JP2004223866A - Mold for molding risin and resin molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold for molding resin which does not need an ejector pin, a high pressure fluid ejection mechanism or the like and makes the release of a molded article possible by a simple constitution, and a resin molding method. <P>SOLUTION: The mold for molding the resin is used when a molded article 21 including a cured resin 20 is produced by curing the molten resin charged in the cavity 11 provided to the lower mold 1 opposed to an upper mold 2 to form the cured resin 20. A piezoelectric body 6A provided in the lower mold 1 to constitute a cavity surface 12 which is a part of a mold surface at a part to be filled with the molten cured resin 20 and a power supply 18 which applies voltage to the piezoelectric body 6A are provided to the mold for molding the resin. Voltage is applied to the piezoelectric body 6A to displace the body 6A along the cavity surface 12. By this constitution, the piezoelectric body 6A is displaced in a direction eliminating the adhesion between the cavity surface 12 and the cured resin 20 of the molded article 21. By opening the lower mold 1 and the upper mold 2, the molded article 21 sucked by the upper mold 2 can be released from the lower mold 1. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
TECHNICAL FIELD The present invention relates to a resin molding die and a resin molding method used when a molded product is formed by curing a molten resin filled in a cavity of a mold and the molded product is taken out.
[0002]
[Prior art]
Conventionally, a mechanism called an ejector pin has been used to cure a molten resin filled in a cavity to generate a cured resin, and to release and remove a molded product mainly composed of the cured resin (for example, Patent Document 1). This is a mechanism in which an ejector plate that can move up and down is provided separately from the mold body below and / or above the mold (or both of them), and a molded product is ejected by an ejector pin attached to the ejector plate to release the mold. It is. Further, the following configuration has been proposed in which there is no need to provide an ejector pin. First, there is proposed a configuration in which a hole and a valve pin are provided on a cavity surface, and a molded product is released from the cavity surface by injecting a high-pressure fluid such as compressed air from the hole opened by the valve pin when the mold is opened. (For example, see Patent Document 1). Secondly, there has been proposed a configuration in which a molded product is released from the cavity surface by applying required vibration to the cavity surface. This vibration is applied to the cavity surface by vibration generating means provided separately from the mold, and has an amplitude of about 1 to 2 μm (for example, see Patent Document 2).
[0003]
[Patent Document 1]
Japanese Utility Model Laid-Open Publication No. 2-36039 (FIGS. 1, 2, and 9)
[Patent Document 2]
JP-A-5-326597 (page 5-6, FIG. 1)
[0004]
[Problems to be solved by the invention]
However, according to the above conventional technique, there are the following problems. First, in the case of an ejector pin, a space for elevating and lowering the ejector plate is required, so that the size of the device cannot be reduced. In the case of injecting a high-pressure fluid, a compressor, a high-pressure fluid tank, piping, and the like are required, so that the size of the apparatus cannot be reduced in this case as well. When the molded product is released from the cavity surface by applying the required vibration, not only the portion where the cavity surface and the molded product are in close contact with each other is vibrated, but the entire mold component is removed from the outside of the mold. Vibration causes inefficiency and complicates the device. Furthermore, depending on the characteristics of the molten resin, the adhesion between the cured resin and the cavity surface may be so strong that the molded product may not be sufficiently released.
[0005]
Further, in resin molding, when a chip-like element (such as a semiconductor chip) mounted on a substrate is resin-sealed to produce a package of an electronic component, there are the following unique problems. The problems are thinner packages in recent years, the need for multiple substrates (and larger molded products) in response to cost requirements, and the adhesion of cured resin to ensure reliability due to smaller packages. Due to the tendency to increase sex. First, when an ejector pin is used, there is a possibility that a crack is generated in a protruding portion and the reliability is reduced as the package becomes thinner. In addition, as the size of the molded product increases, it is necessary to increase the protruding portion, that is, the number of ejector pins, so that the device becomes complicated. These problems are exacerbated by the increased adhesion of the cured resin. Next, when a high-pressure fluid is used, it is necessary to increase the fluid pressure in order to cope with an increase in the size of the molded product and an increase in the adhesion of the cured resin. In this case, as the molded product becomes thinner, cracks may occur and the reliability may decrease. Next, when using vibration, there is a possibility that the molded product cannot be sufficiently released from the mold due to an increase in the size of the molded product and an increase in the adhesion of the cured resin. Then, since the vibration is externally applied to the mold having the cavity, the cured resin in the cavity and the mold belong to the same vibration system. Therefore, even if the amplitude, which is about 1 to 2 μm, is increased, the force acting on the surface where the cavity surface and the molded product are in close contact with each other is limited to the inertial force generated by vibration, and moreover, one side of the cavity. Alternatively, since one of the bottom surfaces acts to prevent mold release, the mold release effect is not significantly improved.
