JP2004328476A - Nonreversible circuit element and communication equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a nonreversible circuit element and communication equipment of which the number of components is little, which is inexpensive and by which a substrate is not impaired by action of large external force on the substrate via an external connection terminal. <P>SOLUTION: The nonreversible circuit element 1 roughly consists of a metal case (a metal upper case 4 and a metal lower case 8), a permanent magnet 9, a center electrode assembly 13 and a multi-layer substrate 30 having a resistive element and a capacitor element for matching built-in and from which terminal electrodes 14, 15, 16 project. The terminal electrodes 14, 15, 16 project toward a mounting surface and bottom surfaces of the terminal electrodes 14, 15, 16 are located in the inside rather than the lowermost surface of element components (for example, the metal case 8) other than the terminal electrodes. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a non-reciprocal circuit device and a communication device.
[0002]
[Prior art]
[Patent Document 1]
JP 2001-136006 A
[Patent Document 2]
JP-A-5-304404
[Patent Document 3]
JP-A-9-55607
[0003]
A conventional isolator described in Patent Document 1 is known. As shown in FIG. 14, the isolator 200 includes a metal upper case 201, a permanent magnet 202, a center electrode assembly 203, a multilayer board 204, an external connection terminal component 205, and a metal lower case 207. R is a resistance element. The center electrode assembly 203 and the multilayer board 204 are accommodated in an external connection terminal component 205, and the resistance element R and the permanent magnet 202 are arranged on the upper surface thereof. Then, the permanent magnet 202, the center electrode assembly 203, the multilayer substrate 204, the external connection terminal component 205, and the resistance element R are accommodated in the metal upper case 201 and the metal lower case 207, and constitute a non-reciprocal circuit. . Here, in order to connect the external connection terminal 209 of the external connection terminal component 205 to the mounting substrate, the external connection terminal component 205 has a depth substantially equal to the thickness of the bottom portion 208 of the lower metal case 207 below the external connection terminal component 205. A groove 206 is formed.
[0004]
Further, another isolator described in Patent Document 2 is known. As shown in FIG. 15, the isolator 300 includes a metal case 301, a permanent magnet 307, a multilayer substrate 303 containing a center electrode assembly, and a ferrite 305. External connection terminals 306 connected to the mounting substrate are provided on the side surfaces of the multilayer substrate 303. In the isolator 300, a permanent magnet 307 and a ferrite 305 are accommodated in a multilayer substrate 303 and inserted into a metal case 301. At this time, the lower portion 302 of the metal case 301 and the groove 304 of the multilayer board 303 are fitted. Therefore, the multilayer substrate 303 has a cavity structure.
[0005]
Also, an isolator having a structure similar to that of the isolator 300 described in Patent Document 3 is known.
[0006]
[Problems to be solved by the invention]
By the way, in the isolator 200, the external connection terminal component 205 as another component for connecting the external connection terminal 209 to the mounting board is required, so that the isolator 200 becomes expensive.
[0007]
Further, in the isolator 300, the multilayer substrate 303 is obtained by firing, but it is difficult to manufacture such a cavity structure having a large hole or groove in the center with high dimensional accuracy at low cost.
[0008]
By the way, the present inventor considered that in the isolator 200, the external connection terminal component 205 was omitted and the external connection terminal 209 was protruded from the multilayer board 303. However, in this case, if the isolator 200 is pressed by the mounter nozzle when mounting it on the substrate, or an external force acts on the external connection terminal during the manufacturing process or during product transportation, cracks and cracks may occur in the multilayer substrate 303. have.
[0009]
Therefore, an object of the present invention is to provide a non-reciprocal circuit device and a communication device which are inexpensive with a small number of components and which are not damaged by a large external force acting on the substrate via external connection terminals. is there.
[0010]
Means and Action for Solving the Problems
In order to achieve the above object, a nonreciprocal circuit device according to the present invention includes a permanent magnet, a ferrite to which a DC magnetic field is applied by the permanent magnet, a center electrode assembly provided with a plurality of center electrodes, A flat dielectric substrate having a built-in matching capacitor element connected to an electrode, a metal case surrounding the permanent magnet, the center electrode assembly and the dielectric substrate, mounted on the bottom surface of the dielectric substrate A plurality of external connection terminal electrodes protruding toward the surface are provided, and the bottom surface of the external connection terminal electrode is located inside the lowermost surface of the element component other than the terminal electrode.
