JP2004335935A - Method for replacing electronic component with lead retained by taping and automatic replacing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a replacement method capable of removing a component and retaining it again without cutting or peeling a tape when replacing the electronic component with leads that is aligned on a carrier tape and is retained by taping, and to provide an automatic replacing device. <P>SOLUTION: While the leads 1b, 1c of the electronic component 1 having leads are taped to the carrier tapes 2, 3, where a pair of upper and lower adhesive tapes is overlapped for aligning and retaining a number of electronic components, the lead of an electronic component (non-conforming one) 1A is peeled from the carrier tape by the handling operation of the automatic replacing device, the lead is moved in an illustrated arrow direction for pulling out of the tape, the lead of an electronic component 1B is inserted into the carrier tape at the same position for retaining again by a procedure reverse to the pulling-out process, and additionally the lead is crimped to the carrier tape for retaining by taping. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention is directed to a method of replacing electronic components, which is performed on electronic components with axial leads, such as capacitors, resistors, and diodes, in a state where a large number of electronic component products are aligned and taped and held on a carrier tape. It relates to a replacement device.
[0002]
[Prior art]
The electronic components with leads mentioned above (mass-produced products) are generally aligned in a taped form with a large number of electronic components on a carrier tape in order to respond to processing such as painting performed in the manufacturing process and automation of product inspection. It is held and transported between processes (for example, see Patent Document 1).
15 and 16 are views showing a state in which a large number of electronic components with leads are taped on a carrier tape and aligned and held. That is, the electronic component 1 with leads has a structure (axial lead type) in which the leads 1b and 1c are drawn out from both ends of the component body (mold portion) 1a in the axial direction, and the individual electronic components 1 are aligned at a constant pitch. Then, the leads 1b and 1c at both ends are taped and held on carrier tapes 2 and 3, which are separately arranged on the left and right. Here, the carrier tapes 2 and 3 use a pair of upper and lower tapes (paper adhesive tapes) 2a / 2b and 3a / 3b, respectively, and connect the leads 1b and 1c of the electronic component 1 to the upper tapes 2a and 3a and the lower tapes 2b and 3b, respectively. The tape is held between the adhesive surface (pressure-sensitive adhesive coated surface) of the tape and held between them.
[0003]
[Patent Document 1]
JP-A-2000-203520 (FIGS. 4 and 5)
[0004]
[Problems to be solved by the invention]
Regarding the electronic component 1 with leads held in the aligned state by taping on the carrier tapes 2 and 3 as described above, the electronic components determined to be defective in the product inspection process are removed from the carrier tapes 2 and 3 and removed, and separately prepared. Replaced with non-defective parts that have already been inspected.As a replacement method, conventionally, a method such as cutting the carrier tape, peeling off the carrier tape, or pulling out the lead from the carrier tape and replacing the electronic component is used. ing.
However, when the carrier tape is cut, it is difficult to re-hold another electronic component (good product) at the position after removing the electronic component (defective product). Also, when pulling out the leads of the electronic component from the carrier tape, if you try to forcibly pull out the leads while the leads are taped, wrinkles may occur on the tape, or the tape may be broken. It is difficult to keep in actual work.
