JP4071639B2 - Silicone resin composition for light emitting diode element - Google Patents
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Description
【０００１】
【発明の属する技術分野】
本発明は、発光ダイオード素子の保護、接着、波長変更・調整、レンズに使用される発光ダイオード（ＬＥＤ）素子用シリコーン樹脂組成物に関する。
【０００２】
【従来の技術】
従来、発光ダイオード素子の封止材料としては、一般的にエポキシ樹脂が用いられている。シリコーン樹脂に関しても特開平１０−２２８２４９号公報や特開平１０−２４２５１３号公報などでレンズ材への使用、特開２０００−１２３９８１号公報では波長調整コーティングへの使用が試みられているが、実際の使用例は少ない。
【０００３】
一方、白色ＬＥＤが注目される中で、これまで問題とされなかったエポキシ封止材の実使用中の紫外線などによる黄変や、小型化に伴う発熱量の増加に伴うクラックなどの問題が発生しており対応が急務となっている。これらの対応策としては分子中にフェニル基を多く持つシリコーンレジン硬化物を用いることにより検討が進められている。しかし、今後のＬＥＤの光源としてはより低波長なもが使用されるようになる傾向にあり、エポキシ封止材やフェニル基含有シリコーンレジン封止材では低波長領域での光透過性が悪く低波長領域を光源としたＬＤＥへの使用は問題があった。
【０００４】
【特許文献１】
特開平１０−２２８２４９号公報
【特許文献２】
特開平１０−２４２５１３号公報
【特許文献３】
特開２０００−１２３９８１号公報
【特許文献４】
特開平１１−１６１９号公報
【０００５】
【発明が解決しようとする課題】
本発明は、上記事情に鑑みなされたもので、高硬度で透明性、低波長領域での光透過性に優れる硬化物を与える発光ダイオード（ＬＥＤ）素子用シリコーン樹脂組成物を提供することを目的とする。
【０００６】
【課題を解決するための手段及び発明の実施の形態】
本発明者は、上記目的を達成するために鋭意努力を行った結果、
（Ａ）下記平均組成式（１）で示されるオルガノポリシロキサン（Ｉ） １００重量部
【化３】
（但し、式中Ｒ４はアルケニル基を除く１価の炭化水素基であり少なくとも８０％以上はメチル基である。ａ，ｂは０．７≦ａ≦２．１、０．００１≦ｂ≦１．０、かつ０．８≦ａ＋ｂ≦２．６を満たす正数である。）で示される１分子中に少なくとも２個のＳｉＨ結合を有し、かつ２５℃での粘度が１０００ｍＰａ・ｓ以下で上記オルガノポリシロキサン（Ｉ）の総アルケニルキ基に対して総ＳｉＨ量が０．５〜２．０倍となる量のオルガノハイドロジェンポリシロキサン
（Ｃ）触媒量の白金族金属系触媒 触媒量
を必須成分とする付加反応硬化型シリコーン樹脂組成物が、高硬度で透明性、低波長領域での光透過性に優れた硬化物を与えることを知見し、本発明をなすに至った。
【０００７】
以下、本発明につき更に詳しく説明する。
本発明に係る発光ダイオード（ＬＥＤ）素子用シリコーン樹脂組成物中
成分（Ａ）は下記平均組成式（１）で示されるオルガノポリシロキサン（Ｉ）
【化４】
【０００８】
上記式（１）において、Ｒ１はビニル基、アリル基、ブテニル基、ペンテニル基などの炭素数２〜８のアルケニル基である。Ｒ２はメチル基、エチル基などのアルキル基、ビニル基、フェニル基等の炭素数１〜２０の１価炭化水素基から選択される。好ましくは、メチル基、エチル基、フェニル基である。それぞれは異なっても良いが、８０％以上はメチル基である。Ｒ３は水素原子、メチル基、エチル基などの炭素数１〜８のアルキル基から選択される。
【０００９】
ｍ、ｎ、ｐ、ｑは、このオルガノポリシロキサンの２５℃における粘度が５〜５０００ｍＰａ・ｓ、好ましくは１０〜２０００ｍＰａ・ｓになるように選定されるが、ｍ、ｑは正数であり（ｑ＋ｒ）／（ｍ＋ｎ＋ｐ）＝０．１〜２．０好ましくは０．６〜１．５の範囲にある。この値が０．１未満であると封止材としての十分な強度が得られなくなり、２．０を超えると合成上このオルガノポリシロキサンの合成が困難になる。
【００１０】
ｒ／（ｑ＋ｒ）は０〜０．０５好ましくは０〜０．０３の範囲である。この値が０．０５を超えると水酸基あるいはアルコシキ基が多くなるためこのシリコーン樹脂組成物の硬化性が低下する。さらに、このオルガノポリシロキサンの２５℃における粘度は、上述したように５〜５０００ｍＰａ・ｓ である。粘度が５ｍＰａ・ｓ未満では硬化性が悪くなり、５０００ｍＰａ・ｓを超えるとシリコーン樹脂組成物の最終粘度が高くなりすぎ実際の使用に適さなくなる。
