JP2005021719A - Imaging device for endoscope - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging device for endoscope, which can prevent degradation of images caused by autoclave sterilization treatment. <P>SOLUTION: An imaging face of a solid state imaging element is adhered and fixed on the backside face of a cover glass 17 via a diaphragm plate 24, which is constituted of a thin plate of phosphor bronze plate, etc., in a shape same as that of the back side of the cover glass 17, and an opening having a nearly square shape almost same as that of an imaging range of a solid state imaging element 19 for a position image of the subject is formed at the center. Thus a gap without an adhesion face is formed between the solid state imaging element 19 and the cover glass 17 to prevent degradation of images caused by peeling-off of the adhesion face by distortion arisen during autoclave sterilization treatment, etc. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention is an endoscope that ensures the airtightness of an imaging function composed of an optical member and an electronic member for imaging a subject site incorporated in an electronic endoscope, and prevents high-pressure and high-temperature steam from entering during autoclave sterilization processing. The present invention relates to an imaging device.

  2. Description of the Related Art In recent years, endoscopes are widely used in the medical field to be inserted deep in a body cavity to observe and diagnose a subject site in the body cavity or to perform a therapeutic treatment using a treatment tool as necessary. It has become.

  It is indispensable that this medical endoscope be used for diagnostic treatment or before diagnostic treatment before it is surely sterilized, and this disinfection sterilization treatment can be performed in gases such as ethylene oxide gas or in disinfectant solution. The method of soaking in is generally used.

  However, as is well known, it is necessary to pay close attention to daily storage management of sterilization gas and disinfectant, and strictly comply with work procedures to ensure the safety of workers during disinfection and sterilization work. In addition, disinfection and sterilization processes such as the need to provide aeration time for removing gas and disinfectant that have adhered to the device after disinfection and sterilization are performed under strict control. For this reason, a lot of time is required for the disinfection and sterilization work.

  Therefore, recently, autoclave sterilization (high-pressure high-temperature steam sterilization), which can surely perform sterilization and can be used immediately after sterilization, and can reduce the cost of sterilization, has been used for endoscope apparatuses. ing.

  In this autoclave sterilization, an object to be sterilized, which is an endoscope apparatus, is soaked and sterilized in steam at high pressure and high temperature (about 120 ° C. to 135 ° C.).

  The endoscope apparatus to be disinfected and sterilized by autoclave sterilization needs to be airtight so that water vapor does not enter the optical member or electronic member incorporated in the endoscope. Although it is solidified and fixed with a resin-based adhesive to form a watertight structure, sufficient resistance to prevent the intrusion of water vapor was not obtained.

  For example, Patent Document 1 and Patent Document 2 have proposed endoscope apparatuses adapted to such autoclave sterilization.

  The endoscope proposed in Patent Document 1 has a structure in which a solid-state image pickup device is completely hermetically sealed using a hermetic connector, and a solid-state image pickup device inside a watertight structure for shortening a hard portion of the image pickup unit. The example provided in FIG.

In addition, the endoscope proposed in Patent Document 2 shows a structure in which a solid-state imaging device is completely airtight using a hermetic connector.
JP 2000-115594 A JP 2000-70213 A

  By the way, as disclosed in Patent Documents 1 and 2, in this type of endoscope, a solid-state image sensor is usually surface-bonded to a cover glass. Therefore, the endoscope having such a configuration peels off the adhesive surface between the cover glass and the solid-state imaging device when the cover glass frame is distorted by thermal expansion and contraction due to high-pressure and high-temperature water vapor during autoclave sterilization. There is a risk that the image will be deteriorated due to this.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an endoscope imaging apparatus that can prevent image degradation due to autoclave sterilization.

  The present invention includes a cylindrical frame, an optical member that is held on the inner peripheral surface of the frame and transmits light from a subject, and light that is provided on one surface of the optical member and passes through the optical member. And a solid-state imaging device held via the plate for imaging light transmitted through the optical member.

