JP2004511754A5 - - Google Patents

Download PDF

Info

Publication number
JP2004511754A5
JP2004511754A5 JP2001586479A JP2001586479A JP2004511754A5 JP 2004511754 A5 JP2004511754 A5 JP 2004511754A5 JP 2001586479 A JP2001586479 A JP 2001586479A JP 2001586479 A JP2001586479 A JP 2001586479A JP 2004511754 A5 JP2004511754 A5 JP 2004511754A5
Authority
JP
Japan
Prior art keywords
fluid
reservoir
temperature
heat exchanger
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001586479A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004511754A (ja
Filing date
Publication date
Priority claimed from US09/574,784 external-priority patent/US6412551B1/en
Application filed filed Critical
Publication of JP2004511754A publication Critical patent/JP2004511754A/ja
Publication of JP2004511754A5 publication Critical patent/JP2004511754A5/ja
Pending legal-status Critical Current

Links

JP2001586479A 2000-05-19 2001-04-30 Ｉｃチップのための熱交換器への流体温度および熱交換器からの流体温度の関数として、ｉｃチップの温度を加熱および冷却される流体で調整するためのシステム Pending JP2004511754A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/574,784 US6412551B1 (en) 2000-05-19 2000-05-19 System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chips
PCT/US2001/013718 WO2001090766A2 (en) 2000-05-19 2001-04-30 System for regulating the temperature of ic-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the ic-chips

Publications (2)

Publication Number Publication Date
JP2004511754A JP2004511754A (ja) 2004-04-15
JP2004511754A5 true JP2004511754A5 (enExample) 2005-01-27

Family

ID=24297626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001586479A Pending JP2004511754A (ja) 2000-05-19 2001-04-30 Ｉｃチップのための熱交換器への流体温度および熱交換器からの流体温度の関数として、ｉｃチップの温度を加熱および冷却される流体で調整するためのシステム

Country Status (5)

Country Link
US (1) US6412551B1 (enExample)
EP (1) EP1282828B1 (enExample)
JP (1) JP2004511754A (enExample)
DE (1) DE60100904D1 (enExample)
WO (1) WO2001090766A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6856037B2 (en) * 2001-11-26 2005-02-15 Sony Corporation Method and apparatus for converting dissipated heat to work energy
US6658736B1 (en) * 2002-08-09 2003-12-09 Unisys Corporation Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent
US7832461B2 (en) * 2006-04-28 2010-11-16 Hewlett-Packard Development Company, L.P. Cooling systems and methods
US7349213B2 (en) * 2006-06-29 2008-03-25 International Business Machines Corporation Coolant control unit, and cooled electronics system and method employing the same
CN101495819B (zh) * 2007-07-30 2011-08-17 株式会社爱德万测试 电子设备热控制装置
TW201249029A (en) * 2011-05-20 2012-12-01 Hon Hai Prec Ind Co Ltd Controller IC adapter tool
CN102339655B (zh) * 2011-08-30 2015-07-08 中国科学院微电子研究所 温控可充气真空辐射设备
WO2016138156A1 (en) * 2015-02-24 2016-09-01 Sustainable Energy Solutions, Llc Methods of dynamically exchanging heat and systems and devices related thereto
JP2022166632A (ja) * 2021-04-21 2022-11-02 Smc株式会社 温調装置
KR102458920B1 (ko) * 2022-02-21 2022-10-25 삼성전자주식회사 유체 공급 장치

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5237345Y2 (enExample) * 1973-03-23 1977-08-25
US4060997A (en) * 1976-03-31 1977-12-06 Application Engineering Corporation Water chiller control
US4495777A (en) * 1983-01-10 1985-01-29 Babington Thomas G Load shaving system
US5174364A (en) * 1988-09-21 1992-12-29 Nec Corporation Cooling abnormality detection system for electronic equipment
DE68922061T2 (de) * 1988-10-03 1995-08-31 Canon Kk Vorrichtung zum Regeln der Temperatur.
JP2691454B2 (ja) * 1989-07-31 1997-12-17 キヤノン株式会社 温度制御装置
JP2937406B2 (ja) * 1990-04-26 1999-08-23 甲府日本電気株式会社 冷却装置
JP2852152B2 (ja) * 1992-02-06 1999-01-27 甲府日本電気株式会社 電子装置の冷却装置
JPH05288801A (ja) * 1992-04-13 1993-11-05 Sumitomo Electric Ind Ltd 温度特性試験装置
US5266778A (en) * 1992-05-29 1993-11-30 Hollister, Inc. Dynamic temperature control for use with a heating and/or cooling system including at least one temperature sensor
US5435379A (en) * 1992-08-14 1995-07-25 Texas Instruments Incorporated Method and apparatus for low-temperature semiconductor processing
US5395451A (en) * 1993-05-26 1995-03-07 Schmidt-Bretten, Inc. Paint temperature control system
JP3343575B2 (ja) * 1993-11-30 2002-11-11 オリオン機械株式会社 液体冷却装置の液温制御装置
US5400609A (en) * 1994-01-14 1995-03-28 Thermo King Corporation Methods and apparatus for operating a refrigeration system characterized by controlling maximum operating pressure
JP3660369B2 (ja) * 1994-05-17 2005-06-15 オリオン機械株式会社 恒温槽の液体温度調節装置
US5977785A (en) * 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
JP3329663B2 (ja) * 1996-06-21 2002-09-30 株式会社日立製作所 電子装置用冷却装置
JP3328664B2 (ja) * 1998-06-02 2002-09-30 東京エレクトロン株式会社 多段容器の温度管理装置

Similar Documents

Publication Publication Date Title
US8844612B2 (en) Thermal controller for electronic devices
JP2004511754A5 (enExample)
EP1637709A3 (en) Exchanging device for motor vehicles
WO2001052323A3 (en) Thermal joint and method of use
WO2005003503A3 (en) Method and apparatus for managing the temperature of thermal components
van der Broeck et al. A thermal modeling methodology for power semiconductor modules
JP2005511122A5 (enExample)
EP2253893A3 (en) Heat exchanger
TW200907655A (en) Heat sink detecting method
WO2001090834A3 (en) System for regulating the temperature of ic-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater
CN107238230A (zh) 一种双温区半导体恒温装置
WO2001090766A3 (en) System for regulating the temperature of ic-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the ic-chips
JP3164692U (ja) 内燃機関の燃料消費率測定装置
TWI299249B (en) Fan device
JP7217401B2 (ja) 発熱量測定方法および発熱量測定装置
JP7065308B2 (ja) 発熱量測定方法および発熱量測定装置
US10887947B2 (en) Transistor implemented heat source
CN207557794U (zh) 用于发动机零部件试验的智能水温控制系统
CN112964108A (zh) 基于在轨相变储能及冷热掺混的瞬时大功率控温系统
JP2000131379A (ja) 電子部品の熱抵抗の測定方法、および測定システム
CN223552038U (zh) 一种基于pwm占空比控制的量热式流量传感器恒温控制电路
JP2000266610A (ja) ソレノイド温度推定装置
CN215729454U (zh) 一种温控装置
RU2002105043A (ru) Способ контроля качества изготовления терморегулятора прямого действия и устройство для осуществления его
JP3454886B2 (ja) 流体の恒温方法及びその装置