JP3938746B2 - Endoscope device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an endoscope apparatus that performs sterilization after use with an autoclave apparatus.
[0002]
[Prior art]
Conventionally, by inserting a long and thin insertion portion into a body cavity, the inside of a body cavity can be observed, and various medical treatments can be performed using a treatment instrument inserted into a treatment instrument channel as necessary. Endoscopes are widely used. Also in the industrial field, industrial endoscopes that can observe and inspect internal scratches and corrosion of boilers, turbines, engines, chemical plants, and the like are widely used.
[0003]
In particular, endoscopes used in the medical field are used to observe various organs by inserting an insertion portion into a body cavity and using a treatment instrument inserted into a treatment instrument channel of an endoscope. Take action. For this reason, when an endoscope or treatment tool that has been used once is reused for another patient, it is necessary to prevent infection between patients via the endoscope or treatment tool. Had to clean and disinfect.
[0004]
Gases such as ethylene oxide gas (EOG) and a disinfectant solution have been used for disinfecting and sterilizing these endoscopes and their accessories. However, as is well known, sterilization gases are extremely toxic, and there is a problem that the work process becomes complicated in order to ensure the safety of sterilization work. In addition, it takes time for aeration to remove gas adhering to the device after sterilization. For this reason, there was a problem that the device could not be used immediately after sterilization. Furthermore, there is a problem that the running cost becomes expensive. On the other hand, in the case of a disinfecting solution, management of the disinfecting agent solution is complicated, and there is a problem that it takes a lot of money to dispose of the disinfecting solution.
[0005]
Therefore, in recent years, autoclave sterilization (high-pressure steam sterilization), which can be used immediately after sterilization without complicated work and has a low running cost, is becoming a mainstream of disinfection sterilization processing of endoscope devices. This autoclave sterilization is also called general sterilization, and is evacuated before the sterilization process, sterilized in detail with high-temperature steam in a short time, and evacuated for drying after completion of the sterilization process. 1992 stipulates that the sterilization process exposes to about 2 atmospheres at 132 ° C. for 4 minutes.
[0006]
[Problems to be solved by the invention]
However, the EOG sterilization has a problem that the EOG used has an adverse effect on the environment. On the other hand, since the autoclave is sterilized with steam, it does not adversely affect the environment. However, since this autoclave is performed under high pressure, the endoscope has much higher airtightness than the normal airtightness under 1 atm or watertightness that is immersed in a conventional chemical solution to disinfect. Is required. In autoclave sterilization, in order to prevent the rupture of the outer tube of the curved portion during the vacuum process before the sterilization process, it is generally put into the autoclave sterilizer in a state where the endoscope is in communication with each other. . In this case, the autoclave-sterilized water vapor actively enters the endoscope.
[0007]
For example, assembling an endoscope imaging unit and an endoscope that reduces the size of the video unit shown in Japanese Patent Laid-Open No. 5-269081 and reduces the distal end of the insertion portion and improves the mechanical strength. In the method, a frame body that protects the video unit is inserted between the front end main body portion and the video unit, and the inside of the frame body, between the frame body and the front end body, and between the frame body and the video unit by an adhesive. Although sealed and fixed, when autoclave sterilization is performed, a small amount of water vapor passes through the adhesion part, and internal objects such as an objective lens and a solid-state image sensor chip constituting the video unit are exposed to water vapor and deteriorate. There is a possibility that a problem or a problem that the adhesive provided in the optical path changes in quality and obstructs the field of view may occur.
[0008]
For this reason, in an endoscope that performs autoclave sterilization, in order to hermetically seal the inside of the imaging unit, the cover glass and the frame constituting the distal end side of the imaging unit are joined by soldering, brazing, or the like. At the time of the joining, the cover glass is disclosed on the outer peripheral surface of the cover glass by a four-layer metal coating made of Cr—Cu—Cu—Ni as shown in JP-A-6-209898, or in JP-A-9-265046. The cover glass was joined to the frame body by providing a coating surface such as Ni vapor deposition film + Ni plating.
[0009]
However, Cr constituting the lowermost layer of the four-layer metal coating disclosed in JP-A-6-209898 and Ni deposited film constituting the lower layer of plating disclosed in JP-A-9-265046, Very strong gloss. For this reason, the light incident on the cover glass is reflected on the Cr layer or the Ni vapor deposition film applied to the outer peripheral surface, which causes flare. And in order to prevent generation | occurrence | production of this flare, although the diameter dimension of the cover glass was set large, there existed a malfunction that the front-end | tip of an insertion part became large diameter by this.
