JP2004354947A

JP2004354947A - Planar optical circuit component and its manufacturing method

Info

Publication number: JP2004354947A
Application number: JP2003155796A
Authority: JP
Inventors: Motohaya Ishii; 元速石井; Takeshi Kitagawa; 毅北川; Shinji Mino; 真司美野; Ikuo Ogawa; 育生小川; Toshikazu Hashimoto; 俊和橋本; Yoshiyuki Doi; 芳行土居; Takashi Yamada; 貴山田; Masahiro Yanagisawa; 雅弘柳澤
Original assignee: Nippon Telegraph and Telephone Corp
Current assignee: Nippon Telegraph and Telephone Corp
Priority date: 2003-05-30
Filing date: 2003-05-30
Publication date: 2004-12-16
Anticipated expiration: 2023-05-30
Also published as: JP4156442B2

Abstract

<P>PROBLEM TO BE SOLVED: To fix an optical waveguide circuit board and a substrate-attached optical component accurately onto a holding plate through an adhesive. <P>SOLUTION: The optical waveguide circuit board 101 has, on a planar base plate 104, a core 102 and a clad 103 that is formed in a manner surrounding the core. The holding plate 120 has adhesive surfaces 122, i.e., a plurality of difference-in-level surfaces sectioned by more than one steps of different depths, with a reference surface 121 provided at both ends which is one level higher than the adhesive surfaces 122. The optical waveguide circuit board 101 is fixed in the manner closely stuck to the uppermost surface which is the reference surface 121 of the holding plate 120. A proper amount of adhesive 114 is applied to the adhesive surfaces 122 which are the difference-in-level surfaces situated at a comparatively shallow position from the reference surface 121 of the holding plate 120. Then, the adhesive 114 is filled between the optical waveguide circuit board 101 and the adhesive surfaces 122, so that the optical waveguide circuit board 101 and the holding plate 120 are fixed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、平面光回路部品及びその作製方法に関し、より詳細には、光通信などの分野に適用され、光導波回路基板や基板付光部品を保持基板に接着固定してなる平面光回路部品及びその作製方法に関する。
【０００２】
【従来の技術】
平面基板上に高い屈折率を有するコアと、このコアを取り囲む低い屈折率を有するクラッドとからなる光導波路、または基板上に固定された受光素子・発光素子などの基板付光部品は、光ファイバと接続させたり、あるいは光部品間で結合させたりすることによって、実用的で高機能な光デバイスを実現することが可能である。このような実用的で高機能な光デバイスとして、低損失かつ機械的強度に優れ、高い信頼性を有する光デバイスを作製するためには、光部品を安定的に把持する固定構造が必要となる。
【０００３】
従来、光導波路の固定方法として、光導波路を保持基板（ホルダー）に接着固定する方法が用いられている。
図９は、従来の光導波路の固定方法を説明するための図で、図中符号４０１は光導波回路基板、４１４は接着剤、４５０は桶状の下部ホルダー、４５０ａはスペーサ部、４５１は上部ホルダーを示している。
【０００４】
この従来の光導波路の固定方法は、所定の機能を有する光回路部と光入出力導波路部とを備えた光導波回路基板４０１を、下部ホルダー４５０及び上部ホルダー４５１に固定するに際し、光回路部を下部ホルダー４５０及び上部ホルダー４５１に対して非接触状態に置くとともに、光入出力導波路部の一部を接着剤４１４により下部ホルダー４５０及び上部ホルダー４５１に固定している。このような従来の光導波路の固定方法では、光回路部に応力を掛けること無く光導波回路基板４０１を固定できるため、低損失で高い機械強度を有する光回路部品を実現することが可能である（例えば、特許文献１参照）。
【０００５】
【特許文献１】
特開平６−６７０４１号公報
【０００６】
【発明が解決しようとする課題】
しかしながら、上述した従来の光導波路の固定方法では、光導波回路基板と保持基板とを固定する固定剤（接着剤）の厚さが不均一であり、光導波回路基板が傾いたり、あるいは光導波回路基板と保持基板との間に固定剤がほとんど介在しない部分が存在し、温度サイクルなどの信頼性試験において、両者が剥離するなどの問題があった。
【０００７】
本発明は、このような問題に鑑みてなされたもので、その目的とするところは、光導波回路基板や、受光素子又は発光素子などを備えた基板付光部品を、接着剤を介して保持基板に固定することによって、光導波回路基板や基板付光部品を精度良く保持基板に固定して高い信頼性を有する平面光回路部品及びその作製方法を提供することにある。
【０００８】
【課題を解決するための手段】
本発明は、このような目的を達成するためになされたもので、請求項１に記載の発明は、平面基板上に、高い屈折率を有するコアと、該コアを囲むように形成された低い屈折率を有するクラッドとを備えた光導波回路基板と、該光導波回路基板を固定する保持基板とから構成される平面光回路部品において、前記保持基板は、前記光導波回路基板との接触面となる基準面と、少なくとも２段以上の深さの異なる段差によって区切られた複数の段差面である接着面とを備え、前記基準面に対して深さの浅い段差面と前記光導波回路基板との間隙に設けられた接着剤により、前記光導波回路基板と前記保持基板とが接着固定されていることを特徴とする。
【０００９】
また、請求項２に記載の発明は、請求項１に記載の発明において、前記光導波回路基板が、前記保持基板に設けられた深さの異なる複数の接着面にそれぞれ固定されていることを特徴とする。
【００１０】
また、請求項３に記載の発明は、請求項１又は２に記載の発明において、前記光導波回路基板と接触する前記保持基板の基準面が、複数の突起状の基準面であることを特徴とする。
【００１１】
また、請求項４に記載の発明は、請求項１，２又は３に記載の発明において、前記保持基板の深い段差面に設けられた台座上に、熱伝導材料が設けられていることを特徴とする。
【００１２】
また、請求項５に記載の発明は、請求項１乃至４のいずれかに記載の発明において、前記光導波回路基板の前記コアに対向した位置に配置される受光素子又は発光素子と、該受光素子又は発光素子を保持する固定基板とを有する基板付光部品を、前記保持基板上に設けたことを特徴とする。
【００１３】
また、請求項６に記載の発明は、請求項５に記載の発明において、前記基板付光部品を搭載する部分の前記保持基板が、前記基板付光部品との接触面となる基準面と、少なくとも２段以上の深さの異なる段差によって区切られた複数の段差面である接着面とを備え、前記基準面に対して深さの浅い段差面と前記基板付光部品との間隙に設けられた接着剤により、前記基板付光部品と前記保持基板とが接着固定されていることを特徴とする。
【００１４】
また、請求項７に記載の発明は、請求項６に記載の発明において、前記保持基板の側壁に、前記基準面及び前記接着面を設けたことを特徴とする。
【００１５】
また、請求項８に記載の発明は、請求項１乃至７のいずれかに記載の発明において、前記前記基準面に対して深さの深い段差面を構成する凹部を、前記接着剤の逃げ溝としたことを特徴とする。
【００１６】
また、請求項９に記載の発明は、平面基板上に、高い屈折率を有するコアと、該コアを囲むように形成された低い屈折率を有するクラッドとを備えた光導波回路基板と、該光導波回路基板を固定する保持基板とから構成される平面光回路部品の作製方法において、前記保持基板に、前記光導波回路基板との接触面となる基準面を形成するとともに、少なくとも２段以上の深さの異なる段差によって区切られた複数の段差面である接着面を有する段差部を形成し、前記基準面に対して深さの浅い段差面と前記光導波回路基板との間隙に接着剤を充填して、前記光導波回路基板と前記保持基板とを接着固定することを特徴とする。
【００１７】
また、請求項１０に記載の発明は、請求項９に記載の発明において、前記光導波回路基板を、前記保持基板に形成された深さの異なる複数の接着面にそれぞれ固定することを特徴とする。
【００１８】
また、請求項１１に記載の発明は、請求項９又は１０に記載の発明において、前記保持基板に形成された複数の突起状の基準面に、前記光導波回路基板を接触させて固定することを特徴とする。
【００１９】
また、請求項１２に記載の発明は、請求項９，１０又は１１に記載の発明において、前記保持基板の深い段差面に台座を形成し、該台座上に熱伝導材料を設けることを特徴とする。
【００２０】
また、請求項１３に記載の発明は、請求項９乃至１２のいずれかに記載の発明において、前記該光導波回路基板の前記コアに対向した位置に配置される受光素子又は発光素子と、該受光素子又は発光素子を保持する固定基板とを有する基板付光部品を、前記保持基板上に形成することを特徴とする。
【００２１】
また、請求項１４に記載の発明は、請求項１３に記載の発明において、前記基板付光部品を搭載する前記保持基板に、前記基板付光部品との接触面となる基準面を形成するとともに、少なくとも２段以上の深さの異なる段差によって区切られた複数の段差面である接着面を形成し、前記基準面に対して深さの浅い段差面と前記基板付光部品との間隙に接着剤を充填して、前記基板付光部品と前記保持基板を接着固定することを特徴とする。
【００２２】
また、請求項１５に記載の発明は、請求項１４に記載の発明において、前記保持基板の側壁に、前記基準面及び前記接着面を形成することを特徴とする。
【００２３】
また、請求項１６に記載の発明は、請求項９乃至１５のいずれかに記載の発明において、前記基準面に対して深さの深い段差面を構成する凹部を、前記接着剤の逃げ溝とすることを特徴とする。
【００２４】
このような構成により、光導波回路基板や基板付光部品を保持基板に設けられた複数の深さの異なる段差面である接着面の内、最上面を基準面として接するように固定することによって、光導波回路基板や基板付光部品を精度良く固定することが可能となる。さらに、基準面と接着面との段差が接着剤の厚さとして確保されるので、接着剤の硬化時の収縮率と硬化後の硬性を考慮して所望の段差に設定することによって、高い信頼性を有する平面光回路部品を提供することができる。
【００２５】
【発明の実施の形態】
以下、図面を参照して本発明の実施例について説明する。
［実施例１］
図１乃至図３は、本発明に係る平面光回路部品の実施例１を説明するための構成図で、図１は各要素部品の固定前の構成図、図２は各要素部品の固定後の構成図、図３がその断面図である。図中符号１０１は光導波回路基板、１０２はコア、１０３はクラッド、１０４は平面基板、１１４は接着剤、１２０は保持基板、１２１は基準面、１２２は接着面、１２３は接着剤の逃げ溝を示している。
【００２６】
本発明の平面光回路部品は、石英系の光導波回路基板１０１と保持基板１２０とから構成されていて、光導波回路基板１０１は、平面基板１０４上に、高い屈折率を有するコア１０２と、このコア１０２の周りを囲むように形成された低い屈折率を有するクラッド１０３とを備えている。
【００２７】
また、保持基板１２０は、複数の深さの異なる段差によって区切られた複数の段差面である接着面１２２を有するとともに、両端部に、接着面１２２より一段高く、光導波回路基板１０１との接触面となる基準面１２１が設けられている。
