JP2004221534A5 - - Google Patents

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Publication number
JP2004221534A5
JP2004221534A5 JP2003350842A JP2003350842A JP2004221534A5 JP 2004221534 A5 JP2004221534 A5 JP 2004221534A5 JP 2003350842 A JP2003350842 A JP 2003350842A JP 2003350842 A JP2003350842 A JP 2003350842A JP 2004221534 A5 JP2004221534 A5 JP 2004221534A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003350842A
Other languages
Japanese (ja)
Other versions
JP4149891B2 (ja
JP2004221534A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003350842A priority Critical patent/JP4149891B2/ja
Priority claimed from JP2003350842A external-priority patent/JP4149891B2/ja
Publication of JP2004221534A publication Critical patent/JP2004221534A/ja
Publication of JP2004221534A5 publication Critical patent/JP2004221534A5/ja
Application granted granted Critical
Publication of JP4149891B2 publication Critical patent/JP4149891B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003350842A 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法 Expired - Fee Related JP4149891B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003350842A JP4149891B2 (ja) 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002379231 2002-12-27
JP2003350842A JP4149891B2 (ja) 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2004221534A JP2004221534A (ja) 2004-08-05
JP2004221534A5 true JP2004221534A5 (fr) 2006-07-06
JP4149891B2 JP4149891B2 (ja) 2008-09-17

Family

ID=32911234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003350842A Expired - Fee Related JP4149891B2 (ja) 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法

Country Status (1)

Country Link
JP (1) JP4149891B2 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4599997B2 (ja) * 2004-11-08 2010-12-15 凸版印刷株式会社 固体電解コンデンサを内蔵した配線基板の製造方法
JP4736451B2 (ja) 2005-02-03 2011-07-27 パナソニック株式会社 多層配線基板とその製造方法、および多層配線基板を用いた半導体パッケージと電子機器
CN101180693B (zh) 2005-05-18 2011-10-26 三洋电机株式会社 层叠型固体电解电容器及其制造方法
JP4839824B2 (ja) * 2005-12-21 2011-12-21 パナソニック株式会社 コンデンサ内蔵基板およびその製造方法
JP2007201065A (ja) * 2006-01-25 2007-08-09 Hitachi Aic Inc コンデンサ内蔵基板
JP5003226B2 (ja) * 2007-03-20 2012-08-15 日本電気株式会社 電解コンデンサシート及び配線基板、並びに、それらの製造方法
JP4812118B2 (ja) 2007-03-23 2011-11-09 Necトーキン株式会社 固体電解コンデンサ及びその製造方法
JP5211777B2 (ja) * 2008-03-17 2013-06-12 富士通株式会社 電解キャパシタ及びその製造方法並びに配線基板
DE112018006091T5 (de) 2017-12-27 2020-08-20 Murata Manufacturing Co., Ltd. Halbleiter-verbund-bauelement und darin verwendete package-platine

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