[0010]
The present invention has been made in view of the above circumstances, and high-temperature water vapor penetrates through the gap between the objective optical system and the frame body constituting the imaging apparatus and the gap between the package of the imaging element and the frame body, resulting in poor visual field. This is an endoscope compatible with autoclave sterilization that prevents the deterioration of observation performance such as the outer peripheral surface of the optical member located at the cutting edge and prevents the occurrence of flare due to reflection of incident light. It aims to provide a mirror device.
[0011]
[Means for Solving the Problems]
An endoscope apparatus according to the present invention is an endoscope apparatus having an observation optical system composed of a plurality of optical members and a frame body that houses the optical members. Located in Made of sapphire or hard glass Optical member And the engagement part between the frame and Forming the coating surface The coating surface of the optical member is a bonding metal layer made of a metal that enables welding to the frame, and a layer formed on the outer peripheral surface of the optical member, and is incident on the optical member A low-reflection metal layer made of a material having a lower light reflectance than the bonding metal layer, and the outer peripheral surface of the optical member on which the low-reflection metal layer is formed is the optical member. After the surface treatment is performed so that the average roughness becomes 0.1 μm to 1 μm in order to reduce the reflectance of the light incident on the metal, the low reflection metal layer is formed on the outer peripheral surface. It is characterized by that.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1 to 7 relate to an embodiment of the present invention, FIG. 1 is a diagram illustrating an endoscope, FIG. 2 is a diagram illustrating a configuration of a distal end portion, and FIG. 3 is a view when the distal end portion is viewed from the front. 4 is a cross-sectional view showing the configuration of the light guide connector, FIG. 5 is an enlarged cross-sectional view of the image pickup apparatus, FIG. 6 is a cross-sectional view illustrating a joint portion between the cover glass and the frame, and FIG. FIG.
[0014]
The endoscope shown in FIG. 1 is an electronic endoscope 1 and has a structure in which a waterproof cap 10 is detachable.
[0015]
The electronic endoscope 1 is provided with an elongated and flexible insertion portion 2 and an operation switch connected to the proximal end side of the insertion portion 2 and used by an observer to perform various operations. The operation unit 3 and the universal cord 4 extending from the side of the operation unit 3 are mainly configured. The distal end portion 2a located on the distal end side of the insertion portion 2 incorporates a CCD, for example, which is a solid-state imaging device described later.
[0016]
A connector portion having a light guide connector 5a connected to a light source device (not shown) and a camera cable 5b (not shown) connected to a camera control unit (not shown) detachably attached to the end of the universal cord 4. 5 is provided.
[0017]
A vent hole 6 is provided on the inner peripheral side of the camera connector 5b to allow the outside and the inside of the endoscope 1 to communicate with each other to be in a vented state. Therefore, the waterproof cap 10 is detachably attached to the camera connector 5b. Then, by attaching the waterproof cap 10 to the camera connector 5b, the inside of the endoscope 1 is kept in a watertight state, and by removing the waterproof cap 10 from the camera connector 5b, the outside and inside of the endoscope 1 Becomes ventilated.
[0018]
The insertion portion 2 is configured by connecting a hard distal end portion 2a, a bendable bending portion 2b, and a flexible flexible tube 2c in order from the distal end side.
[0019]
The operation section 3 is provided with a bending operation lever 3a for controlling the bending operation of the bending section 2b and a plurality of image switches 3b for performing image freezing, release, and the like.
[0020]
As shown in FIGS. 2 and 3, the distal end portion 2 a is disposed so as to surround a metal distal end portion main body 11, an imaging device 12 fixedly disposed on the distal end portion main body 11, and an outer periphery of the imaging device 12. The light guide fiber 13.
[0021]
By arranging the light guide fiber 13 so as to surround the outer periphery of the imaging device 12, the area of the distal end portion 2a is effectively used to the maximum to ensure the amount of illumination light.