【００２８】
光導波回路基板１０１は、保持基板１２０の基準面１２１となる最上面に密着するようにして固定されている。この固定方法は、まず、保持基板１２０の基準面１２１から見て比較的浅い位置にある段差面である接着面１２２に適量の接着剤１１４を塗布しておき、次に、光導波回路基板１０１と基準面１２１が密着するように位置決めし、接着剤を硬化させることによって、光導波回路基板１０１と保持基板１２０とを固定している。
【００２９】
本実施例１では、粘性が高い弾性接着剤などを充填した場合であっても、光導波回路基板１０１を保持基板１２０に密着する際の抑える位置、抑える圧力によって、接着剤層の厚みが変化することなく、光導波回路基板１０１を安定に固定するため、深い段差面を構成する凹部分を余分な接着剤が逃げる逃げ溝１２３としている。
【００３０】
また、光導波回路基板１０１を保持基板１２０の基準面１２１に接するように抑え込むことによって、塗布された接着剤１１４は、光導波回路基板１０１と保持基板１２０との接着面１２２との間に所望の接着層を形成する。ここで、基準面１２１の面積（幅）を比較的小さくすることによって、基準面１２１上に残る接着剤１１４をできるだけ少なくし、光導波回路基板１０１を安定的に保持基板１２０上に固定することができる。
【００３１】
本実施例１では、基準面１２１の幅ｄ１を１ｍｍとしたが、１０ｍｍ以下であれば、本実施例１と同様の効果があることを確認している。また、接着剤１１４の逃げ溝１２３を複数形成することによって、接着層をセグメント化できるため、小さな抑え圧力で光導波回路基板１０１を保持基板１２０の基準面１２１に密着することが可能となり、かつ接着剤１１４の硬化時の接着層の変化が小さいため、光導波回路基板１０１を所望の高さに固定することが可能である。
【００３２】
光導波回路基板１０１を保持基板１２０に固定する接着層の厚みは、薄すぎると十分な接着力が得られず、また厚すぎると硬化時の収縮幅が大きくなり、光導波回路基板１０１に応力を与えることになるため、適切な接着層厚に制御する必要がある。ここで、接着剤１１４の収縮率を考慮して、接着層を制御することによって、接着剤１１４が収縮した際に、光導波回路基板１０１と保持基板１２０を密着させる効果がある。
【００３３】
本実施例１では、収縮率が数％の接着剤を使用したため、基準面１２１と接着面１２２の段差ｄ２は、図３に示すように、０．０３ｍｍに設定した。また、逃げ溝１２３の段差ｄ３は、０．５ｍｍとした。一般的に、接着剤の収縮率は数％程度であるため、基準面１２１と接着面１２２の段差を０．１ｍｍ以下に設定することが望ましい。
【００３４】
本実施例１において、保持基板１２０は、アルミニウム板を機械加工によって切削して作製し、弾性接着剤で固定することによって、光導波回路基板１０１を保持基板１２０に対して０．０１ｍｍ以下の高さ精度で固定できることが確認できた。さらに、温度サイクル（−４０℃〜７５℃で、１００サイクル）試験後も剥離などの劣化は無いことを確認した。
【００３５】
本実施例１では、保持基板１２０の材料として、アルミニウムを用いたが、他の金属またはプラスチック，セラミックなどの非金属であっても同様の効果を奏する。また、段差を有する面を形成する手段として、機械加工を用いたが、成形加工によっても精度良く作製することが可能である。
【００３６】
［実施例２］
図４及び図５は、本発明に係る平面光回路部品の実施例２を説明するための構成図で、図４は各要素部品の固定前の構成図、図５は各要素部品の固定後の平面光回路部品を温調装置に取付けた図である。図中符号２０１は光導波回路基板、２０２はコア、２０３はクラッド、２０４は平面基板（シリコン基板）、２０５はスラブ導波路、２０６はアレイ導波路、２１３は熱伝導性剤、２１４は接着剤、２２０は保持基板、２２１は基準面、２２２は接着面、２２３は接着剤の逃げ溝、２２４は台座、２３１は放熱板、２３２はペルチェ素子を示している。
【００３７】
本実施例２の平面光回路部品は、光導波回路基板２０１と保持基板２２０とから構成されていて、光導波回路基板２０１は、平面基板２０４上に、高い屈折率を有する石英系ガラスから成るコア２０２と、このコア２０２の周りを囲むように形成された低い屈折率を有するクラッド２０３とを備えている。
【００３８】
一般的にこのような複合材料から成る光導波回路基板２０１は、シリコン基板２０４と光導波路を形成するガラスとの熱膨張係数の差によって、僅かな曲率の反りを有する。光導波回路基板２０１の反りは基板全体で一定の曲率を有しておらず、場所によって曲率が異なっている。そのため、大きな１つの面あるいは４点で光導波回路基板２０１を支持した場合、ガタついて、安定的に固定することが困難である。そこで、本実施例２の保持基板２２０は、基準面２２１として３つの突起状の基準面を設け、光導波回路基板２０１を安定的に支持できるように構成されている。
【００３９】
光導波回路基板２０１には、機能回路として、２つのスラブ導波路２０５とその間をつなぐ複数のアレイ導波路２０６とから成るアレイ導波路格子が形成されている。このアレイ導波路格子は、このアレイ導波路２０５を伝搬する光の光路差を高精度に制御することによって、入射した光を波長毎に分波したり、あるいは合波したりすることが可能な機能回路である。従って、アレイ導波路格子は、環境温度の変化によって分波波長特性が変化しないようにペルチェ素子２３２などを用いて温調する必要がある。
【００４０】
また、光導波回路基板２０１を保持基板２２０に固定する際に応力が掛からないように固定する必要がある。従って、光導波回路基板２０１を保持基板２２０上に固定する際に、アレイ導波路２０６の直下に台座２２４を設け、つまり、深い段差面に台座２２４を設け、その台座２２４に熱伝導性剤２１３を塗布することによって、保持基板２２０と光導波回路基板２０１の熱的な接続を実現した。
【００４１】
台座２２４の高さは、保持基板２２０の基準面２２１および光導波回路基板２０１の反り量を考慮して、光導波回路基板２０１と台座２２４の間隙が０．１ｍｍとなるように作製した。また、この台座２２４は、塗布した熱伝導性剤２１３の量が多い場合に、余分な熱伝導性剤２１３が逃げ溝２２３に流れるように、逃げ溝２２３で囲むように一段高くしている。この逃げ溝２２３は、接着剤または熱伝導性剤で完全に充填されないため、光導波回路基板２０１全面を接着剤または熱伝導性剤で固定したものと比べると基板への応力を小さくする効果がある。
【００４２】
光導波回路基板２０１と保持基板２２０は、台座２２４および接着面２２２にそれぞれ熱伝導性剤および接着剤を塗布した後、光導波回路基板２０１と保持基板２２０に設けられた３つの突起状の基準面とが密着するように固定した。本実施例２の平面光回路部品の有効性を確認するため、放熱板２３１上に固定されたペルチェ素子２３２上に作製した保持基板２２０の裏面が接するように固定して、環境温度に対する分波波長特性を評価した。
【００４３】
その結果、環境温度２０〜６０度において、ペルチェ素子２３２を駆動することによって、光導波回路基板２０１の温度変化は、０．１度以下に保持できることを確認した。また、光導波回路基板２０１を保持基板２２０へ接着固定した際の特性劣化も無いことを確認している。なお、本実施例２で用いた突起状の基準面のサイズは、幅１ｍｍ，長さ２ｍｍ，高さ０．０３ｍｍとした。
【００４４】
［実施例３］
図６乃至図８は、本発明に係る平面光回路部品の実施例３を説明するための構造図で、図６は各要素部品の固定前の構造図、図７は各要素部品の固定後の上面図、図８は各要素部品の固定後の側面図である。
【００４５】
図中符号３０１は光導波回路基板、３０２はコア、３０３はクラッド、３０４は平面基板、３１４は接着剤、３２０は保持基板、３２１は第１の基準面、３２２は第１の接着面、３２３は第１の接着剤の逃げ溝、３２４は第２の基準面、３２５は第２の接着面、３２６は第２の接着剤の逃げ溝、３３０は基板付光部品、３３１は受光素子、３３２は受光素子の固定基板、３４１は第３の基準面、３４２は第３の接着面、３４３は第３の接着剤の逃げ溝、３４４は第４の基準面、３４５は第４の接着面、３４６は第４の接着剤の逃げ溝、３４７は第５の基準面、３４８は第５の接着面、３４９は第５の接着剤の逃げ溝を示している。
【００４６】
本実施例３に係る平面光回路部品は、石英系の光導波回路基板３０１と、固定基板３３２に固定された受光素子３３１から成る基板付光部品３３０と、保持基板３２０とから構成されている。光導波回路基板３０１は、平面基板３０４上に、高い屈折率を有するコア３０２と、このコア３０２の周りを囲むように形成された低い屈折率を有するクラッド３０３とを備えている。
【００４７】
保持基板３２０は、光導波回路基板３０１または基板付光部品３３０の底面および側面と接する部分に複数の深さの異なる段差によって区切られた複数の段差面である接着面を有している。第１と第２の基準面３２１，３２４および第３と第４の基準面３４１，３４４は、光導波回路基板３０１のコア３０２の光軸が、基板付光部品３３０の受光素子３３１の中心に一致するように、それぞれのｙ，ｚ方向の相対高さを高精度に制御して作製した。
【００４８】
光導波回路基板３０１のｘ方向の位置は、第２の基準面３２４を形成する段差の側面を基準にし、基板付光部品３３０は、第５の基準面３４７を用いて支持している。光導波回路基板３０１および基板付光部品３３０と保持基板３２０は、それぞれの接着面３２２，３２４，３４２，３４４，３４８に塗布した接着剤３１４を介して固定している。余分に塗布された接着剤３１４は、逃げ溝３２３，３２６，３４３，３４６に流れ込むことによって、光導波回路基板３０１および基板付光部品３３０を所望の位置で固定することが可能となった。
【００４９】
本実施例３の平面光回路部品によって、光導波回路基板３０１のコア３０２の光軸と、基板付光部品３３０の受光素子３３１の中心を２０μｍ以下の精度で合わせることが可能となった。また、各基準面と接着面との段差を０．０３ｍｍとして接着層の厚さを制御した。作製した平面光回路部品は、温度サイクル試験においても特性劣化が無いことを確認した。
【００５０】
【発明の効果】
以上説明したように本発明によれば、保持基板は、光導波回路基板との接触面を有する基準面と、少なくとも２段以上の深さの異なる段差によって区切られた複数の段差面である接着面とを備え、基準部に対して深さの浅い段差面と光導波回路基板との間隙に設けられ接着剤により、光導波回路基板と保持基板とを接着固定したので、保持基板が深さの異なる段差によって区切られて複数の基準面、接着面および逃げ溝を有することによって、光導波回路基板を精度良く保持し、かつ高い信頼性を有するという効果がある。
【００５１】
また、光導波回路基板のコアに対向した位置に配置される受光素子又は発光素子と、受光素子又は発光素子を保持する固定基板とを有する基板付光部品を、光導波回路基板と同様な固定手段で保持基板に設けたので、光導波回路基板のコアの光軸と、基板付光部品の受光素子の中心を２０μｍ以下の精度で合わせることが可能となった。
【図面の簡単な説明】
【図１】本発明に係る平面光回路部品の実施例１を説明するための構成図である。
【図２】各要素部品の固定後の構成図である。
【図３】各要素部品の固定後の断面図である。
【図４】本発明に係る平面光回路部品の実施例２を説明するための構成図である。
【図５】各要素部品の固定後の平面光回路部品を温調装置に取付けた図である。
【図６】本発明に係る平面光回路部品の実施例３を説明するための構造図である。
【図７】各要素部品の固定後の上面図である。
【図８】各要素部品の固定後の側面図である。
【図９】従来の光導波路の固定方法を説明するための図である。
【符号の説明】
１０１，２０１，３０１光導波回路基板
１０２，２０２，３０２コア
１０３，２０３，３０３クラッド
１０４，２０４，３０４平面基板
１１４，２１４，３１４接着剤
１２０，２２０，３２０保持基板
１２１，２２１基準面
１２２，２２２接着面
１２３，２２３接着剤の逃げ溝
２０５スラブ導波路
２０６アレイ導波路
２１３熱伝導性剤
２２４台座
２３１放熱板
２３２ペルチェ素子
３２１第１の基準面
３２２第１の接着面
３２３第１の接着剤の逃げ溝
３２４第２の基準面
３２５第２の接着面
３２６第２の接着剤の逃げ溝
３３０基板付光部品
３３１受光素子
３３２受光素子の固定基板
３４１第３の基準面
３４２第３の接着面
３４３第３の接着剤の逃げ溝
３４４第４の基準面
３４５第４の接着面
３４６第４の接着剤の逃げ溝
３４７第５の基準面
３４８第５の接着面
３４９第５の接着剤の逃げ溝
４０１光導波回路基板
４１４接着剤
４５０桶状の下部ホルダー
４５０ａスペーサ部
４５１上部ホルダー[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar optical circuit component and a method of manufacturing the same, and more particularly, to a planar optical circuit component which is applied to the field of optical communication and the like, and is formed by bonding and fixing an optical waveguide circuit substrate or an optical component with a substrate to a holding substrate. And a manufacturing method thereof.