[0006]
The present invention has been made to solve the above-described problem, and has as its object to provide a resin molding die and a resin molding method that enable a molded product to be released with a simple configuration.
[0007]
[Means for Solving the Problems]
In order to solve the above-mentioned technical problems, the resin molding die according to the present invention forms a cured resin by curing a molten resin filled in a cavity provided in any of the opposing mold groups. A resin molding die used at the time of producing a molded article containing at least the cured resin, wherein at least a part of a mold surface in a part to be filled with a molten resin provided in any of the mold groups And a power supply for applying a voltage to the piezoelectric body, and a molded article is released by applying a voltage to the piezoelectric body to displace the piezoelectric body.
[0008]
According to this, the piezoelectric body is displaced by applying a voltage to the piezoelectric body constituting at least a part of the mold surface in the portion to be filled with the molten resin. Therefore, a force is generated between the mold surface and the molded product that comes into close contact with the mold surface, so that the molded product is released from the mold surface.
[0009]
Further, a resin molding die according to the present invention is characterized in that, in the above-described resin molding die, a piezoelectric body to which a voltage is applied is displaced in a direction along a mold surface.
[0010]
According to this, a force is generated in a direction along the mold surface between the mold surface in a portion to be filled with the molten resin and the molded product that is in close contact with the mold surface. Therefore, this force, that is, the force generated in the direction along the surface where the mold surface and the molded product are in close contact with each other, eliminates the close contact between them, and the molded product is released from the mold surface.
[0011]
Further, a resin molding die according to the present invention is characterized in that, in the above-described resin molding die, a piezoelectric body to which a voltage is applied is displaced in a direction intersecting a mold surface.
[0012]
According to this, a force is generated in a direction intersecting the mold surface between the mold surface in a portion to be filled with the molten resin and the molded product closely contacting the mold surface. Therefore, this force, that is, the force generated in the direction intersecting the surface where the mold surface and the molded product are in close contact with each other acts on the molded product, so that the close contact between them is eliminated, and the molded product is released from the mold surface. .
[0013]
Further, in the resin molding die according to the present invention, in the above-described resin molding die, by intermittently applying the voltage to the piezoelectric body, or periodically changing the polarity of the voltage applied to the piezoelectric body. By inverting, the piezoelectric body is displaced so as to vibrate and the molded article is released.
[0014]
According to this, the piezoelectric body constituting at least a part of the mold surface in the portion to be filled with the molten resin is in close contact with the molded product and forms a vibration system independent of the molded product. Specifically, between the mold surface and the molded product which is in close contact with the mold surface, the generation and disappearance of the force for eliminating the adhesion between the two are repeated, or the direction of the force for eliminating the adhesion between the two is periodically changed. Invert. Therefore, the molded product is reliably released from the mold surface by repeatedly applying a force for eliminating the close contact between the molded products.
[0015]
Further, the resin molding method according to the present invention includes a step of clamping the opposing mold group, a step of bringing the molten resin into a cavity provided in any of the mold groups, and a step of filling. Forming a cured resin by curing the melted resin to form a molded article containing at least the cured resin, a step of opening a mold group, and a step of releasing the molded article. In the step of releasing the mold, a voltage is applied to the piezoelectric body constituting at least a part of the mold surface in the part to be filled with the molten resin provided in one of the mold groups to displace the piezoelectric body. It is characterized in that the molded product is released from the mold.
