JP2004287518A - Manufacturing method of ic card, and manufacture device for ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method preventing a crack in a cross section of an IC card when carrying out punching by a punch and a die, and providing an IC card of good quality. <P>SOLUTION: The manufacturing method of the IC card manufacturing the IC card with an IC module sealed between a first sheet having an image receiving layer capable of forming an image, and a second sheet having a writing layer allowing writing by carrying out punching by the die having a hole part of a shape of the IC card and the punch detachably fitting into the hole part of the die is characterized by that the IC card is punched out by positioning the first sheet in a side of the die and positioning the second sheet in a side of the punch. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an IC card manufacturing method and an IC card manufacturing apparatus for punching an IC card from an IC card sheet containing an IC module.
[0002]
[Prior art]
Conventionally, as an identification card (ID card) such as an identification card or a credit card, a card for storing data by a magnetic recording method has been widely used. In this magnetic recording type card, the data can be rewritten relatively easily, so that the data is not sufficiently protected from tampering. In addition, since the magnetic recording type data is easily affected by external influences, the data is destroyed. However, there is a problem that data cannot be sufficiently protected. Therefore, an IC card has been proposed in which a memory formed of an IC chip and a microcomputer for controlling the memory are incorporated in a card, data can be stored in the memory, and data can be read out as necessary. Is widespread.
[0003]
This IC card has an IC chip inside, and is configured to exchange data with an external device via an internal loop antenna or an electric contact provided on the surface.
[0004]
Note that a device that uses radio waves by a loop antenna or the like, or a device that transmits and receives a signal by other means in a non-contact manner is called a non-contact type, and a device that uses an electric contact is called a contact type. .
[0005]
Here, an outline of a method for manufacturing a non-contact type IC card will be described with reference to FIG. 4A is an exploded perspective view of the IC card sheet, FIG. 4B is an enlarged perspective view of the IC module, and FIG. 4C is a perspective view showing a state where the IC card is punched out of the IC card sheet.
[0006]
In FIG. 4A, reference numeral 3 denotes an IC card sheet for an IC card. The IC card sheet 3 includes a core sheet 303 in which at least one IC module 302 is aligned and attached to a core sheet substrate 302a, a first sheet 301 adhered on the upper side of the core sheet 303, and a core sheet. And a second sheet 304 adhered to the lower side of the sheet 303. Reference numeral 301a denotes a symbol for an IC card provided on the first sheet 301.
[0007]
In FIG. 4B, the IC module 302 has an IC chip 302b and a loop antenna 302c.
[0008]
In FIG. 4C, reference numeral 1 denotes an IC card punched from the IC card sheet 3 in accordance with the design 301a.
[0009]
Note that the IC card sheet 3 may be manufactured for each IC module 302, or a core sheet 303 having a plurality of IC modules 302 between a first sheet and a second sheet is continuously formed. One IC card sheet 3 containing a plurality of IC modules 302 may be sandwiched, manufactured in a strip shape, and cut, and may be appropriately selected and manufactured according to a manufacturing apparatus.
[0010]
In order to reduce the punching resistance and reduce the noise generated when punching the IC card 1, punching apparatuses in which punches and dies have inclined angles are described in Patent Documents 1 and 2 below. .
[0011]
[Patent Document 1]
JP-A-7-328999
[0012]
[Patent Document 2]
JP-A-7-329000
[0013]
[Problems to be solved by the invention]
Although an IC card is manufactured as described above, conventionally, the first sheet and the second sheet have often been made of the same material and physical properties. For this reason, the IC card is conveyed with the sheet surface facing upward, which is more problematic when the IC card is damaged, and punched out from the upper surface side by a punch to manufacture the IC card.
[0014]
However, recent IC cards are provided with an image receiving layer on a first sheet on which an image such as a character or a face photograph can be formed, a transparent protective layer on the image receiving layer for protecting the image, and a writing sheet on the second sheet. Since a possible writing layer is provided, the materials and physical properties of both sheets are different. In such a case, it has been found that a crack may be formed in the cross section of the punched IC card depending on which side of the sheet is punched.
[0015]
The present invention has been made by conducting research and development from such a viewpoint. An IC card in which an IC module is sealed between a first sheet having an image receiving layer and a second sheet having a writing layer is provided. Good quality IC card without cracks in the cross section of the IC card when manufactured by punching with a die having a hole in the shape of an IC card and a punch that is removably fitted into the hole of the die. It is an object of the present invention to provide an IC card manufacturing method and an IC card manufacturing apparatus that can obtain the above.
