example, a jet solder bath. Solder is adhered between the lead wire and the circuit conductor, and then passed through a cooling device to solidify the solder. In the reflow method, circuit components are temporarily fixed to a circuit board with a cream solder, and then the solder is melted through a heating furnace, for example, an infrared electric heating furnace, and then passed through a cooling device. The solder is solidified.
【０００３】回路部品を実装した回路板においては、あ
る回路部品、例えば、ＦＥＴの異常発熱から回路板を保
護するために、温度ヒュ−ズを取り付けることがあり、
ＦＥＴ等が異常発熱すると、その発生熱で温度ヒュ−ズ
のヒュ−ズエレメントを溶断させて回路を電源から遮断
している。In a circuit board on which circuit parts are mounted, a temperature fuse may be attached to protect the circuit board from abnormal heat generation of a certain circuit part, for example, an FET.
When the FET or the like generates abnormal heat, the generated heat causes the fuse element of the temperature fuse to be blown to cut off the circuit from the power supply.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、フロ−
またはリフロ−はんだ付け法でのはんだ付け温度は、通
常２５０℃前後であり、温度ヒュ−ズの作動温度に較べ
て相当に高く、回路部品のフロ−またはリフロ−はんだ
付け時に温度ヒュ−ズをそのフロ−またはリフロ−はん
だ付けで実装することは不可である（ヒュ−ズエレメン
トの溶断が不可避である）。従って、回路部品のはんだ
付け後、温度ヒュ−ズを取り付けており、作業工数が多
く、作業性に問題がある。SUMMARY OF THE INVENTION However, the flow
Alternatively, the soldering temperature in the reflow soldering method is usually around 250 ° C., which is considerably higher than the operating temperature of the temperature fuse, and the temperature fuse is used during the flow or reflow soldering of circuit components. It cannot be mounted by flow or reflow soldering (fusing of the fuse element is inevitable). Therefore, after the soldering of the circuit components, the temperature fuse is attached, so that the number of work steps is large and there is a problem in workability.
【０００５】本発明の目的は、回路基板に回路部品をフ
ロ−またはリフロ−はんだ付けする場合、合金型温度ヒ
ュ−ズを他の回路部品と共にフロ−またはリフロ−はん
だ付けできる温度ヒュ−ズの実装方法を提供することに
ある。SUMMARY OF THE INVENTION An object of the present invention is to provide a temperature fuse which can flow or reflow solder an alloy type temperature fuse together with other circuit components when the circuit component is flow or reflow soldered to a circuit board. It is to provide an implementation method.
【０００６】[0006]
【課題を解決するための手段】本発明に係る温度ヒュ−
ズの実装方法は、ヒュ−ズエレメントが溶融されたとき
に磁界の作用下では溶断されず、磁界の作用が無いとき
は溶断される合金型温度ヒュ−ズを回路基板に、磁界発
生部材でヒュ−ズエレメントに磁界を作用させつつ、フ
ロ−またはリフロ−はんだ付けで実装し、はんだ付け後
に磁界発生部材を取り外すことを特徴とする構成であ
り、ヒュ−ズエレメントに磁性粉末を混合し、磁界発生
部材に磁石または通電コイルを使用して合金型温度ヒュ
−ズのヒュ−ズエレメントを長手方向に貫通する磁界を
作用させることができる。SUMMARY OF THE INVENTION A temperature hue according to the present invention is provided.
When the fuse element is melted, it is not melted under the action of a magnetic field when the fuse element is melted, but is melted when there is no action of the magnetic field. While applying a magnetic field to the fuse element, the fuse element is mounted by flow or reflow soldering, and the magnetic field generating member is removed after the soldering. By using a magnet or an energizing coil as the magnetic field generating member, a magnetic field penetrating the fuse element of the alloy type temperature fuse in the longitudinal direction can be applied.