[0022]
The light guide fiber 13 can obtain a wide illumination angle without disposing an illumination lens at the tip, and has a high numerical aperture (high NA), preferably NA of 0.7 or more. You are using fiber. By using the light guide fiber with NA of 0.7 or more, light distribution failure does not occur even with an endoscope having a viewing angle of 80 ° or more. When a light guide fiber of about NA 0.5 to NA 0.66 that is generally used is used in an endoscope having a viewing angle of 80 ° or more, a light distribution defect occurs.
[0023]
As shown in FIG. 4, a high NA lens 7 such as a convex lens is disposed on the end face of the light guide fiber 13 in the light guide connector 5a. As a result, the light incident angle of the light emitted from the lamp 8 to the light guide fiber 13 is increased. Then, the light emission angle from the light guide fiber 13, that is, the illumination angle is widened. The configuration in which the high NA lens 7 is provided is more effective as the numerical aperture of the light guide fiber 13 is larger.
[0024]
On the other hand, as shown in FIGS. 2 and 5, the imaging device 12 includes an objective lens group 14 configured by arranging optical lenses formed of a plurality of optical members serving as an objective optical system, and the objective lens group 14. The image pickup device 20 arranged at the image forming position, and a metal frame 17 which is an exterior component for holding the objective lens group 14 and the image pickup device 20.
[0025]
Reference numerals 15 and 16 denote a diaphragm and a spacing tube constituting the objective lens group 14, and reference numeral 18 denotes a cover glass formed of sapphire or hard glass located at the forefront of the objective lens group 14. Reference numeral 19 denotes a lens frame for fixing and holding the optical member constituting the objective lens group 14 on the inner peripheral surface with an adhesive.
[0026]
As shown in FIG. 5, the cover glass 18 is fixed to the inner peripheral surface of the frame body 17 in a sealed state. A coating surface 30 is provided on the outer peripheral surface of the cover glass 18 so as to enable bonding to the inner peripheral surface of the distal end portion of the frame body 17. The cover glass 18 provided with the coating surface 30 does not enter the gas from the joint surface between the cover glass 18 and the frame body 17 by soldering, for example, on the inner peripheral surface of the metal frame body 17. So that it is airtightly joined.
[0027]
Further, in this embodiment, brazing such as fusion welding and soldering or brazing, which is a kind of metal welding, is adopted as the airtight joining, but joining by various welding such as other metal welding can be adopted. .
[0028]
The types of welding include fusion welding such as laser welding and electron beam welding, pressure welding represented by resistance welding, brazing such as brazing and soldering, etc., and these joining methods can be hermetic. is there.
[0029]
In addition to metal welding, joining with molten glass and joining with an inorganic binder are joining means that can be joined in an airtight manner, and can naturally be employed. In other words, any joining means in which the main component of the joint is a metal, glass, ceramics, or a crystallizing substance can be employed as the hermetic joining means.
[0030]
Further, as shown in FIG. 6, the coating surface 30 provided on the outer peripheral surface of the cover glass 18 is a lowermost layer 31 formed by vapor deposition on the outer peripheral surface of the cover glass 18, that is, a chromium oxide layer constituting the base layer. The low reflection layer is made of (Cr2O3) and a nickel plating layer that is superimposed on the low reflection layer and forms the uppermost bonding layer 32. As a result, light rays that have entered the cover glass 18 and reached the low reflection layer deposited on the outer peripheral surface of the cover glass 18 are hardly reflected by the low reflection layer. The chromium oxide layer is a low-reflective material compared to the nickel plating layer.
[0031]
In addition, a chromium layer is provided as an intermediate layer 33 on an upper layer of the chromium oxide layer constituting the lowermost layer 31, and a gold layer is provided as a bonding layer 32 on the upper layer of the chromium layer, thereby forming the coating surface 30. The chrome layer further becomes a low reflection layer.
[0032]
In addition, when considering low reflection, the surface roughness of the outer peripheral surface of the cover glass 18 is polished to an average roughness (Ra) of 0.1 μm to 1 μm, or a maximum roughness (PV) of 2 μm to 5 μm. The surface treatment may be performed as described above.
[0033]
In addition, when the outer peripheral surface of the cover glass 18 is mirror-finished, not only is it easy to reflect, but the adhesion strength of the coating is reduced. On the other hand, if the surface roughness is too rough, it becomes difficult to remove foreign matter adhering to the surface, not only the adhesion strength of the coating is lowered, but also the wettability of the solder is lowered and airtight joining is possible. Since it becomes difficult, it is not preferable.
