JP2012215876A - Optical coupling circuit and optical module for signal transmission/reception using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical module for signal transmission/reception having a small loss by obtaining an optical coupling circuit for optical interconnection replacing electric transmission with the small number of components at low cost.SOLUTION: An optical coupling circuit 11 constituting a part of an optical interconnection circuit includes: a waveguide 12 which guides an optical signal inputted onto a board 10 from one end thereof to the other end; a 45° multiple reflection mirror 14 which is disposed so as to face the other end of the waveguide 12 and guides, in transmission/reception, the optical signal in a direction different from that to an installation surface of the waveguide 12; and signal transmission means 15, 25, and so on which transmit and receive the optical signal via the 45° multiple reflection mirror 14 to relay the transmission/reception of the signal to/from the outside. The waveguide 12 is provided with an optical lens part 12c for suppressing the spread of the optical signal within the 45° multiple reflection mirror 14, and the optical lens part 12c is integrated with the waveguide. The optical module for signal transmission/reception is equipped with the optical coupling circuit.

Description

  The present invention relates to an optical coupling circuit and an optical module for signal transmission / reception using the optical coupling circuit, and more particularly to an optical coupling circuit used for an optical interconnection module applied to a server, router, or HPC, and for signal transmission / reception using the optical coupling circuit. The present invention relates to an optical module.

(Recent trends)
In the speeding up of interconnections of 10 [Gbps] or more, the limit of electric transmission is beginning to appear. In particular, in electrical transmission for securing a transmission distance between housings, an increase in power consumption is a problem due to the addition of a waveform shaping circuit. Therefore, in recent years, it has been proposed to reduce power consumption by eliminating the need for a waveform shaping circuit using optical interconnection.

On the other hand, when an optical interconnection is used for interconnection, an optical module that converts an electrical signal into an optical signal and an optical signal into an electrical signal is required.
As an example of such an optical module, Non-Patent Document 1 and Non-Patent Document 2 report multi-channel optical transceivers.

  As shown in FIG. 1 of Non-Patent Document 1 and FIGS. 7 and 9 of Non-Patent Document 2, an optical module includes an optical drive circuit (LDD, TIA), an optical element (VCSEL, PD), a lens, electrical wiring, It consists of optical wiring, mirrors, and connectors. In such an optical module, a surface emitting laser element (surface emitting semiconductor laser: VCSEL) is used as the optical element.

This surface-emitting laser (VCSEL) has a merit that the operating current is smaller than that of the edge-emitting laser, and the power consumption of the IC that drives the laser can be suppressed. In this surface emitting laser, the laser light is emitted in a direction perpendicular to the VCSEL chip.
Therefore, when a polymer waveguide is used for an optical signal line as in Non-Patent Document 1, or between a board on which a module is mounted and coupled with a multimode optical fiber (MMF) as in Non-Patent Document 2. Is narrow, the optical coupling between the optical element and the waveguide is performed through a 45-degree mirror and a lens whose reflection end face is set to 45 degrees.

  This 45 degree mirror is easy to manufacture and can change the optical path, but light spreads in free space only with the 45 degree mirror. Therefore, it is used together with a lens to realize highly efficient optical coupling.

On the other hand, there is an optical path conversion component shown in FIG. 14 or FIG. 17 of Patent Document 1 for converting an optical path without using a combination of a 45 degree mirror and a lens.
In the structure disclosed in Patent Document 1, since the light path can be converted by a 45-degree mirror while the light is confined by the waveguide, the light path can be changed without spreading.
Furthermore, a surface emitting laser is known as a photoelectric conversion member that converts an electrical signal into an optical signal and sends it to an optical waveguide (Patent Document 2).

JP2007-334343 JP2009-141119

OFC / NFOEC2008 Proceedings OThS4 ECTC2008 Proceedings 1838 page

  Here, cost reduction is required for an optical interconnection that replaces electric transmission. However, since the optical module component cost and assembly cost are high, this optical interconnection has been introduced only in expensive devices such as high-performance computing systems (HPCs) and high-end routers. There wasn't.

In addition, optical modules using lenses and mirrors as in Non-Patent Document 1 and Non-Patent Document 2 are required to reduce the number of components for cost reduction.
Furthermore, in the structure as in Patent Document 1 that does not use a lens, there is a possibility that the number of parts can be reduced, but considering the manufacturing variation of members, it is difficult to adjust the optical axis between the optical path conversion component and the waveguide. For this reason, there is a problem that it is impossible to apply the implementation using low-cost image processing or the like.
Moreover, in patent document 2, it is only disclosure of the technical content concerning a photoelectric conversion member, and there is no disclosure about the application circuit.

(Object of invention)
It is an object of the present invention to provide an optical coupling circuit that improves the disadvantages of the related technology and has a low productivity and can be obtained at low cost, and an optical module for signal transmission and reception using the same. And

In order to achieve the above object, an optical coupling circuit according to the present invention includes a waveguide disposed on a substrate and guiding an optical signal input / output at one end toward the other end, and the waveguide. A 45-degree multi-reflection mirror disposed opposite the other end of the waveguide and guiding transmission / reception of optical signals in a direction different from the installation surface of the waveguide, and the 45-degree multi-reflection mirror through the 45-degree multi-reflection mirror A signal transmission means for linking and transmitting optical signals to and from the waveguide and relaying signal transmission and reception to the outside;
The other end of the waveguide is disposed so as to correspond to at least one of a plurality of optical signal transmission multiple layers provided in the 45-degree multiple reflection mirror, and
An optical lens portion for suppressing the spread of the optical signal is provided on the 45 ° multiple reflection mirror side of the waveguide so as to oppose the light input / output surface of the 45 ° multiple reflection mirror, and the optical lens portion is disposed on the waveguide. It is configured to be integrated with.

In order to achieve the above object, an optical module for signal transmission / reception according to the present invention is transmitted to a transmission signal processing unit that is provided on the same board and transmits an externally input electric signal to the transmission signal processing unit. With an optical interconnection circuit for
The optical interconnection circuit includes a transmission-side optical assembly coupled to the transmission signal processing unit, a reception-side optical assembly coupled to the transmission signal processing unit, and a polymer waveguide that interconnects the optical assemblies. And consisting of
As the transmission side optical assembly, one including a surface emitting laser for converting an electric signal into an optical signal is adopted, and as the reception side optical assembly, one including a photodiode is adopted.

Furthermore, in order to achieve the above object, the signal transmission / reception optical module according to the present invention is equipped with an electrical signal for transmission input to a plurality of transmission signal processing units equipped on one board on the other board. Provided with an optical interconnection circuit for transmission to a plurality of outgoing signal processing units to be transmitted to the outside,
The optical interconnection circuit includes a plurality of transmission-side optical assemblies that convert a plurality of electrical signals output from the transmission signal processing units into optical signals, and the optical signals are captured via a plurality of polymer waveguides. An optical signal relay means for transmitting to the other board side, and an optical signal transmitted through the optical signal relay means is taken in through a plurality of polymer waveguides and converted into an electrical signal to each of the transmission signal processing sections. A plurality of receiving side optical assemblies for transmission,
The optical signal relay means includes a plurality of relay optical fibers for optical coupling installed between the one and the other boards, the plurality of relay optical fibers, and the plurality of waveguides on the one board. And the other relay optical coupling circuit that optically couples the plurality of relay optical fibers and the plurality of waveguides on the other board.
Further, the transmitter side optical assembly includes a surface emitting laser that converts an electrical signal into an optical signal, and the receiver side optical assembly includes a photodiode.

In order to achieve the above object, an optical module for signal transmission / reception according to the present invention includes a transmission signal processing unit that transmits an electrical signal externally input to a transmission signal processing unit mounted on the same board. In a signal transmission / reception module equipped with an optical interconnection circuit for transmission to
The optical interconnection circuit includes a transmission side optical assembly (one optical coupling circuit) coupled to the transmission signal processing unit and a reception side optical assembly (the other optical coupling circuit) coupled to the transmission signal processing unit. And a polymer waveguide for interconnecting the optical assemblies,
The board is equipped with the optical coupling circuit according to claim 4 as the transmitting side optical assembly, and the board includes a signal transmission means provided in the optical coupler together with a 45-degree multiple reflection mirror provided in the signal transmission means. Equipped with an optical / electrical linking socket fixed on top.

  Since the present invention is configured as described above, according to this, as an optical interconnection that substitutes for electrical transmission, a plurality of waveguides for optical signals are used for conversion and transmission of a plurality of introduced transmission signals. Since the 45 degree multiple reflection mirror and the signal conversion element are installed in the 45 degree multiple reflection mirror and the lens part is provided on the 45 degree multiple reflection mirror side of each waveguide, this greatly reduces the number of parts. Thus, it is possible to provide an excellent optical coupling circuit that can be configured and mounted with low-cost components and an optical module for signal transmission / reception using the optical coupling circuit.

1 is a schematic plan view showing a first embodiment of an optical module for signal transmission / reception including an optical coupling circuit according to the present invention. It is a perspective view which shows a part of transmission side optical assembly (1st optical coupling circuit) contained in the optical module disclosed in FIG. FIG. 3A is a plan view and FIG. 3B is a front view showing a transmission side optical assembly (one optical coupling circuit) disclosed in FIG. 2. It is explanatory drawing which shows the arrangement | positioning relationship between the waveguide which shows a part of 1st optical coupling circuit disclosed in FIG. 1, and a 45 degree | times multiple reflection mirror. It is a perspective view which shows a part of receiving side optical assembly (other optical coupling circuit) contained in the optical module disclosed in FIG. FIG. 6A is a plan view and FIG. 6B is a front view illustrating a reception-side optical assembly (the other optical coupling circuit) disclosed in FIG. 5. FIG. 7A is a perspective view, and FIG. 7B is a plan view, illustrating another example of an optical lens unit provided in the transmission-side optical assembly (one optical coupling circuit) disclosed in FIG. FIG. 7C is a front view. FIG. 8A is a perspective view, and FIG. 8B is a plan view showing still another example of the optical lens unit provided in the transmission-side optical assembly (one optical coupling circuit) disclosed in FIG. FIG. 8C is a front view. FIG. 9A is a perspective view and FIG. 9B is a plan view showing still another example of the optical lens unit provided in the transmission-side optical assembly (one optical coupling circuit) disclosed in FIG. FIG. 9 (C) is a front view. FIG. 10A is a perspective view and FIG. 10B is a plan view showing still another example of an optical lens unit provided in the transmission-side optical assembly (one optical coupling circuit) disclosed in FIG. FIG. 10C is a front view. It is explanatory drawing which shows the mode of the internal propagation | transmission of the 45-degree multiple reflection mirror with which the transmission side optical assembly (one optical coupling circuit) disclosed in FIG. 2 is equipped, and an optical signal. FIG. 5 is another explanatory diagram showing a state of internal propagation of a 45-degree multiple reflection mirror and an optical signal provided in the transmission-side optical assembly (one optical coupling circuit) disclosed in FIG. 2; FIG. 10 is still another explanatory view showing a state of internal propagation of a 45-degree multiple reflection mirror and an optical signal provided in the transmission side optical assembly (one optical coupling circuit) disclosed in FIG. 2; The calculation result of the relationship between the spread of the light exit angle θ with respect to the exit surface incident angle φ of the surface emitting laser in the 45 ° multiple reflection mirror equipped in the transmitting side optical assembly (one optical coupling circuit) disclosed in FIG. FIG. It is a diagram which shows the far field image of a surface emitting laser (VCSEL). It is a schematic plan view which shows 2nd Embodiment of the optical module for signal transmission / reception including the optical coupling circuit concerning this invention. It is a schematic perspective view which shows an example of the 3rd optical coupling circuit (transmission side stepped optical coupling circuit) which comprises a part of optical module for signal transmission / reception disclosed in FIG. FIG. 17 is a schematic perspective view showing an example of a fourth optical coupling circuit (transmission side optical coupling circuit for MMF array coupling) constituting a part of the signal transmission / reception optical module disclosed in FIG. 16. FIG. 17 is a schematic perspective view illustrating an example of a fifth optical coupling circuit (a transmission side optical coupling circuit for MMF array coupling) that constitutes a part of the signal transmission / reception optical module disclosed in FIG. 16. It is a schematic perspective view which shows an example of the 6th optical coupling circuit (receiving side stepped optical coupling circuit) which comprises a part of optical module for signal transmission / reception disclosed in FIG. It is a schematic plan view which shows 3rd Embodiment of the optical module for signal transmission / reception including the optical coupling circuit concerning this invention. FIG. 22A is a diagram showing a two-layer transmission-side optical assembly (one optical coupling circuit) that constitutes a part of the signal transmission / reception optical module disclosed in FIG. 21, and FIG. 22A is a plan view showing a part thereof; FIG. 22 (B) is a front view of FIG. 22 (A). FIG. 23A is a diagram showing a reception-side optical assembly (the other optical coupling circuit) having a two-layer structure that constitutes a part of the signal transmission / reception optical module disclosed in FIG. 21, and FIG. FIG. 23B is a front view of FIG. It is a schematic plan view which shows 4th Embodiment of this invention, It is a schematic plan view. FIG. 25 is a schematic cross-sectional view illustrating a transmission-side optical conversion unit of one optical coupling circuit portion disclosed in FIG. 24. FIG. 25 is a schematic cross-sectional view showing a transmission side optical coupling portion of one optical coupling circuit portion disclosed in FIG. 24. It is explanatory drawing which shows the opto-electric integrated socket part which comprises the principal part of the transmission side optical conversion part disclosed in FIG. It is a schematic explanatory drawing of the manufacturing method of the anisotropic conductive sheet (45 degree multiple reflection mirror) used with the photoelectric integration socket part disclosed in FIG. FIG. 25 is a schematic cross-sectional view showing a receiving side optical conversion unit of the other optical coupling circuit portion disclosed in FIG. 24. FIG. 25 is a schematic cross-sectional view showing a receiving side optical coupling portion of the other optical coupling circuit portion disclosed in FIG. 24.

[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 shows an optical module 1 for signal transmission and reception incorporating optical coupling circuits 11 and 12 according to the present invention.

<Optical module>
In FIG. 1, an optical module 1 includes a transmission signal processing unit 2 that takes in an externally input signal and processes the signal as a transmission signal, and one light that converts an output signal from the transmission signal processing unit 2 into an optical signal. The other of the coupling circuit (transmission-side optical assembly) 11 and the other optical signal output from the one optical coupling circuit 11 is taken in through a pre-installed waveguide (polymer waveguide) 12 and converted into an electrical signal. An optical coupling circuit (reception side optical assembly) 13 and a transmission signal processing unit 3 that performs signal processing for transmitting an electrical signal converted by the other optical coupling circuit 13 to the outside are provided.

  Here, the one optical coupling circuit (transmission-side optical assembly) 11 and the other optical coupling circuit (receiving-side optical assembly) that takes an optical signal output from the one optical coupling circuit 11 and converts it into an electrical signal. 13 and a waveguide (polymer waveguide) 12 that connects the one and the other optical coupling circuits together constitute an optical signal transmission path (optical interconnection circuit) 1A. Reference numeral 10 denotes a substrate that holds the above-described constituent members.

<Transmission-side optical assembly 11>
As shown in FIGS. 2 to 3, the transmission side optical assembly (one optical coupling circuit) 11 is a waveguide 12 (guides an optical signal sent toward the reception side optical assembly (the other optical coupling circuit) 13. 12 _{1, 12} 2, and 12 _3), towards this respective waveguides ₁₂ 1 to 12 ₃ of the other end (right end) to face disposed in the respective waveguides ₁₂ 1 to 12 ₃ in FIG. 2 45-degree multiple reflection mirror 14 for guiding the propagation of the optical signal, and the electrical signal input from the transmission signal processing unit 2 to the waveguides 12 _{1 to} 12 ₃ via the 45-degree multiple reflection mirror 14 And a signal transmission means 15 for converting into an optical signal and sending it in.

Here, when the whole of each of the waveguides 12 _{1 to} 12 ₃ is indicated, the reference numeral 12 is used as the waveguide. In addition, for each of the waveguides 12 _{1 to} 12 ₃ and related members (for example, surface emitting lasers 16 ₁ , 16 ₂ , and 16 _{3 to be} described later), there are three cases in the first embodiment. Although illustrated, four or more may be sufficient. The same applies to other embodiments.

Next, the waveguide 12 _1, the core layer 12a is formed surrounded by the cladding portion 12b and the waveguide 12 integral with ₁ the cladding portion 12b is specified of different transparent member having a refractive index. The same applies to the other waveguides 12 ₂ and 12 ₃ .
Each of the waveguides (core layer 12a) 12 ₁ , 12 ₂ , 12 ₃ , a clad portion 12b, and a lens portion 12c described later constitute a waveguide array 12.

The other end portions (the right end portion in FIG. 2) of each of the waveguides 12 _{1 to} 12 ₃ are sent out from the 45 ° multiple reflection mirror 14 to the surface facing the 45 ° multiple reflection mirror 14 (described later). In the receiving-side optical assembly, optical lens portions 12c that suppress diffusion of optical signals that are sent in are respectively installed. Each of the optical lens portions 12c, 12c, 12c is configured to be integrated with each of the waveguides 12 _{1 to} 12 ₃ described above.

  Here, in the first embodiment, the 45-degree multiple reflection mirror 14 is formed in a quadrangular prism shape, and a plurality of reflection mirror films 14b are provided in the cross section in the 45-degree direction at substantially equal intervals. A plurality of optical signal transmission multiple layers 14a, 14a,... Are formed between the reflecting mirror films 14b by being filled with a dielectric made of a transparent member.

Each of the waveguides 12 _{1 to} 12 ₃ described above has at least one of the optical signal transmission multiple layers 14a, 14a,... Corresponding to two layers are arranged. In this case, waveguide 12 ₁ and 45 degrees multiple reflection mirror 14, as shown in FIG. 3 (b), are arranged in correspondence with the three optical signal transmission multiplex layer 14a. The same applies to the other waveguides 12 ₂ and 12 ₃ .

Thereby, the diffusion of the optical signal between each of the waveguides 12 _{1 to} 12 ₃ and the 45-degree multiple reflection mirror 14 described above is effectively suppressed, and the decrease in sensitivity during the propagation of the optical signal is effectively suppressed.

Figure 4 shows a corresponding positional relation between the waveguide 12 ₁ and 45 degrees multiple reflection mirror 14. The same applies to the waveguides 12 ₂ and 12 ₃ . The three-dimensional coordinates shown in FIG. 4 are all applied to the coordinate positional relationship formed in the following description.

As shown in FIGS. 2 to 3, the signal transmission means 15 described above has an end face on the opposite side of the face that is optically connected to the waveguides 12 _{1 to} 12 ₃ of the 45-degree multiple reflection mirror 14 (see FIG. 2). the surface emitting laser ₁₆ 1 installed to 1 in the upper end _face), 16 2, 16 ₃ and an electrical wiring circuit ₁₇ 1 for sending the electric signal for driving to this surface-emitting laser _{161-164 3} individually, 17 ₂ and 17 ₃ .