  According to the endoscope imaging apparatus of the present invention, it is possible to prevent image degradation caused by autoclave sterilization.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is an external view illustrating a schematic configuration of an endoscope apparatus according to a first embodiment of the present invention, and FIG. 2 illustrates a configuration of a distal end portion of the endoscope apparatus according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view, FIG. 3 is a cross-sectional view showing a configuration of an imaging unit arranged at the distal end portion of the endoscope apparatus according to the first embodiment of the present invention, and FIG. It is a perspective view which shows the structure of the reinforcement member for solid-state image sensors used for the imaging unit of a endoscope apparatus.

  The endoscope main body 1 of the endoscope apparatus according to the first embodiment of the present invention includes an insertion portion 2, an operation portion 5, a flexible cord 8, and a connector 7, as shown in FIG.

  The insertion portion 2 is generated by a flexible member that is inserted into a body cavity, and is provided with a light guide cable, a signal cable, a bending operation wire, a treatment forceps, an air supply / exhaust channel, and the like.

  The distal end portion of the insertion portion 2 has a distal end portion 3 and a curved portion 4, and the distal end portion 3 has an illumination light projection hole from the light guide cable, a solid-state imaging device for imaging a subject site, In addition, a forceps hole for treatment and the like are provided. When the insertion portion 2 is inserted into the body cavity from the distal end portion 3, the bending portion 4 is bent according to the lumen of the body cavity so that the insertion portion 2 is quickly inserted.

  An operation portion 5 is provided at the base end portion of the insertion portion 2, and the operation portion 5 includes an angle lever 6 for performing a remote bending operation via a bending operation wire of the bending portion 4, and is not illustrated. It has a treatment instrument insertion hole. A flexible cord 8 containing a light guide cable, a signal cable, or the like is connected and extended from the proximal end side of the operation unit 5, and a connector 7 is connected to the proximal end of the flexible cord 8. The connector 7 is connected to a light source device (not shown), and projects illumination light onto the light guide cable, or is connected to a video processor device and a solid-state image sensor provided at the distal end portion 3 is connected via a signal cable. The drive is controlled.

  The internal configuration of the distal end portion 3 of the insertion portion 2 of the endoscope body 1 will be described with reference to FIG. FIG. 2 is a cross-sectional view of the tip portion 3 cut in the axial direction.

  A tip cover glass 11 is airtightly held by a metal frame 12 at the forefront of the imaging unit 9 at the tip 3. The tip cover glass 11 is formed in a substantially circular shape, and the circular outer periphery thereof is held by a substantially cylindrical metal frame 12. The joint between the tip cover glass 11 and the metal frame 12 is airtightly joined by brazing (hard brazing or soft brazing). Moreover, since the outer surface exposed to the outside is exposed to the high-pressure high-temperature steam at the time of autoclave sterilization, the tip cover glass 11 is desirably a sapphire having a performance capable of withstanding autoclave sterilization.

  The inner peripheral surface on the base end side of the metal frame 12 is airtightly joined to the connection pipe 13 formed in a substantially cylindrical shape. The hermetic joint between the metal frame 12 and the connection pipe 13 is laser-welded using a YAG laser that can be easily managed with low output.

  On the inner peripheral surface of the connection pipe 13, a substantially cylindrical insulating frame 14 formed of alumina ceramics or the like and having a high electrical insulation property so as to prevent high-pressure and high-temperature steam from entering is hermetically bonded. Has been placed. A substantially cylindrical connection pipe 15 is airtightly joined to the outer peripheral surface of the base end of the insulating frame 14.

  An objective optical system 18 composed of a plurality of lenses is housed in the inner space of the tip cover glass 11 and the inner space of the metal frame 12 and the insulating frame 14 joined by the connection pipe 13.

  Airtight joining between the outer peripheral surfaces of the both ends of the insulating frame 14 and the connection pipe 13 and the connection pipe 15 is joined by brazing (hard brazing or soft brazing) and unitized in advance.

