JP2004339482A - Curable silicone resin composition - Google Patents

Curable silicone resin composition Download PDF

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JP2004339482A
JP2004339482A JP2004064647A JP2004064647A JP2004339482A JP 2004339482 A JP2004339482 A JP 2004339482A JP 2004064647 A JP2004064647 A JP 2004064647A JP 2004064647 A JP2004064647 A JP 2004064647A JP 2004339482 A JP2004339482 A JP 2004339482A
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group
component
silicone resin
resin composition
curable silicone
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JP4338554B2 (en
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Eiichi Tabei
栄一 田部井
Mitsuhiro Takarada
充弘 宝田
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Shin Etsu Chemical Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a curable silicone resin composition capable of giving a cured product having high hardness and strength and excellent optical transparency in a short wavelength area, and useful as a material for an optical device or an optical part, an insulating material for an electronic device or an electronic part, or a coating material. <P>SOLUTION: This curable silicone resin composition contains (A) an aromatic hydrocarbon compound having at least two hydrogen atoms combining with silicon atoms in such a state that each of the silicon atoms combines with a hydrocarbon skeletal structure of the compound, (B) a cyclic siloxane compound having at least two alkenyl groups combining with silicon atoms, and (C) a hydrosilylation catalyst, or the composition contains (D) an aromatic hydrocarbon compound having at least two alkenyl groups combining with silicon atoms in such a state that each of the silicon atoms combines with a hydrocarbon skeletal structure of the compound, (E) a cyclic siloxane compound having at least two hydrogen atoms combining with silicon atoms, and (C) the hydrosilylation catalyst. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、光学デバイスもしくは光学部品用材料、電子デバイスもしくは電子部品用絶縁材料またはコーティング材料として有用な硬化性シリコーン樹脂組成物に関する。   The present invention relates to a curable silicone resin composition useful as an optical device or optical component material, an electronic device or electronic component insulating material or a coating material.

従来、光学デバイスまたは光学部品用材料、特に発光ダイオード(LED)素子の封止材料としては、一般的にエポキシ樹脂が用いられている。また、シリコーン樹脂に関しても、LED素子のモールド材料等として用いること(特許文献1、特許文献2参照)、またカラーフィルター材料として用いること(特許文献3参照)が試みられているが、実際上の使用例は少ない。   2. Description of the Related Art Conventionally, an epoxy resin is generally used as a material for an optical device or an optical component, particularly, a sealing material for a light emitting diode (LED) element. In addition, silicone resin has been attempted to be used as a molding material for LED elements (see Patent Documents 1 and 2) and as a color filter material (see Patent Document 3). There are few use cases.

近年、白色LEDが注目される中で、これまで問題とされなかったエポキシ封止材の紫外線等による黄変や、小型化に伴う発熱量の増加によるクラック等の問題が発生しており対応が急務となっている。これらの対応策としては、分子中に多量のフェニル基を持つシリコーンレジン硬化物を用いることが検討されている。しかし、今後のLEDの光源としては、より短い波長の光線を生じるものが使用されるようになる傾向にあり、エポキシ封止材およびフェニル基含有シリコーンレジン封止材は短波長領域での光透過性が悪いため、短波長領域の光線を生じるLEDへの適用は問題があった。   In recent years, while attention has been paid to white LEDs, problems such as yellowing of the epoxy encapsulant, which was not a problem until now, due to ultraviolet rays, and cracks due to an increase in heat generation due to miniaturization have occurred. It is urgent. As a countermeasure for these, use of a cured silicone resin having a large amount of phenyl groups in the molecule has been studied. However, there is a tendency to use light sources of shorter wavelengths as light sources for future LEDs, and epoxy encapsulants and phenyl group-containing silicone resin encapsulants transmit light in the short wavelength region. Because of its poor performance, application to LEDs that generate light in the short wavelength region has been problematic.

特開平10−228249号公報JP-A-10-228249 特開平10−242513号公報JP-A-10-242513 特開2000−123981号公報JP 2000-123981 A

本発明は、上記事情に鑑みてなされたもので、光学デバイスもしくは光学部品用材料、電子デバイスもしくは電子部品用絶縁材料またはコーティング材料として有用な、硬度および強度が高く、さらに短波長領域での光透過性に優れた硬化物を与える硬化性シリコーン樹脂組成物を提供することを目的とする。   The present invention has been made in view of the above circumstances, and is useful as a material for an optical device or an optical component, an insulating material or a coating material for an electronic device or an electronic component, having high hardness and strength, and light in a short wavelength region. An object of the present invention is to provide a curable silicone resin composition that gives a cured product having excellent permeability.

本発明者は、上記目的を達成するために鋭意努力を行った結果、ケイ素原子に結合した水素原子またはアルケニル基を、前記ケイ素原子が炭化水素骨格に結合した状態で有する芳香族系炭化水素化合物と、ケイ素原子に結合したアルケニル基または水素原子を有する環状シロキサン化合物とを組み合わせた、ヒドロシリル化反応により硬化するシリコーン樹脂組成物を用いることにより、上記特性を有する硬化物が得られることを見出し、この知見に基づき、本発明を完成させるに至った。   The present inventors have made intensive efforts to achieve the above object, and as a result, an aromatic hydrocarbon compound having a hydrogen atom or an alkenyl group bonded to a silicon atom in a state where the silicon atom is bonded to a hydrocarbon skeleton. And, in combination with a cyclic siloxane compound having an alkenyl group or a hydrogen atom bonded to a silicon atom, by using a silicone resin composition that is cured by a hydrosilylation reaction, it has been found that a cured product having the above properties can be obtained, Based on this finding, the present invention has been completed.

即ち、本発明は、第一に、
(A) ケイ素原子に結合した水素原子少なくとも2個を、前記ケイ素原子が炭化水素骨格に結合した状態で有する芳香族系炭化水素化合物、
(B) ケイ素原子に結合したアルケニル基を少なくとも2個有する環状シロキサン化合物、および
(C) ヒドロシリル化反応触媒
を含む硬化性シリコーン樹脂組成物を提供する(以下、「第一発明」という)。
That is, the present invention firstly
(A) an aromatic hydrocarbon compound having at least two hydrogen atoms bonded to a silicon atom in a state where the silicon atom is bonded to a hydrocarbon skeleton;
(B) a cyclic siloxane compound having at least two alkenyl groups bonded to silicon atoms, and
(C) A curable silicone resin composition containing a hydrosilylation reaction catalyst is provided (hereinafter referred to as "first invention").

