JP2004227793A - Manufacturing method of display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve problems that there is constraint in selecting abrasive in a cutting procedure in display panel manufacturing and that working time is long, and solve problems of an adverse effect by blasting and remaining of the abrasive. <P>SOLUTION: The cutting process is carried out in two stages of a primary cutting process in which the cutting is carried out by using a primary abrasive A having a high polishing speed, and a secondary process in which the cutting is carried out by using a secondary abrasive B having a lower polishing speed than that of the primary abrasive A. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【００２５】
上記の組み合わせのように、金属研磨材を使用した場合、その比重の大きさからブラストレートを上げることができるので、粗加工用の第１研磨材として金属研磨材を使用することで加工時間の短縮が図れる。
【００２６】
また、研磨材の粒子径を大きくすることでブラストレートを挙げることができるので、粗加工用の第１研磨材として平均粒子径の大きい研磨材を使用することで、加工時間の短縮が図れる。
【００２７】
逆に、研磨材の粒子径を小さくすることで精度を上げることができるので、仕上げ加工用の第２研磨材Ｂとして粒子径の小さい研磨材を使用することで高精度の加工が可能となる。
【００２８】
（第２の実施の形態）
次に、第２の実施の形態について説明する。
本実施の形態は、図２に示すように、切削加工工程を第１、第２、第３次工程の３段階に分けて行うものである。
【００２９】
まず、図２（ａ）に示すように、ガラス基板１上に電極パターン２を形成し、その電極形成面上に電極保護層３を一様に設けた後、その上に低融点ガラス材料ペーストをコーターにて塗布して乾燥させることで隔壁形成用材料層４を形成し、さらに隔壁形成用材料層４上に切削用マスク５を形成しておく。
【００３０】
次に、図２（ｂ）に示すように、研磨速度の大きい第１研磨材Ａを用いて隔壁形成用材料層４を切削加工する（第１切削加工工程）。
【００３１】
次に、図２（ｃ）に示すように、第１研磨材Ａよりも研磨速度が小さい第２研磨材Ｂを用いて、さらに隔壁形成用材料層４を切削加工する（第２切削加工工程）。
【００３２】
さらに、図２（ｄ）に示すように、第１研磨材Ａ及び第２研磨材Ｂよりも研磨速度が小さい第３研磨材Ｃを用いて、残った隔壁形成用材料層４を切削加工する（第３切削加工工程）。
【００３３】
そして、第３切削加工工程が終了したら、切削用マスク５を除去し、パターニングされた隔壁形成用材料層４を焼成することにより、図２（ｅ）に示すように、隔壁パターンが形成される。
【００３４】
すなわち、切削加工工程を、第１研磨材Ａによる第１切削加工工程（１次加工：粗加工）と、第１研磨材Ａより研磨速度の遅い第２研磨材Ｂによる第２切削加工工程（２次加工：仕上げ加工１）と、第２研磨材Ｂよりさらに研磨速度の遅い第３研磨材Ｃによる第３切削工程（３次加工：仕上げ加工２）の３段階に分けて行うようにしている。
【００３５】
第１研磨材Ａと第２研磨材Ｂと第３研磨材Ｃの組み合わせ例としては、以下の例が挙げられる。
（組み合わせ例）
第１研磨材Ａ：平均粒子径が１０〜３０μｍのステンレス粉末
第２研磨材Ｂ：平均粒子径が１０〜３０μｍの炭酸カルシウム粉末
第３研磨材Ｃ：平均粒子径が１０μｍ以下の炭酸カルシウム粉末
【００３６】
このように３段階に分けてブラスト処理を実施することにより、より高精度の加工を効率良く行うことができる。なお、さらに上記第３切削工程（３次加工）に続いて、４次加工以上の切削加工工程を追加してさらに高精度の加工を行ってもよい。
【００３７】
以上のように、本発明の実施の形態に係るディスプレイパネルの製造方法によれば、基板１上に隔壁形成用材料層４を形成する工程と、隔壁形成用材料層４上に隔壁パターンに対応した切削用マスク５を形成する工程と、研磨材を用いて切削用マスク５を介して隔壁形成用材料層４を切削加工する工程と、切削加工された隔壁形成用材料層４を焼成して基板上に隔壁パターンを形成する工程とを含むディスプレイパネルの製造方法において、切削加工工程を、研磨速度の大きい第１研磨材Ａを用いて切削加工する第１切削加工工程と、第１研磨材Ａより研磨速度が小さい第２研磨材Ｂを用いて切削加工する第２切削加工工程との２段階に分けて行う（第１の実施の形態）、さらに３段階以上に分けて行う（第２の実施の形態）ようにしたので、各研磨材の選択の幅（粒子径、材質、形状など）を広げることができる。
【００３８】
つまり、第１研磨材Ａは研磨速度の大きいものから自由に選択することができる。また、第２研磨材Ｂ、第３の研磨材Ｃは、研磨速度の小さいものから自由に選択することができる。
【００３９】
したがって、第１切削加工工程で研磨速度を上げ、第２切削加工工程以降では研磨精度を上げることにより、加工時間を短縮しながら、高精度の加工を行うことができる。
【００４０】
また、複数の加工工程における研磨材の自由な選択の組み合わせによって、基板、保護層、電極などへのダメージの問題を解消することができる。また、研磨材の残留による悪影響の問題も解消することができる。
その結果、ブラスト処理後の洗浄工程の簡略化も可能となる。
【図面の簡単な説明】
【図１】本発明の第１実施の形態における切削加工の工程図である。
【図２】本発明の第２実施の形態における切削加工の工程図である。
【符号の説明】
１ ガラス基板
２ 電極パターン
３ 電極保護層
４ 隔壁形成用材料層
５ 切削用マスク
Ａ 第１研磨材
Ｂ 第２研磨材
Ｃ 第３研磨材[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a display panel including a step of forming a partition wall by cutting (sandblasting).
[0002]
[Prior art]
At present, partition walls (ribs formed between linear electrodes) of a display panel such as a plasma display panel are generally formed by a sandblast method (for example, see Patent Document 1).
[0003]
