JP2004356549A - Manufacturing method of printed wiring board, and same board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize a printed wiring board having an excellent moisture resistance, by simple processes. <P>SOLUTION: The manufacturing method of the printed wiring board has a process for laminating at least a first solder resist 4 of an organic-substance-based insulation material and a second solder resist 5 of an inorganic-substance-based insulation material on a wiring board having at least first and second electrodes 3a, 3b, a process for mounting a first circuit component 7 on the first electrodes 3a, a process for coating then the second electrodes 3b and the peripheral edge portions thereof with a sealing resin composition 8 having a flux function whose cure promoting temperature is not lower than its preliminarily heating temperature and not higher than its heating temperature, a process for so mounting then a second circuit component 9 on the second electrodes 3b as to perform thereafter a heat treatment, and a process for performing collectively by the heat treatment the solder joining of the first electrodes 3a to the first circuit component 7, the solder joining of the second electrodes 3b to the second circuit component 9, and the resin sealing of the sealing resin composition 8. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a printed wiring board on which electronic circuit components are mounted and a printed wiring board, and more particularly, to a method for manufacturing a printed wiring board for preventing a reduction in connection reliability between an electrode and a circuit component caused by reflow heating. The present invention relates to a method and a printed wiring board.
[0002]
[Prior art]
Generally, the surface layer of a printed wiring board is coated with a heat-resistant coating material called a solder resist for the purpose of insulation and protection except for necessary parts such as electrodes. As a material of the solder resist, an organic insulating material such as resin or polyimide is often used.
[0003]
However, since these have hygroscopicity, they have a bad influence on mounting on a printed wiring board having fine wiring. That is, there is a possibility that so-called migration may occur, in which metal ions of the printed wiring board migrate due to moisture, and a portion that should be insulated is conducted. In addition, when underfill is performed to reinforce the solder joint, if a solder resist having poor moisture resistance is used, bubbles (voids) due to water vapor or the like are easily generated in the underfill, and the underfill is mounted on an electrode of a printed wiring board. There is also a problem that the connection strength with the circuit component is reduced.
[0004]
Conventionally, to solve such a problem, there is a method of using a glass thin film deposited by a chemical reaction as a solder resist material in order to secure moisture resistance (for example, Patent Document 1).
[0005]
[Patent Document 1]
JP 2001-168500 A (page 4, FIG. 2)
[0006]
[Problems to be solved by the invention]
With the demand for higher performance of electronic devices, improvement of heat resistance and moisture resistance of wiring boards used therein has been more strongly required. However, a printed wiring board on which a glass thin film is deposited as a solder resist as disclosed in Patent Literature 1 requires a number of steps to deposit the glass thin film itself. There is a problem that complicated work is required as compared with the existing method using a system insulating material.
[0007]
In view of the above, the present invention has been made to solve the above-described problem, and provides a method of manufacturing a printed wiring board and a printed wiring board capable of realizing a printed wiring board excellent in moisture resistance and mounting quality in a simple process. The purpose is to:
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a method of manufacturing a printed wiring board according to the present invention has at least a first electrode and a second electrode, and at least a part of an upper portion of the first electrode and the second electrode Laminating a first solder resist, which is an organic insulating material, on a wiring board excluding the peripheral portion thereof, and a peripheral portion of the second electrode except for at least a part of an upper portion of the second electrode. Laminating a second solder resist that is an inorganic insulating material on the first electrode, and mounting a first circuit component via a solder paste on at least a part of an upper portion of the first electrode; A step of applying a sealing resin composition having a flux function and having a curing acceleration temperature higher than a preheating temperature, and a heating temperature or lower on the second electrode and the second solder resist, The upper part of the second electrode A step of mounting a second circuit component having a solder bump electrode on at least a part thereof, and pre-heating the wiring board in the step at the pre-heating temperature for a predetermined time, and thereafter, the temperature is higher than the pre-heating temperature. Heating at a predetermined temperature at the heating temperature, solder bonding between the first electrode and the first circuit component, solder bonding between the second electrode and the second circuit component, and sealing A heat treatment step of performing resin sealing of the resin composition at a time.
