JP2005018051A - 面状ケーブル部材の接続部の補強方法及び画像表示装置の製造方法 - Google Patents
面状ケーブル部材の接続部の補強方法及び画像表示装置の製造方法 Download PDFInfo
- Publication number
- JP2005018051A JP2005018051A JP2004162955A JP2004162955A JP2005018051A JP 2005018051 A JP2005018051 A JP 2005018051A JP 2004162955 A JP2004162955 A JP 2004162955A JP 2004162955 A JP2004162955 A JP 2004162955A JP 2005018051 A JP2005018051 A JP 2005018051A
- Authority
- JP
- Japan
- Prior art keywords
- cable member
- jig
- planar cable
- reinforcing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
【解決手段】 FPC3が接続された表示用パネルを載せるための段差部4aを
設けた流動材流れ止め下治具4と、流動材流れ止め下治具4の上面に重ねられた
、FPC逃げ部6を設けた流動材流れ止め上治具5と、流動材塗布用シリンジ1
1とを用い、表示パネルのFPC3が接続された面と、表示パネルと下治具4お
よび上治具6との隙間とにシリンジ11で流動材を塗布する。
【選択図】 図1
Description
た画像表示装置の製造方法に関する。
前記流動材を供給する行程は、前記面状ケーブル部材が接続された基板と冶具とを近接させて、該冶具によって前記流動材の流れ出しを抑制しながら前記補強材を形成する領域に前記流動材を供給する行程であることを特徴とする面状ケーブル部材の接続部の補強方法である。
装置の製造方法を実現することができる。
図1〜4に本発明の第1の実施の形態として、面状ケーブル部材であるFPC3を表示パネル側の基板と接続したときの接続部を補強及び封止する方法(以下に示す例では補強と同時に封止を行う例を好適な例として示すので、単に封止方法ともいう)の概要を示す。
図5〜8に本発明の第2の実施の形態として、面状ケーブル部材であるTCPを表示パネル側の基板と接続したときの接続部を封止する方法の概要を示す。
例によりなんら限定されるものではない。
本発明の第1の実施例において、図9に示す画像形成装置を作製した。本実施例では、冷陰極電子放出素子である表面伝導型電子放出素子を電子放出素子として複数個、リアプレートに形成し、フェイスプレートには、蛍光体を形成し、有効表示エリアを対角15インチとする縦と横の比が3:4のカラー画像形成装置を作製した。まず、本発明の画像形成装置を図9を用いて説明する。
次に本発明の第2の実施例について説明する。上記の第1の実施例は面状ケーブル部材にFPCを用いた場合であるが、本実施例は面状ケーブル部材にTCP及びPCBを用いた場合について示す。また、治具の形状を一部変更した以外は、第1の実施例とほぼ同様である。したがって、以下では第1の実施例と異なる点を説明するものとし、第1の実施例と同一部分については同一の符号を付して、説明を省略する。
2 リアプレート
3 FPC
4 流動材流れ止め下治具
4a 段差部
5 流動材流れ止め上治具
5a 開口部
6 FPC逃げ部
7 TCP
8 PCB
9 集積回路
10 PCB逃げ部
11 流動材塗布用シリンジ
12 流動材
13、16、18 第1の面
15 TCP逃げ部
900 枠部材
Claims (9)
- 基板に形成された配線に面状ケーブル部材を接続した接続部を、補強材で補強する方法であって、
流動材を供給する工程と、
該流動材を硬化させて前記補強材とする工程とを有しており、
前記流動材を供給する行程は、前記面状ケーブル部材が接続された基板と冶具とを近接させて、該冶具によって前記流動材の流れ出しを抑制しながら前記補強材を形成する領域に前記流動材を供給する行程であることを特徴とする面状ケーブル部材の接続部の補強方法。 - 前記流動材を供給する行程は、前記冶具の所定面が、前記基板の前記面状ケーブル部材が接続される面である第1の面とは非平行になるように前記冶具と前記基板とを配置した状態で、前記冶具の所定面によって前記流動材の流れ出しを抑制しながら前記流動材を供給する行程である請求項1に記載の面状ケーブル部材の接続部の補強方法。
- 前記所定面と該所定面に対向する更なる面と、それらの面によって挟まれる領域の底面とで凹部を形成し、該凹部に前記流動材を供給する請求項2に記載の面状ケーブル部材の接続部の補強方法。
- 前記基板の端面と前記所定面と、それらの面で挟まれる領域の底面とによって凹部を形成し、該凹部に前記流動材を供給する請求項2または3に記載の面状ケーブル部材の接続部の補強方法。
- 前記冶具は、前記基板が配置される凹形状を有しており、該凹形状の壁面を前記所定面として用いる請求項2から4のいずれかに記載の面状ケーブル部材の接続部の補強方法。
- 前記冶具は、下冶具と上冶具から構成されており、該下冶具と上冶具の間から前記面状ケーブル部材を逃がした状態で前記流動材の供給を行う請求項1から5のいずれかに記載の面状ケーブル部材の接続部の補強方法。
- 前記補強材は前記面状ケーブル部材の両面に形成する請求項1から6のいずれかに記載の面状ケーブル部材の接続部の補強方法。
- 前記補強材は、前記面状ケーブル部材の導体の露出部もしくは前記配線もしくはその両方を雰囲気から封止するように形成する請求項1から7のいずれかに記載の面状ケーブル部材の接続部の補強方法。
- 画像表示装置の製造方法であって、
