JP2004308973A - Heat radiating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simply formed and easily manufacturable cooling device used for electronic equipment and performing the cooling of a heating part by collecting and radiating heat from the heating part in non-contact with the heating part. <P>SOLUTION: In this heat radiating device for absorbing and radiating heat to and from a heating element, a single or a plurality of heat pipes are disposed so as to cover the heating surface of the heating element in no-contact therewith, a single or a plurality of radiant heat absorbing devices formed by combining heat pipes and fins as heat absorbing parts with the single or the plurality of heat pipes are connected to any portion, and the fins installed on the single or the plurality of radiant heat absorbing devices are disposed so that radiant heat radiated from a heat source becomes difficult to leak from the surface of the radiant heat absorbing devices facing the heat source. Also, the plate type thin hole heat pipes are used as the heat pipes. In addition, a heat radiating fin device is combined with the fan. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating device that is used in an electronic apparatus and cools a heat generating portion by collecting heat of the heat generating portion in a non-contact manner and dissipating heat to cool the heat generating portion. .
[0002]
[Prior art]
In various electronic devices having components that locally generate heat, such as a semiconductor device and a light emitting element, inside the electronic device, a failure due to overheating of the heating element (for example, malfunction or damage of the heating element or a device member disposed in the vicinity thereof). In order to prevent this, the heat generating means is provided with a heat radiating means for radiating the heat generated by the heat generating element, and the heat generating element is cooled and operated.
[0003]
For example, a computer has a heating element such as a CPU (MPU), a memory, a hard disk drive, etc., and a cathode ray tube or a projector has a large number of heating elements such as a light source. Air cooling that conducts heat to the outside of the housing and radiates heat to the outside, forced air cooling by a small fan, and the like have been performed. (Patent Document 1)
[0004]
However, in recent years, the heat generation density has been remarkably increased due to high performance and modularization of semiconductor devices such as microprocessors, miniaturization and high density arrangement of semiconductor elements. Further, in order to obtain a small-sized and high-fluorescent light-emitting body, the heat generation density of the light-emitting element has been significantly increased.
[0005]
To solve the above problems, for example, a heat collecting means made of a metal plate or the like is disposed in close contact with the heating element, and the heat of the heating element collected by the heat collecting means is used using a heat transfer means such as a flat heat pipe. A heat transfer type cooling device has been devised in which the heat is transferred to the outside of the housing, and the transferred heat is forcibly air-cooled by a heat radiating means such as a radiating fin or a fan arranged on the outer peripheral portion of the housing to cool the heating element. Has been put to practical use.
[0006]
[Patent Document 1]
JP 08-125370 A
[Problems to be solved by the invention]
However, even in the case of using the heat transfer type heat radiating device, when the heating element is arranged in a narrow space, heat can be radiated by directly contacting the cooling device with the heating element as described above. In some cases, it is not possible. For example, when there is a possibility that the contact surface may be peeled off due to vibration, or because a large number of semiconductor devices having different sizes and large heat generation densities are densely arranged in a narrow space due to miniaturization and space saving, a plurality of If it is not possible to arrange the heat radiating device, or because the direction and height of the cooling surface of the heating element are different, arrange a single plate-type heat pipe that is easy to process and contact all the elements. In some cases, a simple heat dissipation device that dissipates heat cannot be applied. Also, when manufacturing a radiator with a shape that is in close contact with a heater with a complicated shape, such as a light source, which is a high heat generator of a projector, the radiator with a complex shape must be processed according to the shape of the light source. There was also a problem that it could not be easily manufactured because it had to be done.
[0008]
The present invention has been made in view of such a problem, and an object of the present invention is to cool an exothermic unit by collecting heat of the exothermic unit in a non-contact manner and radiating the heat in an electronic device. An object of the present invention is to provide a heat radiating device having a simple structure and easy manufacture.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, according to the present invention, according to the first aspect of the present invention, in a heat radiating device for absorbing and radiating heat from a heating element, one or more heat pipes are provided in a non-contact manner with a heating surface of the heating element. Arranged to cover, one or more radiant heat absorbers combining heat pipes and fins as heat sinks to the one or more heat pipes are joined to any location, attached to one or more radiant heat absorbers The fins are arranged such that radiant heat radiated from the heat source is less likely to leak from the surface facing the heat source of the radiant heat absorbing device to the opposite surface. With such a configuration, even when the heat source is not in contact with the heat source, the heat can be absorbed from the heat source and radiated.
[0010]
According to the invention of claim 2, a plate-type pore heat pipe is used as the heat pipe. With such a configuration, it is possible to suppress deterioration of the cooling efficiency due to the arrangement posture of the cooling device.
[0011]
According to a third aspect of the present invention, the radiating fin device and the fan are combined. With such a configuration, the radiating fin device can be air-cooled, and a more efficient cooling device can be configured.