【０００７】[0007]
【発明の実施の形態】本発明により、回路基板に実装さ
れる合金型温度ヒュ−ズは、ヒュ−ズエレメントに磁性
粉末を混入し、ヒュ−ズエレメントが溶融されても、ヒ
ュ−ズエレメントを長手方向に貫通する磁界が作用して
いると溶断されず、その磁界の作用が無いときは溶断さ
れる構成である。すなわち、ヒュ−ズエレメントが溶融
されて磁性粉末の固定拘束が解除されると、その磁性粉
末がヒュ−ズエレメントを長手方向に貫通する磁界で既
に磁化されているから、その磁性粉末が磁力線の方向に
連なった線状に配列され、この線状が芯となって溶融ヒ
ュ−ズエレメントの流動が妨げられ、従って、溶融ヒュ
−ズエレメントのリ−ド線端部への濡れが妨げられ、ヒ
ュ−ズエレメントが溶融されているにもかかわらず、ヒ
ュ−ズエレメントが分断されない。他方、磁界の作用が
ないときは、溶融ヒュ−ズエレメントのリ−ド線端部へ
の濡れにより、ヒュ−ズエレメントが分断される。ヒュ
−ズエレメントに混入する磁性粉末には、フロ−または
リフロ−はんだ付け温度に加熱されても、溶融されず、
かつ、キュ−リ点がフロ−またはリフロ−温度よりも充
分に高いものが使用される。勿論、ヒュ−ズエレメント
を長手方向に貫通する磁界を作用させる磁界発生部材に
も、キュ−リ点がフロ−またはリフロ−温度よりも充分
に高いものが使用される。BEST MODE FOR CARRYING OUT THE INVENTION According to the present invention, an alloy type temperature fuse mounted on a circuit board can be obtained by mixing magnetic powder into a fuse element and melting the fuse element. Is not blown when a magnetic field penetrating through in the longitudinal direction is acting, and is blown when there is no action of the magnetic field. That is, when the fuse element is melted and the magnetic powder is released from the fixed restraint, the magnetic powder is already magnetized by the magnetic field penetrating the fuse element in the longitudinal direction. The melted fuse element is prevented from flowing to the end of the lead wire of the fused fuse element. The fuse element is not broken even though the fuse element is melted. On the other hand, when there is no action of the magnetic field, the fuse element is cut off by the wetting of the molten fuse element to the end of the lead wire. The magnetic powder mixed into the fuse element does not melt even when heated to the flow or reflow soldering temperature.
In addition, one having a Curie point sufficiently higher than the flow or reflow temperature is used. Of course, as the magnetic field generating member for applying a magnetic field penetrating the fuse element in the longitudinal direction, one having a Curie point sufficiently higher than the flow or reflow temperature is used.
【０００８】本発明を実施するには、回路基板にＩＣ、
コンデンサ、抵抗等の回路部品及び上記した合金型温度
ヒュ−ズをリ−ド線のスルホ−ルへの挿入により仮固定
すると共にその合金型温度ヒュ−ズのヒュ−ズエレメン
トを長さ方向に貫通する磁界を作用させる磁石を着脱可
能なように取り付ける。この磁石を合金型温度ヒュ−ズ
に着脱可能に取り付けておき、この磁石付き合金型温度
ヒュ−ズを回路基板に仮固定することもできる。このよ
うに、回路部品や合金型温度ヒュ−ズ及び磁石を回路基
板に取り付けたのちは、この回路基板をフラックス塗布
装置（フラクサ）及びはんだ浴槽に通し、回路部品や合
金型温度ヒュ−ズのリ−ド線と回路基板の導体との間に
はんだを付着させる。In order to implement the present invention, an IC,
Circuit components such as a capacitor and a resistor, and the above-mentioned alloy type temperature fuse are temporarily fixed by inserting lead wires into the through-hole, and the fuse element of the alloy type temperature fuse is lengthwise. A magnet for applying a penetrating magnetic field is detachably attached. This magnet may be detachably attached to the alloy type temperature fuse, and the magnet type temperature fuse with the magnet may be temporarily fixed to the circuit board. After the circuit component, the alloy-type temperature fuse and the magnet are attached to the circuit board, the circuit board is passed through a flux coating device (fluxer) and a solder bath to form the circuit component and the alloy-type temperature fuse. Solder is applied between the lead wire and the conductor of the circuit board.
