JP2004221138A5 - - Google Patents

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Publication number
JP2004221138A5
JP2004221138A5 JP2003003631A JP2003003631A JP2004221138A5 JP 2004221138 A5 JP2004221138 A5 JP 2004221138A5 JP 2003003631 A JP2003003631 A JP 2003003631A JP 2003003631 A JP2003003631 A JP 2003003631A JP 2004221138 A5 JP2004221138 A5 JP 2004221138A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003003631A
Other languages
Japanese (ja)
Other versions
JP2004221138A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003003631A priority Critical patent/JP2004221138A/ja
Priority claimed from JP2003003631A external-priority patent/JP2004221138A/ja
Publication of JP2004221138A publication Critical patent/JP2004221138A/ja
Publication of JP2004221138A5 publication Critical patent/JP2004221138A5/ja
Pending legal-status Critical Current

Links

JP2003003631A 2003-01-09 2003-01-09 半導体熱処理方法および装置 Pending JP2004221138A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003003631A JP2004221138A (ja) 2003-01-09 2003-01-09 半導体熱処理方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003003631A JP2004221138A (ja) 2003-01-09 2003-01-09 半導体熱処理方法および装置

Publications (2)

Publication Number Publication Date
JP2004221138A JP2004221138A (ja) 2004-08-05
JP2004221138A5 true JP2004221138A5 (fr) 2005-10-27

Family

ID=32894842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003003631A Pending JP2004221138A (ja) 2003-01-09 2003-01-09 半導体熱処理方法および装置

Country Status (1)

Country Link
JP (1) JP2004221138A (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303152A (ja) * 2005-04-20 2006-11-02 Fuji Electric Holdings Co Ltd エピタキシャル成膜装置およびエピタキシャル成膜方法
JP5120585B2 (ja) * 2006-03-16 2013-01-16 株式会社Ihi 基板アニール装置用の遮熱板
JP5033020B2 (ja) * 2008-02-28 2012-09-26 三井造船株式会社 誘導加熱を用いた熱処理方法並びに誘導加熱装置
JP5264220B2 (ja) * 2008-03-11 2013-08-14 三井造船株式会社 ウエハ熱処理装置
JP4668343B1 (ja) * 2009-09-30 2011-04-13 三井造船株式会社 半導体基板熱処理装置
JP5647502B2 (ja) * 2010-02-23 2014-12-24 株式会社日立国際電気 熱処理装置、半導体装置の製造方法及び基板処理方法。
JP5063755B2 (ja) * 2010-08-09 2012-10-31 三井造船株式会社 誘導加熱装置および誘導加熱方法
JP5127987B1 (ja) * 2012-02-16 2013-01-23 三井造船株式会社 誘導加熱装置
WO2022230728A1 (fr) * 2021-04-26 2022-11-03 東京エレクトロン株式会社 Mécanisme d'électrode inférieure, dispositif de traitement de substrat et procédé de traitement de substrat

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