JP2004219786A - Manufacture method of semiconductor optical circuit device and manufacture apparatus for semiconductor optical circuit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize a means capable of controlling the optical axis alignment between an optical waveguide and a semiconductor laser and efficiently coupling the both, for example, without allowing a current to flow through the semiconductor laser in a mounting process of mounting an optical element chip on a circuit board. <P>SOLUTION: Light is made incident on the semiconductor laser chip via the optical waveguide 3 and the optical axis alignment control is realized while monitoring the spectral intensity of fluorescence generated from a light emission part 51 which is included in reflective light 13 in the process of mounting the semiconductor laser chip 1 on a circuit board 2. The highly efficient coupling between the optical element such as the semiconductor laser and the optical waveguide is thus realized. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
2. Description of the Related Art In recent years, there has been remarkable progress in technology aimed at miniaturizing and lowering the price of information devices for storing and reproducing music and images, and digital data of computers. With the spread of the Internet, users who want to take in various kinds of external information into their devices at high speed or send them from their devices to external devices at high speed, in addition to desktop-type computers, as well as mobile devices Needs are growing.
[0002]
The present invention relates to an optical element essential for transmitting various information such as music, video, and various other data at high speed using light, and an element mounting apparatus in a circuit assembly process including the optical element. In particular, the present invention relates to a circuit assembling process and a semiconductor optical device circuit manufacturing apparatus capable of increasing the yield on site. The present invention also relates to a communication device and a system equipped with the optical element circuit.
[0003]
[Prior art]
The following various methods are known for mounting a laser chip on a stem or the like.
[0004]
In the first example, a semiconductor laser chip emits light while being energized, and the emitted light is measured by a camera, and the laser chip is mounted on a post of a stem (Patent Document 1). In the second example, a laser chip is die-bonded to a stem while detecting two or more corners of an electrode surface of an active layer in the chip and controlling the position of a light emitting unit (see Patent Document 2). 2). The third example relates to a method for inspecting an edge-emitting semiconductor laser device wafer, which is a method for inspecting device characteristics in a state where a current is applied to a laser device on the wafer to emit light (Patent Document 3). A fourth example relates to fiber optic connections and methods of using the same, providing an optical coupling assembly by directing an opto-electric die perpendicular to a fiber optic cable and the other die parallel to the fiber optic cable. It is described (Patent Document 4). The fifth example relates to a method for mounting a transmitting / receiving module for an optical link, in which an optical element is arranged in the optical axis direction of an optical fiber in an optical fiber mounting portion, while an IC is connected to the optical element via a flexible circuit board. (Patent Document 5).
[0005]
[Patent Document 1]
JP-A-07-202347 (page 5, FIG. 5)
[Patent Document 2]
JP-A-11-087373 (page 5, FIG. 3)
[Patent Document 3]
JP-A-11-340512 (page 6, FIG. 1)
[Patent Document 4]
JP 2001-242358 A (page 17, FIG. 8)
[Patent Document 5]
Japanese Patent Application Laid-Open No. H11-345987 (page 8, FIG. 4)
[0006]
[Problems to be solved by the invention]
In one example of a conventional semiconductor laser die bonding method, a semiconductor laser chip is energized during die bonding, and the FFP (far field pattern) and NFP (near field pattern) of the semiconductor laser are measured by a camera. Therefore, a semiconductor laser chip is bonded to a post of a stem (for example, see Patent Document 1). This method is a method of mounting a semiconductor laser alone on a stem, but further does not consider the optical axis alignment when the semiconductor laser and the optical waveguide are coupled.
[0007]
Another die bonding method for an optical element describes the alignment between a chip and a stem when a laser chip is die-bonded to a stem (for example, see Patent Document 2). However, this method is also unsuitable for die bonding in consideration of the alignment of the optical axis between the laser and the optical waveguide as in Patent Document 1.
[0008]
As a related semiconductor element inspection method, an element inspection method of an edge-emitting light emitting diode in a wafer state is known (for example, see Patent Document 3). Also in this inspection method, no consideration has been given to an assembling step of coupling the light emitting diode and the optical waveguide.
