JP2004356420A - Semiconductor device and substrate for mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of good yield having high degree of integration per unit area by stacking a plurality of highly reliable semiconductor chips that have cleared a final test after burn-in treatment. <P>SOLUTION: A semiconductor device 1 comprises a printed circuit board 10 having two principal planes 12 with a plurality of conductive shafts 14 being extended in a predetermined direction from at least one principal plane, and at least one substrate 30 for mounting a device on which a semiconductor chip 32 is mounted with a plurality of conductive through holes 34 being provided for passing the conductive shafts 14 therethrough, respectively. The printed circuit board 10 and the substrate 30 for mounting device are electrically connected through the conductive shafts 14 and the conductive through holes 34. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor device, and more particularly to a semiconductor device in which a printed wiring board and a device mounting substrate on which a semiconductor chip is mounted are stacked, and a device mounting substrate used for the same.
[0002]
[Prior art]
2. Description of the Related Art Recently, electronic devices such as small portable information electronic terminals (for example, mobile phones) have become increasingly sophisticated and miniaturized. As a result, semiconductor devices used in these electronic devices have become more sophisticated and functional. The demand for miniaturization is further increasing. To cope with this, a technique of arranging a plurality of semiconductor chips in one package (multi-chip package technique: hereinafter referred to as “MCP technique”) has been generally established.
[0003]
Although a semiconductor device based on a general MCP technique is not shown, a first semiconductor chip is mounted on a printed wiring board, and a second semiconductor chip is stacked on the first semiconductor chip. It is configured by resin molding so as to cover the semiconductor chip. Thus, the mounting area is reduced, and the degree of integration per unit area of the semiconductor device is improved.
[0004]
Still another MCP technology-based semiconductor device is similarly configured by stacking a plurality of semiconductor chips on a printed wiring board. Each semiconductor chip has a plurality of through holes formed in a straight line with respect to each other. And a conductive shaft penetrating through holes of the stacked semiconductor chips is provided. Thereby, the printed wiring board and each semiconductor chip are electrically connected (for example, see FIG. 1 of Patent Document 1 and FIG. 1 of Patent Document 2).
[0005]
[Patent Document 1]
JP 2001-127241 A
[Patent Document 2]
JP 2001-127242 A
[Problems to be solved by the invention]
However, a simple chip test is performed on a semiconductor chip used in a semiconductor device configured using these MCP techniques before the semiconductor chip is stacked on a printed wiring board. After the burn-in process in the state, a final test including various functional tests cannot be performed. Therefore, it is impossible to reliably perform an initial defect and perform a screening process for removing the defect. That is, in the semiconductor device based on the conventional MCP technology, the quality of each semiconductor chip cannot be determined until a plurality of semiconductor chips are stacked on a printed wiring board, packaged, and completed as a semiconductor device. Therefore, if such a semiconductor device includes at least one defective semiconductor chip, it becomes a defective product as a whole. Therefore, the semiconductor device must be discarded including other good semiconductor chips. As a result, when the number of semiconductor chips to be stacked is large, or when a semiconductor chip having a high initial failure rate is included, the yield of these semiconductor devices is significantly reduced, resulting in an increase in cost.
[0008]
Further, when semiconductor chips generating a large amount of heat during operation are stacked by using the above-described MCP technology, excessive heat may be applied to other semiconductor chips generating a small amount of heat to cause malfunction. Therefore, since there is a great risk of adversely affecting other semiconductor chips, it has not been possible to stack semiconductor chips having a large amount of heat in this way.
[0009]
Therefore, the semiconductor device of the present invention has a high reliability and a good yield while maintaining a high degree of integration per unit area by stacking a plurality of semiconductor chips that have been subjected to the final test after the burn-in process. The purpose is to provide.
[0010]
It is another object of the present invention to provide a semiconductor device in which semiconductor chips having a large amount of heat are similarly stacked to improve the degree of integration per unit area.
[0011]
[Means for Solving the Problems]
A semiconductor device according to the present invention has two main surfaces, a printed wiring board having a plurality of conductive shafts extending in a predetermined direction from at least one main surface, and a semiconductor chip mounted thereon, and the conductive shaft is penetrated. At least one device mounting board having a plurality of conductive through holes is provided, wherein the printed wiring board and the device mounting board are electrically connected via the conductive shaft and the conductive through holes. .