[0016]
According to this, the piezoelectric body is displaced by applying a voltage to the piezoelectric body constituting at least a part of the mold surface in the portion to be filled with the molten resin. Therefore, since a force for releasing the close contact between the mold surface and the molded product that is in close contact with the mold surface is generated, the molded product can be released from the mold surface.
[0017]
In the resin molding method according to the present invention, in the above-described resin molding method, in the step of releasing the mold, the voltage is applied intermittently to the piezoelectric body, or the polarity of the voltage applied to the piezoelectric body is changed. Is periodically inverted to displace the piezoelectric body so as to vibrate and release the molded product.
[0018]
According to this, the piezoelectric body constituting at least a part of the mold surface in the portion to be filled with the molten resin is in close contact with the molded product and forms a vibration system independent of the molded product. Specifically, between the mold surface and the molded product that is in close contact with the mold surface, the generation and elimination of the force for eliminating the adhesion between the two are repeated, or the direction of the force for eliminating the adhesion between the two is periodically reversed. Let it. Therefore, the molded product is reliably released from the mold surface by repeatedly applying a force for eliminating the adhesion between the two to the molded product.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
A resin molding die and a resin molding method according to the present invention will be described with reference to the drawings. In the following description, as an example of resin molding, when a chip-shaped element (hereinafter, referred to as a “chip”) such as a semiconductor chip mounted on a substrate such as a printed board is resin-sealed to manufacture an electronic component package, That is, resin sealing will be described.
[0020]
(1st Embodiment)
Hereinafter, a first embodiment of a resin molding die according to the present invention will be described with reference to FIG. 1A and 1B are partial cross-sectional views showing a structure and a state where a voltage is applied, respectively, of a resin molding die according to the present embodiment. In each of the drawings shown below, the sizes, operations, and the like of the components are exaggerated.
[0021]
In FIG. 1, a lower mold 1 and an upper mold 2 facing the lower mold 1 constitute a mold group 3 for resin sealing by transfer molding. The lower mold 1 includes a base block 4, a cavity block 5, and a piezoelectric body 6A described later. The base block 4 is provided with a concave portion 7. In the concave portion 7, a block-shaped piezoelectric body 6A composed of a block-shaped piezoelectric element 8A and a coating 9A covering the surface is fixed at the center to the base block 4, and a gap is formed between the base block 4 at both ends. 10 are provided so as to be slidable in the left-right direction in the figure. An opening is provided in the cavity block 5, and a space surrounded by the opening and the coating 9 </ b> A, which is the upper surface of the piezoelectric body 6 </ b> A, forms a cavity 11 which is a space filled with the molten resin. That is, the cavity surface 12 on the bottom surface of the mold surface constituting the cavity 11 is formed of the coating 9A, which is the upper surface of the piezoelectric body 6A. In addition, a resin flow path 13 is provided in communication with the cavity 11, and the resin flow path 13 communicates with a known resin supply means (not shown) including, for example, a pot in which a plunger is provided. That is, the space in the resin supply means, the resin flow path 13 and the cavity 11 are parts of the mold group 3 to be filled with the molten resin.
[0022]
The upper die 2 is provided with a suction pipe 14 in communication with an exhaust pump (not shown). Then, the substrate 16 on which the chip 15 is mounted is sucked and fixed to the mold surface of the upper mold 2 by the suction pipe 14. Further, a heater (not shown) for heating the molten resin is embedded in the lower mold 1. Further, the base block 4 and the cavity block 5 may be integrated to form the lower mold 1 together.
[0023]
Here, the structure, connection and operation of the piezoelectric body 6A composed of the piezoelectric element 8A and the coating 9A will be described. First, the piezoelectric element 8A is made of, for example, a barium titanate, lead zirconate titanate (PZT), or a ternary composite perovskite material added with a third component for improving piezoelectric characteristics and temperature characteristics. It is composed of conductive ceramics. The direction in which the piezoelectric element 8A is displaced is selected according to the polarization direction during manufacture, the position of the electrode during use, and the polarity of the applied voltage. In this embodiment, when a predetermined voltage is applied, the piezoelectric element 8A is displaced so as to expand or contract in both the left and right directions in the figure. The coating 9A is a thin film made of, for example, a fluororesin, and functions as an insulating layer, a smooth layer, and a release layer. Electrodes (not shown) are provided at both ends of the piezoelectric element 8A, and these electrodes are connected to a DC power supply 18 by wiring 17, and a switch 19 is provided in the middle of the wiring 17. In FIG. 1, the piezoelectric body 6A is configured to expand when a voltage is applied. Thus, when the switch 19 is turned on, the piezoelectric body 6A expands so as to eliminate the gap 10 in the direction of the thick arrow in FIG. 1A, and contracts to its original state when it is turned off.