[0009]
A first object of the present invention is to solve the above-described problems and to provide a bonding method and a bonding apparatus for an optical element that can be connected to an optical waveguide such as an optical fiber with high efficiency. .
[0010]
Further, in the connection of the optical fiber and the method of using the same, the surface emitting laser (VCSEL) table is vertically oriented so that the optical axis of the optical fiber cable is oriented horizontally, and the other tables are the same as the optical axis of the optical fiber. Orient horizontally (Patent Document 4). That is, this is a method of vertically connecting the surface emitting laser table and another table via a flexible circuit. A similar method is also found in US Pat.
[0011]
In these conventional methods, an optical element and an optical element drive circuit are connected via a flexible circuit (substrate). Therefore, the wiring length of the circuit is required accordingly. For high-speed signal transmission of about 5 gigabits per second or more, it is necessary to reduce the wiring length of the circuit as much as possible. The methods described in Patent Documents 4 and 5 do not give sufficient consideration to high-speed signal transmission.
[0012]
Another object of the present invention is to solve such a problem and to mount an optical element capable of high-efficiency connection with an optical waveguide such as an optical fiber and capable of high-speed transmission of an optical signal. A method and mounting device are provided.
[0013]
Furthermore, the present application provides a device such as a server and a system including the server using the circuit on which the optical element is mounted by the method of the present invention described above.
[0014]
[Means for Solving the Problems]
An object of the present invention is to provide a chip structure and a chip mounting method capable of easily coupling light emitted from a semiconductor laser to an optical waveguide or an optical fiber with high efficiency. Means for achieving this object is a method using a VCSEL (Vertical Cavity Surface Emitting Laser) as a semiconductor laser. That is, light is externally incident on an output portion (light output end face) of light from a light emitting portion of the surface emitting laser (VCSEL), and light induced from inside the semiconductor crystal of the surface emitting laser irradiated with the incident light. By adjusting the positional relationship between the semiconductor laser chip and the circuit board on which the chip is mounted while observing (fluorescence) as reflected light or transmitted light, highly efficient light coupling is achieved.
[0015]
Further, in mounting the surface emitting laser chip on the circuit board, the chip is mounted on a cross section of the side surface of the circuit board, and wiring for connection with the driver IC of the surface emitting laser is formed on the surface of the circuit board or inside the circuit board. By doing so, it is possible to manufacture a wiring having a shorter wiring length than the flexible wiring, and to realize a structure in which the coupling between the optical element and the optical waveguide is highly efficient.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
<Example 1>
FIG. 1 is a schematic cross-sectional view of a surface emitting laser (VCSEL) mounted on a circuit board, and FIG. 2 schematically illustrates a light spectrum from a light emitting unit with respect to incident light. FIG. 1 is a cross section of a surface emitting laser, and FIG. 2 is a diagram showing a relative change of reflected light with respect to incident light.
[0017]
As shown in FIG. 1, a semiconductor laser chip 1, which is a surface emitting laser, has a light emitting section 51. The light-emitting portion usually includes a region called an active layer, and emits fluorescence 11 substantially corresponding to the emission wavelength of the laser with respect to the incident light 7 from the outside. In FIG. 1, reference numeral 21 denotes an electrode, 22 denotes a laminated body of semiconductor thin layers, and 23 denotes a light emitting unit.
[0018]
FIG. 2 schematically shows the light intensity of the incident light 25 and the fluorescence 26 with respect to the wavelength. The horizontal axis is wavelength and the vertical axis is light intensity. As illustrated in FIG. 2, the fluorescence 26 emitted from the semiconductor laser has a narrower spectral line width than the externally incident light 25, and the light intensity change appears on the longer wavelength side than the rising edge of the spectrum of the incident light. . In the present invention, the position is set using this characteristic, in particular, using fluorescent light having a narrow spectral width. FIG. 3 shows a positioning adjustment mechanism when a semiconductor laser chip is mounted on a circuit board.
