JP6711704B2 - Protective device with bypass electrode - Google Patents

Protective device with bypass electrode Download PDF

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JP6711704B2
JP6711704B2 JP2016122203A JP2016122203A JP6711704B2 JP 6711704 B2 JP6711704 B2 JP 6711704B2 JP 2016122203 A JP2016122203 A JP 2016122203A JP 2016122203 A JP2016122203 A JP 2016122203A JP 6711704 B2 JP6711704 B2 JP 6711704B2
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bypass electrode
electrode
fuse element
insulating substrate
bypass
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JP2017228379A (en
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正泰 西川
正泰 西川
慎太郎 中島
慎太郎 中島
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Schott Japan Corp
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Description

本発明は電気・電子機器の回路保護素子に関する。 The present invention relates to a circuit protection element for electric/electronic equipment.

近年、モバイル機器など小型電子機器の急速な普及に伴い、搭載する電源の保護回路に実装される保護素子も小型薄型のものが使用されている。二次電池パックの保護回路には、例えば特許文献1に記載されるような表面実装部品(SMD)の保護素子が好適に利用される。これらの保護素子には、被保護機器の過電流により生ずる過大発熱や過電圧などの異常状態を検知し、または周囲温度の異常過熱に感応して、所定条件でヒューズを作動させ電気回路を遮断する非復帰型保護素子がある。該保護素子は、機器の安全を図るために、保護回路が機器に生ずる異常を検知すると信号電流により抵抗素子を発熱させ、その発熱で可融性の合金材からなるヒューズエレメントを溶断させて回路を遮断するか、あるいは過電流によってヒューズエレメントを溶断させて回路を遮断できる。 2. Description of the Related Art In recent years, with the rapid spread of small electronic devices such as mobile devices, small and thin protective elements have been used as protective elements to be mounted in a protective circuit of a power supply to be mounted. For the protection circuit of the secondary battery pack, for example, a protection element for a surface mount component (SMD) as described in Patent Document 1 is preferably used. These protective elements detect abnormal conditions such as excessive heat generation and overvoltage caused by overcurrent of the protected equipment, or respond to abnormal overheating of the ambient temperature, and activate a fuse under a predetermined condition to cut off the electric circuit. There is a non-recoverable protection element. In order to ensure the safety of the equipment, the protection element causes the resistance element to generate heat by a signal current when the protection circuit detects an abnormality that occurs in the equipment, and the heat generation melts the fuse element made of a fusible alloy material to fuse the circuit. Or the fuse element is blown by an overcurrent to break the circuit.

特許文献1によると、はんだ付け温度で溶融する低融点金属材と、低融点金属材に溶解性の金属構造材とを積層して成るヒューズエレメント材を用いた保護素子がある。この保護素子のヒューズエレメント材は、はんだ付け作業で液相化した低融点金属材を、その温度で固相の金属構造材に付着させて一定時間溶断しないように界面張力で支えて保持することで、少なくともはんだ付け作業の間、ヒューズエレメントの形状を維持してヒューズエレメント材がはんだ付け作業温度で誤動作するのを防止する。はんだ付けが完了し回路保護素子が被保護回路に実装されると、ヒューズエレメント材の金属構造材は、はんだ付けの熱で媒質である低融点金属材中に拡散または溶解され希薄化しているので、設置環境の異常過熱や内蔵する抵抗発熱素子のヒータ加熱により容易に消失し、以後溶断を妨げることなく動作するようになる。 According to Patent Document 1, there is a protective element using a fuse element material formed by laminating a low-melting metal material that melts at a soldering temperature and a low-melting metal material and a soluble metal structural material. The fuse element material of this protective element is to hold the low melting point metal material that has been liquefied in the soldering work by interfacial tension so that it does not melt for a certain period of time by adhering it to the solid phase metal structural material at that temperature. Thus, the shape of the fuse element is maintained at least during the soldering work to prevent the fuse element material from malfunctioning at the soldering work temperature. When the soldering is completed and the circuit protection element is mounted on the protected circuit, the metal structural material of the fuse element material is diffused or melted in the low melting point metal material that is the medium by the heat of soldering, so it becomes diluted. Further, it easily disappears due to abnormal overheating of the installation environment or heating of the built-in resistance heating element by the heater, and thereafter it operates without hindering fusing.

