JP2000115594A - Solid-state imaging device unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state imaging device unit that no blur occurs on a lens, durability against autoclave sterilization is provided, the outer diameter of a top end part can be small and the length of a hard part can be short in the case of application to an endoscope. SOLUTION: Respective lenses composing an objective lens system 13 are attached to a lens frame 2, and a CCD holding part 9, to which a plate lens 4 and a CCD 5 are attached, is fitted to the lens frame 2 and brazed or the like by a bonding part 15. Further, the CCD holding frame 9 and a shield frame 11 are bonded by brazing or the like as well and connecting parts between members facing the outside of a solid-state imaging device unit 1A are bonded by the molten metal or the like of low steam peameability so that the occurrence of blur on the internal lens is prevented and in the case of housing in a top end part 21 of the endoscope, the outer diameter of the top end part 21 is thinned and the hard length is shortened in terms of the structure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device unit which is incorporated in an electronic endoscope or the like and performs imaging.

[0002]

2. Description of the Related Art In recent years, an imaging optical system for forming an image of a subject and a solid-state imaging device unit having a solid-state imaging device arranged at the imaging position have been widely used in electronic equipment such as an electronic endoscope. .

[0003] For example, Japanese Patent Application Laid-Open No. 9-265047 discloses an electronic endoscope in which an image pickup means having an objective lens and a solid-state image pickup device is provided at the distal end of an insertion section. Inside the exterior structure in which the cylinder and the operation unit having the video signal extraction unit are hermetically sealed, an inner structure in which the inner cylinder provided with the imaging means at the end and the video signal connection unit is hermetically sealed is provided. An electronic endoscope is disclosed.

This electronic endoscope is hermetically sealed with both the inner structure and the outer structure. Even if one hermetic seal is broken, the other is hermetically sealed. There is an advantage that the reliability of the stop is high.

Japanese Utility Model Laid-Open Publication No. Sho 60-107819 discloses a solid-state image pickup device unit in which a solid-state image pickup device and a drive circuit are incorporated in a sheath body, and synthetic resin is filled in gaps between these components. It has been disclosed. In the case of this structure, since the solid-state imaging device and the driving circuit are surrounded by the synthetic resin, these electronic components are not damaged even if the liquid enters.

[0006]

However, Japanese Patent Application Laid-Open No.
In the device disclosed in Japanese Patent No. 265047, there is a disadvantage that the outer diameter of the endoscope is increased because it is necessary to provide both the internal structure and the external structure. In addition, when this technique is applied to an endoscope whose distal end is bendable, there is a disadvantage that the length of the hard portion of the distal end is increased, and the insertability into a living body is significantly deteriorated.

On the other hand, in the solid-state image pickup device unit disclosed in Japanese Utility Model Application Laid-Open No. 60-107819, only the synthetic resin is filled and there is no special contrivance. High pressure (temperature 140 ° C
Water vapor at a pressure of about 2.5 kg / cm @ 2) degrades the synthetic resin, and at the same time, the moisture reaches the electronic parts, causing damage and fogging of the lens.

(Object of the Invention) The present invention has been made in view of the above-mentioned points, and does not cause fogging of the lens, has resistance to autoclave sterilization, and, when applied to an endoscope, has a problem in that the end of the lens can be used. It is an object of the present invention to provide a solid-state imaging device unit having a small outer diameter and capable of shortening the length of a hard part.

[0009]

In order to solve the above-mentioned problems, a solid-state imaging device unit having a solid-state imaging device, an optical system for forming an image on the solid-state imaging device, and a frame for holding the optical system is provided. By fixing the members facing the outer surface of the element unit by bonding with molten metal and / or bonding with an adhesive, the optical system has resistance to autoclave sterilization without fogging, and is applicable to endoscopes. In this case, the outer diameter of the tip portion is small, and the length of the hard portion can be shortened.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 shows a solid-state imaging device unit according to a first embodiment of the present invention. An object of the present embodiment is to realize an airtight state having resistance to autoclave sterilization, and a solid-state imaging device unit having a small outer diameter of a distal end portion and a shorter hard portion when attached to the distal end portion of an endoscope. Is to provide.

A solid-state image sensor unit having resistance to autoclave sterilization will be described below. The term “resistance to autoclave sterilization” does not necessarily mean that high-temperature and high-pressure steam does not infiltrate the solid-state image sensor unit at all. This means a solid-state imaging device unit having a function of continuously reproducing an image without causing fogging of a lens even when a certain amount of high-pressure steam enters, without damaging electronic components.