[0009]
Further, the printed wiring board of the present invention has at least a first electrode and a second electrode, and is a wiring board excluding at least a part of an upper portion of the first electrode and the second electrode and a peripheral portion thereof. A first solder resist of an organic insulating material laminated thereon and an inorganic insulating material laminated on a peripheral portion of the second electrode except for at least a part of an upper portion of the second electrode; A second solder resist, a resin that is applied on the second electrode and the peripheral portion, has a flux function, is heat-treated for a predetermined time and is sealed, and is solder-bonded to the first electrode; It is characterized by having a first circuit component and a second circuit component having a solder bump electrode soldered to the second electrode.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
(First Embodiment)
Hereinafter, a method for manufacturing a printed wiring board according to the first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a diagram illustrating a manufacturing process of a method for manufacturing a printed wiring board according to the first embodiment. That is, the printed wiring board according to the first embodiment of the present invention is manufactured through two main steps, that is, a board manufacturing step and a component mounting step.
[0011]
The substrate manufacturing process is a process that includes a copper-clad laminate preparing process S0, a wiring pattern forming process S1, a first solder resist laminating process S2, and a second solder resist laminating process S3. On the other hand, the component mounting process includes a solder paste forming process S4, a first circuit component mounting process S5, a sealing resin applying process S6, a second circuit component mounting process S7, and a heating process S8. is there. Hereinafter, the shape of the printed wiring board manufactured in the copper clad laminate preparing step S0 to the heating step S8 will be described with reference to FIGS.
[0012]
First, in a copper clad laminate preparing step S0, a copper clad laminate 1 as shown in FIG. 2 is prepared. The copper-clad laminate 1 includes an insulating layer 2 and a wiring layer 3 laminated on the insulating layer 2.
[0013]
Next, in the wiring pattern forming step S1, as shown in FIG. 3, the printed wiring board 1A is created by printing the electrodes 3a, 3b and the wiring pattern 3c on the wiring layer 3 of the copper clad laminate 1. That is, in the wiring pattern forming step S1, the wiring layer 3 is etched to remove unnecessary portions, the first electrode 3a, the second electrode 3b, the wiring pattern 3c are formed, and the printed wiring board 1A is formed. I do.
[0014]
Next, in a first solder resist laminating step S2, as shown in FIG. 4, the first solder resist 4 is laminated on the printed wiring board 1A to form a printed wiring board 1B. That is, the first electrode opening 4a above the first electrode 3a, the second electrode 3b, and the second electrode opening 4b at the periphery thereof are set as masks by a method such as masking or punching. The first solder resist 4 is prepared, and the first solder resist 4 is laminated on the printed wiring board 1A to form the printed wiring board 1B.
[0015]
Here, the size of the second electrode opening 4b is such that not only the surface but also the side surface of the second electrode 3b is completely exposed, and the vertical size of the second circuit component 9 (see FIG. 9). It is preferably larger than the projected area in the direction.
[0016]
On the other hand, the first electrode opening 4a is for applying the solder paste 6 (see FIG. 6) used in the solder paste forming step S4 on the first electrode 3a. The size may be such that only at least a part of the surface of 3a is exposed.
[0017]
However, in the present embodiment, the material of the first solder resist 4 is an organic insulating material such as a resin or polyimide.
Next, in the second solder resist laminating step S3, as shown in FIG. 5, the second solder resist 5 is laminated on the second electrode opening 4b except for the surface of the second electrode 3b. Then, a baked printed wiring board 1C is prepared.
[0018]
That is, a second electrode opening 5b is provided in the second electrode 3b by a method such as masking or punching, and a second solder resist 5 having the same size as the second electrode opening 4b is prepared. Then, the second solder resist 5 is laminated on the second electrode opening 4b, and then baked at a temperature of 100 to 150 ° C. for about 1 hour.
[0019]
However, as a material of the second solder resist 5, for example, an inorganic insulating material such as ceramic is used. Further, the thickness is preferably about 10 to 50 μm.
Next, in the solder paste forming step S4, as shown in FIG. 6, the solder paste 6 is printed on the first electrode 3a to form a printed wiring board 1D.
The solder paste 6 is obtained by uniformly mixing a solder powder and a paste-like flux containing a solvent. Examples of the solder alloy that can be used in the present embodiment include a Sn-Pb alloy and a Sn-Ag alloy. And Sn-Zn-based alloys.
[0020]
The joining temperature of the solder paste 6 is lower than the temperature at which the thermosetting of the sealing resin composition 8 having a flux function used in the sealing resin coating step S6 (see FIG. 8) is completed, and the curing acceleration temperature. It is preferably equal to or less than.
[0021]
Furthermore, the joining temperature of the solder paste 6 may be higher or lower than the joining temperature of the solder bump electrode 9a of the second circuit component 9 (see FIG. 9) used in the second circuit component mounting step S7. , Are preferably substantially equal.