特開2015−079608号公報Japanese Unexamined Patent Application Publication No. 2015-079608

しかしながら、上記の保護素子は、錫基はんだ合金の低融点金属材に、銀や銅の金属構造材を積層したヒューズエレメント材を用いるが、金属構造材が低融点金属材に溶解すると拡散界面に銀や銅の金属間化合物が生成する。このため、界面に生じた高抵抗の金属間化合層が障壁となって保護素子の電気抵抗を増大させてしまうという欠点があった。 However, the above-mentioned protective element uses a fuse element material in which a metal structure material of silver or copper is laminated on a low melting point metal material of a tin-based solder alloy, but when the metal structure material dissolves in the low melting point metal material, the diffusion interface is formed. An intermetallic compound of silver or copper is produced. Therefore, there is a drawback that the high resistance intermetallic compound layer generated at the interface serves as a barrier and increases the electrical resistance of the protective element.

本発明は、上述の問題点を解消するために提案されたものであり、表面実装型の回路保護素子において、耐リフロー性を具備しながら拡散界面に金属間化合物の高抵抗層が生じても内部抵抗値が増大しない保護素子を提供することを目的とする。 The present invention has been proposed in order to solve the above-mentioned problems, and in a surface mount type circuit protection device, even if a high resistance layer of an intermetallic compound is formed at a diffusion interface while having reflow resistance. It is an object of the present invention to provide a protection element whose internal resistance value does not increase.

本発明によると、絶縁基板と、この絶縁基板に設けた複数のパターン電極と、所定のパターン電極間を電気接続した低抵抗材からなるバイパス電極と、パターン電極の間を橋設すると共にバイパス電極と近接して設けたヒューズエレメントとを備え、バイパス電極は、絶縁基板に設けられ、該ヒューズエレメントよりも溶融温度が高く、溶融したヒューズエレメントに溶解性の金属材から構成されたことを特徴とするバイパス電極付き保護素子が提供される。このバイパス電極付き保護素子の絶縁基板には、必要に応じて抵抗発熱素子を設ける。本発明のバイパス電極は、積層セラミック基板の内部電極用に用いられる特定の金属ペーストを焼結して形成された焼結電極からなる。このバイパス電極用の金属ペーストは、ガラスフリット含有量を未添加ないし2質量%未満としたことを特徴とする。ここでいう近接とは、溶融したヒューズエレメントがバイパス電極を速やかに浸潤できる程度に接近していればよく、ヒューズエレメントがバイパス電極に当接した状態でも、ヒューズエレメントをバイパス電極の近傍に設ける(例えば、バイパス電極にヒューズエレメントを被せて、ヒューズエレメントとバイパス電極との間に隙間がある等の)状態でもどちらでもよい。 According to the present invention, an insulating substrate, a plurality of pattern electrodes provided on the insulating substrate, a bypass electrode made of a low resistance material which electrically connects predetermined pattern electrodes, and a bridge electrode between the pattern electrodes And a fuse element provided close to the fuse element, wherein the bypass electrode is provided on the insulating substrate, has a higher melting temperature than the fuse element, and is made of a metal material that is soluble in the melted fuse element. Provided is a protection element with a bypass electrode. If necessary, a resistance heating element is provided on the insulating substrate of the protection element with the bypass electrode. The bypass electrode of the present invention comprises a sintered electrode formed by sintering a specific metal paste used for the internal electrode of the laminated ceramic substrate. The metal paste for the bypass electrode is characterized in that the glass frit content is not added or is less than 2% by mass. The term "proximity" as used herein means that the fused fuse element is close enough to quickly infiltrate the bypass electrode, and the fuse element is provided near the bypass electrode even when the fuse element is in contact with the bypass electrode ( For example, the bypass electrode may be covered with a fuse element so that there is a gap between the fuse element and the bypass electrode.