Here, reference numeral 18 denotes a surface emitting laser array provided with a plurality of surface emitting lasers 16 ₁ , 16 ₂ , 16 ₃ . The surface emitting laser array 18, as shown in FIG. 2, FIG. 3, a plurality of surface emitting lasers ₁₆ 1 to 16 ₃ as described above, is set in advance and holds the surface-emission laser diodes _{161-164 3} A laser holding member 18A for specifying an installation position, and a plurality of laser electrodes 18a, 18a,... Individually installed corresponding to the surface emitting lasers 16 _{1 to} 16 ₃ provided on the laser holding member 18A. And a plurality of bump energizing electrodes 18b, 18b,... Installed individually corresponding to the ends of the electric wiring circuits 17 ₁ , 17 ₂ , 17 ₃ , and the electrodes 18 a, 18 b. Are individually provided with electrode connection circuits 18c, 18c,.

Reference numerals 20a, 20a,... Indicate bumps (spherical connection terminals) that individually connect the corresponding electric wiring circuits 17 _{1 to} 17 ₃ and the bump energizing electrodes 18b, 18b,.
Here, in the present embodiment, a plurality of bumps (spherical connection terminals) 20a are also provided at locations that do not directly contribute to the transmission of electrical signals as shown in FIGS. Reference numerals 18e, 18e,... Denote other electrodes for bump equipment that are formed in the same manner as the bump energizing electrodes 18b.

Thereby, for each of the surface emitting lasers 16 _{1 to} 16 ₃ described above, the drive signals described above from the respective electric wiring circuits 17 _{1 to} 17 ₃ cause the corresponding electrodes 18 a and 18 b and the electrode connection circuit 18 c to pass through. And are applied individually.

For this reason, the predetermined electric signal (laser drive signal) sent from the transmission signal processing unit 2 through the electric wiring circuits 17 _{1 to} 17 ₃ drives the surface emitting lasers 16 _{1 to} 16 ₃ and Thus, a predetermined electric signal included in the laser drive signal is converted into an optical signal, and is individually condensed by each optical lens unit 12c via the 45-degree multiple reflection mirror 14, and is respectively collected to the corresponding waveguides 12 _{1 to} 12 ₃ . It is surely transmitted.

  Next, each component of the above-described one optical coupling circuit (transmission side optical assembly) 11 will be described in detail.

(45 degree multiple reflection mirror)
First, the 45-degree multiple reflection mirror 14 described above includes optical signal transmission multiple layers (dielectric layers) 14a, 14a,... And reflection mirror films (metal thin films) 14b, 14b,. Become.
The 45-degree multiple reflection mirror 14 is fabricated by dicing after a multilayer structure of a dielectric layer 14a and a metal thin film 14b is fabricated.

  In forming the optical signal transmission multi-layer (dielectric layer) 14a, first, there is a method of forming a film on a substrate such as Si or glass by sputtering, CVD, PCVD, spin coating or the like, or a preform method is used. There are film forming methods such as thermal stretching used. On the other hand, as a method for forming the metal thin film 14b forming the reflection mirror film, a technique such as sputtering, vacuum deposition, E-gun, or plating is used.

  Examples of the dielectric that is the material of the optical signal transmission multi-layer (dielectric layer) 14a include SiOx, SiOxNy, SiNx, polymer, and BCB. On the other hand, the thin film which is the material of the reflective mirror film (metal thin film) 14b is composed of Ti, Pt, Au, Ni, Cu, Ag, Sn, etc., and combinations thereof. These materials are selected in consideration of the wavelength band of light to be used and the adhesion with the material.

  When forming the multilayer structure of the dielectric layer 14a and the metal thin film 14b, in the case of film formation, the dielectric and the metal thin film may be alternately formed on the substrate. In the case of a method using a preform, a method of forming a metal thin film after forming a dielectric sheet and bonding the metal surfaces together may be employed.

(About waveguide)
In the waveguide (polymer waveguide) 12 _{1 to} 12 ₃ portion, first, the core layer 12a which is a material portion constituting each of the waveguides 12 _{1 to} 12 ₃ is formed by photolithography and dry etching, and then It is formed by being embedded with a clad layer 12b that constitutes the periphery of the waveguides 12 _{1 to} 12 ₃ .
In this case, each of the optical lens portions 12c is formed in a semi-cylindrical shape in the first embodiment. Each of the optical lens portions 12c is obtained by processing the end portions of the waveguides 12 _{1 to} 12 ₃ into arcs by photolithography and dry etching.

  As a mask for dry etching, first, a metal thin film may be formed, the metal thin film may be etched using a resist mask, and dry etching may be performed using the patterned metal thin film as a mask. In addition, the metal thin film in this case can be used as a marker for mounting an electrical wiring pattern or an optical component when mounting an electrical component, in addition to the purpose of processing polyimide. Alternatively, a waveguide pattern or a cylindrical lens may be directly formed using photosensitive polyimide or the like.

(Construction of transmitting side optical assembly)
Further, in the manufacturing process of the transmission side optical assembly (one optical coupling circuit) 11, a surface-emitting laser (VCSEL) 16 _{1 to} 16 is provided after a 45 ° multiple reflection mirror is additionally provided for the waveguides 12 _{1 to} 12 ₃ . ₃ is installed.

Accordingly, the surface emitting laser is controlled by controlling the position of the surface of the 45-degree multiple reflection mirror 14 (that is, in the Y-axis direction) with reference to the difference information from the surface position of the core positions of the waveguides 12 _{1 to} 12 _3. The positions of 16 _{1 to} 16 ₃ in the Z-axis direction are uniquely determined. The mounting positions of the surface emitting lasers 16 _{1 to} 16 ₃ are information on the Y-axis direction of the 45-degree multiple reflection mirror 14 (difference between the waveguide surface and 45-degree multiple reflection mirror surface position) and information on the Z-axis direction (waveguide surface). The difference between the edge positions on the waveguide side of the 45-degree multi-reflection mirror with respect to the marker or the like formed in (5) is calculated, and high-accuracy mounting is possible.

In this case, in order to realize highly efficient coupling between the surface emitting lasers (VCSEL) 16 _{1 to} 16 ₃ and the waveguides 12 _{1 to} 12 ₃ , it is necessary to adjust the numerical aperture NA (Numerical Aerture). Even if the spot size of the light is small, if the reflection angle of the core / cladding of the light entering the waveguides 12 _{1 to} 12 ₃ is smaller than the total reflection angle, the light in the core layer escapes to the cladding layer side. This is because light does not propagate.

With respect to the X-axis direction of the waveguides 12 _{1 to} 12 ₃ , the NA can be adjusted with a semi-cylindrical lens. Further, the Y-axis direction of the waveguide ₁₂ 1 to 12 ₃ because there is no adjustment mechanism NA, it is necessary to increase the NA of the waveguide ₁₂ 1 to 12 ₃ to the radiation angle of the laser light. Therefore, for example, in a polymer waveguide having a refractive index of about 1.5, the refractive index difference between the core layer and the cladding layer is preferably 2% or more.

<Receiving side optical assembly 13>
Next, the other optical coupling circuit 13 which is a receiving side optical assembly will be described with reference to FIGS.

In the first embodiment, the other optical coupling circuit (reception-side optical assembly) 13 is installed on the same substrate 10 as the above-described one optical coupling circuit (transmission-side optical assembly) 11, and as described above. The optical signal B sent from the one optical coupling circuit 11 via the waveguide 2 (12 _{1 to} 12 ₃ ) is converted into an electric signal A and output. The converted electric signal A is transmitted to the outside via the transmission signal processing unit 3 described above.

As shown in FIGS. 5 to 6, the other optical coupling circuit 13 which is the receiving side optical assembly is in the one optical coupling circuit 11 and is replaced with the plurality of surface emitting lasers 16 _{1 to} 16 ₃ described above. characterized in that equipped with photodiodes 26 ₁ to 26 ₃ is a photoelectric conversion element Te. Reference numerals 28a, 28a,... Denote a plurality of photoelectric conversion element electrodes provided corresponding to the photodiodes 26 _{1 to} 26 ₃ .

That is, as shown in FIGS. 5 to 6, the other optical coupling circuit 13 includes waveguides (core layers 12a) 12 ₁ , 12 ₂ , 12 for guiding the optical signals sent from the one optical coupling circuit 11 described above. 12 _3, the optical signal to the respective waveguides ₁₂ 1 to 12 ₃ at the other end direction different from the facing arranged in the respective waveguide ₁₂ 1 to 12 ₃ (right end in FIG. 5) 45 degree multi-reflection mirror 14 for guiding the light, and signal transmission provided with a relay function for sending out the signal concerning the optical signal from each of the waveguides 12 _{1 to} 12 ₃ to the outside through the 45 degree multi-reflection mirror 14 Means 25.

Among these, as shown in FIGS. 5 to 6, the signal transmission means 25 is an end face on the opposite side of the surface optically connected to the waveguides 12 _{1 to} 12 ₃ of the 45-degree multiple reflection mirror 14 (FIG. 5). , Photodiodes 26 ₁ , 26 ₂ , and 26 ₃ as photoelectric conversion elements installed on the upper end surface), and electric wiring circuits 17 ₁ that individually send electric signals output from the photodiodes 26 _{1 to} 26 ₃ to the outside. 17 ₂ and 17 ₃ .

Here, reference numeral 28 denotes a photodiode array provided in place of the surface emitting laser array 18 described above. The photodiode array 28 is, as shown in FIG. 6 (b), a plurality of photodiodes ₂₆ 1 to 26 ₃ as described above, to identify the preset equipped position holds the respective photodiodes ₂₆ 1 to 26 ₃ diodes A holding member 28A, a plurality of photodiode electrodes 28a, 28a,... Individually installed corresponding to the diode holding member 28A, and individually at the ends of the electric wiring circuits 17 ₁ , 17 ₂ , 17 ₃ And a plurality of energizing electrodes for bumps 18b, 18b,... Installed corresponding to each of the electrodes, and electrode connection circuits 18c, 18c,... For individually connecting the electrodes 18a, 18b. It is configured.

Reference numerals 28e, 28e,... Denote other electrodes for bump equipment formed in the same manner as the bump energizing electrode 28b.
Other configurations are the same as those of the one optical coupling circuit (transmission side optical assembly) 11 described above.

As a result, the electrical signals photoelectrically converted by the photodiodes 26 _{1 to} 26 ₃ described above are sent to the transmission signal processing unit 3 described above via the electrical wiring circuits 17 _{1 to} 17 ₃ as described above. It is transmitted from the signal processing unit 3 to the outside.

(Construction of receiving side optical assembly)
The manufacturing process of the receiving-side optical assembly 13 becomes in the order of mounting the respective photodiodes ₂₆ 1 to 26 ₃ corresponding to the after-site equipped with a 45-degree multiple reflection mirror 14 with respect to each waveguide ₁₂ 1 to 12 ₃ in. Accordingly, by controlling the position of the surface of the 45 ° multiple reflection mirror 14 (ie, in the Y-axis direction) with reference to the position information from the surface of the core layer 12a of each of the waveguides 12 _{1 to} 12 ₃ , each photodiode 26 is controlled. ₁ ~ 26 ₃ Z-axis direction position of the mounting of uniquely determined.

Mounting position of the photodiode 26 _{1-26 3} was formed on 45 ° Y-direction information (difference in surface position of the surface and 45 ° multiple reflection mirrors of the waveguide) of the multiple reflection mirror 14 and Z-direction information (waveguide surface It is calculated based on the difference in edge position on the waveguide side of the 45-degree multiple reflection mirror with respect to the marker or the like, and enables high-precision mounting.

In order to realize high-efficiency coupling between the waveguides 12 _{1 to} 12 ₃ and the photodiodes 26 _{1 to} 26 ₃ , the semi-cylindrical lens 12 </ b> C is provided in the X-axis direction so that light can be collected. Since the Y-axis direction of the waveguide ₁₂ 1 to 12 ₃ no function of the condenser, each photodiode ₂₆ 1-26 ₃ compared to the diameter of the absorbing layer waveguide ₁₂ 1 to 12 ₃ in the Y direction of the core layer small thickness, it is desirable that the thin trapped 45 ° multiple reflection mirror than the diameter of each photodiode 26 _{1-26 3} absorbent layers.

<Another example of the optical lens unit 12c>
Here, another example of the optical lens unit 12c described above will be described.
The structure of the cylindrical lens portion is not limited to the structure shown in FIG. 7 to 10 shown below can also be used effectively.

(Extended lens type (1))
This is shown in FIG.
Light lens unit 12P of the extension lens mold shown in FIG. 7, the semi-cylindrical lens with a basic configuration, 45 ° multiple reflection mirror described above and includes an end portion of the core layer constituting the waveguide 12 ₁ described above 14 (see FIG. 11 to FIG. 13) is set in a state of spreading in a T shape along the input end faces of the optical signal transmission multiple layers 14a and 14a and covering the clad layers located on both sides. The optical lens portion 12P is integrally formed of the same material as the core layer described above.

Here, FIG. 7 (A) is a perspective view of an optical lens portion of the waveguide 12 ₁ of arranging the optical lens portion 12P of the extension lens mold to the end of the 45-degree multi-reflection mirror 14 side, FIG. 7 (B ) Is a plan view, and FIG. 7C is a front view. Other configurations are the same as those of the optical lens unit 12C in FIG. 4 described above.

In this case of FIG. 7, the waveguide 12 ₁ has a structure in which the waveguide is interrupted within the polymer. On the other hand, in the Y-axis direction of the cylindrical lens portion 12P, the structure of the core layer and the cladding layer is maintained and light is confined. For this reason, the light spread in the X direction can be collected by increasing the lens diameter.

Therefore, in the case of FIG. 7, upon reception of optical signals between one another of the waveguide 12 ₁ and 45 degrees multiple reflection mirror 14 can be further effectively suppress the diffusion of light signals between one another Transfers can be performed efficiently.
The other optical waveguides 12 ₂ and 12 ₃ are also provided with the same optical lens portion 12P and function similarly.

(Extended lens type (2))
This is shown in FIG.
The extended lens type optical lens portion 12Q shown in FIG. 8 is formed in the same shape as the extended lens type (1). On the other hand, the optical lens portion 12Q is characterized in that the material is formed of the same material as the surrounding cladding layer 12b surrounding the core layer described above.

Here, FIG. 8 (A) is a perspective view of an optical lens portion 12Q portion of the waveguide 12 ₁ of arranging the optical lens portion 12Q of the extended lens mold to the tip, and FIG. 8 (B) is a plan view, FIG. 8 ( C) shows front views respectively. Other configurations are the same as those of the optical lens portion 12c in FIG.

Also in the example of FIG. 8, the waveguide 12 ₁ is in the broken structure inside the polymer. There is no structure of the core layer and the cladding layer in the Y-axis direction on the cylindrical lens portion 12Q side. For this reason, since there is no light confinement in the Y-axis direction in the lens portion 12Q, the light spreads in the Y-axis direction by the thickness of the lens in the lens portion 12Q. On the other hand, by the absence of the core layer, it is possible to embed a photosensitive polyimide after forming the core layer, the waveguide 12 ₁ of production process in such a point is simplified, productivity can be enhanced.

The other optical waveguides 12 ₂ and 12 ₃ are also provided with the same optical lens portion 12Q and function in the same manner.
Even if it does in this way, the effect similar to the case of the optical lens part 12P shown in FIG. 7 mentioned above can be obtained cheaply.

(Fresnel lens type)
This is shown in FIG.
The Fresnel lens type optical lens portion 12F shown in FIG. 9 is characterized in that the lens portion of the extended lens type (1) disclosed in FIG. 7 is a Fresnel lens type lens portion. On the other hand, the optical lens portion 12F is characterized in that the material is formed of the same material as the core layer 12a described above.

Here, FIG. 9 (A) is a perspective view of an optical lens portion 12F portion of the waveguide 12 ₁ of arranging the optical lens portion 12F of the Fresnel lens type at the tip, and FIG. 9 (B) is a plan view, FIG. 9 ( C) shows front views respectively. Other configurations are the same as those of the optical lens unit 12C in FIG. 4 described above.

In FIG. 9, the waveguide 12 ₁ is in the broken structure inside the polymer. However, the structure of the core layer and the cladding layer is maintained in the Y-axis direction of the cylindrical lens portion 12F, and light is confined. Then, by increasing the lens diameter, it is possible to collect light spreading in the X-axis direction, and at the same time, by using a Fresnel lens, the optical path length in the free space between the lens periphery and the 45 ° multiple reflection mirror 14 can be increased. It is possible to effectively reduce the spread of light in the Y-axis direction in free space.

The other optical waveguides 12 ₂ and 12 ₃ are also provided with the same optical lens portion 12F and function in the same manner.
Even if it does in this way, the effect similar to the case of the optical lens part 12P shown in FIG. 7 mentioned above can be acquired.

(Double lens type)
This is shown in FIG.
This double lens type optical lens portion 12W is characterized in that a semi-cylindrical lens portion 12G is provided as shown in FIG. 10 so as to face the lens surface of the Fresnel lens type lens portion 12F disclosed in FIG. Have. The semi-cylindrical lens portions 12G is composed of a transparent material different refractive index than the clad layer 12b is a member around the waveguide 12 ₁ described above.

Here, FIG. 10 (A) is a perspective view of an optical lens portion 12F portion of the waveguide 12 ₁ of arranging the optical lens portion 12F of the Fresnel lens type at the tip, and FIG. 10 (B) is a plan view, FIG. 10 ( C) shows front views respectively. Other configurations are the same as those of the optical lens unit 12C in FIG. 4 described above.

  In FIG. 10, a semi-cylindrical lens portion 12G is included in the polymer. Thereby, the part which touches a multiple reflection mirror can be comprised by a linear end surface. Therefore, the gap between the 45-degree multiple reflection mirror 14 and the lens surface of the semi-cylindrical lens portion 12G can be filled with the same transparent resin as the core layer 12a, which is resistant to condensation and increases the reliability of the module. be able to.

  As described above, the semi-cylindrical lens is not limited to the single lens system shown in FIGS. 7 to 9, and a plurality of lenses may be combined as shown in FIG. Thereby, a design freedom can be raised. Further, the semi-cylindrical lens portion 12G as shown in FIG. 10 can also be formed on the dielectric layer inside the 45-degree multiple reflection mirror. However, in that case, when the 45-degree multiple reflection mirror 14 is arranged in the waveguide, it is necessary to accurately control the positions of the 45-degree multiple reflection mirror 14 and the X-axis direction, but there is no particular inconvenience.