[0011]
In the nonreciprocal circuit device according to the present invention, since the bottom surface of the external connection terminal electrode is located inside the lowermost surface of the device component other than the terminal electrode, the nonreciprocal circuit device is mounted on the surface of the mounting substrate or the like. Even when an external force acts from above when placed, the external force is reduced by the difference between the bottom surface of the electrode and the lowermost surface of the element component, so that unnecessary stress does not act on the dielectric substrate and the dielectric substrate Damage is prevented beforehand. The element component other than the terminal electrode is, for example, the metal case.
[0012]
Further, in the non-reciprocal circuit device according to the present invention, the external connection terminal component, which has been conventionally required, is not required, and the dielectric substrate has a flat plate shape, so that deformation during firing is suppressed and dimensional accuracy is reduced. Get better.
[0013]
In the non-reciprocal circuit device according to the present invention, in particular, when the device is mounted on a substrate such as a mobile phone, the device is pressed by a mounter nozzle. At this time, external connection terminals are attached to the solder provided on the substrate. The electrodes come into contact with each other, causing stress on the dielectric substrate. However, since the bottom surface of the external connection terminal electrode is retracted inward, the external force due to contact with the solder is reduced, so that no large stress is generated on the dielectric substrate, and the dielectric substrate is not cracked or broken. Does not occur.
[0014]
In order to prevent damage to the dielectric substrate and ensure the reliability of soldering, the vertical distance between the bottom surface of the external connection terminal electrode and the bottom surface of the element component or metal case must be greater than the particle size of the mounting solder. Preferably, it is 100 μm or less.
[0015]
In the nonreciprocal circuit device according to the present invention, the external connection terminal electrodes may be an input terminal electrode and an output terminal electrode, and the ground electrode provided on the bottom surface of the dielectric substrate may be joined to the metal case. This joining is a mechanical and electrical connection using solder, conductive paste, or the like. The metal case is soldered to the mounting board. Since the metal case and the mounting substrate are bonded to each other over a wide area, the electrical characteristics of the non-reciprocal circuit device are improved, and the mounting strength of the non-reciprocal circuit device is improved. Most of the thermal stress and mechanical stress are applied to the joint between the metal case and the mounting board, and the stress applied to the joint between the input / output terminal electrode and the mounting board is reduced. The connection reliability of the electrodes is also improved.
[0016]
Further, the dielectric substrate may be a ceramic substrate or a ceramic multilayer substrate. By using ceramics, a desired matching force with a high Q can be obtained. Further, by incorporating the wiring in the ceramic substrate, the number of components can be reduced, the reliability can be increased, and the cost can be reduced.
[0017]
Preferably, the external connection terminal electrode is plated with Ni or Au. Although Ag is usually used for the electrode, Ni plating is optimally applied as a barrier layer to prevent solder erosion, and the Au plating improves solder wettability.
[0018]
Further, in the non-reciprocal circuit device according to the present invention, the external connection terminal electrode can be formed by a filling electrode provided in the constraining layer. Thus, the dielectric substrate having the somewhat protruding external connection terminal electrodes can be fired in a plate-like form, and an external connection terminal electrode having little dimensional distortion and good dimensional accuracy can be obtained at low cost. be able to.
[0019]
In addition, the communication device according to the present invention includes the above-described non-reciprocal circuit device, and thus has good electrical characteristics and low manufacturing cost.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a nonreciprocal circuit device and a communication device according to the present invention will be described with reference to the accompanying drawings. In each embodiment, the same components and the same portions are denoted by the same reference numerals, and duplicate description will be omitted.
[0021]
(1st Embodiment, FIGS. 1-10)
FIG. 1 is an exploded perspective view of a first embodiment of a non-reciprocal circuit device according to the present invention. This non-reciprocal circuit device 1 is a lumped constant type isolator. As shown in FIG. 1, the lumped-constant isolator 1 generally includes a metal case including a metal upper case (upper yoke) 4 and a metal lower case (lower yoke) 8, a permanent magnet 9, and a ferrite 20. And a center electrode assembly 13 including a center electrode 21, 22, 23, and a resistance element R and matching capacitor elements C1, C2, C3 (see FIG. 4). Terminal electrodes 14, 15, 16 protrude. And a flat multi-layer substrate 30.