[0012]
According to a fourth aspect of the present invention, a surface of the heat dissipation device that receives radiant heat from a heat source is made black. With such a configuration, the radiant heat from the heat source can be more efficiently absorbed by the radiator.
[0013]
According to a fifth aspect of the present invention, a heat absorbing fin is mounted on a surface of the heat dissipation device that receives radiant heat from a heat source. With such a configuration, the radiant heat from the heat source can be more efficiently absorbed by the radiator.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. First, FIGS. 1 and 2 show an overall configuration of a heat radiation device according to a first embodiment of the present invention.
FIGS. 1, 2, and 3 are a diagram, a side view, and a top view, respectively, of a heat absorbing surface of an embodiment when the cooling device of the present invention is applied to a semiconductor device. 1, 2, and 3, 201 and 202 are plate-type pore heat pipes.
[0015]
Here, the plate-type pore heat pipe will be described. It is constituted by a meandering pore tunnel plate type heat pipe or a parallel plate type pore heat pipe as shown in FIGS. These plate-type pore heat pipes will be described taking a meandering plate-type pore heat pipe as an example. Here, the pore heat pipe is a heat pipe having the following characteristics (see Japanese Patent Application Laid-Open No. 4-190090).
(1) Both ends of the thin tube (heat medium passage) are connected to each other in a freely circulating manner and are sealed.
(2) One part of the thin tube is a heat receiving part, and another part is a heat radiating part.
(3) The heat receiving portion and the heat radiating portion are alternately arranged, and the narrow tube meanders between both portions.
(4) A two-phase condensable working fluid is sealed in the thin tube.
(5) The inner wall of the thin tube has a diameter smaller than the maximum fluid diameter that allows the working fluid to circulate or move while always closing the inside of the tube.
By using such a thin tube heat pipe, heat can be transferred regardless of the mounting posture of the thin tube heat pipe to the heating element.
[0016]
The plate-shaped meandering thin tube heat pipe uses a porous flat tube made of a light metal such as aluminum or magnesium. The porous flat tube 51 has a flat outer shape as a whole, and has a large number of through-holes 57a and 57b arranged in parallel inside by extrusion molding. The partition walls 57 on the end surfaces of the pores 57a and 57b are cut off every other line by a predetermined depth, and the other end surfaces are cut off by one line at a time. Each pore communicates at the end to form a series of meandering tunnels (heat medium passages) in which the working fluid is sealed.
[0017]
Next, an embodiment in which the cooling device of the present invention is applied to the electronic board 200 on which the high heat generation semiconductor element 203 is mounted will be described.
One plate-type pore heat pipe 201 is wound so as to form three fin mounting portions, and the corrugated fins 215, 217, and 218 are arranged at the three fin mounting portions, thereby forming the radiant heat absorbing device 205. Have been. As can be seen from FIG. 2, the corrugated fins 215, 217 and 218 are provided so that the radiant heat from the high heat generating semiconductor element 203 can be easily absorbed without being transmitted. Are arranged obliquely.
A plate-type thin tube heat pipe 202 for transferring the absorbed radiant heat to the radiator is attached to the radiant heat absorbing device 205 by soldering or a heat conductive seal. In the present embodiment, the heat is transferred and radiated by using the plate-type thin tube heat pipe 202. However, the radiant heat absorbing device 205 alone may constitute a heat radiating device, or the radiant heat absorbing device 205 may be provided with a high heat generating semiconductor element 203. Alternatively, a heat radiator can be configured by directly attaching a fan to the opposite surface.
Here, the absorptivity of the radiant heat from the high heat generating semiconductor element 203 can be increased by painting black the portions of the plate-type pore heat pipe 202 and the radiant heat absorbing device 205 to which the radiant heat from the high heat generating semiconductor element 203 is applied.
Further, in the present embodiment, an example was shown in which the corrugated fins 215, 217 and 218 were attached diagonally, but the corrugated fins 215, 217 and 218 were used as the fins, but as shown in FIG. 6 and FIG. The radiant heat can be absorbed by disposing the member 227 in an oblique manner like a blind. In other words, a fin structure is used in which the radiant heat from the high heat generating semiconductor element 203 does not leak from the surface of the radiant heat absorbing device 205 on which the radiant heat from the high heat generating semiconductor element 203 is applied to the opposite surface. Thus, the effect of the present invention can be expected.
Further, in the present embodiment, one radiation heat absorbing device 205 is used, but by using a plurality of radiation heat absorbing devices, the heat radiation effect can be further improved. For example, a plurality of radiant heat absorbing devices may be used in a stack, or a plurality of radiant heat absorbing devices may be used to cover a plurality of surfaces with respect to a heat source to radiate heat.