[0034]
On the other hand, as shown in FIG. 7, the image pickup device 20 includes a CCD chip 21, a glass lid 22 disposed on the front surface of the CCD chip 21, and a package 23 that fixes the CCD chip 21. A connection terminal 24 protrudes from the base end surface side of the CCD chip 21 through a through hole 23 a formed in the package 23.
[0035]
The glass lid 22 and the package 23 are integrally and airtightly joined by a molten glass 25. Further, the connection terminal 24 disposed in the through hole 23 of the package 23 is hermetically sealed by sealing molten glass 25 in a gap between the outer peripheral surface of the connection terminal 24 and the inner peripheral surface of the through hole 23a. And they are joined together. As a result, the chip arrangement space 20a in which the CCD chip 21 is arranged is configured as a hermetically sealed space.
[0036]
As shown in FIG. 5, the outer peripheral surface of the package 23 and the inner peripheral surface of the base end side of the frame body 17 are airtightly joined by metal welding such as brazing. As a result, the cover glass 18 constituting the objective lens group 14 is arranged on the front end side of the frame body 17, and the package 23 constituting the image pickup device 20 is joined on the rear end side to constitute the imaging device 12. The frame internal space 17a is configured as a hermetically sealed space.
[0037]
Since the package 23 is usually made of ceramic, the joint surface is preliminarily coated with a metal to enable hermetic sealing.
[0038]
As described above, the imaging apparatus is configured by the objective lens group, the imaging element, and the frame, and the cover glass constituting the objective lens group is hermetically bonded to the front end of the frame, and the imaging element is provided on the rear end side. By configuring the imaging device by airtightly bonding the packages to be configured, the internal space of the frame body in which the cover glass and the package are fixed can be configured as a hermetically sealed space.
[0039]
In addition, the glass lid and the package constituting the imaging element are hermetically and integrally joined with molten glass, and the gap between the outer peripheral surface of the connection terminal disposed in the through hole of the package and the inner peripheral surface of the through hole. By sealing molten glass into the gap and airtightly and integrally joining, the chip placement space where the CCD chip is placed can be configured as an airtightly sealed space.
[0040]
Furthermore, the coating surface provided on the outer peripheral surface of the cover glass is composed of a low-reflection layer that forms the lowermost layer side and a bonding layer that forms the uppermost layer side. Airtight joining that prevents gas from entering from the joint surface with the inner peripheral surface of the body can be made possible, and light incident on the cover glass is reflected on the coating surface to prevent flare from occurring. be able to.
[0041]
As a result, the internal space of the frame body from the objective optical system located on the distal end side of the frame body to the package constituting the imaging device located on the proximal end side of the frame body and the chip placement space where the CCD chip is placed are airtight. Due to the sealed space, it is possible to prevent the occurrence of poor field of view due to clouding of the visual field caused by water vapor entering the frame body or the chip arrangement space when the autoclave sterilization is performed, and the trouble of the solid-state imaging device.
[0042]
Further, the possibility of flare caused by light reflected at the lowermost layer of the coating surface can be greatly reduced, and the outer diameter of the cover glass can be reduced.
[0043]
In the present embodiment, the optical member located at the forefront of the objective lens group 14 is the cover glass 18, but the objective lens may be located at the forefront.
[0044]
Further, although the uppermost bonding layer 32 is a nickel plating layer, the bonding layer 32 is not limited to the nickel plating layer, and may be any metal or alloy plating layer having good solderability such as gold plating.
[0045]
Further, the low reflection layer that constitutes the lowermost layer 31 of the coating surface 30 formed on the cover glass 18 and prevents the reflection of light is not limited to the chromium oxide layer, but molybdenum having an effect of preventing flare ( Compared to solder bonding layers such as nickel plating layer and gold plating layer such as Mo) -manganese (Mn) layer, non-transparent white ceramic coating layer mainly composed of silica and black ceramic coating layer, etc. Thus, any low reflection coating may be used.
[0046]
In particular, the ceramic coating has no metallic luster and is highly effective in preventing flare. And the coating surface 30 given to the outer peripheral surface of the said cover glass 18 is comprised with the lowest layer which is a low reflection layer which consists of molybdenum (Mo) -manganese (Mn), and the joining layer 32 which consists of a nickel plating layer. Thus, the adhesion of the coating surface 30 to the cover glass 18 is improved.