The solid-state imaging device unit 1A according to the first embodiment shown in FIG. 1 is used, for example, by being incorporated in a distal end portion 21 of an electronic endoscope (not shown) whose insertion portion is bendable.

The solid-state image pickup device unit 1A has a lens frame 2 to which an objective lens system 13 as an image forming optical system for forming an image of a subject is fixed, and a CCD holding fitting and fixed to the hand side of the lens frame 2. A frame 3, for example, a CCD (charge-coupled device) 5 as a solid-state imaging device which is joined to a flat lens 4 on the CCD holding frame 3 and arranged at an image forming position of the objective lens system 13, and is provided near the CCD 5. A first substrate 6 and a second substrate 7 provided with a circuit for amplifying an electric signal from the CCD 5; a cable 8 connected to the second substrate 7 and passed through an endoscope (not shown); And a shield frame 11 for connecting the cable holder 10 and the CCD holding frame 3 to each other.

The lens frame 2 is made of a material having good corrosion resistance, for example, stainless steel. A first lens 12 made of sapphire glass having high resistance to autoclave sterilization is joined to the tip of the lens frame 2. The joint surface 2a of the lens frame 2 with the first lens 12 is plated with gold or a gold alloy.

The joint surface 12a of the first lens 12 with the lens frame 2 is provided with a metal coating made of Cr, Cu, Ni or the like. This metal coating
A four layer coating of Cr-Cu-Cu-Ni is desirable. The joining surface 2a and the joining surface 12a thus formed form a joining portion 14 joined by a molten metal, specifically, solder or brazing or welding.
4 prevents high-temperature and high-pressure steam from entering the inside.

Each lens disposed inside the first lens 12 of the lens frame 2 and constituting the objective lens system 13 is a first lens.
The parts other than the lens 12 may be fixed with an adhesive. The flat lens 4 is bonded and fixed to the CCD holding frame 3. Also, C
The CD holding frame 3 is formed of an insulator such as ceramic or PEEK (polyetheretherketone), and a fitting portion 3a for fitting to the lens frame 2 is provided with a metal coating similarly to the outer periphery of the first lens 12. .

The CCD holding frame 3 in the lens frame 2
The fitting portion 2b is plated with the same as the joint surface 2a. Further, a joining portion 15 is formed between the fitting portion 3a and the fitting portion 2b by soldering, brazing or welding to prevent the invasion of high-temperature and high-pressure steam.

The metal coating is also applied to the joint surface 3b of the CCD holding frame 3 with the shield frame 11. Then, a joint 16 joined to the shield frame 11 by soldering or brazing or welding is formed,
It prevents high-temperature and high-pressure steam from entering the interior.

The cable holder 10 is made of solder or brazable or weldable metal, or solder or brazed or welded surface-treated metal, for example, desirably brass plated with Ni.

The shield frame 11 is formed of a thin pipe, and is made of, for example, stainless steel having good corrosion resistance. The front end is joined to the CCD holding frame 3 and the rear end is soldered or brazed or welded to the cable holder 10. It is plated with gold or a gold alloy for joining.

Of course, if it is formed of a material which can be easily soldered or brazed, plating is unnecessary. As described above, both ends of the shield frame 11 are joined to the CCD holding frame 3 and the cable holder 10 by soldering, brazing or welding, respectively, to prevent invasion of high-temperature and high-pressure steam.

The net-shaped shield wire 9 is joined to the through hole 10a provided in the cable holder 10 by soldering to prevent the infiltration of high-temperature and high-pressure steam. Further, the cable 8 is provided so as to be covered with a heat-shrinkable heat-shrinkable tube 17 around the cable 8.
The shield wire 9 is protected from high-temperature and high-pressure steam.

The periphery of the CCD 5 and the substrates 6 and 7 provided on the back side thereof are filled with an insulating filler such as an epoxy resin having electric insulation and low vapor permeability.
It is covered with an insulating tube 18 and the like.

A space 19 surrounded by the CCD holding frame 3, the flat lens 4, the cable holder 10, and the shield frame 11.
Is filled with an insulating filler 20 such as an epoxy resin having electric insulation and low vapor permeability.

In the first embodiment having such a configuration,
The lens frame 2, the CCD holding frame 3, the shield frame 11, the cable holder 10, and the first lens 12, which are exterior members facing the outer surface of the solid-state imaging device unit 1 </ b> A, do not substantially transmit or transmit vapor such as a metal member. It is characterized in that it is made of members that are difficult to be processed, and the connection between these members is joined with a molten metal that has almost no permeation of steam. And it is enough to suppress the fogging of the internal lens,
When housed in the distal end portion 21 of the endoscope, the outer diameter of the distal end portion 21 is made thinner and the rigid length can be made shorter.