[0018]
Next, a second embodiment of the present invention will be described with reference to FIG. The present invention shows an embodiment applied to a high heat generating element having no flat portion such as a high heat generating light bulb and a high light emitting element used for home lighting.
The radiant heat absorbing device 305 in the present embodiment has the same configuration as the radiant heat absorbing device in the first embodiment, and a description thereof will be omitted.
One end of the plate-type pore heat pipe 301 is bent so as to cover the light source 303 and is arranged in a non-contact manner. A radiant heat absorbing device 305 is attached to the other end of the plate-type pore heat pipe 301 by soldering, brazing, or the like. With such an arrangement, the radiant heat from the light source 303, which has become hot, can be absorbed by the plate-type pore heat pipe 301, the heat can be transported to the radiant heat absorber 305, and the heat can be radiated by the radiant heat absorber 305. .
Further, the radiant heat absorbing device 305 itself absorbs the radiant heat from the light source 303 by the fins, so that the heat radiation effect is improved.
Further, by applying black to a portion to which the radiant heat from the light source 303 is applied, the absorption rate of the radiant heat from the light source can be increased.
[0019]
FIG. 9 shows the radiator of FIG. 8 with fins 401 attached. (Third Embodiment) By adopting such a structure, the fin portion can absorb and radiate the radiant heat, and the heat radiation efficiency can be improved.
[0020]
【The invention's effect】
In order to solve the above problem, according to the present invention, according to the first aspect of the present invention, in a heat radiating device for absorbing and radiating heat from a heating element, one or more heat pipes are provided in a non-contact manner with a heating surface of the heating element. It is arranged so as to cover, and one or more heat radiating fin devices are joined to the one or more heat pipes as a heat radiating part at an arbitrary position, and the fins attached to the one or more heat radiating fin devices from the heat source. By arranging diagonally so that radiated radiant heat is less likely to leak from the surface facing the heat source of the heat dissipating fin device to the opposite surface, even without contact with the heat source, it absorbs heat from the heat source and dissipates heat. Can be.
[0021]
According to the second aspect of the present invention, by adopting a configuration using a plate-type pore heat pipe as the heat pipe, it is possible to suppress the deterioration of the cooling efficiency due to the arrangement posture of the cooling device.
[0022]
According to the third aspect of the present invention, by combining the radiating fin device and the fan, the radiating fin device can be air-cooled, and a more efficient cooling device can be configured.
[0023]
According to the fourth aspect of the present invention, since the surface of the heat radiating device that receives the radiant heat from the heat source is made black, the radiant heat from the heat source can be more efficiently absorbed by the heat radiating device.
[0024]
According to a fifth aspect of the present invention, a heat absorbing fin is mounted on a surface of the heat dissipation device that receives radiant heat from a heat source. With such a configuration, the radiant heat from the heat source can be more efficiently absorbed by the radiator.
[Brief description of the drawings]
FIG. 1 is a diagram of a heat absorbing surface according to a first embodiment of the present invention.
FIG. 2 is a side view of the first embodiment of the present invention.
FIG. 3 is a top view of the first embodiment of the present invention.
FIG. 4 is a plate type meandering thin tube heat pipe.
FIG. 5 is a plate-type parallel pore heat pipe.
FIG. 6 is a diagram of a heat absorbing surface of another radiant heat absorbing device according to the first embodiment of the present invention.
FIG. 7 is a front view of another radiant heat absorbing device according to the first embodiment of the present invention.
FIG. 8 is a side view of a second embodiment of the present invention.
FIG. 9 is a plan view of a third embodiment of the present invention.
[Explanation of symbols]
101, 102, 201, 202 Plate-type pore heat pipe 200 Projector 205 Projector housing 203, 325 Light source 210, 313, 315 Radiating fin device 215, 217, 218, 301, 303, 305, 307, 309, 311 Corrugated fins 221 and 321 fans

Claims (5)

In a heat radiating device for absorbing and radiating heat from a heat generating element, one or more heat pipes are arranged so as to cover a heat generating surface of the heat generating element in a non-contact manner, and heat is applied to the single or plural heat pipes as a heat absorbing portion. One or more radiant heat absorbing devices combining pipes and fins are joined to an arbitrary location, and fins attached to one or more radiant heat absorbing devices are exposed to radiant heat radiated from a heat source facing the heat source of the radiant heat absorbing device. A heat radiating device, wherein the heat radiating device is arranged so as to be hardly leaked from the surface to the opposite surface. The heat radiator according to claim 1, wherein a plate-type pore heat pipe is used as the heat pipe. The heat dissipation device according to claim 1, wherein the heat dissipation fin device and a fan are combined. The heat radiating device according to claim 1, wherein a surface of the heat radiating device that receives radiant heat from a heat source is black. The heat radiating device according to claim 1, wherein a heat absorbing fin is mounted on a surface of the heat radiating device that receives radiant heat from a heat source.

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