[0022]
The metal upper case 4 has a substantially box shape and includes an upper portion 4a and four side portions 4b. The lower metal case 8 includes left and right sides 8b and a bottom 8a. At the bottom 8a of the metal lower case 8, a notch 8c for avoiding connection with terminal electrodes 14 and 15 of the multilayer substrate 30 described later and a notch 8d for positioning the ground terminal electrode 16 are provided. Have been. The upper metal case 4 and the lower metal case 8 are formed of a ferromagnetic material such as soft iron, for example, to form a magnetic circuit, and the surfaces thereof are plated with Ag or Cu.
[0023]
The permanent magnet 9 has a substantially flat rectangular parallelepiped shape. This permanent magnet 9 may be pre-magnetized into the isolator 1 or may be non-magnetized into the isolator 1 and then magnetized.
[0024]
In the center electrode assembly 13, three center electrodes 21, 22, and 23 are arranged on the upper surface 20a of the rectangular-shaped microwave ferrite 20 so as to intersect approximately every 120 ° with an insulating layer 25 interposed therebetween. In the first embodiment, the center electrodes 21, 22, and 23 are composed of two lines. The order in which the center electrodes 21, 22, 23 are arranged is arbitrary, but in the first embodiment, the center electrode 23, the insulating layer 25, the center electrode 22, the insulating layer 25, and the center electrode 21 are arranged on the upper surface 20a in this order. . As shown in FIG. 2, one end of each of the center electrodes 21, 22, 23 is connected to a cold-side electrode 24 formed on the lower surface 20b of the ferrite 20 via a side surface 20c of the ferrite 20, and the other end is connected. It is connected to hot-side electrodes 21a, 22a, and 23a formed on the lower surface 20b via the side surface 20c.
[0025]
As the material of the center electrodes 21, 22, 23, the cold side electrode 24, and the hot side electrodes 21a, 22a, 23a, a photosensitive conductive paste material containing Ag or Cu as a main component is employed.
[0026]
The port electrodes P1, P2, P3 and the cold electrode 31 are exposed on the upper surface 30a of the multilayer substrate 30. As shown in FIG. 3, on the lower surface 30 b of the multilayer substrate 30, the input terminal electrode 14, the output terminal electrode 15, and the ground terminal electrode 16 for electrically connecting the isolator 1 to an external circuit have protrusions on opposite sides. It is formed in a shape. The thickness T2 of the protrusion (the amount of protrusion of the terminal electrodes 14, 15, 16 from the lower surface 30b) T2 is smaller than the thickness T1 of the lower metal case 8 (see FIG. 1). The effect of T1> T2 will be described later.
[0027]
A metal case connection ground electrode 19 for connecting to the bottom 8a of the lower metal case 8 is provided on substantially the entire lower surface 30b of the multilayer substrate 30 except for the vicinity of the input terminal electrode 14 and the output terminal electrode 15. I have. As shown in FIG. 4, the multilayer substrate 30 incorporates matching capacitor elements C1, C2, C3 including hot-side capacitor electrodes 71, 72, 73 and a cold-side capacitor electrode 74, and a resistance element R. The multilayer substrate 30 is an LTCC (Low Temperature Cofired Ceramic) multilayer substrate.
[0028]
The multilayer substrate 30 is manufactured, for example, as follows. As shown in FIGS. 4 to 6, the multilayer substrate 30 has an unsintered sheet 40 used as a constraining layer and an unsintered sheet provided with through holes 14g to 14i, 15g to 15i, and 16g to 16i used as a constraining layer. Binding sheet 51, green sheets 41 to 45 provided with electrodes P1, P2, P3, 17, 31, 71 to 74, through holes 14a to 14e, 15a to 15e, 16a to 16e, 18 and the like, and a metal case It is formed by laminating a transfer sheet 50 for transferring the connection ground electrode 19 to the lower surface 30b (in other words, the green sheet 45) of the multilayer substrate 30. Here, the sheets 40, 50, and 51 are sheets that are not sintered at the sintering temperature of the green sheets 41 to 45.