【０００９】このはんだ浴槽としては、上下動方式（回
路基板を徐々に降下させて静止したはんだ浴の鏡面に接
触させ、一定時間後再び徐々に引き上げる方式）、はん
だ槽上下動方式（静止浴面のはんだ槽を上下動させる方
式）またはオバ−フロ−ディプ方式（はんだ浴を噴流さ
せて回路基板に接触させる方式）等を使用できるが、何
れの場合も、仮固定の回路部品、合金型温度ヒュ−ズ及
び磁石が２５０℃前後に加熱され、合金型温度ヒュ−ズ
においては、ヒュ−ズエレメントが溶融される。しかし
ながら、ヒュ−ズエレメントに混入された磁性粉末の上
記磁石の磁力線による磁化が保持されており、ヒュ−ズ
エレメントの溶融によりこの磁化粉末が温度ヒュ−ズの
リ−ド線端部間に線状に連鎖結合される結果、上記した
通り、ヒュ−ズエレメントは溶融されるにもかかわら
ず、分断されない。As the solder bath, a vertical movement method (a method in which a circuit board is gradually lowered and brought into contact with a mirror surface of a stationary solder bath, and then gradually lifted up after a certain period of time), and a solder bath vertical movement method (a static bath surface) Or an over-flow dip method (a method in which a solder bath is jetted and brought into contact with a circuit board), etc. In each case, a temporarily fixed circuit component and an alloy mold temperature are used. The fuse and the magnet are heated to about 250 ° C., and in the alloy type temperature fuse, the fuse element is melted. However, the magnetization of the magnetic powder mixed in the fuse element is maintained by the lines of magnetic force of the magnet, and the magnetized powder is melted between the ends of the lead wire of the temperature fuse by the melting of the fuse element. As a result, as described above, the fuse element is melted but is not divided.
【００１０】このようにして、回路基板をはんだ浴に接
触させ、回路部品や合金型温度ヒュ−ズのリ−ド線と回
路基板の導体との間にはんだを付着させた後は、ファン
等の冷却装置ではんだを凝固させ、更に、磁石を取り外
し、これにて実装作業を終了する。After the circuit board is brought into contact with the solder bath and the solder is attached between the circuit component and the lead wire of the alloy type temperature fuse and the conductor of the circuit board, a fan or the like is used. The solder is solidified by the cooling device described above, and the magnet is further removed, thereby completing the mounting operation.
【００１１】本発明により得られる実装回路板において
は、磁石を取り外してあるから、回路部品、例えば、Ｆ
ＥＴの異常発熱を合金型温度ヒュ−ズに良好な熱伝達効
率で伝達させて（すなわち、伝達熱が途中で磁石による
ヒ−トシンクで吸収されるようなことなく）合金型温度
ヒュ−ズを迅速に作動させることができる。In the mounted circuit board obtained by the present invention, since the magnet is removed, circuit components such as F
The abnormal heat generation of the ET is transmitted to the alloy type temperature fuse with good heat transfer efficiency (that is, the transferred heat is not absorbed by the heat sink by the magnet on the way), and the temperature of the alloy type temperature fuse is reduced. It can be operated quickly.
【００１２】本発明はリフロ−はんだ付け法で実施する
こともでき、この場合は、回路部品や合金型温度ヒュ−
ズを回路基板にクリ−ムはんだで仮固定し、次いで、加
熱炉、例えば、赤外線電気加熱炉、蒸気凝縮加熱炉等に
通してクリ−ムはんだを溶融させ、更に、ファン等の冷
却装置ではんだを凝固させ、最終的に、磁石を取り外
し、これにて実装作業を終了する。上記において、磁石
の代わりに、通電したコイルを使用することもできる。The present invention can be carried out by a reflow soldering method. In this case, a circuit component or an alloy mold temperature heater is used.
The solder is temporarily fixed to the circuit board with cream solder, then passed through a heating furnace, for example, an infrared electric heating furnace, a steam condensation heating furnace, etc., to melt the cream solder, and further cooled by a cooling device such as a fan. After solidifying the solder, the magnet is finally removed, and the mounting operation is completed. In the above, an energized coil may be used instead of the magnet.
