JP2004332000A - Plating method, and plating fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating fixture with which the circumferential flow of plating liquid is not disturbed, the opening part of a plating tank is completely covered and many parts are plated in a single plating process. <P>SOLUTION: The plating fixture 30 consists of an annular part 31 obtained by bending a wire rod such as wire and a handle part 32. Linear suspension members 33 are connected to the annular part 31, each suspension member 33 is fitted with five objects 11 to be plated, and the objects 11 to be plated are arranged closely to the inner circumferential face of a beaker 8. Without the plating fixture 30, only 10 pieces of the objects 11 to be plated can be arranged in the beaker 8 with the same size, however in this example, 20 pieces of the suspension members 33 are fitted, and about 100 pieces of the objects to 11 to be plated can be fitted thereto. The plating fixture is placed on the opening part of the beaker 8, a circular cover member 36 curved into the shape of a convex lens is placed so as to be convex downward, and the covering is securely performed to prevent the deterioration of the liquid. The circumferential flow of the plating liquid by a stirring means is not disturbed by the objects to be plated and the fixture arranged at the inner circumferential face, and the plating is uniform. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a plating jig used for arranging an object to be plated in a plating tank, and particularly to a plating jig capable of arranging a large number of objects to be plated without obstructing rotation of a plating solution in the plating tank. It is about tools.
[0002]
[Prior art]
FIG. 8 is a sectional view of a conventional plating apparatus. FIG. 9 shows a plating jig used in the plating apparatus, which is an instrument for placing an object to be plated in a plating tank of the plating apparatus. FIG. 10 is a plan view of a conventional plating apparatus, showing a flow of a plating solution in a plating tank.
[0003]
The conventional plating apparatus shown in FIG. 8 is an apparatus used for electroless plating or electrolytic plating of a relatively small component, and has a rotary drive device 1 also serving as a base. A magnet 4 that is rotated by a driving unit 3 such as a motor is provided inside a casing 2 of the rotary driving device 1. The magnet 4 is a substantially U-shaped permanent magnet, and is disposed near the center of the lower surface of the top plate 2 a of the casing 2. In the center of the upper surface of the top plate 2a of the casing 2 of the rotary drive device 1, a stainless steel thermostat 5 is arranged. The inside of the thermostat 5 is filled with water, and a heater 6 as a heating means is disposed at the bottom thereof. The heater 6 is controlled by the control means 7 so that the water in the thermostat 5 keeps a constant temperature. In the center of the constant temperature bath 5, a beaker 8 as a plating bath is arranged. The height of the beaker 8 is higher than the water surface of the thermostat 5. A plating solution 9 is stored in the beaker 8, and a stirrer 10 in which a rod-shaped permanent magnet is covered with a resin is placed in the center of the bottom. At the center of the beaker 8, a plating jig 12 to which a plurality of objects to be plated 11 are attached is arranged, whereby the objects to be plated 11 are immersed in the plating solution 9. In the opening of the beaker 8, two plate glasses 13, 13 are placed so as to sandwich the plating jig 12, thereby forming a lid of the beaker 8. A large number of resin floating balls 14 float on the water surface of the constant temperature bath 5 to prevent evaporation of water (hot water) in the constant temperature bath 5.
[0004]
As shown in FIG. 9, the plating jig 12 used in the plating apparatus of FIG. 8 includes a center rod 16 made of a conductive material (for example, copper) having a hook 15 at an upper end, and a plurality of pairs of (5 pairs in the example). Each mounting portion 17 is composed of two thin rods 18 extending horizontally from the center rod 16 at right angles, and the tips of the thin rods 18 are further bent at right angles in a horizontal plane.
[0005]
The object to be plated 11 has a substantially square shape, and two mounting holes 11a are formed along one side thereof.
[0006]
The tips of the two thin rods 18 are inserted into the two mounting holes 11d provided in the object 11 to fix the object 11 to be plated. As shown in FIG. 9 or FIG. 10, the surface of the object to be plated 11 attached to the plating jig 12 is parallel to the center rod 16 and the thin rod 18. In this example, ten plating objects 11 are attached to one plating jig 12.