[0019]
FIG. 3 shows a state in which a film 4 on which a plurality of semiconductor laser chips 1 are adhered is partially approached to a circuit board 2 and a semiconductor laser chip on the film is mounted on an optical waveguide 3 on a circuit board so that the optical axis is aligned. It is a conceptual diagram regarding the process which performs.
[0020]
The specific semiconductor laser chip 1 on the film is indirectly pushed from the back side of the film by the chip mounting probe 5 and approaches the circuit board (2) surface. The semiconductor laser chip 1 is irradiated with incident light 7 via the optical waveguide 3 on the circuit board 2. When the light emitting portion including the active layer of the semiconductor laser chip 1 hits the incident light 7, the fluorescence from the light emitting portion is included in the reflected light 13 and enters the light detector 9. The incident light 7 enters the optical waveguide 3 of the circuit board 2 via the half mirror 51. Then, the light is reflected by the mirror surface 6 formed at one end of the optical waveguide 3 in a direction perpendicular to the optical axis of the optical waveguide 3 (reflected light 13-1). The incident surface of the semiconductor laser chip is arranged facing the traveling direction of the light. On the other hand, the fluorescent light from the semiconductor laser chip 1 enters the mirror surface 6 at the one end of the optical waveguide 3 of the circuit board 2 together with the reflected light shown as the reflected light 13 in the figure. Then, the light is reflected in a direction along the optical axis of the optical waveguide perpendicular to the traveling direction of the reflected light (included in the reflected light 13-1). The reflected light 13-1 including the fluorescence reaches the spectroscope 10 as reflected light 31-3 via the half mirror 51. Then, the light 13-4 having a wavelength corresponding to the fluorescence required for the control is separated. The fluorescent light 13-4 enters the photodetector 9. A signal from the photodetector 9 is transmitted to a drive control system 12 of the chip mounting probe 5 through a signal processing system 11. The drive control system integrally adjusts the position of the chip mounting probe 5 and the film 4 so that the fluorescence intensity from the semiconductor laser chip 1 is maximized. The semiconductor laser chip 1 stuck on the film 4 in this manner can be adjusted to an optimum position for coupling the optical axis with the optical waveguide 3 on the circuit board 2. Note that a conventional mechanical system for position control is sufficient, and is not shown in the drawings.
[0021]
FIG. 4 shows a main part of a process in which the semiconductor laser chip 1 is mounted while being positioned on the circuit board 2. FIG. 4A shows a state in which the electrode portion 21 of the semiconductor laser chip 1 is in contact with the electrode 6 on the circuit board. FIG. 4B shows a state in which the semiconductor laser chip 1 has been mounted on the circuit board 2 from the film 4. In the present embodiment, the method and the device configuration for mounting the semiconductor laser chip 1 on the circuit board 2 with the optical axis aligned with the optical waveguide in a state where no current flows are described.
[0022]
<Example 2>
Another embodiment of the present invention will be described with reference to FIG. FIG. 5 is a schematic cross-sectional view for explaining a process of mounting the semiconductor photodetector (PD: Photo-Diode) chip 14 while aligning the optical axis with the optical waveguide 3 on the circuit board 2. In this embodiment, the light 7 incident on the semiconductor PD chip 14 is reflected by the mirror surface 6 of the optical waveguide 3 (light: 7-1) and transmits through the semiconductor chip. The transmitted light 8 propagates through the optical fiber 12 and reaches the light detector 9. FIG. 6 illustrates a structure in which light transmitted through the semiconductor laser chip 1 reaches the photodetector without using the optical fiber 12.
[0023]
In the mounting of the semiconductor chip shown in FIGS. 5 and 6, a phenomenon is used in which light incident on the semiconductor chip (14, 1) passes through the semiconductor chip and reaches the photodetector. Here, the semiconductor chip shown in FIGS. 5 and 6 has a semiconductor thin film structure.