表示パネルを構成する基板に形成された配線に面状ケーブル部材を接続する工程と、前記面状ケーブル部材を接続した接続部を補強する行程とを有しており、該補強する行程が請求項1から8のいずれかに記載された面状ケーブル部材の接続部の補強方法によってなされることを特徴とする画像表示装置の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004162955A JP4290070B2 (ja) | 2003-06-06 | 2004-06-01 | 面状ケーブル部材の接続部の補強方法及び画像表示装置の製造方法 |
CNB2004100874416A CN100409728C (zh) | 2003-06-06 | 2004-06-04 | 增强扁平电缆部件连接的方法及制造图像显示装置的方法 |
US10/861,256 US7032309B2 (en) | 2003-06-06 | 2004-06-04 | Method for reinforcing the connection of flat cable member and method for manufacturing image display unit |
KR1020040040873A KR100680017B1 (ko) | 2003-06-06 | 2004-06-04 | 플랫케이블부재의 접속부의 보강방법과 화상표시장치의제조방법 |
US11/375,143 US7458146B2 (en) | 2003-06-06 | 2006-03-15 | Method for manufacturing image display unit |
US12/193,687 US20080307640A1 (en) | 2003-06-06 | 2008-08-18 | Method for reinforcing the connection of flat cable member and method for manufacturing image display unit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003161855 | 2003-06-06 | ||
JP2004162955A JP4290070B2 (ja) | 2003-06-06 | 2004-06-01 | 面状ケーブル部材の接続部の補強方法及び画像表示装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005018051A true JP2005018051A (ja) | 2005-01-20 |
JP4290070B2 JP4290070B2 (ja) | 2009-07-01 |
Family
ID=34082283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004162955A Expired - Fee Related JP4290070B2 (ja) | 2003-06-06 | 2004-06-01 | 面状ケーブル部材の接続部の補強方法及び画像表示装置の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (3) | US7032309B2 (ja) |
JP (1) | JP4290070B2 (ja) |
KR (1) | KR100680017B1 (ja) |
CN (1) | CN100409728C (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010010122A (ja) * | 2008-06-26 | 2010-01-14 | Samsung Mobile Display Co Ltd | 有機発光表示装置およびその製造方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8632590B2 (en) * | 1999-10-20 | 2014-01-21 | Anulex Technologies, Inc. | Apparatus and methods for the treatment of the intervertebral disc |
JP4290070B2 (ja) * | 2003-06-06 | 2009-07-01 | キヤノン株式会社 | 面状ケーブル部材の接続部の補強方法及び画像表示装置の製造方法 |
TWI241748B (en) * | 2004-07-05 | 2005-10-11 | Au Optronics Corp | Connecting design of a flexible circuit board |
KR101146525B1 (ko) * | 2005-06-30 | 2012-05-25 | 엘지디스플레이 주식회사 | 기판 고정 지그 및 그 제조방법 |
US7742142B2 (en) * | 2005-08-09 | 2010-06-22 | Chunghwa Picture Tubes, Ltd. | Display and tape carrier package structure |
JP5157602B2 (ja) * | 2008-04-03 | 2013-03-06 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
KR101169686B1 (ko) | 2008-11-07 | 2012-08-06 | 에스케이하이닉스 주식회사 | 반도체 패키지용 기판 및 이의 제조 방법 |
KR101022912B1 (ko) * | 2008-11-28 | 2011-03-17 | 삼성전기주식회사 | 금속범프를 갖는 인쇄회로기판 및 그 제조방법 |
KR101838736B1 (ko) * | 2011-12-20 | 2018-03-15 | 삼성전자 주식회사 | 테이프 배선 기판 및 이를 포함하는 칩 온 필름 패키지 |
KR20140038164A (ko) * | 2012-09-20 | 2014-03-28 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
CN106773364B (zh) * | 2017-03-30 | 2018-07-10 | 深圳市华星光电技术有限公司 | 显示屏边框的封胶方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59121837A (ja) * | 1982-12-22 | 1984-07-14 | Fujitsu Ltd | 電子ビ−ム露光方法 |
US4770641A (en) * | 1986-03-31 | 1988-09-13 | Amp Incorporated | Conductive gel interconnection apparatus |
FR2604823B1 (fr) * | 1986-10-02 | 1995-04-07 | Etude Surfaces Lab | Dispositif emetteur d'electrons et son application notamment a la realisation d'ecrans plats de television |
JPS63314866A (ja) | 1987-06-17 | 1988-12-22 | Nec Corp | バイボ−ラ・トランジスタ |
DE3853744T2 (de) * | 1987-07-15 | 1996-01-25 | Canon Kk | Elektronenemittierende Vorrichtung. |
US5123849A (en) * | 1990-11-15 | 1992-06-23 | Amp Incorporated | Conductive gel area array connector |
US5037312A (en) * | 1990-11-15 | 1991-08-06 | Amp Incorporated | Conductive gel area array connector |
US5074799A (en) * | 1991-03-27 | 1991-12-24 | Amp Incorporated | Gel connector of laminar construction |
US5129833A (en) * | 1991-06-26 | 1992-07-14 | Amp Incorporated | Low-force, high-density gel connector |
DE4320527A1 (de) * | 1992-06-22 | 1993-12-23 | Whitaker Corp | Elektrisch leitfähiges Gel |
US5738530A (en) * | 1996-05-28 | 1998-04-14 | Packard Hughes Interconnect Company | Contact pad having metallically anchored elastomeric electrical contacts |
US6054975A (en) * | 1996-08-01 | 2000-04-25 | Hitachi, Ltd. | Liquid crystal display device having tape carrier packages |
US5905638A (en) * | 1997-12-18 | 1999-05-18 | Ericsson Inc. | Method and apparatus for packaging a microelectronic device with an elastomer gel |
US20040112935A1 (en) * | 2002-12-16 | 2004-06-17 | Visteon Global Technologies, Inc. | Integrated flex substrate metallurgical bonding |
JP2004271611A (ja) * | 2003-03-05 | 2004-09-30 | Pioneer Electronic Corp | フラットパネル型表示装置 |
JP4290070B2 (ja) * | 2003-06-06 | 2009-07-01 | キヤノン株式会社 | 面状ケーブル部材の接続部の補強方法及び画像表示装置の製造方法 |
US7452140B2 (en) * | 2003-07-16 | 2008-11-18 | Ibiden Co., Ltd. | Protective sealing of optoelectronic modules |
-
2004
- 2004-06-01 JP JP2004162955A patent/JP4290070B2/ja not_active Expired - Fee Related
- 2004-06-04 KR KR1020040040873A patent/KR100680017B1/ko not_active IP Right Cessation
- 2004-06-04 CN CNB2004100874416A patent/CN100409728C/zh not_active Expired - Fee Related
- 2004-06-04 US US10/861,256 patent/US7032309B2/en not_active Expired - Fee Related
-
2006
- 2006-03-15 US US11/375,143 patent/US7458146B2/en not_active Expired - Fee Related
-
2008
- 2008-08-18 US US12/193,687 patent/US20080307640A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010010122A (ja) * | 2008-06-26 | 2010-01-14 | Samsung Mobile Display Co Ltd | 有機発光表示装置およびその製造方法 |
US8851952B2 (en) | 2008-06-26 | 2014-10-07 | Samsung Display Co., Ltd. | Method of manufacturing an organic light emitting diode display device |
Also Published As
Publication number | Publication date |
---|---|
KR100680017B1 (ko) | 2007-02-08 |
US20060156543A1 (en) | 2006-07-20 |
US7458146B2 (en) | 2008-12-02 |
US20080307640A1 (en) | 2008-12-18 |
CN1607892A (zh) | 2005-04-20 |
CN100409728C (zh) | 2008-08-06 |
KR20040110985A (ko) | 2004-12-31 |
US7032309B2 (en) | 2006-04-25 |
US20050015976A1 (en) | 2005-01-27 |
JP4290070B2 (ja) | 2009-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7458146B2 (en) | Method for manufacturing image display unit | |
JP4886540B2 (ja) | 有機el素子パネル | |
JP2002351346A (ja) | フラットパネル型表示装置 | |
US10685930B2 (en) | Driving integrated circuit and display device including the same | |
JP2004184805A (ja) | 導電配線の接続構造 | |
US6923703B2 (en) | Method of manufacturing plasma display device | |
US20090302734A1 (en) | Airtight container and display device using the airtight container, and manufacturing method therefor | |
JP2006179218A (ja) | 有機elパネル及び有機el発光装置、並びに有機elパネルの製造方法 | |
JP5322805B2 (ja) | 画像表示素子及びその製造方法 | |
JP2007270149A (ja) | 異方性導電接合物質及び異方性導電接合物質が適用されるディスプレイパネルユニット | |
JP2007178872A (ja) | 液晶表示デバイス | |
JP2007034062A (ja) | 液晶表示装置 | |
TWI452552B (zh) | 顯示裝置及其製造方法以及顯示器 | |
JP2006308824A (ja) | 液晶表示装置 | |
JP2000208073A (ja) | 画像表示装置および陰極管 | |
EP2397887B1 (en) | A backlight unit using electron emission elements and a display apparatus having the same | |
JP2007095375A (ja) | 薄型画像表示装置及びその製造方法 | |
KR100698051B1 (ko) | 액정표시패널 제조공정용 기판 합착장치 및 합착방법 | |
JP2005197050A (ja) | 画像表示装置およびその製造方法 | |
KR100669453B1 (ko) | 표시 패널의 전극 연결 구조를 개선한 화상 표시 장치 | |
JP2004047143A (ja) | 表示装置 | |
JP2006523370A (ja) | 液晶表示装置 | |
WO2018235596A1 (ja) | 表示装置 | |
CN111221182A (zh) | 背光源及其制备方法 | |
JP4886295B2 (ja) | 液晶表示デバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051104 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081022 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081112 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090109 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090325 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090331 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120410 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130410 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130410 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140410 Year of fee payment: 5 |
|
LAPS | Cancellation because of no payment of annual fees |