The operation of the first embodiment having such a configuration will be described. With the above configuration, the solid-state imaging device unit 1
Since the outer peripheral members facing the outer surface of A are all joined by joining parts 14, 15, 16 or the like by soldering, brazing, or welding, the endoscope incorporating the solid-state imaging device unit 1A is attached to an autoclave sterilizer. At the time of sterilization, the high-temperature and high-pressure steam does not enter the inside of the solid-state imaging device unit 1A.

This embodiment has the following effects. When sterilized in an autoclave sterilizer, high-temperature and high-pressure steam does not enter the solid-state imaging device unit 1A.
The internal CCD 5 and other electronic components are not deteriorated or damaged. Further, since water vapor does not enter, the lens inside the first lens 12 does not fog.

The first lens 12, the lens frame 2, the CCD holding frame 3, and the shield frame 1 of the solid-state imaging device unit 1A.
Since the high-temperature and high-pressure steam is prevented from entering by the cable holder 1 and the cable holder 10, the outer diameter of the distal end portion 21 of the endoscope incorporating the solid-state imaging device unit 1A can be significantly reduced.

Further, since the hard portion is also limited to the lens portion, the CCD portion, and the tip of the cable, the length can be shortened, and the hard portion can be incorporated into various bendable endoscopes. The present invention can also be applied to an electronic endoscope for digestive organs and an electronic endoscope for bronchi. In addition, since the components are joined by welding or the like, the strength of the solid-state imaging device unit 1A is significantly improved, and the life of the solid-state imaging device unit 1A is extremely long.

Although the shield frame 11 and the cable holder 10 are joined by soldering, brazing or welding in the above-described embodiment, an epoxy adhesive having a low vapor permeability, alumina or zirconia is used as a main component. A ceramic adhesive may be used.

In this case, it is preferable that the shield frame 11 and the cable holder 10 are formed so that the gap is fitted to about 0.1 mm so that the adhesive can be surely penetrated. Although the adhesive cannot completely block high-temperature and high-pressure steam like soldering or brazing or welding, as described above, the shielding frame 11 cannot be used.
By making the cable holder 10 and the cable holder 10 in a fitted state, the contact area between the adhesive and the vapor is reduced, and the adhesive is surely penetrated into the gap, so that the permeation of the vapor can be extremely reduced.

Moreover, the CCD 5, the first substrate 6, the second substrate 7
Since the surrounding area is filled with an epoxy resin or the like having a low vapor permeability as described in the above embodiment, it is difficult for the vapor to reach the electronic components, and compared to an endoscope which is not devised as described above. And can have a very long life.

In the above embodiment, a part or all of the outer surface of the solid-state imaging device unit 1A is covered with a heat-shrinkable tube, or a coating agent or an adhesive is used for the purpose of electrical insulation and protection of the outer surface. May be applied.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. An object of the present embodiment is to secure resistance to autoclave sterilization, to extend the life, and to provide a solid-state imaging device capable of reducing the outer diameter of the distal end portion and shortening the rigid portion length when provided at the distal end portion of the endoscope. To provide units.

The solid-state imaging device unit 1B according to the second embodiment of the present invention shown in FIG. 2 is different from the solid-state imaging device unit 1A according to the first embodiment in that it is closer to the hand than the vicinity of the rear end of the shield frame 11. Joint part, ie, cable holder 1
The joint between the shield frame 11 and the through hole 10a and the shield wire 9 is made of an epoxy adhesive having a low vapor permeability or a ceramic adhesive mainly containing alumina or zirconia.

Further, a heat-shrinkable tube 22 made of fluororesin or PET (polyethylene terephthalate) is provided as an exterior member for covering the lens frame 2, the CCD holding frame 3, the shield frame 11, and the cable holder 10. Lens frame 2, heat shrink tube 17 respectively
In close contact. Since the heat-shrinkable tube 22 is made of a fluororesin or PET, it has very low vapor permeability.

Although the heat-shrinkable tube 22 cannot completely block the high-temperature and high-pressure steam unlike soldering, brazing or welding, the heat-shrinkable tube 20 and the filler 20 having low vapor permeability filled in the space 19 are used. Both effects can minimize the permeation of vapor to the electronic parts and the lens part.