That is, in the double lens type optical lens portion 12W, the convex portion of the semi-cylindrical lens portion 12G is disposed so as to face the lens surface of the Fresnel lens type lens portion 12F. The side surface (light transmission / reception surface) of the reflection mirror 14 can be a flat end surface. Therefore, 45 degrees and the multiple reflection mirror 14 and the waveguide 12 ₁ is brought into close contact via the lens portion 12W can be linked equipped with, the diffusion of the optical signal further effectively prevented in this respect good efficiency light An advantage that signals can be exchanged can also be obtained.
The other waveguides 12 ₂ and 12 ₃ are also provided with the same double lens type optical lens portion 12W and function in the same manner.

<Overall operation>
Next, the overall operation in the first embodiment will be described.
First, in FIG. 1, when a predetermined transmission signal is set and inputted from the outside, the transmission signal processing unit 2 takes it in, processes it, and outputs it as a transmission signal. The transmission signal output from the transmission signal processing unit 2 is converted into an optical signal through the optical signal transmission path 1A, transmitted to the transmission signal processing unit 3, and converted into an electrical signal again to the transmission signal processing unit 3. It is sent.

In this case, in the optical signal transmission path 1A, first, one optical coupling circuit (transmission-side optical assembly) 11 provided at one end thereof converts the electrical signal from the transmission signal processing unit 2 into an optical signal. Specifically, an electrical signal (laser drive signal) sent from the transmission signal processing unit 2 via the electrical wiring circuits 17 ₁ , 17 ₂ , 17 ₃ is a surface emitting laser array 18 that forms part of the signal transmission means 15. Are individually converted into optical signals by the surface emitting lasers 16 _{1 to} 16 ₃ mounted on the optical fiber and sent to the corresponding waveguides 12 ₁ , 12 ₂ , and 12 ₃ through the 45-degree multiple reflection mirror 14 on the transmission side, Via the waveguides 12 _{1 to} 12 ₃ , the light is sent to the other optical coupling circuit (receiving optical assembly) 13 provided at one end.

Here, the light output from the laser emitting units of the surface emitting lasers 16 _{1 to} 16 ₃ is confined between the mirrors in the 45-degree multiple reflection mirror 14 in the Z-axis direction, and is prevented from spreading spatially. As it is, it is fed into the waveguides 12 _{1 to} 12 ₃ .

For this reason, in the optical signal transmission line 1A, the predetermined electrical signal (laser drive signal) sent from the transmission signal processing unit 2 described above via the electrical wiring circuits 17 _{1 to} 17 ₃ is the front side of the optical signal transmission path 1A. The light-emitting lasers 16 _{1 to} 16 ₃ are driven and a predetermined electric signal included in the laser drive signal is converted into an optical signal by this, and is individually condensed by each optical lens unit 12 c via the 45 ° multiple reflection mirror 14. Thus, the signal is reliably transmitted to the corresponding waveguides 12 _{1 to} 12 ₃ .

Next, the optical signals transmitted through the waveguides 12 _{1 to} 12 ₃ are converted into photodiodes (photoelectric conversion elements) 26 _{1 to} 26 ₃ provided in the photodiode array 28 that forms part of the signal transmission means 25 on the reception side. Are individually photoelectrically changed and sent to the transmission signal processing unit 3 individually through the 45 ° multiple reflection mirror 14 and the electric wiring circuits 17 ₁ , 17 ₂ , and 17 ₃ on the receiving side.

In this case, the optical signal sent through the waveguides 12 _{1 to} 12 ₃ is confined between the mirrors in the 45-degree multiple reflection mirror 14, and the photodiode (photoelectric conversion) is prevented from spreading spatially. _elements) reached 26 1-26 _3, the photodiode ₂₆ 1-26 ₃ a thus converted into individual electrical signals fed to the transmitting signal processing section 3 as described above.

(Operation of 45 degree multiple reflection mirror)
Here, the propagation state of the optical signal in the 45-degree multiple reflection mirror 14 will be described with reference to FIGS.

First, an example of ray tracing in the 45-degree multiple reflection mirror 14 is shown in FIGS.
Among these, as shown in FIG. 11, the trajectory of the light beam on the exit side of the multiple reflection mirror is roughly classified into two, trajectory A and trajectory B.
A general surface emitting laser (VCSEL) has a total radiation angle of 35 degrees or less with respect to the air and 17.5 degrees or less on one side. For example, in a medium having a refractive index of 1.54, the angle is 11.2 degrees or less on one side.

As shown in FIG. 11, the incident angle φ with respect to the exit surface varies depending on the locus of multiple reflection. That is, in the case of the orbit A, the incident angle φ is 11.2 degrees or less. On the other hand, in the case of the trajectory B, it becomes “90-11.2 = 78.8 degrees” or more.
On the other hand, as shown in FIG. 12, if the region outside the emission surface is air, in the case of the orbit A, the light is emitted with the transmittance of the refractive index difference between the air and the dielectric. Also in the case of the orbit B, the light is totally reflected once at the exit surface x point), reflected again by the metal mirror, and then emitted with the transmittance of the difference in refractive index between the air and the dielectric.

  As shown in FIG. 13, if the refractive index of the region outside the exit surface is close to that of the dielectric, the track A emits as it is. On the other hand, in the case of the trajectory B, the light exits at a deep angle on the exit surface and becomes stray light.

FIG. 14 is a calculation result showing the relationship between the above-described exit surface incident angle φ and laser exit angle θ (overall spread angle) when a 45 ° multiple reflection mirror 14 with a mirror interval of 5 [μm] is used.
In addition, as shown in the trajectory B in FIG. 12, the incident angle at the exit surface is large when the laser beam radiation angle is wide and the laser beam radiation angle is generated only on the plus side. .

Assuming a far-field image of a surface emitting laser (VCSEL) having a relatively wide radiation angle as shown in FIG. 15, the refractive index in the outer region of the exit surface of the 45-degree multiple reflection mirror 14 is close to a dielectric as shown in FIG. As a result, the ratio of stray light that exits at a deep angle on the exit surface as in the trajectory B was calculated to be 5% or less.
From this, it was found that the 45-degree multiple reflection mirror 14 is highly efficient as an optical path conversion for the light sources such as the surface emitting lasers 16 _{1 to} 16 ₃ .

  On the other hand, in the case of FIGS. 2 to 3, since the light is not confined in the X-axis direction, it spreads from the laser light emitting point to the waveguide entrance, but is effectively condensed through the semi-cylindrical lens 12c.

From the viewpoint of mounting, the 45-degree multiple reflection mirror 14 has a periodic structure. Therefore, even if the metal layer (mirror surface) is displaced with respect to the Y-axis direction as the accuracy of the member, the period of the periodic structure Only displacement will cause misalignment. Moreover, since the multiple reflection mirror has the same shape with respect to the X-axis direction, no problem occurs even if it is displaced.
That is, since the 45-degree multiple reflection mirror 14 has a laminated structure, even if the mirror position shifts in parallel, the influence of the shift is caused only by the mirror interval. For this reason, the manufacturing accuracy of parts is loose, and it can be manufactured at a lower cost than an optical lens.

Furthermore, the arrangement position of the 45-degree multiple reflection mirror 14 can be controlled in the Z-axis direction and the X-axis direction by referring to the edge of the member or a marker previously formed on the member using visual alignment. Further, the position of the surface of the 45 ° multiple reflection mirror 14 on the same side (that is, the Y-axis direction) can be controlled using the height of the surfaces of the waveguides 12 _{1 to} 12 ₃ as a reference plane. Solder or silver paste can be used to fix the height.
It is possible to control the height by holding the height from heating to melting until it hardens. If the substrate 10 on which the waveguides 12 _{1 to} 12 ₃ are formed is transparent, a photo-curing resin may be used.

In the first embodiment, since the semi-cylindrical lens 12c monolithically attached to the waveguides 12 _{1 to} 12 ₃ can be manufactured by photolithography, it is suitable for mass production and can be manufactured at low cost. Moreover, the radiation angle of light is converted by installing a semi-cylindrical lens. Thereby, the semi-cylindrical lens 12c formed in the waveguides 12 _{1 to} 12 ₃ or the 45 ° multiple reflection mirror 14 converts the radiation angle with respect to one axis in a plane perpendicular to the optical axis.

  Furthermore, if another semi-cylindrical lens 12G shown in FIG. 10 is used to convert the radiation angle of the other vertical axis, the radiation angle can be converted with respect to the biaxial direction. Coupling is possible even to a waveguide having a smaller NA (numerical aperture) than the waveguide. In addition, the 45-degree multi-reflection mirror and the semi-cylindrical mirror arranged adjacent to the mirror are easy to manufacture because they have a uniform structure in one direction, and the control in mounting is also simple. Implementation becomes possible.

Also, semi-cylindrical lenses formed in the waveguides 12 _{1 to} 12 ₃ using surface emitting lasers (VCSEL) 16 _{1 to} 16 ₃ whose lateral light confinement is strong in one of the two axes perpendicular to the optical axis. By using 12c, the radiation angle of the axis where the light confinement becomes strong and the radiation angle becomes large is converted.

For example, the surface emitting lasers (VCSEL) 16 _{1 to} 16 ₃ have a small mode volume by increasing the optical confinement in the lateral direction. As a result, the relaxation oscillation frequency of the surface emitting lasers 16 _{1 to} 16 ₃ is increased, and the speed can be increased.
Furthermore, in this embodiment, since the shape of the 45-degree multiple reflection mirror 14 is a rectangular parallelepiped, the relationship between the light exit position and the incident position after the optical path conversion can be predicted from either one of the information.

In addition, when the optical coupling circuit in the first embodiment is used, the signal transmission speed can be increased using the surface emitting lasers 16 _{1 to} 16 ₃ . In the first embodiment, when the surface emitting lasers 16 _{1 to} 16 ₃ are used and their characteristics are effectively used, an axis having a large radiation angle is arranged in the X direction and an axis having a small radiation angle is arranged in the Z direction. High-efficiency optical coupling to the waveguides 12 _{1 to} 12 ₃ is possible without requiring a separate lens in the multiple reflection mirror 14.

<Effect of embodiment>
In the first embodiment, since it is configured and functions as described above, according to this, as an optical interconnection that substitutes for the transmission of electrical signals, when converting and transmitting a plurality of introduced transmission signals, A plurality of waveguides 12 _{1 to} 12 ₃ for optical signals, a 45 ° multiple reflection mirror 14, and signal conversion elements (surface emitting lasers) 16 _{1 to} 16 ₃ (or photodiodes 26 _{1 to} 26 ₃ ) are 45 ° multiple reflection mirrors 14. Having adopted a structure that is equipped with the waveguide ₁₂ 1 to 12 ₃ of 45 ° multiple reflection mirror 14 side to the lens portion 12c as well as equipped with, thereby forming the end portion of each of the waveguides ₁₂ 1 to 12 ₃ The confined lens portion 12c and the 45 ° multiple reflection mirror 14 allow light confinement in the biaxial direction in the vertical plane to reliably suppress the light from spreading into the space. As a result, it is possible to effectively suppress a decrease in sensitivity during signal transmission, and further, the number of parts is greatly reduced, and a configuration and mounting in which low-cost parts are combined can be realized. It is possible to provide an excellent optical coupling circuit with good productivity and a signal transmission / reception optical module using the same.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS.
In the second embodiment, as shown in FIG. 16, the transmission / reception optical module is provided with an optical signal transmission path within the casing or between the casings.
Here, the same reference numerals are used for the same constituent members as those of the first embodiment described above.

  The transmission / reception optical module shown in FIGS. 16 to 20 transmits electrical signals for transmission input to the two transmission signal processing units 2A and 2B provided on one board (board) 10A to the other board (board). The optical signal transmission path (optical interconnection circuit) 30A for transmission to a plurality of outgoing signal processing units 3A and 3B that are installed in 10B and transmit to the outside.

Among these, the optical interconnection circuit 30A includes two transmission side optical assemblies 3A and 3B that divide a plurality of electrical signals output from the transmission signal processing units 2A and 2B described above into two groups and convert them into optical signals. And optical signal relay means 99A that takes in the optical signals via a plurality of polymer waveguides 12 ₁ , 12 ₂ , 12 ₃ ... And transmits them to the other substrate (board) 10B side, and this optical signal relay means 99A. Is received through a plurality of polymer waveguides 12 ₁ , 12 ₂ , 12 ₃ ... And converted into an electrical signal and transmitted to each of the outgoing signal processing units 3A and 3B. Side light assemblies 13A and 13B are provided.

Here, the optical signal relay means 99A includes a plurality of optical fiber coupling optical fibers (MMF arrays) 100 installed between the one and the other substrates 10A and 10B, and the plurality of relay optical fibers. (MMF array) 100 and one of the plurality of waveguides 12 ₁ , 12 ₂ , 12 ₃ ... On the one substrate 10A are optically coupled to one relay optical coupling circuit (fourth optical coupling circuit) 32; , The other relay optical coupling circuit (fifth optical coupling circuit (MMF array) 100) and the plurality of waveguides 12 ₁ , 12 ₂ , 12 ₃ ... On the other substrate 10B. The optical coupling circuit 33).

This will be described in detail below.
First, in FIG. 16, reference numeral 30 denotes an optical module for signal transmission / reception in the second embodiment. In this optical module 30, the first to eighth optical coupling circuits 11A, 11B, 31, 32, 33, 34, 13A, and 13B according to the present invention include one board 10A for internal transmission and the other board 10B. It is divided into and each equipped.

  The one substrate 10A further includes two transmission signal processing units 2A and 2B that are installed on the left end of FIG. 1 and function in the same manner as the transmission signal processing unit 2 in the first embodiment described above. Is provided.

Among these, one of the transmission signal processing units 2A receives a plurality of electrical signals output from the transmission signal processing unit 2A as electrical wirings (electrical wiring circuits) 17 ₁ , 17 ₂ , 17 ₃ (see FIG. 2). A first optical coupling circuit 11A (same as one optical coupling circuit 11 in FIG. 1) is also provided as one transmission side optical assembly that takes in through the optical signal and converts the optical signals into a plurality of optical signals B1 and outputs them. Here, reference numerals 12 ₁ , 12 ₂ , 12 ₃ (see FIG. 2) denote waveguides that individually guide a plurality of optical signals output from the first optical coupling circuit 11A.

Similarly, in the other transmission signal processing unit 2B described above, a plurality of electrical signals output from the transmission signal processing unit 2B are connected to the electrical wiring (17 ₁ , 17 ₂ , 17 _{3 of} the first optical coupling circuit 11A). ..)) And the other transmission side optical assembly that takes in via the electrical wiring (electrical wiring circuit) 17 ₁ , 17 ₂ , 17 _3. The second optical coupling circuit 11B (same as one optical coupling circuit 11 in FIG. 1) is also provided.

The plurality of optical signals output from the second optical coupling circuit 11B are also waveguides 12 installed separately from the waveguides (12 ₁ , 12 ₂ , 12 ₃ ...) Related to the first optical coupling circuit 11A described above. ₁ , 12 ₂ , 12 ₃ (see FIG. 2), the signals are transmitted to the other substrate 10B.

Optical signals sent from the first and second optical coupling circuits 11A, 11B on the one substrate 10A through separate waveguides 12 ₁ , 12 ₂ , 12 ₃ ... (Using the same reference numerals) The above-described fourth optical coupling circuit 32 that takes in B1 and B2 via a waveguide (for example, 12 ₁ , 12 ₁ ) having a two-layer structure is provided. An MMF (multi-mode fiber) array 100 for sending each one optical signal (for example, 12 ₁ , 12 ₁ ) to the other substrate 10B side while maintaining the upper and lower two-layer structure by the fourth optical coupling circuit 32 is provided. The one substrate 10A and the other substrate 10B are disposed between the other substrates.

Here, between the first optical coupling circuit (one transmission side assembly) 11A and the fourth optical coupling circuit 32 described above, a waveguide (for the optical signal B1 sent from the first optical coupling circuit 11A ( 12 ₁ , 12 ₂ , 12 ₃ ...) To the optical waveguides B ₁ , 12 ₂ , 12 ₂ , 12 ₂ , 12 ₂ , 12 ₂ , 12 ₂ , 12 ₂ , 12 ₂ , 12 ₂ , The upper-layer waveguide optical coupling circuit (third optical coupling circuit) 31 for forming a waveguide having a two-layer structure by being stacked on 12 ₃ .

As a result, in the above-described fourth optical coupling circuit 32, the optical signals transmitted from the first and second optical coupling circuits 11A, 11B via the separate waveguides 12 ₁ , 12 ₂ , 12 ₃ . B1 and B2 can be smoothly taken in through a waveguide (for example, 12 ₁ , 12 ₁ ) having a two-layer structure.

The other optical signals of the optical signals B1 and B2 are also set separately through the corresponding upper and lower two-layered waveguides 12 ₂ , 12 ₂ , 12 ₃ , 12 ₃ ,. The fourth optical coupling circuit 32 captures the optical signal B1 (via the third optical coupling circuit 31), maintains the upper and lower two-layer structure, and passes through the MMF (multimode fiber) array 100. Each is sent to the other substrate 10B side.

In addition, the MMF (multimode fiber) array 100 includes a plurality of pairs formed in pairs corresponding to the waveguides 12 ₁ , 12 ₁ , 12 ₂ , 12 ₂ , 12 ₃ , 12 ₃ ,. An MMF line 100a is provided (see FIGS. 16 and 18).

(Third optical coupling circuit 31 / upper layer waveguide optical coupling circuit)
The upper-layer waveguide optical coupling circuit (third optical coupling circuit) 31 described above targets the optical signal B1 sent from the first optical coupling circuit 11A in FIG. 16 on one substrate 10A as described above. FIG. 17 shows an example of the arrangement in the upper layer portion of a waveguide (for example, 12 ₁ , 12 ₁ ) having an upper and lower two-layer structure.

An upper-layer waveguide optical coupling circuit (third optical coupling circuit) 31 shown in FIG. 17 includes an input-side waveguide (for example, 12 ₁ ) that takes in the optical signal B1 sent from the first optical coupling circuit 11A side, The optical signal is transmitted in a direction different from that of the waveguide input side waveguide 12 ₁ (inclined upward in FIG. 17) which is individually arranged facing the end of the input side waveguide 12 _{1 in} the transmission direction. 45 ° multiple reflection mirror 14 for guiding the (transmission) with respect to the outside from the upper side is taken in conjunction with optical signals between the 45 degrees through the multiple reflection mirror 14 of the waveguide 12 ₁ of the lower Signal transmission means 35 for relaying and sending out the optical signal B1.

Here, the end portion of the transmission direction destination of the input waveguide 12 _1, one or more layers (input side end face of the plurality of optical signal transmission multiplex layer 14a in which the 45 ° multiple reflection mirror 14 is provided with ). Moreover, between the optical signal transmission multiplex layer 14a of the input waveguide 12 ₁ and the 45 ° multiple reflection mirror 14, suppressing lens unit diffusion of the optical signal is provided.

As this optical lens part, a double lens type optical lens part 12Wa formed in the same manner as the double lens type optical lens part 12W disclosed in FIG. 10 is equipped. Then, it is integrated and the input waveguide 12 ₁ and the double lens type lens unit 12Wa.

