JP2004251849A

JP2004251849A - Method and apparatus for measuring characteristics of electronic component

Info

Publication number: JP2004251849A
Application number: JP2003044847A
Authority: JP
Inventors: Hideji Tanaka; 秀治田中
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2003-02-21
Filing date: 2003-02-21
Publication date: 2004-09-09
Anticipated expiration: 2023-02-21
Also published as: JP4123971B2

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and apparatus for measuring characteristics of electronic components, which measures the characteristics with a flat-tip measuring terminal which is superior in throwing-in characteristics of chip type electronic components and of low cost, independently of the sizes of the chip-type electronic components. <P>SOLUTION: A chip-type electronic component housing tool 9 comprises a nonconductive bottom plate 2, a nonconductive housing plate 3 stacked and fixed on the bottom plate 2, and a rod-like common terminal 6, provided in the space formed with the bottom plate 2 and the housing plate 3. A plurality of through holes 4 are formed in a matrix form on the upper surface part of the housing plate 3, while a long groove 5 is formed for each row of the through holes 4 on the lower surface part. The through hole 4 communicates with the groove 5, and the size of its cross section is slightly larger than the cross section of a chip-type laminated capacitor 61 which is to be housed. The cross section of the groove 5 is of a square shape, and it has a depth such that the rod-like common terminal 6 can move in the vertical directions by just the prescribed distance prescribed. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品の特性測定装置およびその測定方法に関する。
【０００２】
【従来の技術】
従来、複数のチップ型電子部品を同時に測定する測定装置として、特許文献１に記載のものが知られている。この測定装置は、図８に示すように、導電性平板５０と、該導電性平板５０上に重ねられ、チップ型電子部品が収容される貫通孔５２がマトリクス状に配置されている非導電性平板５１とからなる測定用トレイ５３と、測定用トレイ５３の貫通孔５２に対応して設けられた複数の測定端子５５（図１０参照）とを備えたものである。導電性平板５０は共通端子として機能し、可動機構はない。
【０００３】
【特許文献１】
特開平８−５１０４８号公報
【０００４】
【発明が解決しようとする課題】
ところで、チップ型電子部品を測定用トレイ５３の貫通孔５２に振り込んで収容する際には、貫通孔５２に収容されたチップ型電子部品の一部が測定用トレイ５３の表面から突出しない方が好ましい。なぜなら、図９に示すように、貫通孔５２に収容されたチップ型電子部品６１の一部が測定用トレイ５３の表面から突出する構成であれば、未だ貫通孔５２に収容されないで測定用トレイ５３上に載っているチップ型電子部品６１ａが、チップ型電子部品６１に引掛かり、貫通孔５２への振込み性が悪くなるからである。
【０００５】
逆に、測定端子５５をチップ型電子部品に当てて測定する際には、貫通孔５２に収容されたチップ型電子部品の一部が測定用トレイ５３の表面から突出した方が好ましい。なぜなら、図１０に示すように、貫通孔５２に収容されたチップ型電子部品６１の一部が測定用トレイ５３の表面から突出しない構成であれば、安価でチップ型電子部品６１のサイズに依存しない平先の測定端子５５が測定用トレイ５３の表面に当たり、チップ型電子部品６１に接触しないからである。そして、測定端子５５は径が細くなるほど機械的強度や寿命が小さくなりかつ高価になることを考慮して、チップ型電子部品６１のサイズに合わせて測定端子を準備しなければならないからである。
