JP2004319598A - Package for housing light emitting element and light emitting device - Google Patents

Package for housing light emitting element and light emitting device Download PDF

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Publication number
JP2004319598A
JP2004319598A JP2003108254A JP2003108254A JP2004319598A JP 2004319598 A JP2004319598 A JP 2004319598A JP 2003108254 A JP2003108254 A JP 2003108254A JP 2003108254 A JP2003108254 A JP 2003108254A JP 2004319598 A JP2004319598 A JP 2004319598A
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light emitting
emitting element
light
solder
package
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Japanese (ja)
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Takashi Ogawa
剛史 小川
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

<P>PROBLEM TO BE SOLVED: To prevent the occurrence of a shadow (dark part) at the lower end of the side face of a light emitting element at the time of manufacturing a high-luminance light emitting device. <P>SOLUTION: A package for housing light emitting element is provided with a ceramic substrate 2 having a mounting section 2a, on which the light emitting element 5 is mounted through solder 6 having a reflectance of ≥40% to the light emitted from the element 5 is mounted, at the central part of its top surface and a frame body 4 which is provided in the outer peripheral section of the top surface of the substrate 2 to surround the mounting section 2a and has an inner peripheral surface inclined so that the surface may be expanded outward toward the upside. The solder 6 is extended farther outward than the lower end of the side face of the light emitting element 5 over the whole circumference of the element 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【発明の属する技術分野】
本発明は、発光ダイオード（ＬＥＤ）等の発光素子を収容するための発光素子収納用パッケージおよび発光装置に関する。
【従来の技術】
従来、発光ダイオード（ＬＥＤ），半導体レーザ（ＬＤ）等の発光素子を用いた発光装置は、今後さらなる低消費電力化や長寿命化がすすむものとして注目されており、近年種々の分野で使用され始めている。従来の赤色から可視光の波長の光を発光する発光素子を搭載する発光素子収納用パッケージ（以下、単にパッケージともいう）の断面図を図２に示す。
