JP2004217869A5 - - Google Patents
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- Publication number
- JP2004217869A5 JP2004217869A5 JP2003009767A JP2003009767A JP2004217869A5 JP 2004217869 A5 JP2004217869 A5 JP 2004217869A5 JP 2003009767 A JP2003009767 A JP 2003009767A JP 2003009767 A JP2003009767 A JP 2003009767A JP 2004217869 A5 JP2004217869 A5 JP 2004217869A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- epoxy
- compound
- ester compound
- ester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 description 23
- 229920000647 polyepoxide Polymers 0.000 description 23
- -1 ester compound Chemical class 0.000 description 18
- 125000003700 epoxy group Chemical group 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 2
- 229940126062 Compound A Drugs 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003009767A JP4241056B2 (ja) | 2003-01-17 | 2003-01-17 | エポキシ樹脂組成物、エポキシ樹脂硬化剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003009767A JP4241056B2 (ja) | 2003-01-17 | 2003-01-17 | エポキシ樹脂組成物、エポキシ樹脂硬化剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004217869A JP2004217869A (ja) | 2004-08-05 |
| JP2004217869A5 true JP2004217869A5 (cg-RX-API-DMAC7.html) | 2006-01-26 |
| JP4241056B2 JP4241056B2 (ja) | 2009-03-18 |
Family
ID=32899164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003009767A Expired - Fee Related JP4241056B2 (ja) | 2003-01-17 | 2003-01-17 | エポキシ樹脂組成物、エポキシ樹脂硬化剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4241056B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101177519B (zh) * | 2006-11-09 | 2010-11-24 | 莘茂复合材料股份有限公司 | 经改质的环氧树脂组成物 |
| CN105273367A (zh) | 2014-06-30 | 2016-01-27 | 新日铁住金化学株式会社 | 芳香族聚酯、芳香族聚酯的制造方法、硬化性树脂组合物及其应用 |
| CN106046321B (zh) * | 2016-06-13 | 2018-02-13 | 西北师范大学 | 一种功能性固化剂及其制备双酚a型环氧树脂的方法 |
| JP2018080264A (ja) * | 2016-11-16 | 2018-05-24 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板 |
| KR102867494B1 (ko) * | 2019-01-10 | 2025-10-01 | 미쯔비시 케미컬 주식회사 | 변성 에폭시 수지, 에폭시 수지 조성물, 경화물, 및 전기·전자 회로용 적층판 |
| CN112375337A (zh) * | 2020-12-09 | 2021-02-19 | 安徽威能电源科技有限公司 | 一种低介质损耗的环氧树脂制备方法 |
| WO2024018949A1 (ja) * | 2022-07-21 | 2024-01-25 | 味の素株式会社 | ポリエステル樹脂、および樹脂組成物、その硬化物、その用途 |
| US20250258430A1 (en) * | 2022-10-05 | 2025-08-14 | Resonac Corporation | Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board |
-
2003
- 2003-01-17 JP JP2003009767A patent/JP4241056B2/ja not_active Expired - Fee Related
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