更に、本発明は、第二に、
(D) ケイ素原子に結合したアルケニル基少なくとも2個を、前記ケイ素原子が炭化水素骨格に結合した状態で有する芳香族系炭化水素化合物、
(E) ケイ素原子に結合した水素原子を少なくとも2個有する環状シロキサン化合物、および
(C) ヒドロシリル化反応触媒
を含む硬化性シリコーン樹脂組成物を提供する(以下、「第二発明」という)。
Furthermore, the present invention provides, secondly,
(D) an aromatic hydrocarbon compound having at least two alkenyl groups bonded to a silicon atom, wherein the silicon atom is bonded to a hydrocarbon skeleton;
(E) a cyclic siloxane compound having at least two hydrogen atoms bonded to a silicon atom, and
(C) A curable silicone resin composition containing a hydrosilylation reaction catalyst is provided (hereinafter, referred to as "second invention").

(なお、以下、ケイ素原子に結合した水素原子を「SiH基」ということがある。
また、上記第二発明においては、上記芳香族系炭化水素化合物が有するケイ素原子に結合したアルケニル基中の−CH=CH2基と、上記環状シロキサン化合物が有するSiH基とが、一方、上記第一発明においては、上記芳香族系炭化水素化合物が有するSiH基と、上記環状シロキサン化合物が有するケイ素原子に結合したアルケニル基中の−CH=CH2基とが、当業者に周知のヒドロシリル化付加反応を受け、ともに同一の連結構造を形成して、硬化物を与える点において、両者は同等のものである。)
(Hereinafter, a hydrogen atom bonded to a silicon atom may be referred to as a “SiH group”.
Further, in the second invention, the —CH 2CH 2 group in the alkenyl group bonded to the silicon atom in the aromatic hydrocarbon compound and the SiH group in the cyclic siloxane compound, In one invention, the SiH group of the aromatic hydrocarbon compound and the —CH = CH 2 group in the alkenyl group bonded to the silicon atom of the cyclic siloxane compound are combined with a hydrosilylation addition known to those skilled in the art. Both are equivalent in that they undergo a reaction and together form the same connected structure to give a cured product. )

本発明の硬化性シリコーン樹脂組成物は、硬度および強度が高く、短波長領域の光線についても光透過率が高く、透明性に優れた硬化物を与えることができる。従って、発光ダイオード素子の保護、封止もしくは接着、波長変更もしくは調整またはレンズ等の用途に好適に使用できる。また、レンズ材料、光学デバイスもしくは光学部品用封止材、ディスプレイ材料等の各種の光学用材料、電子デバイスもしくは電子部品用絶縁材料、更にはコーティング材料としても使用できる。   The curable silicone resin composition of the present invention has a high hardness and strength, a high light transmittance even for light in a short wavelength region, and can provide a cured product having excellent transparency. Therefore, it can be suitably used for applications such as protection, sealing or adhesion of a light emitting diode element, wavelength change or adjustment, or a lens. Further, it can be used as a lens material, a sealing material for optical devices or optical components, various optical materials such as display materials, an insulating material for electronic devices or electronic components, and a coating material.

以下、本発明につき更に詳しく説明する。   Hereinafter, the present invention will be described in more detail.

第一発明
[(A)芳香族系炭化水素化合物]
(A)成分は、少なくとも2個のSiH基を、前記ケイ素原子が炭化水素骨格に結合した状態で有する芳香族系炭化水素化合物である。
この(A)成分としては、例えば、下記一般式(1):
First invention [(A) aromatic hydrocarbon compound]
The component (A) is an aromatic hydrocarbon compound having at least two SiH groups in a state where the silicon atom is bonded to a hydrocarbon skeleton.
As the component (A), for example, the following general formula (1):

HR12Si−A−SiR34H (1)
(式中、R1、R2、R3およびR4は、独立に、水素原子、または、アルケニル基以外の非置換の炭素原子数1〜12、好ましくは1〜6の一価炭化水素基、アルケニル基以外の置換の炭素原子数1〜12、好ましくは1〜6の一価炭化水素基、および炭素原子数1〜6、好ましくは1〜4のアルコキシ基よりなる群から選ばれる基であり、Aは炭素原子数6〜12、好ましくは6〜10の2価の芳香環含有炭化水素基である)
で表される化合物が好ましい。
HR 1 R 2 Si-A-SiR 3 R 4 H (1)
(Wherein, R 1 , R 2 , R 3 and R 4 independently represent a hydrogen atom or an unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms other than an alkenyl group, preferably 1 to 6) A group selected from the group consisting of substituted monovalent hydrocarbon groups having 1 to 12, preferably 1 to 6, carbon atoms other than alkenyl groups, and alkoxy groups having 1 to 6, preferably 1 to 4 carbon atoms. A is a divalent aromatic ring-containing hydrocarbon group having 6 to 12 carbon atoms, preferably 6 to 10 carbon atoms)
The compound represented by is preferred.

上記R1〜R4がアルケニル基以外の一価炭化水素基である場合、それらとしては、例えば、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、tert-ブチル基、ペンチル基、イソペンチル基、ヘキシル基、sec-ヘキシル基等のアルキル基;フェニル基、o-,m-,p-トリル基等のアリール基;ベンジル基、2-フェニルエチル基等のアラルキル基;およびこれらの基の1個以上の水素原子が、ハロゲン原子、シアノ基、エポキシ基含有基等で置換された、例えば、クロロメチル基、3-クロロプロピル基、3,3,3-トリフルオロプロピル基等のハロゲン化アルキル基、2-シアノエチル基、3-グリシドキシプロピル基等が挙げられる。 When R 1 to R 4 are a monovalent hydrocarbon group other than an alkenyl group, they include, for example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, tert-butyl group, pentyl group, isopentyl Alkyl groups such as a phenyl group, a hexyl group and a sec-hexyl group; aryl groups such as a phenyl group, o-, m- and p-tolyl groups; aralkyl groups such as a benzyl group and a 2-phenylethyl group; Halogenation of, for example, a chloromethyl group, a 3-chloropropyl group, a 3,3,3-trifluoropropyl group or the like in which one or more hydrogen atoms have been substituted with a halogen atom, a cyano group, an epoxy group-containing group, or the like; Examples thereof include an alkyl group, a 2-cyanoethyl group, and a 3-glycidoxypropyl group.

また、上記R1〜R4がアルコキシ基である場合、それらとしては、例えば、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、ブトキシ基、sec-ブトキシ基、tert-ブトキシ基等が挙げられる。
上記の一般式(1)の化合物の中でも、上記R1〜R4の全てがメチル基であるものが、工業的に製造することが容易であり、入手しやすいことから好ましい。
When R 1 to R 4 are alkoxy groups, examples thereof include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a sec-butoxy group, and a tert-butoxy group. .
Among the compounds of the above general formula (1), those in which all of the above R 1 to R 4 are methyl groups are preferred because they are easily produced industrially and are easily available.