[0024]
FIG. 7 schematically shows the structure of a chip having a semiconductor thin film structure. FIG. 7A shows a structure in which an epitaxial film 62 on which an element pattern is formed is formed on a substrate 61 via a release layer 63. FIG. 7B shows a structure including the substrate 61 and the epitaxial film 62 after the release layer 63 has been removed from the state of FIG. 7A. In the drawings, reference numeral 21 denotes an electrode, and reference numeral 22 denotes a light emitting unit. In FIG. 7B, a pair of electrodes indicated by reference numeral 21 indicates two electrode terminals of the laser.
[0025]
With the epitaxial film structure shown in FIG. 7B, the thickness of the device can be reduced to a level of several microns (μm). With such a thin element structure, light incident on the element transmits light and reflects the crystal structure of the semiconductor in the process of transmission, that is, fluorescence is included in transmitted light. Therefore, the chip can be mounted on the circuit board such that the optical axis of the semiconductor laser or the semiconductor PD is aligned with the optical waveguide while observing the transmitted light.
[0026]
<Example 3>
Various modes of mounting the circuit board, the semiconductor laser element or the semiconductor PD, and the optical fiber will be described below.
[0027]
Another embodiment according to the present invention will be described with reference to FIGS. FIG. 8 is a schematic diagram illustrating two light emission modes of the semiconductor laser chip. FIG. 8A shows a structure in which light emission from the semiconductor laser is obtained from the same surface as the electrode, whereas FIG. 8B shows light emission from the semiconductor laser on the opposite surface different from the electrode 21. It is a structure obtained from. In the drawings, reference numeral 21 denotes an electrode, and reference numeral 22 denotes a light emitting unit. In FIG. 8B, a pair of electrodes denoted by reference numeral 21 indicates two electrode terminals of the laser.
[0028]
Each of the semiconductor lasers of FIG. 8A and FIG. 8B is mounted on the side surface of the circuit board by using the mounting method described in the first or second embodiment, and is connected to an optical waveguide or an optical fiber. FIGS. 9 and 10A and 10B show a state in which the optical axis alignment is completed.
[0029]
In the example of FIG. 9, an optical waveguide 3 similar to that of the first embodiment is provided on a circuit board 57. The IC chip 52 and the optical element chip 53 are mounted on this upper part. In this case, the mirror surface 6 of the optical waveguide 3 is aligned with the light emitting position of the optical element chip 53 so that the light 56 of the semiconductor laser element 53 is transmitted along the optical axis of the optical waveguide 3. A circuit board 57 is connected to an optical connector 54, and an optical fiber 55 is attached to the optical connector 54. Thus, the laser light 56 is transmitted from the optical fiber 55 to the outside.
[0030]
In the example of FIG. 10A, the optical waveguide 42 is embedded in the circuit board 44, and the end of the optical waveguide 42 is exposed on the side surface of the circuit board. The semiconductor laser chip 43 is mounted on a side surface of the circuit board 44 so that laser light can be incident on the optical waveguide. An IC chip 41 for driving a semiconductor laser is mounted on the circuit board 44. The IC chip 41 and the semiconductor laser chip 43 are connected over a short distance via a wiring 49 provided on a circuit board. Reference numeral 55 denotes an optical fiber provided to face the optical waveguide 42, and reference numeral 47 denotes an electrode of the IC chip 41.
[0031]
The example of FIG. 10B is an example in which the optical element chip 53 is mounted on the side surface of the circuit board 57. The circuit board 57 and the optical fiber 55 are mounted on the optical connector 54 so as to face each other. Since the optical fiber 55 is disposed close to the optical element chip 53, when the optical element chip 53 is a surface emitting laser (VCSEL), a laser beam 56 is incident on the optical fiber 55 and passes through the optical fiber. This is a structure used for propagation. In the case where the optical element chip 53 is a semiconductor PD, light transmitted through the optical fiber is incident on the optical element chip and used. In this example, the IC chip 52 and the optical element chip 53 are connected by the embedded wiring 59.