【０００６】
このように、測定用トレイ５３を使用して複数のチップ型電子部品６１を同時に測定する際には、相反する条件が要求される。しかし、従来の測定用トレイ５３は共通端子である導電性平板５０が非導電性平板５１に固定されているので、両方の条件を満足させることができなかった。
【０００７】
そこで、本発明の目的は、チップ型電子部品の振込み性に優れ、かつ、安価でチップ型電子部品のサイズに依存しない平先の測定端子で測定することができる電子部品の特性測定装置およびその測定方法を提供することにある。
【０００８】
【課題を解決するための手段および作用】
前記目的を達成するため、本発明に係る電子部品の特性測定装置は、
（ａ）チップ型電子部品が収容される貫通孔が複数設けられた収容プレートと、
（ｂ）収容プレートの下に配置された底板と、
（ｃ）収容プレートと底板とで形成されかつ貫通孔と連通した空間内に配置され、空間内を上下方向に可動し、チップ型電子部品の一方の外部電極に電気的に接触する共通端子と、
（ｄ）収容プレートの貫通孔に対応して設けられ、チップ型電子部品の他方の外部電極に電気的に接触する複数の測定端子と、
を備えたことを特徴とする。貫通孔のサイズは、例えばチップ型電子部品が縦置き状態で収容されるサイズに設定される。収容プレートと底板は一体物であってもよい。
【０００９】
以上の構成からなる収容プレートの複数の貫通孔にそれぞれ、チップ型電子部品を振り込む。貫通孔に振り込まれたチップ型電子部品は共通端子上に載り、収容プレートの表面から突出しない状態で貫通孔に収容される。従って、未だ貫通孔に収容されないで収容プレート上に載っているチップ型電子部品が、貫通孔に収容されているチップ型電子部品に引掛かり、貫通孔への振込み性が悪くなるという心配がなくなる。チップ型電子部品の一方の外部電極は、共通端子に電気的に接触する。
【００１０】
次に、収容プレートの厚み方向に可動する共通端子で、貫通孔に振り込まれたチップ型電子部品を押し上げ、チップ型電子部品を収容プレートの上面より突出させる。
【００１１】
この後、収容プレートの上面より突出したチップ型電子部品の他方の外部電極のそれぞれに、収容プレートの貫通孔に対応して設けられている複数の測定端子を電気的に接触させて測定する。このとき、貫通孔に収容されたチップ型電子部品の一部が収容プレートの表面から突出しているため、安価でチップ型電子部品のサイズに依存しない平先の測定端子が使用できる。
【００１２】
また、複数の貫通孔をマトリクス状に収容プレートに配設するとともに、貫通孔の列毎に棒状の共通端子を配設することにより、共通端子が貫通孔の列毎に独立することになる。従って、一つの収容プレートで異なる種類の測定が同時にできる。
【００１３】
【発明の実施の形態】
以下、本発明に係る電子部品の特性測定装置およびその測定方法の実施の形態について添付の図面を参照して説明する。なお、実施形態は、チップ型電子部品として、積層コンデンサを例にして説明するが、インダクタやＬＣノイズフィルタやコモンモードチョークコイルや高周波複合部品などであってもよいことは言うまでもない。
【００１４】
［第１実施形態、図１〜図５］
図１に示すように、特性測定装置１は、概略、チップ型電子部品収容治具９と、測定端子１５と、制御部２１と、測定部２２と、演算部２３と、表示器２４とで構成されている。
【００１５】
チップ型電子部品収容治具９は、図２および図３に示すように、非導電性底板２と、該底板２上に重ねられて固定された非導電性収容プレート３と、底板２と収容プレート３とで形成される空間内に配置された棒状の共通端子６とで構成されている。
【００１６】
収容プレート３の上面部にはマトリクス状に複数の矩形の貫通孔４が形成され、下面部には貫通孔４の列毎に長尺状の溝５が互いに平行に形成されている。貫通孔４は溝５に連通している。
【００１７】
貫通孔４の横断面（収容プレート３の厚み方向に直交する方向の断面）のサイズは、収容対象である直方体状のチップ型積層コンデンサ６１の横断面（ＷＴ面）のサイズよりも若干大きい。また貫通孔４の深さ（収容プレート３の厚み方向の寸法）は、チップ型積層コンデンサ６１の長辺方向寸法（Ｌ寸法）よりも小さい。貫通孔４の上端部は、チップ型積層コンデンサ６１が振り込まれ易いように、口広のテーパ状に形成されている。
【００１８】
溝５の横断面は、貫通孔４の列方向に長手方向を有する細長の矩形であり、そのサイズは共通端子６の横断面のサイズより若干大きい。また、溝５の深さは、共通端子６が上下方向（収容プレート３の厚み方向）に可動できるように、共通端子６の厚み方向寸法よりも大きい。
【００１９】
この収容プレート３の溝５と底板２とで形成される列毎の空間（キャビティ）内にそれぞれ共通端子６が配置されている。なお、収容プレート３と底板２は前述のように貼り合わせて構成したものでもよいが、射出成形などの方法により、前述の構造になるように一体的に形成し、共通端子６が配置される空間を形成してもよい。
【００２０】
底板２には、各共通端子６をそれぞれ個別に上下方向に移動させるための駆動装置（図示せず）の非導電性ロッド１０を貫通させるためのスリット７が形成されている。
【００２１】