[0007]
The plating jig 12 is coated with a plating-resistant solution 9 except for the hook portion 15 and the tip of the fine rod 18, and can be used for both electroless plating and electrolytic plating. In the case of the electrolytic plating, the hook portion 15 is hung on the electrode so that the object to be plated 11 at the tip of the thin rod 18 is energized.
[0008]
When plating is performed by this plating apparatus, the driving means 3 of the rotary driving device 1 is driven to rotate the magnet 4. As shown in FIG. 10, the magnetic force of the magnet 4 causes the stirrer 10 in the beaker 8 to rotate, and with the rotation of the stirrer 10, the plating solution 9 in the beaker 8 moves in the circumferential direction indicated by an arrow A in FIG. To rotate. The plating solution 9 repeatedly collides with the surface of the plating object 11 substantially perpendicularly, and the metal in the plating solution 9 is plated on the surface of the plating object 11.
[0009]
In the conventional plating apparatus as shown in FIG. 8, a jig 12 as shown in FIG. 9 described above was used for disposing the object to be plated 11 in the beaker 8, but this is a kind of plating jig of this kind. For example, a plating hanger 20 (jig) having a structure as shown in FIG. 11 can be used in the plating apparatus. The plating hanger 20 is disclosed in Patent Literature 1 below. A plurality of metal fittings 24 are attached to an elongated strip-shaped conductive shaft 21 made of a conductive material to form a plurality of mounting holes with the conductive shaft 21. In each of the mounting holes, two wire-shaped hooks 22 are provided so as to cross each other in an X-shape. An object to be plated is attached to both ends of the hook 22, the hanger 20 is arranged at the center of the beaker 8, the curved portion 25 at the upper end is hooked at a point, and the object to be plated is arranged and immersed in the plating solution 9.
[0010]
[Patent Document 1]
JP-A-48-65816
[0011]
[Problems to be solved by the invention]
The conventional plating apparatus has the following problems.
{Circle around (1)} Since the plating jig itself obstructs the rotation (flow) of the plating solution, there is a problem that the plating solution does not uniformly contact all the objects to be plated, and the plating is not uniform for each component. That is, as shown in FIG. 10, the flow of the plating solution 9 in the circumferential direction collides substantially perpendicularly with the surface of the plating object 11, so that the momentum of the plating solution 9 is attenuated, and the plating solution 9 is disposed at the center of rotation. The center rod 16 of the plating jig 12 greatly obstructs the flow of the plating solution 9, and the large number of thin rods 18 projecting from the center bar 16 also obstruct the flow of the plating solution 9. For this reason, the peripheral speed of the plating solution 9 is sufficient at the bottom of the beaker 8 where the stirrer 10 is present and the plating jig 12 is not provided, but the plating solution 9 is located above the region where the plating jig 12 exists. The flow rate of the air becomes insufficient. For this reason, the flow of the plating solution 9 is not uniform, and eddies are generated at various places. Then, the contact of the plating solution 9 with the plating object 11 becomes non-uniform, which causes a problem that an unacceptable variation occurs in the plating thickness of the plating object 11. In particular, in this example, the plating solution 9 is stirred by rotating the stirrer 10 remotely by magnetic force. However, in this method, it is originally difficult to give a large flow rate to the plating solution 9, and thus the above-described problem is caused. Is even more difficult to solve.
[0012]
{Circle around (2)} The conventional plating jig 12 is arranged to be inserted into the center of the beaker 8 from above, and since the center rod 16 of the jig 12 is thick, a complete lid is placed at the opening of the beaker 8. Can not do it. As a result, the plating solution 9 evaporates from the gap or the temperature of the plating solution drops, and the plating conditions fluctuate. Therefore, there is a problem that the characteristics of the obtained plating are unacceptably varied. In particular, when a black body film provided on a light receiving element of an optical calorimeter light receiver or an optical shutter is formed by plating, for example, the temperature of the plating solution 9, the stirring speed, the composition of the plating solution 9, etc. The above-mentioned problems become even more important because the plating conditions greatly affect the plating conditions.
