JP2004081577A - Image-sensing device of endoscope - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a desired image-sensing device of an endoscope wherein an electronic member such as a solid-state image-sensing element is prevented from being infiltrated with steam due to autoclave sterilization and is hardly affected by a thermal strain. <P>SOLUTION: In regard to the endoscope wherein an airtight space is formed by welding a cover glass frame 16, a cable frame 23 and a shield frame 22 which form the airtight space, and an image-sensing unit 10 is disposed in the airtight space. The image-sensing device of the endoscope is constituted by providing a separating wall 26 in the airtight space of either the cover glass frame or the cable frame 23 being welded, opposite to a welded part, and by injecting and solidifying a polymeric adhesive member between the separating wall 26 and the image-sensing unit 10. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides an endoscope that secures airtightness of an imaging function including an optical member and an electronic member for imaging an object part built in an electronic endoscope, and prevents intrusion of high-pressure, high-temperature steam during autoclave sterilization. The present invention relates to an imaging device.
[0002]
[Prior art]
2. Description of the Related Art In recent years, in the medical field, endoscopes that are inserted deep into a body cavity to observe and diagnose a subject in the body cavity, and perform a medical treatment or the like using a treatment tool as necessary have been widely used. Has become.
[0003]
It is essential that this medical endoscope be sterilized and sterilized after it is used for diagnostic treatment or before diagnostic treatment. This disinfection and sterilization can be performed by using a gas such as ethylene oxide gas or a disinfectant solution. It is a common method to wash with water.
[0004]
However, as is well known, it is necessary to pay close attention to the daily storage and management of sterilizing gases and disinfectants, and strictly control the adherence to work procedures to ensure the safety of workers during disinfection and sterilization. It is necessary to perform the disinfection / sterilization process under a strict control, for example, it is necessary to provide an aeration time for removing gas and a disinfectant adhering to the equipment after the disinfection / sterilization. For this reason, the disinfection sterilization process requires a lot of time.
[0005]
Therefore, recently, autoclave sterilization (high-pressure high-temperature steam sterilization), which can perform sterilization sterilization reliably, can be used immediately after sterilization sterilization processing, and can reduce the cost of the sterilization sterilization processing, has been used for endoscope devices. ing.
[0006]
In this autoclave sterilization, an object to be sterilized, which is an endoscope apparatus, is immersed in steam at a high pressure and a high temperature (about 120 ° C. to 135 ° C.) to be sterilized.
[0007]
In an endoscope apparatus which is disinfected and sterilized by this autoclave sterilization, it is necessary to be airtight so that water vapor does not enter an optical member or an electronic member incorporated in the endoscope. Although a water-tight structure is obtained by solidifying and fixing with a resin-based adhesive, sufficient resistance for preventing the invasion of the water vapor cannot be obtained.
[0008]
Endoscope devices compatible with such autoclave sterilization are proposed in, for example, JP-A-2000-115594 and JP-A-2000-70213.
[0009]
The endoscope proposed in JP-A-2000-115594 has a structure in which a solid-state imaging device is completely airtight using a hermetic connector, and a solid-state imaging device for shortening a hard portion of the imaging unit. Is provided inside the watertight structure.
[0010]
The endoscope proposed in Japanese Patent Application Laid-Open No. 2000-70213 has a structure in which a solid-state imaging device is completely airtight using a hermetic connector.
[0011]
[Problems to be solved by the invention]
In the structure in which the solid-state imaging device is completely airtight using the hermetic connector disclosed in Japanese Patent Application Laid-Open No. 2000-115594, it is difficult to reduce the size of the hermetic connector. In addition, the length of the rigid portion of the imaging unit becomes longer and the length of the distal end hard portion of the insertion portion also becomes longer. When such an endoscope having a thicker endoscope insertion portion and a longer distal end hard portion is used, the burden on the patient increases. At the same time, the operation performance of observation and diagnosis is reduced.
[0012]
In the case where the solid-state imaging device is made water-tight to shorten the hard portion of the imaging unit, the fitting and bonding portion is caused by peeling of the adhesive due to thermal expansion and cooling contraction of the metal component during autoclave sterilization and deterioration of the adhesive. The watertightness is destroyed, and the transmission of high-pressure and high-temperature steam to the electronic member is increased, and the performance of the electronic member may deteriorate.
[0013]
Further, in the structure in which the solid-state imaging device is completely air-tight using the hermetic connector disclosed in Japanese Patent Application Laid-Open No. 2000-70213, it is difficult to reduce the size of the hermetic connector. Has a problem of decreasing.