【００１１】
次に、（Ｂ）成分のオルガノハイドロジェンポリシロキサン（II）は、（Ａ）成分のオルガノポリシロキサン（Ｉ）とヒドロシリル化反応により組成物を硬化させる架橋剤として作用するものであり、下記平均組成式（２）
Ｒ４ ａＨｂＳｉＯ（４−ａ−ｂ）／２ （２）
（但し、式中Ｒ４はアルケニル基を除く一価の炭化水素基、少なくとも８０％以上はメチル基であり、ａ、ｂは０．７≦ａ≦２．１、０．００１≦ｂ≦１．０、かつ０．８≦ａ＋ｂ≦２．６、好ましくは０．８≦ａ≦２、０．０１≦ｂ≦１、１≦ａ＋ｂ≦２．４を満たす正数である。）
で示される１分子中に少なくとも２個、好ましくは３個以上のＳｉＨ結合を有し、かつ２５℃での粘度が１０００ｍＰａ・ｓ以下であるオルガノハイドロジェンポリシロキサンが好ましい。
【００１２】
ここで、Ｒ４としては、式（１）中のＲ２と同様の基を挙げることができるが、好ましくはアルケニル基を有さないものがよい。また、少なくとも８０％以上はメチル基である。
【００１３】
上記オルガノハイドロジェンシラン及びオルガノハイドロジェンポリシロキサンとしては、（ＣＨ３）ＳｉＨ３、（ＣＨ３）２ＳｉＨ２、（Ｃ６Ｈ５）ＳｉＨ３、１，１，３，３−テトラメチルジシロキサン、１，３，５，７−テトラメチルシクロテトラシロキサン、両末端トリメチルシロキシ基封鎖メチルハイドロジェンポリシロキサン、両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン共重合体、両末端ジメチルハイドロジェンシロキシ基封鎖ジメチルポリシロキサン、両末端ジメチルハイドロジェンシロキシ基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン共重合体、両末端トリメチルシロキシ基封鎖メチルハイドロジェンシロキサン・ジフェニルシロキサン共重合体、両末端トリメチルシロキシ基封鎖メチルハイドロジェンシロキサン・ジフェニルシロキサン・ジメチルシロキサン共重合体、（ＣＨ３）２ＨＳｉＯ１／２単位とＳｉＯ４／２単位とからなる共重合体、（ＣＨ３）２ＨＳｉＯ１／２単位とＳｉＯ４／２単位と（Ｃ６Ｈ５）ＳｉＯ３／２単位とからなる共重合体などが挙げられる。
【００１４】
このオルガノハイドロジェンポリシロキサンの分子構造は、直鎖状、環状、分岐状、三次元網状構造のいずれであってもよいが、１分子中のケイ素原子の数（又は重合度）は３〜１０００、特に３〜３００程度のものを使用することができる。
【００１５】
また、このオルガノハイドロジェンポリシロキサンの２５℃における粘度は、１０００ｍＰａ・ｓ以下、より好ましくは０．１〜５００ｍＰａ・ｓ、更に好ましくは０．５〜３００ｍＰａ・ｓであることが好ましい。
【００１６】
上記（Ｂ）成分のオルガノハイドロポリシロキサン（II）の配合量は、（Ａ）成分のオルガノポリシロキサン（Ｉ）の総アルケニル基量に依存し、オルガノポリシロキサン（Ｉ）の総アルケニルキ基に対して総ＳｉＨ量が０．５〜２．０倍となる量好ましくは０．８〜１．５倍となる量とすればよい。具体的には、（Ａ）成分のオルガノポリシロキサン１００重量部に対して１〜４００重量部、好ましくは５〜２００重量部である。
【００１７】
（Ｃ）成分の付加反応触媒は、（Ａ）成分中のアルケニル基と（Ｂ）成分中のＳｉＨ基とのヒドロシリル化付加反応を促進するための触媒であり、この付加反応触媒としては、白金黒、塩化第２白金、塩化白金酸、塩化白金酸と一価アルコールとの反応物、塩化白金酸とオレフィン類との錯体、白金ビスアセトアセテート等の白金系触媒、パラジウム系触媒、ロジウム系触媒などの白金族金属触媒が挙げられる。なお、この付加反応触媒の配合量は触媒量とすることができるが、通常、白金族金属として（Ａ）及び（Ｂ）成分の合計重量に対して１〜５００ｐｐｍ、特に２〜１００ｐｐｍ程度配合することが好ましい。
【００１８】
さらに、本シリコーン樹脂には下記平均式（３）で示されるＱ単位含有オルガノポリシロキサン（III）
【化５】
【００１９】
ここでＲ５はビニル基、アリル基、ブテニル基、ペンテニル基などの炭素８個以下のアルケニル基、メチル基、エチル基などのアルキル基、フェニル基、から選択され、それぞれは異なっても良いが、８０％以上はメチル基である。また、Ｒ６は水素原子、メチル基、エチル基などのアルキル基から選択される。
【００２０】
この、Ｑ単位含有オルガノポリシロキサン（III）の配合量はオルガノポリシロキサン（Ｉ）１００重量部に対して２００重量部以下好ましくは１００重量部以下がよい。
【００２１】