[0016]
[Means for Solving the Problems]
The above object is achieved by any of the following means.
[0017]
{Circle around (1)} An IC card in which an IC module is sealed between a first sheet having an image-receiving layer capable of forming an image and a second sheet having a writable writing layer has a hole in the shape of the IC card. What is claimed is: 1. A method of manufacturing an IC card, comprising: punching out a die using a die and a punch that is removably fitted in a hole of the die, wherein the first sheet is positioned on a side of the die, and the second sheet is positioned. A method for manufacturing an IC card, characterized in that the IC card is punched by being positioned on the side of the punch.
[0018]
{Circle around (2)} An IC card in which an IC module is sealed between a first sheet having an image-receiving layer capable of forming an image and a second sheet having a writable writing layer has a hole in the shape of the IC card. What is claimed is: 1. A method of manufacturing an IC card, wherein the IC card is manufactured by punching out with a die and a punch that is removably fitted into a hole of the die, wherein the first sheet is positioned on a side of the punch, cooled, and A method for manufacturing an IC card, wherein the IC card is punched out after the second sheet is positioned on the side of the die and heated.
[0019]
(3) An IC card manufacturing apparatus for manufacturing an IC card in which an IC module is enclosed between a first sheet having an image-forming image-receiving layer and a second sheet having a writable writing layer, A die having a hole in the shape of the IC card; and a punch removably fitted into the hole of the die, wherein the first sheet is positioned on the side of the die and the second sheet An IC card manufacturing apparatus, characterized in that the device is positioned on the side of the punch and the IC card is punched.
[0020]
(4) An IC card manufacturing apparatus for manufacturing an IC card in which an IC module is enclosed between a first sheet having an image-forming image-receiving layer and a second sheet having a writable writing layer, A die having a hole in the shape of the IC card; a punch removably fitted into the hole of the die; heating means for heating the die-side surface of the IC card; An IC card manufacturing apparatus, comprising: cooling means for cooling a surface on a punch side.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a method and an apparatus for manufacturing an IC card according to the present invention will be described in detail with reference to the drawings.
[0022]
First, an example of a general IC card sheet manufacturing apparatus will be described with reference to FIGS.
[0023]
FIG. 1 is a schematic diagram illustrating an example of an IC card sheet manufacturing apparatus.
The IC card sheet manufacturing apparatus includes a supply unit 6 for supplying a first sheet 301 wound in a roll shape to be attached to the upper side of the core sheet 303 and a second sheet 304 wound in a roll shape to be attached to the lower side. And a cutting section 8 for cutting the strip-shaped IC card sheet into a predetermined size, and a sticking section 7 for sticking the first sheet 301 and the second sheet 304 to the core sheet 303. .
[0024]
The supply unit 6 includes a first supply unit 6a that supplies the first sheet 301 to the attaching unit 7 and a second supply unit 6b that supplies the second sheet 304 to the attaching unit 7. The first supply unit 6a includes a first sheet 301, a guide roller 602a for supplying the first sheet 301 to the attaching unit 7, a driving roller 603a, and a hot melt adhesive 604a for the first sheet 301. And a hot melt applicator coater 605a for applying a predetermined thickness.
[0025]
The second supply unit 6b includes a second sheet 304, a guide roller 602b for supplying the second sheet 304 to the attaching unit 7, a drive roller 603b, and a hot melt adhesive 604b for the second sheet 304. And a hot melt applicator coater 605b for applying a predetermined thickness.
[0026]
The first sheet 301 has an image receiving layer on which a character or face photograph image serving as personal identification information is printed by a sublimation heat transfer method, a melt heat transfer method, or an ink jet method. A transparent protective layer made of resin and protecting the image receiving layer is formed.
[0027]
A writable writing layer is formed on the second sheet 304.
The first sheet 301 coated with the adhesive and the second sheet 304 are supplied to the sticking section 7 in a state where they are separated from each other and face each other. A core sheet 303 to which at least one IC module is adhered is supplied from a core sheet supply unit (not shown) to a position where the first sheet 301 and the second sheet 304 are separated and opposed to each other. The core sheet 303 may be supplied in a sheet shape or a roll shape.