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a semiconductor device according to the present invention will be described with reference to the accompanying drawings. In the description of the embodiments, terms indicating directions (for example, “upward”, “downward”, “X direction”, “Y direction”, and “Z direction”) are used as appropriate to facilitate understanding. However, this is for explanation, and these terms do not limit the present invention.
[0013]
Embodiment 1 FIG.
Embodiment 1 according to the present invention will be described in detail below with reference to FIGS. The semiconductor device 1 according to the first embodiment shown in FIG. 1 generally includes a printed wiring board 10 and a device mounting board 30, and is mounted on conductive pads 51 of a motherboard 50.
[0014]
The printed wiring board 10 is made of an insulating material, and as shown in FIG. 2 (on the XZ plane) viewed from the line AA in FIG. 1, the main surfaces 12a and 12b facing each other, and one of them. A plurality of conductive shafts 14 extending substantially vertically upward (Z direction) from the main surface (upward surface) 12a and electrically connected to an external device such as a motherboard (main circuit board) not shown here. It has a plurality of input / output terminals 16. The conductive shaft 14 has a circular cross-sectional shape as shown in FIG. 1, but may have any cross-sectional shape corresponding to a through hole described later. The diameter and the number of the conductive shafts 14 also depend on the semiconductor device to be applied, and may be, for example, 4 to several hundreds with a diameter of 20 μm to 3 mm, and do not limit the present invention. On the other hand, the conductive shaft 14 can be formed using any conductive material, but is preferably harder than copper or solder, such as a steel material coated with a solder layer. The input / output terminal 16 may be a general lead frame as shown. Further, although not shown, any electronic components including a semiconductor chip are mounted on the printed wiring board 10.
[0015]
The device mounting board 30 is made of an insulating material. As shown in FIG. 3, in particular, the semiconductor chip 32 is provided in a substantially central area thereof, and a plurality of conductive through holes are provided at positions corresponding to the conductive shafts 14 of the printed wiring board 10. And a hole 34. Although not shown in detail, the semiconductor chip 32 can be mounted on the device mounting substrate 30 by wire bonding or a ball grid array. After mounting the semiconductor chip 32 on the device mounting board 30 of the present invention, a burn-in process is performed to surely cause initial defects, and such defects are screened by a final test including an arbitrary functional test. Therefore, according to the present invention, it is possible to obtain a highly reliable device mounting board 30 that has been subjected to the burn-in process and the final test.
[0016]
After the highly reliable device mounting board 30 thus obtained is arranged at a predetermined vertical (Z-direction) position on the printed wiring board 10 using, for example, an appropriate positioning jig, each conductive through-hole is formed. By electrically connecting the conductive shaft to the corresponding conductive shaft, the device mounting board 30 and the printed wiring board 10 are electrically connected. To facilitate this, as shown in the enlarged cross-sectional view of FIG. 4, a conductive bonding member such as a solder ball or a solder paste is placed on a wiring pattern 36 such as gold plating in each conductive through hole 34 of the device mounting board 30. Preferably, 38 is formed in advance. Thus, the conductive through hole 34 and the conductive shaft 14 can be easily electrically connected by the solder reflow process after the positioning. That is, the printed wiring board 10 and the device mounting board 30 are electrically connected via the conductive through hole 34 and the conductive shaft 14. Note that the cross-sectional shape of the through hole 34 has substantially the same cross-sectional shape as the conductive shaft 14 as described above.
[0017]
As described above, according to the semiconductor device 1 of the present invention, since the assembly is performed using the device mounting substrate 30 that has been subjected to the burn-in process and the final test, the yield is high, and a good semiconductor chip as in the prior art is obtained. Is less likely to be wasted, and production efficiency is improved and costs can be reduced.