[0022]
However, the joining temperature of the solder paste 6 is higher than the preheating temperature Y1 (see FIG. 10) in the heating step S8 and lower than the peak temperature P1 (see FIG. 10).
Next, in the first circuit component mounting step S5, as shown in FIG. 7, the first circuit component 7 is mounted on the first electrode 3a via the solder paste 6 having an adhesive property, and printed wiring is performed. A board 1E is created.
[0023]
It is preferable that the first circuit component 7 is mounted by, for example, positioning with a component mounter or the like so as to be surely mounted on the first electrode 3a. The first circuit component 7 is preferably a small chip component, such as a resistor or a capacitor, which can secure the joining reliability only by soldering.
[0024]
However, in the first circuit component mounting step S5, the first circuit component 7 is only mounted on the first electrode 3a via the solder paste 6, and actual solder bonding is not performed. However, since the solder paste 6 has adhesiveness, the mounted first circuit component 7 can be fixed by the solder paste 6 until the first circuit component 7 is heated and joined in the heating step S8.
[0025]
Next, in the sealing resin application step S6, as shown in FIG. 8, a sealing resin composition having a flux function on the second electrode 3b and the second electrode opening 4b (see FIG. 4). 8 to form a printed wiring board 1G.
[0026]
Before mounting the second circuit component 9 (see FIG. 9) on the second electrode 3b in the second circuit component mounting step S7, the sealing resin composition 8 having the flux function is used. The resist 5 is applied from above.
[0027]
In addition, the sealing resin composition 8 having the flux function has a curing acceleration temperature higher than the preheating temperature, higher than the melting temperature of the solder paste 6 and the solder bump electrode 9a, and not higher than the heating peak temperature. Use one that can be cured. Thereby, the thermosetting of the sealing resin composition 8 having the flux function is promoted after the joining between the solder bump electrode 9a (see FIG. 9) and the second electrode 3b is completed.
[0028]
Therefore, the thermosetting of the sealing resin composition 8 having a flux function is not completed before the joining of the solder bump electrodes 9a, so that it is possible to prevent the solder bump electrodes 9a from being hindered from joining and from reducing connection reliability.
[0029]
Next, in the second circuit component mounting step S7, as shown in FIG. 9, the second circuit component 9 having the solder bump electrode 9a is mounted on the second electrode 3b to form the printed wiring board 1H. I do. In this mounting, it is preferable that the solder bump electrode 9a of the second circuit component 9 is mounted by, for example, positioning with a component mounter or the like so as to be surely mounted on the second electrode 3b.
[0030]
Here, the second circuit component 9 is, for example, a relatively large circuit component, such as a semiconductor integrated circuit component or a package component, whose connection strength needs to be ensured in addition to the solder joint. , The second circuit component 9.
[0031]
The joining temperature of the solder bump electrode 9a is lower than the upper limit of the curing acceleration temperature of the sealing resin composition 8 having a flux function, that is, the thermosetting completion temperature. The joining temperature may be higher than the lower limit of the curing acceleration temperature, but is preferably equal to or lower than the curing acceleration temperature.
[0032]
Next, a heating step S8 is performed as a final step. In this step, solder bonding between the first electrode 3a and the first circuit component 7, solder bonding between the second electrode 3b and the second circuit component 9, and the sealing resin composition 8 having a flux function Is heated in order to perform the sealing at once.
[0033]
This heating step S8 is performed in two processing steps, that is, a pre-heating treatment and a heating treatment, similarly to a general solder reflow temperature profile. That is, after performing the preliminary heating process, the temperature is further increased and the heating process is performed, so that not only the joining of the solder paste 6 but also the joining of the solder bump electrodes 9a and the thermosetting of the sealing resin composition 8 having a flux function. I do.
[0034]
The heating temperature in the heating step S8 will be described with reference to FIG.
FIG. 10 is a diagram showing temperature characteristics of the heating step S8. In FIG. 10, the vertical axis represents temperature, and the horizontal axis represents time. Y1 is the preheating temperature, P0 is the lower limit temperature for accelerating curing of the sealing resin composition 8 having a flux function, P1 is the peak temperature, T1 is the preheating temperature holding time, and T2 is the peak temperature holding time. Further, point A represents the end of the preheating temperature raising, point B represents the reflow heating temperature raising section, and hatched portion C represents the curing range.