[0028]
The attaching unit 7 includes a constant temperature chamber 701 and a plurality of pressing rolls 702a and 702b that press the first sheet 301 and the second sheet 304. The strip-shaped IC card sheet 4 in which the core sheet 303 is sandwiched between the first sheet 301 and the second sheet 304 is manufactured by the press rolls 702a and 702b.
[0029]
The cutting unit 8 includes a driving roller 801 and a cutting blade 802 provided so as to be able to move vertically (in the direction of the arrow in the figure). The strip-shaped IC card sheet 4 sent from the sticking section 7 by the drive roller 801 is cut into a predetermined size to produce a single-sheet IC card sheet 3.
[0030]
Here, as a base material of the core sheet 303 to which the IC module 302 in the present invention is adhered, for example, polyester resin such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyethylene, polypropylene, polymethylpentene Polyolefin resins such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, etc., polyamides such as nylon 6, nylon 6.6, and polyvinyl chloride Vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, vinyl polymers such as polyvinyl alcohol and vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate Biodegradable polylactic acid, biodegradable polyvinyl alcohol, biodegradable cellulose acetate, biodegradable resins such as biodegradable polycaprolactone, cellulose triacetate, cellulose resins such as cellophane, polymethyl methacrylate, Acrylic resins such as polyethyl methacrylate, polyethyl acrylate, polybutyl acrylate, etc., synthetic resin sheets such as polystyrene, polycarbonate, polyarylate, polyimide, etc., paper such as high quality paper, tissue paper, glassine paper, sulfuric acid paper, etc. A single-layer body such as a metal foil, or a laminate of two or more of these layers may be used.
[0031]
The thickness of the substrate is 30 to 300 μm, preferably 50 to 200 μm.
Further, in post-processing, the substrate may be subjected to an easy contact treatment for improving adhesion, or may be subjected to an antistatic treatment for chip protection. Specifically, U2 series, U4 series, UL series manufactured by Teijin Dupont Film Co., Ltd., Crisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. E60 series and QE series can be suitably used.
[0032]
The first sheet 301 in the present invention may be provided with a cushion layer in addition to the image receiving layer in order to form a face image of the card user. An image element is provided on the surface of the personal authentication card base, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided. May be a white card
The image receiving layer provided on the first sheet member can be formed with a binder and various additives.
[0033]
The image receiving layer in the present invention forms a gradation information-containing image by a sublimation-type thermal transfer system, and forms a character information-containing image by a sublimation-type thermal transfer system or a fusion-type thermal transfer system. The adhesiveness of the hot-melt ink as well as the dyeability of the sublimable dye must be good. In order to impart such special properties to the image receiving layer, it is necessary to appropriately adjust the binder, various additives, and the amounts thereof as described below.
[0034]
Hereinafter, the components forming the image receiving layer will be described in detail.
As the binder for the image receiving layer in the present invention, a commonly known binder for a sublimation type thermal transfer recording image receiving layer can be appropriately used. As the main binder, various binders such as a vinyl chloride resin, a polyester resin, a polycarbonate resin, an acrylic resin, a polystyrene resin, a polyvinyl acetal resin, and a polyvinyl butyral resin can be used.
[0035]
However, if there is a practical requirement for the image formed by the present invention (for example, the ID card to be issued is required to have a predetermined heat resistance, etc.), the binder is required to satisfy such requirement. It is necessary to consider the type or combination. Taking the heat resistance of an image as an example, if heat resistance of 60 ° C. or higher is required, it is preferable to use a binder having a Tg of 60 ° C. or higher in consideration of the bleeding of the sublimable dye.
[0036]
When forming the image receiving layer, it may be preferable to include, for example, a metal ion-containing compound as necessary. In particular, when the heat transferable compound reacts with the metal ion-containing compound to form a chelate.
[0037]
Examples of the metal ion constituting the metal ion-containing compound include divalent and polyvalent metals belonging to Groups I to VIII of the periodic table. Among them, Al, Co, Cr, Cu, Fe, Mg , Mn, Mo, Ni, Sn, Ti, Zn and the like are preferable, and Ni, Cu, Co, Cr, Zn and the like are particularly preferable. As the compound containing these metal ions, an inorganic or organic salt of the metal and a complex of the metal are preferable. Specifically, a complex containing Ni2 +, Cu2 +, Co2 +, Cr2 +, and Zn2 + and represented by the following general formula is preferably used.