[0024]
The operation of the resin molding die according to the present embodiment will be described with reference to FIG. First, as shown in FIG. 1 (A), the lower die 1 and the upper die 2 are clamped in a state where the substrate 16 is adsorbed on the die surface of the upper die 2 by the suction pipe 14. Thereafter, a molten resin (not shown) made of a thermosetting resin is filled into the cavity 11 via the resin flow path 13, and the filled molten resin is further heated and cured.
[0025]
Next, as shown in FIG. 1B, in a state where the lower mold 1 and the upper mold 2 are clamped, a cured resin 20 formed by curing a molten resin, a substrate 16 and a chip (not shown) Is completed. Thereafter, the switch 19 is turned on, and a voltage is applied to the piezoelectric body 6A to expand it. Accordingly, the piezoelectric body 6A constituting the cavity surface 12 is displaced in a direction along the cavity surface 12, that is, in a direction in which the close contact between the cavity surface 12 and the cured resin 20 of the molded product 21 is eliminated. Further, even when the switch 19 is turned off and the piezoelectric body 6A is contracted to its original state, the piezoelectric body 6A is displaced in a direction to eliminate the close contact between the cavity surface 12 and the cured resin 20. Therefore, the molded article 21 adsorbed by the upper mold 2 can be released from the lower mold 1 by opening the mold while applying or applying a voltage to the piezoelectric body 6A. Also, when a voltage is applied to the piezoelectric body 6A to expand it, the application is released, and the piezoelectric body 6A is contracted to the original state, the molded article 21 can be similarly released from the lower mold 1. The same applies to the case where the piezoelectric body 6A to which the voltage is applied is displaced in one direction to the left (or right).
[0026]
As described above, according to the present embodiment, the piezoelectric body 6A forming the cavity surface 12 is displaced in the direction along the cavity surface 12. Then, all of the forces generated by this displacement directly act on the contact surface between the cavity surface 12 and the molded product 21 to eliminate the contact between the cavity surface 12 and the molded product 21. Therefore, the molded article 21 can be released from the cavity surface 12 and thus from the lower mold 1 without providing an ejector pin, a high-pressure fluid injection mechanism, or the like.
[0027]
In the description of the present embodiment, one piezoelectric body 6A is provided in the recess 7. The invention is not limited to this, and a plurality of piezoelectric bodies may be provided in the recess 7 as a modification. 2A and 2B are partial cross-sectional views showing a structure and a state where a voltage is applied, respectively, in a modified example of the resin molding die according to the present embodiment. In FIG. 2, two piezoelectric bodies 6B each composed of a piezoelectric element 8B and a coating 9B covering the surface of the piezoelectric element 8B are in contact with each other at the center of the cavity 11 and are connected to the base block 4 at the other ends. A gap 10 is provided between them, and they are slidably arranged in the left-right direction in the figure. Also in this modification, the two piezoelectric bodies 6B try to expand toward both ends in the direction of the thick arrow in FIG. 2A when a voltage is applied. Since one end is in contact with the other at the center of the cavity 11, each of the two piezoelectric bodies 6B extends toward the free end. Therefore, the same effect as that shown in FIG. 1 can be obtained, and in addition, a larger displacement can be obtained. The same applies when three or more piezoelectric bodies are used.
[0028]
In the description of the present embodiment, the piezoelectric bodies 6A and 6B to which the voltage is applied are extended in the left and right directions in the drawing. The present invention is not limited thereto, and the piezoelectric bodies 6A and 6B to which the voltage is applied may contract in the left-right direction in the drawing. In this case, the same effect as that shown in FIGS. 1 and 2 can be obtained.