また、図１に示すように、収容プレート３の貫通孔４に対応して設けられた複数の測定端子１５は、測定端子支持プレート１６に取り付けられている。さらに、測定端子支持プレート１６には、共通端子６ごとに一つのピン端子１７が取り付けられている。測定端子支持プレート１６は、図示しない駆動装置によって上下方向に移動される。
【００２２】
制御部２１は、周知のマイクロコンピュータにて構成され、予め設定されたプログラムに基づいて各部の動作制御を行う。
【００２３】
測定部２２は、周知の静電容量測定器や絶縁抵抗計にて構成され、図示しない電子スイッチを制御部２１からの制御信号によって切り換えることにより、順次、各チップ型積層コンデンサ６１の静電容量や絶縁抵抗を測定し、測定結果を演算部２３に送る。
【００２４】
演算部２３は、周知のマイクロコンピュータにて構成され、測定部２２で得た測定値に基づいて各チップ型積層コンデンサ６１の良否を測定し、この測定結果を表示器２４に表示する。
【００２５】
次に、以上の構成からなる特性測定装置１を使用して、チップ型積層コンデンサ６１の特性を測定する方法について説明する。チップ型積層コンデンサ６１は２端子コンデンサであり、両端部に外部電極が形成されている。
【００２６】
まず、図３に示すように、収容プレート３の複数の貫通孔４にそれぞれ、チップ型積層コンデンサ６１を縦置き状態（収容プレート３の厚み方向とチップ型積層コンデンサ６１の長辺方向が平行な状態）で振り込む。貫通孔４に振り込まれたチップ型積層コンデンサ６１は、一端に設けた外部電極が共通端子６に電気的に接触した状態で共通端子６上に載る。積層コンデンサ６１は収容プレート３の上面から突出しないように、貫通孔４に完全に収容される。
【００２７】
従って、未だ貫通孔４に収容されないで収容プレート３上に載っているチップ型積層コンデンサ６１ａが、貫通孔４に収容されているチップ型積層コンデンサ６１に引掛かり、貫通孔４への振込み性が悪くなるという心配がない。
【００２８】
次に、駆動装置のロッド１０で共通端子６を上昇させて、貫通孔４に振り込まれたチップ型積層コンデンサ６１を押し上げる。そして、図４に示すように、チップ型積層コンデンサ６１の他端を収容プレート３の上面より若干（ｔ＝０．３〜０．８ｍｍ、少なくともチップ型積層コンデンサ６１の半分以上が貫通孔４に隠れる状態）突出させる。共通端子６は棒状であり、チップ型積層コンデンサ６１を保持する面積が広いので、積層コンデンサ６１の姿勢を安定した状態で支えることができる。なお、チップ型積層コンデンサ６１としては、例えば、Ｌ：１．６ｍｍ×Ｗ：０．８ｍｍ×Ｔ：０．８ｍｍやＬ：３．２ｍｍ×Ｗ：１．６ｍｍ×Ｔ：１．６ｍｍのサイズのものが用いられる。
【００２９】
この後、測定端子支持プレート１６が下降され、各測定端子１５は対応する貫通孔４内のチップ型積層コンデンサ６１の他端に設けた外部電極に電気的に接触する。このとき、チップ型積層コンデンサ６１の他端の外部電極は収容プレート３の表面から突出しているので、先端が平らで、かつ、チップ型積層コンデンサ６１のサイズより径の大きい測定端子１５を使用することができる。この形状の測定端子１５は安価で、かつ、異なるサイズのチップ型積層コンデンサに共用できるため、測定のランニングコストを大幅に減らすことができる。
【００３０】
同時に、図５に示すように、各ピン端子１７も対応する貫通孔４内に露出している共通端子６の一端に電気的に接触する。これにより、共通端子６のそれぞれの一端は、ピン端子１７および該ピン端子１７に接続されている信号線（図示せず）を介して測定部２２に電気的に接続されることになる。
【００３１】
次に、測定端子１５と共通端子６の間に測定電圧が印加され、順次、各チップ型積層コンデンサ６１の静電容量が測定される。さらに、チップ型積層コンデンサ６１の絶縁抵抗が共通端子６毎に（言い換えると、貫通孔４の列毎に）測定される。このとき、共通端子６を貫通孔４の列毎に独立して設置しているので、貫通孔４の列毎に異なる種類の測定を同時に行うことができる。例えば、第１列目の貫通孔４に収容されたチップ型積層コンデンサ６１に対しては、１個ずつ順番に静電容量の測定を行いつつ、第２列目の貫通孔４に収容されたチップ型積層コンデンサ６１に対しては、一括して絶縁抵抗の測定を行うことができる。従って、一つの収容プレート３で複数の項目の測定が可能となり、測定の効率アップが図れる。
【００３２】
測定が全て終了すると、制御部２１から終了信号が出力され、測定端子支持プレート１６を上昇させて、元の位置に復帰させる。そして、共通端子６を下降させて、チップ型積層コンデンサ６１を再び収容プレート３内に収容する。
【００３３】
［第２実施形態、図６及び図７］
第２実施形態の特性測定装置は、前記第１実施形態の特性測定装置１において、チップ型電子部品収容治具９の替わりに、図６に示すチップ型電子部品収容治具４５を用いたものである。
【００３４】
チップ型電子部品収容治具４５は、非導電性底板３２と、該底板３２上に重ねられて固定された非導電性収容プレート３３と、底板３２と収容プレート３３とで形成される空間内に配置された棒状の共通端子４０とで構成されている。
【００３５】
収容プレート３３の上面部にはマトリクス状に複数の矩形の貫通孔３４が形成され、下面部には貫通孔３４の列毎に長尺状の段付き溝３５が形成されている。貫通孔３４は溝３５に連通している。底板３２には各共通端子４０をそれぞれ個別に上下方向に移動させるための駆動装置の非導電性ロッド１０を貫通させるための段付き溝３７が形成されている。
【００３６】