[M (Q1) k (Q2) m (Q3) n] p + p (L-)
In the formula, M represents a metal ion, Q1, Q2, and Q3 each represent a coordination compound capable of coordinating with the metal ion represented by M. Examples of these coordination compounds include “chelate chemistry (5 ) (Nankodo) "can be selected from the coordination compounds. Particularly preferably, a coordination compound having at least one amino group coordinated with a metal can be mentioned. More specifically, ethylenediamine and its derivatives, glycinamide and its derivatives, picolinamide and its derivatives can be mentioned. Can be L is a counter anion capable of forming a complex; ₄ , ClO ₄ And an organic compound anion such as a benzenesulfonic acid derivative and an alkylsulfonic acid derivative. Particularly preferred are a tetraphenylboron anion and a derivative thereof, and an alkylbenzenesulfonic acid anion and a derivative thereof. k represents an integer of 1, 2 or 3, m represents 1, 2 or 0, and n represents 1 or 0, and the complex represented by the above general formula is tetradentate or hexadentate. It is determined by coordination or by the number of ligands Q1, Q2, Q3. p represents 1, 2 or 3.
[0038]
As such a metal ion-containing compound, those exemplified in US Pat. No. 4,987,049 can be exemplified. When the metal ion-containing compound is added, the amount of addition is 0.5 to 20 g / m2 based on the image receiving layer. ² Is preferably 1 to 15 g / m ² Is more preferred.
[0039]
It is preferable to add a release agent to the image receiving layer. As the effective release agent, those which are compatible with the binder to be used are preferable, and specific examples thereof include modified silicone oils and modified silicone polymers, such as amino-modified silicone oil, epoxy-modified silicone oil, and polyester-modified silicone. Examples thereof include oil, acrylic-modified silicone resin, and urethane-modified silicone resin. Among them, the polyester-modified silicone oil prevents fusion with the ink sheet, but is particularly excellent in that it does not hinder the secondary workability of the image receiving layer. The secondary processability of the image receiving layer refers to writability with magic ink, laminating property which is a problem when protecting the formed image, and the like. In addition, fine particles such as silica are effective as a release agent. When the secondary workability is not a problem, the use of a curable silicone compound is also effective as a measure for preventing fusion. UV-curable silicone, reaction-curable silicone, and the like are available, and a large releasing effect can be expected.
[0040]
The image receiving layer in the present invention is a coating method in which a coating liquid for an image receiving layer is prepared by dispersing or dissolving the constituents in a solvent, the coating liquid for an image receiving layer is applied to the surface of the support, and dried. Can be manufactured by
[0041]
The thickness of the image receiving layer formed on the surface of the support is generally 1 to 50 μm, preferably about 2 to 10 μm. In the present invention, a cushion layer or a barrier layer may be provided between the support and the image receiving layer. By providing a cushion layer, an image corresponding to image information can be transferred and recorded with good reproducibility with little noise. Examples of the material constituting the cushion layer include urethane resins, acrylic resins, ethylene resins, polypropylene resins, butadiene rubber, epoxy resins, and photocurable resins described in Japanese Patent Application No. 2001-16934. The thickness of the cushion layer is usually 1 to 50 μm, preferably 3 to 30 μm.
[0042]
The information carrier composed of format printing refers to an information carrier provided with at least one of a plurality of information recording identification information and book information. Specifically, ruled lines, company names, card names, notes , Issuer's telephone number, etc.
[0043]
For the formation of an information carrier consisting of format printing, the lithographic printing technology published by the Japan Printing Technology Association, a new overview of printing technology, an offset printing technology, a plate making and printing book, etc. It can be formed by using a general ink described, and is formed by an ink such as carbon in a photo-curable ink, an oil-soluble ink, a solvent-based ink, or the like. In some cases, watermark printing, holograms, fine prints, etc. may be employed to prevent forgery by visual inspection. Printed materials, holograms, bar codes, matte patterns, fine prints, copy-forgery-inhibited patterns, uneven patterns Timely selection, etc., visible light absorbing color material, ultraviolet light absorbing material, infrared light absorbing material, fluorescent brightening material, metal vapor deposition layer, glass vapor deposition layer, bead layer, optical change element layer, pearl ink layer, neighbor pigment layer, It is also possible to provide an antistatic layer or the like on the front sheet by printing or the like.
