JP2004197220A5 - - Google Patents
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- Publication number
- JP2004197220A5 JP2004197220A5 JP2003399443A JP2003399443A JP2004197220A5 JP 2004197220 A5 JP2004197220 A5 JP 2004197220A5 JP 2003399443 A JP2003399443 A JP 2003399443A JP 2003399443 A JP2003399443 A JP 2003399443A JP 2004197220 A5 JP2004197220 A5 JP 2004197220A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- processed
- electrolytic
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 56
- 238000005498 polishing Methods 0.000 claims description 15
- 239000008151 electrolyte solution Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 11
- 239000003792 electrolyte Substances 0.000 claims description 10
- 239000000243 solution Substances 0.000 claims description 10
- 238000005868 electrolysis reaction Methods 0.000 claims description 4
- 238000000866 electrolytic etching Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000003929 acidic solution Substances 0.000 claims 1
- 239000006260 foam Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000004745 nonwoven fabric Substances 0.000 claims 1
- 239000002759 woven fabric Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 229940021013 electrolyte solution Drugs 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003399443A JP2004197220A (ja) | 2002-12-02 | 2003-11-28 | 電解処理装置及びその方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002350529 | 2002-12-02 | ||
| JP2003399443A JP2004197220A (ja) | 2002-12-02 | 2003-11-28 | 電解処理装置及びその方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004197220A JP2004197220A (ja) | 2004-07-15 |
| JP2004197220A5 true JP2004197220A5 (https=) | 2007-01-18 |
Family
ID=32774999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003399443A Pending JP2004197220A (ja) | 2002-12-02 | 2003-11-28 | 電解処理装置及びその方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004197220A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7927092B2 (en) * | 2007-12-31 | 2011-04-19 | Corning Incorporated | Apparatus for forming a slurry polishing pad |
| JP2010084235A (ja) * | 2010-01-18 | 2010-04-15 | Ebara Corp | めっき装置 |
| JP6161863B2 (ja) * | 2010-12-28 | 2017-07-12 | 株式会社荏原製作所 | 電気めっき方法 |
| JP7189013B2 (ja) * | 2018-12-28 | 2022-12-13 | 東京エレクトロン株式会社 | 基板処理装置および基板処理装置の運転方法 |
-
2003
- 2003-11-28 JP JP2003399443A patent/JP2004197220A/ja active Pending
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