JP2004235421A - Equipment and method for inspecting semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide equipment for inspecting a semiconductor device, in which the labor for replacing a probe card can be saved when one chip is measured for a plurality of times individually. <P>SOLUTION: The inspection equipment comprises a probe card 2 including probes 3a of first group, probes 3b of second group, and a substrate 4 supporting the probes of first and second groups, and a means 7 for adjusting the position such that the probes of first group touch the pads of first group on a first semiconductor chip and the probes of second group touch the pads of second group on a second semiconductor chip adjacent to the first semiconductor chip, moving a semiconductor wafer at a specified pitch to the probe card when a semiconductor chip being measured is replaced, and adjusting the position such that the probes of first group touch the pads of first group on the second semiconductor chip and the probes of second group touch the pads of second group on a third semiconductor chip adjacent to the second semiconductor chip . <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor device inspection apparatus and a semiconductor device inspection method for inspecting a semiconductor device in a wafer state.
[0002]
[Prior art]
In the manufacture of a semiconductor device, a wafer on which a large number of circuits are formed is cut into individual chips, and is manufactured by performing a packaging process. A package test (final test) for determining whether or not the semiconductor device has been subjected to the packaging process is performed. However, if the packaging process is performed for a defective product that has occurred before the chip, it is useless. Costs are incurred. Therefore, in general, a wafer test (wafer sort) for determining whether or not each chip is non-defective is performed before performing the package processing.
[0003]
An inspection device used in a wafer test is provided with a probe card for electrically connecting a bonding pad of a wafer to an LSI tester, and a probe needle provided on the probe card is brought into contact with the bonding pad. Thus, electrical connection with the semiconductor device is ensured.
[0004]
Here, for example, when the number of output pads in each chip included in the wafer is larger than the number of input terminals of the LSI tester, it is necessary to measure each chip in plural times. Conventionally, after a plurality of chips included in a wafer are sequentially measured using a first probe card, the first probe card is replaced with a second probe card having a different probe arrangement, and these chips are again measured. Was sequentially measured.
[0005]
However, according to such an inspection method, since the probe card is different between the first measurement and the second measurement, the setup for the measurement needs to be performed twice, which increases the time and cost required for the inspection. I was
[0006]
Meanwhile, in Patent Document 1, a plurality of wafer chucks capable of mounting a wafer on a stage unit and adjusting the position in the X, Y and rotation directions are provided on a stage unit. A semiconductor test apparatus provided with a probe card and capable of simultaneously measuring characteristics of a plurality of wafers with one LSI tester is disclosed.
[0007]
In addition, Patent Document 2 includes a wafer chuck that holds one wafer and a probe card holding unit that holds two or more probe cards, and inspects a plurality of chips in one wafer at the same time. A probing device is disclosed.
[0008]
However, even if the devices described in these documents are used, when the number of output pins in each chip included in the wafer is larger than the number of input terminals of the LSI tester, a plurality of types of probe cards are used. Therefore, it was necessary to measure one chip in multiple times.
[0009]
[Patent Document 1]
JP-A-3-99450 (page 1, FIG. 1)
[Patent Document 2]
JP-A-7-249660 (page 1, FIG. 1)
[0010]
[Problems to be solved by the invention]
In view of the above, the present invention provides an inspection apparatus and an inspection method for a semiconductor device which can save the trouble of replacing a probe card when measuring one chip in a plurality of times. Aim.
[0011]
[Means for Solving the Problems]
In order to solve the above-described problems, a semiconductor device inspection apparatus according to the present invention includes: (a) a semiconductor device inspection apparatus provided for obtaining electrical connection with a first group of pads of a semiconductor chip included in a semiconductor wafer; A first group of probes, a second group of probes provided for obtaining electrical connection with a second group of pads of the semiconductor chip adjacent to the semiconductor chip, and a first group and a second group of probes are supported. (B) a first group of probes in contact with a first group of pads of the first semiconductor chip, and a second group of probes adjacent to the first semiconductor chip. The relative positional relationship between the semiconductor wafer and the probe card is adjusted so as to contact the second group of pads of the semiconductor chip, and when the semiconductor chip to be measured is replaced, the semiconductor wafer is moved at a predetermined pitch with respect to the probe card. Moving the first group of probes into contact with the first group of pads of the second semiconductor chip and the second group of probes with the second group of pads of a third semiconductor chip adjacent to the second semiconductor chip Position adjusting means for adjusting the relative positional relationship between the semiconductor wafer and the probe card so as to contact the probe card.
[0012]
Here, the inspection device is included in the semiconductor wafer through the second group of probes, and a first measurement circuit that measures characteristics of a circuit included in the semiconductor wafer through the first group of probes. A second measurement circuit for measuring a characteristic of the circuit may be further provided.