上記Aの芳香環含有炭化水素基としては、例えば、o-,m-,p-フェニレン基、トリレン基、o-,m-,p-キシリレン基、下記式で表される2価のアリーレン基等が挙げられる。   Examples of the aromatic ring-containing hydrocarbon group of A include o-, m-, p-phenylene, tolylene, o-, m-, p-xylylene, and divalent arylene represented by the following formula: And the like.

Figure 2004339482
Figure 2004339482

上記(A)成分の好適な具体例を、以下に示すが、これに限定されるものではない。なお、以下、「Me」はメチル基を、「Et」はエチル基を、「Ph」はフェニル基を、「-p-C64-」はパラフェニレン基を、また「-m-C64-」はメタフェニレン基を、意味する。 Preferred specific examples of the component (A) are shown below, but are not limited thereto. Hereinafter, "Me" represents a methyl group, "Et" represents an ethyl group, "Ph" represents a phenyl group, "- p-C 6 H 4 -" is a para-phenylene group, also "-m-C 6 H 4 - "is a metaphenylene group means.

HMe2Si-p-C64-SiMe2
HMe2Si-m-C64-SiMe2
HMePhSi-p-C64-SiMePhH
HMePhSi-m-C64-SiMePhH
HPh2Si-p-C64-SiPh2
HPh2Si-m-C64-SiPh2
HMeEtSi-p-C64-SiMeEtH
HMeEtSi-m-C64-SiMeEtH
H(MeO)2Si-p-C64-Si(OMe)2
H(MeO)2Si-m-C64-Si(OMe)2
HMe2Si-CH2-p-C64-CH2-SiMe2
HMe2Si-CH2-m-C64-CH2-SiMe2
HMePhSi-CH2-p-C64-CH2-SiMePhH
HMePhSi-CH2-m-C64-CH2-SiMePhH
また、この(A)成分は1種単独でも2種以上を組み合わせても使用することができる。
HMe 2 Si-p-C 6 H 4 -SiMe 2 H
HMe 2 Si-m-C 6 H 4 -SiMe 2 H
HMePhSi-p-C 6 H 4 -SiMePhH
HMePhSi-m-C 6 H 4 -SiMePhH
HPh 2 Si-p-C 6 H 4 -SiPh 2 H
HPh 2 Si-m-C 6 H 4 -SiPh 2 H
HMeEtSi-p-C 6 H 4 -SiMeEtH
HMeEtSi-m-C 6 H 4 -SiMeEtH
H (MeO) 2 Si-p-C 6 H 4 -Si (OMe) 2 H
H (MeO) 2 Si-m-C 6 H 4 -Si (OMe) 2 H
HMe 2 Si-CH 2 -pC 6 H 4 -CH 2 -SiMe 2 H
HMe 2 Si-CH 2 -mC 6 H 4 -CH 2 -SiMe 2 H
HMePhSi-CH 2 -p-C 6 H 4 -CH 2 -SiMePhH
HMePhSi-CH 2 -mC 6 H 4 -CH 2 -SiMePhH
The component (A) can be used alone or in combination of two or more.

[(B)環状シロキサン化合物]
(B)成分は、上記(A)成分とともにヒドロシリル化付加反応を受ける、ケイ素原子に結合したアルケニル基を少なくとも2個有する環状シロキサン化合物である。
この(B)成分としては、例えば、下記一般式(2):
[(B) Cyclic siloxane compound]
Component (B) is a cyclic siloxane compound having at least two silicon-bonded alkenyl groups that undergoes a hydrosilylation addition reaction with component (A).
As the component (B), for example, the following general formula (2):

(Ra5SiO)n(R67SiO)m (2)
(式中、Raは炭素原子数2〜6、好ましくは2〜3のアルケニル基であり、R5、R6およびR7は、独立に、非置換もしくは置換の炭素原子数1〜12、好ましくは1〜6の一価炭化水素基であり、nは2〜10の整数であり、mは0〜8の整数であり、ただしn+mは3〜10、好ましくは3〜6の整数である)
で表される環状シロキサン化合物が好ましい。
(R a R 5 SiO) n (R 6 R 7 SiO) m (2)
(Wherein, R a is an alkenyl group having 2 to 6, preferably 2 to 3 carbon atoms, and R 5 , R 6 and R 7 are each independently an unsubstituted or substituted C 1 to C 12, Preferably, it is a monovalent hydrocarbon group of 1 to 6, n is an integer of 2 to 10, m is an integer of 0 to 8, provided that n + m is an integer of 3 to 10, preferably 3 to 6. )
The cyclic siloxane compound represented by is preferred.

上記Raとしては、例えば、ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、ペンテニル基、ヘキセニル基等が挙げられ、中でもビニル基およびアリル基が好ましく、特にビニル基が好ましい。
上記R5〜R7としては、上記Raについて例示したアルケニル基、および上記R1〜R4について例示した一価炭化水素基が例示される。
Examples of the Ra include a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, a pentenyl group, a hexenyl group, and the like. Among them, a vinyl group and an allyl group are preferable, and a vinyl group is particularly preferable.
Examples of R 5 to R 7 include the alkenyl groups exemplified for R a and the monovalent hydrocarbon groups exemplified for R 1 to R 4 .

上記(B)成分の好適な具体例を、以下に示すが、これに限定されるものではない。なお、以下、「Vi」はビニル基を、「Allyl」はアリル基を、また、「Pr」はn-プロピル基を意味する。
(ViMeSiO)3
(ViMeSiO)4
(AllylMeSiO)3
(AllylMeSiO)4
(ViMeSiO)2(Me2SiO)2
(ViMeSiO)3(Me2SiO)1
(ViMeSiO)2(PrMeSiO)2
(ViMeSiO)3(PrMeSiO)1
また、この(B)成分は1種単独でも2種以上を組み合わせても使用することができる。
Preferred specific examples of the component (B) are shown below, but are not limited thereto. Hereinafter, "Vi" means a vinyl group, "Allyl" means an allyl group, and "Pr" means an n-propyl group.
(ViMeSiO) 3
(ViMeSiO) 4
(AllylMeSiO) 3
(AllylMeSiO) 4
(ViMeSiO) 2 (Me 2 SiO) 2
(ViMeSiO) 3 (Me 2 SiO) 1
(ViMeSiO) 2 (PrMeSiO) 2
(ViMeSiO) 3 (PrMeSiO) 1
The component (B) can be used alone or in combination of two or more.

