JP2005005449A - Discrete circuit component with through-hole filled with padding at production step and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method in which the leaking-out of a sealant to the reverse side through a through-hole in a resin sealing process after a discrete circuit component is loaded on a base body with the through-hole. <P>SOLUTION: The method has (a) a step where the plated through-holes 131 and 132 are filled with paddings; (b) the step where circuit dies are placed on each first conductive partition of die-surface pattern sets 111 and 112, first electrodes for the dies are connected electrically to the partitions, and second electrodes for the dies are connected electrically to the second conductive partitions of the same patterns 111 and 112; (c) the step where the dies and all die-surface pattern sets on the first surface of a base body are sealed hermetically; and (d) the step where each of a plurality of the discrete circuit components is separated physically by removing paddings in the plated through-holes, cutting the hermetically sealed base body, and individualizing the dies. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention generally relates to a discrete circuit component and a method for manufacturing the same, and more particularly to a discrete circuit component having a through-hole with temporary filling in a manufacturing stage and a method for manufacturing the same.
[0002]
[Prior art]
Active and passive discrete circuit components such as diodes, resistors, capacitors, and inductors are widely used in building electronic circuits. Regardless of whether it is a signal application, a power application, a linear application, or a digital application, various discrete circuit components are required to construct various electronic circuit systems. As with these counter electrodes, diodes, resistors, capacitors, and inductors in the form of discrete circuit components are produced and consumed in large quantities, similar to those manufactured in an integrated circuit (IC).
[0003]
The production of these discrete circuit components is particularly suitable and necessary for automated mass production due to the low unit cost and high volume usage. These discrete circuit components are not competitive as products unless production is automated to achieve low cost and high production speed.
[0004]
Discrete circuit components are available in a variety of packages, of which the leaded package is one of the most common. Due to the ongoing pursuit of miniaturization, discrete circuit components manufactured to SMT (Surface-Mount Technology) standards have become electronic miniaturized for the modern electronics industry. Regardless of whether it is a design or not, it has become an indispensable element in the production of almost all kinds of electronic devices. However, as is well known to those skilled in the art, the manufacture of many of these discrete circuit components is still based on human work to some extent. For example, in the production of some discrete diodes, a significant level of manpower is utilized in some of the production processes.
[0005]
On the other hand, some conventional automated production methods for discrete circuit components form more than two through holes in each component. In order to drill these through holes for each of the component units against a collection of pattern arrangements distributed over the entire production substrate, a certain level of accuracy is required in the alignment. For this drilling, it is necessary that the component die has a structure sufficiently separated from the vicinity of the through hole. Due to such a spatial need, there is a limit to the size that can be reduced as the overall size of the component. In other words, the through hole itself occupies space and prevents the maximum possible component packing density. In addition, the formation of through holes at an intermediate stage of device production causes problems. For example, the presence of through-holes can complicate the application of a mold material for hermetically sealing the element die. The resin molding material to which the molding pressure is applied may leak to the opposite side of the structure through the through hole, although not intended.
[0006]
In addition, the fixtures used in the manufacture of discrete circuit components of different sizes must use different ones even when the structure is the same. Another set of fixtures must be prepared for discrete parts having the same structure but different physical sizes.
[0007]
[Problems to be solved by the invention]
Accordingly, an object of the present invention is to provide a discrete circuit component having a through-hole that has been stuffed at the manufacturing stage and a method for manufacturing the discrete circuit component, which are suitable for manufacturing a miniaturized discrete circuit component at low cost and high efficiency. Is to provide.
[0008]
Another object of the present invention is to provide a through-hole that is padded at the manufacturing stage, suitable for low cost and high efficiency manufacturing of discrete circuit components having the same structure but very different sizes. It is to provide a discrete circuit component having the same and a method for manufacturing the same.
[0009]
[Means for Solving the Problems]
To achieve the above and other objects, the present invention provides a method of manufacturing a discrete circuit component on a substrate, wherein the first surface of the substrate is separated from each other by the first and second. A plurality of die surface pattern set arrays each having a plurality of conductive sections are formed on the second surface of the substrate, correspondingly separated from each other. An array of a plurality of solder surface pattern sets, each having a conductive section, is formed, and plated through holes are provided for each of the first and second conductive sections of each of the die surface pattern sets. Electrically connecting each to the first and second conductive sections of a corresponding soldered surface pattern set, said method comprising: (a) applying a padding to said plated through-holes; (B) placing a circuit die on the first conductive section of each of the die surface pattern sets, electrically connecting a first electrode of the die to the second electrode of the die; Electrically connecting the second conductive section to the second conductive section of the same pattern set; (c) hermetically sealing the die and all die surface pattern sets on the first surface of the substrate And (d) physically removing each of the plurality of discrete circuit components by removing the padding of the plated through holes, cutting the hermetically sealed substrate, and individualizing the die. And a step of separating.
[0010]
According to the present invention, there is also provided a discrete circuit component having a through-hole that has been padded in the manufacturing stage, a die having a first surface and a second conductive section on a first surface thereof. A surface pattern set is formed, and on the opposite second surface is a soldered surface pattern set with first and second conductive sections formed and plated. A through hole electrically connects the first and second conductive sections of the die surface pattern set to the first and second conductive sections of the corresponding soldered surface pattern set, respectively. A circuit die securely mounted on the first conductive section of the die surface pattern set, the first electrode of the die being electrically connected thereto, Second A circuit die having a pole electrically connected to the second conductive section of the pattern set and the die and the die surface pattern set on the first surface of the substrate are hermetically sealed A discrete circuit component comprising: a hermetic sealing material;
[0011]
The above and other objects, features and advantages of the present invention will become apparent upon reference to the following detailed description of the preferred but non-limiting embodiments. This description will be given with reference to the accompanying drawings.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
1 to 9 of the accompanying drawings are diagrams showing discrete circuit components from various directions in several steps in the manufacturing method according to the preferred embodiment of the present invention. Each figure shows the structure of the structure on the way that the characteristic discrete circuit components according to the present invention are gradually constructed in each process step of the method of the present invention.
[0013]
FIG. 1 is a perspective view of a die surface of a substrate according to a preferred embodiment of the present invention. As shown in the figure, conductive pattern patterns 111, 112,..., 116 are formed on the entire die surface 110 of the element substrate 100, and these are formed by a large number of discrete circuit components manufactured in a batch. Functions as a basic support plate. Preferably, the shape patterns 111, 112,..., 116 that are conductive in these initial stages are prepared in hundreds on the entire surface of the die surface 110, and are typically arranged in a regular two-dimensional array. Is done.
[0014]
On the soldering surface of the substrate 100, an opposing arrangement corresponding to the arrangement of the patterns 111, 112,..., 116 on the die surface 110 is also formed. Such a pattern arrangement comprises a number of soldered surface conductive patterns 211, 212,. FIG. 2 is a perspective view of the soldering surface 210 of the substrate 100 of FIG. Note that the soldered surface patterns 211, 212,..., 214 are aligned in an array that is essentially a mirror image of the die surface array of the patterns 111, 112,. For example, the pattern 111 on the die surface array corresponds to the pattern 211 on the soldered surface array, the pattern 112 corresponds to the pattern 212, and so on. The correspondence of this conductive pattern between the array on the die surface and the soldering surface of the substrate 100 can be easily understood by imagining the situation in which the perspective view of FIG. 2 is turned over and superimposed on the substrate 100 of FIG. .
[0015]
As shown in FIG. 2, a plated through-hole (PTH) is formed substantially at the center of each soldered surface conductive pattern. As its name suggests, PTH penetrates the entire thickness of the substrate 100. For example, as shown in both FIGS. 1 and 2, the PTH 131 is formed with respect to the conductive pattern 111 on the die surface 110 of the substrate 100 and the conductive pattern 211 on the soldering surface 210. Similar PTH 132 is formed for patterns 112 and 212.
[0016]
3 and 4 show the details of the spatial interrelationship between the PTH and the corresponding pair of conductive patterns on the die surface and soldering surface of the device substrate. FIG. 3 shows a portion of the substrate of FIG. 1 and details the structure of the structure on the die surface of the substrate. FIG. 4 shows details of the cross section of the substrate 100. In all these figures, the overall rectangular area surrounded by the imaginary line boundary represents a substantial physical area for the structure of one discrete component, as will be described in more detail later in the description. . For example, as shown in FIG. 3, an imaginary line boundary 121 indicates the position of the body structure of one discrete circuit component to be constructed in accordance with the present disclosure. At the substantial center in the boundary 121, there is a part on which a circuit die is placed in order to construct the discrete circuit component, as indicated by another imaginary line 151. Site 151 is also the substantial center of this particular discrete circuit component built in region 121.
[0017]
As shown in the perspective view of FIG. 3, the conductive pattern formed on the die surface 110 of the substrate 100 as a whole is symmetrical along the longitudinal direction of the pattern itself (substantially horizontal in the figure). Note that it is shaped. However, in the preferred embodiment of the present invention, the patterns (111 and 112 in the figure) are generally symmetrical within the component plane area 121 along a direction perpendicular to its longitudinal axis.
[0018]
As shown in FIG. 3, two adjacent die surface patterns 111 and 112 are electrically separated patterns. In other words, all patterns on the die surface 110 of the substrate 100 are electrically independent patterns. The same is true for the soldered pattern. For example, each of the die surface patterns such as 111 and 112 shown in detail in FIG. 3 has a configuration with an extension of a linear conductive section that extends to the left rather than to the right of the central PTH. It can also be regarded as doing. In short, the right arm of the die surface pattern is longer than the left arm, as shown in the perspective view of FIG. This point is also shown in the cross-sectional view of FIG. In short, for example, in the case of the die surface pattern 111 shown in FIG. 3, the right arm of the pattern extends from the PTH 131 toward the component center that is the above-described die mounting portion 151.
[0019]
In the embodiment of the present invention shown in FIG. 3, the right arm of each die surface pattern, i.e., the left section shown in the figure, is an extension section. However, it will be apparent to those skilled in the art that other arrangements where the left arm is extended are also applicable.
[0020]
The cross-sectional view of FIG. 4 clearly shows that all the through holes are plated. As shown in the figure, for example, the surface of the walls of the through holes 131 and 132 can be used in a technique used for manufacturing sputtering, electroplating, and other printed circuit boards (PCBs). Plating can be performed with a conductive material such as a metal by processing such as means. Plated metal materials, compounds, and alloys thereof provide a reliable and stable conductive path between corresponding pattern pairs on the die surface 110 and soldering surface 210 of the substrate 100.
[0021]
The element substrate 100 shown in the perspective views of FIGS. 1 and 2 as a whole functions as a temporary base for batch production of a large number of discrete circuit components. The substrate 100, which is an electrically insulating carrier, can be composed of, for example, a fiber-reinforced plastic (FRP) plate or molded with a resin-based material. The die surface pattern and the soldering surface pattern can be formed, for example, by covering with a layer of copper foil using a technique such as photolithography.
[0022]
The plated through-holes are first drilled into the substrate at the assigned location on the substrate by an NC process using a suitable NC machine tool, and then plated by sputtering or electroplating to produce the FIG. It can be formed as detailed in the perspective view. The result obtained is the substrate 100 shown in FIGS.
[0023]
After all the PTHs are formed on the element substrate, they are padded, that is, filled with materials. For the purposes of the present invention, the material used to pad the PTH shown in FIGS. 1 and 2 may be any material that has sufficient temperature resistance with respect to melting. The material used in filling the PTH must be able to withstand the processing temperature without losing its original function as a temporary filling after the PTH is padded and cured at room temperature. However, the stuffing material used must also be one that can be easily removed from all PTH after batch production of discrete parts is complete. Before or after physical separation into the form of all individual discrete parts, the padding material must be removed by means of water, organic solvents, heating, etc. to restore all PTH openings.
[0024]
The element substrate 100 of FIGS. 3 and 4 is shown in such a state that the padding is applied. The substrate 100 of FIG. 4 is in a state in which circuit dies for all discrete components to be manufactured at once can be placed. As shown in the cross-sectional view of FIG. 3, for each discrete component, one circuit die is placed in the assigned portion 151 in the component area 121. For example, the cross-sectional view of FIG. 5 shows a state in which a circuit die 511, which is a discrete circuit component, is placed on the die surface 110 of the substrate 100 and an electrical connection is formed between the die itself and its carrier. . If the circuit die 511 is placed, the die 511 is placed directly on the pattern 111A, so that the bottom electrode is electrically connected to the pattern 111A.
[0025]
The permanent connection between the circuit die 511 and the pattern 111A can be achieved, for example, by heating a solder material, such as a tin-based solder, previously formed on the surface of the die electrode, and a corresponding assigned area on the surface of the pattern 111A. It can be formed by soldering on (151 in FIG. 4).
[0026]
The electrical connection between the other, ie, the top, electrode of die 511 and the other pattern 112B can be made after the die 511 is firmly secured by electrical connection with the pattern 111A. In the embodiment shown in FIG. 5, for example, the jump wire 531 can be used to make electrical connection between the upper electrode of the die 511 and the pattern 112B.
[0027]
After completing the construction of FIG. 5, all necessary electrical connections are made from the circuit die to the corresponding remaining portion of the discrete component. Since all PTH still contains the padding, all circuit dies aligned on the assembly array on the die surface of the substrate can be hermetically sealed. FIG. 6 is a sectional view showing a state in which the circuit dies 511 and 512 of FIG. Such sealing can be performed by, for example, molding by pressing a molten resin-based material into a molding space formed at an appropriate height on the die surface 110 of the substrate 100. Note that the mold material may be the same as the material used to manufacture the substrate 100 itself.
[0028]
Thereafter, as shown in the cross-sectional view of FIG. 7, individual discrete components can be physically separated from the assembly array. Note that two adjacent parts along the longitudinal axis can be separated by cutting along a path through the center of the PTH. As shown, in order to separate part 711 of FIG. 7, it is necessary to separate at two cutting paths 741 and 742 through the centers of the two PTHs. Further, it is clear that removing at least two parts perpendicular to the cutting paths 741 and 742 is necessary to remove the part 711 from the assembly array.
[0029]
8 and 9 show the details of the structure of the discrete circuit component according to the present invention. Because the cut for physical separation of the discrete parts passes through the center of the PTH, there are relatively large exposed surfaces 131 and 132 at opposite ends along the longitudinal direction of the part 711. . Conductive surfaces 131 and 132 are inherently curved because they are themselves part of the corresponding PTH. They also stand substantially vertically from the soldering surface, which is the component soldering surface indicated by reference numerals 751 and 752 in FIGS. If the temporary filling material is removed, the space partially surrounded and recessed by the surfaces 131 and 132 functions as an effective space for sucking molten solder in the SMT operation when the component 711 is used in an electronic device. To do. Such solder sucking helps the part itself to automatically correct the alignment and to be located at an assigned site on the instrument PCB.
[0030]
【The invention's effect】
Within the scope of the discrete circuit components of the present invention, PTH is formed and plays an important role in the functionality of the component, but these were padded at an early stage of manufacturing the component of the present invention. Accordingly, these are equivalent to substantially not existing in the subsequent component manufacturing process. In other words, the entire space above the element substrate for batch production of discrete circuit components can be completely utilized for component miniaturization. Therefore, the discrete circuit component of the present invention is particularly suitable for miniaturized discrete circuit components, in particular, small devices with dimensions 0603 and 0402, and smaller devices that are not defined in the industry at this stage. Yes.
[0031]
Further, since the padding is applied to the PTH at the initial stage of manufacturing the parts, and the padding is not removed until the individual parts are physically separated from each other or after the separation, the discrete circuit of the present invention is used. Parts have at least one other great advantage. Since the entire element substrate is effectively a single plate with no holes, it can be handled with standardized processing for large single plates even when manufacturing parts with the same configuration but different physical sizes. Therefore, necessary fixtures and tools can be integrated for parts of different sizes. Such integration can directly achieve cost reduction and efficiency gains in the manufacture of the entire circuit component series with the same configuration but different physical sizes.
[0032]
Although specific examples of the present invention have been described in detail above, various modifications, alternative configurations, and equivalent configurations may be used. Also, in the above description of the description of the preferred embodiment of the present invention, only the general and broad term “discrete circuit component” was used, but for any discrete component of the SMT type that complies with the EIA standard. It will be apparent to those skilled in the art that the present invention can be applied in practice. Examples of these include discrete elements such as Zener diodes and Schottky diodes, polar or nonpolar individual capacitor elements, individual resistance elements, certain active elements such as transistors having more than two lead wires, However, it is not limited to these. Furthermore, the present invention is not only applicable to the 1210, 1206, and 0805 dimensions commonly used as EIA standard parts, but is also applicable to smaller dimensions not defined in the EIA standard. . Indeed, the present invention is particularly suitable for miniaturized SMT elements. The die surface pattern and the soldering surface pattern can be formed by curing a silver paste, a copper paste, or a paste of such a metal alloy. This pattern may be further coated with nickel, gold, and / or other metals. Therefore, the above description and illustrations should not be taken as limiting the scope of the invention which is defined in the appended claims.
[Brief description of the drawings]
FIG. 1 is a perspective view of a die surface of a substrate according to a preferred embodiment of the present invention.
FIG. 2 is a perspective view of a soldering surface of the substrate of FIG.
3 is a diagram of a portion of the substrate of FIG. 1, showing details of the configuration of the die surface of the substrate.
4 is a cross-sectional view of the substrate shown in FIGS. 1 and 2. FIG.
FIG. 5 is a cross-sectional view showing a state in which an element die of a discrete circuit component is placed on a substrate and an electrical connection is formed between them.
6 is a cross-sectional view showing a state where the element die of FIG. 5 is hermetically sealed using a sealing material.
FIG. 7 is a cross-sectional view showing a state in which discrete circuit components are physically separated from the assembly substrate.
FIG. 8 is a perspective view showing details of the structure of a discrete circuit component according to the present invention.
FIG. 9 is a perspective view showing details of the structure of a discrete circuit component according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 100 Element substrate 110 Die surface 111,112, Shape pattern 121 Component area 131 Through-hole 151 Die mounting part 210 Surface 211,212, Surface conductive pattern 511 Circuit die 531 Jump electric wire 600 Sealing material 711 Component 741 Cutting path

Claims (5)

A method of manufacturing a discrete circuit component on a substrate, comprising: a plurality of die surface pattern sets each having first and second conductive sections separated from each other on a first surface of the substrate; A plurality of solder surface pattern sets each having an array and correspondingly provided on the second surface of the substrate, each having first and second conductive sections separated from each other; An array is formed and plated through holes connect each of the first and second conductive sections of each of the die surface pattern sets to the first and second of the corresponding soldered surface pattern sets. Electrically connected to each of the conductive compartments, the method comprising:
(A) applying padding to the plated through holes;
(B) placing a circuit die on the first conductive section of each of the die surface pattern sets, electrically connecting a first electrode of the die to the second electrode of the die; Electrically connecting to the second conductive section of the same pattern set;
(C) hermetically sealing the die and all die surface pattern sets on the first surface of the substrate;
(D) physically separating each of the plurality of discrete circuit components by removing the plated through-hole filling, cutting the hermetically sealed substrate and individualizing the die; ,
A method comprising: A method of manufacturing a discrete circuit component according to claim 1, wherein the circuit die comprises a diode die, a transistor die, a capacitor die, a resistance die, and active and passive circuit component dies. A method characterized in that it is one of a group consisting of: A method of manufacturing a discrete circuit component comprising:
(A) forming an array of a plurality of die surface pattern sets each comprising at least two conductive sections on the first surface of the substrate;
(B) Correspondingly, an array of a plurality of soldered surface pattern sets each comprising at least two conductive sections is formed on the second surface of the substrate, and further, plated through holes are formed. Using the first, second, following conductive sections of the at least two conductive sections of each of the die surface pattern sets, the first of the at least two conductive sections of the corresponding soldered surface pattern set. Electrically connecting to the second, following conductive compartments respectively;
(C) padding the plated through-holes;
(D) placing a circuit die for the component on the first conductive section of each of the die surface pattern sets, electrically connecting the first electrode of the die to the die, Electrically connecting the second and lower electrodes to the second and lower conductive sections of the same die surface pattern set, respectively.
(E) hermetically sealing the die and all die surface pattern sets on the first surface of the substrate;
(F) physically removing each of the plurality of discrete circuit components by removing the padding of the plated through-holes, cutting the hermetically sealed substrate and individualizing the die; ,
A method comprising: A discrete circuit component having a through-hole stuffed at the manufacturing stage,
A die surface pattern set having first and second conductive sections is formed on a first surface of the substrate, and on the opposite second surface, first and second surfaces are formed. A soldered surface pattern set having a second conductive section is formed, and a plated through hole corresponds to each of the first and second conductive sections of the die surface pattern set. A substrate electrically connected to each of the first and second conductive sections of the attachment surface pattern set;
A circuit die having first and second electrodes, wherein the first electrode of the die is electrically connected to the first conductive section of the die surface pattern set; A circuit die electrically connected to the second conductive section of the die surface pattern set;
An airtight sealing material hermetically sealing the die and the die surface pattern set on the first surface of the substrate;
Discrete circuit parts equipped with. A discrete circuit component having a through-hole stuffed at the manufacturing stage,
A die surface pattern set having at least first and second conductive sections is formed on a first surface of the substrate, and at least a second surface on the opposite side is at least a first surface. Forming a soldered surface pattern set with first and second conductive sections, wherein one plated through-hole of the first, second and following conductive sections of the die surface pattern set; A substrate electrically connecting each to the first, second, and following conductive sections of the corresponding soldered surface pattern set;
A circuit die having at least a first and a second electrode, wherein the first electrode of the die is electrically connected to the first conductive section of the die surface pattern set; A circuit die having two or fewer electrodes electrically connected to the second or smaller conductive section of the die surface pattern set;
An airtight sealing material hermetically sealing the die and the die surface pattern set on the first surface of the substrate;
Discrete circuit parts equipped with.

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