[0029]
(Second embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to FIG. FIGS. 3A and 3B are partial cross-sectional views showing the structure and a state where a voltage is applied, respectively, of the resin molding die according to the present embodiment. In this embodiment, a single block-shaped piezoelectric body 6C composed of a piezoelectric element 8C and a coating 9C covering the surface thereof is provided in the recess 7 between the base block 4 and the cavity block 5 at both ends. Fixed. Then, when a predetermined voltage is applied by turning on the switch 19, the piezoelectric body 6C expands or contracts in the vertical direction in the figure (not necessarily in the direction perpendicular to the mold surface). Displace. In FIG. 3, when a voltage is applied, the piezoelectric body 6C is configured to expand in the direction of the thick arrow in FIG. 3A.
[0030]
According to the present embodiment, as shown in FIG. 3B, both ends of the piezoelectric body 6C to which the voltage is applied are fixed, and the lower surface is in contact with the base block 4, so that the piezoelectric body 6C is fixed. Only the portion that does not exist, that is, the portion of the cavity surface 12 is extended and displaced upward in the drawing, in other words, in the direction crossing the mold surface (cavity surface 12) in the cavity 11. As a result, a force for releasing the lower mold 1 and the molded product 21 acts on a portion other than the cavity surface 12, so that the adhesion between the entire lower mold 1 and the molded product 21 is reduced. Therefore, the mold 21 adsorbed by the upper mold 2 is separated from the lower mold 1 by opening the lower mold 1 and the upper mold 2 while applying a voltage to the piezoelectric body 6C or after applying the voltage. Can be typed.
[0031]
As described above, also according to the present embodiment, the molded article 21 can be released from the lower mold 1 without providing an ejector pin, a high-pressure fluid ejection mechanism, and the like.
In the description of the present embodiment, the piezoelectric body 6C to which the voltage is applied is displaced so as to increase the thickness. The present invention is not limited thereto, and the piezoelectric body 6C to which the voltage is applied may be displaced so as to reduce the thickness. In particular, in this case, a force for releasing the lower mold 1 and the molded product 21 from each other can be applied to a wide area including most of the central portion of the molded product 21. Therefore, since the molded article 21 is released from the lower mold 1 with a small force, the occurrence of cracks in the molded article 21 can be prevented and the reliability can be improved.
[0032]
(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described with reference to FIG. FIGS. 4A and 4B are partial cross-sectional views respectively showing a structure and a state where a voltage is applied to the resin molding die according to the present embodiment. In the present embodiment, one or a plurality of concave portions 22 are provided in the base block 4, and a block-shaped piezoelectric body 6D including a piezoelectric element 8D and a coating 9D is provided in each concave portion 22. The piezoelectric body 6D is configured so that the upper surface is flush with the cavity surface 12 when no voltage is applied, and expands in the direction of the thick arrow in FIG. 4A when a voltage is applied. ing.
Further, since the piezoelectric body 6D is configured such that the lower surface is in contact with the base block 4, when a voltage is applied, as shown in FIG. 4B, the upper surface forming the cavity surface 12 is formed. Is displaced upward in the drawing, that is, in a direction crossing the mold surface (cavity surface 12) in the cavity 11.
[0033]
According to the present embodiment, when a voltage is applied to the piezoelectric body 6D by turning on the switch 19, the piezoelectric body 6D expands and its upper surface is displaced upward in the drawing. As a result, a force for releasing the lower mold 1 and the molded product 21 acts on a portion of the cavity surface 12 other than the upper surface of the piezoelectric body 6D, so that the adhesion between the entire lower mold 1 and the molded product 21 is reduced. I do. Therefore, the mold 21 adsorbed by the upper mold 2 is separated from the lower mold 1 by opening the lower mold 1 and the upper mold 2 while applying a voltage to the piezoelectric body 6D or after applying the voltage. Can be typed. As described above, also according to the present embodiment, the molded article 21 can be released from the lower mold 1 without providing an ejector pin, a high-pressure fluid ejection mechanism, and the like.