第一発明の組成物中における(A)成分と(B)成分の含有量は、全組成物中に存在するアルケニル基1モルに対する、(A)成分中のSiH基の量が好ましくは 0.5〜2.0モル、より好ましくは 0.8〜1.5モルとなる量である。このとき、全組成物中に存在するアルケニル基に対する(B)成分中のアルケニル基の割合は10モル%以上が好ましく、特に30モル%以上が好ましい。組成物中にアルケニル基を有する成分として(B)成分しか存在しない場合には、(B)成分中に含有されるアルケニル基1モルに対する、(A)成分中のSiH基の量が好ましくは 0.5〜2.0モル、より好ましくは 0.8〜1.5モルとなる量である。   The content of the component (A) and the component (B) in the composition of the first invention is preferably such that the amount of the SiH group in the component (A) is 0.5 to 1 mol of the alkenyl group present in the whole composition. The amount is 2.0 mol, more preferably 0.8 to 1.5 mol. At this time, the ratio of the alkenyl group in the component (B) to the alkenyl group present in the whole composition is preferably at least 10 mol%, particularly preferably at least 30 mol%. When only the component (B) is present as a component having an alkenyl group in the composition, the amount of the SiH group in the component (A) is preferably 0.5 to 1 mol of the alkenyl group contained in the component (B). To 2.0 mol, more preferably 0.8 to 1.5 mol.

[(C)ヒドロシリル化反応触媒]
(C)成分のヒドロシリル化反応触媒としては、従来から公知のものが全て使用することができる。具体例としては、例えば、白金黒、塩化第2白金、塩化白金酸、塩化白金酸と一価アルコールとの反応生成物、塩化白金酸とオレフィン類との錯体、白金ビスアセトアセテート等の白金系触媒;パラジウム系触媒、ロジウム系触媒等の白金族金属系触媒が挙げられる。
なお、この(C)成分の配合量は、触媒としての有効量であればよい。(A)成分と(B)成分との合計重量に対して、白金族金属原子として、通常、1〜500 ppm、特に2〜100 ppm程度配合することが好ましい。
[(C) hydrosilylation reaction catalyst]
As the hydrosilylation reaction catalyst of the component (C), any conventionally known hydrosilylation catalyst can be used. Specific examples include, for example, platinum black, platinous chloride, chloroplatinic acid, a reaction product of chloroplatinic acid and a monohydric alcohol, a complex of chloroplatinic acid and an olefin, and a platinum-based compound such as platinum bisacetoacetate. Catalyst: Platinum group metal-based catalysts such as palladium-based catalysts and rhodium-based catalysts are exemplified.
The compounding amount of the component (C) may be any effective amount as a catalyst. It is usually preferable to add about 1 to 500 ppm, especially about 2 to 100 ppm, as a platinum group metal atom, based on the total weight of the components (A) and (B).

第二発明
[(D)芳香族系炭化水素化合物]
(D)成分は、ケイ素原子に結合したアルケニル基少なくとも2個を、前記ケイ素原子が炭化水素骨格に結合した状態で有する芳香族系炭化水素化合物である。
この(D)成分としては、例えば、下記一般式(3):
Second invention [(D) aromatic hydrocarbon compound]
The component (D) is an aromatic hydrocarbon compound having at least two alkenyl groups bonded to a silicon atom in a state where the silicon atom is bonded to a hydrocarbon skeleton.
As the component (D), for example, the following general formula (3):

a89Si−A−SiR1011b (3)
(式中、RaおよびRbは、独立に、炭素原子数2〜6、好ましくは2〜3のアルケニル基であり、R8、R9、R10およびR11は、独立に、非置換の炭素原子数1〜12、好ましくは1〜6の一価炭化水素基、置換の炭素原子数1〜12、好ましくは1〜6の一価炭化水素基、および炭素原子数1〜6、好ましくは1〜4のアルコキシ基よりなる群から選ばれる基であり、Aは上記式(1)に関して定義と同じである)
で表される芳香族系炭化水素化合物が好ましい。
上記RaおよびRbの例としては、上記式(2)に関して定義のRaについて例示した基が挙げられる。また、上記R8〜R11の例としては、上記式(2)に関して定義のRaについて例示した基、および上記式(1)に関して定義のR1〜R4について例示した基(但し、水素原子を除く)が例示される。
R a R 8 R 9 Si- A-SiR 10 R 11 R b (3)
Wherein R a and R b are independently an alkenyl group having 2 to 6, preferably 2 to 3 carbon atoms, and R 8 , R 9 , R 10 and R 11 are each independently unsubstituted A monovalent hydrocarbon group having 1 to 12 carbon atoms, preferably 1 to 6, a substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, preferably 1 to 6, and 1 to 6 carbon atoms, preferably Is a group selected from the group consisting of 1 to 4 alkoxy groups, and A is the same as defined for the above formula (1))
Is preferred.
Examples of the above R a and R b include the groups exemplified for R a defined with respect to the above formula (2). Examples of R 8 to R 11 include the groups exemplified for R a defined with respect to the above formula (2) and the groups exemplified for R 1 to R 4 defined for the above formula (1) (however, hydrogen (Excluding atoms).

上記(D)成分の好適な具体例を、以下に示すが、これに限定されるものではない。
ViMe2Si-p-C64-SiMe2Vi
ViMe2Si-m-C64-SiMe2Vi
ViMePhSi-p-C64-SiMePhVi
ViMePhSi-m-C64-SiMePhVi
ViMe2Si-CH2-p-C64-CH2-SiMe2Vi
ViMe2Si-CH2-m-C64-CH2-SiMe2Vi
ViMePhSi-CH2-p-C64-CH2-SiMePhVi
ViMePhSi-CH2-m-C64-CH2-SiMePhVi
ViMe(MeO)-CH2-p-C64-CH2-Si(OMe)MeVi
ViMe(MeO)-CH2-m-C64-CH2-Si(OMe)MeVi
ViMe(EtO)-CH2-p-C64-CH2-Si(OEt)MeVi
ViMe(EtO)-CH2-m-C64-CH2-Si(OEt)MeVi
また、この(D)成分は1種単独でも2種以上を組み合わせても使用することができる。
Preferred specific examples of the component (D) are shown below, but are not limited thereto.
ViMe 2 Si-p-C 6 H 4 -SiMe 2 Vi
ViMe 2 Si-m-C 6 H 4 -SiMe 2 Vi
ViMePhSi-p-C 6 H 4 -SiMePhVi
ViMePhSi-m-C 6 H 4 -SiMePhVi
ViMe 2 Si-CH 2 -pC 6 H 4 -CH 2 -SiMe 2 Vi
ViMe 2 Si-CH 2 -mC 6 H 4 -CH 2 -SiMe 2 Vi
ViMePhSi-CH 2 -pC 6 H 4 -CH 2 -SiMePhVi
ViMePhSi-CH 2 -mC 6 H 4 -CH 2 -SiMePhVi
ViMe (MeO) -CH 2 -p- C 6 H 4 -CH 2 -Si (OMe) MeVi
ViMe (MeO) -CH 2 -m- C 6 H 4 -CH 2 -Si (OMe) MeVi
ViMe (EtO) -CH 2 -p- C 6 H 4 -CH 2 -Si (OEt) MeVi
ViMe (EtO) -CH 2 -m- C 6 H 4 -CH 2 -Si (OEt) MeVi
The component (D) can be used alone or in combination of two or more.

