JP2004281992A - Package for storing light emitting element and light emitting device - Google Patents

Package for storing light emitting element and light emitting device Download PDF

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Publication number
JP2004281992A
JP2004281992A JP2003116406A JP2003116406A JP2004281992A JP 2004281992 A JP2004281992 A JP 2004281992A JP 2003116406 A JP2003116406 A JP 2003116406A JP 2003116406 A JP2003116406 A JP 2003116406A JP 2004281992 A JP2004281992 A JP 2004281992A
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emitting element
light emitting
light
frame
package
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JP4336137B2 (en
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Akihiko Funahashi
明彦 舟橋
Yuichi Furumoto
雄一 古本
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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Abstract

<P>PROBLEM TO BE SOLVED: To excellently reflect light emitted by a light emitting element and to radiate the light to outside equally and efficiently. <P>SOLUTION: The package for storing the light emitting element is constituted by providing a recess 4 for storing a light emitting element 3 on the topside of an insulating substrate 1, and by forming a packaging part 2 for packaging the light emitting element 3 on the base of the recess 4 and wiring layers 5a, 5b to which electrodes of the light emitting element 3 are electrically connected and in the recess 4, a metallic frame 8 is fitted while inclining its inner surface to be widened outward from the base to the topside of the insulating substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、発光ダイオード等の発光素子を用いた表示装置等に用いられる、発光素子を収納するための発光素子収納用パッケージおよび発光装置に関する。
【０００２】
【従来の技術】
従来、発光ダイオード等の発光素子を収納するための発光素子収納用パッケージ（以下、パッケージともいう）として、セラミック製のパッケージが用いられており、その一例を図１０に示す（例えば、下記の特許文献１参照）。同図に示すように、従来のパッケージは、複数のセラミック層が積層されて成るとともに上面に凹部１４が形成されている直方体状の絶縁基体の凹部１４の底面に発光素子１３を搭載するための導体層から成る搭載部１２が設けられた基体１１と、基体１１の搭載部１２およびその周辺から基体１１の下面に形成された一対の配線層１５とから主に構成されている。
【０００３】
そして、一方の配線層１５の一端が電気的に接続された搭載部１２上に発光素子１３を導電性接着剤、半田等を介して載置固定するとともに、発光素子１３の電極と他方の配線導体１５とをボンディングワイヤ１６を介して電気的に接続し、しかる後、基体１１の凹部１４内に図示しない透明樹脂を充填して発光素子１３を封止することによって、発光装置が作製される。
【０００４】
また、凹部１４の内周面で発光素子１３の光を反射させてパッケージの上方に光を放射させるために、凹部１４の内周面にニッケル（Ｎｉ）めっき層や金（Ａｕ）めっき層を表面に有するメタライズ層からなる金属層１７を被着させていることもある。
【０００５】
また、上記のパッケージはセラミックグリーンシート積層法により以下のようにして製作される。まず、基体１１の搭載部１２（搭載部から下側）を形成するためのセラミックグリーンシート（以下、グリーンシートともいう）と、基体１１の凹部１４を形成するためのグリーンシートとを準備し、これらのグリーンシートに配線導体１５を導出させるための貫通孔や凹部１４となる貫通穴を打ち抜き法で形成する。
【０００６】
次に、搭載部１２を形成するためのグリーンシートの積層体Ａの貫通孔および所定の部位に、メタライズ層から成る配線層１５形成用の導体ペーストをスクリーン印刷法等で印刷塗布し、また凹部１４の内周面にメタライズ層を被着する場合、凹部１４を形成するためのグリーンシートの積層体Ｂの貫通穴内面に金属層１７形成用の導体ペーストをスクリーン印刷法等で印刷塗布する。
【０００７】
次に、積層体Ａと積層体Ｂとを重ねて接着して基体１１を形成するための積層体とし、これを所定寸法に切断して成形体となし、高温（１６００℃程度）で焼成して焼結体となす。その後、配線層１５および金属層１７の露出表面にニッケル，金，パラジウム，白金等の金属から成るめっき金属層を無電解めっき法や電解めっき法により被着させることによって、パッケージが製作される。
【０００８】
【特許文献１】
特開２００２−２３２０１７号公報
【０００９】
【発明が解決しようとする課題】
しかしながら、上記従来のパッケージにおいては、スクリーン印刷法で凹部１４の内周面に導体ペーストを印刷塗布して、金属層１７を形成することから、導体ペーストの粘度等の影響により、凹部１４の上部と下部で金属層１７の厚みが異なりやすく、凹部１４の内周面に所望の均一な厚さおよび角度で金属層１７を形成するのが困難になるという問題点を有していた。また、金属層１７の表面粗さもばらつきやすいという問題点を有していた。従って、発光素子１３が発光する光を効率よく反射し、外部に均一に放射しにくくなるという問題点を有していた。
【００１０】
従って、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、発光素子が発光する光を良好に反射して、外部に均一かつ効率良く放射することができる発光素子収納用パッケージおよび発光装置を提供することにある。
【００１１】
【課題を解決するための手段】
本発明の発光素子収納用パッケージは、絶縁基体の上面に発光素子を収容するための凹部が設けられるとともに、該凹部の底面に前記発光素子が搭載される搭載部および前記発光素子の電極が電気的に接続される配線層が形成されている発光素子収納用パッケージであって、前記凹部にその底面から前記絶縁基体の上面に向けて外側に広がるように内面が傾斜した金属製の枠体が嵌着されていることを特徴とする。
