JP2004301658A - Substrate inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the number of wires on a probe frame in a substrate inspection device. <P>SOLUTION: This substrate inspection device is used for inspecting a panel 2a on a substrate by impressing an inspection signal on an electrode 2c formed on the substrate 2. This device is equipped, on the same probe frame 1a, with a probe 1b electrically connected to the electrode 2c to impress the inspection signal on the electrode and at least one signal forming circuit 1c for forming the inspection signal sent to the probe 1b. The probe frame 1a is mounted with the circuits (signal forming circuits) for forming the inspection signal. This makes it possible to reduce the number of wires on the probe frame 1a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate inspection device used for a flat panel display such as a liquid crystal display and an organic EL display.
[0002]
[Prior art]
In a manufacturing process of a flat panel display panel, a plurality of panels including a pattern of a TFT array are usually formed on a mother glass substrate, and each panel is cut out from the mother glass substrate. In manufacturing and inspecting this flat panel display, it is necessary to evaluate the characteristics of the TFTs and pixels in the state of the mother glass substrate before separating each panel from the mother glass substrate.
[0003]
In a thin film transistor array substrate (hereinafter, referred to as a TFT array substrate), thin film transistors (TFT arrays) are arranged in a matrix on each panel of a mother glass substrate. A panel using a TFT array using amorphous silicon and a panel using polysilicon are known.
[0004]
In a panel using polysilicon, a driving circuit for driving a panel by supplying a driving signal to a TFT array on a glass substrate can be formed.
[0005]
FIG. 6 is a diagram schematically illustrating a TFT array substrate, and FIG. 7 is a diagram schematically illustrating a probe frame of a conventional TFT array inspection apparatus.
[0006]
In FIG. 6, a plurality of panels 2a including a TFT array 2b are formed on a substrate 2 formed of a glass substrate or the like. Each TFT array 2b includes a plurality of thin film transistors (not shown) arranged in a matrix, and the thin film transistors are driven by signals input from the scanning signal electrode terminal 2ca and the video signal electrode terminal 2cb.
[0007]
As a device for inspecting each panel 2a formed on the substrate 2, a substrate inspection device is known. 7, the board inspection apparatus includes a prober 11 electrically connected to the board 2. The prober 11 includes probes 11 ba and 11 bb electrically connected to the scanning signal electrode terminal 2 ca and the video signal electrode terminal 2 cb of the board 2. Prepare. An inspection signal is supplied to the probes 11ba and 11bb from an inspection device (not shown) via the connector 11c and the wiring 11d, and thereby a short circuit between the gate and the source, a point defect, a disconnection, and the like are checked.
[0008]
Patent Document 1 is known as an example of such a TFT array inspection device.
[0009]
[Patent Document 1]
JP 2001-272643 A
[Problems to be solved by the invention]
A panel in which a driver circuit is formed over a substrate is provided with a large number of signal lines because it is necessary to input and output different signals through electrode terminals. Therefore, in order to perform a board inspection using a probe, it is necessary to supply a large number of inspection signals to the probe frame, and it is necessary to provide a large number of wirings on the probe frame.
[0011]
Usually, when a plurality of pulses are formed on a substrate, only a limited interval is allowed between the panels in order to form the panels efficiently. Therefore, many wires must be provided in a limited space on the probe frame, and there is a problem in the wiring space and connection. The problem of the wiring space and connection is not limited to the wiring on the probe frame, but also to the wiring connecting the probe frame and the external device, and a large number of wiring is required between the external device and the connector on the probe frame side. .
[0012]
It is also conceivable to reduce the number of wirings by connecting a large number of wirings in a cascade connection between the panels. There is a problem that normal panel operation becomes uneasy.
Therefore, an object of the present invention is to solve the above-mentioned conventional problems and reduce the number of wires on a probe frame.