[0029]
The green sheets 41 to 45 are formed by adding a solvent, a binder, and a plasticizer to a mixed powder of a ceramic substrate material (glassy material: about 60% by weight, alumina: about 40% by weight) and kneading to form a slurry. It was manufactured using the doctor blade method.
[0030]
The unsintered sheets 40 and 51 are produced by mixing alumina powder with a binder to form a paste and using a conventional doctor blade method. The transfer sheet 50 is prepared by adding a solvent, a binder, and a plasticizer to alumina powder, kneading the slurry, forming a slurry, and using a conventional doctor blade method. Here, the unsintered sheets 40 and 51 and the transfer sheet 50 are mainly made of a material having a melting point higher than that of the green sheets 41 to 45, so that the green sheets 41 to 45 in the in-plane direction at the time of firing are used. It is used to prevent compression and obtain a highly accurate multilayer substrate 30.
[0031]
Next, as shown in FIG. 4, through holes 14a to 14i for input terminal electrodes necessary for connecting the respective sheets to the green sheets 41 to 45, the transfer sheet 50, and the unsintered sheet 51, and output terminals. The electrode through holes 15a to 15i, the ground terminal electrode through holes 16a to 16i, and the communication through hole 18 are provided. Then, the port electrodes P1, P2, and P3, the cold electrode 31, the capacitor electrodes 71 to 74, and the circuit electrode 17 are provided on the green sheets 41 to 45 and the transfer sheet 50. The electrodes P1, P2, P3, 17, 31, 71 to 74 are formed on the surfaces of the green sheets 41 to 45 and the transfer sheet 50 by a method such as screen printing, sputtering, vapor deposition, bonding, or plating. I have. Further, the green sheet 42 is provided with a thick-film resistance element R such as a cermet-based, carbon-based, or ruthenium-based resistor. Ag, Pd, Cu, Au, Ag-Pd or the like is adopted as a material of the electrodes P1, P2, P3, 17, 31, 71 to 74.
[0032]
As can be seen from FIG. 4, the through holes 14a to 14i, 15a to 15i, 16a to 16i, 18, the electrodes P1, P2, P3, 17, 31, 71 to 74, and the resistance element R are provided inside the multilayer substrate 30. Construct an electric circuit. More specifically, matching capacitor elements C1, C2, and C3 each including the hot-side capacitor electrodes 71, 72, and 73 and the cold-side capacitor electrode 74 are configured. The through holes 14a to 14i for the input terminal electrodes, the through holes 15a to 15i for the output terminal electrodes, and the through holes 16a to 16i for the ground terminal electrodes provided on the sheets 41 to 45, 50, and 51 are laminated and thermocompression-bonded. , An input terminal electrode 14, an output terminal electrode 15, and a ground terminal electrode 16, respectively.
[0033]
Next, as shown in FIG. 5, two unsintered sheets 40, green sheets 41 to 45, a transfer sheet 50, and three unsintered sheets 51 are laminated in this order and thermocompression-bonded. At this time, the unsintered sheet 40, the transfer sheet 50, and the unsintered sheet 51 shown in FIG. 5 become the constraining layers 40a, 50a as shown in FIG. Similarly, the through holes 14a to 14i for the input terminal electrodes, the through holes 15a to 15i for the output terminal electrodes, and the through holes 16a to 16i for the ground terminal electrodes of the sheets 41 to 45, 50, 51 shown in FIG. As shown, they are integrated into a columnar input terminal electrode 14, an output terminal electrode 15, and a ground terminal electrode 16, respectively. Thus, a laminate 70 is obtained. The thermocompression bonding conditions are a temperature of 80 ° C., a pressure of 100 MPa, and a thermocompression bonding time of 1 minute.
[0034]
In the laminate 70, the substantially rectangular parallelepiped multilayer substrate 30 is sandwiched between the constraining layers 40a and 50a. The communication through hole 18 and the capacitor electrode 73 are connected by thermocompression bonding, and an electric circuit is formed inside the multilayer substrate 30 (see FIG. 10). The metal case connection ground electrode 19 formed on the transfer sheet 50 is transferred to the lower surface 30 b of the multilayer substrate 30.
[0035]
Next, leaving the input terminal electrode 14, the output terminal electrode 15, and the ground terminal electrode 16, the constraining layers 40a, 50a of the laminated body 70 are peeled and removed with a brush or the like to remove the multilayer substrate 30 shown in FIGS. obtain. This LTCC (low-temperature sintering substrate) is fired before the constraining layer is removed.