本発明の組成物には、上記（Ａ）〜（Ｃ）成分に加え、任意成分として硬化性、ポットライフを与えるために付加反応制御剤、硬度・粘度を調節するために例えばアルケニル基を有する直鎖状のジオルガノポリシロキサンの他にも直鎖状の非反応性オルガノポリシロキサン、ケイ素原子数が２〜１０個程度の直鎖状又は環状の低分子オルガノポリシロキサンなどを本発明の効果を損なわない範囲で添加してもよい。
【００２２】
更に、透明性に影響を与えない範囲で、強度を向上させるためにヒュームドシリカ等の無機質充填剤を配合してもよいし、必要に応じて波長調整剤、染料、顔料、難燃剤、耐熱剤、耐酸化劣化剤などを配合してもよい。
【００２３】
なお、上記組成物の硬化条件は特に制限されないが、１２０〜１８０℃、３０〜１８０分の条件とすることが好ましい。
【００２４】
【発明の効果】
本発明のシリコーン樹脂組成物は、発光ダイオード素子の保護、封止や接着、波長変更・調整、レンズなど、発光ダイオード素子用として使用されて、高硬度で透明性、低波長領域での光透過性に優れた透明硬化物を与える。
【００２５】
【実施例】
以下、実施例及び比較例を示し、本発明を具体的に説明するが、本発明は下記の実施例に制限されるものではない。
【００２６】
［実施例１］
下記平均組成式で示され、２５℃における粘度が２７ｍＰａ・ｓであり、かつビニル価が０．５ｍｏｌ／１００ｇである成分（Ａ）としてのオルガノポリシロキサン１００重量部、
【化６】
【００２７】
［実施例２］
下記平均組成式で示され、２５℃における粘度が２７ｍＰａ・ｓであり、かつビニル価が５ｍｏｌ／１００ｇである成分（Ａ）としてのオルガノポリシロキサン１００重量部、
【化７】
【００２８】
この混合物に、水素ガス発生量が３５０ｍｌ／ｇで粘度が２５℃で２０ｍＰａ・ｓのメチルハイドロジェンシロキサン５１重重量部（総ＳｉＨ量／総アルケニル基量＝１．５）と制御剤としてのエチニルシクロヘキサノール０．５重量部を均一に混合し、この組成物に白金触媒を白金原子として２０ｐｐｍ添加しさらに均一に混合した組成物を、脱泡後、ガラス板で組んだ型の中に３ｍｍ厚になるように流し込み１５０℃で３時間硬化させ実施例２のサンプルを得た。
【００２９】
［比較例１］
【化８】
【００３０】
［比較例２］
一般的に砲弾型ＬＥＤに使用されている透明エポキシ材料を入手し、実施例と同様に型に流し込み、１５０℃で８時間の硬化を行い、比較例２としてのサンプルを得た。
【００３１】
上記実施例、比較例の一般物性を表１に示す。
【表１】
次に、上記実施例、比較例の光透過率を下記方法により評価した。
評価方法： 作成したサンプルの光透過率を８００，６００，４００ｎｍと低波長領域（紫外線領域）３５０ｎｍで測定してその結果を表２に示す。透過率が８５％を以下ではＬＥＤ封止材としては使用が難しくなる
【表２】
BACKGROUND OF THE INVENTION
The present invention relates to a silicone resin composition for a light emitting diode (LED) element used for protection, adhesion, wavelength change / adjustment of a light emitting diode element, and a lens.
[0002]
[Prior art]
Conventionally, epoxy resin is generally used as a sealing material for a light emitting diode element. Regarding silicone resins, use in lens materials in JP-A-10-228249 and JP-A-10-242513 has been attempted, and use in wavelength adjustment coating in JP-A-2000-123981 has been attempted. There are few examples of use.
[0003]