[0005]
The present invention has been made in view of the above points, and has as its object to solve the above problems, and does not cut or peel off the carrier tape when replacing the electronic component with leads held on the carrier tape by taping. Another object of the present invention is to provide a replacement method that enables easy removal and re-holding of an electronic component, and an automatic replacement device that performs the replacement method.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, for electronic components with axial leads, in which leads are drawn out from both ends of a component body in the axial direction, a pair of upper and lower adhesive tapes are stacked on both ends of the electronic component. From the state in which a large number of electronic components are aligned and held by taping on the left and right rows of carrier tape, a specified electronic component is extracted from the carrier tape, another electronic component is loaded at the same position, and the carrier tape is held again. In the replacement method,
A first step of applying an eccentric rotational movement to the electronic component while holding the leads at both ends between the left and right rows of carrier tape and separating the leads from the adhesive surface of the carrier tape;
A second step of moving the electronic component in the axial direction so as to approach one of the carrier tapes in the left and right rows and pulling out leads from the other carrier tape;
A third step of shifting the carrier tape from which the leads have been pulled out in the second step from the taping position to the retracted position;
The electronic component is removed from the carrier tape through a fourth step of moving the electronic component in the opposite direction to the second step and pulling out the other lead from the carrier tape,
In the subsequent electronic component re-holding step, the leading end of one of the leads of the electronic component is inserted between the carrier tapes corresponding to the fourth step, and the electronic component is inserted into the carrier tape. A fifth step of moving toward the side,
A sixth step of returning the carrier tape shifted to the retracted position in the third step to the original taping position;
A seventh step of moving the electronic component in the opposite direction to the fifth step and inserting the other lead between the carrier tapes returned to the taping position;
In a state where the leads of the electronic component are inserted, a pressing force is applied to the taping position of the carrier tape, and the electronic component with the lead is replaced through an eighth step of pressing the leads to the adhesive surface of the carrier tape (claim 1). .
[0007]
Further, in the present invention, in order to make it easier to insert the leads of the electronic component between the carrier tapes in the fifth and seventh steps in the above method, the holes remaining in the taping portion of the carrier tape are widened. In order to further secure the alignment after replacement of components, before shifting from the seventh step to the eighth step, the electronic components to be re-held are aligned with other electronic components which are taped and held on a carrier tape. To adjust the positioning (claim 3).
According to the above replacement method, the electronic component with leads can be easily replaced without cutting or peeling off the carrier tape while the electronic components with leads held by taping on the carrier tape are being transported.
[0008]
On the other hand, the automatic replacement device of the present invention that implements the above-described replacement method includes a carrier tape transport guide mechanism, and a component replacement position set on a carrier tape transport path, and electronic components taped and held on the carrier tape. A handling mechanism with a chuck hand for gripping to perform eccentric rotation and axial movement operation, and a tape moving mechanism for shifting a carrier tape from a taping position to a retracted position are provided (Claim 4). As embodiments corresponding to the second and third aspects, a hole expanding mechanism, a lead insertion guide mechanism for an electronic component (claim 5), and a positioning guide mechanism for an electronic component (claim 6) are provided.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a method for replacing an electronic component with leads and an automatic replacement device according to the present invention will be described with reference to the embodiments shown in FIGS.
First, the basic operation of the electronic component replacement method will be described with reference to FIGS. In the drawing, 1A indicates an electronic component to be removed from the carrier tapes 2 and 3 (a component determined to be defective in the product inspection), and 1B indicates an electronic component to be held after being removed (a replacement component of a good product).
That is, as described with reference to FIGS. 15 and 16, a state in which a large number of electronic components 1 with leads are aligned along the left and right carrier tapings 2 and 3 and held by taping, the electronic components determined to be defective in product inspection. To remove the (extracted electronic component 1A), first, the leads 1b and 1c of the electronic component 1A are separated from the joining surfaces of the carrier tapes 2 and 3 by the eccentric rotational movement of the lead, which will be described in detail later, and then FIG. As shown by a), the electronic component 1A is moved in the direction of the arrow, the component main body 1a is moved toward the carrier tape 2, and the lead 1c on the opposite side is pulled out from between the upper tape and the lower tape of the carrier tape 3. Next, with the lead 1c removed from the carrier tape 3, the electronic component 1A is moved in the opposite direction as shown in FIG. 1 (b), the lead 1b is pulled out from the carrier tape 2, and the electronic component 1A is removed from the carrier tape 2. , 3.
[0010]
In order to load another electronic component (re-holding electronic component 1B) at the same position after removing the electronic component 1A and to re-hold the carrier tapes 2 and 3, as shown in FIG. 1B is inserted into a hole remaining between the upper tape and the lower tape of the carrier tape 2 (a hole remaining after the lead of the electronic component 1A is pulled out), and then moved in the direction of the arrow to move the lead 1c on the opposite side. The component main body 1 a is moved to the carrier tape 2 so that the leading end is located inside the carrier tape 3. Next, as shown in FIG. 1 (d), the electronic component 1B is moved in the opposite direction to insert the lead 1c into the carrier tape 3, and the electronic component 1b is positioned at a predetermined alignment position as will be described in more detail later. After the correction, the pressing force is applied to the carrier tapes 2 and 3 so that the leads 1b and 1c are pressed against the adhesive surfaces of the carrier tapes 2 and 3 to be held in taping. It shall be performed by the following automatic replacement device installed.