[0018]
1 and 2, the device mounting board 30 is mounted on the printed wiring board 10 such that each conductive shaft 14 passes through the corresponding conductive through hole 34. The printed wiring board 10 and the device mounting board 30 may be arranged in a state of being separated from each other as shown in FIG. 2, or may be arranged in a state of being as close as possible as shown in FIG. When the operating heat of the semiconductor chip mounted on the device mounting board 30 is large and needs to be sufficiently cooled, or when the electronic components mounted on the printed wiring board 10 are bulky, as shown in FIG. It is preferable to arrange the printed wiring board 10 and the device mounting board 30 in a state where they are separated from each other. When the semiconductor device 1 is to be downsized even in the height direction, the semiconductor devices 1 are arranged close to each other as shown in FIG. In FIGS. 2 and 5, the semiconductor chip 32 is arranged on the upward main surface 31a of the device mounting substrate 30, but may be mounted on the downward main surface 31b.
[0019]
The device mounting board 30 of the present invention is burn-in so as to cover the entire main surface 31a as shown in FIG. 6A or after molding the molding resin 40 only for the semiconductor chip 32 as shown in FIG. 6B. Processing and final testing may be performed. Further, after mounting the device mounting board 30 on which the burn-in processing and the final test have been completed on the printed wiring board 10, resin molding may be performed, or resin molding may not be performed at all. However, when the molding resin 40 is molded so as to cover the entire main surface 31a as shown in FIG. 6A, the molding resin 40 is similarly formed with the conductive through holes 34 as shown in FIG. The aligned resin through-hole 41 is provided. Further, as shown in FIG. 7B, it is preferable that the inner wall of the resin through hole 41 has an extended conductive through hole 34 electrically connected to the wiring pattern 36. Further, as shown in FIG. 7 (c) or (d), the semiconductor chip 34 can be mounted on the device mounting board 30 by using a ball grid array (Ball Grid Array) or wire bonding. In the case where the molding resin 40 is molded on the semiconductor chip 32, it is necessary to mold the molding resin 40 as thin as possible on the semiconductor chip 32 in order to realize vertical miniaturization.
[0020]
Modification 1
In the semiconductor device 1 according to the first embodiment, one device mounting board 30 is mounted above the printed wiring board 10. However, as in the first modification example shown in FIG. 8, a plurality of (two in FIG. 8) device mounting boards are mounted. The board 30 may be mounted above the printed wiring board 10. Thus, the degree of integration per unit area of the semiconductor device 1 can be further increased. Further, as shown in FIG. 9, the vertical intervals between the printed wiring board 10 and the device mounting board 30 and between the plurality of device mounting boards 30 can be freely set.
[0021]
Modification 2
According to the first modification (FIG. 8), the conductive shaft 14 extends vertically upward from the main surface 12a of the printed wiring board 10, but according to the second modification (FIG. 10), the conductive shaft 14 10 extends vertically downward from the downward main surface 12b. That is, the device mounting board 30 of the second modification is disposed below the printed wiring board 10. In other words, when the printed wiring board 10 is mounted on the main circuit board 50 via the input / output terminals 16, the printed wiring board 10 of the first modification may be interposed between the device mounting board 30 and the main circuit board. On the other hand, according to the modified example 2, the device mounting board 30 is interposed between the printed wiring board 10 and the main circuit board. According to the semiconductor device 1 according to the second modification, since each semiconductor chip 32 is sandwiched between the printed wiring board 10 and the device mounting board 30, the semiconductor chip 32 is easily protected from an external force caused by carelessness during a work process.
[0022]
Further, in the modified example 2, similarly to the modified example 1, the vertical intervals between the printed wiring board 10 and the device mounting board 30 and between the plurality of device mounting boards 30 can be freely set. Further, as shown in FIG. 11, a heat sink 42 having high thermal conductivity is arranged in the gap so as to be in contact with the semiconductor chip 32, and the heat generated from the semiconductor chip 32 can be efficiently radiated to the outside. The heat sink 42 may be formed by using a non-conductive material. However, when the heat sink 42 is formed of a conductive material, an insulating coating (not shown) is formed on a surface in contact with the semiconductor chip 32, or the heat sink 42 is previously formed on the semiconductor chip 32. It is necessary to mold the mold resin 40 in advance.
[0023]
Thus, even when the heat generated by the semiconductor chip 32 is extremely large, heat can be efficiently radiated through the heat sink 42 without giving excessive heat to other semiconductor chips. Therefore, according to the second modification of the present invention, it is possible to improve the degree of integration by stacking the semiconductor chips 32 having a large heat value and poor thermal characteristics without causing the adjacent semiconductor chips 32 to malfunction. Can be.