【００１３】図１は本発明において使用する合金型温度
ヒュ−ズの一例を示す図面である。図１において、１は
耐熱性・良熱伝導性の絶縁板、例えば、セラミックス板
である。２，２は絶縁板１に設けた一対の膜電極であ
り、導電ペ−スト（例えば、銀ペ−スト）の印刷・焼き
付けにより形成できる。３は電極２，２間に接続した低
融点可溶合金のヒュ−ズエレメントであり、キュ−リ点
がフロ−またはリフロ−はんだ付け温度以上の磁性粉末
を混入してある。４はヒュ−ズエレメント３に塗布した
フラックス（ロジンを主成分とする）、５は各膜電極２
に接続したリ−ド線、６はフラックス塗布ヒュ−ズエレ
メントを覆う耐熱絶縁層である。７はヒュ−ズエレメン
ト３を長さ方向に貫通する磁界を発生させる磁石であ
り、絶縁層に取外し自在に取り付けてある。上記の合金
型温度ヒュ−ズはフロ−はんだ付け用であり、リフロ−
はんだ付け用の場合は、リ−ド線に代え、膜電極を絶縁
板裏面にまで延設し、この裏面膜電極をクリ−ムはんだ
で回路基板に仮固定することができる。なお、基板タイ
プの合金型温度ヒュ−ズでは、箔状のヒュ−ズエレメン
トを使用し、箔に対し垂直方向の磁界を作用させても、
ヒュ−ズエレメントが溶融されたときでの溶断を防止で
きる。FIG. 1 is a drawing showing an example of an alloy type temperature fuse used in the present invention. In FIG. 1, reference numeral 1 denotes an insulating plate having heat resistance and good thermal conductivity, for example, a ceramic plate. Reference numerals 2 and 2 denote a pair of membrane electrodes provided on the insulating plate 1, which can be formed by printing and baking a conductive paste (for example, silver paste). Reference numeral 3 denotes a fuse element made of a low-melting-point fusible alloy connected between the electrodes 2 and 2, in which magnetic powder having a Curie point higher than a flow or reflow soldering temperature is mixed. 4 is a flux (mainly rosin) applied to the fuse element 3 and 5 is a membrane electrode 2
Reference numeral 6 denotes a heat-resistant insulating layer which covers the flux-coated fuse element. Reference numeral 7 denotes a magnet for generating a magnetic field penetrating the fuse element 3 in the length direction, and is detachably attached to the insulating layer. The above alloy mold temperature fuse is for flow soldering,
In the case of soldering, instead of a lead wire, a film electrode can be extended to the back surface of the insulating plate, and this back film electrode can be temporarily fixed to the circuit board by cream solder. In the case of the substrate type alloy type temperature fuse, a foil-type fuse element is used, and even if a magnetic field in the vertical direction is applied to the foil,
It is possible to prevent fusing when the fuse element is melted.
【００１４】[0014]
【発明の効果】本発明に係る温度ヒュ−ズの実装方法に
よれば、フロ−またはリフロ−はんだ付け時、合金型温
度ヒュ−ズのヒュ−ズエレメントがはんだ熱で溶融され
ても、ヒュ−ズエレメントの溶断を阻止でき、合金型温
度ヒュ−ズをそのヒュ−ズエレメントの導通性を保持し
てフロ−またはリフロ−はんだ付けで回路基板に実装で
きる。そして、フロ−またはリフロ−はんだ付け後は、
磁界発生部材を合金型温度ヒュ−ズから取り外している
から、実装回路板の使用において、回路部品の異常発熱
を合金型温度ヒュ−ズに良好な熱伝達効率で伝達させて
合金型温度ヒュ−ズを迅速に作動させ得る。従って、本
発明によれば、合金型温度ヒュ−ズを回路基板に良好な
作業性で満足に実装できる。According to the temperature fuse mounting method according to the present invention, even if the fuse element of the alloy type temperature fuse is melted by the solder heat at the time of flow or reflow soldering, the fuse is not heated. The fuse element can be prevented from being blown, and the alloy type temperature fuse can be mounted on the circuit board by flow or reflow soldering while maintaining the conductivity of the fuse element. And after flow or reflow soldering,
Since the magnetic field generating member is removed from the alloy-type temperature fuse, the abnormal heat generation of the circuit components is transmitted to the alloy-type temperature fuse with good heat transfer efficiency when the mounted circuit board is used. Can be activated quickly. Therefore, according to the present invention, the alloy type temperature fuse can be satisfactorily mounted on the circuit board with good workability.
【図１】請求項３に係る合金型温度ヒュ−ズを示す図面
である。FIG. 1 is a drawing showing an alloy mold temperature fuse according to claim 3;
１ 絶縁板 ２ 膜電極 ３ ヒュ−ズエレメント ４ フラックス ５ リ−ド線 ６ 絶縁層 ７ 磁石 REFERENCE SIGNS LIST 1 insulating plate 2 membrane electrode 3 fuse element 4 flux 5 lead wire 6 insulating layer 7 magnet
Claims (3)
界の作用下では溶断されず、磁界の作用が無いときは溶
断される合金型温度ヒュ−ズを回路基板に、磁界発生部
材でヒュ−ズエレメントに磁界を作用させつつ、フロ−
またはリフロ−はんだ付けで実装し、はんだ付け後に磁
界発生部材を取り外すことを特徴とする温度ヒュ−ズの
実装方法。An alloy type temperature fuse which is not melted under the action of a magnetic field when the fuse element is melted and melted when no action of the magnetic field is applied to a circuit board, and is fused by a magnetic field generating member. -While applying a magnetic field to the
Alternatively, a method for mounting a temperature fuse, wherein the mounting is performed by reflow soldering, and the magnetic field generating member is removed after the soldering.