[0032]
In any structure, the IC chip 52 is used to drive the optical element chip 53. In the structure shown in FIG. 9 and FIG. 10, the optical coupling between the optical waveguide or the optical fiber and the optical element is highly efficient by using the mounting method of the present invention in which both the optical element and the IC are mounted on the circuit board in a bare chip state. Is realized.
[0033]
FIG. 11A is a perspective view of a structure in which a circuit board 57 on which an optical element and an IC are mounted is connected to an optical fiber 55 via an optical connector 54. Here, the optical fiber has a so-called multi-channel configuration in which ten optical fibers are connected in parallel. Note that the optical element is not directly illustrated in FIG. This structure is described in FIG. FIG. 11B is a perspective view of a portion where the semiconductor laser chip 48 connected to the optical connector 54 is mounted on the side surface of the circuit board 57. The semiconductor laser chip 48 forms an array of 1 × 10 channels, and laser light is emitted vertically from the surface of the chip. The multi-point emission of the semiconductor laser chip 48 is mounted facing the optical fiber of the optical connector 54. The IC chip 52 is mounted on a circuit board 57 with solder electrodes 58.
[0034]
The coupling between the semiconductor laser 48 and the optical fiber is made highly efficient by the coupling structure shown in FIG. The connection between the optical element and the IC uses the embedded wiring 59 in the circuit board, and does not employ a flexible wiring structure. With such a wiring structure, the wiring length can be further reduced as compared with the flexible wiring.
[0035]
<Example 4>
An example in which the circuit board described in the third embodiment is applied to a server of an optical transmission network will be described.
[0036]
FIG. 13 illustrates a conceptual configuration diagram of the present embodiment. A server / storage cabinet 77 having both server and storage functions is installed in one of the branches of the optical transmission network 70. In this cabinet, a server mounting rack 76 on which a plurality of small servers 75 are mounted is stored. Here, the server 75 is a main board including a circuit board 71, on which elements necessary for the server such as an IC chip 72, other ICs, and LSIs are mounted. Optical signals transmitted through the optical fiber 74 via the optical connector 73 are used to exchange signals with the inside and outside of the server.
[0037]
The feature of this server 75 is that the present invention is applied, and the circuit board 71, the optical connector 73, and the optical fiber 74 have a space-saving configuration. Because of such a small and space-saving server, ten servers are housed in the server mounting rack 76. One server 75 has 10 optical input / output channels, and can communicate at a maximum transmission rate of 10 gigabits per second (Gbps) per channel. Therefore, since the single server 75 has a maximum of 100 Gbps, and ten servers are mounted on the server mounting rack 76, a processing capacity of a maximum of 1 terabit per second (Tbps) can be obtained.
[0038]
<Example 5>
In this embodiment, various examples in which the server described in the fourth embodiment is applied to an electron microscope, an electron beam lithography apparatus, an ion beam lithography apparatus, an optical observation apparatus, and the like will be described.
[0039]
FIG. 14 is an example of an apparatus for observing and forming a fine structure, for example. In this example, a microstructure observation and formation apparatus capable of forming a fine pattern while observing a semiconductor microstructure is schematically shown and connected to an information device outside the apparatus. The image data obtained by the microstructure observation and formation device 91 is transmitted to the image processing system 90, processed, and then transmitted to the server / storage cabinet 77 for storage. The data stored in the storage in the server is transmitted to a separately provided design / analysis system 92, and is used for evaluation and analysis of observation data. Further, based on the observation data, the pattern formation of the semiconductor element is modified or a new structure is designed. Furthermore, the speed of data processing and analysis via the network is achieved, for example, by transmitting the data stored in the server to the outside via the network 70 and comparing and comparing the data with external data.