[0035]
As a first step of the heating step S8, a preliminary heating process is performed on the printed wiring board manufactured in the steps S0 to S8 of FIG. The preheating process is performed at a preheating temperature Y1 and a preheating temperature holding time T1.
[0036]
By performing this preheating treatment, the thermal shock of the first circuit component 7 and the second circuit component 9 can be reduced. Further, most of the volatile material present in the solder paste 6 is removed by evaporation, and the solder is dried, so that the solder powder and the metal surface to be soldered can be cleaned to some extent.
[0037]
Further, by performing the preheating treatment, it is possible to prevent the rising phenomenon of the small chip component, for example, the Manhattan, Tombstone phenomenon, and the solder sucking phenomenon, for example, wicking.
[0038]
The preheating temperature Y1 is lower than the peak temperature P1 (for example, 140 to 175 ° C.), and the preheating holding time T1 is approximately 60 seconds or more.
As a second step of the heating step S8, heating is further performed to raise the temperature to the peak temperature P1 at a stretch.
Here, the solder paste 6 and the solder bump electrode 9a may have different junction temperature characteristics. However, since these joining temperatures are higher than the preheating temperature Y1 and lower than the peak temperature P1, the first electrode 3a and the first electrode 3a are not connected until the heating temperature reaches the peak temperature P1 from the preheating temperature Y1. And the second electrode 3b and the second circuit component 9 can be completed.
[0039]
Since the heating temperature passes through the curing acceleration lower limit temperature P0 of the sealing resin composition 8 having a flux function before the heating temperature reaches the peak temperature P1, the sealing having the flux function from this passing point. Curing of the resin composition 8 starts.
[0040]
As a final step of the heating step S8, a heating process is performed for the peak temperature holding time T2 while maintaining the peak temperature P1.
Here, as a specific example of the peak temperature P1 and the peak temperature holding time T2, when a Sn-Pb-based alloy solder having a melting temperature of 183 ° C. is used in the solder paste 6 and the solder bump electrode 9a, the peak temperature P1 is 200 It is set that the peak temperature holding time T2 is about 20 seconds to 60 seconds at about 230 ° C. to 230 ° C.
[0041]
By performing the heating step S8 including the preliminary heating treatment to the heating treatment, the curing of the sealing resin composition 8 having the flux function is completed.
The printed wiring board is completed through all the steps of the copper clad laminate preparing step S0 to the heating step S8 described above.
The following effects are obtained by using the manufacturing method according to the first embodiment of the present invention.
That is, the second electrode 3b on which the second circuit component 9 is mounted and the second solder resist 5, which is an inorganic insulating material having excellent moisture resistance, are laminated on the periphery thereof. Therefore, at least from the portion where the second solder resist 5 is laminated, no steam is generated even when heated. Therefore, when the second circuit component 9 is mounted, bubbles (voids) due to water vapor do not occur in the sealing resin composition 8 having a flux function. Further, since the second solder resist is an inorganic material, there is no generation of a gas peculiar to an organic material, which is generated when the organic material is heated, and no voids due to the gas are generated. Therefore, voids are less likely to be present in the sealing resin composition 8 having a flux function, and a decrease in the connection strength of the second circuit component 9 caused by the voids can be prevented. Therefore, an electronic component with high mounting reliability can be provided.
[0042]
On the other hand, the use of the sealing resin composition 8 having a flux function has the following effects. That is, since the thermosetting of the sealing resin composition 8 having the flux function does not progress during the preheating treatment, the first electrode 3a and the first circuit component 7 are soldered and the second electrode 3b And soldering of the second circuit component 9 and sealing of the second circuit component 9 using the sealing resin composition 8 having a flux function can be performed collectively. Therefore, it is not necessary to repeat the heat treatment for the resin sealing again, thereby eliminating the need for the cooling step, and making it possible to significantly reduce the cost. In addition, reducing the number of times of the heat treatment also avoids the problem of thermal stress due to the heat treatment, and can improve the life reliability of the first circuit component 7 and the second circuit component 9.
[0043]
Further, the heat treatment uses a general solder reflow temperature profile. Therefore, this can be realized by using a conventional solder reflow apparatus, and there is no need to provide new equipment for realizing the manufacturing method according to the present embodiment.
[0044]
(Second embodiment)
FIG. 11 is a diagram illustrating a manufacturing process of a method for manufacturing a printed wiring board according to the second embodiment. Regarding each part of the second embodiment, the same parts as those of the manufacturing process according to the first embodiment of FIG. 1 are denoted by the same reference numerals, and the description thereof will be omitted.