[0013]
{Circle around (3)} Since the conventional plating jig 12 is configured to attach the plated objects 11 to the ends of the thin rods 18 protruding from the center rod 16, it is difficult to attach many plated objects 11 at once. As described above, the number is limited to about ten, and it has not been possible to meet a demand for plating many components in one plating step.
It should be noted that the above-described problem also arises similarly when the plating jig described in Patent Document 1 shown in FIG. 11 is used, and it is needless to say that the problem must be solved.
[0014]
The present invention has been made in order to solve the above-mentioned problem, and can completely cover an opening of a plating tank without obstructing a circumferential flow of a plating solution in a plating tank. It is another object of the present invention to provide a plating jig capable of plating many components in a single plating step.
[0015]
[Means for Solving the Problems]
The plating method according to claim 1 stores a plating solution 9 in a cylindrical plating tank 8, and immerses a plurality of objects to be plated 11 in the plating solution 9 to form an inner peripheral surface of the plating tank 8. And the plating solution 9 is rotated in the circumferential direction of the plating tank 8.
[0016]
In the plating jigs 30, 40, 50 according to the second aspect, a plurality of plated objects 11 are arranged along the inner peripheral surface of a cylindrical plating tank 8 having an opening 8 a and containing a plating solution 9. A plating jig for performing
Annular portions 31, 41, 43 installed in the circular openings 8 a of the plating tank 8, and plated portions extending downward from the annular portions 31, 41, 43 along the inner peripheral surface of the plating tank 8. Object to be plated arrangement means 33, 51 for arranging the object 11,
It is characterized by having.
[0017]
The plating jig 30 according to a third aspect is the plating jig according to the second aspect, wherein the object to be plated is a suspension member 33 that is detachably attached to the annular portion 31. A locking structure 34 is provided on the annular portion 31 to prevent the hanging member 33 attached to the annular member 31 from moving in the circumferential direction.
[0018]
According to a fourth aspect of the present invention, there is provided a plating jig according to the second aspect, wherein the annular portion includes an upper annular portion and a lower annular portion in which the annular portion is arranged at the same center. An arrangement means is a suspending member 33 detachably attached to the upper annular portion 41, and a locking structure for preventing the suspending member 33 detachably attached to the upper annular portion 41 from moving in the circumferential direction. 45 and 46 are provided on the lower annular portion 42.
[0019]
The plating jig 50 according to a fifth aspect is the plating jig according to the second aspect, wherein the object to be plated is a rod-shaped arm 51 fixed to the annular portion 31. At the lower end, a locking portion 52 for holding the object to be plated 11 is provided so as to protrude in the horizontal direction.
[0020]
The plating jigs 30, 40, and 50 according to claim 6 are the plating jigs according to claims 2 to 5, and further include a diameter adjusting unit 32 that adjusts the diameter of the annular portions 31, 41, and 43. It is characterized by:
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described. The plating jig according to the embodiment of the present invention is used in the conventional plating apparatus described with reference to FIG. 8 in place of the conventional plating jig. Therefore, the rotary drive 1, the thermostat 5, the stirrer 10, and the like can be the same as those described in the related art.
[0022]
In the plating jig 30 according to the embodiment of the present invention, there is no portion (member) that obstructs rotation of the plating solution 9 in the center of the beaker 8, which is a cylindrical plating tank, and extends along the inner peripheral surface of the beaker 8. It is characterized in that a large number of objects to be plated 11 can be arranged. The object 11 to be plated held in the beaker 8 by the plating jig 30 according to the embodiment of the present invention has the same shape as that exemplified in the related art, and is an optical calorimeter that forms a black body film by plating. It is assumed to be a light receiving element of a light receiver or an optical shutter. Of course, this is only an example and does not limit the subject of the present invention, but is illustrated for the sake of specific description.