[0040]
In addition to observation and evaluation of the semiconductor microstructure, a further specific example of this embodiment is application to evaluation and diagnosis of image data using X-rays, ultrasonic waves, and NMR in the medical field. In this case, the microstructure observation and formation device 91 in FIG. 13 corresponds to an X-ray imaging device, an ultrasonic diagnostic device, or an NMR diagnostic device. In the configuration of FIG. 13, for example, after capturing an x-ray transmission image of a human body, the data is transferred to the server / storage cabinet 77 via the image processing system 90 and stored. The stored X-ray image data is transferred to the design / analysis system 92, where more detailed analysis and diagnosis are performed. Alternatively, the data is transferred through an external network, and compared with other diagnosis cases. In this way, it is possible to perform wide-area evaluation and analysis of image data in the medical field.
[0041]
<Example 6>
An embodiment of the present invention in the entertainment field will be described with reference to FIG.
[0042]
FIG. 14A shows a system in which image data stored in the storage server 80 is transferred to the video display 83 and reproduced as a still image or a moving image. Here, the data from the storage server 80, after passing through the optical fiber 81, enters the photoelectric converter 82, where the optical signal is converted into an electric signal, and the same or different video signal is transmitted to a plurality of video displays. To deliver. The electric signal data that has arrived from the photoelectric converter to the video display 83 is reproduced as a still image or a moving image, and the video display selects various types of video distributed from the storage server. can do.
[0043]
The storage server 80 uses the circuit board to which the optical elements and the optical connectors described in the third and fourth embodiments are connected, so that the server itself can be reduced in size, the number of channels of transmission signals can be increased, and the transmission speed can be reduced. Speeding up is done. The feature of this system is that it is not affected by electromagnetic noise because the signal output from the server is an optical signal transmitted through an optical fiber. On the other hand, the section from the photoelectric converter to the video display may be affected by electromagnetic noise as long as the electric wiring is used. Therefore, the section of the electric wiring should be as short as possible. Alternatively, the signal wiring is constituted entirely by optical fibers.
[0044]
FIG. 14B is a schematic diagram illustrating a system configuration for individually viewing an image such as a moving image at each sleeper of the sleeper train. The image data is stored in a small storage server 80, and a plurality of image data are distributed from this storage server to an individual bed in a sleeper 84. The signal distribution from the server mainly uses the optical fiber 81, and is configured to reduce the influence of electromagnetic noise from the environment on the railway line.
[0045]
As described in the above embodiments, according to the present invention, mounting of a device capable of highly efficient coupling between a semiconductor optical device and an optical waveguide is realized, so that the assembly yield of a circuit including an optical device is improved. A small, lightweight, high-performance circuit board can be realized. Further, a high-speed server having a compact and simple connection structure between the optical element and the optical waveguide is realized. Using the server, observation and evaluation of semiconductor microstructure, transmission of diagnostic images in the medical field, and video distribution in the entertainment field can be realized at high speed and with a high S / N ratio.
[0046]
In the step of mounting the semiconductor optical element on the circuit board surface or in the step of coupling the optical waveguide to the semiconductor optical element mounted on the circuit board surface,
Light from the outside is incident on the optical element, and the optical element and the optical waveguide are coupled while monitoring the spectral peak wavelength or the spectral peak intensity of the light reflected from the optical element or the light transmitted through the optical element. A method for manufacturing a semiconductor optical circuit, comprising:
[0047]
The main modes of the present invention are as follows.
(1) In the step of mounting the semiconductor optical device on the surface of the circuit board or in the step of coupling the optical waveguide to the semiconductor optical device mounted on the surface of the circuit board, light from the outside is incident on the optical device, and A method of manufacturing a semiconductor optical circuit, comprising: coupling an optical element and an optical waveguide while monitoring a spectral peak wavelength or a spectral peak intensity of reflected light or light transmitted through the optical element.
(2) In a semiconductor optical circuit manufacturing apparatus for coupling a semiconductor optical element and an optical waveguide, light from the outside is incident on the optical element, and light reflected from the optical element or light transmitted through the optical element is transmitted to the optical element. An apparatus for manufacturing a semiconductor optical circuit, comprising: a spectroscope for monitoring and a photodetector.
(3) The method for manufacturing a semiconductor optical circuit according to the above (1), wherein the semiconductor optical element mounted on the circuit board is mounted on a side surface of the circuit board and connected to an optical waveguide. Method.