【００１２】
本発明の発光素子収納用パッケージは、凹部にその底面から絶縁基体の上面に向けて外側に広がるように内面が傾斜した金属製の枠体が嵌着されていることから、凹部の内周面の表面状態に影響を受けることはなく、発光素子が発光する光を金属製の枠体の内面で良好に反射し、外部に均一かつ効率良く反射することができる。
【００１３】
本発明の発光素子収納用パッケージは、好ましくは、前記枠体は、アルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることを特徴とする。
【００１４】
本発明の発光素子収納用パッケージは、好ましくは枠体はアルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることから、発光素子が発光する光をさらに枠体でより良好に反射することができ、効率良くかつ均一に外部に放射することができる。
【００１５】
また、本発明の発光素子収納用パッケージは、好ましくは、前記枠体は、表面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることを特徴とする。
【００１６】
本発明の発光素子収納用パッケージは、好ましくは枠体は表面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることから、発光素子が発光する光を枠体に被着されている金属層でより良好に反射することができ、効率良くかつ均一に外部に放射することができる。
【００１７】
本発明の発光装置は、本発明の発光素子収納用パッケージと、前記搭載部に搭載されるとともに前記配線層に電気的に接続された発光素子と、該発光素子を覆う透明樹脂とを具備していることを特徴とする。
【００１８】
本発明の発光装置は、上記の構成により、発光素子が発光する光を良好に反射し、均一かつ効率良く外部に放射することができる、発光効率の高い高性能のものとなる。
【００１９】
【発明の実施の形態】
本発明の発光素子収納用パッケージを以下に詳細に説明する。図１は本発明のパッケージについて実施の形態の一例を示す断面図であり、図２は図１におけるパッケージの平面図であり、これらの図において、１は絶縁基体、２は発光素子３の搭載部、３は発光素子、４は発光素子３を収容するための凹部である。
【００２０】
本発明のパッケージは、絶縁基体１の上面に発光素子３を収容するための凹部４が設けられるとともに、凹部４の底面に発光素子３が搭載される搭載部２および発光素子３の電極が電気的に接続される配線層５ａ，５ｂが形成されているものであって、凹部４にその底面から絶縁基体１の上面に向けて外側に広がるように内面が傾斜した金属製の枠体８が嵌着されている。
【００２１】
本発明の絶縁基体１はセラミックスや樹脂から成り、セラミックスからなる場合、例えば酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス質焼結体等のセラミックスから成る絶縁層を複数層積層してなる直方体状の箱状体であり、上面の中央部に発光素子３を収容するための凹部４が形成されている。絶縁基体１が例えば酸化アルミニウム質焼結体から成る場合、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機バインダー、溶剤等を添加混合して泥漿状となし、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してグリーンシート（セラミック生シート）を得、しかる後、グリーンシートに凹部４用の貫通孔を打ち抜き加工で形成するとともに、発光素子３を搭載するためのグリーンシートと凹部４用のグリーンシートとを複数枚積層し、高温（約１６００℃）にて焼成し、一体化することで形成される。
【００２２】
また、凹部４の底面には発光素子３を搭載するための導体層から成る搭載部２が形成されており、搭載部２はタングステン（Ｗ），モリブデン（Ｍｏ），銅（Ｃｕ），銀（Ａｇ）等の金属粉末のメタライズ層から成っている。
【００２３】
また、絶縁基体１は、搭載部２およびその周辺から絶縁基体１の下面に形成された配線層５ａ，５ｂが被着形成されている。配線層５ａ，５ｂは、ＷやＭｏ等の金属粉末のメタライズ層から成り、凹部４に収容された発光素子３を外部に電気的に接続するための導電路である。そして、搭載部２には発光ダイオード（ＬＥＤ），半導体レーザ（ＬＤ）等の発光素子３が金（Ａｕ）−シリコン（Ｓｉ）合金やＡｇ−エポキシ樹脂等の導電性接合材により固着されるとともに、配線層５ｂには発光素子３の電極がボンディングワイヤ６を介して電気的に接続されている。そして、基体１下面の配線層５ａ，５ｂが外部電気回路基板の配線導体に接続されることで発光素子３の各電極と電気的に接続され、発光素子３へ電力や駆動信号が供給される。また、発光素子３は搭載部２および配線層５ｂにフリップチップ実装により接続されても構わない。
【００２４】
配線層５ａ，５ｂは、例えばＷやＭｏ等の金属粉末に適当な有機溶剤、溶媒を添加混合して得た金属ペーストを基体１となるグリーンシートに予めスクリーン印刷法により所定パターンに印刷塗布しておくことによって、基体１の所定位置に被着形成される。
【００２５】
なお、配線層５ａ，５ｂおよび搭載部２の露出する表面に、ニッケル（Ｎｉ），金（Ａｕ），Ａｇ等の耐蝕性に優れる金属を１〜２０μｍ程度の厚みで被着させておくのがよく、配線層５ａ，５ｂおよび搭載部２が酸化腐蝕するのを有効に防止できるとともに、搭載部２と発光素子３との固着および配線層５ｂとボンディングワイヤ６との接合、配線層５ａ，５ｂと外部電気回路基板の配線導体との接合を強固にすることができる。従って、配線層５ａ，５ｂおよび搭載部２の露出表面には、厚さ１〜１０μｍ程度のＮｉめっき層と厚さ０．１〜３μｍ程度のＡｕめっき層またはＡｇめっき層とが、電解めっき法や無電解めっき法により順次被着されていることがより好ましい。
【００２６】
そして、本発明において、凹部４にその底面から絶縁基体１の上面に向けて外側に広がるように内面が傾斜した金属製の枠体８が嵌着されている。これにより、凹部４の内周面の表面状態に影響を受けることなく、発光素子３が発光する光を枠体８の内面で良好に反射し、均一かつ効率良く反射することができる。この枠体８は、樹脂接着剤により凹部４の内周面に接着されて嵌着されていても良いし、凹部４の内周面に接合用のメタライズ層を形成し、Ａｇろう等によりろう付けして接合されていても良い。また、凹部４内に発光素子３を収容し、ボンディングワイヤ６等を介して電気的接続を行った後に、凹部４内に封入する透明樹脂によって、発光素子３とともに枠体８内面を覆って封止し、枠体８が凹部４に嵌着された状態としても良い。
【００２７】
また、枠体８の貫通穴の内面の表面の算術平均粗さＲａは１〜３μｍが好ましい。１μｍ未満であると、凹部４内に収容された発光素子３が発光する光を均一に反射させることが難しくなり、反射する光の強さに偏りが発生し易くなる。３μｍを超えると、凹部４内に収容された発光素子３が発光する光が散乱し、反射光を高い反射率で外部に均一に放射することが困難になる。
【００２８】
また、枠体８が嵌着される凹部４は、横断面形状が円形状、長円形状、楕円形状、四角形状等であっても良い。また、図３の断面図で示すように、凹部４の内周面および枠体８の外面を凹部４の底面から絶縁基体１の上面に向けて広がるように５〜１５°程度（θ２：７５〜８５°程度）の若干の角度を有するように傾斜させるのがよく、この場合、凹部４の内周面や上端部に若干の変形や反り等が発生したとしても、この変形や反り等に影響をあまり受けることなく、枠体８を容易に凹部４内に挿入することができる。