[0045]
The second embodiment is different from the first embodiment in that the first solder resist laminating step S2 of FIG. 1 is eliminated, and the solder resist laminating step S3 is replaced with the solder resist laminating step S3. The point is that the laminating step S3A is performed.
[0046]
That is, in the first embodiment, the second solder resist 5 is provided on the wiring board 1B except for the second electrode 3b of the printed wiring board 1B and the second electrode opening 4b on the periphery thereof. It was laminated. However, in the second embodiment, attention is paid to the insulating property of the second solder resist 5, and as shown in FIG. 12, one of the first electrode 3a and the second electrode 3b of the printed wiring board 1A is formed. The second solder resist 5 is laminated on the entire surface of the wiring board 1A except for the surface of the part, thereby forming a printed wiring board 1C2.
[0047]
In the second embodiment, other steps than the above are the same as those of the first embodiment, and the description thereof will be omitted. However, in the step of applying the sealing resin composition 8 having a flux function, at least a part of the upper portion of the second electrode 3b (that is, the second electrode opening 5b) and the peripheral portion of the second electrode 3b. Applied on top. The material of the sealing resin composition 8 is the same.
[0048]
According to the method for manufacturing a printed wiring board according to the second embodiment, no water vapor is generated from the portion where the second solder resist 5 is laminated even when heated. In addition, there is no generation of a gas peculiar to an organic material which is generated when the organic material is heated. Therefore, not only the connection reliability between the second circuit component 9 and the second electrode 3b is ensured, but also the connection reliability of the first circuit component 7 can be further improved. Other effects are the same as those of the first embodiment, and the description thereof is omitted.
[0049]
(Third embodiment)
FIG. 13 is a diagram illustrating a manufacturing process of a method for manufacturing a printed wiring board according to the third embodiment. Regarding each part of the third embodiment, the same parts as those of the manufacturing process according to the first embodiment of FIG. 1 are denoted by the same reference numerals, and the description thereof will be omitted.
[0050]
The third embodiment is different from the first embodiment in that the method of the first solder resist laminating step S2 and the second solder resist laminating step S3 of FIG. Is a solder resist laminating step S2B and a second solder resist laminating step S3B.
[0051]
That is, in the first embodiment, the second solder resist 5 uses the moisture resistance to secure the bonding reliability of the second circuit component mounted thereon. In the third embodiment, focusing on the moisture resistance of the second solder resist, as shown in FIG. 14, first, in the first solder resist laminating step S2B, the first electrode of the printed wiring board 1A is formed. The first solder resist 4 is laminated on the entire surface of the wiring board 1A except for the first electrode opening 4a of 3a and the second electrode opening 5b of the second electrode 3b. Then, in the second solder resist laminating step S3B, the second solder resist 5 is laminated on the first solder resist 4 at the peripheral portion of the second electrode 3b to form the printed wiring board 1C3. .
[0052]
Here, the second solder resist 5 has the same size as that used in the first embodiment and is laminated at the same position.
In the third embodiment, the other steps other than those described above and the effects obtained when the present embodiment is used are the same as those in the first embodiment, and a description thereof will be omitted. However, in the step of applying the sealing resin composition 8 having a flux function, at least a part of the upper part of the second electrode 3b (that is, the second electrode opening 5b) and the upper part of the second solder resist 5 Applied to. The material of the sealing resin composition 8 is the same.
[0053]
(Fourth embodiment)
FIG. 15 is a diagram illustrating a manufacturing process of a method for manufacturing a printed wiring board according to the fourth embodiment. Regarding each part of the fourth embodiment, the same parts as those of the manufacturing process according to the first embodiment of FIG. 1 are denoted by the same reference numerals, and the description thereof will be omitted.
[0054]
The fourth embodiment is different from the first embodiment in that the first solder resist lamination step S2 and the second solder resist lamination step S3 in FIG. This is different from the solder resist laminating step S2C of the first embodiment and the second solder resist laminating step S3C.
[0055]
That is, in the first embodiment, the second solder resist 5 uses the moisture resistance to secure the bonding reliability of the second circuit component mounted thereon. In the fourth embodiment, focusing on the moisture resistance of the second solder resist 5, as shown in FIG. 16, first, in the first solder resist laminating step S2C, the first solder resist 5 The first solder resist 4 is laminated on the entire surface of the wiring board 1A except for the first electrode opening 4a of the electrode 3a and the second electrode opening 5b of the second electrode 3b. Then, in the next second solder resist laminating step S3C, the second solder resist 5 is laminated on the entire surface of the first solder resist 4 laminated in the above step S2C to form a printed wiring board 1C4. Therefore, the surfaces of the first electrode 3a and the second electrode 3b of the printed wiring board 1C4 are exposed.