[0044]
As a material for forming the cushion layer of the present invention, a photocurable resin and a polyolefin described in Japanese Patent Application No. 2001-1693 are preferable. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block Those having flexibility and low heat conductivity, such as a copolymer, a styrene-hydrogenated isoprene-styrene block copolymer, and polybutadiene, are suitable.
[0045]
As the material for forming the cushion layer of the present invention, polyolefin is preferable. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene Those having flexibility and low heat conductivity, such as a block copolymer, a styrene-hydrogenated isoprene-styrene block copolymer, polybutadiene, and a photocurable resin layer, are suitable. Specifically, a cushion layer disclosed in Japanese Patent Application No. 2001-16934 can be used.
[0046]
The cushion layer in the present invention is not particularly limited as long as it has a cushion layer between the image receiving layer and the electronic component, but the second sheet member of a separate support substantially the same as the base or It is particularly preferable that the first and second sheet members are formed by coating or bonding on both surfaces.
[0047]
The second sheet 304 is provided with a writing layer. The writing layer is a layer that enables writing on the back surface of the ID card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are contained in a film of a thermoplastic resin (polyolefins such as polyethylene, various copolymers, etc.). Can be formed. It can be formed with the "writing layer" described in JP-A-1-205155.
[0048]
The hot melt adhesive can be used without any particular limitation, and examples thereof include hot melts disclosed in JP-A-2000-36026, JP-A-2000-219855, JP-A-2000-212278, and JP-A-2000-219855. An adhesive may be used. Also, in this figure, a case where a hot melt adhesive is used is shown, but other adhesives can also be used, for example, an epoxy-based two-liquid mixed type, JP-A-10-316959 and JP-A-11-5964. Photocurable adhesives disclosed in the official gazette and the like can be mentioned.
[0049]
FIG. 2 is a schematic perspective view of a punching portion of the IC card.
The IC card sheet 3 is placed on the carrier 11, moves from right to left, passes through the position detection unit 12, and is punched by the punching unit 13.
[0050]
In the punching section 13, the punch 13a is inserted into the die 13b, and the IC card sheets 3 are punched out in the number of directions perpendicular to the conveying direction, and the individual IC cards 1 punched are stacked below. Then, the IC card sheet 3 from which all the IC cards 1 have been punched is conveyed to the left.
[0051]
In addition, this punching mechanism is a mechanism called dropout. However, there is a knock-out that is opposed to the punch and is urged in the direction of the punch. When the punch is lowered during punching, the IC card is lowered together with the knock-out, and when the punch is raised, a mechanism called pushback is provided in which the IC card is raised together with the knock-out. May be used. As a result, the punched IC card returns to the position of the IC card sheet, and is separated and integrated in a process downstream of the punched portion.
[0052]
Further, in the IC card manufactured as described above, the sheet surface on which the IC chip is located has poor flatness, which is not preferable for printing. Therefore, it is desirable to print the face photo so that the face photo does not overlap the IC chip in the thickness direction.
[0053]
In printing a face photograph or the like, it is desirable that the flatness of the peripheral portion of the IC chip constituting the IC module is within ± 10 μm.
[0054]
The IC card is manufactured as described above. As described in “Problems to be Solved by the Invention”, a method for preventing a crack from being generated in the cross section of the punched IC card will be described below.
[0055]
When an IC card provided with a first sheet having an image receiving layer and a second sheet having a writing layer is punched by a punch and a die, as a result of an experiment, the first sheet is positioned on the punch side, and the second sheet is placed. It was found that when located on the die side, the cross section of the second sheet was easily cracked.
[0056]
Assuming the cause, it is as follows. It was found that the first sheet and the second sheet had different elastic moduli, and the second sheet had a higher elastic modulus than the first sheet. When the first sheet is positioned on the punch side and the second sheet is positioned on the die side and punched out, the first sheet having a low elastic modulus has higher ductility and is only stretched by the punch. The second sheet having a high modulus of elasticity is initially stretched by the die because of its low ductility, but becomes sheared on the way, and it is considered that the cross section of the second sheet is cracked at this time.
[0057]
Thus, when the second sheet having a high elastic modulus is located on the punch side and the first sheet having a low elastic modulus is located on the die side, the cross section of the first sheet is also the cross section of the second sheet. Was found to have no cracks.