【００２９】
さらに、図４にパッケージの断面図で示すように、枠体８の上端部に絶縁基体１の上面に延出するように外側に折り曲げられた延出部が形成されていてもよく、この場合枠体８の凹部４への上下方向での嵌め込み位置を正確に位置決めすることができる。また、枠体８の下面と凹部４の底面との間に隙間が形成されるようにすることができ、枠体８と搭載部２および配線層５ａ，５ｂとが接触して短絡等が発生するのを防ぐことができ、また、その隙間の部位の凹部４の底面に搭載部２や配線層５ａ，５ｂを形成することでそれらの形成領域を広くすることができ、さらに、その隙間に発光素子３を覆う透明樹脂が入り込むようにして凹部４内に透明樹脂を強固に接着することができる。この場合、絶縁基体１の上面と凹部４との間に段差を形成して、その段差に枠体８の上端部の延出部が係止されるようにしてもよい。
【００３０】
また、図５にパッケージの断面図で示すように、枠体８の内面で発光素子３の発光部よりも低い部位を凹部４の底面に直交するように形成してもよく、この場合凹部４の底面の面積が増大するとともに枠体８と搭載部２および配線層５ｂとが接触して短絡等が発生するのを防ぐことができる。
【００３１】
本発明の発光素子収納用パッケージにおいては、枠体８の貫通穴が円錐台形状、長円錐台形状、楕円錐台形状の略円錐台形状、または四角錐台形状等の多角錐台形状であるのがよく、この場合、発光素子３が発光する光を枠体８で良好に反射し、外部に均一かつ効率良く放射することができる。特に、円錐台形状であるのがよく、凹部４に収容された発光素子３が発光する光を枠体８内面で満遍なく反射させて外部に極めて均一に放射することができるという利点がある。
【００３２】
また、図２においては、横断面形状が円形状の凹部４に円錐台形状の貫通穴が形成された枠体８が嵌着されているが、凹部４の形状と枠体８の貫通穴の形状は異なっていても良く、図６に平面図で示すように、四角形状の凹部４に円錐台形状の貫通穴が形成された枠体８を嵌着しても良いし、図７に平面図で示すように、四角形状の凹部４に四角錐台形状の貫通穴が形成された枠体８を嵌着しても良い。
【００３３】
また、枠体８の貫通穴の内面は、凹部４の底面から絶縁基体１の上面に向けて３５〜７０°の角度θ１で外側に広がっていることが好ましい。角度θ１が７０°を超えると、凹部４内に収容された発光素子３が発光する光を外部に対して良好に反射することが困難となる傾向にある。一方、角度θ１が３５°未満であると、枠体８が大型化しパッケージが大型化してしまう。
【００３４】
また、図８にパッケージの断面図に示すように、枠体８の内面が凹んだ曲面とされていてもよく、この場合発光素子３の光をほぼ平行光として収束させて高い輝度で外部に反射させることができる。また、この場合は、枠体８の貫通穴の横断面形状は円形状であることが好ましい。なお、図８のものにおいて、枠体８の内面の傾斜角度は、例えば枠体８の内面の上端と下端とを結ぶ線分によって規定される。
【００３５】
また、枠体８は、好ましくはアルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることから、発光素子３が発光する光を枠体８でより良好に反射することができ、効率良くかつ均一に外部に放射することができる。特に、枠体８はアルミニウムから成るのがよく、この場合、枠体８が酸化腐食されにくいとともに、発光素子３の光波長の変動による光の反射率の変動も小さくなるので、広い用途に使用することができる。
【００３６】
また、枠体８として、アルミニウム（熱膨張係数約２３．５×１０−６／℃程度），銀（熱膨張係数約１９．１×１０−６／℃程度），金（熱膨張係数約１４．１×１０−６／℃程度），パラジウム（熱膨張係数約１１．８×１０−６／℃程度）または白金（熱膨張係数約８．８×１０−６／℃程度）を用いる場合、絶縁基体１と枠体８との間に、熱膨張係数が絶縁基体１と枠体８との間にある金属板を介装させても良い。例えば、絶縁基体１としてアルミナセラミックス（熱膨張係数７×１０−６〜８×１０−６／℃程度）等から成るものを用いる場合、絶縁基体１と枠体８との熱膨張係数差により発生する熱応力を緩和するために、絶縁基体１と枠体８との間にＦｅ−Ｎｉ−Ｃｏ合金（熱膨張係数６×１０−６〜１０×１０−６／℃程度）、Ｃｕ−Ｗ合金（熱膨張係数６×１０−６〜１１×１０−６／℃程度）等の、より枠体８に熱膨張係数の近い金属板を用いるのがよい。これにより、絶縁基体１と枠体８との熱膨張係数差により発生する熱応力を緩和して、枠体８の剥がれ等を有効に防止することができる。
【００３７】
なお、枠体８は、アルミニウム，銀，金，パラジウムまたは白金のいずれかを主成分とする合金であっても良い。
【００３８】
また、本発明における枠体８は、表面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることが好ましく、発光素子３が発光する光を枠体８に被着された金属層で良好に反射して、効率良くかつ均一に外部に放射することができる。このような枠体８は、図９に示すように、枠体８の内面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層８ａを被着したものである。特に、金属層８ａはアルミニウムから成るのがよく、酸化腐食やマイグレーション等の不具合が発生しにくいとともに、発光素子３の光波長の変動による光の反射率の変動も小さくなるので、広い用途に使用することができる。
【００３９】
また、枠体８として絶縁基体１に熱膨張係数の近い材質のものを使用するとよい。例えば、絶縁基体１としてアルミナセラミックス（熱膨張係数７×１０−６〜８×１０−６／℃程度）等から成るものを用い、枠体８として絶縁基体１に熱膨張係数の近いＦｅ−Ｎｉ−Ｃｏ合金（熱膨張係数６×１０−６〜１０×１０−６／℃程度）等を使用すると、枠体８の剥がれ等を有効に防止することができる。このような枠体８に金属層８ａを被着すると、枠体８を絶縁基体１に強固に嵌着することができるとともに、発光素子３の発光する光に対する反射率を高いものとすることができる。
【００４０】
また、金属層８ａは、枠体８の発光素子３側の表面（内面）にのみ被着していても良いし、枠体８の全面に被着していてもよい。
【００４１】
なお、金属層８ａはアルミニウム，銀，金，パラジウムまたは白金のいずれかを主成分とする合金層であっても良い。
【００４２】
本発明の発光装置は、本発明のパッケージと、搭載部２に搭載された発光素子３と、発光素子３を覆うシリコーン樹脂等の透明樹脂とを具備している。これにより、発光素子３が発光する光を良好に反射し、均一かつ効率良く外部に放射することができる、発光効率の高い高性能のものとなる。発光素子３を覆う透明樹脂は、発光素子３およびその周囲のみを覆っていてもよいし、凹部４内に充填されて発光素子３を覆っていてもよい。
【００４３】
なお、本発明は上述の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等差し支えない。例えば、図１１にパッケージの断面図で示すように、搭載部２は、凹部４の底面の絶縁基体１上面の搭載領域として、凹部４の底面に樹脂接着剤等の接合材を介して発光素子３を直接搭載するものとし、搭載部２の周囲に発光素子３の電極が接続される配線層５ａ，５ｂを形成していても良い。この場合、搭載部２に発光素子３が搭載されるとともに、配線層５ａ，５ｂに発光素子３の電極がボンディングワイヤ６ａ，６ｂを介して電気的に接続される。また、金属製の枠体８と金属層８ａとの間にニッケル等から成る金属層を介在させていても良い。
【００４４】
【発明の効果】
本発明の発光素子収納用パッケージは、絶縁基体の上面に形成された凹部にその底面から絶縁基体の上面に向けて外側に広がるように内面が傾斜した金属製の枠体が嵌着されていることから、凹部の内周面の表面状態に影響を受けることはなく、発光素子が発光する光を金属製の枠体の内面で良好に反射し、外部に均一かつ効率良く反射することができる。
