JPH0149786B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a vapor deposition apparatus used for vacuum vapor deposition and the like, and particularly in a vapor deposition apparatus that heats and evaporates a vapor deposition material using an electron beam.

Vapor deposition apparatuses that use electron beams as heating means are used in various vapor deposition methods such as vacuum evaporation, ion plating, and sputtering.
The problem is that only a small portion of the material is deposited on the object, so the deposition efficiency is low. For example, in oblique evaporation where the surface to be evaporated is placed obliquely to the vapor flow,
The deposition efficiency is extremely low, about 1-5%, and material loss is large.

In view of this point, the present inventors installed a reflective guide plate between a container containing a vapor deposition material and an object to be deposited to effectively guide the vapor flow toward the object to be vapor deposited, and this reflective guide plate allows the vapor to flow. He invented a device that reflects and guides light, and has already applied for a patent.

This is because when a guide plate installed along the vapor flow path is heated to a certain temperature (this temperature is called the "reflection temperature") that is higher than the evaporation temperature of the vapor deposition material, the guide plate This application was filed based on the discovery that the vapor flow reflects the vapor flow, and the vapor flow can be efficiently transferred to the deposition target by utilizing the phenomenon of reflecting the vapor flow without attaching the vapor deposition material to the surface. It was designed to be directed towards.

Here, "reflection" means changing the course of the vapor flow particles as if they were reflected without actually adhering to the reflection plate, and does not necessarily mean , does not imply reflection such as optical specular reflection.

This method is revolutionary in increasing the conventional resistivity (1%) in oblique evaporation to several tens of percent, but when heating and evaporating the evaporation material with an electron beam, the incident optical path of the electron beam must be changed. There is a problem in that the guide plate blocks the electron beam, making it difficult for the electron beam to enter. One way to solve this problem is to bend the electron beam and irradiate the evaporation material from directly above the upper opening of the reflective guide plate. The evaporation rate will decrease. Also,
There is also a method of drilling a hole in the reflective guide plate and letting the electron beam enter the hole, but since the electron beam scans back and forth in the horizontal direction, a long horizontal hole (slit) must be drilled. There is a problem in that the vapor flow escapes through these long holes, reducing the deposition efficiency.

In oblique evaporation, the tape base of the object to be evaporated is sent along a cooling can with a large diameter, so it is not possible to introduce an electron beam from directly above the container (crucible, hearth, etc.) containing the evaporation material. Therefore, the above-mentioned method has to be adopted, but it has the above-mentioned difficulties and has become a problem that must be solved in practice.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electron beam evaporation apparatus that effectively solves the above problems.

In the vapor deposition apparatus of the present invention, a part of the reflection guide plate in the incident direction of the electron beam is tilted outward by 10 degrees to 60 degrees, so that the electron beam is directed in a direction tilted by 10 degrees or more from a direction perpendicular to the surface of the vapor deposition material. This is characterized by the fact that it can be incident from any direction.

By making the electron beam incident from a direction tilted by the angle in the above range, the electron beam will not be blocked by the cooling canister, and even if the electron beam is bent, it will be able to enter the evaporation material with only a slight angular deflection. can. Furthermore, if the angle is within the above range, even if the reflection guide plate is tilted outward, it is possible to sufficiently guide the vapor flow toward the object to be deposited, and maintain a high deposition efficiency. Can be done.

Hereinafter, the present invention will be explained in more detail with reference to drawings and experimental examples.

FIG. 1 is a schematic diagram of an electron beam evaporation apparatus that performs oblique evaporation at an angle α while feeding a magnetic tape support 2 wound around a cooling can 1. The vapor deposition material 3 is housed in the hearth 4, and on top of it there is an inner wall 5a standing vertically, and this inner wall 5.
A reflective guide plate is provided, which consists of an outer wall 5b that stands opposite to a and is inclined outward by an angle β, and an opposing end wall 5c that stands perpendicularly between both ends of the inner wall 5a and the outer wall 5b. There is. This reflective guide plate 5 is shown in Figure 2.
A perspective view of the figure is shown.

The electron beam 6 can be incident on the surface of the vapor deposition material 3 along the outwardly inclined outer wall 5b from a direction inclined by an angle γ from the vertical, and is provided along the outer periphery of the cooling can 1. , the vapor deposition material 3 can be reached without being obstructed by the shutter plate 7 having a slit 7a for vapor deposition, or by incidental equipment 8 such as a film thickness gauge installed near the shutter plate 7.

The shape of the reflective guide plate 5 is not limited to that shown in FIGS. 1 and 2, but may be such that only the upper portion 5b' of the outer wall is inclined outward, as shown in FIG. 3. .

The angle of inclination of the outer wall may be such that the electron beam 6 is incident on the surface of the vapor deposition material within a range of 10 to 60 degrees.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing an example of the electron beam evaporation apparatus of the present invention, FIG. 2 is a perspective view showing the hearth and reflection guide plate in the example of FIG. 1, and FIG. It is a side sectional view showing an example. DESCRIPTION OF SYMBOLS 1... Cooling canister, 2... Magnetic tape support, 3... Vapor deposition material, 4... Hearth, 5... Reflection guide plate, 6... Electron beam.

Claims (1)

[Scope of Claims] 1. A container containing a vapor deposition material, an electron beam source that irradiates the vapor deposition material contained in the container with an electron beam from diagonally above to heat and evaporate the vapor deposition material, and the container and an object to be vaporized. In an electron beam evaporation apparatus consisting of a reflective guide plate that is heated above the reflection temperature to reflect the vapor flow of the evaporation material and reflects and guides the vapor flow toward the object to be deposited, An electron beam evaporation apparatus characterized in that a part of the apparatus is tilted outward by 10 degrees to 60 degrees so that the electron beam can be incident on the surface of the evaporation material from a direction tilted by 10 degrees or more from a direction perpendicular to the surface of the evaporation material.