[0058]
That is, the second sheet having the writing layer is positioned on the punch side, and the first sheet having the image receiving layer is positioned on the die side and punched out. Was obtained.
[0059]
The elastic modulus of the first sheet is 100 to 200 N / m at room temperature. ² And the elastic modulus of the second sheet is 1000 to 5000 N / m at room temperature. ² It is.
[0060]
In some cases, the first sheet must be positioned on the punch side and the second sheet must be positioned on the die side for punching for manufacturing process reasons. In such a case, the surface of the IC card on the punch side may be cooled by a predetermined cooling unit, and the surface of the IC card on the die side may be heated by a predetermined heating unit. That is, by cooling the surface on the punch side, the elastic modulus of the first sheet is reduced to 100 N / m. ² From 600N / m ² And by heating the die-side surface, the elastic modulus of the second sheet is increased to 1000 N / m. ² From 400N / m ² Can be reduced to Thereby, contrary to the above, the elastic modulus of the first sheet is higher than the elastic modulus of the second sheet. Therefore, the first sheet having the image receiving layer is located on the punch side, and the first sheet having the image receiving layer has the writing layer. Even if the sheet No. 2 is punched with the sheet positioned on the die side, a good quality IC card can be obtained without cracks in the cross section.
[0061]
The elastic modulus was measured by applying an image receiving layer and a writing layer to a polypropylene film, peeling off the polypropylene film after the application, and using an elastic modulus measuring device.
[0062]
Next, FIG. 3 shows a sectional view of the punch and the die. FIG. 3A is a diagram of a conventional punch and die, and FIG. 3B is a diagram of a punch and die according to the present invention.
[0063]
As shown in FIG. 3A, the cutting edge angle θ of the conventional punch 33a has angles such as 15 °, 30 °, 45 °, and 60 °. 33b is a die.
[0064]
Also, as described in Patent Documents 1 and 2, there is also a type in which the cutting edge of the punch is not the same height along the periphery but has an inclination, and the punch gradually penetrates during punching. Was.
[0065]
However, as described above, in order to prevent cracks from being formed in the cross section of the IC card, it was found that cracks were more difficult to be formed in consideration of the shape of the punch.
[0066]
That is, as shown in FIG. 3B, by setting the cutting edge angle θ of the punch 23a to 80 to 90 ° and forming a shape having a flat flat portion 23a1 connected to the cutting edge, more cracks can be formed. It became difficult to enter.
[0067]
It was also found that the moving speed (m / min) of the punch 23a with respect to the die 23b also had an effect. As a result of the experiment, the probability of crack generation was 1% at 2.5 m / min, 5% or less at 5.0 m / min, 20% at 7.0 m / min, 40% at 8.0 m / min, 10.0 m / Min was 90%. Accordingly, in the manufacturing process, the moving speed of the punch relative to the die is preferably 2.5 m / min or more and 7.0 m / min or less. That is, if the speed is 2.5 m / min or less, the production efficiency is lowered because the speed is too slow, and if the speed is 7.0 m / min or more, the crack generation is too large.
[0068]
Although the IC card described above is of a non-contact type, the same applies to a contact type.
[0069]
【The invention's effect】
According to the IC card manufacturing method and the IC card manufacturing apparatus of the present invention, an IC card in which an IC module is sealed between a first sheet having an image receiving layer and a second sheet having a writing layer is provided. In the case of manufacturing by punching with a die having a hole having a shape of a hole and a punch which is removably fitted into the hole of the die, an IC card of good quality can be obtained without cracking in the cross section of the IC card. This has the effect of being
[Brief description of the drawings]
FIG. 1 is a schematic view showing an example of an IC card sheet manufacturing apparatus.
FIG. 2 is a schematic perspective view of a punching section of the IC card.
FIG. 3 is a sectional view of a punch and a die.
FIG. 4 is a schematic view showing a method for manufacturing an IC card sheet.