【００４５】
本発明の発光素子収納用パッケージは、好ましくは枠体はアルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることから、発光素子が発光する光をさらに枠体でより良好に反射することができ、効率良くかつ均一に外部に放射することができる。
【００４６】
また、本発明の発光素子収納用パッケージは、好ましくは枠体は表面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることから、発光素子が発光する光を枠体に被着されている金属層でより良好に反射することができ、効率良くかつ均一に外部に放射することができる。
【００４７】
本発明の発光装置は、本発明の発光素子収納用パッケージと、搭載部に搭載されるとともに配線層に電気的に接続された発光素子と、発光素子を覆う透明樹脂とを具備していることにより、発光素子が発光する光を良好に反射し、均一かつ効率良く外部に放射することができる、発光効率の高い高性能のものとなる。
【図面の簡単な説明】
【図１】本発明の発光素子収納用パッケージについて実施の形態の一例を示す断面図である。
【図２】図１の発光素子収納用パッケージの平面図である。
【図３】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図４】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図５】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図６】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す平面図である。
【図７】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す平面図である。
【図８】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図９】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図１０】従来の発光素子収納用パッケージの断面図である。
【図１１】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【符号の説明】
１：絶縁基体
２：搭載部
３：発光素子
４：凹部
５ａ，５ｂ：配線層
８：枠体[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light emitting element housing package for housing a light emitting element and a light emitting device used for a display device or the like using a light emitting element such as a light emitting diode.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter, also referred to as a package) for housing a light emitting element such as a light emitting diode, and an example thereof is shown in FIG. Reference 1). As shown in FIG. 1, the conventional package is formed by laminating a plurality of ceramic layers and has a concave portion 14 formed on the upper surface. It is mainly composed of a base 11 provided with a mounting portion 12 made of a conductor layer, and a pair of wiring layers 15 formed on the lower surface of the base 11 from the mounting portion 12 of the base 11 and its periphery.
[0003]
The light emitting element 13 is mounted and fixed on the mounting portion 12 to which one end of the one wiring layer 15 is electrically connected via a conductive adhesive, solder or the like, and the electrode of the light emitting element 13 is connected to the other wiring. The light emitting device is manufactured by electrically connecting the conductor 15 with the bonding wire 16 and then filling the concave portion 14 of the base 11 with a transparent resin (not shown) and sealing the light emitting element 13. .
[0004]
In order to reflect the light of the light emitting element 13 on the inner peripheral surface of the concave portion 14 and emit the light above the package, a nickel (Ni) plating layer or a gold (Au) plating layer is provided on the inner peripheral surface of the concave portion 14. The metal layer 17 made of a metallized layer on the surface may be applied.
[0005]
The above package is manufactured by the ceramic green sheet laminating method as follows. First, a ceramic green sheet (hereinafter, also referred to as a green sheet) for forming the mounting portion 12 (below the mounting portion) of the base 11 and a green sheet for forming the concave portion 14 of the base 11 are prepared. In these green sheets, through holes for leading out the wiring conductors 15 and through holes serving as the concave portions 14 are formed by a punching method.