本発明に係るバイパス電極付き保護素子は、絶縁基板に設けられたバイパス電極を有し、該バイパス電極は、ヒューズエレメントより溶融温度が高い金属からなり、溶融したヒューズエレメントがバイパス電極を濡らすと同時にバイパス電極を溶解して行くが、液相化したヒューズエレメントを固相のバイパス電極ではんだ付け作業が終わるまで一定時間溶断しないように固−液界面の濡れを利用して付着させて保持する。従って、少なくともはんだ付け作業の間、ヒューズエレメントの形状を維持してヒューズエレメントがはんだ付け作業温度で誤動作するのを防止できる。 The protection element with a bypass electrode according to the present invention has a bypass electrode provided on an insulating substrate, and the bypass electrode is made of a metal having a higher melting temperature than the fuse element, and the molten fuse element wets the bypass electrode at the same time. Although the bypass electrode is melted, the liquid-phase fuse element is attached and held by utilizing the wetting of the solid-liquid interface so as not to melt for a certain period of time until the soldering work is completed with the solid-phase bypass electrode. Therefore, the shape of the fuse element can be maintained at least during the soldering work to prevent the fuse element from malfunctioning at the soldering work temperature.

さらに本発明のバイパス電極は、金属ペーストを焼結して形成するため、スポンジ様の巣の多いポーラス状の電極材であり、液相化したヒューズエレメントを速やかに浸透させて縦深方向に立体的に溶解させることができ、この保護素子がリフローはんだ付けされた後、再加熱によりヒューズエレメントを速やかに溶断させる。しかも、バイパス電極に浸潤したヒューズエレメントとの界面に高抵抗の金属間化合物層が生成されても、バイパス電極が溶解(すなわち保護素子が動作)するまで、残余のバイパス電極が途中に金属間化合物層を介することなくパターン電極間の導通路を維持するので保護素子の内部抵抗が上昇するのを防止する。 Furthermore, since the bypass electrode of the present invention is formed by sintering a metal paste, it is a porous electrode material with many sponge-like cavities, and a fuse element in a liquid phase is quickly permeated to form a three-dimensional shape in the depth direction. After the protective element is reflow-soldered, the fuse element is quickly melted by reheating. Moreover, even if a high-resistance intermetallic compound layer is formed at the interface with the fuse element that has infiltrated the bypass electrode, the remaining bypass electrode is left in the middle of the intermetallic compound until the bypass electrode is dissolved (that is, the protective element operates). Since the conductive path between the pattern electrodes is maintained without interposing the layer, the internal resistance of the protective element is prevented from increasing.

本発明に係るバイパス電極付き保護素子10の部品部材を分解した斜視図を示す。The perspective view which decomposed|disassembled the component member of the protection element 10 with a bypass electrode which concerns on this invention is shown. 本発明に係るバイパス電極付き保護素子20であり、(a)は(b)のd−d線に沿って蓋体を切断した平面図を示し、(b)は(a)のD−D線に沿った断面図を示し、(c)はその下面図を示す。It is the protection element 20 with a bypass electrode which concerns on this invention, (a) shows the top view which cut|disconnected the lid|cover along the d-d line of (b), (b) shows the D-D line of (a). FIG. 3C is a cross-sectional view taken along the line, and FIG. 本発明に係るバイパス電極付き保護素子30であり、(a)は(b)のd−d線に沿って蓋体を切断した平面図を示し、(b)は(a)のD−D線に沿った断面図を示し、(c)はその下面図を示す。It is the protection element 30 with a bypass electrode which concerns on this invention, (a) shows the top view which cut|disconnected the lid body along the dd line of (b), (b) shows the D-D line of (a). FIG. 3C is a cross-sectional view taken along the line, and FIG.

