JP2004221138A5 - - Google Patents

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Publication number
JP2004221138A5
JP2004221138A5 JP2003003631A JP2003003631A JP2004221138A5 JP 2004221138 A5 JP2004221138 A5 JP 2004221138A5 JP 2003003631 A JP2003003631 A JP 2003003631A JP 2003003631 A JP2003003631 A JP 2003003631A JP 2004221138 A5 JP2004221138 A5 JP 2004221138A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003003631A
Other languages
Japanese (ja)
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JP2004221138A (ja
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Publication date
Application filed filed Critical
Priority to JP2003003631A priority Critical patent/JP2004221138A/ja
Priority claimed from JP2003003631A external-priority patent/JP2004221138A/ja
Publication of JP2004221138A publication Critical patent/JP2004221138A/ja
Publication of JP2004221138A5 publication Critical patent/JP2004221138A5/ja
Pending legal-status Critical Current

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JP2003003631A 2003-01-09 2003-01-09 半導体熱処理方法および装置 Pending JP2004221138A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003003631A JP2004221138A (ja) 2003-01-09 2003-01-09 半導体熱処理方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003003631A JP2004221138A (ja) 2003-01-09 2003-01-09 半導体熱処理方法および装置

Publications (2)

Publication Number Publication Date
JP2004221138A JP2004221138A (ja) 2004-08-05
JP2004221138A5 true JP2004221138A5 (enrdf_load_stackoverflow) 2005-10-27

Family

ID=32894842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003003631A Pending JP2004221138A (ja) 2003-01-09 2003-01-09 半導体熱処理方法および装置

Country Status (1)

Country Link
JP (1) JP2004221138A (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303152A (ja) * 2005-04-20 2006-11-02 Fuji Electric Holdings Co Ltd エピタキシャル成膜装置およびエピタキシャル成膜方法
JP5120585B2 (ja) * 2006-03-16 2013-01-16 株式会社Ｉｈｉ 基板アニール装置用の遮熱板
JP5033020B2 (ja) * 2008-02-28 2012-09-26 三井造船株式会社 誘導加熱を用いた熱処理方法並びに誘導加熱装置
JP5264220B2 (ja) * 2008-03-11 2013-08-14 三井造船株式会社 ウエハ熱処理装置
JP4668343B1 (ja) * 2009-09-30 2011-04-13 三井造船株式会社 半導体基板熱処理装置
JP5647502B2 (ja) * 2010-02-23 2014-12-24 株式会社日立国際電気 熱処理装置、半導体装置の製造方法及び基板処理方法。
JP5063755B2 (ja) * 2010-08-09 2012-10-31 三井造船株式会社 誘導加熱装置および誘導加熱方法
JP5127987B1 (ja) * 2012-02-16 2013-01-23 三井造船株式会社 誘導加熱装置
KR20240001170A (ko) * 2021-04-26 2024-01-03 도쿄엘렉트론가부시키가이샤 하부 전극 기구, 기판 처리 장치 및 기판 처리 방법

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