(4) In a semiconductor optical circuit manufactured by using the semiconductor optical circuit manufacturing method according to the above (3), the semiconductor optical element mounted on the side surface of the circuit board comprises a surface emitting laser. A semiconductor optical circuit, wherein a direction of an optical axis of an optical fiber in coupling with an optical fiber is arranged in parallel to a surface of a circuit board.
(5) In a semiconductor optical circuit manufactured by using the semiconductor optical circuit manufacturing method according to the above (3), the semiconductor optical element mounted on the side surface of the circuit board comprises a surface light receiving type photodetector; A semiconductor optical circuit, wherein a direction of an optical axis of an optical fiber is arranged in parallel with a surface of a circuit board in coupling with the optical fiber.
(6) The semiconductor optical circuit according to the above (4) and (5), wherein the semiconductor optical circuit is formed on a circuit board constituting a server.
(7) The circuit board constituting the server described in (6) above is characterized in that the circuit board is stored in the same housing in combination with a nonvolatile memory.
(8) The circuit board described in (7) above has a configuration in which the circuit board is connected to an image processing system outside the housing in which the circuit board is stored through an optical fiber.
(9) The circuit board described in (7) above constitutes a system for distributing video via an optical fiber to a plurality of video displays outside the housing in which the circuit board is stored.
[0048]
【The invention's effect】
The present invention can provide a semiconductor optical circuit device having a high coupling efficiency between an optical element and an optical waveguide. Further, from another viewpoint of the present invention, a small and lightweight semiconductor optical system can be provided. Further, from another viewpoint of the present invention, a semiconductor optical system having a high speed and a high S / N ratio can be provided.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a relationship between incident light and fluorescence in an optical element mounting step of the present invention.
FIG. 2 is a diagram illustrating a relative relationship between reflected light and incident light in the example of FIG. 1;
FIG. 3 is a schematic view showing a semiconductor laser chip mounting step as an embodiment of the present invention.
FIG. 4 is a schematic diagram for explaining a semiconductor laser chip mounting step as an embodiment of the present invention.
FIG. 5 is a schematic view for explaining a semiconductor laser chip mounting step as an embodiment of the present invention.
FIG. 6 is a schematic view for explaining a semiconductor laser chip mounting step as an embodiment of the present invention.
FIG. 7 is a sectional view of a chip used for mounting an optical element according to the present invention.
FIG. 8 is a cross-sectional view schematically showing the direction of the light output of the semiconductor laser according to the present invention.
FIG. 9 is a cross-sectional view of a configuration example in which a circuit board on which an optical element is mounted and an optical waveguide are connected to the optical element.
FIG. 10 is a cross-sectional view of a configuration example in which a circuit board on which an optical element is mounted and an optical waveguide are connected to the optical element.
FIG. 11 is a perspective view of a configuration in which a circuit board is connected to an optical fiber via an optical connector and a configuration example of a circuit board on which a semiconductor laser element is mounted.
FIG. 12 is a diagram illustrating a configuration example in which a server including a circuit board and a storage using the server are connected to a network;
FIG. 13 is a diagram illustrating a configuration example in which a server including a circuit board and a storage using the server are connected to a microstructure observation system.
FIG. 14 is a diagram illustrating an example of a system in which video data is distributed from a storage using a server.
[Explanation of symbols]
1, 43: semiconductor laser chip, 2, 44, 57, 71: circuit board, 3, 42: optical waveguide, 4: film, 5: probe for chip mounting, 6, etc. Mirror surface, 7 incident light, 8 transmitted light, 9 photodetector, 10 spectroscope (filter), 11 fluorescence, 12, 55, 74, 78, 79, 81 ... optical fiber, 13 ... reflected light, 14 ... semiconductor PD chip, 21, 45, 47 ... electrode, 22, 23, 31, 32 ... light emitting unit, 41, 52 , 72: IC chip, 46, 56: laser light, 48: semiconductor laser array chip, 49: wiring, 51: light emitting unit, 53: optical element chip, 54, 73 ... Optical connector, 59 ... Embedded wiring, 61 ... Substrate, 62 ... Epitaxial , 63: release layer, 75: server, 76: server mounting rack, 77: server / storage cabinet, 80: storage server, 82: photoelectric converter, 83 ... video display, 84 ... sleeper train, 90 ... image processing system, 91 ... microstructure observation and formation device, 92 ... design / analysis system.