[0011]
FIG. 2 is a configuration diagram of the above-described automatic replacement device. The automatic replacement device 4 is roughly divided into a tape transport guide mechanism 5 for guiding the carrier tapes 2 and 3, and an electronic component taped and held by the carrier tapes 2 and 3. 1, a handling mechanism 6 with a chuck hand for eccentric rotation and axial movement operation, a tape moving mechanism 7 for shifting one carrier tape 3 from a taping position to a retracted position, and a carrier tape The configuration includes a hole expanding mechanism, an electronic component lead insertion guide mechanism, and an electronic component positioning guide mechanism (not shown).
Here, the tape transport guide mechanism 5 lays a pair of left and right guide rails, and transports and guides the carrier tapes 2 and 3 on which the electronic components 1 are taped and held along the guide rails. The handling mechanism 6 includes a pair of chuck hands 6c connected to a drive motor 6a via a gear-type eccentric rotation mechanism 6b, and is installed on a base table 8 of the apparatus in combination with a linear moving mechanism 6d. ing. Further, the tape moving mechanism 7 tilts the tape guide rail of the tape transport guide mechanism 5 by operating an air cylinder or the like so as to shift the guide rail for guiding one of the carrier tapes 3 from a fixed position to a retracted position below.
[0012]
Next, the replacement operation of the electronic component with lead 1 performed by the automatic replacement device 4 will be described for each process. First, as described with reference to FIG. 1, when the electronic component 1A determined to be defective in the product inspection is transported to the automatic replacement device 4 by a tape, the discrimination sensor provided in the device recognizes this and a predetermined replacement station. After the transport of the carrier tape is temporarily stopped at the position, as shown in FIGS. 3 (a) and 3 (b), the roots of the leads 1b and 1c protruding from both ends of the component body 1a of the electronic component 1A are moved to the handling mechanism 6. The carrier tapes 2 and 3 are held at the stop position by the tape presser 5a of the tape transport guide mechanism 5 on the front and rear sides while being gripped by the chuck hand 6c. Subsequently, an eccentric rotation is given to the electronic component 1A held by the chuck hand 6c by the drive motor 6a via the eccentric rotation mechanism 6b, and the leads 1b and 1c are moved between the upper tape and the lower tape of the carrier tapes 2 and 3. It is handled along the rotational movement trajectory T shown in FIG. As a result, the leads 1b and 1c which have been taped between the upper and lower tapes partially peel off the upper and lower tapes of the carrier tapes 2 and 3 and peel off from the tape bonding surface (adhesive). (The first step in claim 1).
[0013]
Next, while holding the electronic component 1A with the chuck hand 6c, as shown in FIG. 4, the handling mechanism 6 is moved in the direction of arrow B to move the component body 1a toward the carrier tape 2 on the left side. By this moving operation, the other lead 1c comes out of the carrier tape 3 while the lead 1b is sandwiched between the carrier tapes 2 as described in FIG. 1A (second step in claim 1).
After the second step, while the leads 1b and 1c of the electronic component 1A are being held by the chuck hand 6c as shown in FIG. The right carrier tape 3 is lowered in the direction of arrow C to shift from the original taping position to the retracted position (third step in claim 1).
[0014]
Subsequently, as shown in FIG. 6, by operating the handling mechanism 6, the chuck hand 6c is moved in the direction of arrow D while holding the electronic component 1A, and the left lead 1b is moved between the upper tape and the lower tape of the carrier tape 2. Pull out from. In this case, since the carrier tape 3 on the right side has already retreated to the retreat position in the third step, it does not interfere with the lead 1c, and the electronic component 1A is moved by moving the chuck hand 6c in the direction of arrow D as it is. It is completely removed from the carrier tapes 2 and 3 (the fourth step in claim 1). The electronic component 1A removed from the carrier tape is moved to a collection tray (not shown), and the chuck hand 6c is released and discharged.