[0047]
Further, for the purpose of improving the adhesion of the coating surface 30 to the cover glass 18 between the low reflection layer made of a chromium oxide layer or the like and the bonding layer 32 made of nickel plating or the like, for example, chromium (Cr), copper ( An intermediate layer such as Cu) may be provided.
[0048]
Furthermore, the structure which directly provides the plating layer which can be welded with a low reflective material to the outer peripheral surface of the cover glass 18 may be sufficient.
[0049]
Further, in order to improve the solder bonding property between the cover glass 18 and the frame body 17, the frame body 17 may be preliminarily plated with nickel plating or the like. Further, the joining method is not limited to joining by soldering, but may be joined by welding means such as brazing, fusion welding, or pressure welding. For example, there are brazing and laser welding.
[0050]
With reference to FIG.8 and FIG.9, the other structure of the coating surface formed in a cover glass is demonstrated.
[0051]
As shown in FIGS. 8 and 9, in this embodiment, the low reflection layer constituting the lowermost layer 31 of the coating surface 30 formed on the cover glass 18 is not only the outer peripheral surface of the cover glass 18 but also the cover glass 18. The base end side surface is also formed in a donut shape, and has a function as a mask for beam stop. As the low reflection layer of the lowermost layer 31, the above-described vapor deposition of the chromium oxide layer is particularly suitable.
[0052]
In this way, by providing the low-reflective layer formed to prevent flare to have the role of a light-reducing mask, there is no need to prepare a separate light-reducing mask member, so the number of parts can be reduced. Cost reduction can be achieved.
[0053]
Another configuration example of the imaging apparatus will be described with reference to FIGS.
As shown in FIG. 10, in the imaging device 12 a of this embodiment, instead of arranging and bonding the package 23 on the inner peripheral surface of the frame body 17, the front end side surface of the package 23 is used as the base end surface of the frame body 17. Arranged and joined. As a result, the inner space of the frame body is configured as a hermetically sealed space. Other configurations, operations, and effects are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.
[0054]
As shown in FIG. 11, in the imaging device 12 b of the present embodiment, the lens frame 19 and the frame body 17 are integrally configured as a frame member 26 instead of being configured as separate members, and the internal space of the frame member 26 is configured. Is configured as a hermetically sealed space. In this way, the number of parts is reduced to reduce costs. Other configurations, operations, and effects are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.
[0055]
As shown in FIG. 12, in the imaging device 12c of this embodiment, a plurality of optical members constituting the objective lens group 14 are divided into an objective optical frame 27 that is a first frame and an objective imaging element that is a second frame. The frame 28 is divided and fixed separately. The objective optical frame 27 and the objective imaging element frame 28 are relatively movable in the optical axis direction.
[0056]
For this reason, after adjusting the relative position of the objective optical frame 27 and the objective imaging element frame 28 in the optical axis direction to adjust the position of the imaging element 20 with respect to the objective lens group 14, that is, focusing, the objective optics The frame 27 and the objective imaging element frame 28 are hermetically joined, and the internal space formed by the objective optical frame 27 and the objective imaging element frame 28 is configured as a hermetically sealed space. As a result, an imaging apparatus with an optimum focus adjustment state is provided. Other configurations, operations, and effects are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.
[0057]
In addition, in embodiment mentioned above, although joining to the frame of the cover glass contained in the objective lens group which comprises the imaging device of the electronic endoscope provided with the image pick-up device is disclosed, it is not restricted to an electronic endoscope. Bonding the frame to the objective lens or cover glass of a fiberscope with an image guide fiber that is a bundle of optical fiber bundles arranged behind the objective lens group and an external camera connected to the eyepiece of this fiberscope It may be.
[0058]
For example, as shown in FIG. 14, the eyepiece 60 includes an eyepiece unit 61 and an eyepiece 62, and the eyepiece 60 is detachable from the endoscope body 70.
[0059]
The eyepiece unit 61 includes an eyepiece lens group 63 composed of a plurality of lenses, a metal eyepiece lens frame 64 that is an exterior part in which the eyepiece lens group 63 is disposed in an inner hole, and sapphire that is an exterior part. The eyepiece first cover glass 65 and the eyepiece second cover glass 66 are made of. The eyepiece lens frame 64 and the two cover glasses 65 and 66 are subjected to the above-described processing and are airtightly joined with solder.