[0036]
The portion from which the constraining layer 50a formed so as to fill the space between the terminal electrodes 14, 15, 16 is removed serves as an insertion portion of the bottom 8a as described later. To prevent solder erosion and improve solderability, the terminal electrodes 14, 15, 16 are plated with Ni, Au, or the like. The thickness of the Ni plating is preferably 1 to 10 μm, and the thickness of the Au plating is preferably 1 μm or less.
[0037]
The above components are assembled as follows. These components are assembled using solder or adhesive. That is, as shown in FIG. 1, the permanent magnet 9 is fixed by the adhesive 60 applied to the lower surface of the upper part 4a of the metal upper case 4. The center electrode assembly 13 and the multilayer board 30 are electrically connected to the cold electrode 31 and the solder 61 provided on the port electrodes P1, P2, and P3. Further, the center electrode assembly 13 and the multilayer substrate 30 are preferably fixed with an adhesive by underfill or the like. This is because the mechanical strength of the isolator 1 is further improved.
[0038]
The metal case connection ground electrode 19 provided on the lower surface 30 b of the multilayer substrate 30 is electrically connected to the bottom 8 a of the metal lower case 8 by solder 61. At this time, since the metal case connecting earth electrode 19 is provided on substantially the entire bottom surface 8a of the metal lower case 8, the metal case connecting earth electrode 19 and the metal lower case 8 are sufficiently grounded. Therefore, the electrical characteristics of the isolator 1 can be improved.
[0039]
The side portion 8b of the lower metal case 8 and the side portion 4b of the upper metal case 4 are joined by soldering or the like to form a metal case, which also functions as a yoke. That is, the metal case forms a magnetic path surrounding the permanent magnet 9, the center electrode assembly 13, and the multilayer substrate 30. The permanent magnet 9 applies a DC magnetic field to the ferrite 20.
[0040]
Thus, the isolator 1 shown in FIG. 7 is obtained. FIG. 10 is an electrical equivalent circuit diagram of the isolator 1. As can be seen from FIGS. 6 and 10, the matching capacitor element C3 including the capacitor electrodes 73 and 74 and the resistance element R connect the port electrode P3 and the ground terminal electrode 16 in parallel.
[0041]
The above-described isolator 1 does not require the external connection terminal component 205 of the conventional isolator 200 (see FIG. 14), so that the component cost of the isolator 1 can be reduced. In addition, since it is not necessary to form a large hole or a groove in the center of the upper surface 30a and the lower surface 30b of the multilayer substrate 30 and it is possible to fire in a flat plate state, the multilayer substrate 30 having almost no warpage or deformation can be obtained with high dimensional accuracy. Can be manufactured. Therefore, the isolator 1 which is inexpensive and has excellent electrical characteristics can be obtained.
[0042]
As shown in FIG. 8, the thickness T2 of the terminal electrode 14 (the same applies to the terminal electrodes 15 and 16), that is, the amount of protrusion of the terminal electrodes 14, 15, and 16 from the lower surface 30b of the multilayer substrate 30 is made of metal. It is smaller than the thickness T1 of the bottom 8a of the lower case 8. In other words, the bottom surfaces of the terminal electrodes 14, 15, 16 are located inside the lowermost surface of the lower case 8. The thickness T1 is about 0.15 to 0.30 mm, and the thickness T2 is about 0.1 to 0.25 mm.
[0043]
As described above, since the bottom surfaces of the terminal electrodes 14, 15, 16 are located inside the lowermost surface of the lower case 8, an external force acts from above when the isolator 1 is mounted on the mounting substrate. In addition, the external force is reduced by the difference T3 between the thicknesses T1 and T2, so that unnecessary stress does not act on the multilayer substrate 30, and the occurrence of cracks and cracks in the multilayer substrate 30 is prevented.
[0044]
Specifically, as shown in FIG. 9, when the surface of the upper case 4 of the isolator 1 is suction-held by the mounter nozzle 100 and mounted on a substrate 110 such as a mobile phone, the terminal electrodes 14, 15, and 16 are connected to the substrate 110. A stress is generated in the multilayer substrate 30 by the pressing force from the mounter nozzle 100 when it comes into contact with the cream solder 111 provided thereon. In this case, the external force is reduced by the difference (retreat amount) T3 between the thicknesses T1 and T2.