棒状共通端子４０の上面には、チップ型積層コンデンサ６１との電気的接触を良くするために、チップ型積層コンデンサ６１の幅（Ｗ寸法またはＴ寸法）よりも薄い厚みを有する接触突起板４１を設けている。本第２実施形態では共通端子４０の下面にも接触突起板４２を設けているが、この接触突起板４２は省略してもよい。共通端子４０は収容プレート３３の段付き溝３５と底板３２の段付き溝３７とで形成される空間内にそれぞれ配置され、空間内を上下方向に移動することができる。
【００３７】
以上の構成からなる特性測定装置は、チップ型積層コンデンサ６１の振り込み時には、共通端子４０を下げておくことで、図６に示すように積層コンデンサ６１の端部が収容プレート３３の上面から突出しないので、スムーズな振り込みが行える。また、測定時には、共通端子４０を上げることにより、図７に示すように積層コンデンサ６１の端部を収容プレート３３の上面から突出させる。これにより、先端が平らで、かつ、積層コンデンサ６１のサイズより径の大きい測定端子を使用することができる。
【００３８】
［他の実施形態］
なお、本発明は前記実施形態に限定されるものではなく、その要旨の範囲内で種々に変更することができる。例えば、前記実施形態では、収容プレートに形成される貫通孔の横断面形状が、縦置き状態で収容されるチップ型電子部品の横断面形状に合わせて矩形に形成されている。これにより、チップ型電子部品の短辺寸法（Ｗ寸法）と厚み寸法（Ｔ寸法）が異なる場合、収容プレートに収容されているチップ型電子部品の位置精度を高めることができる。しかし、チップ型電子部品の短辺寸法と厚み寸法が等しい場合には、収容プレートに形成される貫通孔の横断面形状は円形であってもよい。円形の貫通孔の形成は矩形の貫通孔の形成と比較して極めて容易であるので、収容プレートの加工コストを低減することができる。
【００３９】
また、前記実施形態では、チップ型電子部品を貫通孔に縦置き状態で振り込んで測定しているが、横置き状態（収容プレートの厚み方向とチップ型電子部品の長辺方向とが直交する状態）で振り込んで測定してもよい。特に、両端面に隣接する側面に外部電極を有するチップ型電子部品の該側面外部電極を用いて測定する場合には、横置き状態の方が好ましい。
【００４０】
【発明の効果】
以上の説明で明らかなように、本発明によれば、共通端子が収容プレートと底板とで形成される空間内に配置され、この空間内を上下方向に可動するので、チップ型電子部品振り込み時には、共通端子を下げておくことで、チップ型電子部品の端部が収容プレートの上面から突出しないので、スムーズな振り込みが行える。また、測定時には、共通端子を上げることにより、チップ型電子部品の端部を収容プレートの上面から突出させる。これにより、先端が平らで、かつ、チップ型電子部品のサイズより径の大きい測定端子を使用することができる。
【図面の簡単な説明】
【図１】本発明に係る電子部品の特性測定装置の概略構成図。
【図２】本発明に係る電子部品の特性測定装置の一実施形態に使用される収容プレートと底板と共通端子を示す分解斜視図。
【図３】図２のＩＩＩ−ＩＩＩ垂直断面図。
【図４】チップ型電子部品に測定端子を接触させて測定する状態を示した垂直断面図。
【図５】図２のＶ−Ｖ垂直断面図。
【図６】本発明に係る電子部品の特性測定装置の別の実施形態を示す垂直断面図。
【図７】チップ型電子部品に測定端子を接触させて測定する状態を示した垂直断面図。
【図８】従来の特性測定装置に使用される測定用トレイの分解斜視図。
【図９】図８に示した特性測定装置の不具合を説明するための垂直断面図。
【図１０】図８に示した特性測定装置の別の不具合を説明するための垂直断面図。
【符号の説明】
１…特性測定装置
２，３２…底板
３，３３…収容プレート
４，３４…貫通孔
５，３５，３７…溝
６，４０…共通端子
９，４５…チップ型電子部品収容治具
１５…測定端子[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a device and a method for measuring characteristics of electronic components.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as a measuring device for simultaneously measuring a plurality of chip-type electronic components, a measuring device described in Patent Document 1 is known. As shown in FIG. 8, this measuring apparatus is a non-conductive type in which a conductive flat plate 50 and through holes 52 stacked on the conductive flat plate 50 and accommodating chip-type electronic components are arranged in a matrix. It has a measurement tray 53 composed of a flat plate 51 and a plurality of measurement terminals 55 (see FIG. 10) provided corresponding to the through holes 52 of the measurement tray 53. The conductive plate 50 functions as a common terminal and has no movable mechanism.