図２に示すように、従来のパッケージ１１は、樹脂やセラミックス等から成る基体１２を有する。基体１２には、タングステン（Ｗ）やモリブデン（Ｍｏ）、マンガン（Ｍｎ）等を含む導体ペーストを高温で焼結し、その上面にメッキ法によりニッケル（Ｎｉ）メッキ層や金（Ａｕ）メッキ層を被着して成る配線導体１３が形成されている。この配線導体１３を介して、外部電気回路からパッケージ内部に搭載された発光素子１５に電力や駆動電流が供給される。
また基体１２は、その上面に、上下面を貫通する貫通孔を有する平面視形状が正方形状等で樹脂やセラミックス等から成る枠体１４が設けられている。この枠体１４は、基体１２に、７００〜９００℃の融点を有する銀（Ａｇ）−銅（Ｃｕ）合金等のロウ材、エポキシ系樹脂接着剤、２５０〜４５０℃の融点を有する低融点ガラス等により固定される。または、枠体１４が基体１２と同一の材質から成る場合は、枠体１４が基体１２と一体に成型される。
発光素子１５は基体１２の導体層から成る搭載部にＡｕバンプ１６等を介して接合されており、発光素子１５の電極は基体１２上面の搭載部の周囲に設けられた配線導体１３にＡｕ製のボンディングワイヤを介して電気的に接続される。
また、発光素子１５を保護するために枠体１４の内側に透明部材１８が設けられる。この透明部材１８は、枠体１４の内側に発光素子１５を覆うように熱硬化性のエポキシ樹脂などを充填し、加熱硬化させることにより設けられる。また、透明部材１８は、発光素子１５や基体１２、枠体１４と強固に密着して発光素子１５をパッケージ１１内に強固に固定する働きも有する。
さらに、枠体１４の上面にガラス，サファイア等から成る透光性で板状の蓋体１７が樹脂接着剤等で接着される。これにより、発光素子１５を有する発光装置となる。
また、発光素子１５が紫外光を含む短波長の光を発光するものの場合、例えば発光素子１５およびその周囲には、発光素子１５から発光する青色から紫外の光（波長３５０〜４００ｎｍ程度）を白色等の可視光（４００〜８００ｎｍ）に変換するための液状の蛍光体が、発光素子１５を封止するように設けられている場合もあり、この場合、発光素子１５の光を可視光に変換することができる。
このような発光装置は、外部電気回路から供給される駆動電流によって発光素子１５が駆動され、可視光を発光するものとして使用される。その用途は、各種インジケーター，光センサー，ディスプレイ，ホトカプラ，バックライト，光プリンタヘッド等である。
近年、この発光装置を照明用として使用するようになってきており、高輝度および放熱性の点でより高特性の発光装置が要求されている。また、照明用に使用される場合、発光装置の長寿命化が特に重要な問題である。
そこで、最近は発光装置の発光輝度を向上させる構成が考えられており、枠体１４をより反射率の高い材料で構成することが多い。例えば、枠体１４をＡｇやアルミニウム（Ａｌ）からなる反射率の高い金属で形成したり、それらの金属を枠体１４の表面に被着させて、発光素子１５から発光する光を効率よくパッケージ１１の外部へ放射させることが提案されている。
【特許文献１】
特開２００２−３４４０２９号公報
【発明が解決しようとする課題】
しかしながら、上記従来のパッケージ１１では、発光素子１５の側面の下端や下面の外周縁に、０．０４ｍｍ程度の高さを有するＡｕバンプ１６の影響によって影（暗部）が全周にわたって発生するという問題点があった。したがって、従来のパッケージ１１では、高輝度の発光装置と成した際に上記の影が際立つこととなり、照射面に影が薄く投影される場合があり、この場合照明用として使用しにくいといった問題点があった。
したがって、本発明はかかる従来の問題点に鑑みて完成されたものであり、その目的は、高輝度の発光装置を作製する際に発光素子の側面の下端に影（暗部）が生じないものとすることにある。
【課題を解決するための手段】
本発明の発光素子収納用パッケージは、上面の中央部に発光素子を該発光素子の発光する光に対する反射率が４０％以上の半田を介して搭載する搭載部を有するセラミックスから成る基体と、該基体の上面の外周部に前記搭載部を取り囲んで設けられ、内周面が上側に向かって外側に広がるように傾斜した枠体とを具備しており、前記半田は、その外周端が前記発光素子の側面の下端よりも外側に全周にわたって延出していることを特徴とする。
本発明の発光素子収納用パッケージは、上面の中央部に発光素子を発光素子の発光する光に対する反射率が４０％以上の半田を介して搭載する搭載部を有するセラミックスから成る基体と、基体の上面の外周部に搭載部を取り囲んで設けられ、内周面が上側に向かって外側に広がるように傾斜した枠体とを具備しており、半田は、その外周端が発光素子の側面の下端よりも外側に全周にわたって延出していることから、高輝度の発光装置を作製する際に発光素子の側面の下端に影が生じないものとなり、発光装置を照明用として使用した際に照射面に影が薄く投影されるのを解消することができる。