[0015]
After removing the electronic component 1A by the above operation procedure, in order to re-hold a good electronic component separately prepared at the same position, as described with reference to FIGS. It shall be performed in the reverse order of the removal operation.
That is, after removing the electronic component (defective product) 1A from the state of FIG. 6, the chuck hand 6c of the handling mechanism 6 grabs a good electronic component 1B (see FIG. 1) from another tray, and opposes the arrow D in FIG. After moving in the direction, one lead 1b is inserted into the left carrier tape 2, the component body 1a is further moved toward the carrier tape 2, and the tip of the other lead 1c is positioned inside the right carrier tape 3 ( Fifth step in claim 1: FIG. 1 (c)). Next, the tape transport mechanism 5 shifted to the retreat position in the step of FIG. 5 is returned to the original tape position by operating the tape moving mechanism 7 in a direction opposite to the arrow C (a sixth step in claim 1). Subsequently, the lead 1c is inserted into the carrier tape 3 on the right side by the operation of moving the chuck hand 6c, and the electronic component 1b is thereby held on the carrier tapes 2 and 3 (seventh step in claim 1: see FIG. 1 (d)). ).
[0016]
By the way, in order to insert the leads 1b and 1c of another electronic component 1B between the upper tape and the lower tape of the carrier tapes 2 and 3 after extracting the electronic component 1A as described above, a hole (electronic component) remaining between the tapes is required. Since the size of the hole from which the lead of the component 1A is removed is small, there is a difficulty in positioning accuracy. In order to facilitate the insertion of the leads 1b and 1c into the holes of the carrier tapes 2 and 3, the automatic replacement device is provided with a tape transport guide so as to face the left and right carrier tapes 2 and 3 as shown in FIG. A pair of left and right hole expanding mechanisms 9 disposed inside the mechanism 5 and a lead insertion guide mechanism 10 shown in FIG. 9 are provided.
[0017]
Here, as shown in FIG. 8, the hole expanding mechanism 9 moves the hole expanding pin 9a, which is thicker than the leads 1b and 1c, up and down and back and forth by the drive unit 9b. The small-diameter hole remaining between the upper tape and the lower tape after the lead of the electronic component 1A is pulled out from the electronic component 1A is expanded by the hole expanding pin 9a (a hole expanding step corresponding to claim 2). Note that the surface of the hole widening pin 9a is previously coated with a release material so that it does not adhere to the adhesive of the tape when inserted into the carrier tape.
On the other hand, as shown in FIGS. 10A and 10B, the lead insertion guide mechanism 10 has a lead guide hole 10b enlarged in a trumpet shape formed on a mating surface of a header 10a having a left-right split structure. The header 10a is opened and closed by the operation of 10c. Then, as shown in FIG. 11, after positioning the header 10a of the lead insertion guide mechanism 10 to access the hole 2c of the carrier tape 2 expanded by the hole expanding mechanism 9, the electronic component 1B gripped by the chuck hand 6c. Of the carrier tape is guided to the hole 2c of the carrier tape through a trumpet-shaped lead guide hole 10b opened in the header 10a. After inserting the lead of the electronic component 1B, the header 10a having the split structure is opened and detached from the lead. Thereby, the leads 1b and 1c of the electronic component 1B can be reliably inserted into the holes of the carrier tapes 2 and 3 without an operation error.
[0018]
In the loaded state in which the leads 1b and 1c of the electronic component 1B are inserted into the carrier tapes 2 and 3 by the above-described operation, the electronic component 1B is aligned and corrected from the beginning to a position aligned with the other electronic component 1 held and taped. To this end, the automatic replacement device is provided with a positioning guide mechanism 11 inside the tape transport guide mechanism 5 as shown in FIG. 12 (claim 6), and its detailed structure is shown in FIGS. 13 (a) and 13 (b). Shown in
That is, the positioning guide mechanism 11 is configured such that the pair of left and right guide pieces 11a installed in accordance with the replacement station position of the electronic component is slid left and right by the driving unit 11b. The length is set so as to straddle the component body 1a of another electronic component 1 which is taped and held by the carrier tapes 2 and 3 side by side around the center.