[0003]
[Patent Document 1]
JP-A-8-51048
[Problems to be solved by the invention]
By the way, when the chip-type electronic components are transferred to and accommodated in the through holes 52 of the measurement tray 53, it is preferable that some of the chip-type electronic components accommodated in the through holes 52 do not protrude from the surface of the measurement tray 53. preferable. Because, as shown in FIG. 9, if a part of the chip-type electronic component 61 accommodated in the through-hole 52 protrudes from the surface of the measurement tray 53, the measurement tray is not yet accommodated in the through-hole 52. This is because the chip-type electronic component 61a placed on the 53 is hooked on the chip-type electronic component 61, and the transferability to the through-hole 52 is deteriorated.
[0005]
Conversely, when the measurement terminal 55 is applied to the chip-type electronic component for measurement, it is preferable that a part of the chip-type electronic component accommodated in the through hole 52 protrudes from the surface of the measurement tray 53. Because, as shown in FIG. 10, if the configuration is such that a part of the chip-type electronic component 61 accommodated in the through hole 52 does not protrude from the surface of the measurement tray 53, it is inexpensive and depends on the size of the chip-type electronic component 61. This is because the measurement terminal 55 having no flat tip hits the surface of the measurement tray 53 and does not contact the chip-type electronic component 61. The reason for this is that the measurement terminal 55 must be prepared in accordance with the size of the chip-type electronic component 61 in consideration that the smaller the diameter of the measurement terminal 55, the smaller the mechanical strength and the life and the higher the cost.
[0006]
As described above, when simultaneously measuring a plurality of chip-type electronic components 61 using the measurement tray 53, conflicting conditions are required. However, in the conventional measuring tray 53, since the conductive flat plate 50 as the common terminal is fixed to the non-conductive flat plate 51, both conditions cannot be satisfied.
[0007]
Therefore, an object of the present invention is to provide a characteristic measuring apparatus for an electronic component that has excellent transferability of a chip-type electronic component, is inexpensive, and can be measured with a flat-point measuring terminal that does not depend on the size of the chip-type electronic component. It is to provide a measuring method.
[0008]
Means and action for solving the problem
In order to achieve the above object, an electronic component characteristic measuring device according to the present invention includes:
(A) a housing plate provided with a plurality of through holes for housing chip-type electronic components;
(B) a bottom plate arranged below the storage plate;
(C) a common terminal formed in the space formed by the housing plate and the bottom plate and communicating with the through-hole, vertically movable in the space, and electrically contacting one external electrode of the chip-type electronic component; ,
(D) a plurality of measurement terminals provided corresponding to the through holes of the housing plate and electrically contacting the other external electrode of the chip-type electronic component;
It is characterized by having. The size of the through hole is set, for example, to a size in which the chip-type electronic component is accommodated in a vertically placed state. The receiving plate and the bottom plate may be integrated.
[0009]
Chip-type electronic components are transferred to the plurality of through holes of the housing plate having the above configuration. The chip-type electronic component transferred into the through hole is placed on the common terminal and is accommodated in the through hole without protruding from the surface of the accommodation plate. Therefore, there is no need to worry that the chip-type electronic components that are not yet housed in the through-holes and are placed on the housing plate will be caught by the chip-type electronic components housed in the through-holes, and that the transferability to the through-holes will deteriorate. . One external electrode of the chip-type electronic component is in electrical contact with the common terminal.
[0010]
Next, the chip-type electronic component transferred into the through hole is pushed up by the common terminal movable in the thickness direction of the storage plate, and the chip-type electronic component is projected from the upper surface of the storage plate.
[0011]
Thereafter, a plurality of measurement terminals provided corresponding to the through holes of the housing plate are electrically contacted with the other external electrodes of the chip-type electronic component protruding from the upper surface of the housing plate, respectively. At this time, since a part of the chip-type electronic component accommodated in the through hole projects from the surface of the accommodation plate, a low-cost, flat-tip measuring terminal independent of the size of the chip-type electronic component can be used.
[0012]
Further, by arranging a plurality of through-holes in a matrix on the housing plate and arranging a bar-shaped common terminal for each row of the through-holes, the common terminal becomes independent for each row of the through-holes. Therefore, different types of measurements can be simultaneously performed on one receiving plate.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a characteristic measuring apparatus and a measuring method of an electronic component according to the present invention will be described with reference to the accompanying drawings. In the embodiments, a multilayer capacitor is described as an example of a chip-type electronic component, but it goes without saying that an inductor, an LC noise filter, a common-mode choke coil, a high-frequency composite component, or the like may be used.