  Further, as the signal transmission means 35 that takes in the optical signal B1 sent out from the double lens type optical lens portion 12Wa through the 45 degree multiple reflection mirror 14, the second embodiment disclosed in FIG. A double lens type optical lens unit 12Wb is provided which is formed in the same manner as the double lens type optical lens unit 12W and whose front and rear positions are rotated 180 degrees.

In other words, the upper-layer-arranged optical coupling circuit (third optical coupling circuit) 31 shown in FIG. 17 includes the lower input side waveguide (for example, 12 ₁ ) on the first optical coupling circuit 11A side as described above at 45 degrees. through the multiple reflection mirror 14 which was configured to be optically coupled to the output waveguide 12 ₁ of the upper, in the 45 ° multiple reflection mirror 14 side of the lower input waveguide 12 _1, above the lens unit The double lens type optical lens part 12W formed in the same manner as the double lens type optical lens part 12W disclosed in FIG. 10 is provided.

Further, the output side waveguide 12 ₁ of the deployed upper optical transmission output side of the 45-degree multi-reflection mirror 14 side, as described above, opposite to the light output end face of the 45-degree multiple reflection mirror 14 As described above, the double lens type optical lens unit 12Wb formed in the same manner as the double lens type optical lens unit 12Wa rotates the double lens type optical lens unit 12Wa in FIG. 17 is set in a state where the left and right in FIG. 17 are reversed. In the drawing of FIG. 17, arrows indicate examples of propagation paths of the optical signal B1.

In this case, the light in the X direction is confined by a double lens type lens unit 12Wa formed in the waveguide 12 ₁ (diffusion is effectively suppressed), multiple layers of Y-direction of the light 45 degrees multiple reflection mirror 14 14a and 14b. For this reason, by adjusting the thickness T in the Z direction of the 45-degree multi-reflection mirror 14 to the interval S between the waveguides 12 ₁ and 12 ₁ of the upper and lower double layers, different steps from the waveguides 12 ₁ of different steps (lower layers) ( optical coupling to the waveguide 12 ₁ of the upper layer) becomes possible.

  Here, the 45-degree multiple reflection mirror 14 used in FIG. 17 is different from the one previously disclosed, and is incident in the Z direction and changed in the emission position, and is also emitted in the Z direction. It has a height in a state where two of the above-mentioned 45 degree multiple reflection mirrors are stacked.

As a result, the propagation of the optical signal B1 during propagation is effectively suppressed by the double lens type optical lens portions 12Wa and 12Wb and the 45 ° multiple reflection mirror 14, and the lower input side guiding is performed without causing a decrease in sensitivity. from waveguides 12 ₁ to the output side waveguide 12 ₁ of the upper while maintaining the transmission direction in the Z-direction it is possible to transmit.

Similarly for the other lower waveguides 12 ₂ , 12 ₃ ,... (See FIG. 16), the other double-lens type optical lens portions 12Wa, 12Wb and other 45 ° multiple reflections respectively provided correspondingly. The mirror 14 is connected to the upper waveguides 12 ₂ , 12 ₃ ,.

Here, the upper waveguides 12 ₁ , 12 ₂ , 12 ₃ ,... (For the optical signal B1) are, as described above, the lower stage for the optical signal B2 sent out from the second optical coupling circuit 11B side. The waveguides 12 ₁ , 12 ₂ , 12 ₃ ,... Have a two-layer structure, and are optically coupled to the fourth optical coupling circuit 32 having the stepped structure described above.

(Fourth optical coupling circuit 32 / optical coupling circuit with stepped structure)
Next, the fourth optical coupling circuit (stepped structure optical coupling circuit) 32 will be described with reference to FIG.
The fourth optical coupling circuit 32 shown in FIG. 18 takes in the above-described optical signals B1 and B2 through waveguides (for example, 12 ₁ and 12 ₁ ) having an upper and lower two-layer structure, and an MMF (multimode fiber) array. An optical signal relay transmission function for sending the signal to the other substrate 10B described above via 100 is provided.

As described above, the fourth optical coupling circuit 32 is mounted on the right end of FIG. 16 on one substrate 10A, and the first and second optical coupling circuits (transmission side optical assemblies) 11A, This is intended for both the optical signals B1 and B2 sent out from 11B, and is installed corresponding to the waveguides (for example, 12 ₁ and 12 ₁ ) having an upper and lower two-layer structure. In this case, the reason why the upper and lower two-layer structure is used is to increase the degree of aggregation of the connectors provided between the MMF (multimode fiber) array 100 described above.

The fourth optical coupling circuit 32 shown in FIG. 18 is a waveguide (for example, 12 ₁ , 12 ₁ ) that takes in the optical signals B1 and B2 sent from the first and second optical coupling circuits 11A and 11B. And optical signal transmission (transmission) in a direction (diagonally upward) different from that of the waveguide 12 _1, which is individually arranged to face the other end of the waveguides 12 ₁ , 12 _1. 45-degree multiple reflection mirrors 14 and 14 and signal transmission means 32A for sending an optical signal from the upper surface of the 45-degree multiple reflection mirrors 14 and 14 to the outside.

Here, each of the waveguides ₁₂ 1, 12 ₁ of the two-layer structure, the waveguide 12 ₁ located in the lower layer is projected forward (45 degrees to the right direction of the multiple reflection mirror 14 side / Figure 18), waveguide 12 ₁ located in the upper layer are arranged with a form retracted rearward (leftward in FIG. 18), thereby, the end of the waveguide 12 _1, 12 ₁ of the two-layer structure is a stepped structure Yes. The guide of this stepped structure portion, the 45-degree multi-reflection mirror 14 of the waveguide 12 for ₁ positioned in the upper layer is installed so as to face the distal end surface of the lower projecting portion, located below the 45-degree multi-reflection mirror 14 of the waveguide 12 for ₁ is installed.

The waveguides 12 ₁ and 12 ₁ each have a diffusion of the optical signal facing the optical signal transmission multiple layer, which is a side surface (light input surface) of the 45 ° multiple reflection mirrors 14 and 14, facing the end surface. The optical lens part 12c which suppresses each is equipped. As the optical lens portion 12c, the semi-cylindrical lens portion disclosed in FIG. 4 described above is used and integrated with the waveguides 12 ₁ and 12 ₁ .

  The above-described signal transmission means 32A separately takes in the optical signals B1 and B2 sent out from the respective semi-cylindrical lens portions 12c through the 45-degree multiple reflection mirrors 14 and 14 to the other substrate 10B side described above. It has a function to send out.

  In the second embodiment, the signal transmission means 32A includes semi-cylindrical lens bodies 31A and 31B arranged along the upper surfaces of the 45-degree multiple reflection mirrors 14 and 14, respectively, as shown in FIG. The optical signals B1 and B2 sent upward through the cylindrical lens bodies 32A and 32B are reflected and sent in the right direction in FIG. 18 toward one end of the MMF (multimode fiber) line 100a. A reflection mirror 32C and an optical connector portion 32D for connecting the 45-degree reflection mirror 32C and the MMF (multimode fiber) line 100a are provided.

  That is, the signal transmission means 32A is engaged with a 45 degree reflection mirror 32C that reflects and transmits an optical signal transmitted and received from each 45 degree multiple reflection mirror 14 to the outside, and the 45 degree reflection mirror 32C. The MMF (multi-mode fiber) array 100 including a part of a relay optical fiber (MMF line 100a) that relays the optical signal transmitted and received externally, the open end of the MMF line 100a, and the 45 degree reflection. And an MMF optical connector portion 31D including two condenser lenses 32Da and 32Db disposed between the mirrors.

  As a result, the optical signals B1 and B2 sent out from the first and second optical coupling circuits (transmission-side optical assemblies) 11A and 11B on one substrate 10A are transmitted from the fourth optical coupling circuit 32 via the MMF line 100a. Is transmitted to the other substrate 10B side.

(Linkage with the other substrate 10B side)
As shown in FIG. 18, the optical signals B1 and B2 output from the first and second optical coupling circuits (transmission-side optical assemblies) 11A and 11B are polymer waveguides 12 (for example, formed in two stages, respectively) 12 ₁ , 12 ₁ ) are bundled by one compact optical connector portion 32D and sent to the MMF line 100a which is a part of the MMF array 100.

On the other substrate 10B side, the optical signals B1 and B2 sent via the MMF line 100a are taken in via the optical connector portion 33D, and the corresponding polymer waveguides 12 and 12 (formed in two stages) are also formed. For example, the signals are transmitted to the seventh and eighth optical coupling circuits (transmission side optical assemblies) 13A and 13B through 12 ₁ and 12 ₁ ).
The same applies to the other polymer waveguides 12 ₂ , 12 ₂ , 12 ₃ , 12 ₃ ,... (See FIG. 16).

  Here, in order to realize the compact optical connector portion 33D, as described above, it is necessary to make the waveguide into multistages of two or more stages. In this case, the optical path of the optical connector 33D is formed in a matrix and is optically coupled to the MMF array 100 arranged in the matrix.

On one substrate 10A side in the configuration (optical module) of FIG. 16, the optical coupling circuits through which the optical signals B1 and B2 pass and the coupling of the waveguides 12 to the respective stages, and the guiding of the different stages from the different waveguides 12 are performed. A coupling circuit to the waveguide 12 and a coupling circuit from the multi-stage waveguide to the MMF array 100 are required. Therefore, as described above, the first to fourth optical coupling circuits 11A, 11B, 31, and 32 are provided. Each of the waveguides 12 (12 ₁ , 12 ₂ , 12 ₃ ...) Is equipped as a component for individually optically coupling.

Here, the optical coupling from the waveguides 12 (12 ₁ , 12 ₂ , 12 ₃ ,...) Of different stages to the waveguides 12 (12 ₁ , 12 ₂ , 12 ₃ ,. This is realized by the third optical coupling circuit 31 shown in FIG. Further, the optical coupling from the two-layer waveguides 12 ₁ , 12 ₁ , 12 ₂ , 12 ₂ , 12 ₃ , 12 ₃ ... To the MMF line 100a corresponds to the fourth optical coupling circuit 32 shown in FIG. be able to.

In the optical coupling to the MMF array 100, an optical connector portion 32D in which MMFs are arranged in a matrix is assumed in order to reduce the number of connectors. The waveguides 12 ₁ , 12 ₁ , 12 ₂ , 12 ₂ , 12 ₃ , 12 ₃ ... Are processed into a staircase shape as described above, and two types of 45-degree multiple reflection mirrors 14 and 14 are arranged. As described above, the semi-cylindrical lens bodies 31A and 31B are arranged on the upper surfaces of the 45-degree multiple reflection mirrors 14 and 14, respectively.

Thereby, the pitch P of the multilayer polymer waveguides 12 ₁ , 12 ₁ , 12 ₂ , 12 ₂ , 12 ₃ , 12 ₃ ... Can be converted so as to be as wide as the pitch PF of the MMF line 100a. And each of the waveguides 12 ₁ , 12 ₁ , 12 ₂ , 12 ₂ , 12 ₃ , 12 _3, ... Is parallel to the semi-cylindrical lens portion 12c and the semi-cylindrical lens bodies 31A and 31B arranged as parts. Light is formed, and optical coupling with the optical connector portion 32D is facilitated.

In the second embodiment, it is assumed that the semi-cylindrical lens bodies 31A and 31B are arranged in the same manner as the optical element. However, if the thickness accuracy of the semi-cylindrical lens bodies 31A and 31B is high, the semi-cylindrical lens bodies 31A and 31B first. The semi-cylindrical lens bodies 31A and 31B may be bonded to the 45-degree multiple reflection mirrors 14 and 14, respectively.
In order to form the stepped waveguides 12 ₁ and 12 ₂ shown in FIG. 18, a metal mask is formed in advance after forming the first-stage waveguide, and then the second-stage waveguide is formed. After the mask is formed, dry etching may be performed on the two-stage waveguide at once.

(Configuration on the other substrate 10B side)
As shown in FIG. 16, on the other substrate 10B, in order to effectively convert the optical signals B1 and B2 sent from the one substrate 10A into electric signals, the first to fourth elements described above are used. The fifth to eighth optical coupling circuits 33, 34, 13A, and 13B, which are formed substantially the same as the optical coupling circuits 11A, 11B, 31, and 32, have the above-described first to the above-mentioned first through the MMF lines 100a. The fourth optical coupling circuits 11A, 11B, 31, and 32 are installed at symmetrical positions.

That is, in FIG. 16, the optical signals B1 and B2 sent from the one substrate 10A side through the MMF line 100a are stepped structure optical coupling circuits formed in the same manner as the fourth optical signal coupling circuit 32. The fifth optical signal coupling circuit 33 is sent to each of the waveguides 12 ₁ , 12 ₁ (12 ₂ , 12 ₂ , 12 ₃ , 12 ₃ ...) Having a two-layer structure and is taken into the other substrate 10B side. The fifth optical signal coupling circuit 33 is shown in FIG.

  As shown in FIG. 19, the fifth optical signal coupling circuit 33 is configured in exactly the same way as the above-described fourth optical signal coupling circuit 32, and is installed in the opposite direction to the fourth optical signal coupling circuit 32. Are connected to the MMF line 100a. The arrows indicate the reflected propagation directions of the optical signals B1 and B2.

Of the optical signals B1 and B2 sent out from the fifth optical signal coupling circuit 33, the waveguide 12 ₁ (12 ₂ , 12 ₃ ...) Portion located in the upper layer of the two-layer structure for guiding the optical signal B1 is: The optical signal B1 waveguide 12 ₁ (12 ₂ , 12 ₃ ...) Disposed in the lower layer is optically coupled by a sixth optical signal coupling circuit 34 disclosed in FIG.

Here, the sixth optical signal coupling circuit 34 is formed exactly the same as the third optical signal coupling circuit 31 described above as shown in FIG. 20, and is installed in the opposite direction on the other substrate 10B side. As a result, the optical signal B1 is optically coupled to the optical signal B1 waveguide 12 ₁ (12 ₂ , 12 ₃ ...) Disposed in the lower layer as described above.
In FIG. 20, arrow B1 indicates the propagation direction of the optical signal B1.

Then, the optical signal B1 is an optical signal B1 which is a reception side assembly via the sixth optical signal coupling circuit 34 and the optical signal B1 waveguide 12 ₁ (12 ₂ , 12 ₃ ...) Located in the lower layer. Is sent to a seventh coupling circuit (one receiving side coupling circuit) 13A.

  One receiving side coupling circuit 13A, which is this receiving side assembly, is formed in exactly the same manner as the receiving side assembly (the other optical coupling circuit) 13 in the first embodiment described above and functions in the same manner.

  As a result, the optical signal B1 transmitted to the one receiving-side assembly (seventh optical coupling circuit) 13A is converted into an electrical signal by the seventh optical coupling circuit 13A and subjected to external signal processing. The signal is sent to the transmission signal processing unit 3A and subjected to a predetermined signal transmission process.

On the other hand, it is located in the lower layer of the two-layer structure that guides the optical signal B2 among the optical signals B1 and B2 taken from the fifth optical signal coupling circuit (stepped structure optical coupling circuit) 33 shown in FIG. The portion of the waveguide 12 ₁ (12 ₂ , 12 ₃ ...) Is extended as it is and sent to the eighth optical signal coupling circuit 13B for the optical signal B2, which is the other receiving side assembly.

  The eighth optical signal coupling circuit 13B for the optical signal B2 is formed exactly the same as the receiving side assembly (the other optical coupling circuit) 13 in the first embodiment described above and functions in the same manner. . In other words, the other coupling circuits 13A and 13B for the optical signals B1 and B2 in this case are equipped with identically formed circuits.

As a result, the optical signal B2 transmitted to the receiving side assembly (the other optical coupling circuit) 13B is converted into an electrical signal by the receiving side assembly (the other optical coupling circuit) 13B, and is transmitted to the outside. The signal is sent to the transmission signal processing unit 3B that performs signal processing to be subjected to predetermined signal processing.
Other configurations and functions thereof are the same as those of the first embodiment described above.

  Even in this case, the same operational effects as those of the first embodiment described above can be obtained. Further, in the optical coupling in each optical coupling circuit, the optical signal is diffused by each lens unit and the 45-degree multiple reflection mirror. 14 and 14, which effectively suppresses the interconnection speed for signal transmission / reception, and enables the interconnection speed even for a circuit having a long signal transmission distance. High optical interconnection can be realized, and an efficient optical module for optical transmission / reception can be obtained.

Here, in the second embodiment, the case where the two transmission side assemblies (one optical coupling circuit) 11A and 11B for the optical signal B1 and the optical signal B2 are provided is illustrated, but this transmission side assembly ( A single optical coupling circuit (one optical coupling circuit 11A, 11B) having a large number of couplings with the waveguides 12 ₁ , 12 ₂ , 12 ₃ ,. It is also possible to use an optical circuit having a total of optical circuits) and to divide and use each optical circuit of the optical coupling circuit separately for the optical signal B1 and the optical signal B2. The same applies to the reception side assemblies (the other optical coupling circuits) 13A and 13B.

[Third Embodiment]
Next, a third embodiment will be described with reference to FIGS.
Here, the same reference numerals are used for the same components as those of the second embodiment described above.

  In the third embodiment, in the second embodiment described above, two transmission-side assemblies (first and second optical coupling circuits which are transmission-side optical coupling circuits) 11A for the optical signal B1 and the optical signal B2 are provided. Instead of 11B, a single transmission side assembly (one optical coupling circuit) 41 having a two-layer structure, and two reception side assemblies (the other optical coupling circuits) 13A and 13B for the optical signal B1 and the optical signal B2 are used. Instead, one receiving side assembly (the other optical coupling circuit) 43 having a two-layer structure is provided.

That is, the signal transmission / reception optical module 40 according to the third embodiment is configured to transmit electrical signals for transmission input to the two transmission signal processing units 2A and 2B provided on one board (board) 10A. Optical signal transmission path (optical interconnection circuit) 40A for transmission to a plurality of transmission signal processing units 3A and 3B that are mounted on the board (board) 10B and transmit to the outside.
Here, with respect to the two transmission signal processing units 2A and 2B, as shown in FIG. 21, the other transmission signal processing units 2B are waveguides 73 and 83 (to be described later), as shown in FIG. Although the case where it is spread and stacked on top is illustrated, it may be configured to be stacked on one transmission signal processing unit 2A. The same applies to the transmission signal processing units 3A and 3B that transmit to the outside. The transmission signal processing units 2A and 2B are installed at positions rotated 90 degrees on the illustrated surface as shown in FIG. 21, thereby reducing the overall size of the optical module and at the time of input / output of transmission signals. Although the structure has improved operability, it may be arranged in a straight line (along the waveguides 73 and 83) as in the case of the second embodiment described above. The same applies to the transmission signal processing units 3A and 3B. Reference numerals 2 a, 2 b, 3 a, and 3 b denote band-like wiring groups for sending transmission electrical signals to the transmission side assembly 41 or the reception side assembly 43, respectively.