[0014]
The present invention has been made in view of the above circumstances, reduces the outer diameter of the endoscope insertion section, and prevents the invasion of water vapor by autoclave sterilization of electronic members such as a solid-state imaging device and an electronic substrate, and the autoclave An object of the present invention is to provide an endoscope imaging apparatus having resistance to sterilization.
[0015]
[Means for Solving the Problems]
An endoscope imaging apparatus according to the present invention includes a first frame for forming an airtight space, and a second frame for engaging with the first frame and forming an airtight space together with the first frame. And the first frame or the second frame is welded to the first frame or the second frame to hermetically seal the space between the first frame and the second frame. A welded portion, a separation wall provided at a position corresponding to the welded portion in a space hermetically sealed by the first frame and the second frame and separated from the welded portion; An imaging unit provided at a position capable of imaging an object on the opposite side to the welding portion with respect to the separation wall in a space that is airtightly sealed, and injected and solidified between the imaging unit and the separation wall; A polymer adhesive member,
It is characterized by having.
[0016]
An endoscope imaging apparatus according to the present invention includes a first frame for forming an airtight space, and a second frame for engaging with the first frame and forming an airtight space together with the first frame. And the first frame or the second frame is welded to the first frame or the second frame to hermetically seal the space between the first frame and the second frame. A welded portion, a separation wall formed at a position corresponding to the welded portion in a space formed by a heat insulating member and hermetically sealed by the first frame and the second frame; An imaging unit provided at a position capable of imaging an object on the side opposite to the welded portion with respect to the separation wall in a space sealed by the separation wall; And a molecular bonding member.
[0017]
An endoscope imaging apparatus according to the present invention includes a first frame for forming an airtight space, and a second frame for engaging with the first frame and forming an airtight space together with the first frame. And the first frame or the second frame is welded to the first frame or the second frame to hermetically seal the space between the first frame and the second frame. A welding unit, an imaging unit provided at a position where a subject can be imaged inside a space hermetically sealed by the first frame and the second frame, and the welding unit and the imaging A polymer adhesive member injected and solidified between the unit and a polymer adhesive member provided at a position separated from the welded portion and sealingly holding the photomolecular adhesive member at a predetermined position separated from the welded portion; And a holding wall.
[0018]
Further, an endoscope imaging apparatus according to the present invention includes a first frame for forming an airtight space, and a first frame for engaging with the first frame and forming an airtight space with the first frame. A second frame is welded to the first frame or the second frame to provide an airtight seal between the first frame and the second frame. A welded part to be imaged, an imaging unit provided at a position where a subject can be imaged inside a space hermetically sealed by the first frame and the second frame, and the welded part. A polymer adhesive member injected and solidified between the imaging unit and a polymer adhesive member holding wall formed of a heat insulating member and sealingly holding the photomolecular adhesive member at a position corresponding to the welding portion; It is characterized by having.
[0019]
According to the endoscope imaging apparatus of the present invention, an imaging unit including a solid-state imaging device for imaging an object part in an airtight frame is sealed and fixed with a polymer adhesive member, and the airtight frame is hermetically joined by welding. It has become possible to provide a hermetically bonded endoscope imaging apparatus that can prevent the polymer adhesive member from being melted by welding heat and that does not cause steam to enter the imaging unit in autoclave sterilization using high-pressure high-temperature steam.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is an external view illustrating a schematic configuration of an endoscope apparatus according to a first embodiment of the present invention, and FIG. 2 is a diagram illustrating a configuration of a distal end portion of the endoscope apparatus according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating a configuration of an imaging unit disposed at a distal end portion of the endoscope device according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view illustrating the configuration of the first embodiment of the present invention. FIG. 3 is a perspective view illustrating a configuration of a reinforcing member for a solid-state imaging device used in an imaging unit of an endoscope apparatus.
[0021]
The endoscope main body 1 of the endoscope apparatus according to the first embodiment of the present invention includes an insertion section 2, an operation section 5, a flexible cord 8, and a connector 7, as shown in FIG.
[0022]
The insertion section 2 is made of a flexible member inserted into a body cavity, and includes a light guide cable, a signal cable, a bending operation wire, a treatment forceps, a channel for air supply and exhaust, and the like.