[0002]
[Prior art]
An optical waveguide consisting of a core having a high refractive index on a flat substrate and a clad having a low refractive index surrounding the core, or an optical component with a substrate such as a light receiving element and a light emitting element fixed on the substrate is an optical fiber. By connecting them to each other or by connecting them between optical components, it is possible to realize a practical and high-performance optical device. In order to produce such a practical and highly functional optical device having low loss, excellent mechanical strength, and high reliability, a fixing structure that stably holds an optical component is required. .
[0003]
Conventionally, as a method of fixing an optical waveguide, a method of bonding and fixing an optical waveguide to a holding substrate (holder) has been used.
FIG. 9 is a view for explaining a conventional method of fixing an optical waveguide. In the figure, reference numeral 401 denotes an optical waveguide circuit board, 414 denotes an adhesive, 450 denotes a lower holder in the shape of a trough, 450a denotes a spacer, and 451 denotes an upper. Shows a holder.
[0004]
This conventional method for fixing an optical waveguide is based on an optical circuit when fixing an optical waveguide circuit board 401 having an optical circuit section having a predetermined function and an optical input / output waveguide section to a lower holder 450 and an upper holder 451. The part is placed in a non-contact state with respect to the lower holder 450 and the upper holder 451, and a part of the optical input / output waveguide is fixed to the lower holder 450 and the upper holder 451 with an adhesive 414. In such a conventional method for fixing an optical waveguide, the optical waveguide circuit board 401 can be fixed without applying stress to the optical circuit portion, and thus an optical circuit component having low loss and high mechanical strength can be realized. (For example, see Patent Document 1).
[0005]
[Patent Document 1]
JP-A-6-67041
[Problems to be solved by the invention]
However, in the above-described conventional optical waveguide fixing method, the thickness of the fixing agent (adhesive) for fixing the optical waveguide circuit substrate and the holding substrate is not uniform, and the optical waveguide circuit substrate is inclined or the optical waveguide is not fixed. There is a portion where the fixing agent hardly intervenes between the circuit board and the holding substrate, and there has been a problem that the two peel off in a reliability test such as a temperature cycle.
[0007]
The present invention has been made in view of such a problem, and an object thereof is to hold an optical component with a substrate including an optical waveguide circuit board and a light receiving element or a light emitting element via an adhesive. An object of the present invention is to provide a planar optical circuit component having high reliability by fixing an optical waveguide circuit substrate and an optical component with a substrate to a holding substrate with high precision by fixing the optical waveguide circuit substrate and the substrate-mounted optical component, and a method of manufacturing the same.
[0008]
[Means for Solving the Problems]
The present invention has been made to achieve such an object, and the invention according to claim 1 has a core having a high refractive index on a planar substrate and a low core formed to surround the core. In a planar optical circuit component comprising an optical waveguide circuit substrate having a cladding having a refractive index, and a holding substrate for fixing the optical waveguide circuit substrate, the holding substrate has a contact surface with the optical waveguide circuit substrate. A reference surface, and an adhesive surface which is a plurality of step surfaces separated by at least two or more steps having different depths, the step surface having a depth smaller than the reference surface, and the optical waveguide circuit board. The optical waveguide circuit substrate and the holding substrate are bonded and fixed by an adhesive provided in a gap between the optical waveguide circuit substrate and the holding substrate.
[0009]
According to a second aspect of the present invention, in the first aspect of the present invention, the optical waveguide circuit board is fixed to a plurality of adhesive surfaces having different depths provided on the holding substrate. Features.
[0010]
According to a third aspect of the present invention, in the first or second aspect, the reference surface of the holding substrate that is in contact with the optical waveguide circuit substrate is a plurality of projecting reference surfaces. And
[0011]
According to a fourth aspect of the present invention, in the first, second, or third aspect, a heat conductive material is provided on a pedestal provided on a deep step surface of the holding substrate. And
[0012]
According to a fifth aspect of the present invention, in the first aspect of the present invention, the light receiving element or the light emitting element disposed at a position facing the core of the optical waveguide circuit board; An optical component with a substrate having an element or a fixed substrate for holding a light emitting element is provided on the holding substrate.
[0013]