本発明の発光素子収納用パッケージにおいて、好ましくは、前記半田が金−錫合金半田から成ることを特徴とする。
本発明の発光素子収納用パッケージは、好ましくは半田が金−錫合金半田から成ることから、発光素子の側面の下端に全周にわたって光の反射率の高い金−錫合金半田が存在することとなり、発光素子の側面の下端に影が発生しないものとなる。
本発明の発光装置は、本発明の発光素子収納用パッケージと、前記搭載部に前記半田を介して搭載された発光素子と、前記発光素子を覆う透明部材とを具備していることを特徴とする。
本発明の発光装置は、上記の構成により、高輝度の発光装置を作製した際に発光素子の側面の下端に影が生じないものとなり、発光装置を照明用として使用した際に照射面に影が薄く投影されるのを解消することができる。
【発明の実施の形態】
本発明の発光素子収納用パッケージを以下に詳細に説明する。図１は、本発明のパッケージについて実施の形態の一例を示す断面図であり、２は基体、４は枠体であり、主としてこれらで発光素子５を収容するためのパッケージ１が構成されている。
本発明のパッケージは、上面の中央部に発光素子５を発光素子５の発光する光に対する反射率が４０％以上の半田６を介して搭載する搭載部２ａを有するセラミックスから成る基体２と、基体２の上面の外周部に搭載部２ａを取り囲んで設けられ、内周面が上側に向かって外側に広がるように傾斜した枠体４とを具備し、半田６は、その外周端が発光素子５の側面の下端よりも外側に全周にわたって延出している。
本発明において、発光素子５は搭載部２ａに発光素子５の発光する光に対する反射率が４０％以上の半田６を介して接合されるが、半田６としては金（Ａｕ）−錫（Ｓｎ）合金半田が良好な反射率を有しており好ましい。これにより、高輝度の発光装置を作製する際に発光素子５の側面の下端に影が生じないものとなり、発光装置を照明用として使用した際に照射面に影が薄く投影されるのを解消することができる。
半田６は、発光素子５の発光する光に対する反射率が４０％未満では、発光素子５の側面の下端に影が発生し易くなる。
また半田６は、その外周端が発光素子５の側面の下端よりも外側に全周にわたって延出しているが、その延出幅は０．３ｍｍ程度以下がよい。０．３ｍｍを超えると、
ロウ材が接合面から流れ出してしまい接合強度が低下し易くなる。
本発明における基体２は、例えば酸化アルミニウム質焼結体（アルミナセラミックス）や窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックスから成る四角形状等の平板であり、発光素子５を支持するための支持部材として機能し、その上面に発光素子５を搭載するための搭載部２ａを有している。
また、基体２は、搭載部２ａおよびその周囲から下面にかけて導出されるメタライズ層から成る配線導体３が被着されている。配線導体３はＷ，Ｍｏ，Ｃｕ，Ａｇ等の金属粉末のメタライズ層から成り、パッケージ１内部に収容された発光素子５を外部に電気的に接続するための導電路として機能する。そして、搭載部２ａにはＬＥＤ，ＬＤ等の発光素子５が半田６によって固着されるとともに、搭載部２ａ周囲の配線導体３には発光素子５の電極がボンディングワイヤを介して電気的に接続される。
なお、配線導体３の露出する表面にＮｉやＡｕ等の耐食性に優れる金属を１〜２０μｍ程度の厚みに被着させておくのがよく、配線導体３が酸化腐食するのを有効に防止できるとともに、配線導体３と発光素子５との接続および配線導体３とボンディングワイヤとの接続を強固にすることができる。したがって、配線導体３の露出表面には、厚さ１〜１０μｍ程度のＮｉメッキ層と厚さ０．１〜３μｍ程度のＡｕメッキ層とが電解メッキ法や無電解メッキ法により順次被着されていることがより好ましい。
さらに、基体２の熱伝導率は１０Ｗ／ｍ・Ｋ以上が好ましく、１０Ｗ／ｍ・Ｋ以下では、５０ｍＡ以上の駆動電流を発光素子５に入力した際に発光素子５の表面温度が１００℃以上に達し、発光素子５の寿命を劣化させるばかりではなく、発光素子５の光出力を上げられなくなる。
枠体４はＡｌ，Ａｇ，Ａｕ，Ｐｔ，Ｔｉ，Ｃｒ，Ｃｕ等の金属、これらの１種以上を含む合金、ステンレススチール，真鍮等の合金、樹脂、セラミックス等から成るのがよく、金属からなる場合、発光素子５の光を高い反射率で反射させることができ、高輝度の発光装置を作製することができる。また、枠体４の表面にＡｌ，Ａｇ，Ａｕ，Ｐｔ，Ｔｉ，Ｃｒ，Ｃｕ等の高い反射率の金属層を形成してもよい。さらに、枠体４がＡｇ，Ｃｕ等の酸化により変色し易い金属から成る場合やＡｇ，Ｃｕ等の酸化により変色し易い金属層を形成したものである場合、その表面に透明樹脂層や透明樹脂シートを被着してもよい。