The optical signal transmission path (optical interconnection circuit) 40A described above divides a plurality of electrical signals output from the two transmission signal processing units 2A and 2B into two groups of optical signals B1 and B2 for conversion and output. And the optical signals B1 and B2 through a plurality of polymer waveguides 73 ₁ , 73 ₂ , 73 ₃ ,..., 83 ₁ , 83 ₂ , 83 ₃ ,. The optical signal relay means 99B that individually captures and transmits the optical signal to the other substrate (board) 10B, and the optical signals B1 and B2 transmitted through the optical signal relay means 99B are a plurality of polymer waveguides 73 _1. , 73 ₂ , 73 ₃ ,..., 83 ₁ , 83 ₂ , 83 ₃ ,... Are individually captured and converted into electric signals and transmitted to the respective outgoing signal processing units 3A and 3B. Receiver side light It is constituted by a assembly 43.
Here, the optical signal B1 propagates through the polymer waveguides 73 ₁ , 73 ₂ , 73 ₃ ,... In the upper layer portion of the polymer waveguides 73 and 78 having a two-layer structure, and the optical signal B1 has a two-layer structure. Are propagated through the polymer waveguides 83 ₁ , 83 ₂ , 83 ₃ ,... In the lower layer portion of the polymer waveguides 73 and 78 (see FIGS. 22B and 23B).

The optical signal relay means 99B includes a plurality of optical coupling optical fibers (MMF 100 including the MMF line 100a) installed between the one and the other substrates 10A and 10B described above, One of the relay lights for optically coupling the polymer waveguides 73 ₁ , 73 ₂ , 73 ₃ ,..., 83 ₁ , 83 ₂ , 83 ₃ ,... Corresponding to the optical signals B 1 and B 2 on the substrate 10 A. Polymer waveguides 73 ₁ and 73 corresponding to the optical signals B1 and B2 on the coupling circuit (fourth optical coupling circuit) 32, the plurality of relay optical fibers (MMF 100 including the MMF line 100a) and the other substrate 10B. _{2, 73} 3, _..., 83 _1, 83 2, 83 _3, ..., is constituted by the other relay optical coupling circuit (fifth optical coupling circuit) 33 for the city optically coupling .

Here, FIG. 22 shows a configuration content of the transmission side assembly (one optical coupling circuit) 41.
In FIG. 22, a transmission side assembly (one optical coupling circuit) 41 includes a 45-degree multiple reflection mirror 44 that is provided in common corresponding to the waveguides 73 ₁ and 83 ₁ that are previously installed in two upper and lower layers. I have.

Surface emitting lasers (VCSEL) 35 and 45 are arranged on the upper surface of the 45 degree multiple reflection mirror 44, and optical signals B1 and B2 converted and output from the surface emitting lasers 35 and 45 are respectively 45 degree multiple reflection mirror 44. The optical signals B1 and B2 are sent out from the side surfaces of the optical waveguides toward the waveguides 73 ₁ and 83 ₁ described above. The same applies to the other waveguides 73 ₂ , 83 ₂ , 73 ₂ , 83 ₂ , 73 ₃ , 83 ₃ ,... (See FIG. 21).

Here, in the third embodiment, since the waveguides (for example, 73 ₁ and 83 ₁ ) installed in the upper and lower two layers are targeted from the beginning, the third embodiment equipped in the second embodiment described above is used. The optical coupling circuits 31 and 34 (see FIG. 16) are unnecessary and are not equipped (see FIG. 21).

  In FIG. 22, reference numeral 201 denotes a surface emitting laser array body equipped with surface emitting lasers 35 and 45. Reference numerals 35a and 45a denote donut-shaped electrodes electrically connected to the surface emitting lasers 35 and 45, respectively.

  The donut-shaped electrodes 35a and 45a have signal introduction electrodes 34a for taking in electrical signals (laser drive signals) that are transmission signals output from the transmission signal processing units 2A and 2B (see FIG. 21). The surface emitting laser array main body 201 is provided with signal guide lines 34b and 44b for guiding 44a and the captured electric signal to the doughnut-shaped electrodes 35a and 45a on the surface emitting lasers 35 and 45 side. Reference numeral 202 denotes a laser array body support portion that holds the surface emitting laser array body 201.

Each of the surface emitting lasers 35 and 45 is driven by an electric signal to convert and output the optical signals B1 and B2 including the transmission signal described above. The optical signals B1 and B2 converted and output by the surface emitting lasers 35 and 45 are two-layer waveguides 73 ₁ and 83 ₁ (73 ₂ , 73) configured in the same manner as in the second embodiment described above. 83 ₂ , 73 ₃ , 83 ₃ ...), The fourth optical coupling circuit 32, and the MMF line 100 a are sequentially optically coupled and transmitted to the other substrate 10 B side.

On the other substrate 10B side, the optical signals B1 and B2 sent via the MMF line 100a are sent to the fifth optical coupling circuit 73 (see FIG. 21) as in the case of the second embodiment described above. The other optical coupling circuit having a two-layer structure shown below through two-layer waveguides 73 ₁ , 83 ₁ (73 ₂ , 83 ₂ , 73 ₃ , 83 ₃ ...) Received assembly) 43 is photoelectrically converted and sent separately to transmission signal processing units 3A and 3B that perform signal processing for external transmission.

Here, in the third embodiment, the two receiving side assemblies for the optical signal B1 and the optical signal B2 installed in the second embodiment described above (the seventh and eighth optical coupling circuits are the other optical coupling circuits). Instead of the optical coupling circuit) 13A and 13B, as described above, one receiving side assembly (the other optical coupling circuit) 43 having a two-layer structure is provided.
FIG. 23 shows the configuration of the receiving side assembly (the other optical coupling circuit) 43.

In FIG. 23, the receiving-side assembly (the other optical coupling circuit) 43 has _one 45-degree multiple reflection mirror 44 in common with respect to a preset upper and lower two-layer waveguide (for example, 73 ₁ , 83 ₁ ). The optical signals (received optical signals) B1 and B2 incident on the 45-degree multi-reflection mirror 44 through the waveguides 73 ₁ and 83 ₁ previously installed in the upper and lower two layers from the side surface of the 45-degree multi-reflection mirror 44 44 is photoelectrically converted by photodiodes (PD) 55 and 65 disposed on the upper surface, and sent to transmission signal processing units 3A and 3B (see FIG. 21) for performing signal processing for external transmission. It is like that.

Then, in the third embodiment, even in the other substrate 10B side, configured to transmit optical signals B1, B2 through the installed waveguide from the beginning bilevel (e.g. 73 _1, 83 ₁₎ Therefore, as described above, the sixth optical coupling circuit 34 provided in the second embodiment is unnecessary and is not provided.

  Here, reference numeral 301 denotes a photodiode array equipped with photodiodes (PD) 55 and 65. Reference numerals 55a and 65a denote signal output electrodes electrically connected to the photodiode (PD) through the electrode wirings 54b and 64b, respectively.

  A transmission signal in which the received signal (electrical signal) photoelectrically converted by the photodiode (PD) 55, 65 through the signal output electrodes 55a, 65a is subjected to signal processing for external transmission through a wiring (not shown). It is sent out toward the processing units 3A and 3B. Other configurations are the same as those of the second embodiment described above.

  Even if it does in this way, since the same operation effect as a 2nd embodiment mentioned above can be obtained, since the laminated structure of two or more waveguides is also possible, it can realize optical interconnection with high throughput. There are advantages.

Further, as shown in FIGS. 22 and 23, the two-layered waveguides (for example, 73 ₁ and 83 ₁ ), as shown in FIG. 22 and FIG. Since the set interval S of (PD) 55 and 65 is set, it is necessary to control the position of the waveguide in the Y-axis direction during mounting.

  In the case of two or more layers, it is necessary to decrease the curvature of the semi-cylindrical lens as it goes down. In this case, the lens configuration in FIG. 10 provides a high degree of freedom in design, and the curvature of the semi-cylindrical lens portion can be changed for each position of the waveguide. Here, the electrodes 35a, 45a, 55a and 65a for the optical elements of the surface emitting lasers 35 and 45 and the photodiodes (PD) 55 and 65 can be mounted on the waveguide using gold bumps or the like.

[Other effects]
In each of the above-described embodiments, each of the optical coupling circuits is formed monolithically in the waveguide and the waveguide, the 45-degree multiple reflection mirror 14 made of alternately stacked dielectric layers and metal thin films. Since it is configured with a semi-cylindrical lens, the number of parts is reduced, and the optical coupling of a surface emitting laser and a waveguide, a photodiode and a waveguide with a combination of low-cost parts and low-cost mounting. As a result, a low-cost optical coupling circuit can be provided.

Further, as disclosed in the second embodiment, the optical coupling between the polymer waveguide and the MMF line is possible, and in this respect, even if the optical interconnection is divided into a plurality of cases (or substrates), the cost is low. It is possible to provide an optical coupling circuit with less propagation loss.
Further, since the optical confinement in the lateral direction is made possible by using a surface emitting laser (VCSEL) strong in one of the two axes perpendicular to the optical axis, the low-cost multi-reflection mirror 14 can be manufactured at low cost. An optical transmission module (optical module) capable of high-speed operation can be provided.

  In addition, as disclosed in the second embodiment, since the optical coupling to the waveguides having different heights can be effectively performed via the 45-degree multiple reflection mirror 14, high efficiency is achieved. It was possible to enable optical coupling.

Further, since the relationship between the emission position and the incident position of the light after the optical path conversion in the 45-degree multiple reflection mirror 14 can be predicted from either information, the image processing and the height detection for the mounted waveguide are mounted in combination. It becomes possible. As a result, mounting is fully automated, and low-cost mounting is possible.
<Example>

Specific examples of the optical coupling circuit according to the present invention will be described.
Here, as shown in FIGS. 1 to 3, the first optical coupling circuit 11 which is a transmission side optical assembly includes a surface emitting laser (VCSEL) array 18 and an electric connected to the surface emitting laser (VCSEL) array 18. The transmission path 17 (17 ₁ , 17 ₂ , 17 ₃ ,...), A 45-degree multiple reflection mirror 14 and a polymer waveguide 12 (12 ₁ , 12 ₂ , 12 ₃ ,...) Are combined.

  The polymer waveguide 12 is fabricated in an array on a Si substrate, the array interval is 250 [μm], the number of arrays is 12 [ch], the core size is 30 [μm], the refractive index of the core is 1.54, the core and the cladding The refractive index difference was 2%. The thickness of the cladding layer above the core was 70 [μm], and the thickness of the cladding layer below the core was 100 [μm].

  A TiAu thin film was previously formed on the Si substrate, and the TiAu film other than the position where the 45 ° multiple reflection mirror was arranged was removed by photolithography and wet etching before forming the polymer waveguide.

  A 0.1 [μm] -thick Ti thin film and a 0.5 [μm] -thick Au thin film are formed on the outermost surface, and a mounting marker, a semi-cylindrical lens 12c and an electric wiring pattern (electricity) are formed by photolithography. (Transmission path) 17 is formed, Cu plating is applied to reduce the resistance of the electrical wiring portion, dry etching is performed using this as a mask, etching is performed until the Au film on the substrate surface is reached, and thereby a semi-cylindrical lens Formed.

The 45-degree multiple reflection mirror 14 described above was formed by dicing after alternately laminating Ti and SiO ₂ on a glass substrate. The thickness of Ti is 0.1 [μm], the thickness of SiO ₂ is 4.9 [μm], and after 100 periods are formed, it is cut out at 45 degrees by dicing and the metal layer is formed at 45 degrees (size 200) [Μm] × 500 [μm] × 3500 [μm]) 45 degree multiple reflection mirror 14 was fabricated, and TiAu on the back surface was formed.

Also, AuSn balls were placed on the Si substrate and heated to melt AuSn.
After the height of the waveguide surface was detected in advance by the mount head, the 45-degree multiple reflection mirror 14 detected the edge, performed parallelism, and vacuum-adsorbed the mount head. Thereafter, the 45 ° multiple reflection mirror 14 is placed on the Si substrate, the position in the X direction and the Z direction is controlled with respect to the mounting marker, the height is controlled at the same time, and AuSn is solidified by cooling, and the 45 ° multiplexing is performed. The surface of the reflection mirror 14 was fixed at a position 30 [μm] higher than the waveguide surface and at a position 10 [μm] away from the end of the cylindrical lens.

The surface emitting laser array 100 uses 12 ch (250 [μm] pitch) with a full angle of emission of 35 degrees. The wavelength is 0.85 [μm]. With reference to the mounting marker, thermocompression bonding was performed with a gold bump of 60 [μm].
As a result, the distance between the surface emitting laser (VCSEL) and the 45-degree multiple reflection mirror surface was suppressed to 30 [μm] or less.

  The light output from the surface emitting laser (VCSEL) is confined between the mirror films in the 45-degree multiple reflection mirror in the Z-axis direction, and is spatially suppressed to the waveguide 12 while being suppressed from spreading. To reach.

On the other hand, since light is not confined in the X-axis direction, it spreads from the exit point of the surface emitting laser to the waveguide entrance, but is effectively condensed through the semi-cylindrical lens.
As a result, a coupling loss of 1 [dB] or less between all the channels between the surface emitting laser (VCSEL) and the waveguide can be realized at low cost.

  Here, the mounting technique for the transmission side optical assembly (one optical coupling circuit) 11 is shown, but the mounting method is the same for the reception side optical assembly (the other optical coupling circuit) 13. Also, by setting the absorption layer diameter of the photodiode (PD) array to 50 [μm], high-efficiency photodiode (PD) and waveguide coupling can be obtained, and high throughput operation of 10 [Gbps] can be achieved with 12 [ch]. It was confirmed that it could be realized at low cost.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described with reference to FIGS.
Here, the same reference numerals are used for the same constituent members as those of the first embodiment described above.

First, the main points of the technical contents in the fourth embodiment will be described, and then the specific contents will be described in detail.
First, in the fourth embodiment, a signal transmission / reception module 400 as an optical module is provided on the same board 10 and transmits an electric signal input to the transmission signal processing unit 2 to the outside. 3 is provided with an optical interconnection circuit 400A for transmission to the network.

  In the fourth embodiment, the optical interconnection circuit 400A includes one optical coupling circuit (transmission-side optical assembly) 411 connected to the transmission signal processing unit 2, and the transmission signal processing unit 3. The other optical coupling circuit (reception-side optical assembly) 413 connected to each other and the polymer waveguide 12 that connects the optical assemblies 411 and 413 to each other are configured. The details of the one and the other optical coupling circuits 411 and 413 will be described later.

  Further, an optical / electrical connection socket for fixing the signal transmission means included in the one and the other optical coupling circuits 411 and 413 to the board 10 together with the 45-degree multiple reflection mirror 14 provided in the signal transmission means. A portion 96 is provided.

  The optical / electrical connection socket unit 96 includes a lock mechanism 96 that presses and fixes the 45-degree multi-reflection mirror 14 and the optical coupler circuit 411 (or 413) to the same board 10 at the same time, and the optical coupling. It includes a positioning pin 96B that determines the position of the optical coupling circuit 411 (or 413) on the board 10 through an electric wiring board 91 provided in the circuit 411.

This will be described in further detail below.
As shown in FIG. 24, the optical module for signal transmission / reception (optical interconnection module) 400 in the fourth embodiment includes a transmission signal processing unit 2 that takes in an externally input signal and processes it as a transmission signal, One optical coupling circuit (transmission-side optical assembly) 411 that converts an output signal from the transmission signal processing unit 2 into an optical signal, and an optical signal output from the one optical coupling circuit 411 are installed in advance. The other optical coupling circuit (receiving-side optical assembly) 413 that takes in through the waveguide (polymer waveguide) 12 and converts it into an electrical signal, and transmits the electrical signal converted by the other optical coupling circuit 413 to the outside And a transmission signal processing unit 3 that performs processing for the purpose.

  Here, the transmission signal processing unit 2 and one optical coupling circuit 411 constitute a transmission-side optical module 401. The transmission signal processing unit 3 and the other optical coupling circuit 413 constitute a reception side optical module 403.

  Also, one optical coupling circuit (transmission-side optical assembly) 411 of the transmission-side optical module 401 includes a transmission-side optical conversion unit 411A that converts an electrical signal into an optical signal, and the optical waveguide (polymer) that converts the converted optical signal into the above-described optical waveguide. And a transmission-side optical coupling unit 411B that sends out to the reception-side optical module 403 via the waveguide 12).

  The other optical coupling circuit (reception-side optical assembly) 413 of the reception-side optical module 403 converges and receives the optical signal sent from the transmission-side optical module 401 and sends it toward the reception-side optical conversion unit 413A. The receiving-side optical coupling unit 413B and a receiving-side optical conversion unit 413A that converts an optical signal sent from the receiving-side optical coupling unit 413B into an electrical signal and sends the electrical signal to the transmission signal processing unit 3 are configured.

  Here, one optical coupling circuit (transmission-side optical assembly) 411 of the transmission-side optical module 401, the other optical coupling circuit (reception-side optical assembly) 413 of the reception-side optical module 403, and an optical waveguide that connects both of them. An optical interconnection circuit 400 </ b> A is constituted by the waveguide (polymer waveguide) 12.

  The transmission side optical module 401 and the reception side optical module 403 are connected via the optical waveguide 12 on the board 10, and the optical waveguide on the board 10 and the MMF or waveguide sheet are connected via the optical connector. By connecting, an MMF or a waveguide sheet may be connected between the optical modules on the transmission side and the reception side.

<Transmission side optical coupling circuit 411>
Next, the transmission side optical conversion unit 411A and the transmission side optical coupling unit 411B constituting the transmission side optical coupling circuit 411 will be described with reference to FIGS.
FIG. 25 is a cross-sectional view of the transmission side optical coupling circuit 411. FIG. 26 is an explanatory diagram of the transmission side optical coupler 411B.

  In FIG. 25, the transmission side optical conversion unit 411A is an optical modulation provided with a driver IC 92 that receives a signal from the transmission signal processing unit 2 on an electric wiring board 91, and a surface emitting laser that converts the electric signal into an optical signal and sends it. A device array (hereinafter referred to as an optical modulation device) 93, an optical through hole 94 for propagating an optical signal from the optical modulation device 93 to the back side of the electrical wiring board 91, and the entire transmission side optical coupling circuit 411 are mounted on the board 10. A fitting hole 91A provided in the electric wiring board 91 for fixing, and a heat radiation cover 95 that covers the driver IC 92 and the light modulation device 93 and also serves as heat radiation of the driver IC 92 are configured.