[0045]
Here, as the cream solder 111, a lead-free solder containing flux (for example, a solder having a composition of Sn: 96.5%, Ag: 3%, Cu: 0.5%) is used. Sn may contain at least one of Ag, Cu, Zn, Bi, and In.
[0046]
The difference T3 between the thicknesses T1 and T2, that is, the vertical distance between the bottom surfaces of the terminal electrodes 14, 15, 16 and the lowermost surface of the lower case 8 is not less than the particle size of the cream solder 111 and not more than 100 μm. Is preferred. This is to prevent damage to the multilayer substrate 30 and ensure the reliability of soldering. Incidentally, this type of cream solder has a granular shape of about 10 to 50 μm.
[0047]
In addition to the above-described soldering, there is a possibility that an external force may act on the terminal electrodes 14, 15, 16 during the manufacturing process of the isolator 1 or during the transportation of the product. However, since the terminal electrodes 14, 15, and 16 are retracted by T3 inside, a large stress is prevented from acting on the multilayer substrate 30.
[0048]
(Refer to the second embodiment, FIGS. 11 and 12)
In the isolator 2 according to the second embodiment, as shown in FIGS. 11 and 12, the external connection terminal electrodes protruding from the multilayer substrate 30 are the input terminal electrode 14 and the output terminal electrode 15, and the lower surface 30b of the multilayer substrate 30 Is connected to the bottom 8a of the metal lower case 8 by soldering or conductive paste.
[0049]
Further, a frame member 7 made of resin is provided. The frame member 7 is provided on the multilayer substrate 30, accommodates the center electrode assembly 13 and the permanent magnet 9, and is sandwiched between metal cases 4 and 8. The metal cases 4 and 8 have slightly different shapes from those of the first embodiment shown in FIG. 1, but have the same function.
[0050]
In the second embodiment, the ground electrode 19 is soldered to the mounting board via the lower case 8. Since the lower case 8 and the mounting board are joined to each other with a wide area by soldering, the electrical characteristics of the isolator 2 are improved and the mounting strength is improved. Most of the thermal stress and mechanical stress act on the joint between the lower case 8 and the mounting board, and the stress acting on the joint between the terminal electrodes 14 and 15 and the mounting board is reduced. The connection reliability of the terminal electrode is also improved. In addition, since only the two terminal electrodes 14 and 15 protrude, the non-defective rate in manufacturing is improved, and the cost can be reduced.
[0051]
In the second embodiment, the method of manufacturing the multilayer substrate 30 is the same as in the first embodiment. Other functions and effects are the same as those in the first embodiment.
[0052]
(Third embodiment, see FIG. 13)
In the third embodiment, a mobile phone will be described as an example of the communication device according to the present invention.
[0053]
FIG. 13 shows an electric circuit of the RF portion of the mobile phone 120. In FIG. 13, reference numeral 122 denotes an antenna element, 123 denotes a duplexer, 131 denotes a transmission-side isolator, 132 denotes a transmission-side amplifier, 133 denotes a transmission-side interstage bandpass filter, and 134 denotes a transmission-side mixer. Reference numeral 135 denotes a reception-side amplifier, 136 denotes a reception-side interstage bandpass filter, 137 denotes a reception-side mixer, 138 denotes a voltage controlled oscillator (VCO), and 139 denotes a local bandpass filter.
[0054]
Here, the lumped-constant isolator 1 or 2 of the first embodiment or the second embodiment can be used as the transmission-side isolator 131. By mounting the isolator 1 or 2, a mobile phone that is inexpensive and has improved electrical characteristics can be realized.
[0055]
(Other embodiments)
The non-reciprocal circuit device and the communication device according to the present invention are not limited to the above-described embodiment, but can be changed to various configurations within the scope of the gist.
[0056]
For example, details of components such as the metal upper case 4, the frame member 7, the metal lower case 8, the center electrode assembly 13, the multilayer substrate 30, the ferrite 20, and the like, which are components of the isolators 1 and 2 shown in the above embodiment. The structure is arbitrary.