この枠体４は、その中央部に発光素子５を収容するための横断面形状が円形状や四角形状の貫通穴４ａを有しており、貫通穴４ａに発光素子５が収容されるとともに搭載部２ａに搭載される。この貫通穴４ａの内周面は、その算術平均粗さＲａが０．００４〜４μｍであることがよく、これにより、枠体４の内周面が発光素子５の光を良好に反射させることとなる。Ｒａが４μｍを超えると、貫通穴４ａに収容された発光素子５が発光する光を均一に反射させるのが困難となり、反射する光の強さに偏りが発生しやすくなる。０．００４μｍ未満では、そのような面を安定かつ効率よく形成することが困難となる傾向にある。
さらに、貫通穴４ａの内周面に厚さ１〜１０μｍ程度のＮｉメッキ層と厚さ０．１〜３μｍ程度のＡｕメッキ層とが電解メッキ法や無電解メッキ法により順次被着されていることがよく、枠体４の耐腐食性が向上する。
また、貫通穴４ａはその横断面形状が円形状であるのがよく、貫通穴４ａに収容された発光素子５が発光する光を貫通穴４ａの内周面で万遍なく反射させて外部に極めて均一に放射することができる。
かくして、本発明のパッケージ１は、基体２の搭載部２ａに発光素子５を搭載するとともに発光素子５の電極と基体２の配線導体３とをボンディングワイヤを介して電気的に接続し、しかる後、発光素子５を覆う透明樹脂等から成る透明部材を設けることによって発光装置となる。透明部材は、発光素子５を覆うシリコーン樹脂等の透明樹脂であってもよく、枠体４の上面に樹脂接着剤等で接着された、ガラス，サファイア等から成る平板状，レンズ状の透光性の蓋体７であってもよい。
なお、本発明は上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を行なうことは何等支障ない。
【発明の効果】
本発明の発光素子収納用パッケージは、上面の中央部に発光素子を発光素子の発光する光に対する反射率が４０％以上の半田を介して搭載する搭載部を有するセラミックスから成る基体と、基体の上面の外周部に搭載部を取り囲んで接合され、内周面が上側に向かって外側に広がるように傾斜した枠体とを具備しており、半田は、その外周端が発光素子の側面の下端よりも外側に全周にわたって延出していることから、高輝度の発光装置を作製する際に発光素子の側面の下端に影が生じないものとなり、発光装置を照明用として使用した際に照射面に影が薄く投影されるのを解消することができる。
本発明の発光素子収納用パッケージは、好ましくは半田が金−錫合金半田から成ることから、発光素子の側面の下端に全周にわたって光の反射率の高い金−錫合金半田が存在することとなり、発光素子の側面の下端に影が発生しないものとなる。
本発明の発光装置は、本発明の発光素子収納用パッケージと、搭載部に半田を介して搭載された発光素子と、発光素子を覆う透明部材とを具備していることにより、高輝度の発光装置を作製した際に発光素子の側面の下端に影が生じないものとなり、発光装置を照明用として使用した際に照射面に影が薄く投影されるのを解消することができる。
【図面の簡単な説明】
【図１】本発明の発光素子収納用パッケージについて実施の形態の例を示す断面図である。
【図２】従来の発光素子収納用パッケージの断面図である。
【符号の説明】
１：発光素子収納用パッケージ
２：基体
２ａ：搭載部
３：配線導体
４：枠体
５：発光素子
６：半田TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light emitting element housing package for housing a light emitting element such as a light emitting diode (LED) and a light emitting device.
[Prior art]
Conventionally, light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and semiconductor lasers (LDs) have been attracting attention in the future as having lower power consumption and longer life, and have recently been used in various fields. Has begun. FIG. 2 is a cross-sectional view of a conventional light emitting element housing package (hereinafter, also simply referred to as a package) on which a light emitting element that emits light having a wavelength from red to visible light is mounted.