[0006]
Next, a conductor paste for forming a wiring layer 15 made of a metallized layer is printed and applied by a screen printing method or the like on the through-holes and predetermined portions of the laminate A of the green sheets for forming the mounting portion 12, and the concave portions are formed. When a metallized layer is applied to the inner peripheral surface of the metal layer 14, a conductive paste for forming the metal layer 17 is printed and applied to the inner surface of the through hole of the green sheet laminate B for forming the concave portion 14 by a screen printing method or the like.
[0007]
Next, the laminate A and the laminate B are overlapped and bonded to form a laminate for forming the base 11, which is cut into a predetermined size to form a molded body, and fired at a high temperature (about 1600 ° C.). To form a sintered body. Thereafter, a package is manufactured by applying a plating metal layer made of a metal such as nickel, gold, palladium, or platinum on the exposed surfaces of the wiring layer 15 and the metal layer 17 by an electroless plating method or an electrolytic plating method.
[0008]
[Patent Document 1]
JP-A-2002-232017
[Problems to be solved by the invention]
However, in the above-described conventional package, the metal paste 17 is formed by printing and applying a conductive paste on the inner peripheral surface of the concave portion 14 by a screen printing method. In addition, the thickness of the metal layer 17 tends to be different between the lower portion and the lower portion, and it is difficult to form the metal layer 17 at a desired uniform thickness and angle on the inner peripheral surface of the concave portion 14. In addition, there is a problem that the surface roughness of the metal layer 17 tends to vary. Therefore, there is a problem that the light emitted from the light emitting element 13 is efficiently reflected and it is difficult to uniformly radiate the light to the outside.
[0010]
Accordingly, the present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to provide a light emitting device capable of satisfactorily reflecting light emitted from the light emitting device and emitting the light uniformly and efficiently to the outside. An object of the present invention is to provide a storage package and a light emitting device.
[0011]
[Means for Solving the Problems]
In the light emitting element housing package of the present invention, a concave portion for housing the light emitting element is provided on the upper surface of the insulating base, and the mounting portion on which the light emitting element is mounted and the electrode of the light emitting element are electrically connected to the bottom surface of the concave portion. A light emitting element housing package in which a wiring layer to be electrically connected is formed, wherein the recess has a metal frame whose inner surface is inclined so as to spread outward from the bottom surface toward the upper surface of the insulating base. It is characterized by being fitted.
[0012]
In the light emitting element housing package of the present invention, since the metal frame whose inner surface is inclined so as to spread outward from the bottom surface toward the upper surface of the insulating base is fitted into the concave portion, the inner peripheral surface of the concave portion is fitted. Without being affected by the surface condition of the metal frame, the light emitted by the light emitting element can be reflected well by the inner surface of the metal frame, and can be uniformly and efficiently reflected to the outside.
[0013]
In the light-emitting element housing package according to the present invention, preferably, the frame is made of any one of aluminum, silver, gold, palladium and platinum.
[0014]
In the light-emitting element housing package of the present invention, since the frame is preferably made of any one of aluminum, silver, gold, palladium and platinum, light emitted from the light-emitting element can be more effectively reflected by the frame. It is possible to efficiently and uniformly radiate to the outside.
[0015]
In the light-emitting element housing package according to the present invention, preferably, the frame has a metal layer made of any one of aluminum, silver, gold, palladium, and platinum adhered to a surface thereof.
[0016]
In the light-emitting element housing package of the present invention, preferably, the frame body has a surface coated with a metal layer made of any of aluminum, silver, gold, palladium, and platinum. It can be better reflected by the metal layer applied to the body, and can be efficiently and uniformly radiated to the outside.
[0017]
A light emitting device of the present invention includes the light emitting element housing package of the present invention, a light emitting element mounted on the mounting portion and electrically connected to the wiring layer, and a transparent resin covering the light emitting element. It is characterized by having.
[0018]
With the above structure, the light-emitting device of the present invention is a high-performance light-emitting device with high luminous efficiency, which can satisfactorily reflect the light emitted from the light-emitting element and radiate the light uniformly and efficiently to the outside.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
The light emitting element housing package of the present invention will be described in detail below. 1 is a cross-sectional view showing an example of an embodiment of the package of the present invention. FIG. 2 is a plan view of the package in FIG. Reference numeral 3 denotes a light emitting element, and 4 denotes a recess for accommodating the light emitting element 3.
[0020]
In the package of the present invention, a concave portion 4 for accommodating the light emitting element 3 is provided on the upper surface of the insulating base 1, and the mounting portion 2 on which the light emitting element 3 is mounted on the bottom surface of the concave portion 4 and the electrode of the light emitting element 3 are electrically connected. A metal frame 8 having an inner surface inclined so as to spread outward from the bottom surface toward the upper surface of the insulating base 1 in the recess 4 is provided with wiring layers 5a and 5b to be electrically connected. It is fitted.
[0021]
The insulating substrate 1 of the present invention is made of ceramic or resin. When made of ceramic, for example, aluminum oxide sintered body (alumina ceramic), aluminum nitride sintered body, mullite sintered body, glass ceramic sintered body, etc. It is a rectangular parallelepiped box-like body formed by laminating a plurality of insulating layers made of ceramics, and a concave portion 4 for accommodating the light emitting element 3 is formed at the center of the upper surface. When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide is mixed with an appropriate organic binder, a solvent, and the like to form a slurry. A green sheet (green ceramic sheet) is obtained by forming the sheet into a sheet shape by a well-known doctor blade method, a calendar roll method, or the like. Thereafter, a through hole for the recess 4 is formed in the green sheet by punching, and the light emitting element is formed. A plurality of green sheets for mounting 3 and a plurality of green sheets for recesses 4 are laminated, fired at a high temperature (about 1600 ° C.), and integrated.