[0024]
Modification 3
According to the first modification (FIG. 8), the conductive shaft 14 extends vertically upward from the main surface 12a of the printed wiring board 10, and according to the second modification (FIG. 10), the conductive shaft 14 According to the third modified example (FIG. 12), both the main surfaces 12a and 12b of the printed wiring board 10 extend vertically upward and downward from the surface 12b. . In this way, more device mounting boards 30 can be mounted on the printed wiring board 10, and the degree of integration per unit area is improved.
[0025]
Modification 4
According to the third modification (FIG. 12), the conductive shaft 14 extends vertically upward and downward from both the main surfaces 12a and 12b of the printed wiring board 10, respectively. (FIG. 13) Two sets of conductive shafts 14a and 14b extend vertically upward from one main surface 12a of the printed wiring board 10. In other words, the printed wiring board 10 of the modified example 3 has a plurality of first and second conductive shafts extending vertically from the main surfaces 12a and 12b, while the printed wiring board 10 of the modified example 4 has one side. And a plurality of third and fourth conductive shafts 14a and 14b extending upward from the main surface 12a (or downward from one main surface 12b). Thus, the same printed wiring board 10 can be mounted on a plurality of semiconductor chips 32 having different shapes.
[0026]
Modification 5
In the first embodiment, an appropriate positioning jig is used to arrange the device mounting board 30 at a predetermined vertical position on the printed wiring board 10. On the other hand, in the semiconductor device 1 of Modification 6, the conductive shaft 14 is gradually tapered so that the device mounting board 30 is easily arranged at a predetermined vertical position on the printed wiring board 10. And the printed wiring board 10 and the device mounting board 30 are configured such that the conductive through-hole 34 has a predetermined diameter. That is, when the device mounting board 30 is mounted on the printed wiring board 10, the device mounting board 30 is printed so that the diameters of the conductive shaft 14 and the conductive through hole 34 match as shown in FIGS. It is structurally positioned with respect to the wiring board 10.
[0027]
Alternatively, at a position where the device mounting board 30 is arranged, as shown in FIGS. 16 and 17, the conductive shaft 14 has a step portion 44. On the other hand, the diameter of the conductive through hole 34 of the printed wiring board 10 is smaller than the diameter of the conductive shaft 14 below the step 44 and larger than the diameter of the conductive shaft 14 above the step 44. It is configured. Thus, similarly, the device mounting board 30 is structurally positioned with respect to the printed wiring board 10.
[0028]
Modification 6
According to the first embodiment, the input / output terminal 16 has a general lead frame (for example, FIG. 1), but according to Modification 6 (FIG. 18), a surface mountable ball including the solder bump 18 is provided. Construct a grid array (Ball Grid Array). Further, a solder bump may be formed on the upper end portion 15 of the conductive shaft 14 shown in FIG. 18, and the semiconductor device 1 shown in FIG.
[0029]
Modification 7
According to the third modification (FIG. 12), the input / output terminal 16 of the printed wiring board 10 has a general lead frame 16 extending from a pair of opposed end faces, and the main surface of the printed wiring board 10 has a mother board. 50 are mounted so as to be parallel to the main surface. On the other hand, as shown in the perspective view of FIG. 19 and FIG. 20 (on the XZ plane) viewed from the BB line, the printed wiring board 10 and the device The main circuit board 50 is mounted so as to be substantially perpendicular to the main surface. The electrical connection between the printed wiring board 10 and the motherboard 50 according to the modified example 7 is configured in any form as understood by those skilled in the art. For example, as shown in FIG. The male plug 20 may be formed as the input / output terminal 16 of the wiring board 10, and the main surface 52 of the motherboard 50 may be provided with a female socket 54 that can receive and electrically connect the plug 20. The wiring pattern 22 is formed on the plug 20, and an elastic pin 55 for holding the wiring pattern 22 by elastic force to obtain electrical contact is formed in the socket 54, as shown in FIG. 21 (b). By inserting the plug 20 of the printed wiring board 10 into the socket 54 of the motherboard 50, the printed wiring board 10 and the motherboard 50 are electrically connected.
[0030]
Embodiment 2 FIG.