According to a sixth aspect of the present invention, in the invention according to the fifth aspect, the holding substrate at a portion where the optical component with a substrate is mounted has a reference surface serving as a contact surface with the optical component with a substrate. An adhesive surface which is a plurality of step surfaces separated by at least two or more steps having different depths, and is provided in a gap between the step surface having a depth smaller than the reference surface and the optical component with a substrate. The optical component with a substrate and the holding substrate are bonded and fixed by the adhesive.
[0014]
The invention according to claim 7 is the invention according to claim 6, wherein the reference surface and the bonding surface are provided on a side wall of the holding substrate.
[0015]
According to an eighth aspect of the present invention, in the invention according to any one of the first to seventh aspects, a concave portion forming a stepped surface having a depth greater than the reference surface is provided with a relief groove for the adhesive. It is characterized by having.
[0016]
Further, the invention according to claim 9 is an optical waveguide circuit board comprising a core having a high refractive index and a clad having a low refractive index formed so as to surround the core, on a planar substrate, In a method of manufacturing a planar optical circuit component comprising a holding substrate for fixing an optical waveguide circuit board, a reference surface serving as a contact surface with the optical waveguide circuit board is formed on the holding substrate, and at least two or more steps are provided. Forming a step portion having an adhesive surface which is a plurality of step surfaces separated by steps having different depths, and providing an adhesive in a gap between the step surface having a depth smaller than the reference surface and the optical waveguide circuit board. And the optical waveguide circuit substrate and the holding substrate are bonded and fixed.
[0017]
According to a tenth aspect, in the ninth aspect, the optical waveguide circuit board is fixed to a plurality of adhesive surfaces having different depths formed on the holding substrate. I do.
[0018]
According to an eleventh aspect of the present invention, in the ninth or tenth aspect, the optical waveguide circuit board is fixed by contacting the plurality of projecting reference surfaces formed on the holding substrate. It is characterized.
[0019]
According to a twelfth aspect of the present invention, in the ninth, tenth or eleventh aspect, a pedestal is formed on a deep step surface of the holding substrate, and a heat conductive material is provided on the pedestal. I do.
[0020]
According to a thirteenth aspect of the present invention, in the invention according to any one of the ninth to twelfth aspects, a light receiving element or a light emitting element disposed at a position facing the core of the optical waveguide circuit board, An optical component with a substrate having a fixed substrate for holding a light receiving element or a light emitting element is formed on the holding substrate.
[0021]
According to a fourteenth aspect of the present invention, in the thirteenth aspect, a reference surface serving as a contact surface with the substrate-mounted optical component is formed on the holding substrate on which the substrate-mounted optical component is mounted. Forming an adhesive surface, which is a plurality of step surfaces separated by at least two or more steps having different depths, and adhering to a gap between the step surface having a smaller depth with respect to the reference surface and the optical component with a substrate. An optical component is filled, and the optical component with a substrate and the holding substrate are bonded and fixed.
[0022]
According to a fifteenth aspect, in the fourteenth aspect, the reference surface and the bonding surface are formed on a side wall of the holding substrate.
[0023]
According to a sixteenth aspect of the present invention, in the invention according to any one of the ninth to fifteenth aspects, a concave portion forming a stepped surface having a depth greater than the reference surface is formed as a relief groove for the adhesive. It is characterized by doing.
[0024]
With such a configuration, by fixing the optical waveguide circuit substrate and the optical component with the substrate so that the uppermost surface of the bonding surfaces that are the step surfaces having different depths provided on the holding substrate is in contact with the uppermost surface as a reference surface. Thus, the optical waveguide circuit board and the optical component with the board can be fixed with high accuracy. Furthermore, since the step between the reference surface and the adhesive surface is secured as the thickness of the adhesive, the desired step is set in consideration of the shrinkage ratio during curing of the adhesive and the hardness after curing, thereby achieving high reliability. It is possible to provide a planar optical circuit component having flexibility.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[Example 1]
FIGS. 1 to 3 are configuration diagrams for explaining a planar optical circuit component according to a first embodiment of the present invention. FIG. 1 is a configuration diagram before fixing each component, and FIG. 2 is a diagram after fixing each component. FIG. 3 is a sectional view of the same. In the figure, reference numeral 101 denotes an optical waveguide circuit board, 102 denotes a core, 103 denotes a clad, 104 denotes a flat substrate, 114 denotes an adhesive, 120 denotes a holding substrate, 121 denotes a reference surface, 122 denotes an adhesive surface, and 123 denotes a groove for the adhesive. Is shown.
[0026]
The planar optical circuit component of the present invention includes a silica-based optical waveguide circuit substrate 101 and a holding substrate 120. The optical waveguide circuit substrate 101 has a core 102 having a high refractive index on a planar substrate 104, And a clad 103 having a low refractive index formed so as to surround the core 102.