[0019]
Then, with the leads 1b and 1c of the electronic component 1B inserted into the left and right carrier tapings 2 and 3 as described above (see FIG. 1D), the chuck hand 6c is removed from the lead of the electronic component 1B. Then, the positioning guide piece 11a is moved from the standby position toward the center, and is brought close until both ends of the guide piece 11a come into contact with the end surface of the component body (mold portion) 1a of the electronic component 1 which is held in a fixed position by taping. . As a result, the electronic component 1B, which is displaced in the axial direction from the regular alignment position, has its component body pushed by the guide piece 11a, and the alignment position is corrected. Reference numeral 12 denotes a pressing plate disposed above the component body 1a so as to prevent the electronic component 1B from jumping up during the electronic component positioning operation.
[0020]
Next, in a final step of component replacement (an eighth step of the first aspect), the leads 1b and 1c of the electronic component 1B which is positioned and corrected to a fixed position and loaded on the carrier tapes 2 and 3 are connected to the carrier tape 2 and FIG. 14 shows a lead press-fitting mechanism for press-fitting to the adhesive surface of No. 3 and securely holding the taping. The lead pressure bonding mechanism 13 is configured to press a pressure roller 13a arranged to press down the carrier tapes 2 and 3 from above on the rail of the tape transport guide mechanism 5 by the spring force of a compression spring 13b. It is arranged downstream of the component replacement position set on the transport path. In addition, concave grooves 13a-1 are formed on the peripheral surface of the pressure roller 13a in accordance with the arrangement pitch of the electronic components held and taped on the carrier tapes 2 and 3.
[0021]
Then, when the electronic component 1B re-held on the carrier tapes 2 and 3 by the component replacement operation described above moves right below the lead crimping mechanism 13 when the transport of the carrier tape is resumed, the leads 1b and 2b of the electronic component 1B are moved. The upper and lower tapes of the carrier tapes 2 and 3 sandwiching 1c from above and below receive pressure from the pressure roller 13a, so that the leads 1b and 1c adhere to the adhesive surface (adhesive) of the carrier tape and securely. Taping is held.
The component replacement process for one electronic component is completed by the above-described series of operations. Then, when the next electronic component determined to be defective in the product inspection is sent to the component replacement position of the automatic replacement device after restarting the transport of the carrier tape, this is detected, and the transport of the carrier tape is temporarily stopped. A series of operations similar to those described above are performed to replace a defective electronic component with a non-defective electronic component and send it to a subsequent process.
[0022]
【The invention's effect】
As described above, according to the component replacement method and the automatic replacement device of the present invention, when the electronic component with leads held by taping on the carrier tape is removed from the carrier tape, the tape is not cut or peeled off. The electronic components that have been determined to be defective can be properly re-held at the same position after being removed, especially by combining the automatic replacement device with the electronic component product inspection process. Can be automatically performed on the carrier tape conveyance path.