In the step of forming a partition of a display panel using such a sandblasting method, first, an electrode pattern is formed on a glass substrate, an electrode protective layer is uniformly provided on the electrode forming surface, and then a low melting point glass is formed thereon. A material paste is applied by a coater and dried to form a material layer for forming a partition, and further, a mask for blast is formed on the material layer for forming a partition, and a partition is formed by using an abrasive through the mask. After the material layer is cut off and the mask is removed, the patterned partition wall forming material layer is baked to form the partition walls.
At the time of the above-mentioned cutting processing, processing is performed using one kind of abrasive, and as a representative abrasive, inorganic powder such as calcium carbonate and alumina is used.
[0004]
[Patent Document 1]
Patent No. 3110719 (FIG. 2)
[0005]
[Problems to be solved by the invention]
However, in the above-mentioned prior art, since the blasting process is performed from the beginning to the end using one kind of abrasive, when attempting to process the partition wall with high accuracy, the particle diameter, material, and shape of the abrasive to be used are used. However, there is a problem that processing time is long.
[0006]
On the other hand, when a high-hardness abrasive such as alumina is used, the processing time can be shortened because the blast rate is high, but there is a problem of damage to the substrate, the protective layer, the electrodes, and the like.
[0007]
In addition, when a metal abrasive such as stainless steel is used, the specific gravity is large, so that the blast rate can be increased and the processing time can be shortened, but the effect of the residual metal as the abrasive on the panel characteristics, especially in the case of white ribs Can cause discoloration problems. For this reason, it is necessary to enhance the cleaning process after sandblasting in order to eliminate the adverse effect of the residue.
[0008]
The problem to be solved by the present invention is to solve the above-mentioned problems in the prior art, such as the restriction on the selection of the abrasive material, the problem of long processing time, the adverse effect of blasting, and the problem of residual abrasive material. Each is given as an example.
[0009]
[Means for Solving the Problems]
The invention according to claim 1, wherein a step of forming a partition-forming material layer on a substrate, a step of forming a mask corresponding to the partition pattern on the partition-forming material layer, and the step of forming a mask using an abrasive A step of cutting the partition wall forming material layer through, and a step of firing the cut partition wall forming material layer to form a partition pattern on a substrate, The cutting step includes a first cutting step of cutting using a first abrasive having a high polishing rate, and a second cutting step of cutting using a second abrasive having a lower polishing rate than the first abrasive. And a step.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments according to the present invention will be described with reference to the drawings.
FIG. 1 is a manufacturing process diagram of the first embodiment of the present invention, and FIG. 2 is a manufacturing process diagram of the second embodiment of the present invention.