On the other hand, while white LEDs are attracting attention, problems such as yellowing due to ultraviolet rays during actual use of epoxy sealing materials, which have not been a problem, and cracks associated with an increase in the amount of heat generated due to downsizing have occurred. The response is urgent. As a countermeasure for these, studies are being made by using a cured silicone resin having many phenyl groups in the molecule. However, light sources for future LEDs tend to be used at lower wavelengths, and epoxy sealing materials and phenyl group-containing silicone resin sealing materials have poor light transmission in the low wavelength region and are low. There has been a problem with the use of LDE with a wavelength region as a light source.
[0004]
[Patent Document 1]
JP-A-10-228249 [Patent Document 2]
Japanese Patent Laid-Open No. 10-242513 [Patent Document 3]
JP 2000-123981 A [Patent Document 4]
Japanese Patent Laid-Open No. 11-1619
[Problems to be solved by the invention]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a silicone resin composition for a light emitting diode (LED) element that provides a cured product having high hardness, transparency, and excellent light transmittance in a low wavelength region. And
[0006]
Means for Solving the Problem and Embodiment of the Invention
As a result of diligent efforts to achieve the above object,
(A) 100 parts by weight of an organopolysiloxane (I) represented by the following average composition formula (1)
(In the formula, R 4 is a monovalent hydrocarbon group excluding an alkenyl group and at least 80% is a methyl group. A and b are 0.7 ≦ a ≦ 2.1 and 0.001 ≦ b ≦. 1.0 and a positive number satisfying 0.8 ≦ a + b ≦ 2.6.) 1 molecule having at least two SiH bonds and a viscosity at 25 ° C. of 1000 mPa · s or less In the above-mentioned organopolysiloxane (I), the total amount of SiH is 0.5 to 2.0 times the amount of the organohydrogenpolysiloxane (C) catalyst amount of platinum group metal catalyst. It has been found that the addition reaction curable silicone resin composition as an essential component gives a cured product having high hardness and transparency, and excellent light transmission in a low wavelength region, and has led to the present invention.