本発明に係るバイパス電極付き保護素子10は、図1に示すように、絶縁基板11と、この絶縁基板11に設けた銅、銀、銅合金、銀合金からなる複数のパターン電極12と、所定のパターン電極12の間を電気接続した銅、銀、銅合金、銀合金などの低抵抗材からなるバイパス電極13と、所定のパターン電極12の間を橋設すると共にバイパス電極13と近接して設けた少なくとも1つのヒューズエレメント14と、このヒューズエレメント14の表面に塗布した動作フラックス(図示せず)と、この動作フラックスごとヒューズエレメント14の上部を覆った蓋体15とを備え、該バイパス電極13は、絶縁基板11に設けられ、ヒューズエレメント14よりも溶融温度が高く、かつ溶融したヒューズエレメント14に溶解性の金属材から構成されたことを特徴とする。本発明のバイパス電極13は、積層セラミック基板の内部電極用に用いられる金属ペーストを焼結して形成された焼結電極からなり、該バイパス電極用金属ペーストは、ガラスフリット含有量を未添加ないし2質量%未満のものを用いたことを特徴とする。ガラスフリット含有量が2質量%を上回るとガラス材がバイパス電極13の溶解や溶融ヒューズエレメント14の浸透を阻害するようになるため、バイパス電極13の融け残りが生じ易くなる。一方、本発明のパターン電極12は、材料等を特に限定されない。例えば、本発明のパターン電極12は、上述のバイパス電極用金属ペーストを用いて焼結形成してバイパス電極13と同じ構成とすることもできるし、あるいは、溶融ヒューズエレメントに溶解しない別の導電材料を選定することもできる。一例として、バイパス電極用の金属ペーストより多くのガラスフリットを含有(すなわち、ガラスフリットを2質量%以上、好ましくは2〜5質量%含有するなど)した別の金属ペーストを用いて焼結形成するか、または同じバイパス電極用の金属ペーストを用いてパターン電極12も焼結形成し、このパターン電極12のみを溶融ヒューズエレメントに溶解しないニッケルなどバリア性の被覆材でさらに覆ってもよい。このバイパス電極付き保護素子10の絶縁基板11は、耐熱性の絶縁板、例えば、ガラスエポキシ基板、セラミックス基板、ガラス基板などからなり、絶縁基板11の片面に必要に応じて抵抗発熱素子を設けてもよい。抵抗発熱素子は必要に応じて絶縁コーティングを施す。抵抗発熱素子を設けない場合は、ヒューズエレメント14に接続されるパターン電極12のうち中央の電極を省略してもよい。蓋体14は、絶縁基板11およびヒューズエレメント14の上部を覆って所望のキャビティ空間を確保できればよく、形状、材質を制限するものではない。例えば、蓋体14には、ドーム状樹脂フイルムカバー、プラスチック蓋、セラミックス蓋などが好適に利用できる。 As shown in FIG. 1, a protection element 10 with a bypass electrode according to the present invention includes an insulating substrate 11, a plurality of pattern electrodes 12 made of copper, silver, a copper alloy, and a silver alloy, which are provided on the insulating substrate 11, and a predetermined pattern. The bypass electrode 13 made of a low-resistance material such as copper, silver, copper alloy, or silver alloy electrically connected between the pattern electrodes 12 and the predetermined pattern electrode 12 are bridged and close to the bypass electrode 13. The bypass electrode is provided with at least one fuse element 14 provided, an operating flux (not shown) applied to the surface of the fuse element 14, and a lid 15 that covers the upper portion of the fuse element 14 together with the operating flux. 13 is provided on the insulating substrate 11, has a melting temperature higher than that of the fuse element 14, and is made of a metal material that is soluble in the melted fuse element 14. The bypass electrode 13 of the present invention is a sintered electrode formed by sintering a metal paste used for an internal electrode of a laminated ceramic substrate, and the bypass electrode metal paste does not contain a glass frit content. It is characterized by using less than 2% by mass. If the glass frit content exceeds 2% by mass, the glass material hinders the melting of the bypass electrode 13 and the permeation of the fused fuse element 14, so that the unmelted portion of the bypass electrode 13 is likely to occur. On the other hand, the pattern electrode 12 of the present invention is not particularly limited in material and the like. For example, the patterned electrode 12 of the present invention may be formed by sintering using the above-mentioned metal paste for a bypass electrode to have the same structure as the bypass electrode 13, or another conductive material that is not melted in the fused fuse element. Can also be selected. As an example, sintering is performed using another metal paste containing more glass frit than the metal paste for the bypass electrode (that is, containing 2% by mass or more, preferably 2 to 5% by mass of the glass frit). Alternatively, the pattern electrode 12 may be sintered and formed using the same metal paste for the bypass electrode, and only the pattern electrode 12 may be further covered with a coating material having a barrier property such as nickel that does not dissolve in the molten fuse element. The insulating substrate 11 of the protection element 10 with the bypass electrode is made of a heat-resistant insulating plate, for example, a glass epoxy substrate, a ceramics substrate, a glass substrate, or the like. Good. An insulation coating is applied to the resistance heating element as needed. When the resistance heating element is not provided, the central electrode of the pattern electrodes 12 connected to the fuse element 14 may be omitted. The lid 14 may cover the upper portions of the insulating substrate 11 and the fuse element 14 to secure a desired cavity space, and does not limit the shape or material. For example, for the lid body 14, a dome-shaped resin film cover, a plastic lid, a ceramics lid, or the like can be preferably used.