[0011]
(First Embodiment)
A first embodiment according to the present invention will be described with reference to FIG.
First, as shown in FIG. 1A, an electrode pattern 2 is formed on a glass substrate 1, which is a substrate, and an electrode protection layer 3 is uniformly provided on the electrode forming surface. A glass material paste is applied by a coater and dried to form a partition forming material layer 4, and a cutting mask 5 is formed on the partition forming material layer 4.
[0012]
Next, as shown in FIG. 1B, the partition-forming material layer 4 is cut using a first abrasive A having a high polishing rate (first cutting step).
[0013]
Further, as shown in FIG. 1C, the remaining partition wall forming material layer 4 is cut using a second abrasive B having a lower polishing rate than the first abrasive A (second cutting step). ).
[0014]
Then, when the second cutting process is completed, the cutting mask 5 is removed, and the patterned partition wall forming material layer 4 is baked to form a partition wall pattern as shown in FIG. .
[0015]
As described above, in the manufacturing method of the present embodiment, the cutting process is performed in two stages of the roughing (the first cutting process) and the finishing process (the second cutting process). And different abrasives are used for finishing.
[0016]
That is, in the rough processing (first cutting processing step) shown in FIG. 1B, in order to perform processing with high efficiency, the cutting processing is performed using the first abrasive A for rough processing having a high polishing rate. .
[0017]
Next, in the finishing process (second cutting process) shown in FIG. 1C, a cutting process is performed using a second polishing material B for finishing, which has a lower polishing rate than the first polishing material A.
[0018]
In conventional cutting (sandblasting) processing, only one type of abrasive material that matches the final processing accuracy is used, and cutting is performed to the end, so processing time was long. In the cutting step in the embodiment, since the polishing material A having a high polishing rate is used as the rough processing, the processing time can be reduced.
[0019]
Further, in the present embodiment, since the remaining polishing material (first polishing material A) at the time of rough processing can be removed at the time of finishing processing, selection of the first polishing material A to be used at the time of rough processing is free. it can.
As a result, it is possible to use a polishing material which cannot be used because of problems such as residual polishing material and processing accuracy, and processing can be performed with high efficiency.
[0020]
Further, by selecting a second abrasive material B for finishing that does not cause a problem even if it remains, the cleaning process after the cutting process can be simplified.
[0021]
Examples of the combination of the first abrasive A for the roughing (the first cutting step) and the second abrasive B for the finishing (the second cutting step) include the following combination examples 1, 2, 3 and the like. Can be
[0022]
(Combination example 1)
First abrasive A: stainless powder having an average particle diameter of 10 to 30 μm Second abrasive B: calcium carbonate powder having an average particle diameter of 10 to 30 μm
(Combination example 2)
First abrasive A: calcium carbonate powder having an average particle diameter of 50 to 70 μm Second abrasive B: calcium carbonate powder having an average particle diameter of 10 to 30 μm

[0025]
When a metal abrasive is used as in the above combination, the blast rate can be raised from the specific gravity of the metal abrasive, so that the processing time can be reduced by using the metal abrasive as the first abrasive for roughing. It can be shortened.
[0026]
In addition, since the blast rate can be increased by increasing the particle diameter of the abrasive, the processing time can be reduced by using an abrasive having a large average particle diameter as the first abrasive for rough processing.
[0027]
Conversely, the precision can be improved by reducing the particle diameter of the abrasive, so that high-precision processing can be performed by using an abrasive having a small particle diameter as the second abrasive B for finishing. .
[0028]
(Second embodiment)
Next, a second embodiment will be described.
In the present embodiment, as shown in FIG. 2, the cutting process is performed in three stages of first, second, and third steps.
[0029]
First, as shown in FIG. 2A, an electrode pattern 2 is formed on a glass substrate 1, an electrode protection layer 3 is uniformly provided on the electrode forming surface, and then a low melting glass material paste is formed thereon. Is applied by a coater and dried to form a partition-forming material layer 4, and a cutting mask 5 is formed on the partition-forming material layer 4.
[0030]
Next, as shown in FIG. 2B, the material layer 4 for forming the partition walls is cut using the first abrasive A having a high polishing rate (first cutting step).
[0031]
Next, as shown in FIG. 2C, the material layer 4 for forming partition walls is further cut using a second abrasive B having a lower polishing rate than the first abrasive A (second cutting step). ).