[(E)環状シロキサン化合物]
(E)成分は、上記(D)成分とともにヒドロシリル化付加反応を受ける、SiH基を少なくとも2個有する環状シロキサン化合物である。
この(E)成分としては、例えば、下記一般式(4):
[(E) Cyclic siloxane compound]
The component (E) is a cyclic siloxane compound having at least two SiH groups, which undergoes a hydrosilylation addition reaction together with the component (D).
As the component (E), for example, the following general formula (4):

(HR12SiO)n(R1314SiO)m (4)
(式中、R12、R13およびR14は、独立に、水素原子、またはアルケニル基以外の非置換もしくは置換の炭素原子数1〜12、好ましくは1〜6の一価炭化水素基であり、nは2〜10の整数であり、mは0〜8の整数であり、ただしn+mは3〜10、好ましくは3〜6の整数である)
で表される環状シロキサン化合物が好ましい。
上記R12〜R14の例としては、上記式(1)に関して定義のR1〜R4について例示した基(但し、アルコキシ基を除く)が挙げられる。
(HR 12 SiO) n (R 13 R 14 SiO) m (4)
(Wherein, R 12 , R 13 and R 14 are each independently a hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, preferably 1 to 6 other than an alkenyl group) , N is an integer from 2 to 10, m is an integer from 0 to 8, provided that n + m is an integer from 3 to 10, preferably from 3 to 6.
The cyclic siloxane compound represented by is preferred.
Examples of the above R 12 to R 14 include the groups exemplified for R 1 to R 4 defined with respect to the above formula (1) (excluding the alkoxy group).

上記(E)成分の好適な具体例を、以下に示すが、これに限定されるものではない。
(HMeSiO)3
(HMeSiO)4
(HMeSiO)2(Me2SiO)1
(HMeSiO)3(Me2SiO)1
(HMeSiO)4(Me2SiO)1
また、この(E)成分は1種単独でも2種以上を組み合わせても使用することができる。
Preferred specific examples of the component (E) are shown below, but are not limited thereto.
(HMeSiO) 3
(HMeSiO) 4
(HMeSiO) 2 (Me 2 SiO) 1
(HMeSiO) 3 (Me 2 SiO) 1
(HMeSiO) 4 (Me 2 SiO) 1
The component (E) can be used alone or in combination of two or more.

第二発明の組成物中における(D)成分と(E)成分の含有量は、(D)成分中に含有されるアルケニル基1モルに対する、全組成物中のSiH基の量が好ましくは 0.5〜2.0モル、より好ましくは 0.8〜1.5モルとなる量である。このとき、全組成物中に存在するSiH基に対する(E)成分中のSiH基の割合は10モル%以上が好ましく、特に30モル%以上が好ましい。組成物中にSiH基を有する成分として(E)成分しか存在しない場合には、(D)成分中に含有されるアルケニル基1モルに対する、(E)成分中のSiH基の量が好ましくは 0.5〜2.0モル、より好ましくは 0.8〜1.5モルとなる量である。   The content of the component (D) and the component (E) in the composition of the second invention is preferably such that the amount of the SiH group in the whole composition per 1 mol of the alkenyl group contained in the component (D) is 0.5. To 2.0 mol, more preferably 0.8 to 1.5 mol. At this time, the ratio of the SiH groups in the component (E) to the SiH groups present in the entire composition is preferably at least 10 mol%, particularly preferably at least 30 mol%. When only the component (E) is present as a component having a SiH group in the composition, the amount of the SiH group in the component (E) is preferably 0.5 to 1 mol of the alkenyl group contained in the component (D). To 2.0 mol, more preferably 0.8 to 1.5 mol.

[(C)ヒドロシリル化反応触媒]
(C)成分のヒドロシリル化反応触媒については、上記と同じものが例示される。また、(D)成分と(E)成分との合計重量に対する(C)成分の好ましい配合量も上記と同様である。
[(C) hydrosilylation reaction catalyst]
As the hydrosilylation reaction catalyst of the component (C), the same ones as described above are exemplified. The preferred amount of component (C) relative to the total weight of component (D) and component (E) is the same as described above.

その他の配合成分
本発明の組成物に、上記(A)〜(E)成分に加えて、本発明の効果を損なわない範囲で他の成分を配合することは任意である。
例えば、組成物の粘度、硬化物の硬度等を調整するために、ケイ素原子に結合したアルケニル基またはSiH基を有する直鎖状ジオルガノポリシロキサンもしくは網状オルガノポリシロキサン、非反応性の直鎖状もしくは環状ジオルガノポリシロキサン等を配合してもよい。
Other Compounding Components In addition to the above components (A) to (E), it is optional to add other components to the composition of the present invention as long as the effects of the present invention are not impaired.
For example, in order to adjust the viscosity of the composition, the hardness of the cured product, etc., a linear diorganopolysiloxane or network organopolysiloxane having an alkenyl group or SiH group bonded to a silicon atom, a non-reactive linear Alternatively, a cyclic diorganopolysiloxane or the like may be blended.

中でも、ケイ素原子に結合したアルケニル基またはSiH基を有する単官能性構造単位と4官能性構造単位(SiO2)とから構成される網状オルガノポリシロキサンを配合すると、透明性が高く、耐候性も付与された硬化物が得られるので好ましい。 Above all, when a network organopolysiloxane composed of a monofunctional structural unit having an alkenyl group or a SiH group bonded to a silicon atom and a tetrafunctional structural unit (SiO 2 ) is blended, high transparency and weather resistance are obtained. It is preferable because the applied cured product can be obtained.

上記第一発明において、(F1)ケイ素原子に結合したアルケニル基を有する網状オルガノポリシロキサンを配合する場合、その配合量は、該(F1)成分が有するアルケニル基と上記(B)成分が有するアルケニル基との合計量1モル当り、上記(A)成分が有するSiH基が好ましくは 0.5〜2.0モル、より好ましくは 0.8〜1.5モルとなる量である。また、(F2)SiH基を有する網状オルガノポリシロキサンを配合する場合、その配合量は、該(F2)成分が有するSiH基と上記(A)成分が有するSiH基との合計量が、上記(B)成分が有するアルケニル基1モル当り好ましくは 0.5〜2.0モル、より好ましくは 0.8〜1.5モルとなる量である。   In the first invention, (F1) when blending a network organopolysiloxane having an alkenyl group bonded to a silicon atom, the blending amount thereof, the alkenyl group of the component (F1) and the alkenyl of the component (B) The amount of the SiH group contained in the component (A) is preferably 0.5 to 2.0 mol, more preferably 0.8 to 1.5 mol, per 1 mol of the total amount of the group. Further, when the (F2) reticulated organopolysiloxane having a SiH group is compounded, the compounding amount is such that the total amount of the SiH group of the component (F2) and the SiH group of the component (A) is as described above ( The amount is preferably 0.5 to 2.0 mol, more preferably 0.8 to 1.5 mol, per 1 mol of the alkenyl group contained in the component (B).