The operation of this embodiment is as follows.
With the above configuration, since the solid-state imaging device unit 1B has very low vapor permeability, high-temperature and high-pressure steam enters the inside of the endoscope incorporating the solid-state imaging device unit 1B when sterilizing the distal end portion with an autoclave sterilizer. And hardly any intrusion into electronic parts and lens parts.

This embodiment has the following effects. When sterilized in an autoclave sterilizer, high-temperature and high-pressure steam hardly enters the solid-state imaging device unit 1B, so that the CCD 5 and other electronic components are hardly deteriorated or damaged, and the life can be extended. Also, there is no fogging of the internal lens.

Further, the invasion of high-temperature and high-pressure steam is prevented by devising only the lens portion, the CCD portion of the solid-state imaging device unit 1B, the frame thereof, and the thin heat-shrinkable tube 22, so that the solid-state imaging device unit 1B is incorporated. The outer diameter of the distal end portion 21 of the endoscope can be significantly reduced.

Further, since the hard portion is limited to the lens portion, the CCD portion, and the end of the cable, the length of the hard portion can be shortened, and the hard portion can be incorporated into various bendable endoscopes. The present invention can be applied to a dexterous electronic endoscope and an electronic endoscope for bronchi. In this embodiment, a similar effect can be obtained by molding and coating a lead pipe or sheet instead of the heat-shrinkable tube 22. Moreover, you may make it cover with metal foils other than lead.

(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG. An object of the present embodiment is to secure resistance to autoclave sterilization, to extend the life, and to provide a solid-state imaging device capable of reducing the outer diameter of the distal end portion and shortening the rigid portion length when provided at the distal end portion of the endoscope. To provide units. FIG. 3 shows a configuration near the distal end 31 of an insertion section 30 of an endoscope 29 provided with a solid-state imaging device unit 28 according to a third embodiment of the present invention.

Hard tip member 32 constituting tip portion 31
A distal end cover 33 is attached to the outer periphery on the distal end side, and a distal end of a pipe member 34 is attached to the outer peripheral end on the rear end. The rear end of the pipe member 34 is rotatably connected to a bending piece 37 adjacent to the rear end via a rivet 36.
A curved portion 38 is formed so that 7 is rotatably connected to a curved piece 37 on the rear end side by a rivet 36.

The operation wire 3 is provided inside the bending piece 37.
9 is inserted, and the rear end side of the operation wire 39 is inserted into the insertion portion 30.
By operating a bending knob (not shown) provided on the operating portion at the rear end of the operating member and pulling the operation wire 39, the plurality of bending pieces 37 are rotated around the rivets 36 to bend the bending portion 38, and the bending portion 38 is bent. The tip 31 formed at the tip of the solid-state image sensor is oriented in a desired direction, and the viewing direction of the solid-state imaging device unit 28 incorporated in the tip 31 can be freely changed.

Unit mounting hole 41 provided in tip member 32
The solid-state imaging device unit 28 has its lens frame 2 and C
The CD holding frame 3 is inserted so as to substantially fit, and is fixed to the distal end member 32 with screws or the like (not shown). The solid-state imaging device unit 28 has substantially the same configuration as the solid-state imaging unit 1B of the second embodiment.

That is, the solid-state imaging device unit 28
Are provided on the lens frame 2 to which the objective lens system 13 is attached, the CCD holding frame 3 adhered to the flat lens 4, the CCD 5 having the protective cover glass 43 adhered to the flat lens 4, and the CCD 5 and the rear surface thereof. The shield frame 11 covers the substrate 44, and the heat-shrinkable tube 22 further covers the shield frame 11.

The joining method between the components is the same as in the second embodiment. However, the substrate 44 is disposed between the end of the shield frame 11 and the cable 8, and an epoxy adhesive 45 having low vapor permeability around the substrate 44 is a ceramic adhesive 46 containing alumina or zirconia as a main component. It is filled and further fixed around it with a heat-shrinkable tube 22. Both ends of the heat shrink tube 22 are the cable 8 and the shield frame 1 respectively.
Adhere to 1. The tip member 32 has a unit mounting hole 41
A through hole communicating with the forceps channel 47 is provided adjacent to.

Next, the operation of the present embodiment will be described. With the above configuration, the solid-state imaging device unit 28 is largely blocked by the heat-shrinkable tube 22 from the infiltration of high-temperature and high-pressure vapor, and then the vapor slightly infiltrated by the epoxy adhesive 45 or the ceramic-based adhesive 46 is also blocked. By this action, when the endoscope 29 in which the solid-state imaging device unit 28 is incorporated is sterilized by an autoclave sterilizer, high-temperature and high-pressure steam hardly intrudes into the inside, and particularly hardly invades the electronic parts and the lens portion.