[0057]
In particular, in the above embodiment, the assembly 13 in which the center electrode is formed and the multilayer substrate 30 in which the matching capacitance electrode and the like are combined are combined, and the multilayer substrate 30 in which the external connection terminal electrodes 14, 15, 16 are formed. Although shown, other structures include a structure in which an external connection terminal electrode is formed on a multilayer substrate on which a center electrode is formed, or a structure in which an external connection terminal electrode is formed on a multilayer substrate on which a center electrode and a matching capacitance electrode are formed. The structure may be modified.
[0058]
Further, in the above-described embodiment, the bottom retreat amount T3 of the terminal electrodes 14, 15, 16 has been described in comparison with the lowermost surface of the metal lower case 8, but the bottom of the non-reciprocal circuit element has a portion other than the case 8. In some cases, a resin molded part, a ceramic base, or the like may be arranged, and the bottom surface of the external connection terminal electrode may be located inside the lowermost surfaces of these element components.
[0059]
The center electrodes 21, 22, 23, etc. of the center electrode assembly 13 shown in the above-described embodiment are formed using a photosensitive conductive paste material, but are not limited thereto. A central conductor integrally formed by punching or etching a thin metal plate made of, may be wound around the ferrite 20. The center conductor has three center electrodes extending radially from the ground electrode plate. The ground electrode plate is arranged on the lower surface 20b of the ferrite 20, and the three center electrodes are connected to the upper surface 20a of the ferrite 20 so as to surround the ferrite 20. And an insulating sheet interposed therebetween. In the center electrode assembly thus obtained, the ends of the three center electrodes are electrically connected to the port electrodes P1, P2, and P3 of the multilayer substrate 30, and the ground electrode plate is connected to the cold electrode 31.
[0060]
In addition, although the isolators 1 and 2 shown in the above embodiment have been described as being of the three-port type, the present invention is not limited to this, and may be a two-port type isolator. In addition, although the intersection angle between the center electrodes 21, 22, and 23 of the three-port type isolators 1 and 2 has been described as approximately 120 °, the present invention is not limited to this. In the case of a three-port type isolator, for example, it is set in the range of 90 ° to 150 °. In the case of a two-port type isolator, for example, it is set in the range of 60 ° to 120 ° (the representative intersection angle is approximately 90 °).
[0061]
In addition, the metal case of the isolators 1 and 2 is composed of two of the metal upper case 4 and the metal lower case 8, but is not limited thereto, and is divided into three or more. Is also good. Further, the ferrite 20 is not limited to a rectangular shape, but may be another shape such as a circle or a hexagon. Further, the shape of the permanent magnet 9 may be, for example, a circular shape, a triangular shape with rounded corners, or the like, in addition to the rectangular shape.
[0062]
Further, in the isolators 1 and 2, a terminal electrically connected to the port electrode P3 is newly provided in addition to the terminal electrode 14, the terminal electrode 15, and the terminal electrode 16 shown in FIG. By omitting it, a circulator may be used. Further, the present invention can be applied to various non-reciprocal circuit devices in addition to the isolator and the circulator.
[0063]
In the above-described embodiment, the center electrodes 21, 22, and 23 are configured by two lines. However, the present invention is not limited to this, and the number of lines of the center electrodes 21, 22, 23 may be one or three or more. The number of lines of the center electrodes 21, 22, 23 does not need to be the same, and may be different from each other.
[0064]
In the above embodiment, the horizontal cross-sectional shapes of the through holes 14a to 14i, 15a to 15i, 16a to 16i, and 18 have been illustrated and described as being rectangular. However, the present invention is not limited to this. It may be shaped.
[0065]
In the third embodiment, a mobile phone is described as an example of a communication device. However, the present invention is not limited to this, and can be applied to other communication devices.
[0066]
【The invention's effect】
As is clear from the above description, according to the present invention, since the external connection terminal electrodes are provided on the dielectric substrate, the number of components can be reduced, and the dielectric substrate is flat. Therefore, deformation during firing, such as warpage and distortion, is suppressed, and dimensional accuracy is improved. Furthermore, since the bottom surface of the external connection terminal electrode is located inside the lowermost surface of the element component other than the terminal electrode, external force acting on the dielectric substrate is reduced, and damage to the dielectric substrate is prevented. Can be. Therefore, an inexpensive non-reciprocal circuit device and a communication device having good characteristics can be obtained.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a first embodiment of a nonreciprocal circuit device according to the present invention.