[0007]
Hereinafter, the present invention will be described in more detail.
The component (A) in the silicone resin composition for a light emitting diode (LED) element according to the present invention is an organopolysiloxane (I) represented by the following average composition formula (1):
[Formula 4]
[0008]
In the above formula (1), R 1 is an alkenyl group having 2 to 8 carbon atoms such as a vinyl group, an allyl group, a butenyl group, or a pentenyl group. R 2 is selected from alkyl groups such as a methyl group and an ethyl group, and monovalent hydrocarbon groups having 1 to 20 carbon atoms such as a vinyl group and a phenyl group. Preferably, they are a methyl group, an ethyl group, and a phenyl group. Each may be different, but 80% or more is a methyl group. R 3 is selected from alkyl groups having 1 to 8 carbon atoms such as a hydrogen atom, a methyl group, and an ethyl group.
[0009]
m, n, p, and q are selected so that the viscosity of the organopolysiloxane at 25 ° C. is 5 to 5000 mPa · s, preferably 10 to 2000 mPa · s, and m and q are positive numbers ( q + r) / (m + n + p) = 0.1 to 2.0, preferably 0.6 to 1.5. If this value is less than 0.1, sufficient strength as a sealing material cannot be obtained, and if it exceeds 2.0, synthesis of this organopolysiloxane becomes difficult in terms of synthesis.
[0010]
r / (q + r) is in the range of 0 to 0.05, preferably 0 to 0.03. When this value exceeds 0.05, the number of hydroxyl groups or alkoxy groups increases, so that the curability of the silicone resin composition decreases. Furthermore, the viscosity at 25 ° C. of this organopolysiloxane is 5 to 5000 mPa · s as described above. If the viscosity is less than 5 mPa · s, the curability is poor, and if it exceeds 5000 mPa · s, the final viscosity of the silicone resin composition becomes too high to be suitable for actual use.
[0011]
Next, the organohydrogenpolysiloxane (II) as the component (B) acts as a crosslinking agent for curing the composition by hydrosilylation reaction with the organopolysiloxane (I) as the component (A). Composition formula (2)
R 4 a H b SiO (4-ab) / 2 (2)
(In the formula, R 4 is a monovalent hydrocarbon group excluding an alkenyl group, at least 80% is a methyl group, and a and b are 0.7 ≦ a ≦ 2.1 and 0.001 ≦ b ≦ 1. 0.0 and 0.8 ≦ a + b ≦ 2.6, preferably 0.8 ≦ a ≦ 2, 0.01 ≦ b ≦ 1, and 1 ≦ a + b ≦ 2.4.
An organohydrogenpolysiloxane having at least 2, preferably 3 or more SiH bonds in one molecule and having a viscosity at 25 ° C. of 1000 mPa · s or less is preferred.
[0012]
Here, examples of R 4 include the same groups as R 2 in formula (1), but those having no alkenyl group are preferable. Further, at least 80% or more is a methyl group.
[0013]
Examples of the organohydrogensilane and organohydrogenpolysiloxane include (CH 3 ) SiH 3 , (CH 3 ) 2 SiH 2 , (C 6 H 5 ) SiH 3 , 1,1,3,3-tetramethyldisiloxane. 1,3,5,7-tetramethylcyclotetrasiloxane, trimethylsiloxy group-blocked methylhydrogenpolysiloxane at both ends, trimethylsiloxy group-blocked dimethylsiloxane / methylhydrogensiloxane copolymer at both ends, dimethylhydrogensiloxy at both ends Group-blocked dimethylpolysiloxane, both ends dimethylhydrogensiloxy group-blocked dimethylsiloxane / methylhydrogensiloxane copolymer, both ends trimethylsiloxy group-blocked methylhydrogensiloxane / diphenylsiloxane copolymer, Both ends trimethylsiloxy group-blocked methylhydrogensiloxane / diphenylsiloxane / dimethylsiloxane copolymer, (CH 3 ) 2 HSiO 1/2 unit copolymer and SiO 4/2 unit copolymer, (CH 3 ) 2 HSiO 1 / 2 units, SiO 4/2 units, and copolymers composed of (C 6 H 5 ) SiO 3/2 units.