Therefore, the present embodiment has almost the same effect as the previous embodiment. In this embodiment, a similar effect can be obtained by molding and coating a lead pipe or sheet instead of the heat-shrinkable tube 22.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIG. An object of the present embodiment is to provide a solid-state imaging device unit that has a short rigid portion, can secure resistance to autoclave sterilization, can have a long life, and can reduce the outer diameter of the distal end portion when applied to an endoscope. It is in. FIG. 4 shows the distal end 31 of the endoscope 29.

In this embodiment, as in the third embodiment, the solid-state imaging device unit 51 is incorporated in the end portion 31 of the endoscope 29. This solid-state imaging device unit 51
Differs from the solid-state image sensor unit up to the third embodiment in that a connection frame 52 for connecting the lens frame 2 and the CCD holding frame 3 is provided.

In the solid-state imaging device unit 51, the cable 8 is connected to the lead 53 of the CCD 5, and a protective tube 54 made of resin is provided to cover the cable 8 and the end of the CCD holding frame 3.

The connection between the connection frame 52 and the end of the CCD holding frame 3 and the connection between the connection frame 52 and the end of the lens frame 2 are performed by soldering, brazing or welding. The protective tube 54 and the CCD holding frame 3 are bonded to each other with an epoxy adhesive or a ceramic adhesive in a fitted state.

In this case, since the protection tube 54 is made of resin, watertightness can be secured, but high-temperature and high-pressure steam enters to some extent. Therefore, the epoxy adhesive 45 or the ceramic adhesive 46 is filled at a position as close as possible to the CCD holding frame 3 inside the protection tube 54, and high-temperature and high-pressure steam hardly permeates from the proximal side of the protection tube 54 to the CCD 5 side. It has a configuration.

In this embodiment, the second lens 55 is attached to the tip of the lens frame 2, and the first lens 12 is attached to the tip member 56. For this reason, a metallized film is formed on the outer peripheral surface of the side of the first lens 12 and joined to the tip member 56 by a joining portion 57 such as brazing to prevent vapor from entering the inside. In addition, the connection frame 52 is also joined by a joining portion 58 such as brazing at a portion where the connection frame 52 is fitted with the tip member 56, thereby preventing steam from entering the inside.

Further, the distal end of the light guide fiber 61 is fixed to the distal end member 56 via a base, and an illumination lens 62 is attached to the distal end surface thereof, and the illumination lens 62 is also brazed to the distal end member 56. It is joined by.
Others are the same as the third embodiment.

Next, the operation of the present embodiment will be described. By filling an epoxy adhesive 45 or a ceramic adhesive 46 at a position as close as possible to the CCD holding frame 3 inside the protection tube 54, when sterilizing with an autoclave sterilizer, high-temperature and high-pressure steam hardly enters the inside, In particular, it can hardly enter the electronic parts and the lens portion.

This embodiment has the same effect as the previous embodiment. It is more effective to fill the gap between the CCD 5 and the CCD holding frame 3 with an epoxy adhesive or a ceramic adhesive.

(Fifth Embodiment) Next, a fifth embodiment of the present invention will be described with reference to FIGS. The purpose of this embodiment is the same as that of the previous embodiment. FIG.
The solid-state imaging device unit 64 according to the embodiment is shown.

The joining of the components of the solid-state image sensing device unit 64 is the same as that of the second embodiment except for the portions described below. However, the heat-shrinkable tube 65 that covers the solid-state imaging device unit 64 is only on the near side of the CCD 5.

The flat lens 4 and the CCD holding frame 3 are joined by applying the above-described metal coating to the outer periphery of the flat lens 4.
Laser irradiation is performed from outside the CCD holding frame 3 to perform welding.
The material of the heat-shrinkable tube 65 is a fluororesin or PET (polyethylene terephthalate) that does not easily transmit vapor.

Although a gap 66 is formed between the protective tube 54 and the heat shrink tube 65, it is desirable to make the gap 66 as small as possible. An epoxy adhesive 45 or a ceramic adhesive 46 is filled in the distal end portion of the protective tube 54, and the protective tube 54 is filled as in the previous embodiment.
Of the high-temperature and high-pressure steam hardly permeates from the near side to the CCD 5 side.

Further, the space 67 surrounded by the second substrate 7 and the heat-shrinkable tube 65 and the first substrate 6 and the second substrate 7
Similarly, a space 68 surrounded by the heat-shrinkable tube 65 also has an epoxy adhesive 45 or a ceramic adhesive 46.
So that high-temperature and high-pressure steam hardly permeates.