[0013]
In addition, the method for inspecting a semiconductor device according to the present invention includes a first group of probes provided for obtaining an electrical connection with a first group of pads of a semiconductor chip included in a semiconductor wafer; Using a probe card including a second group of probes provided for obtaining electrical connection with a second group of pads of a semiconductor chip adjacent to the semiconductor chip, and a substrate supporting the first and second groups of probes. A first group of probes that contacts a first group of pads of a first semiconductor chip and a second group of probes that is adjacent to the first semiconductor chip. Adjusting the relative positional relationship between the semiconductor wafer and the probe card so as to contact the second group of pads of the semiconductor chip, and the circuit included in the first semiconductor chip via the first group of probes. of Measuring the characteristics of the circuit included in the second semiconductor chip through the second group of probes while measuring the performance of the semiconductor chip, and connecting the semiconductor wafer to the probe card when replacing the semiconductor chip to be measured. At a predetermined pitch so that the first group of probes comes into contact with the first group of pads of the second semiconductor chip and the second group of probes is moved to the third semiconductor chip adjacent to the second semiconductor chip. Adjusting the relative positional relationship between the semiconductor wafer and the probe card so as to contact the second group of pads; and measuring characteristics of a circuit included in the second semiconductor chip via the first group of probes. Measuring the characteristics of the circuit included in the third semiconductor chip via the second group of probes.
[0014]
According to the present invention configured as described above, the first group of probes is connected to the first group of pads of the first semiconductor chip, and the second group of probes is connected to the second group of pads of the second semiconductor chip. Are connected and the first group of probes are connected to the first group of pads of the second semiconductor chip, and the second group of probes are connected to the second group of pads of the third semiconductor chip. In this case, when one chip is measured a plurality of times, the labor for replacing the probe card can be saved. As a result, the number of inspection steps can be reduced, and only one probe card needs to be prepared, so that the inspection cost of the semiconductor device can be totally reduced.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the same components are denoted by the same reference numerals, and description thereof will be omitted.
FIG. 1 is a diagram showing a semiconductor wafer to be inspected in the present invention. As shown in FIG. 1, the semiconductor wafer 1 includes a large number of semiconductor chips T (m, n-1), T (m, n), T (m, n + 1), and the like.
[0016]
FIG. 2 is a view showing a probe card used in the semiconductor device inspection apparatus according to one embodiment of the present invention. The probe card used in the present invention is configured to measure a plurality of semiconductor chips. In the present embodiment, the probe card 2 is configured to measure two semiconductor chips.
[0017]
As shown in FIG. 2, the probe card 2 is provided for obtaining an electrical connection with the first group of pads (the left half pad in FIG. 2) of the semiconductor chip T (m, n-1). The first group of probes 3a is electrically connected to the second group of pads (the right half pad in FIG. 2) of the semiconductor chip T (m, n) adjacent to the semiconductor chip T (m, n-1). And a substrate 4 supporting the first and second groups of probes 3a and 3b. The substrate 4 has a conductive wiring pattern formed on an insulating substrate, and connects each of the first and second groups of probes 3a and 3b to the wiring of the input terminal or output terminal of the LSI tester. .
[0018]
FIG. 3 is a diagram showing an overall configuration of a semiconductor device inspection apparatus according to one embodiment of the present invention. As shown in FIG. 3, the inspection apparatus includes a probing apparatus 10 on which a probe card 2 is mounted and a circuit included in a semiconductor wafer 1 via a first group of probes 3a provided on the probe card 2. And a second LSI tester 30 for measuring characteristics of a circuit included in the semiconductor wafer 1 via a second group of probes 3b provided on the probe card 2. It is constituted by and.
[0019]
The probing apparatus 10 includes a support unit 5 for supporting the probe card 2, a wafer chuck unit 6 for fixing the semiconductor wafer 1, and a wafer chuck unit 6 for moving the wafer chuck unit 6 up and down, front and rear, and right and left with respect to the probe card 2. The housing includes a position adjuster 7 for adjusting a relative positional relationship and a housing 8.
[0020]
As shown in FIG. 2, the position adjusting unit 7 is configured such that the first group of probes 3 a contacts the first group of pads of the semiconductor chip T (m, n−1) and the second group of probes 3 b The relative positional relationship between the semiconductor wafer 1 and the probe card 2 is adjusted so as to contact the second group of pads of T (m, n). Further, when replacing the semiconductor chip to be measured, the position adjusting unit 7 moves the semiconductor wafer 1 at a predetermined pitch with respect to the probe card 2, and the first group of probes 3a moves the semiconductor chip T (m, n). ), The relative position between the semiconductor wafer 1 and the probe card 2 so that the second group of probes 3b contact the second group of pads of the semiconductor chip T (m, n + 1) while contacting the first group of pads. Adjust the relationship.
[0021]
Next, a semiconductor device inspection method according to the present invention will be described in detail. FIG. 4 is a diagram showing the semiconductor chips T (2,1) to T (2,6) in the second row included in the semiconductor wafer shown in FIG. Here, it is assumed that two types of measurement, that is, measurement A via the first group of pads and measurement B via the second group of pads are performed on each semiconductor chip.