[0032]
Further, as shown in FIG. 2D, the remaining partition wall forming material layer 4 is cut using a third abrasive C having a lower polishing rate than the first abrasive A and the second abrasive B. (3rd cutting process).
[0033]
Then, when the third cutting step is completed, the cutting mask 5 is removed, and the patterned partition wall forming material layer 4 is baked to form a partition wall pattern as shown in FIG. .
[0034]
That is, the cutting process includes a first cutting process using a first abrasive A (primary processing: roughing) and a second cutting process using a second abrasive B having a lower polishing rate than the first abrasive A ( Secondary processing: finishing processing 1) and a third cutting step (tertiary processing: finishing processing 2) using a third polishing material C having a lower polishing rate than the second polishing material B are performed in three stages. I have.
[0035]
Examples of combinations of the first abrasive A, the second abrasive B, and the third abrasive C include the following examples.
(Combination example)
First abrasive A: stainless steel powder having an average particle diameter of 10 to 30 μm Second abrasive B: calcium carbonate powder having an average particle diameter of 10 to 30 μm Third abrasive C: calcium carbonate powder having an average particle diameter of 10 μm or less [ [0036]
By performing the blast processing in three stages as described above, more accurate processing can be performed efficiently. It should be noted that, following the third cutting step (tertiary processing), a fourth or higher cutting step may be added to perform higher-precision processing.
[0037]
As described above, according to the display panel manufacturing method according to the embodiment of the present invention, the step of forming the partition wall forming material layer 4 on the substrate 1 and the step of forming the partition wall pattern on the partition forming material layer 4 are performed. Forming the cut mask 5, cutting the partition forming material layer 4 through the cutting mask 5 using an abrasive, and firing the cut partition forming material layer 4. In a method for manufacturing a display panel including a step of forming a partition pattern on a substrate, a cutting step is performed by using a first abrasive A having a high polishing rate, and a first abrasive is formed. The cutting is performed in two steps of a second cutting step of cutting using the second abrasive material B having a lower polishing rate than A (first embodiment), and is further performed in three or more steps (second step). Embodiment) The range of selection of the abrasive (particle size, material, shape, etc.) can be widened.
[0038]
That is, the first abrasive A can be freely selected from those having a high polishing rate. Further, the second abrasive B and the third abrasive C can be freely selected from those having a low polishing rate.
[0039]
Therefore, by increasing the polishing rate in the first cutting step and increasing the polishing accuracy in the second and subsequent cutting steps, high-precision processing can be performed while shortening the processing time.
[0040]
In addition, the problem of damage to the substrate, the protective layer, the electrode, and the like can be solved by a combination of freely selecting abrasives in a plurality of processing steps. In addition, the problem of the adverse effect due to the residual abrasive can be solved.
As a result, the cleaning process after the blasting process can be simplified.
[Brief description of the drawings]
FIG. 1 is a process chart of a cutting process according to a first embodiment of the present invention.
FIG. 2 is a process chart of a cutting process according to a second embodiment of the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 glass substrate 2 electrode pattern 3 electrode protective layer 4 material layer 5 for forming partition walls 5 cutting mask A first abrasive B second abrasive C third abrasive

Claims (5)

A step of forming a partition-forming material layer on a substrate, a step of forming a mask corresponding to a partition pattern on the partition-forming material layer, and the partition-forming material layer via the mask using an abrasive A step of cutting and forming a partition pattern on a substrate by firing the cut partition wall forming material layer, the method for manufacturing a display panel,
The cutting step is a first cutting step of cutting using a first abrasive having a high polishing rate;
A second cutting step of cutting using a second abrasive having a lower polishing rate than the first abrasive,
A method for manufacturing a display panel, comprising: 2. The method according to claim 1, wherein an abrasive having an average particle diameter smaller than that of the first abrasive is used as the second abrasive. 3. 3. The display panel according to claim 2, wherein an abrasive having an average particle diameter of 10 to 30 [mu] m is used as the first abrasive, and an abrasive having an average particle diameter of 50 to 70 [mu] m is used as the second abrasive. Production method. 4. The method according to claim 1, wherein any one of stainless steel powder, alumina powder, and silicon carbide powder is used as the first abrasive, and calcium carbonate powder is used as the second abrasive. Display panel manufacturing method. 5. The method according to claim 1, wherein the cutting step further includes a third cutting step of performing cutting using a third abrasive having a lower polishing rate than the second abrasive. 6. Display panel manufacturing method.

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