[0022]
A mounting portion 2 made of a conductor layer for mounting the light emitting element 3 is formed on the bottom surface of the concave portion 4, and the mounting portion 2 is made of tungsten (W), molybdenum (Mo), copper (Cu), silver ( Ag) and other metal powder layers.
[0023]
Further, the insulating base 1 is provided with wiring layers 5a and 5b formed on the lower surface of the insulating base 1 from the mounting portion 2 and the periphery thereof. The wiring layers 5a and 5b are formed of a metallized layer of a metal powder such as W or Mo, and are conductive paths for electrically connecting the light emitting element 3 housed in the recess 4 to the outside. A light emitting element 3 such as a light emitting diode (LED) or a semiconductor laser (LD) is fixed to the mounting portion 2 by a conductive bonding material such as a gold (Au) -silicon (Si) alloy or an Ag-epoxy resin. The electrode of the light emitting element 3 is electrically connected to the wiring layer 5b via the bonding wire 6. Then, the wiring layers 5 a and 5 b on the lower surface of the base 1 are electrically connected to the respective electrodes of the light emitting element 3 by being connected to the wiring conductors of the external electric circuit board, and power and a driving signal are supplied to the light emitting element 3. . Further, the light emitting element 3 may be connected to the mounting section 2 and the wiring layer 5b by flip chip mounting.
[0024]
The wiring layers 5a and 5b are formed by applying a metal paste obtained by adding and mixing an appropriate organic solvent and a solvent to a metal powder such as W or Mo onto a green sheet serving as the substrate 1 in a predetermined pattern by a screen printing method in advance. By doing so, it is formed at a predetermined position on the base 1.
[0025]
It is preferable that a metal having excellent corrosion resistance, such as nickel (Ni), gold (Au), or Ag, be applied to the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2 in a thickness of about 1 to 20 μm. In addition, it is possible to effectively prevent the wiring layers 5a and 5b and the mounting portion 2 from being oxidized and corroded, to fix the mounting portion 2 to the light emitting element 3 and to join the wiring layer 5b and the bonding wire 6 to the wiring layers 5a and 5b. And the connection with the wiring conductor of the external electric circuit board can be strengthened. Therefore, on the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed by an electrolytic plating method. More preferably, they are sequentially applied by an electroless plating method.
[0026]
In the present invention, a metal frame 8 whose inner surface is inclined so as to spread outward from the bottom surface toward the upper surface of the insulating base 1 is fitted into the concave portion 4. Thereby, the light emitted by the light emitting element 3 can be reflected well on the inner surface of the frame 8 without being affected by the surface condition of the inner peripheral surface of the concave portion 4, and can be uniformly and efficiently reflected. The frame body 8 may be bonded and fitted to the inner peripheral surface of the concave portion 4 with a resin adhesive, or may be formed by forming a metallized layer for bonding on the inner peripheral surface of the concave portion 4 and using Ag brazing or the like. It may be attached and joined. After the light emitting element 3 is accommodated in the recess 4 and the electrical connection is made via the bonding wire 6 or the like, the inner surface of the frame 8 is sealed together with the light emitting element 3 by the transparent resin sealed in the recess 4. The frame 8 may be stopped, and the frame 8 may be fitted in the recess 4.
[0027]
The arithmetic average roughness Ra of the inner surface of the through hole of the frame 8 is preferably 1 to 3 μm. When the thickness is less than 1 μm, it is difficult to uniformly reflect the light emitted from the light emitting element 3 accommodated in the recess 4, and the intensity of the reflected light tends to be uneven. When the thickness exceeds 3 μm, the light emitted from the light emitting element 3 accommodated in the concave portion 4 is scattered, and it is difficult to uniformly emit the reflected light to the outside with a high reflectance.
[0028]
The recess 4 into which the frame 8 is fitted may have a circular cross section, an oval shape, an elliptical shape, a square shape, or the like. As shown in the cross-sectional view of FIG. 3, the inner peripheral surface of the concave portion 4 and the outer surface of the frame 8 are extended from the bottom surface of the concave portion 4 toward the upper surface of the insulating base 1 by about 5 to 15 ° (θ 2 : (Approximately 75 to 85 °), and it is preferable to incline such that even if slight deformation or warpage occurs on the inner peripheral surface or the upper end of the recess 4, the deformation, warpage or the like may occur. The frame 8 can be easily inserted into the concave portion 4 without being greatly affected by the above.
[0029]
Further, as shown in the cross-sectional view of the package in FIG. 4, an extension portion bent outward may be formed at the upper end of the frame 8 so as to extend to the upper surface of the insulating base 1. In this case, The position where the frame body 8 is fitted into the concave portion 4 in the vertical direction can be accurately positioned. Further, a gap can be formed between the lower surface of the frame 8 and the bottom of the concave portion 4, and the frame 8 comes into contact with the mounting portion 2 and the wiring layers 5a and 5b to cause a short circuit or the like. In addition, by forming the mounting portion 2 and the wiring layers 5a and 5b on the bottom surface of the concave portion 4 at the portion of the gap, the formation area thereof can be widened. The transparent resin that covers the light emitting element 3 can be firmly adhered to the recess 4 so that the transparent resin enters. In this case, a step may be formed between the upper surface of the insulating base 1 and the recess 4 so that the extension at the upper end of the frame 8 is locked to the step.
[0030]
As shown in the sectional view of the package in FIG. 5, a portion lower than the light emitting portion of the light emitting element 3 on the inner surface of the frame 8 may be formed so as to be orthogonal to the bottom surface of the concave portion 4. And the area of the bottom surface increases, and it is possible to prevent a short circuit or the like from occurring due to contact between the frame 8 and the mounting portion 2 and the wiring layer 5b.
[0031]
In the light emitting element housing package of the present invention, the through hole of the frame 8 has a truncated cone shape, a long truncated cone shape, a substantially truncated cone shape having an elliptical truncated cone shape, or a truncated polygonal pyramid shape such as a truncated square pyramid shape. In this case, the light emitted from the light emitting element 3 is preferably reflected by the frame 8 and radiated to the outside uniformly and efficiently. In particular, it is preferable to have a truncated cone shape, and there is an advantage that light emitted by the light emitting element 3 accommodated in the concave portion 4 can be reflected uniformly on the inner surface of the frame 8 and emitted to the outside very uniformly.
[0032]
Further, in FIG. 2, the frame 8 having the truncated conical through hole formed therein is fitted into the concave portion 4 having a circular cross-sectional shape. The shape may be different, and as shown in a plan view in FIG. 6, a frame 8 having a truncated conical through hole formed in a square concave portion 4 may be fitted. As shown in the figure, a frame 8 having a truncated quadrangular pyramid-shaped through hole formed in the quadrangular recess 4 may be fitted.
[0033]
Further, the inner surface of the through hole of the frame 8 is preferably flare outwardly at an angle theta 1 of 35 to 70 ° toward the bottom surface of the recess 4 on the upper surface of the insulating substrate 1. If the angle theta 1 is greater than 70 °, it tends to be difficult to satisfactorily reflect light emitting light emitting device 3 housed in the recess 4 from the outside. On the other hand, if the angle theta 1 is less than 35 °, the frame 8 is packaged size becomes large.
[0034]
Further, as shown in the cross-sectional view of the package in FIG. 8, the inner surface of the frame body 8 may be a concave curved surface. In this case, the light of the light emitting element 3 is converged as substantially parallel light and is externally provided with high luminance. Can be reflected. In this case, the cross-sectional shape of the through hole of the frame 8 is preferably circular. In FIG. 8, the inclination angle of the inner surface of the frame 8 is defined by, for example, a line connecting the upper end and the lower end of the inner surface of the frame 8.
[0035]
Further, since the frame 8 is preferably made of any one of aluminum, silver, gold, palladium, and platinum, the light emitted by the light emitting element 3 can be reflected by the frame 8 more efficiently, and efficiently. It can radiate uniformly to the outside. Particularly, the frame body 8 is preferably made of aluminum. In this case, the frame body 8 is hardly oxidized and corroded, and the fluctuation of the light reflectance due to the fluctuation of the light wavelength of the light emitting element 3 is reduced. can do.
[0036]
Further, as the frame 8, aluminum (coefficient of thermal expansion of about 23.5 × 10 −6 / ° C.), silver (coefficient of thermal expansion of about 19.1 × 10 −6 / ° C.), gold (coefficient of thermal expansion of about 14 .1 × 10 −6 / ° C.), palladium (coefficient of thermal expansion of about 11.8 × 10 −6 / ° C.) or platinum (coefficient of thermal expansion of about 8.8 × 10 −6 / ° C.) A metal plate having a coefficient of thermal expansion between the insulating base 1 and the frame 8 may be interposed between the insulating base 1 and the frame 8. For example, when the insulating base 1 is made of alumina ceramics (coefficient of thermal expansion of about 7 × 10 −6 to 8 × 10 −6 / ° C.) or the like, it is generated due to a difference in the thermal expansion coefficient between the insulating base 1 and the frame 8. Fe-Ni-Co alloy (coefficient of thermal expansion of about 6 × 10 −6 to 10 × 10 −6 / ° C.) between the insulating substrate 1 and the frame 8 to reduce the thermal stress (Thermal coefficient of thermal expansion is about 6 × 10 −6 to 11 × 10 −6 / ° C.). Thereby, thermal stress generated due to a difference in thermal expansion coefficient between the insulating base 1 and the frame 8 can be reduced, and peeling of the frame 8 can be effectively prevented.
[0037]
The frame 8 may be an alloy containing aluminum, silver, gold, palladium or platinum as a main component.
[0038]
Further, the frame 8 in the present invention preferably has a metal layer made of any of aluminum, silver, gold, palladium and platinum adhered to the surface, and the light emitted by the light emitting element 3 is applied to the frame 8. It can be well reflected by the deposited metal layer and radiate efficiently and uniformly to the outside. As shown in FIG. 9, such a frame 8 has a metal layer 8a made of any of aluminum, silver, gold, palladium and platinum adhered to the inner surface of the frame 8. In particular, the metal layer 8a is preferably made of aluminum, which is less likely to cause inconveniences such as oxidation corrosion and migration, and has a small variation in light reflectance due to a variation in the light wavelength of the light emitting element 3, so that it is used for a wide range of applications. can do.
[0039]
Further, it is preferable that the frame 8 be made of a material having a thermal expansion coefficient close to that of the insulating base 1. For example, the insulating base 1 is made of alumina ceramics (with a coefficient of thermal expansion of about 7 × 10 −6 to 8 × 10 −6 / ° C.), and the frame 8 is made of Fe—Ni having a thermal expansion coefficient close to that of the insulating base 1. The use of a -Co alloy (coefficient of thermal expansion of about 6 × 10 −6 to 10 × 10 −6 / ° C.) or the like can effectively prevent the frame 8 from peeling off. When the metal layer 8a is attached to such a frame body 8, the frame body 8 can be firmly fitted to the insulating base 1, and the reflectance of the light emitting element 3 with respect to emitted light can be increased. it can.
[0040]
Further, the metal layer 8a may be applied only to the surface (inner surface) of the frame 8 on the light emitting element 3 side, or may be applied to the entire surface of the frame 8.
[0041]
Note that the metal layer 8a may be an alloy layer containing any of aluminum, silver, gold, palladium, and platinum as a main component.
[0042]
The light emitting device of the present invention includes the package of the present invention, the light emitting element 3 mounted on the mounting section 2, and a transparent resin such as a silicone resin that covers the light emitting element 3. Thereby, the light emitted from the light emitting element 3 can be reflected well, and can be radiated uniformly and efficiently to the outside. The transparent resin covering the light emitting element 3 may cover only the light emitting element 3 and its surroundings, or may be filled in the recess 4 to cover the light emitting element 3.