As shown in FIG. 2, a conventional package 11 has a base 12 made of resin, ceramics, or the like. A conductive paste containing tungsten (W), molybdenum (Mo), manganese (Mn), or the like is sintered at a high temperature on the base 12, and a nickel (Ni) plating layer or a gold (Au) plating layer is formed on the upper surface thereof by a plating method. Is formed on the wiring conductor 13. Power and drive current are supplied from the external electric circuit to the light emitting element 15 mounted inside the package via the wiring conductor 13.
The base body 12 is provided on its upper surface with a frame 14 made of resin, ceramics, or the like having a square shape or the like in plan view having through holes penetrating the upper and lower surfaces. The frame body 14 is formed on a substrate 12 by using a brazing material such as a silver (Ag) -copper (Cu) alloy having a melting point of 700 to 900 ° C., an epoxy resin adhesive, and a low-melting glass having a melting point of 250 to 450 ° C. It is fixed by the like. Alternatively, when the frame 14 is made of the same material as the base 12, the frame 14 is molded integrally with the base 12.
The light emitting element 15 is bonded to a mounting portion formed of a conductor layer of the base 12 via an Au bump 16 or the like. The electrodes of the light emitting element 15 are made of Au on a wiring conductor 13 provided around the mounting portion on the upper surface of the base 12. Are electrically connected through the bonding wires of
Further, a transparent member 18 is provided inside the frame 14 to protect the light emitting element 15. The transparent member 18 is provided by filling the inside of the frame body 14 with a thermosetting epoxy resin or the like so as to cover the light emitting element 15 and heating and curing the same. In addition, the transparent member 18 has a function of firmly adhering to the light emitting element 15, the base 12, and the frame body 14 to firmly fix the light emitting element 15 in the package 11.
Further, a transparent and plate-shaped lid 17 made of glass, sapphire, or the like is adhered to the upper surface of the frame 14 with a resin adhesive or the like. Thus, a light emitting device having the light emitting element 15 is obtained.
In the case where the light emitting element 15 emits light of a short wavelength including ultraviolet light, for example, blue to ultraviolet light (wavelength of about 350 to 400 nm) emitted from the light emitting element 15 is white-colored around the light emitting element 15. In some cases, a liquid phosphor for converting the light into visible light (400 to 800 nm) is provided so as to seal the light emitting element 15, and in this case, the light from the light emitting element 15 is converted into visible light. can do.
In such a light emitting device, the light emitting element 15 is driven by a drive current supplied from an external electric circuit, and is used as one that emits visible light. Its applications are various indicators, optical sensors, displays, photocouplers, backlights, optical printer heads, and the like.
In recent years, this light-emitting device has been used for lighting, and a light-emitting device having higher characteristics in terms of high luminance and heat dissipation has been demanded. In addition, when used for lighting, extending the life of the light emitting device is a particularly important problem.
Therefore, recently, a configuration for improving the light emission luminance of the light emitting device has been considered, and the frame 14 is often made of a material having higher reflectance. For example, the frame body 14 is formed of a metal having a high reflectance such as Ag or aluminum (Al), or the metal is adhered to the surface of the frame body 14 to efficiently package light emitted from the light emitting element 15. It has been proposed to radiate to the outside of 11.
[Patent Document 1]
JP 2002-344029 A [Problems to be Solved by the Invention]
However, in the above-described conventional package 11, a shadow (dark portion) is generated over the entire circumference due to the influence of the Au bump 16 having a height of about 0.04 mm on the lower end of the side surface and the outer peripheral edge of the lower surface of the light emitting element 15. There was a point. Therefore, in the conventional package 11, when the light emitting device has a high brightness, the above-mentioned shadow becomes conspicuous, and the shadow may be projected thinly on the irradiation surface, and in this case, it is difficult to use it for illumination. was there.