[0014]
The molecular structure of the organohydrogenpolysiloxane may be any of linear, cyclic, branched, and three-dimensional network structures, but the number of silicon atoms in one molecule (or the degree of polymerization) is 3 to 1000. In particular, about 3 to 300 can be used.
[0015]
The viscosity of the organohydrogenpolysiloxane at 25 ° C. is preferably 1000 mPa · s or less, more preferably 0.1 to 500 mPa · s, and still more preferably 0.5 to 300 mPa · s.
[0016]
The blending amount of the organohydropolysiloxane (II) as the component (B) depends on the total alkenyl group amount of the organopolysiloxane (I) as the component (A) and is based on the total alkenyl groups of the organopolysiloxane (I). Thus, the total SiH amount may be 0.5 to 2.0 times, preferably 0.8 to 1.5 times. Specifically, it is 1 to 400 parts by weight, preferably 5 to 200 parts by weight, based on 100 parts by weight of the organopolysiloxane of component (A).
[0017]
The addition reaction catalyst for component (C) is a catalyst for promoting the hydrosilylation addition reaction between the alkenyl group in component (A) and the SiH group in component (B). Black, platinum chloride, chloroplatinic acid, reaction product of chloroplatinic acid and monohydric alcohol, complex of chloroplatinic acid and olefins, platinum catalyst such as platinum bisacetoacetate, palladium catalyst, rhodium catalyst Platinum group metal catalysts such as In addition, although the compounding quantity of this addition reaction catalyst can be made into a catalytic quantity, it is normally mix | blended as 1 to 500 ppm with respect to the total weight of (A) and (B) component as a platinum group metal, especially about 2-100 ppm. It is preferable.
[0018]
Furthermore, this silicone resin contains a Q unit-containing organopolysiloxane (III) represented by the following average formula (3):
[Chemical formula 5]
[0019]
Here, R 5 is selected from an alkenyl group having 8 or less carbon atoms such as vinyl group, allyl group, butenyl group and pentenyl group, alkyl group such as methyl group and ethyl group, and phenyl group, and each may be different. 80% or more is a methyl group. R 6 is selected from an alkyl group such as a hydrogen atom, a methyl group, or an ethyl group.
[0020]
The compounding amount of the Q unit-containing organopolysiloxane (III) is 200 parts by weight or less, preferably 100 parts by weight or less based on 100 parts by weight of the organopolysiloxane (I).
[0021]
In addition to the above components (A) to (C), the composition of the present invention has an addition reaction control agent for imparting curability and pot life as an optional component, and has, for example, an alkenyl group for adjusting hardness and viscosity. In addition to the linear diorganopolysiloxane, the linear non-reactive organopolysiloxane, the linear or cyclic low-molecular organopolysiloxane having about 2 to 10 silicon atoms, and the like are effective. You may add in the range which does not impair.
[0022]
In addition, inorganic fillers such as fumed silica may be blended to improve the strength within a range that does not affect the transparency, and wavelength adjusters, dyes, pigments, flame retardants, heat resistance as necessary. You may mix | blend an agent, an oxidation-resistant deterioration agent, etc.
[0023]
In addition, although the hardening conditions in particular of the said composition are not restrict | limited, It is preferable to set it as the conditions for 120-180 degreeC and 30-180 minutes.
[0024]
【The invention's effect】
The silicone resin composition of the present invention is used for light-emitting diode elements such as protection, sealing and adhesion, wavelength change / adjustment, and lenses for light-emitting diode elements, and has high hardness and transparency, and light transmission in a low wavelength region. Gives a transparent cured product with excellent properties.
[0025]
【Example】
EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example.