[0023]
The distal end portion of the insertion portion 2 has a distal end portion 3 and a curved portion 4. The distal end portion 3 has an illumination light projection hole from a light guide cable, a solid-state imaging device for imaging an object part, And a forceps hole for treatment. When the insertion section 2 is inserted into the body cavity from the distal end section 3, the bending section 4 bends in accordance with the lumen of the body cavity so that the insertion section 2 can be quickly inserted.
[0024]
An operation section 5 is provided at the base end of the insertion section 2. The operation section 5 has an angle lever 6 for remotely bending operation via a bending operation wire of the bending section 4 and a not-shown angle lever 6. It has a treatment instrument insertion hole and the like. A flexible cord 8 containing a light guide cable, a signal cable, and the like is connected and extended from a proximal end side of the operation unit 5. A connector 7 is connected to a proximal end of the flexible cord 8. The connector 7 is connected to a light source device (not shown) to project illumination light onto the light guide cable, or is connected to a video processor device to connect a solid-state imaging device provided at the distal end portion 3 via a signal cable. , And drive control.
[0025]
The internal configuration of the distal end portion 3 of the insertion section 2 of the endoscope main body 1 will be described with reference to FIG. FIG. 2 is a sectional view of the distal end portion 3 cut in the axial direction.
[0026]
At the forefront of the imaging unit 9 at the distal end portion 3, a distal end cover glass 11 is airtightly held by a metal frame 12. The tip cover glass 11 is formed in a substantially circular shape, and the outer periphery of the circular shape is held by a substantially cylindrical metal frame 12. The joint between the front cover glass 11 and the metal frame 12 is hermetically joined by brazing (hard brazing or soft brazing). In addition, since the outer surface of the tip cover glass 11 exposed to the outside is exposed to high-pressure and high-temperature steam during autoclave sterilization, sapphire having the ability to withstand autoclave sterilization is desirable.
[0027]
The inner peripheral surface on the base end side of the metal frame 12 is air-tightly joined to a connection pipe 13 formed in a substantially cylindrical shape. The hermetic connection between the metal frame 12 and the connection pipe 13 is laser-welded using a YAG laser which is easy to control at low power.
[0028]
On the inner peripheral surface of the connection pipe 13, a substantially cylindrical insulating frame 14 made of a material having electrical insulation such as alumina ceramics and formed at a high density so that high-pressure high-temperature steam cannot enter is air-tightly joined. Are located. A substantially cylindrical connection pipe 15 is hermetically joined to an outer peripheral surface of a base end of the insulating frame 14.
[0029]
An objective optical system 18 including a plurality of lenses is provided in an inner peripheral space between the inner surface of the tip cover glass 11 and the metal frame 12 and the insulating frame 14 joined by the connection pipe 13.
[0030]
The hermetic joining between the outer peripheral surfaces of both ends of the insulating frame 14 and the connection pipes 13 and 15 is joined by brazing (hard brazing or soft brazing) and is unitized in advance.
[0031]
The outer periphery of the connection pipe 15 is hermetically joined to a substantially cylindrical cover glass frame 16 by laser welding. The cover glass frame 16 hermetically joins and holds the outer periphery of the cover glass 17 formed by the optical member. The cover glass 17 and the cover glass frame 16 are hermetically joined by brazing (hard brazing or soft brazing).
[0032]
In addition, metallized (metallic) is provided at the joint between the tip cover glass 11 and the metal frame 12, the joint between the cover glass 17 and the cover glass frame 16, and the joint between the insulating frame 14 and the connection pipes 13 and 15. Film formation) and can be brazed. Metallization is performed by molybdenum manganese baking and then plating nickel, or chromium and nickel are formed by deposition using a vacuum process such as evaporation or sputtering. It has a structure that is resistant to heat and stress during brazing and autoclave sterilization.
[0033]
Further, it is desirable that the metal frame 12, the connection pipes 13, 15 and the cover glass frame 16 to be welded by the YAG laser are made of stainless steel such as SUS304.
[0034]
A solid-state imaging device 19 is provided on the rear surface side of the cover glass 17, and the solid-state imaging device 19 is electrically connected to a cable 21 via a substrate 20. The board 20 and the cable 21 are sealed and fixed in a cable frame 23 with an adhesive.
[0035]
The outer peripheral surfaces of the cover glass frame 16 and the cable frame 23 are hermetically joined to the inner peripheral surface of the shield frame 22 by YAG laser welding.