[0022]
First, as shown in FIG. 4A, the measurement B is performed by bringing the second group of probes into contact with the second group of pads of the semiconductor chip T (2, 1). Next, as shown in FIG. 4B, the semiconductor wafer is moved at a predetermined pitch with respect to the probe card, and the first group of probes is placed on the first group of pads of the semiconductor chip T (2, 1). The measurement A is performed by making the contact, and the measurement B is performed by bringing the second group of probes into contact with the second group of pads of the semiconductor chip T (2, 2). Thus, the measurement of the semiconductor chip T (2, 1) ends.
[0023]
Further, as shown in FIG. 4C, the semiconductor wafer is moved at a predetermined pitch with respect to the probe card, and the first group of probes is brought into contact with the first group of pads of the semiconductor chip T (2, 2). Then, measurement A is performed, and measurement B is performed by bringing the second group of probes into contact with the second group of pads of the semiconductor chip T (2, 3). Thus, the measurement of the semiconductor chip T (2, 2) ends.
[0024]
Hereinafter, the same procedure is repeated. In FIG. 4D, the measurement A is performed by bringing the first group of probes into contact with the first group of pads of the semiconductor chip T (2, 5), and the semiconductor chip T (2 , 6), the second group of probes are brought into contact with the second group of pads to perform measurement B. Finally, measurement A is performed by bringing the first group of probes into contact with the first group of pads of the semiconductor chip T (2, 6). This completes the measurement of the semiconductor chips T (2,1) to T (2,6) in the second row of the second row. As described above, according to the present embodiment, when one chip is measured in plural times, each semiconductor chip included in one semiconductor wafer is inspected without replacing the probe card. be able to.
[Brief description of the drawings]
FIG. 1 is a view showing a semiconductor wafer to be inspected in the present invention.
FIG. 2 is a diagram showing a probe card used in one embodiment of the present invention.
FIG. 3 is a diagram showing an entire configuration of an inspection apparatus according to one embodiment of the present invention.
FIG. 4 is a view showing a semiconductor chip included in the semiconductor wafer shown in FIG. 1;
[Explanation of symbols]
Reference Signs List 1 semiconductor wafer, 2 probe card, 3a first group of probes, 3b second group of probes, 4 substrate, 5 support, 6 wafer chuck, 7 position adjuster, 8 housing, 10 probing device, 20, 30 LSI Tester

Claims (3)

An inspection device for a semiconductor device,
A first group of probes provided for obtaining electrical connection with a first group of pads of a semiconductor chip included in the semiconductor wafer; and a second group of pads of the semiconductor chip adjacent to the semiconductor chip. A probe card including a second group of probes provided to obtain an effective connection, and a substrate supporting the first and second groups of probes;
The first group of probes contacts a first group of pads of a first semiconductor chip, and the second group of probes contacts a second group of pads of a second semiconductor chip adjacent to the first semiconductor chip. Adjust the relative positional relationship between the semiconductor wafer and the probe card so that the semiconductor wafer to be measured is replaced at a predetermined pitch with respect to the probe card when replacing a semiconductor chip to be measured, A first group of probes contacts a first group of pads of the second semiconductor chip, and the second group of probes contacts a second group of pads of a third semiconductor chip adjacent to the second semiconductor chip. Position adjusting means for adjusting the relative positional relationship between the semiconductor wafer and the probe card so as to contact the
An inspection device comprising: A first measurement circuit that measures characteristics of a circuit included in the semiconductor wafer via the first group of probes;
A second measurement circuit that measures a characteristic of a circuit included in the semiconductor wafer via the second group of probes;
The inspection apparatus according to claim 1, further comprising: A first group of probes provided for obtaining electrical connection with a first group of pads of a semiconductor chip included in the semiconductor wafer; and a second group of pads of the semiconductor chip adjacent to the semiconductor chip. A semiconductor device inspection method for inspecting a semiconductor device using a probe card including a second group of probes provided for obtaining a proper connection and a substrate supporting the first and second groups of probes. So,
The first group of probes contacts a first group of pads of a first semiconductor chip, and the second group of probes contacts a second group of pads of a second semiconductor chip adjacent to the first semiconductor chip. Adjusting the relative positional relationship between the semiconductor wafer and the probe card so as to contact the
The characteristics of the circuit included in the first semiconductor chip are measured via the first group of probes, and the characteristics of the circuit included in the second semiconductor chip are measured via the second group of probes. Measuring a property;
When replacing the semiconductor chip to be measured, the semiconductor wafer is moved at a predetermined pitch with respect to the probe card, and the first group of probes comes in contact with the first group of pads of the second semiconductor chip. Adjusting the relative positional relationship between the semiconductor wafer and the probe card such that the second group of probes contacts a second group of pads of a third semiconductor chip adjacent to the second semiconductor chip. When,
The characteristics of the circuit included in the second semiconductor chip are measured via the first group of probes, and the characteristics of the circuit included in the third semiconductor chip are measured via the second group of probes. Measuring a property;
An inspection method comprising:

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