[0060]
That is, the internal space in which the eyepiece lens group 63 of the eyepiece unit 61 is disposed is hermetically sealed by the eyepiece lens frame 64, the eyepiece first cover glass 65, and the eyepiece second cover glass 66.
[0061]
In addition, the metal coat applied to the outer peripheral surfaces of the two cover glasses 65 and 66 has a lower reflection layer as a lowermost layer in order to prevent flare. Specifically, a chromium oxide layer is provided in the lowest layer, and a chromium layer is provided thereon. Further, the surface roughness of the side peripheral surfaces of the cover glasses 65 and 66 is polished to an average surface roughness (Ra) of 0.1 μm to 1 μm, or a maximum roughness (PV) of 2 μm to 5 μm, and the metal coat Is applied to the surface that has been surface-treated in this way, a further low reflection surface can be obtained.
[0062]
Reference numeral 71 denotes an image guide fiber, reference numeral 72 denotes an image guide fiber frame covering the image guide fiber, reference numeral 73 denotes a cover glass disposed at the end of the image guide fiber, and reference numeral 74 denotes the image guide fiber. A fiber holding member for holding a guide fiber frame and the cover glass.
[0063]
Moreover, as shown in FIG. 13, the structure etc. which arrange | position the cover glass 29 to the front end surface of the said light guide fiber 13 may be sufficient.
[0064]
The configuration of the bending portion 2b will be described with reference to FIG.
As shown in the figure, the bending portion 2 b is configured by sequentially connecting adjacent bending pieces 41, 42,... The outer periphery of these connecting bending pieces 41, 42,... Is covered with a blade 52 braided with, for example, a stainless steel thin wire, and the outer periphery of this blade 52 is, for example, a curved rubber 53 formed of fluorine rubber or EPT. Is covered.
[0065]
The end portion of the blade 52 is fixed to the leading end bending piece 41 and the trailing end bending piece 46 located at the most distal end by solder or the like, respectively, and the end portion of the bending rubber 53 is the tip end main body 11. And it is being fixed to the flexible tube structural part 54, respectively. Reference numeral 55 denotes a bending operation wire, and reference numeral 56 denotes a wire hook through which the bending operation wire 55 is inserted.
[0066]
The inner diameter dimension of the distal end portion of the curved rubber 53 is d1, and the inner diameter dimension of the proximal end portion is d2. Further, the outer diameter of the distal end body 11 including the blade 52 on which the distal end portion of the curved rubber 53 is covered is D1, and the flexible tube constituting portion 54 including the blade 52 on which the proximal end portion of the curved rubber 53 is covered. The outer diameter is D2. At this time, between the inner diameters d1 and d2 and the outer dimensions D1 and D2,
The relations d1 <D1 and d2 <D2 are established.
[0067]
That is, the inner diameter dimension of the distal end portion of the curved rubber 53 is set smaller than the outer dimension dimension of the distal end portion main body 11, and the inner diameter dimension of the proximal end portion of the curved rubber 53 is set smaller than the outer dimension dimension of the flexible tube constituting portion 54. . As a result, the end portion of the curved rubber 53 is covered and fixed in a watertight manner so as to fasten the distal end portion main body 11 and the flexible tube constituting portion 54.
[0068]
Thus, the outer dimension of the distal end body is set larger than the inner diameter dimension of the distal end portion of the curved rubber, and the outer dimension of the flexible tube component is set larger than the inner diameter dimension of the proximal end portion of the curved rubber. Thereby, the water tightness in the bending portion can be ensured by covering the inner peripheral surface of the curved rubber in a state of being in close contact with the outer peripheral surface of the tip body and the flexible tube constituting portion.
[0069]
In addition, while providing the convex part 57 in the inner surface of the edge part which covers the front-end | tip part main body 11 and the flexible tube structure part 54 of the said curved rubber 53, as shown in FIG. 16, the recessed part 58 by which the said convex part 57 is arrange | positioned is provided. It is formed on the outer peripheral surface of the bending pieces 41 and 46. As a result, the convex portion 57 is engaged and arranged in the concave portion 58, and the water tightness in the curved portion can be ensured more reliably.
[0070]
It should be noted that the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the invention.