In this case, the light modulation device 93 and the light through hole 94 have a butt joint configuration. The light modulation device 93 is preferably a surface emitting laser in order to couple with the optical through hole 94 with high efficiency. If a structure that converts the optical path to 90 degrees is added to the light modulation device 93 itself, an edge emitting laser may be used. A combination of a CW light source and an external modulator may be used.
The optical through hole 94 is an optical waveguide composed of a core and a clad. The optical through hole 94 may have a configuration in which there is no clad and the core is covered with a metal reflection film. In this case, the core may be hollow without being filled with material.

As shown in FIG. 26, the transmission-side optical coupling unit 411B is provided at the other end of each of the waveguides 12 (12 ₁ , 12 ₂ , 12 ₃ , 12 ₄ ) for guiding an optical signal (the left ends of FIGS. 25 and 26). ) And a 45 ° multiple reflection mirror 14 that guides the propagation of the optical signal toward each of the waveguides 12 _{1 to} 12 ₄ , and the right side surface of the 45 ° multiple reflection mirror 14 in FIG. And a lens portion 12c formed on an opposing surface (light incident end surface) of each of the optical waveguides 12 _{1 to} 12 _{4 that} are mounted to face each other.

Here, it is assumed that the three-dimensional coordinates on the board 10 shown in FIG. 26 are all applied to the coordinate positional relationship formed in the following description.
Further, when the whole of each of the optical waveguides 12 _{1 to} 12 ₄ is indicated, the reference numeral 12 is used as the optical waveguide. In the fourth embodiment, the case where four optical waveguides are used is illustrated, but the number is not limited. The same applies to other embodiments.

Next, the optical waveguide 12 _1, the core layer 12a is formed surrounded by the cladding portion 12b and the waveguide 12 integral with ₁ the cladding portion 12b is specified of different transparent member having a refractive index. The same applies to other waveguides.
And each waveguide and the lens part 12c mentioned later comprise the waveguide array 12. FIG.

Each other end of each of the waveguides 12 _{1 to} 12 ₄ (the right end in FIG. 26) is sent out from the 45 ° multiple reflection mirror 14 to a portion facing the 45 ° multiple reflection mirror 14 (reception described later). Each of the optical lens portions 12c described above that suppresses the diffusion of the optical signal is installed on the side optical module 1B side. Each optical lens portion 12c is integrated with each of the optical waveguides 12 _{1 to} 12 ₄ described above.

As described above, the optical through hole 94 provided corresponding to the plurality of surface emitting lasers of the light modulation device 93 provided in the transmission side light conversion unit 411A is the waveguide of the 45-degree multiple reflection mirror 14. It is installed on the end surface (upper surface in FIG. 26) opposite to the surface optically conductive with 12 _{1 to} 12 ₃ .
The optical through hole 94 and the waveguides 12 _{1 to} 12 ₄ described above are at least of a plurality of optical signal transmission multiple layers (layers sandwiched between metal thin films) included in the 45-degree multiple reflection mirror 14. It is arranged corresponding to one layer.

  The diffusion of the optical signal from the optical through hole 94 is effectively suppressed by the effect of confining the light between the mirrors of the 45-degree multiple reflection mirror 14 and the lens 12c at the end of the waveguide. In the fourth embodiment, since there is a semi-cylindrical lens 12c on the end face of the optical waveguide 12, light spreading in the X-axis direction (direction along the facing surface) can be condensed. There is no condensing function in the Y-axis direction. However, in the fourth embodiment, light does not spread in the Y-axis direction thanks to the 45-degree multiple reflection mirror 14. As a result, the loss during the propagation of the optical signal is effectively suppressed.

<Optical / electrical connection socket>
The optical / electrical connection socket unit 96 is incorporated in the above-described transmission-side optical coupling circuit 411 and has a role as a socket for fixing the transmission-side optical coupling circuit 411 on the board 10. This is shown in FIG.

FIG. 27 is a schematic cross-sectional view, with parts omitted, taken along arrows IV-IV in FIG.
In this case, the optical / electrical connection socket unit 96 includes an elastic 45-degree multiple reflection mirror 14 disposed on the mother board (or daughter board) 10 on the inner side, and the transmission side optical coupling circuit 411 as a whole. The lock mechanism 96A is pressed against and fixed, and the pin 96B that determines the position of the entire transmission side optical coupling circuit 411 is configured.

Here, in the fourth embodiment, the 45-degree multiple reflection mirror (anisotropic conductive sheet) 14 also functions as a rectangular parallelepiped anisotropic conductive sheet.
In the cross section, a plurality of reflective mirror films 14b made of metal are provided at substantially equal intervals in the direction of 45 degrees, and between these reflective mirror films 14b, a rubber or resin that is transparent, insulative and elastic to optical signals. Is incorporated into a state in which a plurality of optical signal transmission layers 14a are emphasized, thereby forming a plurality of optical signal transmission multiple layers 14a.

  On the other hand, in the anisotropic conductive sheet 14, the reflective mirror film 14a also serves as an electrical wiring that connects the front surface of the board and the back surface of the transmission side light conversion unit 411A. In order to also serve as electrical wiring, the reflection mirror is formed in a striped pattern so as to be electrically separated in a plane parallel to the board 10 as shown in FIGS.

  BGA electrodes 98 arranged at equal intervals are exposed on the back surface of the transmission-side light conversion unit 411A. Inside the transmission-side light conversion unit 411A, the surface emitting laser array included in the light modulation device 93 is connected to the driver IC 92 on the electric wiring board 91, and the power supply line and the signal line for the driver IC 92 are electrically wired. It is connected to the BGA electrode 98 on the back side of the substrate 91. An electrode 98 a is also formed on the board 10 in the same arrangement as the BGA electrode 98, whereby the transmission side optical coupling circuit 411 and the electrode on the board 10 are connected via the anisotropic conductive sheet 14.

Here, the interval between the optical through holes 94 and the interval between the BGA electrodes 98 may be different, but it is desirable to align them. Thereby, the structure of the anisotropic conductive sheet 14 is simplified.
In order to fix the position where the transmission side optical coupling circuit 411 is disposed, the positioning pins 96B are disposed on the board 10 as described above. The pins 96B may be arranged on the board 10 based on the relative information of the position where the fitting hole 91a is located with respect to the position of the optical through hole 94.

  The position of the positioning pin 96B is determined from the positional relationship between the fitting hole 91a of the transmission side optical coupling circuit 411 and the optical through hole 94. In alignment, the BGA electrode 98 and the electrode on the board 10 have a large diameter of about 0.4 [mm], and the core size of the optical through hole 94 and the optical waveguide 12 is as small as several tens [μm]. .

  Conversely, the margin of electrical connection is high. For example, when the thickness variation of the anisotropic conductive sheet 14 or the height of the center of the waveguide core changes, the positional relationship between the BGA electrode 98 of the transmission side optical coupling circuit 411 and the electrode 98a on the board 10 changes. However, since the size of the BGA electrode 98 and the electrode 98a on the board 10 is as large as about 0.4 [mm], even if the thickness of the anisotropic conductive sheet varies about ± 0.2 [mm] Sufficient conductivity can be secured.

  It is desirable that a spacer 96a thinner than the thickness of the anisotropic conductive sheet 14 is disposed below the lock mechanism 96A that presses the transmission side optical coupling circuit 411 from above. As a result, the bottom surface of the transmission side optical coupling circuit 411 stops at this point, so that the anisotropic conductive sheet 14 is not further crushed and broken.

  Here, each component of the transmission side optical coupling circuit (one optical coupling circuit) 401 including the optical / electrical connection socket unit 96 described above will be described in detail.

(Anisotropic conductive sheet)
The 45-degree multi-reflection mirror (also an anisotropic conductive sheet) 14 described above is an optical signal transmission multi-layer (transparent, insulating and elastic resin) that is alternately laminated, as in the first embodiment. (Or rubber) 14a and reflecting mirror film (metal thin film) 14b.

The manufacturing procedure of this anisotropic conductive sheet will be described with reference to FIG.
The anisotropic conductive sheet 14 is produced by dicing after producing a multilayer structure of a signal transmission multi-layer made of a transparent, insulating and elastic resin or rubber and a metal thin film.
First, the signal transmission multiple layer 14a is formed as shown in FIG. A film can be formed on a substrate such as Si or glass by sputtering, CVD, PCVD, ink jet printing, or spin coating.

Next, as shown in FIG. 28B, the metal thin film 14 b forming the reflection mirror film is formed in a striped pattern using the metal mask 35. As a film forming method, a method such as sputtering, vacuum deposition, E-gun, ink jet printing, or plating is used.
The metal mask has a structure in which a hole is partially formed in a metal plate, and the metal thin film can be formed in a stripe shape by forming a film by pressing it against the surface of rubber.

Subsequently, as shown in FIG. 28C, a rubber layer is applied by spin coating and cured, and then a metal thin film is formed using a metal mask: a multilayer structure is formed.
Finally, an anisotropic conductive sheet can be produced as shown in FIG. 28 (d) by cutting out in a rectangular parallelepiped shape at 45 degrees as shown by a dotted line.
Although a metal mask is used here, the stripe pattern may be formed using photolithography and a lift-off process.

  As the material of the optical signal transmission multi-layer 14a, styrene butadiene rubber, butadiene rubber, isoprene rubber, ethylene propylene rubber, butyl rubber, chloroprene rubber, acrylonitrile-butadiene rubber, urethane rubber, silicone rubber, fluorine rubber, polysulfide rubber, polyether rubber , Polyethylene naphthalate, polyethersulfone, cycloolefin polymer, polyimide, glass / epoxy resin, aramid film, liquid crystal polymer.

On the other hand, as a thin film which is a material of the reflective mirror film (metal thin film) 14b, Ti, Pt, Au, Ni
, Cu, Ag, Sn, etc., and combinations thereof. These materials are selected in consideration of the wavelength band of light to be used and the adhesion with the material.
For forming the signal transmission multilayer, there is a film forming method such as thermal stretching using a preform method. In that case, after producing a sheet of elastic resin, a method of printing a metal thin film and bonding the sheets together may be employed.

  The metal thin film preferably has a thickness in the range of 0.1 [μm] to 0.3 [μm] in the region where light passes. This is because when the thickness is reduced, the reflectance is lowered, and when the thickness is increased, the thickness reflects the light before entering the signal transmission multiple layer. It is desirable that it is 10 [μm] or more in the region where electricity is conducted. This is because if it is too thin, contact resistance and resistance during conduction increase.

(About optical waveguide)
In the waveguide (polymer waveguide) 12 _{1 to} 12 ₄ portions, first, a cladding layer 12b serving as a base is formed only in a region where the waveguide is formed by photolithography and dry etching, and each of the waveguides 12 _{1 to} 12 ₄ is formed. The core layer 12a, which is a constituent material portion, is formed in the same manner, and then formed by photolithography and dry etching so as to be embedded in the cladding layer 12b that forms the periphery of each of the waveguides 12 _{1 to} 12 ₄ .

In this case, each of the optical lens portions 12c is formed in a semi-cylindrical shape in the fourth embodiment. Each optical lens portion 12c is obtained by processing by photolithography and dry etching to the waveguides 12 ₁ to 12 ₄ to end in an arc.

  As a mask for dry etching, first, a metal thin film may be formed, the metal thin film may be etched using a resist mask, and dry etching may be performed using the patterned metal thin film as a mask. In addition, the metal thin film in this case can be used as a marker for mounting an electrical wiring pattern or an optical component when mounting an electrical component, in addition to the purpose of processing polyimide. Alternatively, a waveguide pattern or a cylindrical lens may be directly formed using photosensitive polyimide or the like.

(Construction of optical / electrical connection socket on transmission side)
In the manufacturing process of the optical and electrical linkage socket 96 described above, with respect to the optical waveguide 12 ₁ to 12 _4, the anisotropic conductive sheet (45 ° multiple reflection mirror) 14 according to the fourth embodiment, the module positions A matching pin 96B is mounted.

  The positions of the anisotropic conductive sheet 14 and the alignment pins 96B are as follows: the positional relationship between the optical waveguide 12 and the optical through hole 94 on the board 10 and the board 10 corresponding to the BGA electrode 98a of the transmission side optical coupling circuit 411. This is a parameter in determining the positional relationship of the upper electrode. Either the anisotropic conductive sheet 14 or the alignment pin 96B may be mounted first, but it is desirable to mount the one that is easy to handle later.

When the positioning pin 96B is mounted first, the operation is as follows.
The positioning pin 96B is mounted based on position information of the optical waveguide 12 in the X-axis direction. When the positioning pin 96B is mounted, the position of the optical through hole 94 on the XY plane is determined.
Performing differential information from the surface position of the core position of the height and the waveguide 12 ₁ to 12 ₄ of the anisotropic conductive sheet 14 as a reference, the anisotropic conductive sheet 14 (i.e., Z-axis direction) control Thus, the coupling between the optical through hole 94 and the optical waveguide 12 can be maximized.

When the anisotropic conductive sheet 14 is mounted first, the following is performed.
The anisotropic conductive sheet 14 is mounted based on position information of the optical waveguide in the X-axis direction. When mounting the anisotropic conductive sheet 14, the difference information from the surface position of the core position of the height and the waveguide 12 ₁ to 12 ₄ of the anisotropic conductive sheet 14, on the X-Z plane of the optical through-hole 94 The position is determined. By controlling the positioning pin 96B (that is, in the X-axis and Z-axis directions) based on this information, the coupling between the optical waveguide 12 and the optical through hole 94 can be maximized.

In order to realize high-efficiency coupling between the light modulation device 93 including a surface emitting laser (VCSEL) and the waveguides 12 _{1 to} 12 ₃ , the numerical aperture NA (Numerical Aperture) of the optical through hole 94 and the optical waveguide 12 is achieved. Need to be adjusted.
Even if the spot size of the light is small, if the reflection angle of the core / cladding light entering the optical through-hole 94 or the waveguides 12 _{1 to} 12 ₃ is smaller than the total reflection angle, the light in the core layer is reflected in the cladding layer. This is because the light does not propagate to the side.

With respect to the X-axis direction of the waveguides 12 _{1 to} 12 ₃ , the NA can be adjusted with a semi-cylindrical lens, but there is no NA adjustment mechanism in the Y-axis direction of the waveguides 12 _{1 to} 12 ₃ . In that case, it is necessary to increase the refractive index of the core and the refractive index of the cladding.
Thereby, the NA of the optical through hole 94 and the waveguides 12 _{1 to} 12 ₃ can be increased with respect to the radiation angle of the laser light. For example, in a polymer waveguide having a refractive index of about 1.5, the refractive index difference between the core layer and the clad layer is preferably 2% or more. Further, when the optical through hole is composed of a core and a clad like the waveguide, it is desirable that the difference in refractive index between the core and the clad of the optical through hole is 2% or more.

<Reception Side Optical Coupling Circuit 413>
Next, the receiving side optical coupling circuit 413 will be described with reference to FIGS.
As described above, the reception-side optical coupling circuit 413 includes the reception-side optical conversion unit 413A and the reception-side optical coupling unit 413B.

  FIG. 29 is a cross-sectional view of the receiving side optical coupling circuit 413. FIG. 30 is an explanatory diagram of the receiving side optical coupling unit 413B.

  First, in FIG. 29, the receiving side optical conversion unit 413A of the receiving side optical coupling circuit 413 has a photodiode array (hereinafter referred to as a photodiode) 26 as a photoelectric conversion element on the electrical wiring substrate 101, and outputs from the respective photodiodes 26. Receiver IC (transimpedance amplifier) 102 that amplifies the current signal to be sent to the outside, optical through hole 104 that guides the light of the photodiode 26, fitting hole 105 for fixing the optical assembly, covers the receiver IC 102 and the photodiode 26, and A heat radiation cover 105 that also serves as heat radiation of the impedance amplifier is provided.

  Among these, the photodiode 26 is connected to a receiver IC (transimpedance amplifier) 102 on the electric wiring board 101, and power supply lines and signal lines for the receiver IC 102 are arranged at equal intervals on the back surface side of the electric wiring board 101. The BGA electrode 108 is exposed.

  The optical through hole 104 is an optical waveguide composed of a core and a clad. The optical through hole 104 may have a configuration in which a core is covered with a metal reflection film. In this case, the core may be hollow without being filled with material. The photodiode 26 and the optical through hole 104 have a butt joint configuration.

The reception side optical coupling unit 413B couples the optical signal sent through the optical waveguide 12 (12 _{1 to} 12 ₃ ) to the optical through hole 104 of the reception side optical conversion unit 413A. The optical signal passing through the optical through hole 104 is combined with the photodiode 26, converted into a current signal, and output. The converted current signal is converted into a voltage signal by the receiver IC 102 and output to the outside via the transmission signal processing unit 3 described above.

As shown in FIGS. 29 to 30, the receiving-side optical coupling unit 413B is configured such that the other end (right end in FIG. 29) of the optical waveguide 12 (12 ₁ , 12 ₂ , 12 ₃ , 12 ₄ ) that guides an optical signal. 45 degrees multiple reflection mirror 14 disposed opposite to the waveguides 12 _{1 to} 12 ₄ to guide the optical signal in a different direction, and the optical waveguide 12 (12 ₁ , 12 ₂ , 12 ₃ , 12 ₄ ) and the lens portion 12c provided at the other end portion (the right end portion in FIG. 29).

Among them, the 45-degree multi-reflection mirror 14, the optical signals from the optical waveguide ₁₂ 1 to 12 _4, coupled to the optical through-hole 104 of the receiving-side optical conversion unit 413A as described above.
In the fourth embodiment, since there is a semi-cylindrical lens 12c on the end face of the optical waveguide 12, the light spread in the X-axis direction can be condensed. There is no condensing function in the Y-axis direction of the optical waveguides 12 _{1 to} 12 ₃ . However, in the fourth embodiment, light does not spread in the Y-axis direction thanks to the 45-degree multiple reflection mirror 14. As a result, the loss during the propagation of the optical signal is effectively suppressed.

<Optical / electrical connection socket on the receiving side>
The reception-side optical / electrical connection socket unit is formed in the same manner as the transmission-side optical / electrical connection socket unit 96 described above, and is incorporated in the reception-side optical conversion unit 413A. It serves as a socket for fixing the whole on the board 10.

The receiving-side optical / electrical connection socket section will be described with reference to FIG.
In this case, the opto-electric integrated socket is provided with an elastic anisotropic conductive sheet (45 degree multiple reflection mirror) 14 disposed on the mother board (or daughter board) 10 on the inner side and the receiving side optical coupling circuit 413. A lock mechanism (not shown / same as the lock mechanism on the transmission side) that fixes the entire body against the board 10 and a pin 107 that determines the position of the entire reception-side optical coupling circuit 413 are configured.

  The anisotropic conductive sheet (45-degree multiple reflection mirror) 14 has a plurality of reflection mirror films 14b made of metal in the direction of 45 degrees in the cross section at substantially equal intervals, and light is reflected between the reflection mirror films 14b. A rubber or resin that is transparent, insulative, and elastic with respect to the signal is incorporated in a focused state, thereby forming a plurality of optical signal transmission multiple layers. On the other hand, in the anisotropic conductive sheet, the reflection mirror film also serves as electrical wiring that connects the front surface of the board and the back surface of the optical assembly.