Therefore, the present invention has been completed in view of such a conventional problem, and an object of the present invention is to produce a high-luminance light-emitting device without producing a shadow (dark portion) at a lower end of a side surface of a light-emitting element. Is to do.
[Means for Solving the Problems]
A light emitting element housing package according to the present invention includes a base body made of ceramics having a mounting portion in which a light emitting element is mounted via a solder having a reflectance of 40% or more with respect to light emitted from the light emitting element at a central portion of an upper surface; A frame provided on the outer peripheral portion of the upper surface of the base so as to surround the mounting portion, and having an inner peripheral surface inclined so as to expand outward toward the upper side; It is characterized in that it extends over the entire periphery outside the lower end of the side surface of the element.
The package for housing a light emitting element according to the present invention includes a base made of ceramics having a mounting portion for mounting the light emitting element via a solder having a reflectance to light emitted from the light emitting element of 40% or more at the center of the upper surface; A frame provided on the outer peripheral portion of the upper surface so as to surround the mounting portion, the inner peripheral surface being inclined so as to expand outward toward the upper side, and the outer peripheral end of the solder is provided at the lower end of the side surface of the light emitting element. Since the light emitting device extends over the entire circumference, no shadow is formed at the lower end of the side surface of the light emitting element when manufacturing a high-luminance light emitting device. Can be prevented from being shadowed thinly.
In the light emitting element housing package according to the present invention, preferably, the solder is made of a gold-tin alloy solder.
In the light emitting element housing package of the present invention, since the solder is preferably made of gold-tin alloy solder, there is a gold-tin alloy solder having a high light reflectance over the entire periphery at the lower end of the side surface of the light emitting element. Thus, no shadow is generated at the lower end of the side surface of the light emitting element.
The light-emitting device of the present invention includes the light-emitting element housing package of the present invention, a light-emitting element mounted on the mounting portion via the solder, and a transparent member that covers the light-emitting element. I do.
With the above structure, the light emitting device of the present invention does not produce a shadow at the lower end of the side surface of the light emitting element when a light emitting device with high luminance is manufactured, and has a shadow on an irradiation surface when the light emitting device is used for illumination. Can be prevented from being projected thinly.
BEST MODE FOR CARRYING OUT THE INVENTION
The light emitting element housing package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of the package of the present invention. Reference numeral 2 denotes a base, 4 denotes a frame, and these mainly constitute a package 1 for housing a light emitting element 5. .
The package according to the present invention includes a base body 2 made of ceramics having a mounting portion 2a at a center portion of an upper surface for mounting the light emitting element 5 via a solder 6 having a reflectance of 40% or more with respect to light emitted from the light emitting element 5, and a base. A frame 4 provided on the outer peripheral portion of the upper surface of the upper surface 2 so as to surround the mounting portion 2a, the inner peripheral surface of which is inclined so as to expand outward toward the upper side; Extends over the entire periphery outside the lower end of the side surface of the.
In the present invention, the light emitting element 5 is bonded to the mounting portion 2a via the solder 6 having a reflectance of 40% or more with respect to light emitted from the light emitting element 5, and the solder 6 is gold (Au) -tin (Sn). Alloy solder is preferred because it has good reflectivity. Thereby, when manufacturing a high-luminance light-emitting device, no shadow is formed at the lower end of the side surface of the light-emitting element 5, and when the light-emitting device is used for illumination, the shadow is not projected on the irradiation surface thinly. can do.
When the reflectance of the solder 6 with respect to the light emitted from the light emitting element 5 is less than 40%, a shadow is easily generated at the lower end of the side surface of the light emitting element 5.
Further, the solder 6 has an outer peripheral end extending outside the lower end of the side surface of the light emitting element 5 over the entire periphery, and the extended width is preferably about 0.3 mm or less. If it exceeds 0.3 mm,
The brazing material flows out from the joining surface, and the joining strength tends to decrease.
The base 2 according to the present invention is a rectangular flat plate made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic. And a mounting portion 2a for mounting the light emitting element 5 on the upper surface thereof.