[0071]
[Appendix]
According to the embodiment of the present invention as described above in detail, the following configuration can be obtained.
[0072]
(1) In an endoscope apparatus having an observation optical system constituted by a plurality of optical members and a frame body that houses the optical members therein,
Forming a coating surface having a low reflection layer constituting the lowermost layer and a bonding layer constituting the uppermost layer on at least the outer peripheral surface of the optical member;
An endoscope apparatus in which the optical member is hermetically joined to the frame.
[0073]
(2) A solid-state imaging device that is arranged at an imaging position of the objective optical system and includes a chip that converts an optical image formed on the imaging surface into an image signal and a package that fixes the chip is used as the frame. When configuring the imaging device in one unit,
A coating surface having at least a low reflection layer constituting the lowermost layer and a bonding layer constituting the uppermost layer is formed on the outer peripheral surface of the optical member located at the forefront of the objective optical system. The endoscope apparatus according to appendix 1, wherein the package is hermetically joined to the frame while the package is hermetically joined to the frame.
[0074]
(3) The endoscope apparatus according to appendix 2, wherein the inner space of the frame is hermetically sealed.
[0075]
(4) The material of the exterior component constituting the imaging device is one or more materials selected from metal, ceramic, glass, and sapphire,
The endoscope apparatus according to appendix 2, wherein a method of joining the exterior parts is selected from metal welding or joining by molten glass.
[0076]
(5) The endoscope apparatus according to appendix 4, wherein the metal welding is fusion welding, brazing welding, or pressure welding.
[0077]
(6) The endoscope apparatus according to appendix 5, wherein the fusion welding is laser welding.
[0078]
(7) The endoscope apparatus according to appendix 5, wherein the brazing is brazing or soldering.
[0079]
(8) The endoscope apparatus according to appendix 2, wherein the inside of the solid-state imaging device is sealed.
[0080]
(9) The endoscope apparatus according to appendix 8, wherein the inside of the solid-state imaging device is hermetically sealed.
[0081]
(10) The material of the exterior component constituting the solid-state imaging device is one or more materials selected from metal, ceramic, glass, and sapphire,
The endoscope apparatus according to appendix 9, wherein a method of joining the exterior parts is selected from metal welding or welding by welding glass.
[0082]
(11) The endoscope apparatus according to appendix 10, wherein the metal welding is fusion welding, brazing welding, or pressure welding.
[0083]
(12) The endoscope apparatus according to appendix 11, wherein the fusion welding is laser welding.
[0084]
(13) The endoscope apparatus according to appendix 11, wherein the brazing is brazing or soldering. (14) The endoscope apparatus according to appendix 1, wherein the same material as that of the low reflection layer is formed by vapor-depositing a diaphragm mask on an optical member.
[0085]
(15) The endoscope apparatus according to appendix 1, wherein the low reflection layer is a chromium oxide layer.
[0086]
(16) The endoscope apparatus according to appendix 1, wherein the low reflection layer is composed of chromium oxide constituting the lowermost layer and chromium constituting the upper layer.
[0087]
(17) The endoscope apparatus according to appendix 1, wherein the low reflection layer is a molybdenum-manganese layer.
[0088]
(18) The endoscope apparatus according to appendix * 1, wherein the low reflection layer is a non-transparent ceramic coating layer.
[0089]
(19) The surface roughness of the outer peripheral surface of the optical member on which the low reflection layer is provided is in the range of 0.1 μm to 1 μm in terms of average roughness (Ra), or in the range of 2 μm to 5 μm in terms of maximum height (PV). The endoscope apparatus according to appendix 1, which has been processed.
[0090]
(20) The endoscope apparatus according to appendix 1, wherein the bonding layer is a metal or alloy plating layer.
[0091]
(21) The endoscope apparatus according to appendix 20, wherein the alloy plating layer is a nickel plating layer.
[0092]
(22) The endoscope apparatus according to appendix 20, wherein the alloy plating layer is a gold plating layer.
[0093]
(23) The endoscope apparatus according to appendix 1, wherein the airtight joining is performed by welding.
[0094]
(24) The endoscope apparatus according to appendix 23, wherein the welding is brazing.
[0095]
(25) The endoscope apparatus according to appendix 24, wherein the brazing is soldering.
[0096]
(26) The endoscope apparatus according to appendix 24, wherein the brazing is brazing.