[0014]
[First Embodiment, FIGS. 1 to 5]
As shown in FIG. 1, the characteristic measuring device 1 includes a chip-type electronic component housing jig 9, a measuring terminal 15, a control unit 21, a measuring unit 22, a calculating unit 23, and a display 24. It is configured.
[0015]
As shown in FIGS. 2 and 3, the chip-type electronic component housing jig 9 houses the non-conductive bottom plate 2, the non-conductive housing plate 3 stacked and fixed on the bottom plate 2, and the bottom plate 2. And a common terminal 6 in the form of a bar arranged in a space formed by the plate 3 and the plate 3.
[0016]
A plurality of rectangular through holes 4 are formed in a matrix on the upper surface of the housing plate 3, and elongated grooves 5 are formed in the lower surface of each of the rows of the through holes 4 in parallel with each other. The through hole 4 communicates with the groove 5.
[0017]
The size of the cross section (the cross section in the direction perpendicular to the thickness direction of the storage plate 3) of the through hole 4 is slightly larger than the cross section (WT surface) of the rectangular parallelepiped chip-type multilayer capacitor 61 to be stored. The depth of the through hole 4 (the dimension in the thickness direction of the storage plate 3) is smaller than the dimension (L dimension) in the long side direction of the chip-type multilayer capacitor 61. The upper end of the through-hole 4 is formed in a wide tapered shape so that the chip-type multilayer capacitor 61 is easily transferred.
[0018]
The cross section of the groove 5 is an elongated rectangle having a longitudinal direction in the column direction of the through holes 4, and its size is slightly larger than the size of the cross section of the common terminal 6. The depth of the groove 5 is larger than the dimension of the common terminal 6 in the thickness direction so that the common terminal 6 can move in the vertical direction (the thickness direction of the housing plate 3).
[0019]
A common terminal 6 is arranged in a space (cavity) for each row formed by the groove 5 and the bottom plate 2 of the housing plate 3. The accommodation plate 3 and the bottom plate 2 may be formed by bonding together as described above, but are integrally formed so as to have the above-mentioned structure by a method such as injection molding, and the common terminal 6 is arranged. A space may be formed.
[0020]
The bottom plate 2 is provided with a slit 7 for passing a non-conductive rod 10 of a driving device (not shown) for individually moving each common terminal 6 in the vertical direction.
[0021]
Further, as shown in FIG. 1, a plurality of measurement terminals 15 provided corresponding to the through holes 4 of the storage plate 3 are attached to a measurement terminal support plate 16. Further, one pin terminal 17 is attached to the measurement terminal support plate 16 for each common terminal 6. The measurement terminal support plate 16 is moved up and down by a driving device (not shown).
[0022]
The control unit 21 is configured by a known microcomputer, and controls the operation of each unit based on a preset program.
[0023]
The measuring unit 22 is configured by a well-known capacitance measuring device or an insulation resistance meter, and switches an electronic switch (not shown) according to a control signal from the control unit 21 to sequentially change the capacitance of each chip-type multilayer capacitor 61. And the insulation resistance is measured, and the measurement result is sent to the calculation unit 23.
[0024]
The calculation unit 23 is configured by a well-known microcomputer, and measures the quality of each chip-type multilayer capacitor 61 based on the measurement value obtained by the measurement unit 22, and displays the measurement result on the display 24.
[0025]
Next, a method of measuring the characteristics of the chip-type multilayer capacitor 61 using the characteristic measuring device 1 having the above configuration will be described. The chip-type multilayer capacitor 61 is a two-terminal capacitor, and external electrodes are formed at both ends.
[0026]
First, as shown in FIG. 3, the chip-type multilayer capacitor 61 is placed vertically in the plurality of through holes 4 of the housing plate 3 (the thickness direction of the housing plate 3 and the long side direction of the chip-type multilayer capacitor 61 are parallel to each other). State). The chip-type multilayer capacitor 61 transferred into the through hole 4 is mounted on the common terminal 6 in a state where an external electrode provided at one end is in electrical contact with the common terminal 6. The multilayer capacitor 61 is completely housed in the through hole 4 so as not to protrude from the upper surface of the housing plate 3.
[0027]
Accordingly, the chip-type multilayer capacitor 61a that is not yet housed in the through-hole 4 and is placed on the housing plate 3 is hooked on the chip-type multilayer capacitor 61 that is housed in the through-hole 4, and the transferability to the through-hole 4 is improved. Don't worry about getting worse.