本発明に係るバイパス電極付き保護素子20は、図2に示すように、絶縁基板21と、この絶縁基板21に設けた銅、銀、銅合金、銀合金からなる複数のパターン電極22と、所定のパターン電極22の間を電気接続した銅、銀、銅合金、銀合金などの低抵抗材からなるバイパス電極23と、所定のパターン電極22の間を橋設すると共にバイパス電極23と近接して設けた少なくとも1つのヒューズエレメント24と、このヒューズエレメント24の表面に塗布した動作フラックス(図示せず)と、この動作フラックスごとヒューズエレメント24の上部を覆った蓋体25とを備え、バイパス電極23は、絶縁基板21に設けられ、ヒューズエレメント24よりも溶融温度が高く、溶融したヒューズエレメント24に溶解性の金属材から構成されたことを特徴とする。このバイパス電極付き保護素子20の絶縁基板21は、耐熱性の絶縁板、例えば、ガラスエポキシ基板、セラミックス基板、ガラス基板などからなり、絶縁基板21の片面に抵抗発熱素子26を設ける。抵抗発熱素子26は絶縁コーティング(図示せず)を施す。なお、抵抗発熱素子26は、図2のようにヒューズエレメント24の搭載面と異なるもう一方の板面に設けてもよいし、図3のようにヒューズエレメント34と同じ板面に積層して設けてもよい。蓋体25は、絶縁基板21およびヒューズエレメント24の上部を覆って所望のキャビティ空間を確保できればよく、形状、材質を制限するものではない。例えば、蓋体25には、ドーム状樹脂フイルムカバー、プラスチック蓋、セラミックス蓋などが好適に利用できる。 As shown in FIG. 2, the protection element 20 with a bypass electrode according to the present invention includes an insulating substrate 21, a plurality of pattern electrodes 22 made of copper, silver, a copper alloy, and a silver alloy, which are provided on the insulating substrate 21, and a predetermined pattern. The bypass electrode 23 made of a low resistance material such as copper, silver, copper alloy, or silver alloy electrically connected between the pattern electrodes 22 and the predetermined pattern electrode 22 are bridged and close to the bypass electrode 23. The bypass electrode 23 is provided with at least one fuse element 24 provided, an operating flux (not shown) applied to the surface of the fuse element 24, and a lid 25 that covers the upper portion of the fuse element 24 together with the operating flux. Is provided on the insulating substrate 21, has a higher melting temperature than the fuse element 24, and is made of a metal material that is soluble in the melted fuse element 24. The insulating substrate 21 of the protection element 20 with the bypass electrode is made of a heat resistant insulating plate, for example, a glass epoxy substrate, a ceramics substrate, a glass substrate or the like, and the resistance heating element 26 is provided on one surface of the insulating substrate 21. The resistance heating element 26 is provided with an insulating coating (not shown). The resistance heating element 26 may be provided on the other plate surface different from the mounting surface of the fuse element 24 as shown in FIG. 2, or may be provided on the same plate surface as the fuse element 34 as shown in FIG. May be. The lid body 25 may cover the upper portions of the insulating substrate 21 and the fuse element 24 to secure a desired cavity space, and does not limit the shape or material. For example, as the lid 25, a dome-shaped resin film cover, a plastic lid, a ceramics lid, or the like can be preferably used.

本発明に係る実施例1のバイパス電極付き保護素子20は、図2に示すように、アルミナ・セラミックスの絶縁基板21と、この絶縁基板21の上下面に設けた複数の銀合金製パターン電極22と、所定のパターン電極22と電気接続され絶縁基板21の下面に設けた抵抗発熱素子26と、所定のパターン電極22の間を電気接続した銀材からなるバイパス電極23と、所定のパターン電極22の間を橋設すると共にバイパス電極23と近接して設けたヒューズエレメント24と、このヒューズエレメント24の表面に塗布した動作フラックス(図示せず)と、この動作フラックスごとヒューズエレメント24の上部を覆って絶縁基板21に固着した液晶ポリマー製の蓋体25とを備え、バイパス電極23は、絶縁基板21の上面に設けられ、ヒューズエレメント24よりも溶融温度が高く、溶融したヒューズエレメント24に溶解性の銀材から構成され、ガラスフリットが未添加の銀ペーストを焼結して成り、パターン電極22は、基板上下面のパターン電極22を電気接続する銀合金のハーフ・スルーホール27を有する。特に図示しないが、実施例1の抵抗発熱素子26の表面はガラスのオーバーグレーズを施している。 As shown in FIG. 2, a protective element 20 with a bypass electrode according to the first embodiment of the present invention includes an alumina/ceramic insulating substrate 21 and a plurality of silver alloy pattern electrodes 22 provided on the upper and lower surfaces of the insulating substrate 21. A resistance heating element 26 electrically connected to a predetermined pattern electrode 22 and provided on the lower surface of the insulating substrate 21, a silver bypass electrode 23 electrically connecting the predetermined pattern electrodes 22, and a predetermined pattern electrode 22. A fuse element 24 provided between the fuse electrode 24 and the bypass electrode 23 in a bridge manner, an operating flux (not shown) applied to the surface of the fuse element 24, and an upper portion of the fuse element 24 together with the operating flux. And a lid 25 made of liquid crystal polymer fixed to the insulating substrate 21, the bypass electrode 23 is provided on the upper surface of the insulating substrate 21, has a higher melting temperature than the fuse element 24, and is soluble in the melted fuse element 24. The pattern electrode 22 has a silver alloy half through hole 27 for electrically connecting the pattern electrodes 22 on the upper and lower surfaces of the substrate. Although not particularly shown, the surface of the resistance heating element 26 of Example 1 is glass overglaze.

本発明に係る実施例2のバイパス電極付き保護素子30は、実施例1の回路保護素子20を変形したもので、図3に示すように、アルミナ・セラミックスの絶縁基板31と、この絶縁基板31の上下面に設けた複数の銀合金製パターン電極32と、所定のパターン電極32と電気接続され絶縁基板31の上面に設けた抵抗発熱素子36と、所定のパターン電極32の間を電気接続した銀合金からなるバイパス電極33と、所定のパターン電極32の間を橋設すると共にバイパス電極33と近接して設けたヒューズエレメント34と、このヒューズエレメント34の表面に塗布した動作フラックス(図示せず)と、この動作フラックスごとヒューズエレメント34の上部を覆って絶縁基板31に固着した液晶ポリマー製の蓋体35とを備え、バイパス電極33は、絶縁基板31の上側に設けられ、ヒューズエレメント34よりも溶融温度が高く、溶融したヒューズエレメント34に溶解性の銀合金から構成され、ガラスフリットが未添加の銀合金ペーストを焼結して成り、パターン電極32は、基板上下面のパターン電極32を電気接続する銀合金のハーフ・スルーホール37を有する。特に図示しないが、実施例2の抵抗発熱素子36の所定表面はガラスのオーバーグレーズを施している。 A protection element 30 with a bypass electrode according to a second embodiment of the present invention is a modification of the circuit protection element 20 of the first embodiment. As shown in FIG. 3, an insulating substrate 31 made of alumina/ceramics and this insulating substrate 31 are used. The plurality of silver alloy pattern electrodes 32 provided on the upper and lower surfaces, the resistance heating element 36 electrically connected to the predetermined pattern electrode 32 and provided on the upper surface of the insulating substrate 31, and the predetermined pattern electrode 32 are electrically connected. A bypass electrode 33 made of a silver alloy, a fuse element 34 provided between the predetermined pattern electrode 32 and the fuse electrode 34 in the vicinity of the bypass electrode 33, and an operating flux (not shown) applied to the surface of the fuse element 34. ) And a lid 35 made of liquid crystal polymer that covers the upper portion of the fuse element 34 together with the operating flux and is fixed to the insulating substrate 31, and the bypass electrode 33 is provided on the upper side of the insulating substrate 31. Also has a high melting temperature and is formed by sintering a silver alloy paste which is composed of a silver alloy which is soluble in the melted fuse element 34 and glass frit is not added, and the pattern electrode 32 is formed on the upper and lower surfaces of the substrate. It has a silver alloy half through hole 37 for electrical connection. Although not particularly shown, the predetermined surface of the resistance heating element 36 of the second embodiment is glass overglaze.

なお、実施例1および実施例2のバイパス電極付き保護素子は、絶縁基板上下面のパターン電極を電気接続する配線手段は、ハーフ・スルーホールに替えて該基板を貫通した導体スルーホールや、平面電極パターンによる表面配線に変更してもよい。 In the protective elements with bypass electrodes of Examples 1 and 2, the wiring means for electrically connecting the pattern electrodes on the upper and lower surfaces of the insulating substrate was replaced with a half through hole, a conductor through hole penetrating the substrate, or a flat surface. You may change to the surface wiring by an electrode pattern.

本発明のバイパス電極付き保護素子は、他の表面実装部品と共に被保護回路板にマウントでき、リフロー工法などで一括はんだ付け実装されて、電池パックなど2次電池の保護装置に利用できる。 The protection element with a bypass electrode according to the present invention can be mounted on a circuit board to be protected together with other surface mounting components, and can be collectively soldered and mounted by a reflow method or the like to be used as a protection device for a secondary battery such as a battery pack.

10、20、30・・・バイパス電極付き保護素子、
11、21、31・・・絶縁基板、
12、22、32・・・パターン電極、
13、23、33・・・バイパス電極、
14、24、34・・・ヒューズエレメント、
15、25、35・・・蓋体、
26、36・・・抵抗発熱素子、
17、27、37・・・ハーフ・スルーホール。
10, 20, 30... Protective element with bypass electrode,
11, 21, 31... Insulating substrate,
12, 22, 32... Pattern electrodes,
13, 23, 33... Bypass electrode,
14, 24, 34... Fuse element,
15, 25, 35... Lid,
26, 36... Resistance heating element,
17, 27, 37... Half through hole.

Claims (3)

絶縁基板と、この絶縁基板に設けた複数のパターン電極と、所定の前記パターン電極間を電気接続した低抵抗材からなるバイパス電極と、所定の前記パターン電極の間を橋設すると共に前記バイパス電極と近接して設けたヒューズエレメントとを備え、前記バイパス電極は、前記絶縁基板に設けられ、前記ヒューズエレメントよりも溶融温度が高く、溶融した前記ヒューズエレメントに溶解性の金属ペーストを焼結して形成した金属材から構成されており、前記金属ペーストは、ガラスフリット含有量を未添加ないし2質量%未満のものを用いたことを特徴とするバイパス電極付き保護素子。 An insulating substrate, a plurality of pattern electrodes provided on the insulating substrate, a bypass electrode made of a low resistance material that electrically connects the predetermined pattern electrodes, and a bridge between the predetermined pattern electrodes and the bypass electrode. And a fuse element provided in proximity to the fuse element, the bypass electrode is provided on the insulating substrate, has a higher melting temperature than the fuse element, and sinters a meltable metal paste to the melted fuse element. A protection element with a bypass electrode , comprising a formed metal material , wherein the metal paste is a glass frit content not added or less than 2% by mass . 前記絶縁基板の片面にさらに抵抗発熱素子を設けたことを特徴とする請求項1に記載のバイパス電極付き保護素子。 The protection element with a bypass electrode according to claim 1, further comprising a resistance heating element provided on one surface of the insulating substrate. 前記バイパス電極は、銅、銀、銅合金、銀合金の群から選択された少なくとも1つの溶解性の金属材を用いたことを特徴とする請求項1または請求項2に記載のバイパス電極付き保護素子。
The bypass electrode protection according to claim 1 or 2, wherein the bypass electrode is made of at least one soluble metal material selected from the group consisting of copper, silver, copper alloys, and silver alloys. element.
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