[0043]
Note that the present invention is not limited to the above-described embodiment, and various changes may be made without departing from the scope of the present invention. For example, as shown in the cross-sectional view of the package in FIG. 11, the mounting portion 2 serves as a mounting region on the upper surface of the insulating base 1 on the bottom surface of the concave portion 4 and on the bottom surface of the concave portion 4 via a bonding material such as a resin adhesive. 3 may be directly mounted, and wiring layers 5 a and 5 b to which electrodes of the light emitting element 3 are connected may be formed around the mounting portion 2. In this case, the light emitting element 3 is mounted on the mounting section 2, and the electrodes of the light emitting element 3 are electrically connected to the wiring layers 5a, 5b via the bonding wires 6a, 6b. Further, a metal layer made of nickel or the like may be interposed between the metal frame 8 and the metal layer 8a.
[0044]
【The invention's effect】
In the light-emitting element housing package of the present invention, a metal frame whose inner surface is inclined so as to spread outward from the bottom surface toward the upper surface of the insulating substrate is fitted into a concave portion formed on the upper surface of the insulating substrate. Therefore, the light emitted from the light emitting element is well reflected on the inner surface of the metal frame, and can be uniformly and efficiently reflected to the outside without being affected by the surface condition of the inner peripheral surface of the concave portion. .
[0045]
In the light-emitting element housing package of the present invention, since the frame is preferably made of any one of aluminum, silver, gold, palladium and platinum, light emitted from the light-emitting element can be more effectively reflected by the frame. It is possible to efficiently and uniformly radiate to the outside.
[0046]
Further, in the light-emitting element housing package of the present invention, preferably, the frame body has a surface coated with a metal layer made of any of aluminum, silver, gold, palladium or platinum. Can be better reflected by the metal layer applied to the frame, and can be efficiently and uniformly radiated to the outside.
[0047]
The light-emitting device of the present invention includes the light-emitting element housing package of the present invention, a light-emitting element mounted on a mounting portion and electrically connected to a wiring layer, and a transparent resin covering the light-emitting element. Accordingly, the light emitted from the light-emitting element can be reflected well, and can be radiated uniformly and efficiently to the outside.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a light emitting element housing package of the present invention.
FIG. 2 is a plan view of the light emitting element housing package of FIG. 1;
FIG. 3 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 5 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 6 is a plan view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 7 is a plan view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 8 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 9 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 10 is a cross-sectional view of a conventional light emitting element storage package.
FIG. 11 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
[Explanation of symbols]
1: Insulating substrate 2: Mounting part 3: Light emitting element 4: Depressions 5a, 5b: Wiring layer 8: Frame

Claims (4)

絶縁基体の上面に発光素子を収容するための凹部が設けられるとともに、該凹部の底面に前記発光素子が搭載される搭載部および前記発光素子の電極が電気的に接続される配線層が形成されている発光素子収納用パッケージであって、前記凹部にその底面から前記絶縁基体の上面に向けて外側に広がるように内面が傾斜した金属製の枠体が嵌着されていることを特徴とする発光素子収納用パッケージ。A concave portion for accommodating the light emitting element is provided on the upper surface of the insulating base, and a mounting portion on which the light emitting element is mounted and a wiring layer for electrically connecting the electrode of the light emitting element are formed on the bottom surface of the concave portion. Wherein a metal frame whose inner surface is inclined so as to spread outward from the bottom surface toward the upper surface of the insulating base is fitted into the concave portion. Light emitting element storage package. 前記枠体は、アルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることを特徴とする請求項１記載の発光素子収納用パッケージ。The light emitting element storage package according to claim 1, wherein the frame is made of one of aluminum, silver, gold, palladium, and platinum. 前記枠体は、表面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることを特徴とする請求項１記載の発光素子収納用パッケージ。2. The package for housing a light-emitting element according to claim 1, wherein a metal layer made of any one of aluminum, silver, gold, palladium and platinum is applied to a surface of the frame. 請求項１乃至請求項３のいずれかに記載の発光素子収納用パッケージと、前記搭載部に搭載されるとともに前記配線層に電気的に接続された発光素子と、該発光素子を覆う透明樹脂とを具備していることを特徴とする発光装置。A light-emitting element storage package according to any one of claims 1 to 3, a light-emitting element mounted on the mounting portion and electrically connected to the wiring layer, and a transparent resin covering the light-emitting element. A light-emitting device comprising:
JP2003116406A 2003-01-24 2003-04-21 Light emitting element storage package and light emitting device Expired - Fee Related JP4336137B2 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156747A (en) * 2004-11-30 2006-06-15 Ngk Spark Plug Co Ltd Wiring board
JP2006165542A (en) * 2004-12-06 2006-06-22 Samsung Electro Mech Co Ltd Light emitting device package
JP2006237646A (en) * 2005-01-27 2006-09-07 Kyocera Corp Light-emitting device
US7850344B2 (en) 2006-07-04 2010-12-14 Shinko Electric Industries Co., Ltd. Light emitting device housing and a manufacturing method thereof, and light emitting apparatus using the same
EP2263268B1 (en) * 2008-04-18 2016-01-06 Tridonic Jennersdorf GmbH Led module having a platform with a central recession

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156747A (en) * 2004-11-30 2006-06-15 Ngk Spark Plug Co Ltd Wiring board
JP2006165542A (en) * 2004-12-06 2006-06-22 Samsung Electro Mech Co Ltd Light emitting device package
JP2006237646A (en) * 2005-01-27 2006-09-07 Kyocera Corp Light-emitting device
JP4606382B2 (en) * 2005-01-27 2011-01-05 京セラ株式会社 Light emitting device
US7850344B2 (en) 2006-07-04 2010-12-14 Shinko Electric Industries Co., Ltd. Light emitting device housing and a manufacturing method thereof, and light emitting apparatus using the same
EP2263268B1 (en) * 2008-04-18 2016-01-06 Tridonic Jennersdorf GmbH Led module having a platform with a central recession

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