[0028]
Next, the common terminal 6 is raised by the rod 10 of the driving device, and the chip-type multilayer capacitor 61 transferred into the through hole 4 is pushed up. Then, as shown in FIG. 4, the other end of the chip-type multilayer capacitor 61 is slightly (t = 0.3-0.8 mm) from the upper surface of the housing plate 3, and at least half or more of the chip-type multilayer capacitor 61 is in the through hole 4. (Hiding state) Protrude. Since the common terminal 6 is rod-shaped and has a large area for holding the chip-type multilayer capacitor 61, the attitude of the multilayer capacitor 61 can be stably supported. The chip-type multilayer capacitor 61 has a size of, for example, L: 1.6 mm × W: 0.8 mm × T: 0.8 mm or L: 3.2 mm × W: 1.6 mm × T: 1.6 mm. Things are used.
[0029]
Thereafter, the measurement terminal support plate 16 is lowered, and each measurement terminal 15 is electrically contacted with an external electrode provided at the other end of the chip-type multilayer capacitor 61 in the corresponding through hole 4. At this time, since the external electrode at the other end of the chip-type multilayer capacitor 61 protrudes from the surface of the housing plate 3, the measurement terminal 15 having a flat tip and a diameter larger than the size of the chip-type multilayer capacitor 61 is used. be able to. Since the measuring terminal 15 having this shape is inexpensive and can be shared by chip-type multilayer capacitors of different sizes, the running cost for measurement can be greatly reduced.
[0030]
At the same time, as shown in FIG. 5, each pin terminal 17 is also in electrical contact with one end of the common terminal 6 exposed in the corresponding through hole 4. Thus, one end of each of the common terminals 6 is electrically connected to the measurement unit 22 via the pin terminal 17 and a signal line (not shown) connected to the pin terminal 17.
[0031]
Next, a measurement voltage is applied between the measurement terminal 15 and the common terminal 6, and the capacitance of each chip-type multilayer capacitor 61 is sequentially measured. Further, the insulation resistance of the chip-type multilayer capacitor 61 is measured for each common terminal 6 (in other words, for each row of the through holes 4). At this time, since the common terminal 6 is provided independently for each row of the through holes 4, different types of measurements can be simultaneously performed for each row of the through holes 4. For example, with respect to the chip-type multilayer capacitors 61 accommodated in the through holes 4 in the first row, the capacitances are sequentially measured one by one while being accommodated in the through holes 4 in the second row. The insulation resistance of the chip-type multilayer capacitor 61 can be measured at a time. Therefore, a plurality of items can be measured with one accommodation plate 3, and the measurement efficiency can be increased.
[0032]
When all the measurements are completed, a termination signal is output from the control unit 21, and the measurement terminal support plate 16 is raised to return to the original position. Then, the common terminal 6 is lowered, and the chip-type multilayer capacitor 61 is housed in the housing plate 3 again.
[0033]
[Second Embodiment, FIGS. 6 and 7]
The characteristic measuring device of the second embodiment is the same as the characteristic measuring device 1 of the first embodiment, except that a chip-type electronic component housing jig 45 shown in FIG. 6 is used instead of the chip-type electronic component housing jig 9. It is.
[0034]
The chip-type electronic component housing jig 45 includes a non-conductive bottom plate 32, a non-conductive housing plate 33 stacked and fixed on the bottom plate 32, and a space formed by the bottom plate 32 and the housing plate 33. And a bar-shaped common terminal 40 arranged.
[0035]
A plurality of rectangular through-holes 34 are formed in a matrix on the upper surface of the accommodation plate 33, and a long stepped groove 35 is formed on the lower surface for each row of the through-holes 34. The through hole 34 communicates with the groove 35. The bottom plate 32 is provided with a stepped groove 37 for penetrating the non-conductive rod 10 of the driving device for individually moving the common terminals 40 in the vertical direction.
[0036]
On the upper surface of the rod-shaped common terminal 40, in order to improve the electrical contact with the chip-type multilayer capacitor 61, a contact projection plate 41 having a thickness smaller than the width (W dimension or T dimension) of the chip-type multilayer capacitor 61 is provided. Provided. In the second embodiment, the contact protrusion plate 42 is also provided on the lower surface of the common terminal 40, but the contact protrusion plate 42 may be omitted. The common terminal 40 is disposed in a space formed by the stepped groove 35 of the accommodation plate 33 and the stepped groove 37 of the bottom plate 32, and can move up and down in the space.
[0037]
In the characteristic measuring device having the above configuration, when the chip-type multilayer capacitor 61 is transferred, the common terminal 40 is lowered so that the end of the multilayer capacitor 61 does not protrude from the upper surface of the housing plate 33 as shown in FIG. Therefore, smooth transfer can be performed. At the time of measurement, by raising the common terminal 40, the end of the multilayer capacitor 61 is projected from the upper surface of the housing plate 33 as shown in FIG. Thus, a measuring terminal having a flat tip and a diameter larger than the size of the multilayer capacitor 61 can be used.