[0036]
That is, the imaging unit 10 including the solid-state imaging device 19, the substrate 20, and the cable 21 is formed in a space formed by hermetically joining the outer peripheral surfaces of the cover glass frame 16 and the cable frame 23 with the shield frame 22. It forms a high level watertight space where water and water vapor do not enter.
[0037]
Next, the configuration of the storage portion of the imaging unit 10 of the imaging unit 9 in which the individual imaging device 19 is installed will be described in detail with reference to FIG.
[0038]
The imaging surface of the solid-state imaging device 19 is bonded and fixed to the rear surface of the cover glass 17 via an aperture plate 24. The aperture plate 24 is formed by using a thin plate such as a phosphor bronze plate having the same shape as the shape of the rear surface of the cover glass 17 and forming a substantially square opening at the center thereof. The shape is substantially the same as the imaging range of the subject part image of the element 19.
[0039]
In other words, the image light of the subject site transmitted through the openings of the cover glass 17 and the aperture plate 24 is projected into the imaging range of the imaging surface of the solid-state imaging device 19.
[0040]
A reinforcing member 25 is attached to the back surface of the solid-state imaging device 19, and the reinforcing member 25 is bonded and fixed to the cover glass frame 16.
[0041]
As shown in FIG. 4, the reinforcing member 25 is provided with a pair of substantially arc-shaped openings 28, 28 symmetrically in the axial direction from the bottom surface 25a of the bottomed cylindrical member. The lead wire of the solid-state imaging device 19 can be inserted into the. In other words, the solid-state imaging device 19 is mounted such that the bottom surface 25a of the reinforcing member 25 is in contact with the rear end surface, and the lead wires of the mounted solid-state imaging device 19 are drawn out from the openings 28, 28 and connected to the substrate 20. .
[0042]
The bottom surface 25a of the reinforcing member 25 and the rear end surface of the solid-state imaging device 19 are held and fixed by an adhesive.
[0043]
When electrical insulation between the rear end surface of the solid-state imaging device 19 and the bottom surface 25a of the reinforcing member 25 is required, it is formed of a polyimide or the like having electrical insulation and heat resistance. An insulating sheet (not shown) may be interposed between the bottom surface 25 a of the reinforcing member 25 and the rear end surface of the solid-state imaging device 19. The shape of the reinforcing member 25 may be any shape as long as it can reinforce and hold and fix the solid-state imaging device 19, such as a shape similar to the outer shape of the solid-state imaging device 19 or a U-shape.
[0044]
The cable frame 23 has a substantially cylindrical shape, a cable 21 is inserted therein, and a substrate 20 to which each signal line inside the cable 21 is electrically soldered and connected is fixed and fixed with an adhesive. .
[0045]
A substantially cylindrical separation wall 26 is disposed on the inner periphery of the cable frame 23 to which the substrate 20 is disposed and to which the shield frame 22 is laser-bonded, so that the space between the cable frame 23 and the separation wall 26 is provided. Is formed with a space portion 27. The substrate 20 to which the cable 21 is connected is fixed and fixed to the inner peripheral side of the separation wall 26 with an adhesive.
[0046]
That is, the cable frame 23 houses the substrate 20 to which the lead wires of the solid-state imaging device 19 are electrically connected on the inner periphery and the cable 21 electrically connected to the substrate 20, and solidifies and fixes the cable with an adhesive. A separation wall 26 is provided via a space 27 on the inner peripheral surface of the cable frame 23 at a portion where the shield frame 22 on the outer periphery of the cable frame 23 is laser-welded.
[0047]
As the adhesive for sealing and fixing the substrate 20 and the cable 21 in the separation wall 26 of the cable frame 23, a polymer adhesive member is used.
[0048]
Since the cable frame 23 has the separation wall 26 in this manner, when the shield frame 22 is mounted on the cable frame 23 and laser-welded at the laser welded portion 22b having the separation wall 26 in the drawing, heat generated during the laser welding is obtained. Due to the space portion 27 and the separation wall 26, it is difficult to transmit to the polymer adhesive member that fixes and fixes the board 20 and the cable 21, and the polymer adhesive member does not dissolve.
[0049]
The hermetic connection between the shield frame 22 and the cover glass frame 16 is laser-welded at a laser weld 22a.
[0050]
On the other hand, a lens 30 is provided on the front side of the cover glass 17 airtightly fixed to the cover glass member 16. The lens 30 is held and fixed by a lens centering member 29 on the front side of a cover glass 17 air-tightly fixed to the cover glass frame 16.