[0056]
In the fourth embodiment, other steps than those described above are the same as those in the first embodiment, and thus the description thereof will be omitted. However, in the step of applying the sealing resin composition 8 having a flux function, at least a part of the upper part of the second electrode (that is, the second electrode opening 5b) and the peripheral part of the second electrode 3b are formed. It is applied on the second solder resist 5. The material of the sealing resin composition 8 is the same.
[0057]
According to the method for manufacturing a printed wiring board according to the fourth embodiment, no water vapor is generated from the portion where the second solder resist 5 is laminated even when heated. In addition, there is no generation of a gas peculiar to an organic material which is generated when the organic material is heated. Therefore, not only the connection reliability between the second circuit component 9 and the second electrode 3b is ensured, but also the connection reliability of the first circuit component 7 can be further improved.
[0058]
The other effects are the same as those of the first embodiment, and the description is omitted.
Next, the sealing resin composition 8 having a flux function used in the sealing resin application step (S6 in FIG. 1, FIG. 8) will be described.
That is, the sealing resin composition 8 having the flux function is made of a thermosetting resin composition, and preferably contains a thermosetting resin and a flux component. Examples of the thermosetting resin used include an epoxy resin, a silicone resin, a urethane resin, and a phenoxy resin. An epoxy resin is preferable in consideration of heat resistance, workability, adhesiveness, and the like.
[0059]
Examples of the epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, o-cresol novolak epoxy resin, triphenolmethane epoxy resin, dicyclopentadiene epoxy resin, and terpene epoxy resin. Is mentioned.
[0060]
Examples of the flux component include an acid flux, a rosin flux, and an organic carboxylic acid compound. The content of the flux component is preferably 0.5 to 30% by weight based on 100 parts by weight of the thermosetting resin.
[0061]
Further, a curing agent can be added to the sealing resin composition 8 having a flux function as needed. Examples of such a curing agent include phenol aralkyl resins, phenol novolak resins, phenol resins, acid anhydrides such as methylhexahydrophthalic anhydride, and amine curing agents such as dicyanamide.
[0062]
More preferably, the curing agent has a reducing action, for example, has a hydroxyl group. The content of the curing agent is preferably 5 to 20 parts by weight in the case of a solid and 10 to 50 parts by weight in the case of a liquid with respect to 100 parts by weight of the thermosetting resin.
[0063]
The curing acceleration temperature of the sealing resin composition 8 having a flux function can be appropriately adjusted by changing the composition of the thermosetting resin composition. For example, when an Sn—Pb-based alloy solder having a melting temperature of 183 ° C. is used in the solder paste 6 and the solder bump electrode 9a, the curing acceleration temperature can be set to 190 ° C. to 220 ° C.
[0064]
The sealing resin composition 8 having a preferable flux function has a viscosity of 1 Pa · S to 30 Pa · S at room temperature. If the viscosity at room temperature is less than 1 Pa · S, there is a tendency that too much wet spread occurs, and if it exceeds 30 Pa · S, there is a tendency that air is involved and voids are generated.
[0065]
Further, as the sealing resin composition 8 having a preferable flux function, a thermosetting resin composition having a viscosity of more than 10 Pa · S and a viscosity of 30 Pa · S or less at a temperature not lower than the preheating temperature and not higher than the curing acceleration temperature is used. can do.
[0066]
【The invention's effect】
According to the present invention, there is provided a printed wiring board having high connection reliability and high life reliability, since a reduction in connection strength caused by the presence of voids can be prevented and a problem of thermal stress due to heat treatment can be avoided. it can. Further, since the soldering and the resin sealing can be performed together, a cooling step is not required, and a significant cost reduction can be realized.
[Brief description of the drawings]
FIG. 1 is a view showing a manufacturing process of a method for manufacturing a printed wiring board according to a first embodiment of the present invention.
FIG. 2 is a diagram showing a shape of a printed wiring board in a copper clad laminate preparing step in the first embodiment.
FIG. 3 is a view showing a shape of a printed wiring board in a wiring pattern forming step according to the first embodiment;
FIG. 4 is a view showing a shape of a printed wiring board in a first solder resist laminating step according to the first embodiment;
FIG. 5 is a view showing a shape of a printed wiring board in a second solder resist laminating step in the first embodiment.
