JP2004296631A - Substrate fixing apparatus and substrate fixing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate fixing apparatus and a substrate fixing method capable of ensuring satisfactory adhesiveness of film-like substrate to a lower supporting member, and maintaining stable mounting quality. <P>SOLUTION: In the substrate fixing apparatus, a film-like substrate is supported from downward by a lower supporting member 5. Prior to a first vacuum suction process for vacuum-sucking the substrate 13 by sucking grooves 8a formed on a lower supporting surface 7a at positions corresponding to a component mounting portion in the substrate 13, a second vacuum sucking process of vacuum-sucking the substrate by sucking grooves 8b formed outside of the grooves 8a is performed. By doing this, a tensile stress in an outside direction is applied to the substrate 13, and the component mounting portion of the substrate 13 is sucked and held in a state that deformation in vertical directions of the substrate is corrected, and the substrate can be stuck closely on the member 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate fixing device and a substrate fixing method for receiving and fixing a film-shaped substrate in a component mounting apparatus, for example.
[0002]
[Prior art]
In the component mounting apparatus, a board fixing device for fixing the position and posture of the board at a mounting operation position for mounting components on the board is used. In this substrate fixing device, it is necessary to position the substrate in the horizontal direction, correct the warpage of the substrate, and properly align the upper surface. Conventionally, as a method of this surface alignment, a method is known in which a lower receiving member having an upper surface provided with a suction hole supports the lower surface of the substrate, and the substrate is vacuum-sucked and held by the suction hole. 1).
[0003]
[Patent Document 1]
JP-A-11-17397
[Problems to be solved by the invention]
However, the above-mentioned conventional method has the following difficulties when targeting a thin film-shaped substrate. Since the film-shaped substrate has extremely low rigidity and is easily bent, the substrate may be supplied to the mounting process with the entire substrate being warped or partially unevenly deformed in the previous process. In such a case, even if the substrate is placed on the lower receiving member and vacuum suction is performed from the lower surface side, the suction force is hard to reach the entire surface of the substrate because the rigidity of the substrate is extremely small.
[0005]
That is, the portion sucked by the suction hole or the suction groove is attracted to the lower receiving surface, but the other portion remains floating from the lower receiving surface, so that good adhesion of the substrate cannot be secured. If such a floating of the substrate occurs at a component mounting portion, stable component operation is not performed, resulting in a decrease in mounting quality.
[0006]
In view of the above, the present invention provides a substrate fixing device and a substrate fixing method capable of securing good adhesion to a lower receiving member and maintaining stable mounting quality for a film-like substrate. Aim.
[0007]
[Means for Solving the Problems]
2. The substrate fixing device according to claim 1, wherein the substrate fixing device receives the film-shaped substrate on which components are mounted from below at a mounting operation position and fixes the film-shaped substrate. A lower receiving member provided with a lower receiving surface that abuts on the lower receiving surface, and a second receiving member that is formed on the lower receiving surface at a position corresponding to the component mounting portion on the substrate and sucks and holds the component mounting portion when receiving the substrate. And a second suction groove formed on the lower receiving surface outside the first suction groove to apply a tension outward from the component mounting portion to the substrate by sucking the substrate when receiving the substrate. And vacuum suction means for performing vacuum suction at different timings from the first suction groove and the second suction groove.
[0008]
3. The substrate fixing method according to claim 2, wherein the film-shaped substrate on which the components are mounted is fixed by receiving the film-shaped substrate from below at a mounting operation position, wherein the substrate is disposed at the mounting operation position and is mounted on an upper surface. A substrate loading step of loading and placing the substrate on a lower receiving member provided with a lower receiving surface that abuts on the lower receiving surface; and forming the substrate on the lower receiving surface at a position corresponding to a component mounting portion of the substrate. A first vacuum suction step of performing vacuum suction from the first suction groove provided, and a second vacuum suction step of performing vacuum suction from a second suction groove formed on the lower receiving surface outside the first suction groove. And a step of performing a second vacuum suction step prior to the first vacuum suction step, thereby applying an outward tension to the substrate to correct vertical deformation of the substrate, Suction holding of the component mounting area on the board Fixed Te.