[0013]
[Means for Solving the Problems]
The present invention is a substrate inspection apparatus that inspects a panel on a substrate by applying an inspection signal to an electrode formed on the substrate, and a probe that is electrically connected to the electrode and applies an inspection signal to the electrode. At least one signal forming circuit that forms a test signal to be sent to a probe is provided on the same probe frame, and the circuit that forms the test signal is mounted on the probe frame, thereby reducing the number of wires on the probe frame. be able to. The signal forming circuit is not limited to being provided on the probe frame, but may be provided on a stage or a pallet.
[0014]
The signal forming circuit forms a test signal based on a test command received from the outside of the probe frame, sends the test signal to the electrode on the board side through the probe, and tests the panel on the board. On the probe frame, the signal forming circuit is provided in the probe frame by performing the wiring only between the corresponding probes, compared to the conventional configuration in which the wiring is performed between all the probes. The number of wirings can be reduced.
[0015]
Further, since the signal forming circuit receives only the inspection command from the outside, the number of wirings connected to the outside can be reduced as compared with the conventional configuration in which the inspection signal for all the probes is received from the outside.
[0016]
One embodiment of the present invention includes the same number of signal forming circuits as the panels included in the substrate, and each signal forming circuit supplies a test signal to each of the corresponding panels.
[0017]
According to another aspect of the present invention, the signal forming circuit supplies a test signal to an arbitrary plurality of panels on the substrate. In this aspect, one signal forming circuit may be provided on the probe frame, and the inspection signal may be supplied from this signal forming circuit to all the panels on the substrate. And the number of signal lines can be reduced.
[0018]
The external device includes a power supply unit for supplying a voltage for driving the TFT array, a detecting unit for detecting a signal of the TFT array, and an inspecting unit for inspecting the TFT array for short-circuit, point defect, disconnection, and the like based on the detection signal. It can be provided with a configuration.
[0019]
According to the present invention, by mounting the signal forming circuit on the probe frame, the board inspection can be performed only by inputting / outputting a command for driving the signal forming circuit from the outside of the probe frame. There is no need to input a large number of test signals to be supplied.
[0020]
According to the present invention, the noise of the signal supplied to the panel itself can be reduced by mounting the signal forming circuit on the probe frame.
[0021]
According to the present invention, since the inspection signal is supplied to each panel from the signal forming circuit, interference between the panels can be prevented, and the inspection signal can be supplied without being affected by the defective panel. .
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0023]
FIG. 1 is a schematic diagram showing each component part separately for explaining a TFT array inspection apparatus of the present invention.
[0024]
The substrate 2 is an inspection target to be inspected by the liquid crystal substrate inspection device 10, and a plurality of panels 2 a on which the TFT array 2 b is formed are formed on the substrate 2. The layout of the TFT array 2b formed on the substrate 2 is variously set according to, for example, the size and specifications of the liquid crystal panel. In the TFT array 2b on the substrate 2, thin film transistors are formed in a matrix, and signal electrode terminals 2c (for example, scanning signal electrode terminals and video signal electrode terminals) for driving each thin film transistor are formed. In FIG. 1, the signal electrode terminal 2c also serves as an electrode for electrically connecting to the outside of the substrate 2, but another electrode may be provided.
[0025]
The liquid crystal substrate inspection apparatus 10 of the present invention includes a prober 1 that is electrically connected to the signal electrode terminal 2c of the substrate 2 and supplies an inspection signal to the signal electrode terminal 2c. The prober 1 includes a prober frame 1a and a probe pin (not shown) that is electrically connected to the signal electrode terminal 2c of the liquid crystal substrate 2. The number and arrangement of the probe pins are provided corresponding to the signal electrode terminals 2 c of the substrate 2.
[0026]
The substrate 2 is arranged on a pallet 3, and the prober frame 1 a is arranged on the substrate 2. The electrical connection between the signal electrode terminals 2c and the probe pins of the probe 1b is performed between the substrate 2 and the prober frame 1a, and the prober frame 1a is provided between the prober frame 1a and the pallet 3. This is performed by a connector (not shown) and a connector 4a provided on the pallet 3. In FIG. 1, only the pallet-side connector 3a provided on the pallet 3 is shown, and the connector on the prober frame 1a side is omitted.