[0026]
[Example 1]
100 parts by weight of an organopolysiloxane as a component (A) represented by the following average composition formula, having a viscosity at 25 ° C. of 27 mPa · s and a vinyl value of 0.5 mol / 100 g,
[Chemical 6]
[0027]
[Example 2]
100 parts by weight of an organopolysiloxane as a component (A) represented by the following average composition formula, having a viscosity at 25 ° C. of 27 mPa · s and a vinyl value of 5 mol / 100 g,
[Chemical 7]
[0028]
To this mixture, 51 parts by weight of methylhydrogensiloxane (total SiH amount / total alkenyl group amount = 1.5) having a hydrogen gas generation amount of 350 ml / g and a viscosity of 20 mPa · s at 25 ° C. and ethynyl as a control agent 0.5 parts by weight of cyclohexanol was uniformly mixed, and after adding 20 ppm of platinum catalyst as a platinum atom to this composition and further uniformly mixing, 3 mm thick in a mold assembled with a glass plate after defoaming And was cured at 150 ° C. for 3 hours to obtain a sample of Example 2.
[0029]
[Comparative Example 1]
[Chemical 8]
[0030]
[Comparative Example 2]
A transparent epoxy material generally used for a bullet-type LED was obtained, poured into a mold in the same manner as in Example, and cured at 150 ° C. for 8 hours to obtain a sample as Comparative Example 2.
[0031]
Table 1 shows the general physical properties of the above Examples and Comparative Examples.
[Table 1]
Next, the light transmittance of the said Example and the comparative example was evaluated by the following method.
Evaluation method: The light transmittance of the prepared sample was measured in 800, 600, and 400 nm and in a low wavelength region (ultraviolet region) of 350 nm. If the transmittance is 85% or less, it will be difficult to use as an LED sealing material. [Table 2]
Claims (3)
サン（Ｉ） １００重量部
（Ｂ）下記平均組成式（２）で示されるオルガノハイドロジェンポリシロキサン
（II） １〜４００重量部
Ｒ４ ａＨｂＳｉＯ（４−ａ−ｂ）／２ （２）
（但し、式中Ｒ４はアルケニル基を除く１価の炭化水素基であり少なくとも８０％以上はメチル基である。ａ，ｂは０．７≦ａ≦２．１、０．００１≦ｂ≦１．０、かつ０．８≦ａ＋ｂ≦２．６を満たす正数である。）
で示される１分子中に少なくとも２個のＳｉＨ結合を有し、かつ２５℃での粘度が１０００ｍＰａ・ｓ以下で上記オルガノポリシロキサン（Ｉ）の総アルケニルキ基に対して総ＳｉＨ量が０．５〜２．０倍となる量のオルガノハイドロジェンポリシロキサン
（Ｃ）触媒量の白金族金属系触媒 触媒量
を主成分とする発光ダイオード（ＬＥＤ）素子用シリコーン樹脂組成物。(A) 100 parts by weight of organopolysiloxane (I) represented by the following average composition formula (1)
(B) Organohydrogenpolysiloxane (II) represented by the following average composition formula (2) 1 to 400 parts by weight R 4 a H b SiO (4-ab) / 2 (2)
(In the formula, R 4 is a monovalent hydrocarbon group excluding an alkenyl group, and at least 80% is a methyl group. A and b are 0.7 ≦ a ≦ 2.1 and 0.001 ≦ b ≦). 1.0 and a positive number satisfying 0.8 ≦ a + b ≦ 2.6.)
Having at least two SiH bonds in one molecule, a viscosity at 25 ° C. of 1000 mPa · s or less, and a total SiH amount of 0.5 to the total alkenyl groups of the organopolysiloxane (I). A silicone resin composition for a light-emitting diode (LED) device, the main component of which is a platinum group metal catalyst having an amount of an organohydrogenpolysiloxane (C) catalyst of an amount of up to 2.0 times.
をオルガノポリシロキサン（Ｉ）１００重量部に対して２００重量部以下含む請求項１の発光ダイオード（ＬＥＤ）素子用シリコーン樹脂組成物Q unit-containing organopolysiloxane (III) represented by the following average formula (3)
A silicone resin composition for a light emitting diode (LED) device according to claim 1, comprising 200 parts by weight or less based on 100 parts by weight of organopolysiloxane (I).
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