[0009]
According to the present invention, the first suction groove formed at the position corresponding to the component mounting portion on the substrate on the lower receiving surface which comes into contact with the substrate and receives the lower surface, and the first suction groove formed outside the first suction groove. Prior to the first vacuum suction step of vacuum-suctioning from the first suction groove and sucking and holding the component mounting portion, vacuum suction is performed from the second suction groove and the substrate is outwardly drawn to the substrate. By applying the tension to correct the vertical deformation of the substrate, even when targeting a film-shaped substrate, it ensures good adhesion to the lower receiving member and ensures stable mounting quality. Can be kept.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a substrate fixing device according to one embodiment of the present invention, FIG. 2 is a plan view of a lower receiving member of the substrate fixing device of one embodiment of the present invention, and FIG. 3 is one embodiment of the present invention. FIG. 4 is an operation explanatory view of the substrate fixing device according to the embodiment of the present invention.
[0011]
First, the structure of the substrate fixing device will be described with reference to FIG. This substrate fixing device is placed at the mounting position of a component mounting device for mounting components such as electronic components on a substrate, and receives a thin and flexible substrate such as a film-like flexible substrate made of a material such as polyimide from below. It has a function of fixing. In FIG. 1, a base plate 4 is mounted on a moving table 1 composed of an X table 2 and a Y table 3, and a central portion of the upper surface of the base plate 4 is provided with a lower plate for receiving a substrate and holding a height position. A receiving member 5 is provided. The lower receiving member 5 has a shape in which a convex portion 7 is provided on the upper surface of a rectangular block 5a, and the upper surface of the convex portion 7 is a lower receiving surface 7a that comes into contact with the lower surface of the substrate to receive the lower portion.
[0012]
On both sides of the lower receiving member 5 on the upper surface of the base plate 4, cylinders 9 are disposed in a vertical posture, and rods 9 a of the cylinders 9 are connected to transport rails 10 disposed in the X direction. On the transport rail 10, the carrier 11 holding the thin film-shaped substrate 13 is transported by a transport mechanism (not shown), and is positioned at the mounting work position.
[0013]
The carrier 11 is a frame-shaped member provided with an opening 11a at the center of a rectangular plate made of a thin plate. In a state where the substrate 13 is held by the carrier 11, only the both side end portions of the lower surface of the substrate 13 are lowered by the carrier 11. Supported by The component mounting portion 13a of the substrate 13 is located at the center of the opening 11a, and its lower surface is exposed downward.
[0014]
A board positioning pin 12 is provided upright at a corner of the carrier 11. The board 13 is conveyed while being positioned by the board positioning pins 12, and in this mounting work position, a component 14 such as an electronic component is mounted on a component mounting portion 13 a of the board 13 by a mounting head (not shown). . The transfer rail 10 serves as a board transfer unit that transfers and positions the board 13.
[0015]
By driving the cylinder 9, the transport rail 10 moves up and down while being guided by the guide member 10a. The transport rail 10 serves as a support for supporting both sides of the carrier 11 from below, and the cylinder 9 serves as an elevating means for elevating and lowering the substrate 13 held by the carrier 11 with respect to the lower receiving member 5. ing. When the transport rail 10 is lowered, the lower surface of the substrate 13 contacts the lower receiving surface 7a, and the position in the vertical direction is fixed.
[0016]
Next, the lower receiving member 5 will be described with reference to FIGS. As shown in FIG. 2, suction grooves 8a and 8b for sucking a substrate are provided on the lower receiving surface 7a. The suction groove 8a is a first suction groove, and is formed at a position corresponding to each component mounting portion 13a on the substrate 13 so as to surround each component mounting portion 13a. The suction groove 8b is a second suction groove, and is formed on the lower receiving surface 7a outside the suction groove 8a so as to surround the whole.
[0017]
Suction holes 15a, 15b provided inside the lower receiving member 5 communicate with the suction grooves 8a, 8b, respectively. The suction holes 15a, 15b are connected to a suction switching valve 18 via a pipe member 17. I have. Further, the suction switching valve 18 is connected to a vacuum suction source 19, and by switching the suction switching valve 18 while driving the vacuum suction source 19, it is possible to selectively perform vacuum suction from the suction grooves 8a and 8b. It has become.
[0018]
Therefore, by switching the suction switching valve 18 at an arbitrary timing, vacuum suction can be performed at different timings from the suction grooves 8a and 8b. By vacuum suction from the suction groove 8a, the component mounting portion 13a is suction-held at the time of receiving the substrate. By vacuum suction from the suction groove 8b, a tension acts on the substrate 13 outward from the component mounting portion 13a as described later. The suction switching valve 18 and the vacuum suction source 19 are vacuum suction means for performing vacuum suction at different timings from the first suction groove and the second suction groove.
