JP2004259819A5 - - Google Patents
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- JP2004259819A5 JP2004259819A5 JP2003046972A JP2003046972A JP2004259819A5 JP 2004259819 A5 JP2004259819 A5 JP 2004259819A5 JP 2003046972 A JP2003046972 A JP 2003046972A JP 2003046972 A JP2003046972 A JP 2003046972A JP 2004259819 A5 JP2004259819 A5 JP 2004259819A5
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- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003046972A JP4381694B2 (ja) | 2003-02-25 | 2003-02-25 | 試料の表面処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003046972A JP4381694B2 (ja) | 2003-02-25 | 2003-02-25 | 試料の表面処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004259819A JP2004259819A (ja) | 2004-09-16 |
| JP2004259819A5 true JP2004259819A5 (enExample) | 2005-12-15 |
| JP4381694B2 JP4381694B2 (ja) | 2009-12-09 |
Family
ID=33113350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003046972A Expired - Fee Related JP4381694B2 (ja) | 2003-02-25 | 2003-02-25 | 試料の表面処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4381694B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7700494B2 (en) * | 2004-12-30 | 2010-04-20 | Tokyo Electron Limited, Inc. | Low-pressure removal of photoresist and etch residue |
| US7902078B2 (en) | 2006-02-17 | 2011-03-08 | Tokyo Electron Limited | Processing method and plasma etching method |
| JP4722725B2 (ja) * | 2006-02-17 | 2011-07-13 | 東京エレクトロン株式会社 | 処理方法およびプラズマエッチング方法 |
| US9786471B2 (en) | 2011-12-27 | 2017-10-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Plasma etcher design with effective no-damage in-situ ash |
| JP6026375B2 (ja) * | 2013-09-02 | 2016-11-16 | 株式会社東芝 | 半導体装置の製造方法 |
| JP2019121750A (ja) * | 2018-01-11 | 2019-07-22 | 東京エレクトロン株式会社 | エッチング方法およびエッチング装置 |
| WO2025197721A1 (ja) * | 2024-03-22 | 2025-09-25 | 東京エレクトロン株式会社 | 基板処理方法及びプラズマ処理装置 |
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2003
- 2003-02-25 JP JP2003046972A patent/JP4381694B2/ja not_active Expired - Fee Related