Embodiment 2 according to the present invention will be described in detail below with reference to FIGS. The semiconductor device 2 of the second embodiment generally includes a printed wiring board 10 and a plurality of (three in FIG. 22) device mounting boards 30 in FIG. As in the first embodiment, the burn-in process and the final test of the device mounting board 30 of the second embodiment are completed before the device mounting board 30 is mounted on the printed wiring board 10.
[0031]
The printed wiring board 10 of the second embodiment has a plurality of plate-shaped conductive support portions 24 fixed on the main surface 12a. The conductive support portion 24 has a rectangular cross-sectional shape in FIG. 23 (on the YZ plane) viewed from the line CC in FIG. 22, and extends in the X-axis direction. On the other hand, the device mounting board 30 has a semiconductor chip 32 and has a plurality of cutouts (engaging portions) 46 formed at one end thereof, and the cutouts 46 are electrically conductive in the YZ plane. It has substantially the same planar shape as the sexual support portion 24. In particular, as shown in the enlarged cross-sectional view of FIG. 23, a pattern wiring 26 such as gold plating is formed on the conductive support portion 24 of the printed wiring board 10, and a solder layer 48 is formed on the cutout 46 of the device mounting board 30. Are formed in advance.
[0032]
The printed circuit board 10 and the device mounting board 30 are electrically connected by engaging the cutout portion 46 thus configured with the conductive support portion 24 and welding the solder layer 48 on the cutout portion 46 in a solder reflow process. I do.
[0033]
Since the semiconductor device 2 thus configured is assembled using the device mounting substrate 30 that has been subjected to the burn-in process and the final test, a semiconductor device having a very high yield and a high degree of integration can be realized.
[Brief description of the drawings]
FIG. 1 is a perspective view of a semiconductor device according to a first embodiment of the present invention.
FIG. 2 is a sectional view of the semiconductor device taken along line AA of FIG. 1;
FIG. 3 is a perspective view of a device mounting board used in the semiconductor device of FIG. 1;
FIG. 4 is an enlarged sectional view showing a conductive through hole of the device mounting board of FIG. 3;
FIG. 5 is a sectional view of the semiconductor device according to the first embodiment;
FIG. 6 is a sectional view of the semiconductor device according to the first embodiment;
FIG. 7 is a sectional view of the semiconductor device according to the first embodiment;
FIG. 8 is a cross-sectional view illustrating a semiconductor device of a first modification.
FIG. 9 is a cross-sectional view illustrating a semiconductor device of a first modification.
FIG. 10 is a cross-sectional view illustrating a semiconductor device of Modification Example 2.
FIG. 11 is a cross-sectional view illustrating a semiconductor device of Modification 2;
FIG. 12 is a cross-sectional view illustrating a semiconductor device of Modification 3;
FIG. 13 is a cross-sectional view illustrating a semiconductor device according to Modification 4;
FIG. 14 is a cross-sectional view illustrating a semiconductor device of Modification Example 5;
FIG. 15 is an enlarged sectional view of FIG. 14;
FIG. 16 is a cross-sectional view illustrating a semiconductor device of Modification Example 5.
FIG. 17 is an enlarged sectional view of FIG. 16;
FIG. 18 is a cross-sectional view illustrating a semiconductor device of Modification 6;
FIG. 19 is a perspective view showing a semiconductor device of Modification 7;
FIG. 20 is a cross-sectional view of the semiconductor device taken along line BB of FIG. 19;
FIGS. 21A and 21B are cross-sectional views of the semiconductor device before and after a plug of a printed wiring board is inserted into a socket of a motherboard.
FIG. 22 is a perspective view of a semiconductor device according to a second embodiment of the present invention.
FIG. 23A is a cross-sectional view of the semiconductor device taken along line CC of FIG. 22 before a conductive support portion of a printed wiring board is engaged with a notch of a device mounting board. 23 (b) is an enlarged view thereof.
[Explanation of symbols]
1, 2 semiconductor device, 10 printed wiring board, 12 main surface, 14 conductive shaft, 16 input / output terminal, 18 solder bump, 20 plug, 22 wiring pattern, 24 conductive support, 26 wiring pattern, 30 device mounting board , 32 semiconductor chips, 34 conductive through holes, 36 wiring patterns, 38 conductive bonding members, 40 mold resin, 42 heat sinks, 44 step portions, 46 notches (engagement portions), 48 solder layers, 50 mother boards (main circuit) Board), 51 conductive pad, 52 main surface, 54 socket, 55 elastic pin.

Claims (19)

A semiconductor device,
A printed wiring board having two main surfaces and having a plurality of conductive shafts extending in a predetermined direction from at least one main surface;
A semiconductor chip mounted thereon, comprising: at least one device mounting substrate having a plurality of conductive through holes penetrating the conductive shaft;
A semiconductor device, wherein the printed wiring board and the device mounting board are electrically connected via the conductive shaft and the conductive through-hole. The semiconductor device according to claim 1, wherein:
A semiconductor device, wherein a plurality of input / output terminals are provided on the printed wiring board. The semiconductor device according to claim 2, wherein:
The semiconductor device, wherein the input / output terminal includes a lead frame. The semiconductor device according to claim 2, wherein:
The semiconductor device, wherein the input / output terminal includes a solder bump. The semiconductor device according to claim 2, wherein:
Further, a main circuit board to which the input / output terminals of the printed wiring board are connected,
A semiconductor device, wherein the printed wiring board is interposed between the device mounting board and the main circuit board. The semiconductor device according to claim 2, wherein:
A semiconductor device, wherein when the printed wiring board is mounted on the main circuit board via the input / output terminal, the device mounting board is interposed between the printed wiring board and the main circuit board. The semiconductor device according to claim 1, wherein:
A semiconductor device, wherein a plurality of the device mounting substrates are stacked separately from each other. The semiconductor device according to claim 1, wherein:
A plurality of the device mounting boards are stacked,
A semiconductor device further comprising a heat sink provided between the plurality of device mounting substrates. The semiconductor device according to claim 1, wherein:
The printed wiring board has a plurality of first and second conductive shafts extending in a predetermined direction from each main surface,
First and second device mounting boards each having a conductive through-hole through which the first and second conductive shafts respectively penetrate, via the respective conductive shafts and the corresponding conductive through-holes, the printed wiring board. And a semiconductor device electrically connected to the semiconductor device. The semiconductor device according to claim 1, wherein:
The printed wiring board has a plurality of third and fourth conductive shafts extending in a predetermined direction from one main surface,
Third and fourth device mounting boards each having a conductive through-hole through which the third and fourth conductive shafts pass, respectively, are connected to the printed wiring board via the respective conductive shafts and the corresponding conductive through-holes. And a semiconductor device electrically connected to the semiconductor device. The semiconductor device according to claim 1, wherein:
A semiconductor device, wherein the conductive shaft has a cross-sectional shape that gradually tapers. The semiconductor device according to claim 1, wherein:
The semiconductor device according to claim 1, wherein the conductive shaft has a stepped tapered cross-sectional shape. The semiconductor device according to claim 1, wherein:
A semiconductor device, wherein a conductive bonding member is arranged near a conductive through-hole. The semiconductor device according to claim 1, wherein:
The printed circuit board further includes a main circuit board electrically connected,
A semiconductor device, wherein a main surface of the main circuit board is substantially orthogonal to a main surface of the printed wiring board. A semiconductor device,
A printed wiring board having a plurality of conductive support portions extending in a predetermined direction fixed on the main surface,
A semiconductor chip is mounted, comprising a plurality of device mounting boards having a plurality of conductive notches to be engaged with each support portion,
The device mounting board is supported by the printed wiring board so as to be orthogonal to the printed wiring board, and is electrically connected to the printed wiring board via the conductive support portion and the conductive notch. A semiconductor device characterized by the above-mentioned. The semiconductor device according to claim 1, wherein:
A semiconductor device, wherein the semiconductor chip is resin-molded. The semiconductor device according to claim 15, wherein:
The semiconductor device, wherein the conductive bonding member is arranged near the conductive notch. A substrate on which a semiconductor chip is mounted and a plurality of conductive through holes capable of penetrating the conductive shaft are formed,
A device mounting board, wherein the conductive through-hole and the semiconductor chip are electrically connected. The device mounting board according to claim 18, wherein
The device mounting board, wherein the conductive bonding member is arranged near the conductive through hole.

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