[0023]
A first example of an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the plating jig 30 is made of a single wire such as a wire having plasticity, and has an annular portion 31 formed by bending the wire and both ends of the wire are annular portions 31. And a handle portion 32 linearly protruding outwardly from the handle.
[0024]
By adjusting the distance between the two ends of the handle portion 32, the diameter of the annular portion 31 can be adjusted to some extent. That is, the handle portion 32 composed of the two end portions 32a serves as a portion to be gripped by hand when handling, and also has a function as a diameter adjusting means for adjusting the diameter of the annular portion 31.
[0025]
A linear suspending member 33 is detachably connected to the annular portion 31 as an object to be plated arrangement means. The suspending member 33 is a member extending downward and for arranging the plating object 11 along the inner peripheral surface of the beaker 8, and is a long body having a certain degree of rigidity such as a wire or a copper wire. A member such as a soft thread is not suitable because the object to be plated 11 fluctuates due to the flow of the plating solution 9.
[0026]
In this example, a thin wire 34 is spirally wound around the annular portion 31 over the entire circumference, and a locking structure for the annular portion 31 of the suspending member 33 attached to the annular portion 31 is configured. Is prevented from being moved in the circumferential direction along the annular portion 31 by being pushed by the flow of the plating solution 9.
[0027]
As shown in FIG. 1, a beaker 8 as a plating tank has a circular opening 8a. The opening 8a is slightly larger in diameter than the cylindrical portion 8b of the main body. The annular portion 31 of the plating jig 30 of this example is adjusted to have an outer diameter smaller than the opening 8a and slightly larger than the cylindrical portion 8b of the main body, and is placed in the opening 8a. The handle part 32 is arranged at the spout 8 c of the beaker 8 and faces slightly downward.
[0028]
Five objects to be plated 11 are attached to each of the suspension members 33. The object 11 to be plated in this example has the same shape as that described in the related art, and as shown in FIG. 3, five suspension members 33 are passed through the two mounting holes 11d of the mounting portion. The objects 11 are skewered by the hanging members 33 and arranged. The plated object 11 provided on the suspension member 33 suspended from the annular portion 31 is arranged close to the inner peripheral surface of the beaker 8. The attitude of the plate-shaped object to be plated 11 with respect to the plating solution 9 rotating in the beaker 8 can be appropriately set by picking the object to be plated 11 attached to the suspension member 33 and twisting the suspension member 33 lightly. it can. In this example, although not shown in detail, the surface of the object to be plated 11 has an obtuse angle of attack with respect to the flow of the plating solution 9.
[0029]
In FIG. 1, only one hanging member 33 and five plated objects 11 attached thereto are shown in order to avoid complication in the illustration, but a beaker 8 (with a capacity of 2 According to the plating jig 30 of the present example used for (liter), at least 20 suspension members 33 are attached to the annular portion 31 at a sufficient interval in the circumferential direction. Accordingly, in the present example, at least 100 plated objects 11 (disc diameter of 16 mm), which could be arranged only in the middle of the beaker 8 in the middle of the beaker 8, are arranged along the inner peripheral surface of the beaker 8. It can be arranged.
[0030]
Further, since the plating jig 30 of the present example mainly includes the annular portion 31 whose center is open as a space, as shown in FIG. 2, a convex lens is provided at the opening of the beaker 8 provided with the plating jig 30. The cover member 36 (specifically, a watch glass is used) can be placed so as to be convex downward, thereby evaporating the plating solution 9 from the beaker 8 and plating. The temperature of the liquid 9 can be prevented from lowering. That is, the moisture evaporated from the plating solution 9 adheres to the inner surface (lower surface) of the lid member 36 without escaping to the outside and becomes water, collects at the center of the lower surface protruding below the lid member 36, and falls, and falls inside the beaker 8. It is possible to return to the plating solution 9. The concentration of the plating solution 9 does not change.
[0031]
Further, since the handle 32 of the plating jig 30 of the present example has an end inclined downward as shown in FIG. 2, even if water adheres to the handle 32, the water causes the handle 32 to move. It does not penetrate into the plating solution 9 in the beaker 8 but flows down to the outside. The concentration and temperature of the plating solution 9 do not change.
[0032]
When plating is performed, the driving means 3 of the rotary driving device 1 is driven to rotate the magnet 4. As shown in FIG. 1, the magnetic force of the magnet 4 causes the stirrer 10 in the beaker 8 to rotate, and with the rotation of the stirrer 10, the plating solution 9 in the beaker 8 moves in the circumferential direction indicated by an arrow B in FIG. To rotate. The plating solution 9 comes into contact with the surfaces of a large number of the objects to be plated 11 arranged along the inner peripheral surface of the beaker 8, and the metal in the plating solution 9 is plated on the surfaces of the objects to be plated 11.
[0033]
In this example, in order to prevent the suspending member 33 from being moved by the flow of the plating solution 9 in the circumferential direction along the annular portion 31, the annular member 31 is used as a locking structure for the annular member 31 of the suspending member 33. A thin wire 34 was spirally wound. However, as such a locking structure, the wire itself forming the annular portion 31 may be configured by a wire having irregularities, or a notch or a convex portion which becomes a hook of the hanging member 33 at an appropriate interval may be formed in the annular portion 31. The structure provided may be sufficient. Further, the annular portion 31 may be covered with a soft tube to form a bellows shape.
[0034]
A second example of the embodiment of the present invention will be described with reference to FIGS.
The plating jig 40 of this example has two annular portions 43 of an upper annular portion 41 and a lower annular portion 42 arranged at the same center. The two annular portions 41 and 42 are vertically connected by four rod-shaped connecting members 44 arranged at equal intervals in the circumferential direction. The outer diameter of the lower annular portion 42 is adjusted to be slightly smaller than the inner diameter of the cylindrical portion 8b of the beaker 8, and enters the beaker 8. The outer diameter of the upper annular portion 41 is smaller than the maximum inner diameter of the opening 8a of the beaker 8, is adjusted to be slightly larger than the inner diameter of the cylindrical portion 8b of the main body, and is placed in the opening 8a. You.
[0035]
The object to be plated arrangement means of this example is also a linear suspension member 33 similarly to the first example, and is detachably connected to the upper annular portion 41. As shown in FIG. 4A, the suspending members 33 are provided at appropriate intervals on the lower annular portion 42 so as not to be pushed by the flow of the plating solution 9 and move in the circumferential direction along the upper annular portion 41. The holding hole 45 is inserted. The number of the holding holes 45 corresponds to the number of the hanging members 33. In this example, the number is set to 20. If five pieces 11 to be plated are attached to one suspension member 33, a total of 100 pieces 11 to be plated can be plated. These numbers can be set arbitrarily, but in any case, a larger number of objects to be plated 11 can be processed at one time as compared with the conventional example.
[0036]
Instead of forming the holding hole 45 in the lower annular portion 42, as shown in FIG. 4B, a holding wire 46 formed into a corrugated shape is welded to the inner peripheral surface of the lower annular portion 42 at every wave trough. The suspension member 33 may be inserted into a gap between the lower annular portion 42 and the holding wire 46.
[0037]
FIG. 5 is a schematic diagram of a plating jig 40 'which is a modification of the second example. In this modification, a handle portion 32 similar to that of the first example is provided on the upper annular portion 41 so that the diameter of the annular portion 43 can be adjusted, and the lower annular portion 42 connected thereto is a handle of the upper annular portion 41. At a position corresponding to the portion 32, a C-shape having a gap 47 in which the ring was interrupted was used. According to this configuration, if the diameter of the upper annular portion 41 is adjusted by the operation of the handle portion 32, the lower annular portion 42 connected to the upper annular portion 41 by the connecting member 44 receives the same force, and the dimension of the gap portion 47 changes. To adjust the diameter.
[0038]
According to the present example, the linear hanging member 33 is used for disposing the object to be plated 11 as in the first example, but the first example is such that the annular member 31 is locked at the base of the hanging member 33. In this example, the base of the suspension member 33 is tied to the upper annular portion 41, and the free end side of the suspension member 33 is held by the lower annular portion 42. There is an advantage that the plating solution 9 is hard to move due to the flow of the solution 9 and the contact state of the plating solution 9 with the plating object 11 is constant and more difficult to change. That is, the suspension member 33 is more reliably fixed to the upper annular portion 41, the suspension member 33 does not tilt due to the flow of the plating solution 9, and the plating solution 9 hits the plating object 11 uniformly. There is an effect that it is easy.
[0039]
A third example of the embodiment of the present invention will be described with reference to FIGS.
In the plating jig 50 of this example, the configuration of the annular portion 31 including the handle portion 32 is substantially the same as that of the first example, but the plating object arranging means is the suspension member 33 of the first and second examples. The difference is that a rod-shaped arm 51 fixed to the annular portion 31 is used instead of a wire or a copper wire as described above. The arm 51 extends vertically downward with respect to the surface of the annular portion 31 and is a rod-shaped member having the same rigidity as the annular portion 31. At a lower end and a substantially middle position of the arm 51, a locking portion 52 composed of two rods for holding the object to be plated 11 is horizontally projected. The object to be plated 11 is attached to the locking portion 52 such that the surface is perpendicular.
[0040]
As shown in FIG. 7A, the direction in which the locking portion 52 protrudes in the horizontal plane with respect to the arm 51 with respect to the flow direction B of the plating solution 9 in the plating bath is such that the angle with respect to the tangent of the annular portion 31 is an acute angle. Set to be. By doing so, the plating solution 9 hits the desired surface of the plating object 11 attached to the tip of the locking portion 52 at an obtuse angle, and does not obstruct the flow of the plating solution 9 without obstructing the flow of the plating solution 9. To the plating solution 9.
[0041]
Further, as shown in FIG. 7B, the projecting direction of the locking portion 52 in the horizontal plane with respect to the arm 51 is set so as to be perpendicular to the tangent to the annular portion 31. In this way, the plating object 11 attached to the tip of the locking portion 52 becomes parallel to the flow of the plating solution 9, and does not obstruct the flow of the plating solution 9, and 9 can be brought into sufficient contact.
[0042]
According to the plating jig 50 of the present example, since the annular portion 31 and the arm 51 are integrally provided with high rigidity, a large number of the plated objects 11 attached to the arm 51 are located close to the inner peripheral surface of the beaker 8. The plating object 9 is securely placed at the position, does not move even by the flow of the plating solution 9, and is appropriately brought into contact with the plating solution 9 under predetermined conditions, so that the intended plating treatment is reliably performed.
[0043]
In this example, as shown in FIG. 6, ten arms 51 are provided, and each arm 51 has two sets of locking portions 52. Accordingly, in the illustrated example, twenty plating objects 11 are arranged along the inner peripheral surface of one plating tank, and plating can be performed at one time. However, these numbers are arbitrary, and if the number of the arms 51 is 20 and the number of the locking portions of each arm 51 is 5, each 100 objects to be plated 11 are arranged along the inner peripheral surface of one plating tank. And can be plated at one time. In any case, a larger amount of the object to be plated 11 can be processed at one time than in the conventional example.
[0044]
In each embodiment of the present invention described above, a beaker is illustrated as a plating tank, but this is an example of a case where the plating tank is used for a relatively small-scale plating process, and is not limited thereto. If so, it can be suitably used as a plating tank regardless of the size, size, volume, height, etc. of the scale.
However, not only a cylindrical plating tank, but also a cylindrical body having an elliptical shape on a horizontal cut surface, or a polygonal shape of a quadrangle or more with rounded corners (curved corners) on a horizontal cut surface A corresponding effect can be obtained for the presenting cylinder by using the plating jig of the present invention.
[0045]
Further, in each of the embodiments of the present invention described above, electroless plating is exemplified as in the case of an optical component in which a black body film is formed as an object to be plated. In this case, since electricity is not used, there is no influence of the electric conditions, and the conditions such as the temperature and composition of the plating solution have a great influence on the plating result. Therefore, the present invention is particularly advantageous in that the opening of the plating tank can be securely closed with the lid member to prevent the deterioration of the plating solution.
[0046]
Specifically, the black body is obtained by, for example, forming a nickel-phosphorus alloy film by electroless plating and oxidizing the same. In the electroless plating process, a chemically easily dissolvable portion and a hardly dissolvable portion are uniformly formed on the surface of the coating, and when this is oxidized in a later process, the surface is uniformly formed with irregularities. The overall reflectivity is reduced, and the performance as a black body is obtained. Therefore, in the electroless plating step, the function as a finally obtained black body varies unless the chemical reaction on the surface is constant. As described above, in the electroless plating in the formation of the black body film, the conditions such as the temperature and composition of the plating solution have a great influence on the plating result.
[0047]
However, it goes without saying that the present invention can also be applied to an electrolytic plating process in which conditions such as the temperature and composition of the plating solution do not relatively significantly affect the results of plating. Also in this case, as in the above-described examples, it is needless to say that the flow of the plating solution in the plating tank in the circumferential direction is smooth, and the effect of plating many components in one plating step can be obtained.
[0048]
【The invention's effect】
According to the invention of the plating method according to the first aspect, since a large number of objects to be plated are arranged along the inner peripheral surface of the plating tank, many parts can be plated in one plating step, and the circumference of the plating tank is reduced. The plating object does not obstruct the rotation of the plating solution along the direction, and a lid that completely closes the opening of the plating tank can be used. There is an effect that it can be held.
[0049]
According to the invention of the plating jig according to the second aspect, the object to be plated is extended downward from the annular portion and the object to be plated can be arranged along the inner peripheral surface of the plating tank. Many parts can be plated in the process, and the plating object does not obstruct the rotation of the plating solution along the circumference of the plating tank, and a lid can be used to completely close the opening of the plating tank. There is an effect that the evaporation of the solution can be prevented and the uniformity of the plating conditions can be maintained.
[0050]
According to the invention of the plating jig according to the third aspect, since the elongated plating object arranging means is detachably attached to the annular portion via the locking structure, the suspension member is pushed by the flow of the plating solution. Prevents the plating object from moving in the circumferential direction along the annular part, and the plating object does not collect at a specific location in the plating tank, and the predetermined plating conditions are maintained for many plating objects Can be performed stably.
[0051]
According to the invention of the plating jig according to the fourth aspect, the annular portion is constituted by the upper annular portion and the lower annular portion arranged at the same center, and the elongated object to be plated is attached to the upper annular portion. Since the structure is such that the ring-shaped portion is locked by the locking structure, even if the elongated object-to-be-plated arrangement means is used, the base can be tied to the upper ring-shaped portion and the free end side can be held by the lower ring-shaped portion. For this reason, there is an advantage that the elongated object to be plated is hardly moved or deformed even by the force of the flow of the plating solution, and the contact state of the plating solution with the object to be plated is constant and more difficult to change.
[0052]
According to the invention of the plating jig according to the fifth aspect, the object to be plated is arranged along the inner peripheral surface of the plating tank in a highly rigid frame structure in which a rod-shaped arm is fixed to the annular portion as means for arranging the object to be plated. Therefore, a large number of objects to be plated attached to the arm are securely arranged at predetermined positions close to the inner peripheral surface of the beaker and do not move even by the flow of the plating solution. , And the desired plating treatment is reliably performed.
[0053]
According to the invention of the plating jig according to claim 6, since the diameter adjusting means is provided in the plating jig according to claims 2 to 5, the annular portion is adjusted according to the diameter of the plating tank in which the plating jig is set. Can be adjusted, and the plating jig can be attached to the plating tank in a stable state.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a first example of an embodiment of the present invention.