一方、上記第二発明において、(F1)ケイ素原子に結合したアルケニル基を有する網状オルガノポリシロキサンを配合する場合、その配合量は、該(F1)成分が有するアルケニル基と上記(D)成分が有するアルケニル基との合計量1モル当り、上記(E)成分が有するSiH基が好ましくは 0.5〜2.0モル、より好ましくは 0.8〜1.5モルとなる量である。また、(F2)SiH基を有する網状オルガノポリシロキサンを配合する場合、その配合量は、該(F2)成分が有するSiH基と上記(E)成分が有するSiH基との合計量が、上記(D)成分が有するアルケニル基1モル当り好ましくは 0.5〜2.0モル、より好ましくは 0.8〜1.5モルとなる量である。   On the other hand, in the second invention, when (F1) a network organopolysiloxane having an alkenyl group bonded to a silicon atom is compounded, the compounding amount is such that the alkenyl group of the component (F1) and the component (D) The amount of the SiH group contained in the component (E) is preferably 0.5 to 2.0 mol, more preferably 0.8 to 1.5 mol, per 1 mol of the total amount of the compound and the alkenyl group. Further, when the (F2) reticulated organopolysiloxane having a SiH group is compounded, the compounding amount is such that the total amount of the SiH group of the component (F2) and the SiH group of the component (E) is (( The amount is preferably 0.5 to 2.0 mol, more preferably 0.8 to 1.5 mol, per 1 mol of the alkenyl group contained in the component (D).

また、必要なポットライフを確保するために、1-エチニルシクロヘキサノール、3,5-ジメチル-1-ヘキシン-3-オール等の反応制御剤を配合することができる。更に、透明性に影響を与えない範囲で、硬化物の強度を向上させるためにヒュームドシリカ等の無機質充填剤を配合してもよいし、必要に応じて、染料、顔料、難燃剤等を配合してもよい。
なお、本発明組成物の硬化条件は、その量により異なり、特に制限されないが、通常、60〜180℃、5〜180分の条件とすることが好ましい。
Further, in order to secure a necessary pot life, a reaction control agent such as 1-ethynylcyclohexanol and 3,5-dimethyl-1-hexyn-3-ol can be blended. Further, within a range that does not affect the transparency, an inorganic filler such as fumed silica may be blended to improve the strength of the cured product, and, if necessary, a dye, a pigment, a flame retardant, and the like. You may mix.
The curing conditions of the composition of the present invention vary depending on the amount thereof, and are not particularly limited. However, it is usually preferable to set the conditions at 60 to 180 ° C. for 5 to 180 minutes.

本発明の組成物は用途に応じて所定の基板に塗布した後、上記条件で加熱することにより硬化させることができる。   The composition of the present invention can be cured by heating under the above conditions after being applied to a predetermined substrate according to the application.

以下、実施例および比較例を示し、本発明を具体的に説明するが、本発明はこれらの実施例に制限されるものではない。   Hereinafter, the present invention will be described specifically with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.

[実施例1]
(A) HMe2Si-p-C64-SiMe2H:53重量部、
(B) (ViMeSiO)4:47重量部(なお、(A)中のSiH/(B)中のVi(モル比)=1.0)、および
1-エチニルシクロヘキサノール:0.03重量部
を均一に混合し、この混合物に、
(C) 白金-ビニルシロキサン錯体:白金金属原子として(A)と(B)との合計量に対して20 ppmとなる量
を添加しさらに均一に混合して組成物を得た。この組成物を、ガラス板で組んだ型の中に4mm厚になるように流し込み、150℃で2時間加熱して硬化物を得た。
[Example 1]
(A) HMe 2 Si-p-C 6 H 4 -SiMe 2 H: 53 parts by weight,
(B) (ViMeSiO) 4 : 47 parts by weight (SiH in (A) / Vi (molar ratio) in (B) = 1.0), and
1-ethynylcyclohexanol: 0.03 parts by weight are uniformly mixed, and
(C) Platinum-vinylsiloxane complex: A platinum metal atom was added in an amount of 20 ppm based on the total amount of (A) and (B), and the mixture was further uniformly mixed to obtain a composition. This composition was poured into a mold assembled from glass plates so as to have a thickness of 4 mm, and heated at 150 ° C. for 2 hours to obtain a cured product.

[実施例2]
実施例1に記載の(A)成分および(B)成分に代えて、
(D) ViMe2Si-p-C64-SiMe2Vi:67重量部、および
(E) (HMeSiO)4:33重量部(なお、(E)中のSiH/(D)中のVi(モル比)=1.0)
を用いること以外は、実施例1と同様にして組成物を調製し、硬化物を得た。
[Example 2]
Instead of the components (A) and (B) described in Example 1,
(D) ViMe 2 Si-p-C 6 H 4 -SiMe 2 Vi: 67 parts by weight, and
(E) (HMeSiO) 4 : 33 parts by weight (SiH in (E) / Vi (molar ratio) in (D) = 1.0)
A composition was prepared in the same manner as in Example 1 except for using, and a cured product was obtained.

[実施例3]
実施例1に記載の(A)成分および(B)成分に代えて、
(A) HMe2Si-p-C64-SiMe2H:23重量部、
(B) (ViMeSiO)4:17重量部、および
(F1)組成式:(ViMe2SiO1/2)3(Me3SiO1/2)18(SiO2)25で表される数平均分子量 3600のシリコーンレジン:60重量部(なお、(A)中のSiH/(B)および(F1)中のVi(モル比)=1.0)
を用いること以外は、実施例1と同様にして組成物を調製し、硬化物を得た。
[Example 3]
Instead of the components (A) and (B) described in Example 1,
(A) HMe 2 Si-p-C 6 H 4 -SiMe 2 H: 23 parts by weight,
(B) (ViMeSiO) 4 : 17 parts by weight, and
(F1) Compositional formula: (ViMe 2 SiO 1/2 ) 3 (Me 3 SiO 1/2 ) 18 (SiO 2 ) Silicone resin having a number average molecular weight of 3600 represented by 25 : 60 parts by weight ((A) SiH / Vi in (B) and Vi in (F1) (molar ratio) = 1.0)
A composition was prepared in the same manner as in Example 1 except for using, and a cured product was obtained.