磁界発生部材に磁石または通電したコイルを使用して合
金型温度ヒュ−ズのヒュ−ズエレメントを長手方向に貫
通する磁界を作用させる請求項１記載の温度ヒュ−ズの
実装方法。2. A fuse element is mixed with a magnetic powder.
2. The temperature fuse mounting method according to claim 1, wherein a magnetic field penetrating the fuse element of the alloy type temperature fuse in the longitudinal direction is applied to the magnetic field generating member by using a magnet or an energized coil.
回路基板に実装する合金型温度ヒュ−ズであり、キュ−
リ点がフロ−またはリフロ−はんだ付け温度以上の磁性
粉末をヒュ−ズエレメントに混入し、ヒュ−ズエレメン
トを長さ方向に貫通する磁界を作用させる磁界発生部材
を取外し可能なように取り付けたことを特徴とする合金
型温度ヒュ−ズ。3. An alloy-type temperature fuse mounted on a circuit board by a flow or reflow soldering method.
A magnetic powder having a re-point equal to or higher than the flow or reflow soldering temperature is mixed into the fuse element, and a magnetic field generating member for applying a magnetic field penetrating the fuse element in the length direction is detachably mounted. An alloy-type temperature fuse characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15008597A JPH10321107A (en) | 1997-05-23 | 1997-05-23 | Mounting method of thermal fuse and alloy type thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15008597A JPH10321107A (en) | 1997-05-23 | 1997-05-23 | Mounting method of thermal fuse and alloy type thermal fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10321107A true JPH10321107A (en) | 1998-12-04 |
Family
ID=15489193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15008597A Pending JPH10321107A (en) | 1997-05-23 | 1997-05-23 | Mounting method of thermal fuse and alloy type thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10321107A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022118642A1 (en) * | 2020-12-04 | 2022-06-09 | 株式会社オートネットワーク技術研究所 | Fuse and vehicle-mounted device |
-
1997
- 1997-05-23 JP JP15008597A patent/JPH10321107A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022118642A1 (en) * | 2020-12-04 | 2022-06-09 | 株式会社オートネットワーク技術研究所 | Fuse and vehicle-mounted device |
| JP2022089575A (en) * | 2020-12-04 | 2022-06-16 | 株式会社オートネットワーク技術研究所 | Fuse and on-vehicle equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0647531A (en) | Method and device for joining exterior lead of integrated circuit | |
| JP2001044616A (en) | Electronic component, printed wiring board, and method for attaching and detaching electronic component on and from printed wiring board | |
| US6779710B2 (en) | Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument | |
| CA2255587A1 (en) | Thermally fused resistor | |
| JPH10321107A (en) | Mounting method of thermal fuse and alloy type thermal fuse | |
| JP4463713B2 (en) | Mounting method of alloy type thermal fuse | |
| US20020162878A1 (en) | Method and means for rapid heat-sink soldering | |
| JP6711704B2 (en) | Protective device with bypass electrode | |
| JPH06132647A (en) | Method and apparatus for soldering surface mounting ic, and electric device produced with it | |
| JP4112078B2 (en) | Substrate type resistance / temperature fuse | |
| JPS60257587A (en) | Soldering method | |
| JPS5937549B2 (en) | Wire - installation method | |
| JP3696635B2 (en) | How the temperature protector works | |
| JP2006315043A (en) | Reflow welding equipment | |
| JPH0456028A (en) | Temperature fuse and its forming method | |
| JPH07109745B2 (en) | How to reset the alloy type thermal fuse | |
| JPH117876A (en) | Circuit board type temperature fuse | |
| JPH10173333A (en) | Reflow furnace and flux-removing method therefor | |
| JPS6222278B2 (en) | ||
| JP2007048700A (en) | Fuse element, fuse, and capacitor with fuse | |
| JP3614894B2 (en) | How to use the temperature protector | |
| JPH0392736A (en) | Temperature sensor | |
| JPH02276125A (en) | Fuse circuit forming method | |
| JPH08264929A (en) | Bump melting and connecting structure | |
| JP2000133931A (en) | Removal of solder ball and solder ball removal tool |