Next, the operation of the present embodiment will be described. When the position and the space 67 as close as possible to the second substrate 7 inside the protective tube 54 are filled with the epoxy adhesive 45 or the ceramic adhesive 46 and sterilized by an autoclave sterilizer, high-temperature and high-pressure steam enters the inside. Hard to penetrate into electronic parts and lens parts.

This embodiment has the same effect as the second embodiment. As shown in FIG. 6, it is more effective to fill the portion 70 near the end of the protective tube 54 with the epoxy adhesive 45 or the ceramic adhesive 46 on the connector 69 side connected to a camera control unit (not shown).

By the way, as shown in FIG.
The endoscope 71 incorporating the solid-state imaging device unit according to the fifth embodiment needs to secure the resistance to autoclave sterilization, and at the same time, reduce the weight of the endoscope 71 as much as possible to make it easier for the operator to operate. .

In particular, the flexible insertion section 72 of the endoscope 71 inserted into the living body, the operation section 73 held by the operator, and the cord 75 for guiding the cable of the solid-state imaging device unit 74 to a camera control unit (not shown) are reduced in weight. Various heat-resistant resins are used to achieve this. At this time, some heat resistant resins, such as polysulfone, generate gas at high temperatures.

Such a gas is supplied to the solid-state imaging device unit 7.
4 and other parts may be damaged. Therefore, FIG.
As described above, a gas absorber 76 of, for example, calcium chloride is provided inside the operation unit 73. With this gas absorber 76,
Even if gas is generated inside the endoscope 71 during autoclave sterilization, the gas is quickly absorbed and there is an effect that there is no possibility of damaging the solid-state imaging device unit 74 and other components.

(Sixth Embodiment) FIG. 8 shows a sixth embodiment of the present invention.
1 shows a solid-state imaging device unit 80 according to the embodiment. Lens frame 8 for holding a lens group constituting the objective lens system 81
2 is a cover glass made of sapphire at the front end surface.
3 is held against a cover glass frame 84 that holds the cover glass 3.

The cover glass frame 84 is preferably made of Kovar, but may be made of stainless steel depending on the joining technique. The lens frame 82 is fitted inside an insulating frame 85 made of ceramics,
The cover frame 84 is externally fitted from the front end side of the insulating frame 85 and is hermetically fixed to the metal coating portion provided on the outer peripheral surface of the insulating frame 85 by welding or brazing with metal. I have.

The cover glass 87 to which the solid-state image sensor 86 is adhered and fixed is made of sapphire or a multi-component glass having relatively high heat and water resistance, and is air-tightly fixed to the cover glass frame 88 by fusion welding with metal. . The cover glass frame 88 is preferably made of Kovar, but may be made of stainless steel depending on the joining technique.

The lens 89 and the spacing tube 90 are sandwiched between the cover glass 87 and the insulating frame 85, and the cover glass frame 88
And the insulating frame 85 are hermetically fixed by fusion welding with a metal.

As in the first embodiment, a first substrate 91 and a second substrate 92 are arranged on the back side of the solid-state image sensor 86 and connected to a cable 93. The solid-state imaging device 86, the first substrate 91, and the second substrate 92 are covered with a tube 94, and the inside thereof is filled with an insulating adhesive 95.

Further, the cable 9 is connected to the cover glass frame 88.
3 is covered with a heat-shrinkable tube 96 near the front end. The heat-shrinkable tube 96 is desirably made of a fluorine resin. The space between the heat-shrinkable tube 96 and the tube 94 is filled with an adhesive 97 made of an epoxy resin.

The procedure for assembling the solid-state imaging device unit 80 will be described with reference to FIGS. FIG. 9 (A)
Shows a state where the cover glass 83 and the cover glass frame 84 are assembled. FIG. 9B shows a state where the cover glass 87 and the cover glass frame 88 are assembled. FIG.
Both (A) and (B) can be melt-welded by raising their respective heat-resistant temperatures, so that soldering or brazing can be performed.

The brazing is also referred to as brazing material joining, in which metallizing is performed on the joining surface of the sapphire cover glass, and joining is performed using silver brazing or the like. Also called active metal method,
A method using Ti or Zr as a brazing filler metal is generally known.

FIG. 9C shows a lens 89 on a cover glass 87 and a cover glass frame 88 assembled in FIG. 9B.
And a state where the spacer tube 90 and the insulating frame 85 are assembled. Metallize the joining surface of the ceramic insulating frame 85,
Perform solder or brazing material joining.