BGA electrodes 108 arranged at equal intervals are exposed on the back surface of the reception-side light conversion unit 413A. In addition, the photodiode array 26 is connected to the receiver IC 102 on the electric wiring board 101 inside the receiving side optical conversion unit 413A, and the power supply line and the signal line for the receiver IC 102 are on the back side of the electric wiring board 101. It is connected to the BGA electrode 108.
An electrode 108 a is also formed on the board 10 in the same arrangement as the BGA electrode 108, so that the transmission side light conversion unit 413 A and the board 10 are placed on the board 10 via the anisotropic conductive sheet (45 degree multiple reflection mirror) 14. The electrode is connected.

As with the transmission side described above, positioning pins 107 are arranged on the board 10 in order to fix the position where the entire reception-side optical coupling circuit 413 is arranged. The positioning pin 107 may be disposed on the board 10 based on the relative information of the position where the fitting hole is located with respect to the position of the optical through hole 104.
Also in the manufacturing process of the reception side optical coupling circuit 413, the anisotropic conductive sheet 14 according to the present embodiment and the positioning pins 107 for module alignment with respect to the optical waveguides 12 _{1 to} 12 ₄ are the same as the transmission side. Is installed.

  The arrangement positions of the anisotropic conductive sheet (45-degree multiple reflection mirror) 14 and the positioning pins 107 correspond to the positions of the optical waveguide 12 and the optical through hole 104 on the board 10 and the BGA electrode 108 of the transmission side light conversion unit 413A. This is a parameter for determining the position of the electrode on the board 10. Either may be installed first.

When the positioning pin 107 is mounted first, the operation is as follows.
In this case, the positioning pin 107 is mounted based on the position information of the optical waveguide 12 in the X-axis direction. When the positioning pin 107 is mounted, the position of the optical through hole 104 on the XY plane is determined.

Difference information from the surface position of the core position of the anisotropic conductive sheet (45 ° multiple reflection mirror) 14 of the height and the waveguide 12 ₁ to 12 ₄ as a reference, the anisotropic conductive sheet 14 (i.e., Z By controlling in the axial direction, the coupling between the optical through hole 104 and the optical waveguide can be maximized.

When the anisotropic conductive sheet 14 is mounted first, the following is performed. The anisotropic conductive sheet 14 is mounted based on position information of the optical waveguide 12 in the X-axis direction. When the anisotropic conductive sheet 14 is mounted, the difference between the height information of the anisotropic conductive sheet 14 and the surface positions of the core positions of the optical waveguides 12 _{1 to} 12 ₃ is calculated on the XY plane of the optical through hole 104. The position is determined. By controlling the positioning pin 107 (that is, in the XY axis direction) based on this information, the coupling between the optical waveguide 12 and the optical through hole 104 can be maximized.

Waveguide ₁₂ 1 to 12 ₄ and for high efficiency coupling between each photodiode 26, the thickness of the absorbent layer than the diameter waveguide ₁₂ 1 to 12 ₄ in the Y direction of the core layer of the photodiode 26 It is desirable that it is thin and is confined thinly in the 45 ° multiple reflection mirror as compared with the diameter of the absorption layer of each photodiode 26.

<Overall operation>
Next, the overall operation in the fourth embodiment will be described.
First, in FIG. 25, when a predetermined transmission signal is set and inputted from the outside, the transmission signal processing unit 2 takes it in, processes the signal, and outputs it as a transmission signal.

  The transmission signal output from the transmission signal processing unit 2 is converted from an electrical signal to an optical signal by the transmission side optical conversion unit 411A, and passes through the transmission side optical coupling unit 411B including the 45-degree multiple reflection mirror 14 and the optical waveguide 12. The signal is converted again into an electric signal by the receiving side optical coupling circuit 413 and sent to the transmission signal processing unit 3 described above.

Here, in the transmission side light conversion unit 411A, the light output from the light modulation device 93 including the surface emitting laser (VCSEL) passes through the optical through hole 94 and is a 45 degree multiple reflection mirror on the transmission side optical coupling unit 411B side. 14 In 45-degree multi-reflecting mirror 14 is confined between the mirror 14b and the mirror 14b, while being suppressed from spreading in a space with respect to the Y-axis direction, are fed into the optical waveguide ₁₂ 1 to 12 _4.
The optical signal spreads in the X-axis direction, but is individually collected by each optical lens portion 12 c formed in the optical waveguide 12 and reliably transmitted to the corresponding waveguides 12 _{1 to} 12 ₃ .

Next, the optical signal transmitted through the waveguides 12 _{1 to} 12 ₃ is sent to the reception side optical conversion unit 413A via the reception side optical coupling unit 413B, and a part of the reception side optical conversion unit 413A is transmitted. Through the optical through hole 104 formed, it is individually photoelectrically converted by a photodiode (photoelectric conversion element) 26 (that is, individually converted into an electric signal via the 45 ° multiple reflection mirror 14 and the electric wiring circuit on the receiving side). The signal is sent to the transmission signal processing unit 3 described above.

In this case, the optical signals sent through the optical waveguides 12 _{1 to} 12 ₄ are collected at the output end of the optical waveguide 12 with respect to the X-axis direction, and between the mirror 14 b and the mirror 14 b in the 45 ° multiple reflection mirror 14. It reaches the photodiode (photoelectric conversion element) 26 while being confined and suppressed from being spatially spread, and is individually converted into an electric signal by the photodiode 26 and sent to the transmission signal processing unit 3 as described above.

  Here, the driver IC 92 is disposed in the transmission side optical conversion unit 411A described above, but the driver IC 92 may be disposed on the board 10 together with the transmission signal processing unit 2. Similarly, the receiver IC 102 is disposed inside the reception-side light conversion unit 413A, but the receiver IC 102 may be disposed on the board 10 together with the transmission signal processing unit 3.

That is, an electric signal from the driver IC 92 is propagated to the light modulation device 93 through the anisotropic conductive sheet (45 degree multiple reflection mirror) 14 to perform electro-optical conversion.
Further, the optical signal sent through the optical waveguides 12 _{1 to} 12 ₄ is sent to the photodiode 26 through the anisotropic conductive sheet (45 degree multiple reflection mirror) 14 as described above. It is converted and propagated to the receiver IC 102.

  In general, the lifetime of the optical module 400 is determined by the lifetime of the optical element (the light modulation device 93 and the photodiode 26) rather than the optical IC (the driver IC 92 and the receiver IC 102). Therefore, the optical IC is removed from the optical module 400 which is a replacement part. Thus, the replacement cost of the optical module 400 can be reduced.

  Here, the operation of the 45-degree multiple reflection mirror 14 described above is the same as that of the 45-degree multiple reflection mirror 14 in the first embodiment described above.

  Furthermore, the arrangement position of the 45-degree multiple reflection mirror 14 can be controlled in the Z-axis direction and the X-axis direction by referring to the edge of the member or the striped metal thin film position using visual alignment. In this case, an adhesive can be used for fixing. Since the adhesive also has a thickness, it is desirable that a groove for allowing the adhesive to flow is provided on the board side or the anisotropic conductive sheet side in a place where the adhesive is fixed. Thereby, after the adhesive fixing, the height of the member can be matched with the member thickness with respect to the board surface by reducing the adhesive material at the groove portion.

In the fourth embodiment, since the semi-cylindrical lens 12c monolithically attached to the optical waveguides 12 _{1 to} 12 ₄ can be manufactured by photolithography, it is suitable for mass production and can be manufactured at low cost. Moreover, the radiation angle of light is converted by installing a semi-cylindrical lens. Thus, waveguides 12 ₁ to 12 ₄ or 45 ° multiple reflection mirror 14 semicylindrical lens 12c formed converts the radiation angle with respect to one axis of the plane perpendicular to the optical axis.

  Furthermore, in the fourth embodiment, since the 45-degree multi-reflection mirror 14 has a rectangular parallelepiped shape, the relationship between the light exit position and the incident position after the optical path conversion can be predicted from either information.

<Effects of Fourth Embodiment>
In the fourth embodiment, since it is configured and functions as described above, according to this, in addition to having the same operational effects as in the case of the first embodiment described above, the 45-degree multiple reflection mirror 14 is Since it also serves as an anisotropic conductive sheet, the number of parts is greatly reduced, and it is possible to construct and mount low-cost parts together, which makes it possible to obtain the entire device at a low cost including replacement costs. An excellent optical coupling circuit and an optical module for signal transmission and reception using the same can be provided.

  Specifically, in the fourth embodiment, the 45-degree multiple reflection mirror (anisotropic conductive sheet) 14 exchanges optical signals with the transmission side light conversion unit 411A and the reception side light conversion unit 413A. As well as being a part of the optical circuit, it is possible to perform electrical transmission between the board 10 and the transmitting side optical coupling unit 411B and the receiving side optical coupling unit 413B. can do.

  Further, the 45 ° multiple reflection mirror (anisotropic conductive sheet) 14 is an anisotropic conductive sheet having elasticity. Since the metal thin film 14b is disposed at an angle of 45 degrees with respect to the sheet 14a, the elasticity of the sheet can be kept high. Thereby, even when the optical module substrate is warped, the amount of expansion and contraction of the sheet can be increased, so that electrical contact with high tolerance can be secured.

In addition, the following two structures and the effects thereof are excellent in mass productivity between the surface emitting laser and the photodiode, and high coupling efficiency can be realized at low cost.
As a first structure, the 45 ° multiple reflection mirror 14 is disposed between the optical through hole and the optical waveguide. Since light can be confined between the multiple reflection mirrors as compared with a normal 45 degree mirror, it is possible to prevent the light from spreading in a direction orthogonal to the board 10.

  The second structure is a lens structure integrally formed with the optical waveguide 12. The optical waveguide can be manufactured on a mother board or a daughter board by a photolithography technique excellent in mass productivity. Similarly, since a configuration is employed in which a lens unit manufactured in a plane parallel to the board using photolithography technology is employed, the spread of light in the horizontal direction with respect to the board can also be suppressed.

  Although it is necessary to adjust the position of the optical through hole with respect to the board, it is possible to replace the optical module 400 by previously arranging an alignment pin on the board 10 and aligning the fitting hole for the optical module with the pin. Become.

The position of the optical through hole is determined by the height of the optical waveguide and the arrangement of the 45-degree multiple reflection mirror, and a highly efficient coupling can be realized by arranging a fixing pin and a fitting hole in accordance with this.
As described above, the number of parts can be reduced by a manufacturing method suitable for mass production without deteriorating the coupling efficiency, and an inexpensive socket structure can be realized.
As a result, it is possible to provide an optical interconnection that can reduce the introduction cost and the exchange cost.
<Example>

Here, the Example concerning 4th Embodiment mentioned above is described.
Specifically, a specific example of the transmission side optical conversion unit 411A and the transmission side optical coupling unit 411B constituting the transmission side optical coupling circuit 411 disclosed in the fourth embodiment will be described.

  The transmission-side light conversion unit 411A includes an optical modulation device 93 including a surface emitting laser on the electric wiring board 91, a driver IC 92, an optical through hole 94 formed in the electric wiring board 91, and a fitting hole 91A. . The light modulation device 93 and the driver IC 92 are connected on the electric wiring board 91, and the signal line, the power supply line, the control line, and the GND line from the driver IC 92 are connected to the BGA electrode on the back side of the electric wiring board 91. .

The size of the electric wiring board 91 is 9 [mm] × 9 [mm], and the BGA is formed at a pitch of 1 [mm]. A fitting hole 91A having a diameter of 1 [mm] ± 5 [μm] is formed with a distance error of ± 5 [μm] from the optical through hole 94.
The optical through hole 94 is made of a metal circular pipe having a diameter of 30 [μm]. A hole with a diameter of 30 [μm] is formed again by drilling in a metal embedded via with a diameter of 50 [μm].

The transmission-side optical coupling portion 411B includes the optical through hole 94, the 45-degree multiple reflection mirror 14 also serving as an anisotropic conductive sheet, and the polymer waveguide 12 (12 ₁ , 12 ₂ , 12 ₃ ,...). It consists of a combination with a lens portion 12c formed at each light input end.

Here, in this embodiment, the polymer waveguides 12 are formed in an array on the board 10, and the array interval is 1000 [μm], the number of arrays is 12 [ch], the core size is 30 [μm], and the refractive index of the core is The refractive index difference between the core and the clad was 1.54 and 2 [%]. The thickness of the cladding layer above the core was 70 [μm], and the thickness of the cladding layer below the core was 100 [μm].
With reference to a mounting marker separately formed on the board 10, the polymer waveguide 12 was formed together with the lens portion 12c on the board 10 on which electrical wiring was previously formed.
A waveguide and a semi-cylindrical lens were formed by photolithography using two types of photosensitive polyimides having different refractive indexes as a core material and a cladding material of an optical waveguide.

The anisotropic conductive sheet (45-degree multiple reflection mirror) 14 described above was formed by dicing after repeating the sputter formation of Pt using a metal mask on the silicon rubber sheet and the silicon rubber spray film formation. The Pt thickness is 0.1 [μm] and the silicon rubber thickness is 4.9 [μm]. After 100 cycles are formed, the Pt thickness is 10 [μm] and the silicon rubber thickness is 50 [μm] and 15 cycles are formed. Then, a 45 ° multiple reflection mirror 14 of a rectangular parallelepiped (size 200 [μm] × 9000 [μm] × 9000 [μm]) in which the metal layer was formed at 45 degrees was cut by dicing. The thin Pt side is used as a 45 ° multiple reflection mirror.
With reference to the mounting marker, a hole having a diameter of 1 mm was formed in the board, and the module fixing pin and the locking mechanism of the optical assembly were fixed by soldering. The pin and optical assembly locking mechanism was made of resin using a mold.

  After detecting the height of the waveguide surface and the thickness of the anisotropic conductive sheet by laser length measurement, the anisotropic conductive sheet 14 detected the edge, parallelized, and vacuum-adsorbed to the mount head. Thereafter, the anisotropic conductive sheet 14 was placed on the board, and the positions in the X direction and the Z direction were controlled and fixed to the module fixing pins.

  A spacer thinner than the thickness of the anisotropic conductive sheet 14 is disposed below the lock mechanism 95 that presses the transmission side optical coupling circuit 411 around the anisotropic conductive sheet (45 degree multiple reflection mirror) 14. Since the bottom surface of the transmission-side light conversion unit 411A stops at this point, the anisotropic conductive sheet (45-degree multiple reflection mirror) 14 is not further crushed.

  The optical module 400 is arranged on the board 10 by inserting a pin 96B into the fitting hole 91A and fixed in the XZ direction, and the Y axis direction is fixed by a lock mechanism 95 on the board 10. At this time, the electrode terminal of the BGA on the bottom surface of the electric wiring board 91 of the optical assembly and the electrode on the board 10 are connected via the metal of the anisotropic conductive sheet (45 degree multiple reflection mirror) 14.

The light output from the surface emitting laser (VCSEL) of the light modulation device 93 passes through the light through hole 94 and reaches the 45 degree mirror formed on the anisotropic conductive sheet. The 45-degree multi-reflection mirror 14 is confined between the mirror film and the mirror film in the Y-axis direction, and reaches the optical waveguide 12 while being prevented from spreading spatially.
On the other hand, since light is not confined in the X-axis direction, it spreads from the exit point of the surface emitting laser to the waveguide entrance, but is effectively condensed through the semi-cylindrical lens.
As a result, a coupling loss of 1 [dB] or less between all the channels between the surface emitting laser (VCSEL) and the waveguide can be realized at low cost.

Here, the mounting technique for the transmission-side optical coupling circuit (transmission-side optical assembly / one optical coupling circuit) 411 has been described. However, the mounting method is described with respect to the reception-side optical coupling circuit (reception-side optical assembly / other optical coupling circuit). ) 413 is the same.
Also, by setting the absorption layer diameter of the photodiode (PD) array to 50 [μm], high-efficiency photodiode (PD) and waveguide coupling can be obtained, and high throughput operation of 10 [Gbps] can be achieved with 12 [ch]. It was confirmed that it could be realized at low cost.

About each embodiment mentioned above, if the summary of the novel technical content is put together, it will become as the following additional remarks. Note that the scope of rights of the present invention is not necessarily limited to this supplementary note.
[Appendix 1] (See FIGS. 2 to 6)
A waveguide disposed on the substrate for guiding an optical signal input / output at one end toward the other end, and the waveguide disposed opposite the other end of the waveguide. A 45-degree multi-reflection mirror that guides transmission / reception of optical signals in a direction different from the installation surface of the optical fiber, and the optical signals are transmitted / received to / from the waveguide via the 45-degree multi-reflection mirror to the outside. And signal transmission means for relaying signal transmission and reception,
The other end of the waveguide is disposed so as to correspond to at least one of a plurality of optical signal transmission multiple layers provided in the 45-degree multiple reflection mirror, and
An optical lens portion for suppressing the spread of the optical signal is provided on the 45 ° multiple reflection mirror side of the waveguide so as to oppose the light input / output surface of the 45 ° multiple reflection mirror, and the optical lens portion is disposed on the waveguide. An optical coupling circuit characterized by being integrated with.

[Appendix 2]
In the optical coupling circuit according to attachment 1,
An optical coupling circuit characterized in that the 45-degree multi-reflection mirror is composed of metal thin films alternately laminated with insulating and elastic rubber or resin, and this anisotropic conductive sheet also functions as a mirror.

[Appendix 3] (See Figure 7)
In the optical coupling circuit according to attachment 1,
An optical coupling circuit, wherein the optical lens portion is a semi-cylindrical lens having the same height as the one waveguide.

[Appendix 4] (See FIGS. 2 to 6)
In the optical coupling circuit according to attachment 1,
The optical lens portion is a semi-cylindrical lens having the same height as the waveguide, and the semi-cylindrical lens is obtained by forming the end portion of the waveguide in a semi-cylindrical shape. An optical coupling circuit.

[Appendix 5] (See FIGS. 7 to 9)
In the optical coupling circuit according to attachment 1,
The optical lens portion is a semi-cylindrical lens having the same height as the waveguide, and the semi-cylindrical lens includes an end portion of the waveguide and the optical signal transmission multiple of the 45-degree multiple reflection mirror. An optical coupling circuit comprising a semi-cylindrical lens having an expanded arc-shaped lens surface in a state of covering a clad layer portion installed on both sides along a multilayer.

[Appendix 6] (See FIGS. 9 and 10)
In the optical coupling circuit according to attachment 4,
An optical coupling circuit, wherein the arc-shaped lens surface of the semi-cylindrical lens is a Fresnel lens surface.

[Appendix 7] (See FIGS. 7, 9, and 10)
In the optical coupling circuit according to any one of appendices 1 to 5,
An optical coupling circuit, wherein the optical lens unit is integrally formed of a material having the same refractive index as that of the waveguide.