[0097]
(27) The endoscope apparatus according to appendix 23, wherein the welding is fusion welding.
[0098]
(28) The endoscope apparatus according to appendix 27, wherein the fusion welding is laser welding.
[0099]
(29) The endoscope apparatus according to appendix 23, wherein the welding is pressure welding.
[0100]
(30) The endoscope apparatus according to appendix 1, wherein the optical member is formed of sapphire.
[0101]
(31) The endoscope apparatus according to appendix 1, wherein the optical member is an objective lens.
[0102]
(32) The endoscope apparatus according to appendix 1, wherein the optical member is a cover glass.
[0103]
(33) In an endoscope apparatus having a joint portion between an optical member and a frame, and forming a coating surface that enables welding to the frame on the outer peripheral surface of the optical member.
An endoscope apparatus in which the coating surface is formed of a low reflective metal or alloy plating layer.
[0104]
(34) The endoscope apparatus according to appendix 33, wherein the coating surface includes a molybdenum-manganese layer and a nickel plating layer.
[0105]
(35) Invasion of water vapor under high-temperature and high-pressure water vapor at least during autoclave sterilization is performed at least in the space enclosed by the optical member provided at the tip of the objective optical system, the package of the solid-state imaging device, and the frame. The endoscope apparatus according to appendix 2, wherein the endoscope apparatus is configured so as to be sealed.
[0106]
【The invention's effect】
As described above, according to the present invention, high-temperature water vapor enters through the gap between the objective optical system and the frame constituting the image pickup apparatus and the gap between the package of the image pickup device and the frame, and observation of a visual field defect or the like is observed. In addition to preventing the performance from deteriorating, the outer peripheral surface of the optical member located at the forefront is used as a low reflection surface, which can prevent the occurrence of flare due to reflection of incident light.
[Brief description of the drawings]
FIG. 1 to FIG. 7 relate to an embodiment of the present invention, and FIG. 1 is a diagram for explaining an endoscope;
FIG. 2 is a diagram for explaining a configuration of a tip portion;
FIG. 3 is a view when the front end portion is viewed from the front;
FIG. 4 is a cross-sectional view showing a configuration of a light guide connector;
FIG. 5 is an enlarged cross-sectional view of the imaging device;
FIG. 6 is a cross-sectional view illustrating a joint portion between a cover glass and a frame,
FIG. 7 is a diagram illustrating the configuration of an image sensor;
8 and 9 are embodiments showing another configuration of the coating surface formed on the cover glass, and FIG. 8 is a cross-sectional view illustrating the configuration of the cover glass and the coating surface.
FIG. 9 is a perspective view showing a cover glass on which a coating surface is formed,
FIGS. 10 to 12 show another configuration example of the imaging apparatus, and FIG. 10 is a diagram for explaining imaging apparatuses having different configurations of the joint portion between the package and the frame;
FIG. 11 is a diagram for explaining an imaging device in which a lens frame is composed of two frames;
FIG. 12 is a diagram for explaining an imaging device in which a lens frame and a frame are integrated;
FIG. 13 is an enlarged view for explaining another configuration of the tip portion;
FIG. 14 is a diagram for explaining the configuration of an eyepiece part of an endoscope;
FIG. 15 is a diagram for explaining a configuration of a bending portion;
FIG. 16 is a diagram illustrating another configuration of the bending portion;
[Explanation of symbols]
12 ... Imaging device
14 ... Objective lens group
17 ... Frame
18 ... Cover glass
20 ... Image sensor
30 ... Coating surface

Claims (1)

In an endoscope apparatus having an observation optical system composed of a plurality of optical members and a frame body that houses the optical members therein,
Among the plurality of optical members , a coating surface is formed at an engagement portion between the optical member formed of sapphire or hard glass positioned at the forefront, and the frame body ,
The coating surface of the optical member is
A joining metal layer made of metal that enables welding with the frame,
A layer formed on the outer peripheral surface of the optical member, and a low-reflection metal layer made of a material whose reflectance of light incident on the optical member is lower than that of the bonding metal layer;
Composed of
The outer peripheral surface of the optical member on which the low-reflection metal layer is formed is subjected to a surface treatment so that the average roughness is 0.1 μm to 1 μm in order to reduce the reflectance of light incident on the optical member. Then, the low reflection metal layer is formed on the outer peripheral surface .

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