  The outer periphery of the connection pipe 15 is airtightly joined to the substantially cylindrical cover glass frame 16 by laser welding. The cover glass frame 16 is used for airtightly bonding and holding the outer periphery of the cover glass 17 formed of an optical member. The cover glass 17 and the cover glass frame 16 are hermetically bonded by brazing (hard brazing or soft brazing).

  It should be noted that a metallized (metal) is formed at the joint between the tip cover glass 11 and the metal frame 12, the joint between the cover glass 17 and the cover glass frame 16, and the joint between the insulating frame 14 and the connection pipes 13 and 15. Film formation) is applied, and brazing is possible. Metallization is performed by baking molybdenum manganese and then plating nickel, or by forming a film using a vacuum process such as vapor deposition or sputtering of chromium and nickel, and the outer surface is wetted against the brazing material. And has a structure resistant to heat and stress during brazing and autoclave sterilization.

  The metal frame 12, the connection pipes 13 and 15, and the cover glass frame 16 that are welded by the YAG laser are preferably formed of a stainless material such as SUS304.

  A solid-state image sensor 19 is provided on the rear surface side of the cover glass 17, and the solid-state image sensor 19 is electrically connected to the cable 21 via the substrate 20. The substrate 20 and the cable 21 are sealed and fixed in the cable frame 23 with an adhesive.

  The outer peripheral surfaces of the cover glass frame 16 and the cable frame 23 are hermetically joined to the inner peripheral surface of the shield frame 22 by YAG laser welding.

  That is, the imaging unit 10 including the solid-state imaging device 19, the substrate 20, and the cable 21 is formed in a space portion formed by airtight bonding with the shield frame 22 on the outer peripheral surfaces of the cover glass frame 16 and the cable frame 23. It forms a high level watertight space where water and water vapor do not enter.

  Next, the configuration of the storage portion of the imaging unit 10 of the imaging unit 9 in which the individual imaging element 19 is installed will be described in detail with reference to FIG.

  The imaging surface of the solid-state imaging device 19 is bonded and fixed to the rear surface side of the cover glass 17 through a diaphragm plate 24. The diaphragm plate 24 is formed by using a thin plate such as a phosphor bronze plate having the same shape as the rear surface side of the cover glass 17, and a substantially square opening is formed at the center thereof. It has substantially the same shape as the imaging range of the subject region image of the element 19.

  That is, the subject region image light transmitted through the openings of the cover glass 17 and the diaphragm plate 24 is projected within the imaging range of the imaging surface of the solid-state imaging device 19.

  A reinforcing member 25 is attached to the back surface of the solid-state imaging device 19, and the reinforcing member 25 is bonded and fixed to the cover glass frame 16.

  As shown in FIG. 4, the reinforcing member 25 has a pair of symmetrical openings 28, 28 that are substantially arc-shaped in the axial direction from the bottom surface 25 a of the bottomed cylindrical member. The lead wire of the solid-state image sensor 19 can be inserted into the. That is, the solid image pickup device 19 is mounted so that the bottom surface 25a of the reinforcing member 25 is in contact with the rear end surface of the solid image pickup device 19, and the lead wires of the mounted solid image pickup device 19 are pulled out from the openings 28 and 28 and connected to the substrate 20. .

  The bottom surface portion 25a of the reinforcing member 25 and the rear end surface of the solid-state imaging device 19 are held and fixed with an adhesive.

  In addition, when electrical insulation between the rear end surface of the solid-state imaging device 19 and the bottom surface 25a of the reinforcing member 25 is necessary, it is formed of polyimide or the like that has electrical insulation and heat resistance. Alternatively, an insulating sheet (not shown) may be sandwiched between the bottom surface portion 25 a of the reinforcing member 25 and the rear end surface of the solid-state imaging device 19. The shape of the reinforcing member 25 may be any shape as long as the solid-state imaging device 19 can be reinforced and held and fixed, such as a shape similar to the outer shape of the solid-state imaging device 19 or a U-shape.

  The cable frame 23 has a substantially cylindrical shape, a cable 21 is inserted therein, and a substrate 20 electrically connected by soldering each signal line inside the cable 21 is solidified and fixed with an adhesive. .

  A substantially cylindrical separation wall 26 is disposed on the inner periphery of the cable frame 23 on which the substrate 20 is disposed and the shield frame 22 is laser-bonded. A space 27 is formed in the space. The substrate 20 to which the cable 21 is connected is solidified and fixed with an adhesive on the inner peripheral side of the spacing wall 26.

  That is, the cable frame 23 accommodates the board 20 electrically connected to the lead wire of the solid-state imaging device 19 on the inner periphery and the cable 21 electrically connected to the board 20, and is solidified and fixed with an adhesive. A separation wall 26 is provided on the inner peripheral surface of the cable frame 23 at the portion where the shield frame 22 on the outer periphery of the cable frame 23 is laser welded via a space 27.

  A polymer adhesive member is used as an adhesive for sealing and fixing the substrate 20 and the cable 21 in the separation wall 26 of the cable frame 23.

  By having the separation wall 26 in the cable frame 23 in this way, when the shield frame 22 is attached to the cable frame 23 and laser welding is performed at the laser welded portion 22b in the drawing having the separation wall 26, the heat during the laser welding is obtained. Is difficult to be transmitted to the polymer adhesive member that bonds and fixes the substrate 20 and the cable 21 by the space 27 and the separation wall 26, and the polymer adhesive member does not melt.

  In addition, the airtight joining of the shield frame 22 and the cover glass frame 16 is laser-welded by a laser welding portion 22a.

  On the other hand, a lens 30 is provided on the front side of the cover glass 17 that is airtightly fixed to the cover glass member 16. The lens 30 is held and fixed by a lens centering member 29 on the front side of the cover glass 17 that is airtightly fixed to the cover glass frame 16.

  The lens centering member 29 is provided with a thin portion 29a interposed between the cover glass 17 and the lens 30, and the thin portion 29a prevents the cover glass 17 and the lens 30 from being in surface contact. It is configured.

  Further, a spacing member 31 and a diaphragm 32 are provided on the object site image light intake side, which is the distal end side of the lens centering member 29.

  The spacing member 31 sets a distance dimension between the lens 30 and the diaphragm 32. The diaphragm 32 is an object region image when the object region image captured by the objective optical system 18 is projected onto the lens 30. An opening for setting the light projection range is provided.

  The procedure for assembling the imaging unit 10 to the imaging unit 9 will be described. First, the diaphragm plate 24 is bonded and fixed to the imaging surface of the solid-state imaging device 19. When the diaphragm plate 24 is bonded and fixed to the imaging surface of the solid-state image sensor 19, the positional relationship between the imaging range of the solid-state image sensor 19 and the opening of the diaphragm plate 24 is adjusted.

  Next, the diaphragm plate 24 bonded and fixed to the solid-state image sensor 19 is positioned and fixed to the rear surface side of the cover glass 17 that is airtightly fixed to the cover glass frame 16. The reinforcing member 25 is assembled. The reinforcing member 25 is bonded and fixed to the outer periphery of the cover glass frame 16.

  The lead wire of the solid-state imaging device 19 reinforced by the reinforcing member 25 and attached and fixed to the rear surface side of the cover glass 17 via the diaphragm plate 24 is electrically soldered to the substrate 20 to which the cable 21 is connected. Let

  The periphery of the substrate 20 to which the lead wire of the solid-state imaging device 19 and the cable 21 are connected is solidified and fixed by injecting and sealing a polymer adhesive on the inner periphery of the separation wall 26 of the cable frame 23.

  In this way, after the solid-state imaging device 19, the cover glass 17, the substrate 20, and the cable 21 are installed and hermetically fixed in the internal space between the cover glass frame 16 and the cable frame 23, the cover glass frame 16 and the cable frame 23 are The shield frame 22 is fitted on the outer periphery, the cover glass frame 16 and the shield frame 22 are laser welded by the laser welded portion 22a, and the cable frame 23 and the shield frame 22 are laser welded by the laser welded portion 22b.