FIG. 2 is a perspective view of the center electrode assembly shown in FIG. 1;
FIG. 3 is a perspective view of the multilayer substrate shown in FIG. 1;
FIG. 4 is an exploded perspective view for explaining a method of manufacturing the multilayer substrate shown in FIG.
FIG. 5 is a vertical sectional view for explaining the method of manufacturing the multilayer substrate following FIG. 4;
FIG. 6 is a vertical sectional view for explaining the method of manufacturing the multilayer substrate following FIG. 5;
7 is a perspective view of the non-reciprocal circuit device shown in FIG. 1 after assembly is completed.
FIG. 8 is a sectional view showing a main part of the non-reciprocal circuit device shown in FIG. 7;
9A and 9B are cross-sectional views illustrating mounting of the non-reciprocal circuit device shown in FIG. 7 on a substrate. FIG. 9A shows a state before mounting, and FIG. 9B shows a state after mounting.
10 is an electrical equivalent circuit diagram of the non-reciprocal circuit device shown in FIG.
FIG. 11 is an exploded perspective view showing a second embodiment of the nonreciprocal circuit device according to the present invention.
FIG. 12 is a perspective view of the multilayer substrate shown in FIG. 11;
FIG. 13 is an electric circuit block diagram of a communication device according to the present invention.
FIG. 14 is an exploded perspective view showing a first example of a conventional nonreciprocal circuit device.
FIG. 15 is an exploded perspective view showing a second example of a conventional nonreciprocal circuit device.
[Explanation of symbols]
1, 2 ... Lumped constant type isolator (non-reciprocal circuit device)
4: Metal upper case (upper yoke)
8 Metal lower case (lower yoke)
9 ... permanent magnet
13 ... Center electrode assembly
14. Input terminal electrode (terminal electrode for external connection)
15 Output terminal electrode (terminal electrode for external connection)
16 ... Earth terminal electrode (terminal electrode for external connection)
19… Earth electrode
20 ... Microwave ferrite
21, 22, 23 ... center electrode
30 Multilayer substrate
120: Mobile phone (communication device)
C1, C2, C3 ... matching capacitor element
T1: Thickness of metal lower case
T2: Projection amount of terminal electrode
T3: Evacuation amount

Claims (8)

A permanent magnet,
A center electrode assembly including a ferrite to which a DC magnetic field is applied by the permanent magnet, and including a plurality of center electrodes,
A flat dielectric substrate having a built-in matching capacitor element connected to the center electrode,
A metal case surrounding the permanent magnet, the center electrode assembly, and the dielectric substrate,
A plurality of external connection terminal electrodes protruding toward the mounting surface are provided on the bottom surface of the dielectric substrate, and the bottom surface of the external connection terminal electrode is located inside the lowermost surface of the element component other than the terminal electrode. That
Non-reciprocal circuit device characterized by the above. The non-reciprocal circuit device according to claim 1, wherein the device components other than the terminal electrodes are metal cases. The vertical distance between the bottom surface of the external connection terminal electrode and the lowermost surface of an element component or a metal case other than the terminal electrode is not less than the particle size of the mounting solder and not more than 100 μm. Or the non-reciprocal circuit device according to claim 2. The said external connection terminal electrode is an input terminal electrode and an output terminal electrode, The earth electrode provided in the bottom surface of the said dielectric substrate is joined to the said metal case, The Claim 1 characterized by the above-mentioned. The non-reciprocal circuit device according to claim 3. The non-reciprocal circuit device according to claim 1, wherein the dielectric substrate is a ceramic substrate or a ceramic multilayer substrate. The non-reciprocal circuit device according to claim 1, wherein the external connection terminal electrode is plated with Ni or Au. The said external connection terminal electrode is formed by the filling electrode provided in the constraining layer, The Claim 1, Claim 2, Claim 3, Claim 4, Claim 5, or Claim 6 characterized by the above-mentioned. The non-reciprocal circuit element according to claim 1. A communication device comprising the non-reciprocal circuit device according to claim 1, claim 2, claim 3, claim 4, claim 5, claim 6, or claim 7.

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