[0051]
The lens centering member 29 is provided with a thin portion 29a interposed between the cover glass 17 and the lens 30 so that the cover glass 17 and the lens 30 do not come into surface contact with the thin portion 29a. Is configured.
[0052]
Further, a spacing member 31 and a diaphragm 32 are provided on the side of the front end of the lens centering member 29 where the image light of the subject site is taken in.
[0053]
The spacing member 31 sets the distance between the lens 30 and the stop 32. The stop 32 serves as an object part image when projecting the object part image captured by the objective optical system 18 onto the lens 30. It has an opening for setting the light projection range.
[0054]
The procedure for assembling the imaging unit 10 to the imaging unit 9 will be described. First, the aperture plate 24 is bonded and fixed to the imaging surface of the solid-state imaging device 19. When the diaphragm plate 24 is bonded and fixed to the imaging surface of the solid-state imaging device 19, the positional relationship between the imaging range of the solid-state imaging device 19 and the opening of the diaphragm plate 24 is adjusted.
[0055]
Next, an aperture plate 24 bonded and fixed to the solid-state imaging device 19 is positioned and bonded and fixed to the rear surface side of the cover glass 17 airtightly fixed to the cover glass frame 16, and is fixed to the back surface of the solid-state imaging device 19. The reinforcing member 25 is assembled. The reinforcing member 25 is bonded and fixed to the outer periphery of the cover glass frame 16.
[0056]
The lead wires of the solid-state imaging device 19 reinforced by the reinforcing member 25 and fixed to the rear surface side of the cover glass 17 via the aperture plate 24 are electrically connected by soldering to the substrate 20 to which the cable 21 is connected. Let it.
[0057]
A polymer adhesive is injected and sealed into the inner periphery of the separation wall 26 of the cable frame 23 to solidify and fix the periphery of the substrate 20 to which the lead wires of the solid-state imaging device 19 and the cable 21 are connected.
[0058]
After the solid-state imaging device 19, the cover glass 17, the substrate 20, and the cable 21 are installed and airtightly fixed in the internal space between the cover glass frame 16 and the cable frame 23 in this manner, the connection between the cover glass frame 16 and the cable frame 23 is performed. The shield frame 22 is fitted around the outer periphery, the cover glass frame 16 and the shield frame 22 are laser-welded at the laser weld 22a, and the cable frame 23 and the shield frame 22 are laser-welded at the laser weld 22b.
[0059]
Conventionally, at the time of this laser welding, the vicinity of the laser welded portions 22a and 22b is exposed to a high temperature, and in particular, the substrate 20 and the cable 21 are sealed and fixed inside the cable frame 23 with an adhesive. The molecular adhesive is melted by laser welding heat, the melted adhesive leaks from a hole generated by welding, the solder for electrically connecting the substrate 20 and the cable 21 is melted, or the cover is melted. There is a possibility that the glass 17 and the cover glass frame 16 may be brazed and melted in an airtight manner.
[0060]
However, as in the present invention, the cable frame 23 and the shield frame 22 are laser-welded. In particular, the cable frame 23 of the laser welding portion 22b is provided with the separation wall 26, and the gap between the separation wall 26 and the cable frame 23 is provided. The formation of the space portion 27 makes it difficult for the laser welding heat to be transmitted to the sealing polymer adhesive inside the cable frame 23, and the sealing adhesive between the substrate 20 and the cable 21, solder, and the like. Does not dissolve.
[0061]
Therefore, the cover glass frame 16, the cable frame 23, and the shield frame 22 are formed, and airtightness of a space in which the solid-state imaging device 19 is mainly installed can be secured.
[0062]
In addition, the endoscope having such a configuration allows the solid-state imaging device 19 attached to the cover glass frame 16 to be deformed even when the cover glass frame 16 is distorted due to thermal expansion and contraction due to high-pressure high-temperature steam during autoclave sterilization. , The cover glass 17 and the lens 30 are provided with a gap formed by the diaphragm plate 24 and the thin portion 29a of the lens centering member 29, that is, between the solid-state imaging device 19 and the cover glass 17, or There is no adhesive surface between the glass 17 and the lens 30, so that the image is not degraded due to the peeling of the adhesive surface due to distortion.
[0063]
Further, a space for installing the imaging unit 10 formed by the cover glass frame 16, the cable frame 23, and the shield frame 22, and an objective optical system formed by the metal frame 12, the connection pipes 13 and 15, and the insulating frame 14. The space where the 18 is installed is joined by brazing or laser welding, so that the intrusion of high-pressure and high-temperature steam can be completely prevented, and the deterioration of the lens, the peeling of the coating of the lens, and the adhesion of water droplets are hardly generated. A good view can be secured.
[0064]
Next, a second embodiment of the imaging unit of the endoscope apparatus of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view illustrating a configuration of an imaging unit used in the endoscope apparatus according to the second embodiment of the present invention. 1 to 4 are denoted by the same reference numerals, and detailed description is omitted.
[0065]
In the imaging unit 33 of the second embodiment provided at the distal end portion 3 of the endoscope apparatus of the present invention, the outer peripheral surface of the cover glass 17 is brazed and air-tightly joined to a cylindrical cover glass frame 34, and this cover glass frame is attached. A cylindrical portion 34a extends rearward (to the right in the drawing) from the joint with the cover glass 17, and has a cylindrical shape such that a space 37 is formed inside the cylindrical portion 34a. A first separation wall 35 is provided, and a solid-state imaging device 19 is installed in a central portion of the inside of the first separation wall 35. An adhesive is sealed and fixed between the first separation wall 35 and the solid-state imaging device 19.
[0066]
The outer diameter of a portion of the cover glass frame 34 extending forward (to the left in the drawing) from the joint with the cover glass 17 is formed smaller than the outer diameter of the cylindrical portion 34a.
[0067]
A shield frame 36 is laser-welded to the outer periphery of the cylindrical portion 34a of the cover glass frame 34 and the cable frame 23 at laser-welded portions 36a and 36b, respectively. A first separation wall 35 is provided on the inner periphery of the cover glass frame 34 facing the laser welded portion 36a. The first separation wall 35 has a cylindrical shape substantially the same shape as the cover glass frame 34, and a space 37 is provided between the first separation wall 35 and the cover glass frame 34.
[0068]
In addition, a second separation wall 38 is provided on the inner periphery of the cable frame 23 facing the laser welded portion 36b. A concave portion 39 is provided at a central portion in the axial direction of the outer peripheral surface of the second separation wall 38. That is, both end portions in the axial direction of the outer peripheral surface of the second separation wall 38 are in contact with the inner peripheral surface of the cable frame 23, and the concave portion 39 in the center portion is a space between the inner peripheral surface of the cable frame 23. The concave portion 39 forming this space is provided at a position facing the laser welded portion 36b.
[0069]
In the imaging unit 33 having such a configuration, the solid-state imaging device 19 is positioned and fixed to the cover glass 17 which is air-tightly joined to the cover glass frame 34 via the aperture plate 24, and the lead wire of the solid-state imaging device 19 connects the substrate 20. The solid-state imaging device 19, the substrate 20, and the cable 21 are bonded to the inner peripheral portion of the first separation wall 35 of the cover glass frame 34 and the second separation wall 38 of the cable frame 23 while the cable 21 is connected via the cable 21. It is sealed and fixed with an agent. After the cover glass 17, the solid-state imaging device 19, the substrate 20, and the shield frame 36 are mounted on the outer periphery of the cable frame 23 in which the cover glass 17 and the cable 21 are provided, the cover glass is formed by the laser welds 36a and 36b. The frame 34, the cable frame 23 and the shield frame 36 are laser-welded.
[0070]
In this laser welding, the heat generated in the laser welding portion 36a is suppressed from being transmitted by the space 37 formed by the space portion 37 and the first separation wall 35, and the heat generated in the laser welding portion 36b is Transmission is suppressed by the space formed by the second separation wall 38.
[0071]
Accordingly, the imaging unit 33 can prevent the heat of welding when the shield frame 36 is laser-welded from being transmitted to the solid-state imaging device 19, which is an electronic component housed in the cover glass frame 34 and the cable frame 23, and In addition, heat transfer that melts the sealed adhesive for solidifying and fixing the substrate 20 and the cable 21 connected to the solid-state imaging device 19 can also be prevented. For this reason, the imaging unit 33 can be air-tightly joined and assembled, and can prevent the intrusion of high-pressure, high-temperature steam during autoclave sterilization.
[0072]
Next, a modification of the imaging unit of the endoscope apparatus according to the second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view illustrating a configuration of a modification of the second embodiment of the imaging unit used in the endoscope apparatus of the present invention. 1 to 5 are denoted by the same reference numerals, and detailed description is omitted.