[0038]
[Other embodiments]
The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the gist. For example, in the embodiment, the cross-sectional shape of the through-hole formed in the housing plate is formed in a rectangular shape in accordance with the cross-sectional shape of the chip-type electronic component housed vertically. Accordingly, when the short side dimension (W dimension) and the thickness dimension (T dimension) of the chip type electronic component are different, the positional accuracy of the chip type electronic component housed in the housing plate can be improved. However, when the short side dimension and the thickness dimension of the chip-type electronic component are equal, the cross-sectional shape of the through hole formed in the housing plate may be circular. Since the formation of the circular through-hole is extremely easy as compared with the formation of the rectangular through-hole, the processing cost of the accommodation plate can be reduced.
[0039]
Further, in the above-described embodiment, the measurement is performed by vertically transferring the chip-type electronic component into the through-hole, but in the horizontal position (when the thickness direction of the housing plate and the long-side direction of the chip-type electronic component are orthogonal to each other). ) May be used for measurement. In particular, when measurement is performed using the side external electrodes of a chip-type electronic component having external electrodes on the side surfaces adjacent to both end surfaces, the horizontal position is more preferable.
[0040]
【The invention's effect】
As is clear from the above description, according to the present invention, the common terminal is arranged in the space formed by the housing plate and the bottom plate, and moves up and down in this space, so that when the chip-type electronic component is transferred, By lowering the common terminal, the end of the chip-type electronic component does not protrude from the upper surface of the housing plate, so that smooth transfer can be performed. Further, at the time of measurement, the end of the chip-type electronic component is projected from the upper surface of the housing plate by raising the common terminal. Thereby, a measuring terminal having a flat tip and a diameter larger than the size of the chip-type electronic component can be used.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of an electronic component characteristic measuring device according to the present invention.
FIG. 2 is an exploded perspective view showing a housing plate, a bottom plate, and a common terminal used in an embodiment of the electronic component characteristic measuring device according to the present invention.
FIG. 3 is a vertical sectional view taken along the line III-III of FIG. 2;
FIG. 4 is a vertical sectional view showing a state in which measurement is performed by bringing a measurement terminal into contact with a chip-type electronic component.
FIG. 5 is a vertical sectional view taken along line VV of FIG. 2;
FIG. 6 is a vertical sectional view showing another embodiment of the electronic component characteristic measuring device according to the present invention.
FIG. 7 is a vertical sectional view showing a state in which a measurement terminal is brought into contact with a chip-type electronic component to perform measurement.
FIG. 8 is an exploded perspective view of a measuring tray used in a conventional characteristic measuring device.
FIG. 9 is a vertical cross-sectional view for explaining a problem of the characteristic measuring device shown in FIG. 8;
FIG. 10 is a vertical sectional view for explaining another problem of the characteristic measuring apparatus shown in FIG. 8;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Property measuring device 2, 32 ... Bottom plate 3, 33 ... Housing plate 4, 34 ... Through-hole 5, 35, 37 ... Groove 6, 40 ... Common terminal 9, 45 ... Chip type electronic component housing jig 15 ... Measurement terminal

Claims

A housing plate provided with a plurality of through holes for housing chip-type electronic components,
A bottom plate arranged below the storage plate,
A common space formed by the housing plate and the bottom plate and arranged in a space communicating with the through hole, vertically movable in the space, and electrically contacting one external electrode of the chip-type electronic component. Terminals and
A plurality of measurement terminals provided corresponding to the through holes of the housing plate and electrically contacting the other external electrode of the chip-type electronic component,
A characteristic measuring device for an electronic component, comprising:

The characteristic measurement of an electronic component according to claim 1, wherein a plurality of the through holes are arranged in the receiving plate in a matrix, and a bar-shaped common terminal is arranged for each row of the through holes. apparatus.

The device according to claim 1, wherein the size of the through hole is larger than a size in which the chip-type electronic component is accommodated in a vertically placed state.

The said accommodation plate and the said bottom plate are an integral thing, and the said common terminal is arrange | positioned and the said space connected with the said through-hole is provided, The Claim 1 characterized by the above-mentioned. Equipment for measuring the characteristics of electronic components.

Transferring a plurality of chip-type electronic components into a plurality of through-holes of the housing plate;
Contacting a common terminal movable in the thickness direction of the housing plate with one of the external electrodes of the plurality of chip-type electronic components, and pushing up the chip-type electronic component to project from the upper surface of the housing plate;
A step of measuring by contacting a plurality of measurement terminals provided corresponding to the plurality of through holes with the other external electrodes of the chip-type electronic component, respectively;
A characteristic measuring method for an electronic component, comprising: