JP2004319604A - Method of manufacturing chip component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing chip component by which a chip component that can cope with both-face mounting, a chip component in which the projection of a functional material between electrodes is small, etc., can be manufactured inexpensively. <P>SOLUTION: In the method of manufacturing the chip component, a ceramic green sheet 101 is prepared, and an insulating substrate 100 having projecting sections 104 and recessed sections 103a corresponding to chip divisions is manufactured by screen-printing a projecting pattern 102 having openings 103 corresponding to the chip divisions on the green sheet 101 and baking the green sheet 101. Then the device patterns corresponding to the chip divisions are formed on the recessed sections 103a and projecting sections 104 in the circumferences of the sections 103a of the insulating substrate 100. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a chip component, and more particularly to a method for manufacturing a chip component suitable for manufacturing a chip component such as a double-sided mounted chip resistor or a thermistor element.
[0002]
[Prior art]
A conventional general chip resistor has thick film electrodes at both ends of the surface of an insulating substrate made of alumina or the like, and a thick film resistor is arranged between the electrodes. The resistor is covered and protected by a protective film made of a glass insulating film and a resin insulating film. Plating electrodes are formed on the front and rear electrodes, which are both ends of the insulating substrate, and the end electrodes on the longitudinal end surfaces. In this case, the height of the protective film at the center of the substrate is generally higher than the height of the plating electrode. For example, in many cases, a level difference of about 30 to 50 μm occurs between the surface of the plating electrode and the surface of the protective film on the surface of the insulating substrate.
[0003]
By the way, conventional chip resistors are often shipped one by one on a tape at the time of shipment from a factory in a form of so-called taping in which the surface on which the resistor exists is fixed as a surface. When mounted on a circuit board, it is fixed to the circuit board by a mounting machine (mounter) as it is, that is, with the surface on which the resistor exists (the protective film side) as the surface. In this case, the back side electrode of the insulating substrate is in close contact with the land portion of the circuit board, and fixing is performed by solder reflow or the like.
[0004]
On the other hand, as a mounting method, there is a so-called bulk mounting in which a large number of chip components are randomly stored in a bulk cassette, and the chip components are taken out of the bulk cassette one by one and mounted on a circuit board. According to such a mounting method, when mounting the chip component on the circuit board, the surface mounting of the chip component is performed without selecting the front and back of the chip component.
[0005]
However, when a conventional chip resistor is bulk-mounted by a bulk mounting machine, about 50% of the cases are mounted face-down such that the front side (protective film side) of the chip resistor faces the circuit board. Occurs with a probability of At this time, there is a strong possibility that the chip resistor is mounted at an angle, and in the worst case, there is a problem that one side cannot be soldered or a chip stands up. Therefore, there is a problem that the conventional chip resistor having a general structure cannot cope with so-called bulk mounting.
[0006]
In order to solve this problem, the applicant of the present application has arranged a concave portion formed gently in the center with respect to both ends of each chip section on the surface of the insulating substrate, and arranged from both ends of the substrate surface to a part of the concave portion. A pair of electrodes, a resistor connected to the electrode in the recess and disposed between the pair of electrodes, a protective film disposed in the recess to cover the resistor, and both ends of the back surface of the substrate A pair of electrodes arranged in the portion, an end face electrode conducting to the electrodes, and a plating electrode arranged on these electrodes, wherein the height of the surface of the plating electrode is higher than the height of the surface of the protective film Has proposed a chip resistor (see Patent Document 1).
[0007]
To prepare an insulating substrate having such a concave portion, it is conceivable to form a plurality of linear concave grooves in parallel on one surface side of a flat ceramic substrate. By cutting this into a chip shape, a plurality of pieces can be obtained. Such a groove needs to be produced by repeating the relative movement between the grinding blade and the porcelain substrate while grinding one surface side of the ceramic substrate by rotating and driving a rotary grinding blade such as a diamond grindstone. . In addition, as for the chip resistor, after forming the concave groove, a resistor, an electrode, and the like are arranged and cut into a chip shape (for example, see Patent Document 2).
[0008]
[Patent Document 1]
JP-A-2002-343601
[Patent Document 2]
JP-A-10-135014
[0009]
[Problems to be solved by the invention]
However, in such a conventional chip component, if the concave portion (concave groove) is formed by grinding with a rotary grinding blade, the strength of the groove portion decreases, and the groove is used as a starting point during the process. There is a possibility that the substrate cracking may occur. In particular, when forming a break groove for dividing into chip shapes, without breaking at the break groove, there is a possibility of breaking at the concave groove portion, it is not suitable for substrate division by pressing the roller. There's a problem. Because of this problem, in the related art described in the above-mentioned Document 2, the cutting blade is divided into a chip shape by linearly moving the cutting blade in the X and Y directions.
[0010]
The present invention has been made in view of the above-described circumstances, and a so-called bulk mounting method in which an insulating substrate having a concave portion corresponding to each chip section is manufactured by an easy and simple process and the front and back of the component is not selected. It is an object of the present invention to provide a method of manufacturing a chip component capable of inexpensively manufacturing a chip component capable of coping with the problem and a chip component having a small projection of a functional material between electrodes.
[0011]
[Means for Solving the Problems]
In order to solve the above problems, a method for manufacturing a chip component according to the present invention includes preparing a ceramic green sheet, screen-printing a convex pattern having an opening corresponding to each chip section on the green sheet, and printing the green sheet. Baking to produce an insulating substrate having a convex portion and a concave portion corresponding to each chip section, and forming the device pattern corresponding to each chip section on the concave section and the peripheral convex section of the insulating substrate. It is characterized by forming.
[0012]
According to the present invention, a convex pattern is screen-printed on a ceramic green sheet and fired, thereby producing an insulating substrate in which a central portion between the convex patterns is formed in a gentle concave shape (concave portion). You. For this reason, the convex shape is fired integrally with the green sheet, and the opening corresponding to each chip section is formed in a concave shape. Accordingly, the strength of the insulating substrate is not reduced, the occurrence of substrate cracking can be avoided, and the work for dividing into chip shapes can be performed with either the break groove or the cutting blade.
[0013]
In the present invention, it is preferable that each material of the ceramic green sheet and the convex pattern is mainly composed of the same ceramic powder as a main component, and a grid-like convex pattern is formed on the green sheet. The green sheet is preferably formed by screen printing, and a convex pattern is preferably screen-printed so as to leave the peripheral portion of the green sheet.
[0014]
By forming a device pattern corresponding to each chip section on the concave portion of the insulating substrate and the convex portion around the concave portion, a chip resistor that can be mounted on both sides and a thermistor chip having a large thermistor film thickness can be simplified. And it can be manufactured at low cost.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In each of the drawings, members or elements having the same function are denoted by the same reference numerals, and redundant description will be omitted.
[0016]
A method for manufacturing a chip resistor according to the present invention will be described with reference to FIGS. First, as shown in FIG. 1A, a flat ceramic green sheet 101 is prepared. This green sheet is made of powdered alumina (Al ₂ O ₃ ), MgO, CaO, SiO ₂ A raw material powder is prepared by using a clay mineral and talc so as to have an inorganic composition of 96% by weight of alumina and 4% by weight of other components. An appropriate amount of a binder, a solvent, a plasticizer, and a dispersant are added thereto and mixed to obtain a slurry (slurry). The slurry is formed into a sheet by a doctor blade method or the like, and a flat green sheet 101 is prepared and prepared (green sheet preparing step).
[0017]
Next, as shown in FIG. 1B, a lattice-shaped convex pattern 102 is formed on the green sheet 101 so that the peripheral portion 101a of the prepared green sheet 101 is left as a grip portion of a jig in a later step. Screen print. The convex pattern 102 has an opening 103 corresponding to each chip section for each lattice. Thereafter, the insulating substrate 100 is manufactured by firing the green sheet 101 and the convex pattern 102 together. At this time, the opening 103 corresponding to each chip section becomes a concave part, and a lattice-like convex part 104 is formed around the concave part. It should be noted that preparing the same or familiar ceramic powder of the same quality as a main component as the material of each of the green sheet 101 and the convex pattern 102 is necessary to secure the integration between the insulating substrate and the convex pattern. preferable.
[0018]
Specifically, powdered alumina, MgO, CaO, SiO ₂ A raw material powder is prepared by using a clay mineral and talc so as to have an inorganic composition of 96% by weight of alumina and 4% by weight of other components. A paste is obtained by adding and mixing a binder and a solvent thereto. As the binder, a polymer which is easily thermally decomposed and has a high viscosity when dissolved in a solvent is preferable, and ethyl cellulose, acryl, polyvinyl butyral and the like are used. As the solvent, those having a high boiling point are preferable, and terpineol, butyl carbitol, ethyl carbitol and the like are used. Here, polyvinyl butyral and terpineol are mixed, heated and stirred to dissolve. Thereafter, the raw material powder was weighed so that the weight ratio of the raw material was 71, the binder was 4, and the solvent was 25, and the mixture was kneaded a plurality of times with three rollers. An alumina paste is obtained (a process for producing an alumina paste).
[0019]
Then, a lattice-like convex pattern 102 is formed on the prepared green sheet 101 by screen printing using the alumina paste. After drying the convex pattern 102, as shown in FIG. 1C, a lattice-shaped substrate dividing slit (break groove) 105 is formed at the center of the convex portion 104 by embossing. The slit 105 was formed so as to be deeper than the thickness of the convex portion 104 of the convex pattern 102 so as to reach the green sheet 101. After that, the green sheet 101 and the convex pattern 102 are fired at 1300 ° C. to 1600 ° C. to manufacture an insulating substrate (a ceramic substrate having unevenness) 100 (an insulating substrate manufacturing process).
[0020]
Thus, an insulating (before division) substrate 100 having a convex pattern 102 composed of a concave portion 103 having a gentle side surface and a convex portion 104 corresponding to each chip section is manufactured. For example, when the depth of the concave portion 103 (the height of the convex portion 104) is about 60 μm, since the green sheet 101 and the convex pattern 102 use the same raw material, the heat shrinkage is also substantially the same. As a result, an integrated sintered body having good adhesion was obtained. That is, unlike the prior art, the substrate strength is not reduced unlike the case of grinding from a flat plate shape with a rotary grinding blade. In other words, the insulating substrate 100 does not need to change the jig by thickening the substrate itself to compensate for the insufficient strength of the substrate, and presses the roller in a later dividing step to form the slit formed in the convex pattern 102. At 105, a large number of pieces can be obtained by dividing into chip sections.
[0021]
In addition, it is preferable that the depth of the concave portion 103 of the insulating substrate 100 be approximately 50 μm to 70 μm. Needless to say, the chip may be cut (diced) and separated into chip sections without forming the slit 105. Here, reference numeral 106 in FIG. 1B is a mark indicating the direction of the insulating substrate 100, and can be used as an index when the peripheral portion 101a is gripped in a later step.
[0022]
Next, as shown in FIG. 2A, a resistor 15 having a thickness of about 10 μm to 15 μm is formed on the bottom surface 103 a of the concave portion 103 of the insulating substrate 100 by screen printing and baking a resistor paste. As the resistor 15, it is preferable to use a ruthenium oxide-based paste, for example, firing at a temperature of about 850 ° C. (a resistor forming step).
[0023]
Next, as shown in FIG. 2B, an electrode pattern 13 having a thickness of about 10 μm to 15 μm is formed so as to cover the convex portion 104 and electrically connect to the resistor 15 in the concave portion 103. The electrode pattern 13 is formed by screen-printing an Ag or Ag-Pd paste, and is formed, for example, by firing at a temperature of about 850 ° C. (first electrode forming step). Similarly, the back electrode pattern 19 is formed by arranging Ag or Ag-Pd paste by screen printing and baking (second electrode forming step). Either of the front electrode pattern 13 and the rear electrode pattern 19 may be formed by screen printing first, but it is preferable that firing be performed simultaneously.
[0024]
At this time, since the insulating substrate 100 forms the convex pattern 102 by screen printing instead of the rotary grinding blade, the convex portion 104 is rounded as shown in FIG. . This prevents the shape from being broken due to chipping, and furthermore, the slope 104a of the convex portion 104 from the bottom surface 103a of the concave portion 103 smoothly continues with a curved surface having a large curvature. The surface from the slope 104a to the upper surface 104b is smoothly continuous with a curved surface having a large curvature. As a result, as in the case where the electrode is formed so as to cover the steep edge shape in the case of the conventional technology shown in FIG. 3B, the electrode is disconnected from the electrode materials 13a and 13b due to shrinkage during firing. Therefore, there is no possibility that conduction failure occurs and a large gap S is formed. Therefore, the electrode 13 having a uniform thickness can be formed on the protruding portion 104 to ensure conduction with the resistor 15.
[0025]
Next, as shown in FIG. 2C, a pattern of the first protective film 17a and a pattern of the second protective film 17b are sequentially formed on the pattern of the resistor 15 in the concave portion 103 by screen printing. First, the first protective film 17a is a glass insulating film having a thickness of about 15 μm to 20 μm, and is preferably fired at a temperature of about 600 ° C. Subsequently, if necessary, the resistance of the resistor 15 is adjusted by laser trimming or the like. Next, a second protective film 17b of a resin paste having a thickness of about 20 μm is formed on the glass insulating film 17a and is heated and cured. The second protective film 17b is made of an epoxy resin, and is preferably heated and cured at a temperature of about 200 ° C. (step of forming an insulating film). Note that the protective film 17 has been described as an example in which the glass insulating film 17a and the resin insulating film 17b are stacked, but one layer may be omitted as necessary.
[0026]
Next, as shown in FIG. 2D, a roller is pressed against the insulating substrate 100 to divide it into strips (a state extending in a direction perpendicular to the paper surface) (first substrate dividing step). Thereafter, as shown in FIG. 2E, an end face electrode 21 is formed on the exposed end face on the substrate side. The end face electrode 21 is, for example, a thin film layer of Ni / Cr applied by sputtering (third electrode forming step).
[0027]
Next, a roller is pressed against each of the chip division groups divided into strips to divide them into chip divisions (second substrate dividing step). Then, as shown in FIG. 2 (f), electrolytic plating is performed to form a plated electrode 23 on the electrodes 13, 19 and 21. A plating electrode comprising a Ni plating layer having a thickness of about 3 μm to 10 μm by electrolytic plating and a solder plating layer having a thickness of about 5 to 15 μm (or Sn plating layer) for preventing electrode cracking and improving solderability. 23 (plating step).
[0028]
In the above steps, the steps after FIG. 2A are not different from the steps of manufacturing a normal chip resistor. With such a simple process, the concave portion 12 which is surrounded by the convex portions 14 of the both end portions 11a of the insulating substrate 11 and which is gently inclined and continuous is provided. It is possible to manufacture the chip resistor 10 in which the resistor 15 and the protective film 17 which are conducted by the formed electrode 13 are embedded.
[0029]
In the chip resistor 10, the height of the convex portion 14 (depth of the concave portion 12) is about 60 μm, the electrode 13 has a thickness of 10 μm to 15 μm, and the plating electrode 23 has a thickness of 8 μm to 25 μm. And the height from the bottom surface 12a to the upper surface of the plating electrode 23 is set to 78 μm to 100 μm. On the other hand, the resistor 15 has a thickness of 10 μm to 15 μm, the protective film 17 has a thickness of 35 μm to 40 μm, and a total thickness of 45 μm to 65 μm.
[0030]
Therefore, this chip resistor 10 can be securely mounted on the circuit board even when the surface of the plated electrode 23 is higher than the surface of the protective film 17 and mounted on It can be fixed by soldering without any problem, and can be mounted on both sides for bulk. In the case of the face-up, since the electrode 19 has a thickness of 10 μm to 15 μm and the plating electrode 23 has a thickness of 8 μm to 25 μm, it goes without saying that bulk mounting can be performed.
[0031]
Here, in the above-described manufacturing process, except for preparing an insulating substrate in which the concave portion 12 is formed in the substrate 11, a normal manufacturing method of a chip component can be employed as it is, so that an increase in manufacturing cost is suppressed. At the same time, it is possible to manufacture a chip component corresponding to bulk mounting without selectivity between the front and back of the mounting surface.
[0032]
Here, as another aspect of the present embodiment, the case where the electrode 13 is formed after the resistor 15 is formed in the concave portion 103 in the present embodiment has been described. Conversely, the electrode 13 is formed in the concave portion 103 ( It goes without saying that the resistor 15 may be formed after the formation in the recess 12).
[0033]
Further, in the present embodiment, an example has been described in which electrodes are provided on the front surface and the back surface of the insulating substrate, and the chip component can be mounted face-up or face-down, but the gist of the present invention is that the electrode is provided only on the substrate surface. And so-called filletless mounting, which is mounted only face down, can be applied.
[0034]
Next, a method for manufacturing a chip thermistor according to the present invention will be described with reference to FIG.
[0035]
First, similarly to the above-described chip resistor 10, a flat green sheet 101 is prepared, and a grid-like convex pattern 102 is screen-printed thereon and fired, thereby forming concave portions corresponding to each chip section. The process for preparing the insulating (pre-split) substrate 100 with the 103 formed thereon is as shown in FIG.
[0036]
Next, as shown in FIG. 4A, a surface electrode 43 having a thickness of about 10 μm that covers an area ２ of the bottom surface 103 a of the concave portion 103 and covers the upper surface 104 b from the one side inclined surface 104 a of the convex portion 104. Form. The surface electrode 43 is formed by forming an Ag or Ag-Pd paste pattern by screen printing and baking it at a temperature of about 850 ° C., for example.
The surface electrode 43 is divided into two in the formation region of the upper surface 104b of the convex portion 104 in a dividing step described later, so that the bottom surface 103a forms the electrode 33. The rest forms a part of the other electrode 34.
[0037]
Similarly, the back electrode 19 is formed by arranging an Ag or Ag-Pd paste pattern by screen printing and baking. Either the surface electrode 43 on the front side or the electrode 19 on the back side may be patterned by screen printing first, but it is preferable that firing be performed simultaneously (steps for forming the first and second electrodes). ).
[0038]
At this time, similarly to the above-described electrode 13, the convex portion 104 of the convex pattern 102 is rounded, and between the bottom surface 103a of the concave portion 103 and the inclined surface 104a of the convex portion 104, and between the inclined surface 104a and the upper surface 104b. Is smoothly continuous with a curved surface having a large curvature. From this, it is possible to prevent the surface electrode 43 from becoming defective in conduction.
[0039]
Next, as shown in FIG. 4B, a resistor 35 having a thickness of about 40 μm is formed in the concave portion 103 of the insulating substrate 100 so as to be stacked on the surface electrode 43. This resistor 35 is made of a metal oxide powder (CO) of a functional material exhibiting thermistor characteristics. ₂ O ₃ + NiO + Mn ₂ O ₃ ), A paste material made of a glass frit and an organic vehicle is prepared and prepared by coating and laminating four times on the surface electrode 43 in the concave portion 103 by a screen printing method, and firing at 850 ° C. ( Step of forming resistor). At this time, since the paste material is applied over the concave portion 103 by screen printing at this time, the pattern shape is fixed to the shape of the concave portion 103, and the resistor 35 can be stably formed with high quality.