[0073]
The imaging unit 33 ′ according to the modification of the second embodiment differs from the imaging unit 33 in FIG. 5 in that a heat insulating member is used instead of the second separation wall 38 provided on the inner peripheral surface of the cable frame 23. There is a difference in that the formed heat insulating wall 40 is provided.
[0074]
The heat insulating wall 40 is mounted on the entire inner peripheral surface of the cable frame 23, and insulates welding heat when the shield frame 36 mounted on the outer peripheral surface of the cable frame 23 is laser-welded from the laser welded portion 36b. The heat insulating wall 40 has heat insulating properties, and ceramics and zirconia, which are materials having low thermal conductivity, are suitable. Further, another material may be used as long as a similar effect can be obtained. Due to the heat insulating wall 40, the welding heat is not transmitted to the sealing adhesive which solidifies and fixes the substrate 20 and the cable 21, so that the adhesive does not melt. Although not shown in FIG. 5, the separating wall 35 may be used in place of the heat insulating wall.
[0075]
As a result, it is possible to prevent high-pressure, high-temperature steam from entering the inside of the imaging unit 33 'when the endoscope apparatus using the imaging unit 33' is subjected to autoclave sterilization.
[0076]
[Appendix]
According to the embodiment of the present invention described in detail above, the following configuration can be obtained.
[0077]
(Appendix 1)
A first frame for forming an airtight space;
A second frame for engaging with the first frame and forming an airtight space with the first frame;
A welded portion provided on the first frame or the second frame and welded to hermetically seal a gap between the first frame and the second frame;
A separation wall provided at a position corresponding to the welded portion in a space hermetically sealed by the first frame and the second frame, and separated from the welded portion;
An imaging unit provided at a position capable of imaging an object on the opposite side of the welded portion with respect to the separation wall in the airtightly sealed space,
A polymer adhesive member injected and solidified between the imaging unit and the separation wall,
An endoscope imaging apparatus comprising:
[0078]
(Appendix 2)
A first frame for forming an airtight space;
A second frame for engaging with the first frame and forming an airtight space with the first frame;
A welded portion provided on the first frame or the second frame and welded to hermetically seal a gap between the first frame and the second frame;
A separation wall formed of a heat insulating material and provided at a position corresponding to the welding portion in a space hermetically sealed by the first frame and the second frame;
An imaging unit provided at a position capable of imaging an object on the opposite side of the welded portion with respect to the separation wall in the airtightly sealed space,
A polymer adhesive member injected and solidified between the imaging unit and the separation wall,
An endoscope imaging apparatus comprising:
[0079]
(Appendix 3)
A first frame for forming an airtight space;
A second frame for engaging with the first frame and forming an airtight space with the first frame;
A welded portion provided on the first frame or the second frame and welded to hermetically seal a gap between the first frame and the second frame;
An imaging unit provided at a position capable of imaging a subject inside a space hermetically sealed by the first frame and the second frame;
A polymer adhesive member injected and solidified between the welding portion and the imaging unit,
A polymer adhesive member holding wall that is provided at a position separated from the welded portion and seals and holds the polymer adhesive member at a predetermined position separated from the welded portion,
An endoscope imaging apparatus comprising:
[0080]
(Appendix 4)
A first frame for forming an airtight space;
A second frame for engaging with the first frame and forming an airtight space with the first frame;
A welded portion provided on the first frame or the second frame and welded to hermetically seal a gap between the first frame and the second frame;
An imaging unit provided at a position capable of imaging a subject inside a space hermetically sealed by the first frame and the second frame;
A polymer material injected between the welding portion and the imaging unit,
A polymer adhesive member holding wall formed of a heat insulating member that is provided at a position separated from the welded portion and seals and holds the polymer adhesive member at a predetermined position separated from the welded portion,
An endoscope imaging apparatus comprising:
[0081]
(Appendix 5)
A first frame member made of a metal material and having a substantially cylindrical shape;
A second frame member that fits with the first member, houses the electronic component therein, and has a substantially cylindrical shape made of a metal material;
An imaging unit in which a fitting portion between the first frame member and the second frame member is hermetically joined by welding;
Heat blocking means provided inside a fitting portion between the first member and the second member;
An endoscope comprising:
[0082]
(Appendix 6)
6. The endoscope according to claim 5, wherein the heat blocking means is formed by an air layer.
[0083]
(Appendix 7)
A pipe member is provided between a fitting portion of the first frame member and the second frame member, and the electronic component, and a thermal cutoff means by an air layer is provided between the pipe member and the welding portion. 7. The endoscope according to supplementary note 6, wherein
[0084]
(Appendix 8)