The base 2 is covered with a wiring conductor 3 formed of a metallized layer extending from the mounting portion 2a and its periphery to the lower surface. The wiring conductor 3 is formed of a metallized layer of a metal powder such as W, Mo, Cu, and Ag, and functions as a conductive path for electrically connecting the light emitting element 5 housed inside the package 1 to the outside. A light emitting element 5 such as an LED or an LD is fixed to the mounting portion 2a by solder 6, and an electrode of the light emitting element 5 is electrically connected to a wiring conductor 3 around the mounting portion 2a via a bonding wire. You.
It is preferable that a metal having excellent corrosion resistance, such as Ni or Au, is applied to the exposed surface of the wiring conductor 3 to a thickness of about 1 to 20 μm, thereby effectively preventing the wiring conductor 3 from being oxidized and corroded. In addition, the connection between the wiring conductor 3 and the light emitting element 5 and the connection between the wiring conductor 3 and the bonding wire can be strengthened. Therefore, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor 3 by electrolytic plating or electroless plating. Is more preferable.
Further, the thermal conductivity of the base 2 is preferably 10 W / m · K or more, and when the thermal conductivity is 10 W / m · K or less, the surface temperature of the light emitting element 5 becomes 100 ° C. or more when a driving current of 50 mA or more is input to the light emitting element 5. , The life of the light emitting element 5 is not only deteriorated, but also the light output of the light emitting element 5 cannot be increased.
The frame 4 is preferably made of a metal such as Al, Ag, Au, Pt, Ti, Cr, or Cu, an alloy containing one or more of these, an alloy such as stainless steel or brass, a resin, or a ceramic. In that case, the light of the light emitting element 5 can be reflected with a high reflectance, and a light emitting device with high luminance can be manufactured. Further, a metal layer having a high reflectance such as Al, Ag, Au, Pt, Ti, Cr, or Cu may be formed on the surface of the frame 4. Further, when the frame 4 is made of a metal that is easily discolored by oxidation such as Ag or Cu, or when a metal layer that is easily discolored by oxidation of Ag or Cu is formed, a transparent resin layer or a transparent resin is formed on the surface thereof. A sheet may be applied.
The frame 4 has a through hole 4a having a circular or square cross section for accommodating the light emitting element 5 at the center thereof. The light emitting element 5 is accommodated in the through hole 4a and mounted. It is mounted on the unit 2a. The inner peripheral surface of the through hole 4a preferably has an arithmetic mean roughness Ra of 0.004 to 4 μm, so that the inner peripheral surface of the frame 4 reflects the light of the light emitting element 5 satisfactorily. It becomes. When Ra exceeds 4 μm, it becomes difficult to uniformly reflect the light emitted by the light emitting element 5 accommodated in the through hole 4a, and the intensity of the reflected light tends to be biased. If it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.
Further, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the inner peripheral surface of the through hole 4 a by an electrolytic plating method or an electroless plating method. Therefore, the corrosion resistance of the frame 4 is improved.
The through-hole 4a preferably has a circular cross-sectional shape, and the light emitted by the light-emitting element 5 housed in the through-hole 4a is uniformly reflected by the inner peripheral surface of the through-hole 4a, and the light is emitted to the outside. It can radiate very uniformly.
Thus, in the package 1 of the present invention, the light emitting element 5 is mounted on the mounting portion 2a of the base 2 and the electrodes of the light emitting element 5 are electrically connected to the wiring conductors 3 of the base 2 through the bonding wires. By providing a transparent member made of a transparent resin or the like that covers the light emitting element 5, a light emitting device is obtained. The transparent member may be a transparent resin such as a silicone resin that covers the light emitting element 5, and may be a plate-like or lens-like light-transmitting material made of glass, sapphire, or the like, which is adhered to the upper surface of the frame 4 with a resin adhesive or the like. The cover 7 may be made of a natural material.
It should be noted that the present invention is not limited to the above-described embodiment, and that various changes may be made without departing from the scope of the present invention.