FIG. 6 is a view showing a shape of a printed wiring board in a solder paste forming step in the first embodiment.
FIG. 7 is a view showing the shape of a printed wiring board in a first circuit component mounting step according to the first embodiment;
FIG. 8 is a diagram showing a shape of a printed wiring board in a sealing resin applying step according to the first embodiment.
FIG. 9 is a view showing the shape of a printed wiring board in a second circuit component mounting step according to the first embodiment.
FIG. 10 is a diagram showing temperature characteristics of a heating step in the first embodiment.
FIG. 11 is a view showing a manufacturing process of a method for manufacturing a printed wiring board according to the second embodiment of the present invention.
FIG. 12 is a view showing a shape of a printed wiring board in a solder resist laminating step according to the second embodiment.
FIG. 13 is a view showing a manufacturing process of a method for manufacturing a printed wiring board according to the third embodiment of the present invention.
FIG. 14 is a view showing a shape of a printed wiring board in a second solder resist laminating step in the third embodiment.
FIG. 15 is a view showing a manufacturing process of a method for manufacturing a printed wiring board according to a fourth embodiment of the present invention.
FIG. 16 is a view showing a shape of a printed wiring board in a second solder resist laminating step according to the fourth embodiment;
[Explanation of symbols]
1 Copper clad laminate
1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H Printed wiring board
2 Insulating layer
3 Wiring layer
3a first electrode
3b Second electrode
3c Wiring pattern
4 First solder resist
4a First electrode opening
4b Opening for second electrode
5 Second solder resist
5a First electrode opening
5b Opening for second electrode
6. Solder paste
7 First circuit components
8 Sealing resin composition having flux function
9 Second circuit components
9a Solder bump electrode

Claims (12)

A first electrode having an organic insulating material on at least a first electrode and a second electrode, and on at least a part of an upper portion of the first electrode and the wiring substrate except for the second electrode and a peripheral portion thereof; Laminating a solder resist,
Excluding at least a part of the upper portion of the second electrode, and laminating a second solder resist that is an inorganic insulating material on a peripheral portion of the second electrode;
Mounting a first circuit component on at least a part of an upper portion of the first electrode via a solder paste;
A step of applying a sealing resin composition having a flux function and having a curing acceleration temperature higher than a preheating temperature and a heating temperature or lower on the second electrode and the second solder resist,
Mounting a second circuit component having a solder bump electrode on at least a part of an upper portion of the second electrode;
The wiring board in the step is preheated at the preheating temperature for a certain time, and thereafter, is heated at the heating temperature higher than the preheating temperature for a certain time, and the first electrode and the first circuit component are heated. And a heat treatment step of collectively performing the solder bonding of the second electrode and the second circuit component and the resin sealing of the sealing resin composition. Manufacturing method of printed wiring board. 2. The method according to claim 1, wherein the size of the second solder resist is equal to an area of the second circuit component projected in a vertical direction. A step of laminating a solder resist, which is an inorganic insulating material, on a wiring board having at least a first electrode and a second electrode and excluding at least a part of an upper part of the first and second electrodes;
Mounting a first circuit component on at least a part of an upper portion of the first electrode via a solder paste;
A sealing resin composition having a flux function and a curing acceleration temperature higher than a preheating temperature and equal to or lower than a heating temperature on at least a part of an upper portion of the second electrode and a peripheral portion of the second electrode; Applying an object,
When a second circuit component having a solder bump electrode is mounted on at least a part of an upper portion of the second electrode,
The wiring board in the step is pre-heated at the pre-heating temperature for a certain time, and thereafter, is heated at the heating temperature higher than the pre-heating temperature for a certain time, so that the first electrode and the first circuit component are heated. A printed wiring, comprising: a soldering process; a soldering process of the second electrode and the second circuit component; and a heat treatment step of collectively performing resin sealing of the sealing resin composition. Plate manufacturing method. An organic insulating material is provided on the wiring substrate having at least a first electrode and a second electrode, and excluding at least a part of an upper part of the first electrode and at least a part of an upper part of the second electrode. Laminating a first solder resist;
Laminating a second solder resist, which is an inorganic insulating material, on the first solder resist at a peripheral portion of the second electrode except for at least a part of an upper portion of the second electrode;
Mounting a first circuit component on at least a part of an upper portion of the first electrode via a solder paste;
Applying a sealing resin composition having a flux function and having a curing acceleration temperature higher than a preheating temperature and equal to or lower than a heating temperature on at least a part of an upper portion of the second electrode and the second solder resist. The process of
Mounting a second circuit component having a solder bump electrode on at least a part of an upper portion of the second electrode;