[0027]
In addition, the holding substrate 120 has a plurality of bonding surfaces 122 which are a plurality of step surfaces separated by a plurality of steps having different depths, and has a step higher than the bonding surface 122 at both ends so as to make contact with the optical waveguide circuit board 101. A reference surface 121 serving as a surface is provided.
[0028]
The optical waveguide circuit substrate 101 is fixed so as to be in close contact with the uppermost surface serving as the reference surface 121 of the holding substrate 120. In this fixing method, first, an appropriate amount of adhesive 114 is applied to an adhesive surface 122 which is a step surface at a relatively shallow position as viewed from the reference surface 121 of the holding substrate 120, and then the optical waveguide circuit substrate 101 The optical waveguide circuit substrate 101 and the holding substrate 120 are fixed by positioning the optical waveguide circuit substrate 101 and the reference surface 121 in close contact with each other and curing the adhesive.
[0029]
In the first embodiment, even when a highly viscous elastic adhesive or the like is filled, the thickness of the adhesive layer changes depending on the position and pressure at which the optical waveguide circuit substrate 101 is held in close contact with the holding substrate 120. In order to stably fix the optical waveguide circuit board 101 without performing the above, the concave portion forming the deep stepped surface is formed as an escape groove 123 from which excess adhesive escapes.
[0030]
Also, by holding down the optical waveguide circuit substrate 101 so as to be in contact with the reference surface 121 of the holding substrate 120, the applied adhesive 114 is desired between the adhesive surface 122 of the optical waveguide circuit substrate 101 and the holding substrate 120. Is formed. Here, by making the area (width) of the reference surface 121 relatively small, the adhesive 114 remaining on the reference surface 121 is reduced as much as possible, and the optical waveguide circuit substrate 101 is stably fixed on the holding substrate 120. Can be.
[0031]
In the first embodiment, the width d1 of the reference surface 121 is set to 1 mm. However, if the width d1 is 10 mm or less, it is confirmed that the same effect as the first embodiment is obtained. Further, since the adhesive layer can be segmented by forming a plurality of escape grooves 123 of the adhesive 114, the optical waveguide circuit substrate 101 can be brought into close contact with the reference surface 121 of the holding substrate 120 with a small holding pressure, and Since the change in the adhesive layer when the adhesive 114 is hardened is small, the optical waveguide substrate 101 can be fixed at a desired height.
[0032]
If the thickness of the adhesive layer for fixing the optical waveguide circuit substrate 101 to the holding substrate 120 is too small, sufficient adhesive strength cannot be obtained. Therefore, it is necessary to control the thickness of the adhesive layer to an appropriate value. Here, by controlling the adhesive layer in consideration of the contraction rate of the adhesive 114, when the adhesive 114 contracts, there is an effect of bringing the optical waveguide circuit substrate 101 into close contact with the holding substrate 120.
[0033]
In Example 1, since an adhesive having a shrinkage of several percent was used, the step d2 between the reference surface 121 and the bonding surface 122 was set to 0.03 mm as shown in FIG. The step d3 of the clearance groove 123 was 0.5 mm. In general, since the shrinkage of the adhesive is about several percent, it is desirable to set the step between the reference surface 121 and the bonding surface 122 to 0.1 mm or less.
[0034]
In the first embodiment, the holding substrate 120 is formed by cutting an aluminum plate by machining, and fixing the optical waveguide circuit substrate 101 to the holding substrate 120 by a height of 0.01 mm or less by fixing with an elastic adhesive. It was confirmed that it can be fixed with accuracy. Furthermore, it was confirmed that there was no deterioration such as peeling even after a temperature cycle (−40 ° C. to 75 ° C., 100 cycles) test.
[0035]
In the first embodiment, aluminum is used as the material of the holding substrate 120. However, similar effects can be obtained by using other metals or non-metals such as plastics and ceramics. In addition, although machining is used as a means for forming a surface having a step, it can also be manufactured with high precision by molding.
[0036]
[Example 2]
4 and 5 are configuration diagrams for explaining a planar optical circuit component according to a second embodiment of the present invention. FIG. 4 is a configuration diagram before fixing each component, and FIG. 5 is a diagram after fixing each component. FIG. 4 is a diagram in which the flat optical circuit component of FIG. In the figure, reference numeral 201 denotes an optical waveguide circuit substrate, 202 denotes a core, 203 denotes a clad, 204 denotes a plane substrate (silicon substrate), 205 denotes a slab waveguide, 206 denotes an array waveguide, 213 denotes a heat conductive agent, and 214 denotes an adhesive. , 220 is a holding substrate, 221 is a reference surface, 222 is an adhesive surface, 223 is an adhesive escape groove, 224 is a pedestal, 231 is a heat sink, and 232 is a Peltier element.
[0037]
The planar optical circuit component according to the second embodiment includes an optical waveguide circuit substrate 201 and a holding substrate 220. The optical waveguide circuit substrate 201 is formed of a silica-based glass having a high refractive index on a planar substrate 204. A core 202 and a clad 203 having a low refractive index and formed so as to surround the core 202 are provided.