FIG. 2 is a longitudinal sectional view showing a first example of an embodiment of the present invention.
FIG. 3 is a front view showing a state of attachment of the object to be plated 11 to the object to be plated arrangement means in the first example of the embodiment of the present invention.
FIG. 4A is a perspective view showing a second example of the embodiment of the present invention, and FIG. 4B is a partially enlarged perspective view showing a modification of the locking structure.
FIG. 5 is a perspective view showing a modification of the second example of the embodiment of the present invention.
FIG. 6 is a perspective view showing a third example of the embodiment of the present invention.
FIG. 7A is a plan view showing a relationship between a plating object locating means and a flow direction of a plating solution with respect to a plating object 11 in a third example of an embodiment of the present invention, and FIG. It is a top view which shows the relationship between the to-be-plated object arrangement | positioning means in the modification of 3rd Example, and the flow direction of the plating solution with respect to a to-be-plated object.
FIG. 8 is a longitudinal sectional view showing the entire configuration of a conventional plating apparatus.
FIG. 9 is a perspective view showing a plating jig for arranging a plating object used in a conventional plating apparatus in a plating tank and a plating object attached to the plating jig.
FIG. 10 is a plan view of a plating tank in a conventional plating apparatus, showing a relationship between an object to be plated attached to a plating jig and a flow of a plating solution.
FIG. 11 is a front view of a conventional plating hanger (jig) that can be used in a conventional plating apparatus.
[Explanation of symbols]
8: beaker as plating tank, 9: plating solution, 11: plating object,
Reference numeral 30 denotes a plating jig, 31 denotes an annular portion, 32 denotes a handle as a means for adjusting the diameter of the annular portion, 33 denotes a long hanging member as a means for arranging an object to be plated, 34 denotes a thin wire as a locking structure,
Reference numeral 40: plating jig, 41: upper annular portion, 42: lower annular portion, 43: annular portion, 45: holding hole as a locking structure, 46: holding wire as a locking structure,
Reference numeral 50 denotes a plating jig, 51 denotes an arm as means for arranging an object to be plated, and 52 denotes a locking portion.

Claims (6)

A plating solution (9) is accommodated in a cylindrical plating tank (8), and a plurality of objects to be plated (11) are immersed in the plating solution and arranged along the inner peripheral surface of the plating tank. A plating method, comprising rotating a solution in a circumferential direction of the plating tank. A plating jig for arranging a plurality of objects to be plated (11) along an inner peripheral surface of a cylindrical plating tank (8) having an opening (8a) and containing a plating solution,
An annular portion (31, 41, 43) installed in a circular opening (8a) of the plating tank;
A plating object disposing means (33, 51) extending downward from the annular portion and disposing the plating object along an inner peripheral surface of the plating tank;
A plating jig (30, 40, 50) comprising: The object-to-be-plated means is a suspending member (33) detachably attached to the annular portion (31), and locking for preventing the suspending member attached to the annular portion from moving in the circumferential direction. The plating jig (30) according to claim 2, wherein a structure (34) is provided on the annular portion. The annular member (43) comprises an upper annular portion (41) and a lower annular portion (42) arranged at the same center, and the hanging member (33) to which the object to be plated is detachably attached to the upper annular portion. ), Wherein a locking structure (45, 46) is provided on the lower annular portion to prevent the hanging member detachably attached to the upper annular portion from moving in the circumferential direction. The plating jig (40) according to claim 2. The plating object arranging means is a rod-shaped arm (51) fixed to the annular portion (31), and a locking portion (52) for holding the plating object (11) is provided at a lower end of the arm. The plating jig (50) according to claim 2, wherein the plating jig (30) is provided so as to protrude in a horizontal direction. The plating jig (30, 40, 50) according to any one of claims 2 to 5, further comprising a diameter adjusting means for adjusting a diameter of the annular portion (31, 41, 43).

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