In the brazing material joining, a low melting point metal method using an ultrasonic soldering iron, a melting point metal method, and the like are generally known. In addition, when the joining surface of the metal cover glass frame 88 is plated with Ni, the joining becomes easy.

After this assembly, the solid-state image sensor 86 is assembled, and the lens group and the lens frame 82 are focused and fixed by bonding. FIG. 10 shows a cross section in a state where the cover glass 83 and the cover glass frame 84 assembled in FIG. 9A are assembled. The insulating frame 85 made of ceramics and the cover glass frame 84 are soldered or brazed. At this time, it is necessary to consider the internal adhesive and the heat resistant temperature of the solid-state imaging device 86, and it is necessary to consider that the other brazing portions do not come off. Therefore, a low melting point Pb-Sn alloy or In
A system solder or the like is effective.

The operation of this embodiment is the same as that of the first embodiment. Further, the present embodiment has the following effects. In the present embodiment, the inside of the lens unit sandwiched between the cover glass 83 and the cover glass 87 is completely airtightly maintained, and there is no invasion of water vapor by autoclave sterilization. There is no deterioration or the like of the adhesive fixing portion, and reliability can be ensured for long-term use.

Further, the rear end side (hand side) of the CCD maintains a strong watertight state by fixing and filling with an adhesive to prevent breakage of electronic parts. With such a configuration, it is possible to make the wiring portion with the cable thinner,
The distance from the CCD to the cable wiring section can be reduced. Therefore, the rigid portion at the distal end of the endoscope insertion section can be shortened. Others are the same as the first embodiment.

The airtightness described in the present invention means that the equivalent reference leak amount (0.1 to 0.4 cm ^{3 of the} space in the test body) is basically determined by a helium leak detector described in JIS Z2331, etc. As 1 × 10 ^-9
Pa · m ³ / S or less.

When the value exceeds 1 × 10 ⁻⁹ Pa · m ³ / S, steam invades during autoclave sterilization, and water vapor accumulates due to repeated autoclave sterilization, causing dew condensation and clouding on the lens. In addition, there is a possibility that defects such as defective observation images may occur due to deterioration of the coating or adhesive applied to the lens or the lens surface.

Table 1 shows the relationship between the difference in the equivalent reference leak amount due to the difference in the joining method and the presence or absence of vapor intrusion.

An airtight structure by welding, in other words, the airtight airtight objective lens unit 4 shown in the above-described embodiment.
It can be seen that the transmission reference leak amount differs between the airtight structure of 0 and the watertight structure formed using a general O-ring or an adhesive.

[0086]

[Table 1] The data on the presence or absence of water vapor intrusion after autoclave sterilization shows that in the case of bonding or sealing using a polymer material, vapor enters through the bonding portion and the sealing member for welding such as brazing and fusion welding. This manifests itself as a more pronounced difference with repeated autoclaving.

The present invention also includes an embodiment configured by partially combining the above-described embodiments.

[Supplementary Notes] (1) In a solid-state imaging device unit having a solid-state imaging device, an optical system for forming an image on the solid-state imaging device, and a frame for holding the optical system, the solid-state imaging device unit faces the outer surface of the solid-state imaging device unit. A solid-state imaging device unit wherein members are fixed by joining with a molten metal and / or joining with an adhesive.

(2) The solid-state imaging device unit according to appendix 1, wherein the joining by the molten metal is performed by welding, brazing, or soldering. (3) The bonding with the adhesive uses an epoxy resin or a ceramic adhesive.
Or 2 solid-state imaging device units.

(4) The outer member of the solid-state image sensor unit closer to the distal end than the solid-state image sensor is joined by molten metal, and the outer member of the solid-state image sensor unit closer to the hand than the solid-state image sensor is joined by an adhesive. 3. The solid-state imaging device unit according to any one of supplementary notes 1 to 3, characterized in that the solid-state imaging device unit is joined by a solid-state imaging device.

(5) Among the outer members, a joining surface of a non-metal member is metal-coated.
To 4 solid-state imaging device units. (6) In a solid-state imaging device unit including a solid-state imaging device, a substrate connected to the solid-state imaging device, an optical system that forms an image on the solid-state imaging device, and a frame that holds the optical system, the solid-state imaging device and / or Alternatively, a solid-state imaging device unit in which a space around a substrate is filled with an epoxy-based adhesive or a ceramic-based adhesive.

(7) The solid-state imaging device unit according to appendix 6, wherein a frame or a tube is provided around the solid-state imaging device or the substrate. (8) The solid-state imaging device unit according to attachment 7, wherein the tube is made of a fluororesin or polyethylene terephthalate.