Claims (9)

A substrate having an optical waveguide and a semiconductor chip mounted on a support member and having a semiconductor portion capable of emitting or absorbing light, a first end of the optical waveguide and a semiconductor portion capable of emitting or absorbing the semiconductor chip; A step of preparing a predetermined portion of the device so as to face each other,
From the optical waveguide, a step of emitting light to a semiconductor portion capable of emitting or absorbing the semiconductor chip,
The incident light, the reflected light from the semiconductor portion capable of emitting or absorbing the semiconductor chip, or the transmitted light of the semiconductor chip, detects the spectral peak wavelength or the spectral peak intensity, the substrate having the optical waveguide and A step of aligning with a semiconductor chip,
And a method for manufacturing a semiconductor optical circuit device. The optical waveguide of the substrate having the optical waveguide has at least one end on a side surface of the substrate, and the semiconductor chip has a light emitting surface facing an optical waveguide end surface of the optical waveguide on the end surface of the substrate. 2. The method according to claim 1, wherein the substrate having the optical waveguide and the semiconductor chip are aligned. The second end of the optical waveguide of the substrate is placed facing the optical fiber, the semiconductor chip has a surface emitting laser, and the light of the optical fiber in the coupling between the surface emitting laser and the optical fiber. 3. The method according to claim 2, wherein the direction of the axis is arranged in parallel with the surface of the substrate. A second end of the optical waveguide of the substrate is provided so as to face an optical fiber, the semiconductor chip has a surface light receiving type light detecting portion, and light in coupling between the surface emitting laser and the optical fiber is provided. 3. The method according to claim 2, wherein the direction of the optical axis of the fiber is arranged in parallel with the surface of the substrate. 4. The method according to claim 3, wherein the semiconductor optical circuit device is mounted on a circuit board constituting a server of an optical system. 5. The method according to claim 4, wherein the semiconductor optical circuit device is mounted on a circuit board constituting a server of an optical system. A substrate having an optical waveguide and a semiconductor chip mounted on a support member and having a semiconductor portion capable of emitting or absorbing light, a first end of the optical waveguide and a semiconductor portion capable of emitting or absorbing the semiconductor chip; A preparatory member with the predetermined portions facing each other;
An optical member that, from the optical waveguide, emits light to a semiconductor portion capable of emitting or absorbing light from the semiconductor chip;
The incident light, reflected light from the semiconductor portion capable of emitting or absorbing the semiconductor chip, or transmitted light of the semiconductor chip, a spectral peak wavelength or a detecting member for detecting the spectral peak intensity,
An apparatus for manufacturing a semiconductor optical circuit device, comprising: at least a member that enables the substrate having the optical waveguide and the semiconductor chip to move relative to each other. An image of a semiconductor circuit device formed on a circuit board, a semiconductor chip capable of emitting light, and an image outside a housing in which the circuit board of the semiconductor circuit device is optically connected to a predetermined portion of a light emitting portion of the semiconductor chip. An optical system having a configuration connected to a processing system, wherein the semiconductor circuit device is a semiconductor circuit device manufactured by the method for manufacturing a semiconductor circuit device according to claim 1. A semiconductor circuit device formed on a circuit board includes a semiconductor chip capable of emitting light and a plurality of semiconductor circuit devices optically connected to a predetermined portion of a light emitting portion of the semiconductor chip outside a housing in which the circuit board is stored. An optical system, characterized in that it has a configuration for distributing an image to an image display device, and wherein the semiconductor circuit device is a semiconductor circuit device manufactured by the method for manufacturing a semiconductor circuit device according to claim 1.

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