[0027]
Further, the pallet 3 is placed on the stage 4 and can be moved freely. The connection between the pallet 3 and the stage 4 is performed by a pallet-side connector 3b provided on the pallet 3 side and a stage-side connector 4a provided on the stage 4 side.
[0028]
Next, the configuration of a probe included in the substrate inspection apparatus of the present invention will be described with reference to FIG.
[0029]
FIG. 2B illustrates an example of a substrate, and FIG. 2A illustrates an example of a configuration of a probe corresponding to the substrate. In FIG. 2B, four panels 3a1 to 3a4 are formed on a substrate 2, and each of the panels 3a1 to 3a4 has a TFT array 2b and a signal electrode terminal 2c (for example, a scanning signal) for driving the TFT array 2b. The electrode terminal 2ca and the video signal electrode terminal 2cb) are formed.
[0030]
In FIG. 2A, a probe frame 1a of the prober 1 includes a probe 1b that contacts each signal electrode terminal 2c and supplies a signal. In the board inspection apparatus of the present invention, a signal forming circuit 1c is provided on the probe frame 1a. A wiring 1d is provided between the signal forming circuit 1c and the probe 1b, and the signal forming circuit 1c and the outside are connected by the connectors 3a and 3b of the pallet 3 and the connector 4a of the stage 4, for example. .
[0031]
The signal forming circuit 1c is a circuit that receives a test command from outside the probe frame 1a and forms a test signal based on the test command, sends the formed test signal to the signal electrode terminal 2c on the substrate side through the probe 1b, The panel 2a on the substrate 2 is inspected. When the inspection command is, for example, a signal encoded according to the inspection content, the signal forming circuit 1c converts the encoded signal to form an inspection signal having a pattern corresponding to each inspection content. The signal conversion from the inspection command to the inspection signal is performed, for example, by storing the correspondence between the inspection command and the inspection signal in the signal forming circuit 1c, and checking the inspection signal corresponding to the inspection command input based on the correspondence. Is read out and an inspection signal is formed on the probe 1b based on this pattern. The signal forming circuit 1c sends the formed inspection signal to the probe 1b via the wiring 1d. Since the probe 1b and the signal electrode terminal 2c are in electrical contact with each other, an inspection signal is supplied to the TFT array 2b of each panel 2a on the substrate 2, and the characteristic inspection of the TFT array 2b and the pixels is performed. .
[0032]
The signal forming circuit 1c may be a hardware circuit having a function of forming an inspection signal from an inspection command, a dedicated circuit such as a circuit for executing this function by software, or a panel driving IC for driving each panel. And any other circuit configuration.
[0033]
The signal forming circuit 1c can be arranged on either the upper surface or the lower surface of the probe frame 1a, or can be embedded inside the probe frame 1a. Further, the signal forming circuit 1c may be arranged on the pallet 3 or the stage 4. Further, the configuration may be such that the probe frame and the pallet, the probe frame and the stage, and the like are arranged on any combination of the probe frame, the pallet, and the stage.
[0034]
The correspondence between the signal forming circuit and the panel is not limited to one-to-one as shown in FIG.
[0035]
FIG. 3 is a configuration example in which one signal forming circuit is associated with a plurality of panels, and shows an example in which an inspection signal formed by one signal forming circuit is supplied to two panels. In FIG. 3, the signal forming circuit 1c1 is connected to the probes corresponding to the two panels via wiring, and the signal forming circuit 1c2 is connected to the probes corresponding to the other two panels via the wiring. .
[0036]
The number of panels supplied by the signal forming circuit can be set arbitrarily, and although not shown, one signal forming circuit provided on the probe frame is connected to probes corresponding to all panels on the board via wiring. Connection.
[0037]
Next, the effect of providing the signal forming circuit on the probe frame in the board inspection apparatus of the present invention will be described with reference to FIGS.
[0038]
FIG. 4 is a diagram for explaining a signal state by the signal forming circuit of the board inspection apparatus of the present invention. In FIG. 4, in the board inspection apparatus of the present invention, an inspection command is input from the outside to the signal forming circuit 1c (1c1 to 1c4) provided in the probe frame 1a via the connector 1e. Each signal forming circuit 1c forms a test signal based on the input test command, and sends the formed test signal to each probe 1b (1b1 to 1b4).