[Explanation of symbols]
1 IC card
3 IC card sheet
13a, 23a Punch
23a Flat part
13b, 23b die
301 1st sheet
302 IC module
302b IC chip
303 core sheet
304 2nd sheet
604b hot melt adhesive

Claims (21)

An IC card in which an IC module is sealed between a first sheet having an image-receiving layer capable of forming an image and a second sheet having a writable writing layer is provided with a die having a hole having the shape of the IC card. A method of manufacturing an IC card manufactured by punching with a punch that is removably fitted into a hole of a die,
A method for manufacturing an IC card, wherein the first sheet is positioned on the die side, the second sheet is positioned on the punch side, and the IC card is punched. An IC card in which an IC module is sealed between a first sheet having an image-receiving layer capable of forming an image and a second sheet having a writable writing layer is provided with a die having a hole having the shape of the IC card. A method of manufacturing an IC card manufactured by punching with a punch that is removably fitted into a hole of a die,
The IC card is characterized in that the first sheet is positioned on the side of the punch and cooled, and the second sheet is positioned on the side of the die and heated, and then the IC card is punched. Production method. The method according to claim 1, wherein the punch has a cutting edge having an angle of 80 degrees or more and 90 degrees or less, and has a flat flat portion connected to the cutting edge. 4. The method of manufacturing an IC card according to claim 1, wherein the punch is moved at a speed of 2.5 m / min to 7.0 m / min with respect to the die. 5. The image of a character or a face photograph serving as personal identification information is printed on the first sheet by a sublimation heat transfer method, a fusion heat transfer method, or an ink jet method. Method for manufacturing an IC card. The method for manufacturing an IC card according to any one of claims 1 to 5, wherein a hot melt adhesive is applied between the first sheet and the second sheet. The method for producing an IC card according to any one of claims 1 to 6, wherein a transparent protective layer made of an actinic ray curable resin and protecting the image receiving layer is provided. The IC card according to any one of claims 1 to 7, wherein an IC chip constituting the IC module and a portion where a face image is formed are arranged so as not to overlap in a thickness direction. Production method. 9. The IC card according to claim 1, wherein a flatness of a peripheral portion of an IC chip constituting the IC module on the first sheet is formed within ± 10 μm. 10. Method. The method for manufacturing an IC card according to claim 1, wherein the IC card is a non-contact type. An IC card manufacturing apparatus for manufacturing an IC card in which an IC module is enclosed between a first sheet having an image-forming image-receiving layer and a second sheet having a writable writing layer,
A die having a hole in the shape of the IC card;
A punch that is removably fitted into the hole of the die,
An IC card manufacturing apparatus, wherein the first sheet is positioned on the die side and the second sheet is positioned on the punch side, and the IC card is punched. An IC card manufacturing apparatus for manufacturing an IC card in which an IC module is enclosed between a first sheet having an image-forming image-receiving layer and a second sheet having a writable writing layer,
A die having a hole in the shape of the IC card;
A punch that is removably fitted into the hole of the die,
Heating means for heating the die-side surface of the IC card;
Cooling means for cooling the punch-side surface of the IC card;
An IC card manufacturing apparatus, comprising: After the first sheet is positioned on the side of the punch and cooled by the cooling means, and the second sheet is positioned on the side of the die and heated by the heating means, 13. The IC card manufacturing apparatus according to claim 12, wherein punching is performed by a punch and the die. The IC card according to any one of claims 11 to 13, wherein the punch has a cutting edge having an angle of 80 degrees or more and 90 degrees or less, and has a flat flat portion connected to the cutting edge. manufacturing device. The IC card manufacturing apparatus according to any one of claims 11 to 14, wherein the punch is moved at a speed of 2.5 m / min or more and 7.0 m / min or less with respect to the die. The image of a character or a face photograph serving as personal identification information is printed on the first sheet by a sublimation heat transfer method, a fusion heat transfer method, or an ink jet method. IC card manufacturing equipment. 17. The IC card manufacturing apparatus according to claim 11, wherein a hot melt adhesive is applied between the first sheet and the second sheet. The IC card manufacturing apparatus according to any one of claims 11 to 17, further comprising a transparent protective layer made of an actinic radiation curable resin and protecting the image receiving layer. The IC card according to any one of claims 11 to 18, wherein an IC chip constituting the IC module and a portion where a face image is formed are arranged so as not to overlap in a thickness direction. manufacturing device. 20. The IC card according to claim 11, wherein a flatness of a peripheral portion of an IC chip constituting the IC module on the first sheet is formed within ± 10 [mu] m. apparatus. The IC card manufacturing apparatus according to any one of claims 11 to 20, wherein the IC card is a non-contact type.

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