[Appendix 8] (See Figure 8)
In the optical coupling circuit according to any one of appendices 1 to 5,
An optical coupling circuit, wherein the optical lens portion is formed integrally with the waveguide by a transparent material having a refractive index different from that of the waveguide.

[Appendix 9] (See Figure 10)
In the optical coupling circuit according to attachment 1,
The optical lens unit includes a first lens unit having the same height as the waveguide, and a second lens unit disposed between the first lens unit and the 45-degree multiple reflection mirror. ,
The first lens portion is a semi-cylindrical lens, and the surface of the semi-cylindrical lens on the 45 ° multiple reflection mirror side includes the end of the waveguide and the optical signal transmission of the 45 ° multiple reflection mirror. An expanded arc-shaped lens surface covering the core layer located on the waveguide side along the multiple layers,
The second lens portion is a half surface in which the lens surface facing the first lens portion is an arc-shaped lens surface and the lens surface facing the optical signal transmission multiple layer of the 45 ° multiple reflection mirror is a flat surface. An optical coupling circuit characterized by being a cylindrical lens.

[Appendix 10] (See Figure 10)
In the optical coupling circuit according to attachment 8,
An optical coupling circuit, wherein the arc-shaped lens surface of the first lens portion is a Fresnel lens surface.

[Appendix 11] (See FIGS. 2 and 3 / Single / Transmitting Optical Assembly)
In the optical coupling circuit according to attachment 1,
A configuration in which the signal transmission means includes a surface-emitting laser installed on an end surface of the 45-degree multi-reflection mirror opposite to the waveguide, and an electric wiring circuit for sending an electric signal for driving the surface-emitting laser; An optical coupling circuit characterized by that.

[Appendix 12] (Refer to FIG. 2 and FIG. 3 / Plural / Transmission side optical assembly)
In the optical coupling circuit according to attachment 1,
The signal transmission means for providing a plurality of the waveguides provided with the optical lens portion at regular intervals and sending the optical signal through the 45-degree multiple reflection mirror individually corresponding to each of the plurality of the waveguides Multiple
Each signal transmission means includes a surface emitting laser installed on an end surface of the 45-degree multiple reflection mirror opposite to the waveguide, and an electric wiring circuit for sending an electric signal for driving the surface emitting laser. An optical coupling circuit characterized by that.

[Supplementary Note 13] (See FIG. 22 / double layer / transmission side optical assembly)
In the optical coupling circuit according to attachment 10,
The waveguide including the optical lens unit is equipped with at least two upper and lower parts at a predetermined interval, and the optical lens unit is configured by the optical lens unit according to Appendix 8.
The surface-emitting laser provided in the signal transmission means is at least two surface-emitting lasers that individually send optical signals to each of the waveguides configured in layers through the 45-degree multiple reflection mirror. An optical coupling circuit.

[Appendix 14] (See FIGS. 5 and 6 / Single / Receiver side optical assembly)
In the optical coupling circuit according to attachment 1,
The signal transmission means is installed on the light output end face of the 45-degree multi-reflection mirror, and converts a light signal into an electric signal, and a predetermined electric power output from the photoelectric conversion element connected to the photoelectric conversion element. An optical coupling circuit comprising an electric signal transmission circuit for sending a signal for external transmission.

[Supplementary Note 15] (See FIGS. 5 and 6 / Plural / Receiving side optical assembly)
In the optical coupling circuit according to attachment 1,
A plurality of the waveguides having the optical lens portions are provided at regular intervals, and an optical signal sent through the 45-degree multiple reflection mirror corresponding to each of the plurality of waveguides is converted into an electrical signal. A plurality of the signal transmission means for outputting
Each of these signal transmission means is installed on the light output end face of the 45-degree multiple reflection mirror, and a photoelectric conversion element that converts an optical signal into an electrical signal, and a predetermined signal that is connected to the photoelectric conversion element and converted by the photoelectric conversion element An optical coupling circuit comprising an electrical signal transmission circuit for sending an electrical signal for external transmission.

[Supplementary Note 16] (See FIG. 23 / Double-layer / Receiver side optical assembly)
In the optical coupling circuit according to attachment 13,
The waveguide including the optical lens unit is equipped with at least two upper and lower parts at a predetermined interval, and the optical lens unit is configured by the optical lens unit according to Appendix 8.
The photoelectric conversion elements provided in the signal transmission means are at least two photoelectric conversion elements corresponding to optical signals individually sent from the respective waveguides through the 45-degree multiple reflection mirrors, Optical coupling circuit.

[Appendix 17] (See Figure 17)
In the optical coupling circuit according to attachment 1,
The optical lens unit is composed of an optical lens unit equivalent to the optical lens unit described in Appendix 8, and the optical signal output from the optical lens unit is positioned outside via the 45-degree multiple reflection mirror. An optical coupling circuit characterized in that the signal transmission means for feeding into another waveguide is a signal transmission means including an optical lens portion equivalent to the optical lens portion described in appendix 8.

[Appendix 18] (See FIGS. 18 and 19 / Stepped optical coupling)
In the optical coupling circuit according to attachment 1,
Equipped with two waveguides each having the optical lens portion as a set, the two waveguides are stacked in a vertical direction to form a two-layer structure, and the upper waveguide is formed along the lower waveguide. Arranged in a retracted state,
Two 45 degree multiple reflection mirrors are arranged corresponding to each of the two waveguides individually, and the transmission / reception direction of the optical signal from each 45 degree multiple reflection mirror is set in the same direction,
The signal transmission means is installed by being engaged with the 45 degree reflection mirror and transmitting and receiving to and from the outside by reflecting the optical signal transmitted and received from each 45 degree multiple reflection mirror to the outside. Two optical fibers that relay the optical signal, and two condensing lenses disposed between the optical fibers and the 45-degree reflection mirror,
An optical coupling circuit, wherein a semi-cylindrical lens for converging the transmitted and received optical signals is installed between each of the 45-degree multiple reflection mirrors and the 45-degree reflection mirror.

[Appendix 19] (See Fig. 1 / Optical Module)
In an optical module for signal transmission / reception provided with an optical interconnection circuit for transmitting to an outgoing signal processing unit that transmits an electrical signal externally input to the transmission signal processing unit, which is installed on the same board,
The optical interconnection circuit includes a transmission-side optical assembly coupled to the transmission signal processing unit, a reception-side optical assembly coupled to the transmission signal processing unit, and a polymer waveguide that interconnects the optical assemblies. And consisting of
The optical coupling circuit according to any one of the supplementary notes 10 to 11 as the transmission side optical assembly, and the optical coupling circuit according to any one of the supplementary notes 13 to 14 as the corresponding reception side optical assembly. An optical module for signal transmission / reception characterized by being equipped with a circuit.

[Supplementary Note 20] (Second embodiment / see FIG. 16)
Optical interconnection circuit for transmitting electrical signals for transmission input to a plurality of transmission signal processing units installed on one board to a plurality of transmission signal processing units installed on the other board and transmitting to the outside In the optical module for signal transmission and reception comprising
The optical interconnection circuit;
A plurality of transmission-side optical assemblies that convert a plurality of electrical signals output from the respective transmission signal processing units into optical signals, and light that takes the optical signals through a plurality of polymer waveguides and transmits them to the other board side Signal relay means, and a plurality of reception side optical assemblies that take optical signals transmitted through the optical signal relay means through a plurality of polymer waveguides, convert them into electrical signals, and transmit them to the respective outgoing signal processing units And a configuration including
The optical signal relay means;
A plurality of relay optical fibers for optical coupling installed between the one and the other boards, and one relay for optically coupling the plurality of relay optical fibers and the plurality of waveguides on the one board An optical coupling circuit for use, and the other relay optical coupling circuit for optically coupling the plurality of relay optical fibers and the plurality of waveguides on the other board,
The plurality of transmission side optical assemblies are each configured by the optical coupling circuit described in Appendix 10, and the plurality of reception side optical assemblies are each configured by the optical coupling circuit described in Appendix 13. Transmit / receive optical module.

[Supplementary Note 21] (Third Embodiment / See FIG. 21)
Optical interconnection circuit for transmitting electrical signals for transmission input to a plurality of transmission signal processing units installed on one board to a plurality of transmission signal processing units installed on the other board and transmitting to the outside In the optical module for signal transmission and reception comprising
The optical interconnection circuit;
A transmission-side optical assembly having a two-layer structure that converts a plurality of electrical signals output from the transmission signal processing units into optical signals, and the optical signals are captured via a plurality of polymer waveguides and transmitted to the other board side. And an optical signal relay means that receives the optical signal transmitted through the optical signal relay means through a plurality of polymer waveguides, converts the optical signal to an electrical signal, and transmits the electrical signal to each outgoing signal processor. Including a receiving side optical assembly,
The optical signal relay means;
A plurality of relay optical fibers for optical coupling installed between the one and the other boards, and one relay for optically coupling the plurality of relay optical fibers and the plurality of waveguides on the one board An optical coupling circuit for use, and the other relay optical coupling circuit for optically coupling the plurality of relay optical fibers and the plurality of waveguides on the other board,
The transmission-side optical assembly having the two-layer structure is configured by the optical coupling circuit according to Appendix 12, and the reception-side optical assembly having the two-layer structure is configured by the optical coupling circuit according to Appendix 15.
An optical module for signal transmission / reception, wherein each of the one and the other optical coupling circuits for relaying is configured by the optical coupling circuit described in Appendix 17.

[Appendix 22] (See Figure 24)
In a signal transmission / reception module equipped with an optical interconnection circuit for transmitting to an outgoing signal processing unit that transmits an electrical signal externally input to the transmission signal processing unit equipped on the same board,
The optical interconnection circuit includes a transmission side optical assembly (one optical coupling circuit 411) coupled to the transmission signal processing unit and a reception side optical assembly (the other optical coupling circuit) coupled to the transmission signal processing unit. 413) and a polymer waveguide for interconnecting the optical assemblies,
The board is equipped with the optical coupling circuit according to claim 4 as the transmitting side optical assembly, and the board includes a signal transmission means provided in the optical coupler together with a 45-degree multiple reflection mirror provided in the signal transmission means. A signal transmission / reception module comprising an optical / electrical connection socket portion 96 fixed on the top.

[Appendix 23]
In the signal transmission / reception module according to attachment 21,
An electric wiring board 91 provided in the optical coupling circuit 411 and a lock mechanism 96A for fixing the optical / electrical connection socket part 96 by pressing the 45-degree multiple reflection mirror and the optical coupler against the same board at the same time. A signal transmission / reception module comprising a positioning pin 96B for determining the position of the optical coupling circuit on the board 10 via

  The present invention is suitable for an optical circuit used in an optical interconnection module applied to a server, a router, and an HPC.

1, 30, 40, 400 Signal transmission / reception optical module (optical module)
1A, 30A, 40A, 400A Optical signal transmission line (optical interconnection circuit)
2, 2A, 2B Transmission signal processing unit 3, 3A, 3B Transmission signal processing unit 10 Substrate (board)
10A One board (board)
10B The other board (board)
11,411 Transmitting side optical assembly (one optical coupling circuit)
11A First optical coupling circuit (transmission side optical assembly)
11B Second optical coupling circuit (transmission side optical assembly)
12 (12 ₁ , 12 ₂ , 12 ₃ , ...) Waveguide (polymer waveguide)
12a Core layer 12b Clad layer 12c Semi-cylindrical lens 12F Fresnel lens surface 12P, 12Q Arc-shaped lens surface 12G Second lens part (semi-cylindrical lens part)
12W optical lens part (double lens part)
12Wa 12Wb Lens part 13,413 Reception side optical assembly (the other optical coupling circuit)
13A Seventh optical coupling circuit (receiving-side optical assembly)
13B Eighth optical coupling circuit (receiving-side optical assembly)
14, 44 45 degree multiple reflection mirror 15, 25, 35 Signal transmission means 15A, 25A, 32A, 33A Signal transmission means 16 ₁ , 16 ₂ , 16 ₃ ,..., 35, 45 Surface emitting laser (VCSEL)
17 ₁ , 17 ₂ , 17 ₃ , ... Electric wiring circuit (electrical wiring)
26 ₁ , 26 ₂ , 26 ₃ , ..., 55, 65 Photodiode (PD)
31 Third optical coupling circuit 32 One relay optical coupling circuit (fourth optical coupling circuit)
32A, 32B Semi-cylindrical lens body 32C 45 degree reflection mirror 32D, 32D Optical connector part 32Da, 32Db Condensing lens 33 The other optical coupling circuit for relay (5th optical coupling circuit)
34 Sixth optical coupling circuit 41 Transmission side optical assembly 43 Reception side optical assembly 73 (73 ₁ , 73 ₂ , 73 ₃ ,...) Waveguide (polymer waveguide)
83 (83 ₁ , 83 ₂ , 83 ₃ ,...) Waveguide (polymer waveguide)
96 optical / electrical connection socket part 96A lock mechanism 96B positioning pin 99A, 99B optical signal relay means 100 MMF array (relay optical fiber array)
100a MMF line (relay optical fiber)

Claims (10)

A waveguide disposed on the substrate for guiding an optical signal input / output at one end toward the other end, and the waveguide disposed opposite the other end of the waveguide. A 45-degree multi-reflection mirror that guides transmission / reception of optical signals in a direction different from the installation surface of the optical fiber, and the optical signals are transmitted / received to / from the waveguide via the 45-degree multi-reflection mirror to the outside. And signal transmission means for relaying signal transmission and reception,
The other end of the waveguide is disposed so as to correspond to at least one of a plurality of optical signal transmission multiple layers provided in the 45-degree multiple reflection mirror, and
An optical lens portion for suppressing the spread of the optical signal is provided on the 45 ° multiple reflection mirror side of the waveguide so as to oppose the light input / output surface of the 45 ° multiple reflection mirror, and the optical lens portion is disposed on the waveguide. An optical coupling circuit characterized by being integrated with. The optical coupling circuit according to claim 1.
An optical coupling circuit characterized in that the 45-degree multi-reflection mirror is composed of metal thin films alternately laminated with insulating and elastic rubber or resin, and this anisotropic conductive sheet also functions as a mirror. The optical coupling circuit according to claim 1 or 2,
The optical lens portion is a semi-cylindrical lens having the same height as the waveguide, and the semi-cylindrical lens includes an end portion of the waveguide and the optical signal transmission multiple of the 45-degree multiple reflection mirror. An optical coupling circuit comprising a semi-cylindrical lens having an expanded arc-shaped lens surface in a state of covering a clad layer portion installed on both sides along a multilayer. The optical coupling circuit according to claim 1 or 2,
The optical lens unit includes a first lens unit having the same height as the waveguide, and a second lens unit disposed between the first lens unit and the 45-degree multiple reflection mirror. ,
The first lens portion is a semi-cylindrical lens, and the surface of the semi-cylindrical lens on the 45 ° multiple reflection mirror side includes the end of the waveguide and the optical signal transmission of the 45 ° multiple reflection mirror. An expanded arc-shaped lens surface covering the core layer located on the waveguide side along the multiple layers,
The second lens portion is a half surface in which the lens surface facing the first lens portion is an arc-shaped lens surface and the lens surface facing the optical signal transmission multiple layer of the 45 ° multiple reflection mirror is a flat surface. An optical coupling circuit characterized by being a cylindrical lens. The optical coupling circuit according to claim 1, 3, 4,
A configuration in which the signal transmission means includes a surface-emitting laser installed on an end surface of the 45-degree multi-reflection mirror opposite to the waveguide, and an electric wiring circuit for sending an electric signal for driving the surface-emitting laser; An optical coupling circuit characterized by that. The optical coupling circuit according to claim 1, 2, 3, 4
The signal transmission means includes an optical through hole installed on an end surface opposite to the waveguide of the 45-degree multiple reflection mirror, a surface emitting laser installed on an end surface opposite to the optical through hole, and this surface. An optical coupling circuit comprising an electrical wiring circuit for sending an electrical signal for driving a light emitting laser. The optical coupling circuit according to claim 1.
The signal transmission means is installed by being engaged with the 45 degree reflection mirror and transmitting and receiving to and from the outside by reflecting the optical signal transmitted and received from each 45 degree multiple reflection mirror to the outside. A relay optical fiber that relays the optical signal, and a condensing lens disposed between each of the relay optical fibers and the 45 degree reflection mirror, and each of the 45 degree multiple reflection mirror and the 45 degree An optical coupling circuit characterized in that a semi-cylindrical lens for converging the transmitted and received optical signals is provided between the reflecting mirrors. In an optical module for signal transmission / reception provided with an optical interconnection circuit for transmitting to an outgoing signal processing unit that transmits an electrical signal externally input to the transmission signal processing unit, which is installed on the same board,
The optical interconnection circuit includes a transmission-side optical assembly coupled to the transmission signal processing unit, a reception-side optical assembly coupled to the transmission signal processing unit, and a polymer waveguide that interconnects the optical assemblies. And consisting of
7. An optical module for signal transmission / reception, comprising the optical coupling circuit according to claim 1 as the transmission-side optical assembly. Optical interconnection circuit for transmitting electrical signals for transmission input to a plurality of transmission signal processing units installed on one board to a plurality of transmission signal processing units installed on the other board and transmitting to the outside In the optical module for signal transmission and reception comprising
The optical interconnection circuit;
A plurality of transmission-side optical assemblies that convert a plurality of electrical signals output from the respective transmission signal processing units into optical signals, and light that takes the optical signals through a plurality of polymer waveguides and transmits them to the other board side Signal relay means, and a plurality of reception side optical assemblies that take optical signals transmitted through the optical signal relay means through a plurality of polymer waveguides, convert them into electrical signals, and transmit them to the respective outgoing signal processing units And a configuration including
The optical signal relay means;
A plurality of relay optical fibers for optical coupling installed between the one and the other boards, and one of the plurality of relay optical fibers and the plurality of waveguides on the one board for optical coupling. 8. The relay optical coupling circuit according to claim 7, wherein the relay optical coupling circuit according to claim 7 is optically coupled to the plurality of relay optical fibers and the plurality of waveguides on the other board. And consisting of
7. An optical module for signal transmission / reception, wherein the plurality of transmission-side optical assemblies are configured by the optical coupling circuit according to claim 1. In a signal transmission / reception module equipped with an optical interconnection circuit for transmitting to an outgoing signal processing unit that transmits an electrical signal externally input to the transmission signal processing unit equipped on the same board,
The optical interconnection circuit includes a transmission side optical assembly (one optical coupling circuit) coupled to the transmission signal processing unit and a reception side optical assembly (the other optical coupling circuit) coupled to the transmission signal processing unit. And a polymer waveguide for interconnecting the optical assemblies,
The optical coupling circuit according to any one of claims 1 to 6 is provided as the transmission-side optical assembly, and the signal transmission means provided in the optical coupler is combined with a 45-degree multiple reflection mirror provided in the signal transmission means. A signal transmission / reception module comprising an optical / electrical connection socket portion fixed on the board.

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