【The invention's effect】
The package for housing a light emitting element according to the present invention includes a base made of ceramics having a mounting portion for mounting the light emitting element via a solder having a reflectance to light emitted from the light emitting element of 40% or more at the center of the upper surface; A frame body which is joined to the outer peripheral portion of the upper surface so as to surround the mounting portion, and whose inner peripheral surface is inclined so as to expand outward toward the upper side; Since the light emitting device extends over the entire circumference, no shadow is formed at the lower end of the side surface of the light emitting element when manufacturing a high-luminance light emitting device. Can be prevented from being shadowed thinly.
In the light emitting element housing package of the present invention, since the solder is preferably made of gold-tin alloy solder, there is a gold-tin alloy solder having a high light reflectance over the entire periphery at the lower end of the side surface of the light emitting element. Thus, no shadow is generated at the lower end of the side surface of the light emitting element.
The light-emitting device of the present invention includes a light-emitting element housing package of the present invention, a light-emitting element mounted on a mounting portion via solder, and a transparent member that covers the light-emitting element, so that high-luminance light is emitted. When the device is manufactured, no shadow is generated at the lower end of the side surface of the light emitting element, and when the light emitting device is used for illumination, it is possible to prevent the shadow from being thinly projected on the irradiation surface.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a light emitting element housing package of the present invention.
FIG. 2 is a cross-sectional view of a conventional light emitting element storage package.
[Explanation of symbols]
1: Package for housing light emitting element 2: Base 2a: Mounting portion 3: Wiring conductor 4: Frame 5: Light emitting element 6: Solder

Claims (3)

上面の中央部に発光素子を該発光素子の発光する光に対する反射率が４０％以上の半田を介して搭載する搭載部を有するセラミックスから成る基体と、該基体の上面の外周部に前記搭載部を取り囲んで設けられ、内周面が上側に向かって外側に広がるように傾斜した枠体とを具備しており、前記半田は、その外周端が前記発光素子の側面の下端よりも外側に全周にわたって延出していることを特徴とする発光素子収納用パッケージ。A base made of ceramics having a mounting portion on which a light emitting element is mounted via a solder having a reflectance of 40% or more with respect to light emitted from the light emitting device at a central portion of the upper surface; And a frame body whose inner peripheral surface is inclined so that the inner peripheral surface expands outward toward the upper side, and the outer periphery of the solder is entirely outside the lower end of the side surface of the light emitting element. A light emitting element storage package extending over the circumference. 前記半田が金−錫合金半田から成ることを特徴とする請求項１記載の発光素子収納用パッケージ。2. The package according to claim 1, wherein the solder is made of gold-tin alloy solder. 請求項１または請求項２記載の発光素子収納用パッケージと、前記搭載部に前記半田を介して搭載された発光素子と、前記発光素子を覆う透明部材とを具備していることを特徴とする発光装置。3. A light-emitting element storage package according to claim 1, comprising: a light-emitting element mounted on the mounting portion via the solder; and a transparent member covering the light-emitting element. Light emitting device.
JP2003108254A 2003-04-11 2003-04-11 Package for housing light emitting element and light emitting device Pending JP2004319598A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251142A (en) * 2006-02-14 2007-09-27 Dowa Electronics Materials Co Ltd Solder layer, substrate for bonding electronic device using same, and method of manufacturing same
KR101012936B1 (en) * 2008-09-29 2011-02-08 한국광기술원 Light emitting diode package encapsulated by light transmitting substrate and method for fabricating the same
JP2011134785A (en) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd Light emitting device
JP2011134786A (en) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd Light emitting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251142A (en) * 2006-02-14 2007-09-27 Dowa Electronics Materials Co Ltd Solder layer, substrate for bonding electronic device using same, and method of manufacturing same
KR101012936B1 (en) * 2008-09-29 2011-02-08 한국광기술원 Light emitting diode package encapsulated by light transmitting substrate and method for fabricating the same
JP2011134785A (en) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd Light emitting device
JP2011134786A (en) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd Light emitting device

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