[Brief description of the drawings]
FIGS. 1A to 1D are plan views schematically illustrating a replacement operation position of an electronic component in each step. FIGS. 1A to 1D are explanatory views of basic operations of a component replacement method according to the present invention. FIGS. FIG. 3 is a view showing the configuration of an automatic replacement device according to an embodiment of the present invention applied to the method. FIG. 3 is an explanatory view of an electronic component lead peeling process by the automatic replacement device of FIG. ) Is a diagram showing the trajectory of the eccentric rotational movement of the lead. FIG. 4 is a diagram showing an operation state of a lead pulling-out step following the step of FIG. 3. FIG. 5 is an operation state of a carrier tape retracting step following the step of FIG. FIG. 6 is a diagram showing an operation state of an electronic component removing process following the process of FIG. 5. FIG. 7 is a layout diagram of a carrier tape hole expanding mechanism provided in the automatic replacement device. FIG. FIG. (B) is a plan view and a side view showing a state in which the hole widening pins are inserted into the carrier tape. [FIG. 9] A layout view of a lead insertion guide mechanism provided in the automatic replacement device. [FIG. 10] A lead insertion guide in FIG. (A) and (b) are side and cross-sectional views, respectively, of the mechanism. [FIG. 11] Operation explanatory view of the lead insertion guide mechanism in FIG. 9 [FIG. 12] FIG. FIG. 13 is a detailed structural view of the positioning guide mechanism in FIG. 12, wherein (a) and (b) are a plan view and a side view, respectively. FIG. 14 is a lead crimping mechanism provided in an automatic replacement device. FIG. 15 is a perspective view showing a state in which electronic components with leads are aligned and held on a carrier tape. FIG. 16 is a plan view of FIG. Description]
REFERENCE SIGNS LIST 1 electronic component with lead 1a component body 1b, 1c lead 2, 3 carrier tape 4 automatic replacement device 5 tape transport guide mechanism 6 handling mechanism 6c chuck hand 7 tape moving mechanism 9 hole expanding mechanism 9a hole expanding pin 10 lead insertion guide mechanism 11 Positioning guide mechanism 13 Lead crimping mechanism

Claims (6)

For electronic components with axial leads, whose leads are drawn out from both ends of the component body in the axial direction, the leads at both ends of the electronic components are taped to carrier tapes in the left and right rows where a pair of upper and lower adhesive tapes are superimposed on each other. A method of replacing electronic components with leads, in which a specified electronic component is extracted from a carrier tape from a state where the components are aligned and held, another electronic component is loaded in the same position, and the carrier tape is held again.
The process of extracting electronic components
A first step of applying an eccentric rotational movement to the electronic component while holding the leads at both ends between the left and right rows of carrier tape and separating the leads from the adhesive surface of the carrier tape;
A second step of moving the electronic component in the axial direction so as to approach one of the carrier tapes in the left and right rows and pulling out leads from the other carrier tape;
A third step of shifting the carrier tape from which the leads have been pulled out in the second step from the taping position to the retracted position;
A fourth step of moving the electronic component in the opposite direction to the second step and pulling out the other lead from the carrier tape,
The following electronic component re-holding process
In a procedure reverse to the above-described extracting step, a tip of one lead of the electronic component is inserted between the carrier tapes corresponding to the fourth step, and then the electronic component is moved toward the carrier tape. Process and
A sixth step of returning the carrier tape shifted to the retracted position in the third step to the original taping position;
A seventh step of moving the electronic component in the opposite direction to the fifth step and inserting the other lead between the carrier tapes returned to the taping position;
An eighth step of applying a pressing force to the taping position of the carrier tape in a state where the leads of the electronic component are inserted, and pressing the leads against the adhesive surface of the carrier tape; Replacement method. The replacement method according to claim 1, wherein before inserting the lead of the electronic component between the carrier tapes in the fifth and seventh steps, a hole remaining in a taping portion of the carrier tape is expanded. Replacement method of the parts with leads held by taping. 2. The method according to claim 1, wherein, before shifting from the seventh step to the eighth step, the electronic component to be re-held is aligned with another electronic component which is taped and held on a carrier tape. A method of replacing an electronic component with a lead held by taping, wherein the electronic component is held in a taping position and adjusted. An automatic replacement device that implements the replacement method according to claim 1 grips an electronic component taped and held on the carrier tape at a component replacement position set on a carrier tape transport guide mechanism and a carrier tape transport path. A handling mechanism with a chuck hand that performs eccentric rotation and axial movement operation, and a tape movement mechanism that shifts the carrier tape from the taping position to the retracted position are equipped with a taping-held lead. Automatic replacement device for electronic components. An automatic replacement device according to claim 4, further comprising a hole expanding mechanism corresponding to the replacement method according to claim 2, and a lead insertion guide mechanism for electronic components. Replacement device. 5. An automatic replacement device for electronic components with leads held on tape, wherein the automatic replacement device according to claim 4 is provided with a positioning guide mechanism for electronic components corresponding to the replacement method according to claim 3.

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