[0040]
Next, as shown in FIG. 4C, the area of the convex portion 104 on which the surface electrode 43 is formed is separated from the one-side slope 104 a by ２ of the area of the resistor 35, and the adjacent convex portion 104 is formed. An upper electrode 44 having a thickness of about 10 μm, which is conductively connected to the surface electrode 43 covering the upper surface 104b, is formed. The upper electrode 44 is formed by screen printing an Ag or Ag-Pd paste pattern so as to overlap a part of the resistor 35 and the surface electrode 43, and is formed by firing at a temperature of, for example, about 850 ° C. The upper electrode 44 is connected to the surface electrode 43 on the opposite side (the surface electrode 43 that does not extend to the slope 104 a), which is divided into two in the formation region of the upper surface 104 b of the convex portion 104 in a step described later. Thus, the electrode 34 is formed. In addition, the upper electrode 44 is subjected to laser tomilling, for example, by partially removing the upper electrode 44 with a laser as necessary, and the resistance value is adjusted (third electrode forming step).
[0041]
Next, as shown in FIG. 4D, a protective film 37 of a resin paste having a thickness of about 30 μm is formed on the pattern of the resistor 35 in the concave portion 103 by screen printing, and is heated and cured. The protective film 37 is an epoxy resin, and is preferably cured by heating at a temperature of about 130 ° C. (a process of forming an insulating film).
[0042]
Then, as shown in FIG. 4E, a roller is pressed against the insulating (before division) substrate 100 to divide it into strips (first division step). At this time, the surface electrode 43 is divided into two in the formation region of the upper surface 104b of the convex portion 104, and the surface electrode 43 extending to the bottom surface 103a forms the electrode 33, while the opposite surface electrode 43 and the upper electrode 44 constitutes an electrode 34.
[0043]
Next, as shown in FIG. 4F, an end electrode 21 of a thin film layer of Ni / Cr is formed on the exposed end face on the substrate side (end face on the substrate side of the chip group divided into strips) by sputtering or the like (fourth). Electrode forming step). Thereafter, a roller is pressed against the chip group divided into strips to divide the chip into respective chip sections (second dividing step). Then, as shown in FIG. 4 (g), electrolytic plating is performed to form a plating electrode 23 on the electrodes 43 (33, 34), 19, 21 (plating step).
[0044]
In this simple process, the electrode 33 formed so as to include the concave portion 12 that is gently opened and surrounded by the convex portions 14 of the both end portions 11a of the insulating substrate 11 and to cover the convex portions 14 is provided. The chip thermistor 30 in which the conductive resistor 35 disposed between the conductors 34 is buried in the recess 12 and covered with the protective film can be manufactured.
[0045]
The tip thermistor 30 has a height of 60 μm (the depth of the concave portion 12), a thickness of 10 μm for the electrodes 33 and 34, and a thickness of 8 to 25 μm for the plating electrode 23. The height from 12a to the upper surface of the plating electrode is set to 78 μm to 95 μm. On the other hand, the electrodes 33 and 34 have a total thickness of 20 μm, the resistor 35 has a thickness of 40 μm, the protective film 37 has a thickness of 30 μm, and the total thickness is 90 μm.
[0046]
Therefore, the chip thermistor 30 can suppress the height of the surface of the protective film 37 to a degree slightly higher than the surface of the plating electrode 23, and the electrodes 33 and 34, the resistor 35, and the protective film The amount of protrusion can be considerably reduced as compared with the case where 37 are stacked.
[0047]
Here, in the above-described manufacturing process, a normal chip thermistor manufacturing process can be employed as it is, except that the concave portion 12 is formed in the substrate 11 and an insulating substrate is prepared. Therefore, it is possible to manufacture a chip thermistor with a reduced protruding height while suppressing an increase in manufacturing cost.