The wiring board in the step is preheated at the preheating temperature for a certain time, and thereafter, is heated at the heating temperature higher than the preheating temperature for a certain time, and the first electrode and the first circuit component are heated. And a heat treatment step of collectively performing the solder bonding of the second electrode and the second circuit component and the resin sealing of the sealing resin composition. Manufacturing method of printed wiring board. An organic insulating material is provided on the wiring substrate having at least a first electrode and a second electrode, and excluding at least a part of an upper part of the first electrode and at least a part of an upper part of the second electrode. Laminating a first solder resist;
Laminating a second solder resist that is an inorganic insulating material on the first solder resist;
Mounting a first circuit component on at least a part of an upper portion of the first electrode via a solder paste;
A flux function is provided on at least a part of the upper portion of the second electrode and the second solder resist on the peripheral portion of the second electrode, and the curing acceleration temperature is higher than the preheating temperature, and is equal to or lower than the heating temperature. Applying a sealing resin composition which is
Mounting a second circuit component having a solder bump electrode on at least a part of an upper portion of the second electrode;
The wiring board in the step is preheated at the preheating temperature for a certain time, and thereafter, is heated at the heating temperature higher than the preheating temperature for a certain time, and the first electrode and the first circuit component are heated. And a heat treatment step of collectively performing the solder bonding of the second electrode and the second circuit component and the resin sealing of the sealing resin composition. Manufacturing method of printed wiring board. 4. The method according to claim 1, wherein the first circuit component is a chip component, and the second circuit component is a semiconductor integrated circuit component or a package component. An organic insulating material having at least a first electrode and a second electrode, wherein at least a part of an upper portion of the first electrode and the second electrode and a peripheral portion thereof are laminated on a wiring board excluding a peripheral portion thereof; A first solder resist,
A second solder resist of an inorganic insulating material laminated on a peripheral portion of the second electrode except for at least a part of an upper portion of the second electrode;
A resin that is applied on the second electrode and the peripheral portion, has a flux function, and is heat-treated for a predetermined time and sealed;
A first circuit component soldered to the first electrode;
A printed circuit board comprising: the second electrode; and a second circuit component having a solder bump electrode soldered thereto. Inorganic insulation having at least a first electrode and a second electrode, and laminated on a wiring board excluding at least a part of an upper part of the first electrode and at least a part of an upper part of the second electrode Material solder resist,
A resin that is applied on the second electrode and the peripheral portion thereof, has a flux function, and is heat-treated for a predetermined time and sealed;
A first circuit component soldered to at least a part of an upper portion of the first electrode;
A printed circuit board comprising: a second circuit component having a solder bump electrode soldered to at least a part of an upper portion of the second electrode. An organic insulating layer that has at least a first electrode and a second electrode, and is stacked on a wiring board except at least a part of an upper part of the first electrode and at least a part of an upper part of the second electrode; A first solder resist of the material;
A second solder resist of an inorganic insulating material laminated on the first solder resist at a peripheral portion of the first electrode except for at least a part of an upper portion of the first electrode;
A resin that is applied on the second electrode and the peripheral portion, has a flux function, and is heat-treated for a predetermined time and sealed;
A first circuit component soldered to at least a part of an upper portion of the first electrode;
A printed circuit board comprising: a second circuit component having a solder bump electrode soldered to at least a part of an upper portion of the second electrode. An organic insulating layer that has at least a first electrode and a second electrode, and is stacked on a wiring board except at least a part of an upper part of the first electrode and at least a part of an upper part of the second electrode; A first solder resist of the material;
A second solder resist made of an inorganic insulating material laminated on the first solder resist,
A resin that is applied on the second electrode and the peripheral portion thereof, has a flux function, and is heat-treated for a predetermined time and sealed;
A first circuit component soldered to at least a part of an upper portion of the first electrode;
A printed circuit board comprising: a second circuit component having a solder bump electrode soldered to at least a part of an upper portion of the second electrode. At the time of the heat treatment, the solder joint between the first electrode and the first circuit component, the solder joint between the second electrode and the second circuit component, and the sealing of the resin are collectively performed. The printed wiring board according to any one of claims 7 to 10, wherein The printed circuit board according to claim 7, wherein the first circuit component is a chip component, and the second circuit component is a semiconductor integrated circuit component or a package component.

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