(9) In a solid-state image sensor unit having a solid-state image sensor and an optical system for forming an image on the solid-state image sensor, at least a part of the solid-state image sensor unit outside is covered with a metal or a tube. Solid-state image sensor unit. (10) The tube is made of fluororesin or polyethylene terephthalate.
Solid-state image sensor unit.

(11) The solid-state imaging device unit, wherein the metal is lead. (12) The solid-state imaging device unit according to appendix 9 or 11, wherein the metal is a pipe.

(13) The solid-state imaging device unit according to appendix 9 or 11, wherein the metal is a frame formed by molding a metal foil. (14) In a solid-state imaging device unit including a solid-state imaging device, an optical system for forming an image on the solid-state imaging device, a signal line extending from the solid-state imaging device, and a tube for protecting the signal line, at least a part of the tube A solid-state imaging device unit characterized in that an adhesive is filled therein.

(15) The solid-state image pickup device unit according to appendix 14, wherein the adhesive is filled in a distal end side of a tube and / or an end portion on a connector side. (16) The supplementary note 14 or 15, wherein the adhesive is an epoxy resin or a ceramic adhesive.
Solid-state image sensor unit. (17) The solid-state imaging device unit according to attachments 14 to 16, wherein the sealing of the imaging unit is performed by filling the adhesive.

[0097]

As described above, according to the present invention, since the joining between members facing the outside of the solid-state imaging device unit is performed by using the joining by the molten metal or the adhesive, the high-temperature and high-pressure steam during the autoclave sterilization is used. Can be prevented from entering the solid-state imaging device unit, and a solid-state imaging device unit in which lens fogging due to the invading vapor does not occur can be provided. Further, when provided at the distal end of the endoscope, the outer diameter can be reduced and the length of the hard portion can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of a solid-state imaging device unit according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a configuration of a solid-state imaging device unit according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a configuration of a distal end portion of an endoscope provided with a third embodiment of the present invention.

FIG. 4 is a sectional view showing a configuration of a distal end portion of an endoscope provided with a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a configuration of a solid-state imaging device unit according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view showing the structure near the connector at the end of the cable in FIG. 5;

FIG. 7 is a diagram showing a schematic configuration of an endoscope provided with the first to fifth embodiments.

FIG. 8 is a sectional view showing a configuration of a solid-state imaging device unit according to a sixth embodiment of the present invention.

FIG. 9 is an explanatory diagram of an assembling procedure according to a sixth embodiment.

FIG. 10 is a diagram showing a state in which a solid-state imaging device and the like are assembled after the assembly in FIG. 9C.

[Explanation of symbols]

 1A: solid-state imaging device unit 2: lens frame 3: CCD holding frame 4: flat lens 5: CCD 6: first substrate 7: second substrate 8: cable 9: net-shaped shield wire 10: cable holder 11: shield frame 12 ... First lens 14, 15, 16 ... Joint 17 ... Heat shrinkable tube 18 ... Insulating tube 19 ... Space 20 ... Insulating filler 21 ... Tip

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Seiichi Higuma 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Industrial Co., Ltd. (72) Inventor Susumu Aono 2-43-2 Hatagaya, Shibuya-ku, Tokyo No. Olympus Optical Co., Ltd. (72) Hidetoshi Saito, inventor 2-43-2 Hatagaya, Shibuya-ku, Tokyo Tokyo, Japan No. 72 Inventor Takao Yamaguchi 2-43-2, Hatagaya, Shibuya-ku, Tokyo No. Olympus Optical Co., Ltd. (72) Inventor Hiroshi Tatsuno 2-43-2 Hatagaya, Shibuya-ku, Tokyo In-line Olympus Optical Co., Ltd. (72) Takeaki Nakamura 2-43, Hatagaya, Shibuya-ku, Tokyo No. 2 Olympus Optical Co., Ltd. (72) Inventor Takahiro Kishi 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Hikari Within Kogyo Co., Ltd. (72) Inventor Yasuhito Kura 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Inventor Jun Hiroya 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Within Optical Industry Co., Ltd. (72) Inventor Ichiro Nakamura 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Industry Co., Ltd.

Claims (1)

[Claims] In a solid-state imaging device unit having a solid-state imaging device, an optical system for forming an image on the solid-state imaging device, and a frame for holding the optical system, a space between members facing an outer surface of the solid-state imaging device unit is fused. A solid-state imaging device unit characterized by being fixed by bonding with a metal and / or bonding with an adhesive.