[0034]
Further, in the present embodiment, the arrangement location, the number, and the area of the upper surface of the piezoelectric bodies 6D can be arbitrarily determined. Thereby, the location, number, and area of the upper surface of the piezoelectric bodies 6D can be optimally determined according to the adhesion between the entire lower mold 1 and the molded article 21, the area of the portion where the two adhere, and the like. . Further, when a voltage is applied to the piezoelectric body 6D, the piezoelectric body 6D may be contracted.
[0035]
In the description of each of the above embodiments, the case where the chip is sealed with resin by transfer molding has been described. Not limited to this, a plate-like, granular, or powdery resin material is arranged in the cavity, and the cavity is filled with a molten resin formed by melting the resin material. The present invention may be applied to so-called compression molding in which a chip mounted thereon is immersed in a molten resin and the molten resin is cured. The present invention can also be applied to resin molding other than transfer molding and compression molding, for example, injection molding. Also in these cases, the molded product can be released from the mold surface in the cavity or the like filled with the molten resin.
[0036]
Further, by turning on the switch 19, the piezoelectric bodies 6A to 6D are displaced. The invention is not limited thereto, and the switch 19 can be turned on / off intermittently. In this case, the piezoelectric bodies 6A to 6D constituting at least a part of the cavity surface 12 are in close contact with the molded article 21 and constitute a vibration system independent of the molded article 21. Specifically, by repeating the expansion or compression of the piezoelectric bodies 6A to 6D and the return to the original state, the close contact between the cavity surface 12 and the molded article 21 that is in close contact with the cavity surface 12 is eliminated. The generation and disappearance of force are repeated. Therefore, by repeatedly applying a force for eliminating the close contact between the cavity surface 12 and the molded product 21 to the molded product 21, the molded product 21 can be reliably released from the cavity surface 12. The polarity of the DC power supply 18 may be periodically inverted by the switch 19, and an AC power supply may be used as the power supply 18. Also in these cases, the effect of reliably releasing the molded product 21 from the cavity surface 12 can be obtained by vibrating the piezoelectric bodies 6A to 6D.
[0037]
Also, block-shaped piezoelectric elements 8A to 8D and piezoelectric bodies 6A to 6D were used. Not limited to this, a thin plate-shaped piezoelectric element may be used depending on the characteristics such as the size, shape, and type of the molded product 21 or the degree of adhesion between the cured resin 20 and the lower mold 1. Further, a bimorph-type piezoelectric element which is thin and has a large displacement by bending and displacing in the thickness direction may be used. In this case, two bimorph-type piezoelectric elements are joined together at one end at the center of the cavity surface 12, the other end is fixed to the lower mold 1, and a supporting member provided below the piezoelectric element Is preferably provided so as to be able to move up and down freely. Then, when the mold is opened, a voltage may be applied so that the joined one end of each piezoelectric element is displaced downward in the drawing, and the supporting member may be lowered.
[0038]
In addition, the surfaces of the piezoelectric elements 8A to 8D are covered with the coatings 9A to 9D. However, regarding these coatings, the adhesiveness between the cured resin 20 and the lower mold 1 such as the size, shape, and type of the molded product 21 is determined. Or by the use of a release film.
[0039]
Further, in addition to the cavity surface 12, a piezoelectric body may be provided on a mold surface of a resin flow path 13 or a resin supply means (not shown) which is another portion to be filled with the molten resin. According to this, a force is evenly applied over the entire surface of the cured resin 20. Therefore, since the molded article 21 is released from the mold with a small force, it is possible to prevent occurrence of cracks in the molded article 21 and to improve appearance quality and reliability.
[0040]
Further, the bottom surface of the surfaces constituting the cavity 11 was defined as the cavity surface 12, and the piezoelectric bodies 6A to 6D were provided on this surface. The present invention is not limited to this, and the piezoelectric body may be provided on the inclined surface in FIGS. Further, a piezoelectric body can be provided on both the bottom surface and the inclined surface of the surface constituting the cavity 11.
Further, the portion where the base block 4 and the cavity block 5 are integrated, in other words, the entire periphery of the cavity 11 can be made of a piezoelectric material.