  In this laser welding, conventionally, the vicinity of the laser welded portions 22a and 22b is exposed to a high temperature. In particular, the substrate 20 and the cable 21 are sealed and fixed with an adhesive inside the cable frame 23. The molecular adhesive is melted by laser welding heat, the melted adhesive leaks from the hole formed by welding, the solder electrically connecting the substrate 20 and the cable 21 is melted, or the cover There is a risk that brazing and airtight fixation of the glass 17 and the cover glass frame 16 may occur.

  However, as in the present invention, the cable frame 23 and the shield frame 22 are laser welded. In particular, the cable frame 23 of the laser welded portion 22b is provided with a separation wall 26, and the gap between the separation wall 26 and the cable frame 23 is provided. The formation of the space 27 makes it difficult for laser welding heat to be transmitted to the sealing polymer adhesive inside the cable frame 23, and the sealing adhesive, solder, etc. for the substrate 20 and the cable 21. Does not dissolve.

  Therefore, the cover glass frame 16, the cable frame 23, and the shield frame 22 are formed, and the airtightness of the space where the solid-state image sensor 19 is mainly installed can be secured.

  In addition, the endoscope having such a configuration has a solid-state imaging device 19 attached to the cover glass frame 16 even if the cover glass frame 16 is distorted by thermal expansion and contraction due to high-pressure and high-temperature steam during autoclave sterilization. Between the cover glass 17 and the lens 30, a gap is provided by the diaphragm plate 24 and the thin portion 29a of the lens centering member 29, that is, between the solid-state imaging device 19 and the cover glass 17, or the cover. There is no adhesive surface between the glass 17 and the lens 30. Therefore, image degradation due to the adhesive surface peeling due to distortion does not occur.

  Furthermore, an objective optical system formed by the space for installing the imaging unit 10 formed by the cover glass frame 16, the cable frame 23, and the shield frame 22, the metal frame 12, the connection pipes 13 and 15, and the insulating frame 14. The space in which the 18 is installed is joined by brazing or laser welding, so that high-pressure and high-temperature steam can be completely prevented from entering, and the lens is not deteriorated, the lens coating is peeled off, and water droplets are hardly attached. A good field of view.

  Next, a second embodiment of the imaging unit of the endoscope apparatus of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a configuration of a second embodiment of an imaging unit used in the endoscope apparatus of the present invention. The same parts as those in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the imaging section 33 of the second embodiment provided at the distal end portion 3 of the endoscope apparatus of the present invention, the outer peripheral surface of the cover glass 17 is brazed and airtightly joined to a cylindrical cover glass frame 34, and this cover glass frame A cylindrical portion 34a extends rearward (rightward in the drawing) from the joint portion with the cover glass 17, and a cylindrical portion 34 is formed so as to form a space portion 37 inside the cylindrical portion 34a. A single separation wall 35 is provided, and the solid-state imaging device 19 is installed in the central portion of the inside of the first separation wall 35. An adhesive is sealed and fixed between the first separation wall 35 and the solid-state imaging device 19.

  The outer diameter of the portion of the cover glass frame 34 extending forward (leftward in the figure) from the joint portion with the cover glass 17 is formed smaller than the outer diameter of the cylindrical portion 34a.

  On the outer periphery of the cylindrical portion 34a of the cover glass frame 34 and the cable frame 23, the shield frame 36 is laser welded by laser welding portions 36a and 36b, respectively. A first separating wall 35 is provided on the inner periphery of the cover glass frame 34 facing the laser welded portion 36a. The first separation wall 35 has a cylindrical shape that is substantially the same shape as the cover glass frame 34, and a space 37 is provided between the first separation wall 35 and the cover glass frame 34.

  A second spacing wall 38 is provided on the inner periphery of the cable frame 23 facing the laser weld 36b. A concave portion 39 is provided at the axial center portion of the outer peripheral surface of the second spacing wall 38. That is, both end portions in the axial direction of the outer peripheral surface of the second separation wall 38 are in contact with the inner peripheral surface of the cable frame 23, and the concave portion 39 in the central portion is a space portion between the inner peripheral surface of the cable frame 23. The recess 39 that forms the space is provided at a position facing the laser weld 36b.

  The imaging unit 33 having such a configuration positions, bonds, and fixes the solid-state imaging element 19 to the cover glass 17 hermetically bonded to the cover glass frame 34 via the diaphragm plate 24, and the lead wire of the solid-state imaging element 19 attaches the substrate 20. And the solid-state imaging device 19, the substrate 20, and the cable 21 are bonded to the inner peripheral portion of the first separation wall 35 of the cover glass frame 34 and the second separation wall 38 of the cable frame 23. Seal and fix with an agent. As described above, the cover glass frame 34 in which the cover glass 17, the solid-state imaging device 19, the substrate 20, and the cable 21 are installed, and the shield frame 36 are mounted on the outer periphery of the cable frame 23, and then the cover glass is formed by the laser welding portions 36 a and 36 b. The frame 34, the cable frame 23, and the shield frame 36 are laser welded.

  In this laser welding, the heat generated in the laser welded part 36a is suppressed from being transmitted by the space 37 formed by the space part 37 and the first separation wall 35, and the heat generated in the laser welded part 36b is Transmission is suppressed by the space formed by the second separation wall 38.

  Therefore, the imaging unit 33 can prevent the heat of welding when the shield frame 36 is laser-welded from being transmitted to the solid-state imaging device 19 which is an electronic component built in the cover glass frame 34 and the cable frame 23, and Further, it is possible to prevent heat transfer that melts the adhesive that is sealed for solidifying and fixing the substrate 20 and the cable 21 connected to the solid-state imaging device 19. For this reason, the imaging unit 33 can be hermetically joined and assembled, and can prevent high-pressure and high-temperature steam from entering during autoclave sterilization.

  Next, the modification of 2nd Embodiment of the imaging unit of the endoscope apparatus of this invention is demonstrated using FIG. FIG. 6 is a cross-sectional view showing a configuration of a modified example of the second embodiment of the imaging unit used in the endoscope apparatus of the present invention. The same parts as those in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The imaging unit 33 ′ according to the modification of the second embodiment is different from the imaging unit 33 in FIG. 5 in that a heat insulating member is used instead of the second separation wall 38 provided on the inner peripheral surface of the cable frame 23. There is a difference in that the formed heat insulating wall 40 is provided.

  The heat insulating wall 40 is attached to the entire inner periphery of the cable frame 23, and insulates the welding heat when the shield frame 36 attached to the outer peripheral surface of the cable frame 23 is laser-welded from the laser welded portion 36b. For the heat insulating wall 40, ceramics or zirconia, which has a heat insulating property and has a low thermal conductivity, is suitable. Further, other materials may be used as long as the same effect can be obtained. Due to the heat insulating wall 40, the welding heat is not transmitted to the sealing adhesive that solidifies and fixes the substrate 20 and the cable 21, so that the adhesive does not melt. Further, although not shown in FIG. 5, the separating wall 35 may be used in place of the heat insulating wall.

  As a result, it is possible to prevent the high-pressure and high-temperature steam from entering the imaging unit 33 ′ when the endoscope apparatus using the imaging unit 33 ′ is autoclaved.

[Appendix]
According to the embodiment of the present invention described in detail above, the following configuration can be obtained.

(Appendix 1)
A first frame for forming an airtight space;
A second frame for engaging with the first frame to form an airtight space with the first frame;
A welded portion that is provided on the first frame or the second frame and is welded to hermetically seal between the first frame and the second frame;
A separating wall provided at a position corresponding to the welded portion in a space hermetically sealed by the first frame and the second frame, and spaced from the welded portion;
An imaging unit provided at a position where the subject opposite to the welded portion can be imaged with respect to the separation wall in the hermetically sealed space;
A polymer adhesive member injected and solidified between the imaging unit and the separation wall;
An endoscope imaging device characterized by comprising:

