JP2004311857A5 - - Google Patents

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Publication number
JP2004311857A5
JP2004311857A5 JP2003106079A JP2003106079A JP2004311857A5 JP 2004311857 A5 JP2004311857 A5 JP 2004311857A5 JP 2003106079 A JP2003106079 A JP 2003106079A JP 2003106079 A JP2003106079 A JP 2003106079A JP 2004311857 A5 JP2004311857 A5 JP 2004311857A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2003106079A
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JP4242194B2 (ja
JP2004311857A (ja
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Priority to JP2003106079A priority Critical patent/JP4242194B2/ja
Priority claimed from JP2003106079A external-priority patent/JP4242194B2/ja
Publication of JP2004311857A publication Critical patent/JP2004311857A/ja
Publication of JP2004311857A5 publication Critical patent/JP2004311857A5/ja
Application granted granted Critical
Publication of JP4242194B2 publication Critical patent/JP4242194B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003106079A 2003-04-10 2003-04-10 半導体発光装置およびその製造方法 Expired - Fee Related JP4242194B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003106079A JP4242194B2 (ja) 2003-04-10 2003-04-10 半導体発光装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003106079A JP4242194B2 (ja) 2003-04-10 2003-04-10 半導体発光装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2004311857A JP2004311857A (ja) 2004-11-04
JP2004311857A5 true JP2004311857A5 (ja) 2008-06-05
JP4242194B2 JP4242194B2 (ja) 2009-03-18

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ID=33468372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003106079A Expired - Fee Related JP4242194B2 (ja) 2003-04-10 2003-04-10 半導体発光装置およびその製造方法

Country Status (1)

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JP (1) JP4242194B2 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180059A (ja) * 2005-12-26 2007-07-12 Toshiba Corp 光半導体装置とその製造方法
JP2007201420A (ja) 2005-12-27 2007-08-09 Sharp Corp 半導体発光装置、半導体発光素子、および半導体発光装置の製造方法
US7365407B2 (en) * 2006-05-01 2008-04-29 Avago Technologies General Ip Pte Ltd Light emitting diode package with direct leadframe heat dissipation
JP5103805B2 (ja) * 2006-06-27 2012-12-19 日亜化学工業株式会社 発光装置及びその製造方法
KR101456266B1 (ko) * 2006-12-08 2014-11-04 서울반도체 주식회사 발광소자
KR101353579B1 (ko) 2007-06-29 2014-01-22 서울반도체 주식회사 발광 다이오드 램프 및 발광 장치
JP2009123873A (ja) * 2007-11-14 2009-06-04 Wen-Gung Sung 発光ダイオード封止構造およびその製造方法
KR20090005281U (ko) * 2007-11-28 2009-06-02 웬-쿵 숭 발광 다이오드 밀봉 구조
CN102265417B (zh) * 2008-12-26 2013-10-23 古河电气工业株式会社 光半导体装置用引线框、其制造方法及光半导体装置
US8610156B2 (en) 2009-03-10 2013-12-17 Lg Innotek Co., Ltd. Light emitting device package
WO2010140693A1 (ja) * 2009-06-04 2010-12-09 三洋電機株式会社 電子部品
JP2011176364A (ja) * 2010-01-29 2011-09-08 Toshiba Corp Ｌｅｄパッケージ
JP4764519B1 (ja) * 2010-01-29 2011-09-07 株式会社東芝 Ｌｅｄパッケージ
KR101064084B1 (ko) * 2010-03-25 2011-09-08 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
JP2021103911A (ja) * 2019-12-24 2021-07-15 住友電装株式会社 電気接続箱

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