[0048]
Here, in the above-described embodiment, the dividing slit 105 is formed so as to be deeper than the thickness of the convex portion 104 so as to reach the green sheet 101, but it is needless to say that the present invention is not limited to this. . For example, as shown in FIG. 5A, it may be inserted into the upper surface 104 b of the convex portion 104 and the lower surface of the green sheet 101. In this case, the same operation and effect as the above embodiment can be obtained. Further, as shown in FIG. 5B, the slits 105 are inserted into the upper and lower surfaces of the green sheet 101, and thereafter, the convex portions 104 of the convex pattern 102 are formed on the slits 105 on the upper surface. You may. In this case, in addition to the same functions and effects as those of the above-described embodiment, it is possible to prevent the convex portion 104 from being deformed at the time of embossing for inserting the slit 105.
[0049]
In the above-described embodiment, the case where the lattice-shaped convex pattern 102 is formed on the green sheet 101 has been described. However, a ridge-shaped convex pattern in which convex parts are arranged in parallel is formed on the green sheet and divided. It goes without saying that it may be possible to do so. Further, although examples of the chip resistor and the chip thermistor have been described as the chip components, it is needless to say that the gist of the present invention can be similarly applied to other types of chip components.
[0050]
Although one embodiment of the present invention has been described, the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention may be embodied in various forms within the scope of the technical idea.
[0051]
【The invention's effect】
According to the present invention, it is possible to manufacture an insulating substrate in which gentle concave portions are formed between the convex portions only by screen-printing and firing a convex pattern on a flat green sheet. For this reason, a resistor or the like can be embedded and an electrode connected to the resistor can be manufactured by using a normal process.
[0052]
In general, according to the present invention, it is possible to easily and inexpensively produce a chip component capable of supporting double-sided mounting and a chip component capable of embedding a functional material in a concave portion between electrodes.
[Brief description of the drawings]
FIGS. 1A and 1B are views showing a method for manufacturing a chip component according to the present invention, wherein FIGS. 1A and 1B are perspective views, and FIG. 1C is a partially enlarged longitudinal sectional view.
FIGS. 2A to 2F are views showing a manufacturing process of the chip resistor, and FIGS.
FIG. 3A is a partially enlarged longitudinal sectional view showing a step portion according to the present invention, and FIG. 3B is a partially enlarged longitudinal sectional view showing a step portion in a conventional technique.
FIG. 4 is a view showing a manufacturing process of the chip thermistor, and (a) to (g) are longitudinal sectional views.
FIG. 5 is a partially enlarged longitudinal sectional view showing another embodiment of the dividing slit.
[Explanation of symbols]
10 Chip resistance
11 Insulating substrate
11a convex part
12 recess
12a bottom
13, 19, 21, 33, 34, 43, 44 electrodes
14 convex part
15, 35 resistor
17, 37 protective film
23 Plating electrode
30 Chip thermistor
100 Insulating (before split) substrate
101 Green Sheet
101a Peripheral part
102 convex pattern
103 concave part (opening)
104 convex part
105 slit

Claims (7)

A ceramic green sheet is prepared, a convex pattern having an opening corresponding to each chip section is screen-printed on the green sheet, the green sheet is fired, and a convex section and a concave section corresponding to each chip section. A method for producing a chip component, comprising: producing an insulating substrate having: (i) forming a device pattern corresponding to each chip section on the concave portion and the peripheral convex portion of the insulating substrate; 2. The method of manufacturing a chip component according to claim 1, wherein each material of the ceramic green sheet and the convex pattern is mainly composed of the same ceramic powder. The method according to claim 1, wherein the convex pattern is formed so as to leave a peripheral portion of the green sheet. 2. The method according to claim 1, wherein the convex patterns are arranged in a grid on the green sheet. 2. The method according to claim 1, wherein a dividing groove for dividing the insulating substrate for each chip section is provided by embossing at a stage of the green sheet. The method according to claim 1, wherein a resistor pattern is formed in the concave portion, an electrode pattern is formed in the convex portion, and a chip resistor that can be mounted on both sides is formed. The method according to claim 1, wherein a thermistor pattern is formed in the concave portion, an electrode pattern extending over the convex portion is formed, and a chip thermistor element is formed.

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