[0019]
This substrate fixing device is configured as described above. Next, with reference to FIG. 4, a description will be given of a substrate fixing method in which a film-like substrate on which components are mounted is received from below at a mounting work position and fixed. I do. First, the substrate 13 held in a state of being positioned on the carrier 11 by the substrate positioning pins 12 is loaded onto the lower receiving member 5 arranged at the mounting work position, and as shown in FIG. The substrate 13 is placed on the substrate (substrate loading step). At this time, since the substrate 13 has extremely low rigidity and is easily bent, the substrate 13 is carried in with the entire surface being warped or partially unevenly deformed in the previous step.
[0020]
Next, the vacuum suction source 19 is driven, the suction switching valve 18 is switched to the suction groove 8b side, and vacuum suction is performed from the suction groove 8b as shown in FIG. 4B (second vacuum suction step). Thereby, the substrate 13 is deformed so as to be recessed in the suction groove 8b. This deformation causes a tension in the in-plane direction of the substrate 13 to act on the substrate 13, but since the displacement of the substrate 13 in the in-plane direction is restrained by the substrate positioning pins 12, this tension is reduced by an arrow a in FIG. As shown in (1), it acts only in the outward direction from the center.
[0021]
As a result, the unevenness of the substrate 13 in the loaded state is corrected by the tension, and the central portion of the substrate 13 is in a planar state. Thereafter, the suction switching valve 18 is switched to the suction groove 8a side, and vacuum suction is performed from the suction groove 8a as shown in FIG. 4C (first vacuum suction step). As a result, the substrate 13 around the component mounting portion 13a is vacuum-sucked and adheres to the lower receiving surface 7a.
[0022]
That is, in the substrate fixing method described in the present embodiment, the above-described second vacuum suction step is performed prior to the first vacuum suction step, so that outward tension is applied to the substrate 13 so that the substrate The component mounting portion 13a of the substrate 13 is suction-held and fixed while the vertical deformation of the substrate 13 is corrected. Accordingly, even when a film-shaped substrate that is easily bent is targeted, adhesion to the lower receiving surface 7a of the substrate 13 can be ensured, and stable mounting quality can be maintained.
[0023]
【The invention's effect】
According to the present invention, the first suction groove formed at the position corresponding to the component mounting portion on the substrate on the lower receiving surface which comes into contact with the substrate and receives the lower surface, and the first suction groove formed outside the first suction groove. Prior to the first vacuum suction step of sucking and holding the component mounting portion by vacuum suction from the first suction groove, vacuum suction is performed from the second suction groove to the substrate so as to be directed outward. The tension is applied to correct the vertical deformation of the board, so even when targeting a film-shaped board, good adhesion to the lower receiving member is ensured and stable mounting Quality can be maintained.
[Brief description of the drawings]
FIG. 1 is a perspective view of a substrate fixing device according to one embodiment of the present invention; FIG. 2 is a plan view of a lower receiving member of the substrate fixing device according to one embodiment of the present invention; FIG. FIG. 4 is a partial cross-sectional view of a lower support member of the substrate fixing device according to the embodiment.
5 Lower receiving member 7a Lower receiving surfaces 8a and 8b Suction groove 11 Carrier 13 Substrate 14 Parts 18 Suction switching valve 19 Vacuum suction source

Claims (2)

What is claimed is: 1. A substrate fixing device for receiving and fixing a film-like substrate on which components are mounted from below at a mounting operation position, wherein the lower receiving surface is disposed at the mounting operation position and abuts on the upper surface and receives the substrate. A lower receiving member, a first suction groove formed on the lower receiving surface at a position corresponding to the component mounting portion of the board, and suction-holding the component mounting portion at the time of lower receiving the substrate; and the lower receiving surface. A second suction groove formed outside of the first suction groove, the second suction groove being adapted to apply a tension outward from a component mounting portion to the substrate by sucking the substrate when receiving the substrate; A substrate fixing device, comprising: vacuum suction means for performing vacuum suction at different timings from the groove and the second suction groove. What is claimed is: 1. A method of fixing a film-like substrate on which components are mounted, by receiving the film substrate from below at a mounting operation position and fixing the film substrate, wherein the lower receiving surface is disposed at the mounting operation position and abuts against the substrate on the upper surface to receive the lower surface. A substrate loading step of loading and placing the substrate on a lower receiving member provided with a substrate, and vacuum suction from a first suction groove formed on the lower receiving surface at a position corresponding to a component mounting portion of the substrate. A first vacuum suction step of performing vacuum suction from a second suction groove formed outside the first suction groove on the lower receiving surface, wherein the first vacuum suction step is performed. By performing the second vacuum suction step prior to the suction step, the tension is applied to the substrate in the outward direction to correct the vertical deformation of the substrate, and the component mounting portion of the substrate is sucked and held. A base characterized by being fixed Fixing method.

Images