[0039]
Each probe 1b of the probe frame 1a is electrically connected to a signal electrode terminal 2c (2c1-2c4) provided on the substrate 2, receives an inspection signal, and supplies it to each panel 2a (2a1-2a4).
[0040]
On the other hand, in the conventional configuration shown in FIG. 5, an inspection signal is externally input to the probe frame 11a via the connector 11e. In the probe frame 11a, the wirings 11d for transmitting the inspection signals are prepared by the number of the inspection signals to be supplied to the panel formed on the substrate 3. The wiring 11d sends the input inspection signal to each probe 1b (1b1 to 1b4).
[0041]
Each probe 1b of the probe frame 1a is electrically connected to a signal electrode terminal 2c (2c1-2c4) provided on the substrate 2, receives an inspection signal, and supplies it to each panel 2a (2a1-2a4).
[0042]
According to the board inspection apparatus of the present invention, the signal is sent from the outside to the probe frame 1a in the form of an inspection command, and the signal forming circuit 1c (1c1 to 1c4) is sent in the probe frame 1a in the signal form of the inspection command. Can be Since the inspection command can be in the form of, for example, an encoded signal, the number of signal lines used for transmission can be reduced.
[0043]
Therefore, it is difficult to provide the same number of wirings as the number of inspection signals as in the related art in a probe frame having a limited wiring space, but in the substrate inspection apparatus of the present invention, a signal forming circuit is arranged on the probe frame. Thus, the wiring can be easily formed, and the noise of the signal supplied to the panel can be reduced.
[0044]
In addition, by supplying a signal from each signal forming circuit to each panel, wiring connecting the panels can be eliminated, and interference between the panels can be prevented. Further, since each panel has an independent configuration with respect to the inspection signal, the signal can be supplied without being affected by the defective panel.
[0045]
Also, the number of signal lines for the probe frame can be reduced.
[0046]
【The invention's effect】
As described above, according to the present invention, the number of wires on a probe frame can be reduced.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing components separated to explain a TFT array inspection apparatus of the present invention.
FIG. 2 is a diagram for explaining a configuration of a probe included in the substrate inspection apparatus of the present invention.
FIG. 3 is a diagram illustrating a configuration example in which one signal forming circuit is associated with a plurality of panels.
FIG. 4 is a diagram for explaining a signal state by a signal forming circuit of the board inspection apparatus of the present invention.
FIG. 5 is a diagram for explaining signal states of a conventional board inspection apparatus.
FIG. 6 is a diagram for schematically explaining a TFT array substrate.
FIG. 7 is a view schematically illustrating a probe frame of a conventional TFT array inspection apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Prober, 1a ... Probe frame, 1b, 1b1-1b4 ... Probe, 1c, 1c1-1c4 ... Signal formation circuit, 1d ... Wiring, 1e ... Connector, 2 ... Board, 2a, 2a1-2a4 ... Panel, 2b ... TFT Array, 2c, 2c1, 2c2 ... signal electrode terminal, 3 ... pallet, 3a, 3b ... connector, 3c1-3c4 ... signal electrode terminal, 4 ... stage, 4a ... connector, 10 ... board inspection device, 11 ... probe frame, 11b , 11b1 to 11b4 ... probe, 11d ... wiring, 11e ... connector.

Claims (3)

A board inspection apparatus for inspecting a panel on a substrate by applying an inspection signal to an electrode formed on the substrate,
A probe electrically connected to the electrode and applying a test signal to the electrode;
At least one signal forming circuit for forming a test signal to be sent to the probe,
A substrate inspection apparatus provided on at least one of the same probe frame, stage, and pallet. 2. The board inspection apparatus according to claim 1, wherein the signal forming circuit supplies an inspection signal to each corresponding panel. The substrate inspection apparatus according to claim 1, wherein the signal forming circuit supplies an inspection signal to a plurality of arbitrary panels on the substrate.

Images