(Appendix 2)
A first frame for forming an airtight space;
A second frame for engaging with the first frame to form an airtight space with the first frame;
A welded portion that is provided on the first frame or the second frame and is welded to hermetically seal between the first frame and the second frame;
A separation wall provided at a position corresponding to the welded portion in a space formed of a heat insulating material and hermetically sealed by the first frame and the second frame;
An imaging unit provided at a position where the subject opposite to the welded portion can be imaged with respect to the separation wall in the hermetically sealed space;
A polymer adhesive member injected and solidified between the imaging unit and the separation wall;
An endoscope imaging device characterized by comprising:

(Appendix 3)
A first frame for forming an airtight space;
A second frame for engaging with the first frame to form an airtight space with the first frame;
A welded portion that is provided on the first frame or the second frame and is welded to hermetically seal between the first frame and the second frame;
An imaging unit provided at a position where the subject can be imaged inside a space hermetically sealed by the first frame and the second frame;
A polymer adhesive member injected and solidified between the weld and the imaging unit;
A polymer adhesive member holding wall that is provided at a position separated from the welded portion and seals and holds the polymer adhesive member at a predetermined position separated from the welded portion;
An endoscope imaging device characterized by comprising:

(Appendix 4)
A first frame for forming an airtight space;
A second frame for engaging with the first frame to form an airtight space with the first frame;
A welded portion provided on the first frame or the second frame and welded to hermetically seal between the first frame and the second frame;
An imaging unit provided at a position where the subject can be imaged inside a space hermetically sealed by the first frame and the second frame;
A polymer material injected between the weld and the imaging unit;
A polymer adhesive member holding wall formed by a heat insulating member provided at a position separated from the welded portion and sealingly holding the polymer adhesive member at a predetermined position spaced apart from the welded portion;
An endoscope imaging device characterized by comprising:

(Appendix 5)
A first frame member made of a metal material and having a substantially cylindrical shape;
A second frame member that fits with the first member, houses an electronic component therein, and has a substantially cylindrical shape made of a metal material;
An imaging unit in which a fitting portion of the first frame member and the second frame member is airtightly joined by welding;
A heat shut-off means provided on the inner side of the fitting portion between the first member and the second member;
An endoscope provided with

(Appendix 6)
The endoscope according to appendix 5, wherein the heat blocking means is an air layer.

(Appendix 7)
A pipe member is provided between the fitting portion of the first frame member and the second frame member and the electronic component, and a heat blocking means by an air layer is provided between the pipe member and the welded portion. The endoscope according to appendix 6.

(Appendix 8)
The endoscope according to appendix 7, wherein the pipe member is filled with an adhesive.

(Appendix 9)
The endoscope according to any one of appendices 5 to 8, which can be autoclaved.

1 is an external view illustrating a schematic configuration of an endoscope apparatus according to a first embodiment of the present invention. Sectional drawing which shows the structure of the front-end | tip part of the endoscope apparatus of the 1st Embodiment of this invention. Sectional drawing which shows the structure of the imaging unit arrange | positioned at the front-end | tip part of the endoscope apparatus of the 1st Embodiment of this invention. The perspective view which shows the structure of the reinforcement member for solid-state image sensors used for the imaging unit of the endoscope apparatus of the 1st Embodiment of this invention. Sectional drawing which shows the structure of 2nd Embodiment of the imaging unit used for the endoscope apparatus of this invention. Sectional drawing which shows the structure of the modification of 2nd Embodiment of the imaging unit used for the endoscope apparatus of this invention.

Explanation of symbols

2 ... Insertion part 17 ... Cover glass 19 ... Solid-state image sensor 24 ... Diaphragm plate
Agent Patent Attorney Susumu Ito

Claims (2)

A cylindrical frame,
An optical member that is held on the inner peripheral surface of the frame and transmits light from the subject;
A plate provided on one surface of the optical member and having an opening for transmitting light transmitted through the optical member;
A solid-state imaging device held via the plate for imaging light transmitted through the optical member;
An endoscope imaging apparatus characterized by comprising:   The endoscope imaging apparatus according to claim 1, wherein the solid-state imaging element is sealed with an adhesive.

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