[実施例4]
実施例1に記載の(A)成分および(B)成分に代えて、
(D) ViMe2Si-p-C64-SiMe2Vi:33重量部、
(E) (HMeSiO)4:7重量部、および
(F2)組成式:(HMe2SiO1/2)5(Me3SiO1/2)15(SiO2)10で表される数平均分子量 2300のシリコーンレジン:60重量部(なお、(E)および(F2)中のSiH/(D)中のVi(モル比)=1.0)
を用いること以外は、実施例1と同様にして組成物を調製し、硬化物を得た。
[Example 4]
Instead of the components (A) and (B) described in Example 1,
(D) ViMe 2 Si-p-C 6 H 4 -SiMe 2 Vi: 33 parts by weight,
(E) (HMeSiO) 4 : 7 parts by weight, and
(F2) Compositional formula: (HMe 2 SiO 1/2 ) 5 (Me 3 SiO 1/2 ) 15 (SiO 2 ) Silicone resin having a number average molecular weight of 2300 represented by 10 : 60 parts by weight ((E) (SiH in (F2) / Vi (molar ratio) in (D) = 1.0)
A composition was prepared in the same manner as in Example 1 except for using, and a cured product was obtained.

[比較例1]
(HMeSiO)4:41重量部、(ViMeSiO)4:59重量部、および 1-エチニルシクロヘキサノール:0.03重量部を均一に混合した。この混合物に白金-ビニルシロキサン錯体:白金金属原子として前記環状シロキサン化合物の合計量に対して20 ppmとなる量を添加し更に均一に混合して組成物を得た。この組成物を用いて、実施例1と同様にして硬化物を得た。
[Comparative Example 1]
(HMeSiO) 4 : 41 parts by weight, (ViMeSiO) 4 : 59 parts by weight, and 1-ethynylcyclohexanol: 0.03 part by weight were uniformly mixed. To this mixture was added a platinum-vinylsiloxane complex: an amount of 20 ppm as a platinum metal atom based on the total amount of the cyclic siloxane compound, and the mixture was further uniformly mixed to obtain a composition. Using this composition, a cured product was obtained in the same manner as in Example 1.

[比較例2]
ビスフェノールA型エポキシ樹脂(商品名:ペルノックス ME-540、ペルノックス社製)を実施例1と同様にガラス板で組んだ型の中に4mm厚になるように流し込み、150℃で8時間加熱して硬化物を得た。
[Comparative Example 2]
A bisphenol A type epoxy resin (trade name: Pernox ME-540, manufactured by Pernox) was poured into a mold formed of glass plates in the same manner as in Example 1 so as to have a thickness of 4 mm, and heated at 150 ° C. for 8 hours. A cured product was obtained.

[比較例3]
フェニルシリコーンレジン系硬化性組成物(商品名:X-34-1195、信越化学工業社製、フェニル基含有量:約50モル%)を実施例1と同様にガラス板で組んだ型の中に4mm厚になるように流し込み、150℃で8時間加熱して硬化物を得た。
[Comparative Example 3]
A phenyl silicone resin-based curable composition (trade name: X-34-1195, manufactured by Shin-Etsu Chemical Co., Ltd., phenyl group content: about 50 mol%) was placed in a mold assembled with a glass plate in the same manner as in Example 1. The mixture was poured to a thickness of 4 mm and heated at 150 ° C. for 8 hours to obtain a cured product.

<性能評価手法>
上記各実施例および比較例で得られた硬化物について、下記手法に従い、性能を評価した。
外観
各硬化物の外観を観察し、表1に記載した。
硬度
ASTM D 2240 に準じて、各硬化物の硬度(Shore D)を測定した。測定結果を表1に記載した。
弾性率
4mm厚の各硬化物から、10mm×100mmの試験片を作製し、JIS K-66911 に準じて、3点曲げ試験により、弾性率(MPa)を測定した。測定結果を表1に記載した。
<Performance evaluation method>
The performance of the cured products obtained in the above Examples and Comparative Examples was evaluated according to the following method.
The appearance of each cured product was observed and is shown in Table 1.
hardness
The hardness (Shore D) of each cured product was measured according to ASTM D 2240. Table 1 shows the measurement results.
A test piece of 10 mm x 100 mm was prepared from each cured product having an elastic modulus of 4 mm, and the elastic modulus (MPa) was measured by a three-point bending test according to JIS K-66911. Table 1 shows the measurement results.

光透過率
各硬化物の光透過率を分光光度計を用いて、測定波長:800、600、400nm、および 350nm(紫外線領域)の4点について測定した。測定結果を表2に記載した。
Light transmittance The light transmittance of each cured product was measured using a spectrophotometer at four points of measurement wavelengths: 800, 600, 400 nm, and 350 nm (ultraviolet region). Table 2 shows the measurement results.

Figure 2004339482
Figure 2004339482

Figure 2004339482
Figure 2004339482

[評価]
比較例1の硬化物は、硬度等が測定できない程度に柔らかなものであった。また、比較例2および比較例3の硬化物に比較して、実施例の硬化物は、いずれも、硬度および弾性率に優れ、また、特に 350nm(紫外線領域)の短波長における光透過率においても優れていることが分かる。
[Evaluation]
The cured product of Comparative Example 1 was so soft that hardness and the like could not be measured. Further, as compared with the cured products of Comparative Example 2 and Comparative Example 3, the cured products of the Examples were all excellent in hardness and elastic modulus, and particularly in light transmittance at a short wavelength of 350 nm (ultraviolet region). It can be seen that is also excellent.

Claims (11)

