JP2005146008A5 - - Google Patents

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Publication number
JP2005146008A5
JP2005146008A5 JP2003381352A JP2003381352A JP2005146008A5 JP 2005146008 A5 JP2005146008 A5 JP 2005146008A5 JP 2003381352 A JP2003381352 A JP 2003381352A JP 2003381352 A JP2003381352 A JP 2003381352A JP 2005146008 A5 JP2005146008 A5 JP 2005146008A5
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JP
Japan
Prior art keywords
general formula
organic residue
group
represented
carboxylic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003381352A
Other languages
English (en)
Japanese (ja)
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JP2005146008A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003381352A priority Critical patent/JP2005146008A/ja
Priority claimed from JP2003381352A external-priority patent/JP2005146008A/ja
Publication of JP2005146008A publication Critical patent/JP2005146008A/ja
Publication of JP2005146008A5 publication Critical patent/JP2005146008A5/ja
Pending legal-status Critical Current

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JP2003381352A 2003-11-11 2003-11-11 封止材用熱硬化性樹脂、熱硬化性樹脂組成物、熱硬化性樹脂組成物で封止する方法、および熱硬化性樹脂組成物で封止された電子部品装置 Pending JP2005146008A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003381352A JP2005146008A (ja) 2003-11-11 2003-11-11 封止材用熱硬化性樹脂、熱硬化性樹脂組成物、熱硬化性樹脂組成物で封止する方法、および熱硬化性樹脂組成物で封止された電子部品装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003381352A JP2005146008A (ja) 2003-11-11 2003-11-11 封止材用熱硬化性樹脂、熱硬化性樹脂組成物、熱硬化性樹脂組成物で封止する方法、および熱硬化性樹脂組成物で封止された電子部品装置

Publications (2)

Publication Number Publication Date
JP2005146008A JP2005146008A (ja) 2005-06-09
JP2005146008A5 true JP2005146008A5 (cg-RX-API-DMAC7.html) 2006-12-28

Family

ID=34690753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003381352A Pending JP2005146008A (ja) 2003-11-11 2003-11-11 封止材用熱硬化性樹脂、熱硬化性樹脂組成物、熱硬化性樹脂組成物で封止する方法、および熱硬化性樹脂組成物で封止された電子部品装置

Country Status (1)

Country Link
JP (1) JP2005146008A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5186144B2 (ja) * 2006-07-18 2013-04-17 昭和電工株式会社 透明反射防止板
US12098257B2 (en) 2019-07-17 2024-09-24 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
JP7547067B2 (ja) * 2020-03-31 2024-09-09 日本ユピカ株式会社 電気電子部品固定用結晶性ラジカル重合性組成物、車載ロータコア、及びロータコア固定体の製造方法

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