[0038]
In general, the optical waveguide circuit substrate 201 made of such a composite material has a slight curvature due to a difference in thermal expansion coefficient between the silicon substrate 204 and the glass forming the optical waveguide. The warpage of the optical waveguide circuit substrate 201 does not have a constant curvature over the entire substrate, and varies depending on the location. Therefore, when the optical waveguide circuit substrate 201 is supported on one large surface or four points, it is difficult to stably fix the optical waveguide circuit substrate 201 with play. In view of this, the holding substrate 220 of the second embodiment is configured so that three projection-shaped reference surfaces are provided as the reference surface 221 so that the optical waveguide circuit substrate 201 can be stably supported.
[0039]
On the optical waveguide circuit board 201, an arrayed waveguide grating including two slab waveguides 205 and a plurality of arrayed waveguides 206 connecting between the slab waveguides 205 is formed as a functional circuit. The array waveguide grating can separate or multiplex incident light for each wavelength by controlling the optical path difference of light propagating through the array waveguide 205 with high accuracy. It is a functional circuit. Therefore, it is necessary to control the temperature of the arrayed waveguide grating using the Peltier element 232 or the like so that the demultiplexing wavelength characteristic does not change due to a change in environmental temperature.
[0040]
Further, it is necessary to fix the optical waveguide circuit substrate 201 to the holding substrate 220 so that stress is not applied. Therefore, when fixing the optical waveguide circuit substrate 201 on the holding substrate 220, the pedestal 224 is provided immediately below the array waveguide 206, that is, the pedestal 224 is provided on a deep step surface, and the pedestal 224 is provided with the heat conductive agent 213. Is applied, thermal connection between the holding substrate 220 and the optical waveguide circuit substrate 201 is realized.
[0041]
The height of the pedestal 224 was made such that the gap between the optical waveguide circuit board 201 and the pedestal 224 was 0.1 mm in consideration of the reference surface 221 of the holding substrate 220 and the amount of warpage of the optical waveguide circuit board 201. The base 224 is raised one step so as to be surrounded by the escape groove 223 so that when the amount of the applied heat conductive agent 213 is large, the excess heat conductive agent 213 flows into the escape groove 223. Since the escape groove 223 is not completely filled with the adhesive or the heat conductive agent, the effect of reducing the stress on the substrate is smaller than that in which the entire surface of the optical waveguide circuit board 201 is fixed with the adhesive or the heat conductive agent. is there.
[0042]
The optical waveguide circuit substrate 201 and the holding substrate 220 are formed by applying a heat conductive agent and an adhesive to the pedestal 224 and the bonding surface 222, respectively, and then forming three projection-shaped reference surfaces provided on the optical waveguide circuit substrate 201 and the holding substrate 220. It was fixed so that it was in close contact with the surface. In order to confirm the effectiveness of the planar optical circuit component of the second embodiment, the holding substrate 220 manufactured on the Peltier element 232 fixed on the heat sink 231 is fixed so that the back surface thereof is in contact with the Peltier device 232, and the demultiplexing with respect to the environmental temperature is performed. The wavelength characteristics were evaluated.
[0043]
As a result, it was confirmed that by driving the Peltier element 232 at an ambient temperature of 20 to 60 degrees, the temperature change of the optical waveguide circuit board 201 could be maintained at 0.1 degrees or less. In addition, it has been confirmed that there is no deterioration in characteristics when the optical waveguide circuit substrate 201 is bonded and fixed to the holding substrate 220. The size of the projecting reference surface used in Example 2 was 1 mm in width, 2 mm in length, and 0.03 mm in height.
[0044]
[Example 3]
6 to 8 are structural views for explaining a planar optical circuit component according to a third embodiment of the present invention. FIG. 6 is a structural diagram before fixing each component, and FIG. 7 is a diagram after fixing each component. FIG. 8 is a side view after fixing of each component.
[0045]
In the figure, reference numeral 301 denotes an optical waveguide circuit substrate, 302 denotes a core, 303 denotes a clad, 304 denotes a flat substrate, 314 denotes an adhesive, 320 denotes a holding substrate, 321 denotes a first reference surface, 322 denotes a first bonding surface, and 323. Is a relief groove for the first adhesive, 324 is a second reference surface, 325 is a second adhesive surface, 326 is a relief groove for the second adhesive, 330 is an optical component with a substrate, 331 is a light receiving element, 332 Is a fixed substrate of the light receiving element, 341 is a third reference surface, 342 is a third adhesive surface, 343 is a relief groove for the third adhesive, 344 is a fourth reference surface, 345 is a fourth adhesive surface, 346 denotes a fourth adhesive escape groove, 347 denotes a fifth reference surface, 348 denotes a fifth adhesive surface, and 349 denotes a fifth adhesive escape groove.
[0046]