(A) ケイ素原子に結合した水素原子少なくとも2個を、前記ケイ素原子が炭化水素骨格に結合した状態で有する芳香族系炭化水素化合物、
(B) ケイ素原子に結合したアルケニル基を少なくとも2個有する環状シロキサン化合物、および
(C) ヒドロシリル化反応触媒
を含む硬化性シリコーン樹脂組成物。
(A) an aromatic hydrocarbon compound having at least two hydrogen atoms bonded to a silicon atom in a state where the silicon atom is bonded to a hydrocarbon skeleton;
(B) a cyclic siloxane compound having at least two alkenyl groups bonded to silicon atoms, and
(C) A curable silicone resin composition containing a hydrosilylation reaction catalyst.
前記(A)成分が、下記一般式(1):
HR12Si−A−SiR34H (1)
(式中、R1、R2、R3およびR4は、独立に、水素原子、または、アルケニル基以外の非置換の炭素原子数1〜12の一価炭化水素基、アルケニル基以外の置換の炭素原子数1〜12の一価炭化水素基、および炭素原子数1〜6のアルコキシ基よりなる群から選ばれる基であり、Aは炭素原子数6〜12の2価の芳香環含有炭化水素基である)
で表される芳香族系炭化水素化合物である請求項1に記載の硬化性シリコーン樹脂組成物。
The component (A) has the following general formula (1):
HR 1 R 2 Si-A-SiR 3 R 4 H (1)
(Wherein, R 1 , R 2 , R 3 and R 4 independently represent a hydrogen atom or an unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms other than an alkenyl group, and a substituent other than an alkenyl group. Is a group selected from the group consisting of a monovalent hydrocarbon group having 1 to 12 carbon atoms and an alkoxy group having 1 to 6 carbon atoms, and A is a divalent aromatic ring-containing carbon atom having 6 to 12 carbon atoms. Is a hydrogen group)
The curable silicone resin composition according to claim 1, which is an aromatic hydrocarbon compound represented by the formula:
前記(B)成分が、下記一般式(2):
(Ra5SiO)n(R67SiO)m (2)
(式中、Raは炭素原子数2〜6のアルケニル基であり、R5、R6およびR7は独立に非置換もしくは置換の炭素原子数1〜12の一価炭化水素基であり、nは2〜10の整数であり、mは0〜8の整数であり、ただしn+mは3〜10の整数である)
で表される環状シロキサン化合物である請求項1または2に記載の硬化性シリコーン樹脂組成物。
The component (B) is represented by the following general formula (2):
(R a R 5 SiO) n (R 6 R 7 SiO) m (2)
(Wherein, R a is an alkenyl group having 2 to 6 carbon atoms, and R 5 , R 6 and R 7 are each independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, n is an integer of 2 to 10, m is an integer of 0 to 8, provided that n + m is an integer of 3 to 10.
The curable silicone resin composition according to claim 1, which is a cyclic siloxane compound represented by the formula:
(D) ケイ素原子に結合したアルケニル基少なくとも2個を、前記ケイ素原子が炭化水素骨格に結合した状態で有する芳香族系炭化水素化合物、
(E) ケイ素原子に結合した水素原子を少なくとも2個有する環状シロキサン化合物、および
(C) ヒドロシリル化反応触媒
を含む硬化性シリコーン樹脂組成物。
(D) an aromatic hydrocarbon compound having at least two alkenyl groups bonded to a silicon atom, wherein the silicon atom is bonded to a hydrocarbon skeleton;
(E) a cyclic siloxane compound having at least two hydrogen atoms bonded to a silicon atom, and
(C) A curable silicone resin composition containing a hydrosilylation reaction catalyst.
前記(D)成分が、下記一般式(3):
a89Si−A−SiR1011b (3)
(式中、RaおよびRbは、独立に、炭素原子数2〜6のアルケニル基であり、R8、R9、R10およびR11は、独立に、非置換の炭素原子数1〜12の一価炭化水素基、置換の炭素原子数1〜12の一価炭化水素基、および炭素原子数1〜6のアルコキシ基よりなる群から選ばれる基であり、Aは炭素原子数6〜12の2価の芳香環含有炭化水素基である)
で表される芳香族系炭化水素化合物である請求項4に記載の硬化性シリコーン樹脂組成物。
The component (D) is represented by the following general formula (3):
R a R 8 R 9 Si- A-SiR 10 R 11 R b (3)
(Wherein, R a and R b are each independently an alkenyl group having 2 to 6 carbon atoms, and R 8 , R 9 , R 10 and R 11 are each independently an unsubstituted carbon atom having 1 to 6 carbon atoms. 12 is a group selected from the group consisting of 12 monovalent hydrocarbon groups, substituted monovalent hydrocarbon groups having 1 to 12 carbon atoms, and alkoxy groups having 1 to 6 carbon atoms; 12 divalent aromatic ring-containing hydrocarbon groups)
The curable silicone resin composition according to claim 4, which is an aromatic hydrocarbon compound represented by the following formula:
前記(E)成分が、下記一般式(4):
(HR12SiO)n(R1314SiO)m (4)
(式中、R12、R13およびR14は、独立に、水素原子、またはアルケニル基以外の非置換もしくは置換の炭素原子数1〜12の一価炭化水素基であり、nは2〜10の整数であり、mは0〜8の整数であり、ただしn+mは3〜10の整数である)
で表される環状シロキサン化合物である請求項4または5に記載の硬化性シリコーン樹脂組成物。
The component (E) is represented by the following general formula (4):
(HR 12 SiO) n (R 13 R 14 SiO) m (4)
(Wherein, R 12 , R 13 and R 14 are each independently a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms other than an alkenyl group, and n is 2 to 10 And m is an integer of 0 to 8, provided that n + m is an integer of 3 to 10.
The curable silicone resin composition according to claim 4, which is a cyclic siloxane compound represented by the formula:
更に、(F1)ケイ素原子に結合したアルケニル基を有する網状オルガノポリシロキサンを含む、請求項1〜6のいずれか1項に記載の硬化性シリコーン樹脂組成物。   The curable silicone resin composition according to any one of claims 1 to 6, further comprising (F1) a network organopolysiloxane having an alkenyl group bonded to a silicon atom. 更に、(F2)ケイ素原子に結合した水素原子を有する網状オルガノポリシロキサンを含む、請求項1〜6のいずれか1項に記載の硬化性シリコーン樹脂組成物。   The curable silicone resin composition according to any one of claims 1 to 6, further comprising (F2) a network organopolysiloxane having a hydrogen atom bonded to a silicon atom. 前記(A)成分および(B)成分が、前記(B)成分中に含有されるアルケニル基1モルに対する、前記(A)成分中のケイ素原子に結合した水素原子の量が0.5〜2.0モルとなる量で存在し、前記(C)成分が触媒としての有効量存在する、請求項1〜3のいずれか1項に記載の硬化性シリコーン樹脂組成物。   The component (A) and the component (B) are such that the amount of hydrogen atoms bonded to silicon atoms in the component (A) is 0.5 to 2.0 mol per 1 mol of the alkenyl group contained in the component (B). The curable silicone resin composition according to any one of claims 1 to 3, wherein the curable silicone resin composition is present in an amount, and the component (C) is present in an effective amount as a catalyst. 前記(D)成分および(E)成分が、前記(D)成分中に含有されるアルケニル基1モルに対する、前記(E)成分中のケイ素原子に結合した水素原子の量が0.5〜2.0モルとなる量で存在し、前記(C)成分が触媒としての有効量存在する、請求項4〜6のいずれか1項に記載の硬化性シリコーン樹脂組成物。   The component (D) and the component (E) have an amount of hydrogen atoms bonded to silicon atoms in the component (E) of 0.5 to 2.0 mol per 1 mol of the alkenyl group contained in the component (D). The curable silicone resin composition according to any one of claims 4 to 6, wherein the curable silicone resin composition is present in an amount, and the component (C) is present in an effective amount as a catalyst. 請求項1〜10のいずれか1項に記載の硬化性シリコーン樹脂組成物を硬化させることにより得られる硬化物。
A cured product obtained by curing the curable silicone resin composition according to any one of claims 1 to 10.
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