[0041]
Further, the present invention can be applied to not only thermosetting resins but also thermoplastic resins. If the melting temperature of the thermoplastic resin is low to some extent, a crystalline polymer piezoelectric material such as polyvinylidene fluoride (PVDF) is used instead of the piezoelectric materials 6A to 6D using the piezoelectric elements 8A to 8D made of ceramic. May be. In this case, the crystalline polymer piezoelectric body can be formed in a film shape on the mold surface, and the coatings 9A to 9D in FIGS. 1 to 4 can be omitted.
[0042]
In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed without departing from the spirit of the present invention. You can do it.
[0043]
【The invention's effect】
According to the present invention, the piezoelectric body is displaced by applying a voltage to the piezoelectric body constituting at least a part of the mold surface in the portion to be filled with the molten resin. Therefore, a force is generated between the mold surface and the molded product that comes into close contact with the mold surface, so that the molded product is released from the mold surface. Further, the piezoelectric body constituting at least a part of the mold surface in the portion to be filled with the molten resin is in close contact with the molded product and forms a vibration system independent of the molded product. Therefore, the molded product is reliably released from the mold surface by repeatedly applying a force for eliminating the close contact between the mold surface and the molded product. As a result, the present invention has an excellent practical effect of providing a resin molding die and a resin molding method capable of releasing a molded product with a simple configuration.
[Brief description of the drawings]
FIGS. 1A and 1B are partial cross-sectional views showing a structure and a state in which a voltage is applied, respectively, of a resin molding die according to a first embodiment of the present invention.
FIGS. 2A and 2B are partial cross-sectional views respectively showing a structure and a state where a voltage is applied, in a modified example of the resin molding die according to the first embodiment of the present invention.
FIGS. 3A and 3B are partial cross-sectional views showing a structure and a state where a voltage is applied, respectively, of a resin molding die according to a second embodiment of the present invention.
FIGS. 4A and 4B are partial cross-sectional views showing a structure and a state where a voltage is applied, respectively, of a resin molding die according to a third embodiment of the present invention.
[Explanation of symbols]
1 lower mold
2 Upper type
3 mold group
4 Base block
5 Cavity block
6A, 6B, 6C, 6D Piezoelectric
7,22 recess
8A, 8B, 8C, 8D Piezoelectric element
9A, 9B, 9C, 9D coating
10 gap
11 cavities
12 Cavity surface (mold surface)
13 Resin channel
14 Suction line
15 chips
16 substrates
17 Wiring
18 Power supply
19 switches
20 Cured resin
21 Molded product

Claims (6)

A resin molding die used to cure a molten resin filled in a cavity provided in one of the opposing mold groups to form a cured resin, and to manufacture a molded article containing at least the cured resin. And
A piezoelectric body that constitutes at least a part of a mold surface in a portion to be filled with the molten resin provided in any of the mold groups,
A power supply for applying a voltage to the piezoelectric body,
A resin molding die, wherein the molded article is released by applying a voltage to the piezoelectric body to displace the piezoelectric body. The resin molding die according to claim 1,
A resin molding die, wherein the piezoelectric body to which a voltage is applied is displaced in a direction along the mold surface. The resin molding die according to claim 1,
A resin molding die, wherein the piezoelectric body to which a voltage is applied is displaced in a direction crossing the mold surface. The resin molding die according to any one of claims 1 to 3,
By intermittently applying the voltage to the piezoelectric body, or by periodically inverting the polarity of the voltage applied to the piezoelectric body, the piezoelectric body is displaced so as to vibrate and the molding is performed. A resin molding die for releasing a product. A step of clamping opposing mold groups, a step of filling molten resin in a cavity provided in any of the mold groups, and a step of curing the filled molten resin to form a cured resin. Forming a molded article containing at least the cured resin, a step of opening the mold group, and a step of releasing the molded article, a resin molding method comprising:
In the releasing step, a voltage is applied to a piezoelectric body that constitutes at least a part of a mold surface in a part to be filled with the molten resin provided in one of the mold groups to displace the piezoelectric body. A resin molding method, wherein the molded article is released from the mold by causing the molded article to be released. The resin molding method according to claim 5,
In the releasing step, the piezoelectric body is vibrated by intermittently applying a voltage to the piezoelectric body or by periodically inverting the polarity of the voltage applied to the piezoelectric body. The resin molding method is characterized in that the molded article is released by such displacement.

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