The planar optical circuit component according to the third embodiment includes a quartz-based optical waveguide circuit substrate 301, an optical component with a substrate 330 including a light receiving element 331 fixed to a fixed substrate 332, and a holding substrate 320. . The optical waveguide circuit substrate 301 includes, on a plane substrate 304, a core 302 having a high refractive index and a clad 303 having a low refractive index formed so as to surround the core 302.
[0047]
The holding substrate 320 has an adhesive surface which is a plurality of step surfaces separated by a plurality of steps having different depths at portions which are in contact with the bottom surface and side surfaces of the optical waveguide circuit substrate 301 or the optical component 330 with a substrate. The first and second reference surfaces 321 and 324 and the third and fourth reference surfaces 341 and 344 are arranged such that the optical axis of the core 302 of the optical waveguide circuit board 301 is at the center of the light receiving element 331 of the optical component 330 with a substrate. They were manufactured by controlling the relative heights in the y and z directions with high precision so as to match.
[0048]
The position of the optical waveguide circuit board 301 in the x direction is based on the side surface of the step forming the second reference plane 324, and the optical component with board 330 is supported using the fifth reference plane 347. The optical waveguide circuit board 301, the optical component with board 330, and the holding board 320 are fixed via an adhesive 314 applied to the respective bonding surfaces 322, 324, 342, 344, 348. The excessively applied adhesive 314 flows into the escape grooves 323, 326, 343, and 346, whereby the optical waveguide circuit board 301 and the optical component with board 330 can be fixed at desired positions.
[0049]
With the planar optical circuit component of the third embodiment, the optical axis of the core 302 of the optical waveguide circuit board 301 can be aligned with the center of the light receiving element 331 of the optical component 330 with a precision of 20 μm or less. The thickness of the adhesive layer was controlled by setting the step between each reference surface and the adhesive surface at 0.03 mm. It was confirmed that the fabricated planar optical circuit component had no characteristic deterioration even in a temperature cycle test.
[0050]
【The invention's effect】
As described above, according to the present invention, the holding substrate is a reference surface having a contact surface with the optical waveguide circuit substrate and a plurality of step surfaces separated by at least two or more steps having different depths. The optical waveguide circuit substrate and the holding substrate are bonded and fixed by an adhesive provided in the gap between the step surface having a shallow depth with respect to the reference portion and the optical waveguide circuit substrate. By having a plurality of reference surfaces, adhesive surfaces, and relief grooves separated by different steps, there is an effect that the optical waveguide circuit board is accurately held and has high reliability.
[0051]
Also, an optical component with a substrate having a light receiving element or a light emitting element arranged at a position facing the core of the optical waveguide circuit board and a fixed substrate holding the light receiving element or the light emitting element is fixed in the same manner as the optical waveguide circuit board. Since the optical axis is provided on the holding substrate by means, the optical axis of the core of the optical waveguide circuit substrate and the center of the light receiving element of the optical component with the substrate can be aligned with an accuracy of 20 μm or less.
[Brief description of the drawings]
FIG. 1 is a configuration diagram for explaining Embodiment 1 of a planar optical circuit component according to the present invention.
FIG. 2 is a configuration diagram after fixing of each element part.
FIG. 3 is a sectional view after fixing of each element part.
FIG. 4 is a configuration diagram for explaining Embodiment 2 of the planar optical circuit component according to the present invention.
FIG. 5 is a diagram in which a planar optical circuit component after fixing of each component is attached to a temperature control device.
FIG. 6 is a structural diagram for explaining Embodiment 3 of the planar optical circuit component according to the present invention.
FIG. 7 is a top view after fixing of each element part.
FIG. 8 is a side view after fixing of each element part.
FIG. 9 is a view for explaining a conventional optical waveguide fixing method.
[Explanation of symbols]
101, 201, 301 Optical waveguide circuit substrates 102, 202, 302 Cores 103, 203, 303 Claddings 104, 204, 304 Plane substrates 114, 214, 314 Adhesives 120, 220, 320 Holding substrates 121, 221 Reference surfaces 122, 222 Adhesive surfaces 123, 223 Adhesive escape groove 205 Slab waveguide 206 Arrayed waveguide 213 Thermal conductive agent 224 Pedestal 231 Heat sink 232 Peltier element 321 First reference surface 322 First adhesive surface 323 First adhesive surface Escape groove 324 Second reference surface 325 Second adhesive surface 326 Escape groove 330 for second adhesive Optical component 331 with substrate Light receiving element 332 Fixed substrate 341 for light receiving element Third reference surface 342 Third adhesive surface 343 Third adhesive relief groove 344 Fourth reference surface 345 Fourth adhesive surface 346 Fourth adhesive relief groove 3 7 a fifth reference surface 348 fifth adhesive surface 349 fifth adhesive escape groove 401 optical waveguide board 414 glue 450 trough-shaped lower holder 450a spacer portion 451 the upper holder of

Claims

On a flat substrate, an optical waveguide circuit substrate including a core having a high refractive index and a clad having a low refractive index formed so as to surround the core, and a holding substrate for fixing the optical waveguide circuit substrate. In the configured planar optical circuit component,
The holding substrate includes a reference surface serving as a contact surface with the optical waveguide circuit substrate, and an adhesive surface serving as a plurality of step surfaces separated by steps having different depths of at least two steps.
The optical waveguide circuit substrate and the holding substrate are adhered and fixed by an adhesive provided in a gap between the step surface having a depth smaller than the reference surface and the optical waveguide circuit substrate. Planar optical circuit parts.

2. The planar optical circuit component according to claim 1, wherein the optical waveguide circuit board is fixed to a plurality of adhesive surfaces having different depths provided on the holding substrate. 3.

The planar optical circuit component according to claim 1, wherein a reference surface of the holding substrate that contacts the optical waveguide circuit substrate is a plurality of protrusion-like reference surfaces.

4. The planar optical circuit component according to claim 1, wherein a heat conductive material is provided on a pedestal provided on a deep step surface of the holding substrate. 5.

An optical component with a substrate having a light receiving element or a light emitting element disposed at a position facing the core of the optical waveguide circuit board and a fixed substrate holding the light receiving element or the light emitting element is provided on the holding substrate. The planar optical circuit component according to any one of claims 1 to 4, wherein:

The holding substrate of the portion for mounting the optical component with a substrate,
A reference surface serving as a contact surface with the substrate-attached optical component, and an adhesive surface that is a plurality of step surfaces separated by at least two or more steps having different depths,
The optical component with a substrate and the holding substrate are bonded and fixed by an adhesive provided in a gap between the stepped surface having a small depth with respect to the reference surface and the optical component with a substrate. A planar optical circuit component according to claim 5.

The planar optical circuit component according to claim 6, wherein the reference surface and the adhesive surface are provided on a side wall of the holding substrate.

The planar optical circuit component according to any one of claims 1 to 7, wherein a concave portion that forms a stepped surface having a depth greater than the reference surface is a relief groove for the adhesive.

On a flat substrate, an optical waveguide circuit substrate including a core having a high refractive index and a clad having a low refractive index formed so as to surround the core, and a holding substrate for fixing the optical waveguide circuit substrate. In the method for manufacturing a planar optical circuit component to be configured,
On the holding substrate, a reference surface serving as a contact surface with the optical waveguide circuit substrate is formed, and a step having an adhesive surface that is a plurality of step surfaces separated by steps having different depths of at least two steps or more is provided. Forming
An adhesive is filled in a gap between the step surface having a smaller depth with respect to the reference surface and the optical waveguide circuit substrate, and the optical waveguide circuit substrate and the holding substrate are bonded and fixed. How to make circuit parts.

10. The method of manufacturing a planar optical circuit component according to claim 9, wherein the optical waveguide circuit board is fixed to a plurality of adhesive surfaces having different depths formed on the holding substrate.

The method of manufacturing a planar optical circuit component according to claim 9, wherein the optical waveguide circuit substrate is brought into contact with and fixed to a plurality of projecting reference surfaces formed on the holding substrate.

The method according to claim 9, wherein a pedestal is formed on a deep step surface of the holding substrate, and a heat conductive material is provided on the pedestal.

Forming an optical component with a substrate having a light receiving element or a light emitting element disposed at a position facing the core of the optical waveguide circuit board, and a fixed substrate holding the light receiving element or the light emitting element on the holding substrate. The method for manufacturing a planar optical circuit component according to claim 9, wherein

On the holding substrate on which the substrate-mounted optical component is mounted, a reference surface serving as a contact surface with the substrate-mounted optical component is formed, and at least two or more steps are separated by different steps having different depths. Form an adhesive surface,
An adhesive is filled into a gap between the stepped surface having a depth smaller than the reference surface and the optical component with a substrate, and the optical component with a substrate and the holding substrate are bonded and fixed. 3. The method for producing a planar optical circuit component according to 1.

15. The method according to claim 14, wherein the reference surface and the adhesive surface are formed on a side wall of the holding substrate.

The method of manufacturing a planar optical circuit component according to any one of claims 9 to 15, wherein a concave portion that forms a stepped surface having a depth greater than the reference surface is used as a relief groove for the adhesive.