JP2004502535A5 - - Google Patents

Download PDF

Info

Publication number
JP2004502535A5
JP2004502535A5 JP2002508580A JP2002508580A JP2004502535A5 JP 2004502535 A5 JP2004502535 A5 JP 2004502535A5 JP 2002508580 A JP2002508580 A JP 2002508580A JP 2002508580 A JP2002508580 A JP 2002508580A JP 2004502535 A5 JP2004502535 A5 JP 2004502535A5
Authority
JP
Japan
Prior art keywords
substrate
composition
dielectric
cured
precursor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002508580A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004502535A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2001/021927 external-priority patent/WO2002004134A1/en
Publication of JP2004502535A publication Critical patent/JP2004502535A/ja
Publication of JP2004502535A5 publication Critical patent/JP2004502535A5/ja
Pending legal-status Critical Current

Links

JP2002508580A 2000-07-12 2001-07-11 マイクロエレクトロニックデバイスへの組込みに好適な低誘電率誘電体膜を形成する熱処理システムおよび方法 Pending JP2004502535A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61474600A 2000-07-12 2000-07-12
PCT/US2001/021927 WO2002004134A1 (en) 2000-07-12 2001-07-11 Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices

Publications (2)

Publication Number Publication Date
JP2004502535A JP2004502535A (ja) 2004-01-29
JP2004502535A5 true JP2004502535A5 (enExample) 2005-02-03

Family

ID=24462539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002508580A Pending JP2004502535A (ja) 2000-07-12 2001-07-11 マイクロエレクトロニックデバイスへの組込みに好適な低誘電率誘電体膜を形成する熱処理システムおよび方法

Country Status (2)

Country Link
JP (1) JP2004502535A (enExample)
AU (1) AU2001270314A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102683249B (zh) * 2008-05-09 2015-06-17 泰尔Fsi公司 用于处理微电子工件的系统
KR102721924B1 (ko) * 2021-07-12 2024-10-24 시바우라 메카트로닉스 가부시끼가이샤 유기막 형성 장치 및 유기막의 제조 방법

Similar Documents

Publication Publication Date Title
US4518848A (en) Apparatus for baking resist on semiconductor wafers
TWI456631B (zh) 溫度控制離子植入技術
US20140103030A1 (en) Apparatus and method for heat treatment of coatings on subtrates
CN105895524A (zh) 一种热板加热装置及控制方法
JP2004502535A5 (enExample)
ATE342929T1 (de) Planarisierte mikroelektronik-substrate
CN1922925A (zh) 热传递相适配的层状加热器系统
JP2001012848A (ja) 板状製品のペースト乾燥方法
CA2432102A1 (en) Apparatus and related method for rapid cure of sol-gel coatings
EP0456829A1 (en) Heat-treatment device and method of drying functional thin film using said device
JP3062719B2 (ja) 耐熱プレコート金属板の焼付炉及び焼付方法
KR0161872B1 (ko) 에스오지 건조용 가열로
JP2003304671A (ja) コイル巻装体含浸樹脂硬化方法
KR100515040B1 (ko) 열처리 장치
JPS6324628A (ja) 半導体装置の製造方法および製造装置
CN114641145A (zh) 一种线路板及其线路板阻焊层的制作方法
CN219400920U (zh) 厚膜用吸附性热板
JP3067177B2 (ja) 回転塗布装置
KR100522745B1 (ko) 수평식 에나멜 오븐 장치
JP4217103B2 (ja) 熱処理方法及び熱処理装置
CN1692478A (zh) 绝缘膜的形成方法
JPH0929167A (ja) 塗布液の塗布・硬化方法、カラーフィルタの製造方法およびこれらの装置
KR100400468B1 (ko) 플랫 컬러 디스플레이 튜브의 코팅막 소성방법
JP2002319473A (ja) 加熱炉
JP2006164905A (ja) 有機ｅｌ表示装置を製造するための塗布装置