8. The endoscope according to claim 7, wherein an adhesive is filled inside the pipe member.
[0085]
(Appendix 9)
9. The endoscope according to any one of Supplementary Notes 5 to 8, which is autoclavable.
[0086]
【The invention's effect】
In the endoscope imaging apparatus of the present invention, the welding heat when laser-welding the hermetic frame in which the imaging unit is sealed and fixed is fixed and fixed by the separation wall provided on the inner periphery of the hermetic frame. The transmission to the polymer adhesive is suppressed, and the airtight joining can be performed without dissolving the adhesive, and the airtightness that makes it impossible for high pressure and high temperature steam to enter during autoclave sterilization can be maintained. This has the effect of preventing the mounting distortion of the solid-state imaging device, cover glass, lens, and the like due to thermal expansion and contraction due to high-pressure steam.
[Brief description of the drawings]
FIG. 1 is an external view illustrating a schematic configuration of an endoscope apparatus according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating a configuration of a distal end portion of the endoscope device according to the first embodiment of the present invention.
FIG. 3 is a cross-sectional view illustrating a configuration of an imaging unit disposed at a distal end portion of the endoscope device according to the first embodiment of the present invention.
FIG. 4 is a perspective view showing a configuration of a reinforcing member for a solid-state imaging device used in the imaging unit of the endoscope apparatus according to the first embodiment of the present invention.
FIG. 5 is a cross-sectional view illustrating a configuration of an imaging unit used in an endoscope apparatus according to a second embodiment of the present invention.
FIG. 6 is a cross-sectional view illustrating a configuration of a modification of the second embodiment of the imaging unit used in the endoscope apparatus of the present invention.
[Explanation of symbols]
1. Endoscope body
2. Insertion part
3 ... tip
4: Bending part
5 Operation unit
7 Connector
8 ... Soft cord
10 ... Imaging unit
16 ... Cover glass frame
17 ... Cover glass
19 ... Solid-state image sensor
20 ... substrate
21 ... Cable
22 ... Shield frame
23 Cable frame

Claims (4)

A first frame for forming an airtight space;
A second frame for engaging with the first frame and forming an airtight space with the first frame;
A welded portion provided on the first frame or the second frame and welded to hermetically seal a gap between the first frame and the second frame;
A separation wall provided at a position corresponding to the welded portion in a space hermetically sealed by the first frame and the second frame, and separated from the welded portion;
An imaging unit provided at a position capable of imaging an object on the opposite side of the welded portion with respect to the separation wall in the airtightly sealed space,
A polymer adhesive member injected and solidified between the imaging unit and the separation wall,
An endoscope imaging apparatus comprising: A first frame for forming an airtight space;
A second frame for engaging with the first frame and forming an airtight space with the first frame;
A welded portion provided on the first frame or the second frame and welded to hermetically seal a gap between the first frame and the second frame;
A separation wall formed of a heat insulating member and provided at a position corresponding to the welding portion in a space hermetically sealed by the first frame and the second frame;
An imaging unit provided at a position capable of imaging an object on the opposite side of the welded portion with respect to the separation wall in the airtightly sealed space,
A polymer adhesive member injected and solidified between the imaging unit and the separation wall,
An endoscope imaging apparatus comprising: A first frame for forming an airtight space;
A second frame for engaging with the first frame and forming an airtight space with the first frame;
A welded portion provided on the first frame or the second frame and welded to hermetically seal a gap between the first frame and the second frame;
An imaging unit provided at a position capable of imaging a subject inside a space hermetically sealed by the first frame and the second frame;
A polymer adhesive member injected and solidified between the welding portion and the imaging unit,
A polymer adhesive member holding wall provided at a position separated from the welded portion and sealingly holding the polymer adhesive member at a predetermined position separated from the welded portion;
An endoscope imaging apparatus comprising: A first frame for forming an airtight space;
A second frame for engaging with the first frame and forming an airtight space with the first frame;
A welded portion provided on the first frame or the second frame and welded to hermetically seal a gap between the first frame and the second frame;
An imaging unit provided at a position capable of imaging a subject inside a space hermetically sealed by the first frame and the second frame;
A polymer adhesive member injected and solidified between the welding portion and the imaging unit,
A polymer adhesive member holding wall formed of a heat insulating member and sealingly holding the polymer adhesive member at a position corresponding to the welded portion,
An endoscope imaging apparatus comprising:

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