JP2004190093A5 - - Google Patents
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- Publication number
- JP2004190093A5 JP2004190093A5 JP2002359458A JP2002359458A JP2004190093A5 JP 2004190093 A5 JP2004190093 A5 JP 2004190093A5 JP 2002359458 A JP2002359458 A JP 2002359458A JP 2002359458 A JP2002359458 A JP 2002359458A JP 2004190093 A5 JP2004190093 A5 JP 2004190093A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002359458A JP2004190093A (ja) | 2002-12-11 | 2002-12-11 | 置換無電解金めっき浴 |
| KR1020030015066A KR20040051470A (ko) | 2002-12-11 | 2003-03-11 | 치환 무전해 금 도금욕 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002359458A JP2004190093A (ja) | 2002-12-11 | 2002-12-11 | 置換無電解金めっき浴 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004190093A JP2004190093A (ja) | 2004-07-08 |
| JP2004190093A5 true JP2004190093A5 (ja) | 2005-11-04 |
Family
ID=32758850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002359458A Pending JP2004190093A (ja) | 2002-12-11 | 2002-12-11 | 置換無電解金めっき浴 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2004190093A (ja) |
| KR (1) | KR20040051470A (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4955315B2 (ja) * | 2005-06-16 | 2012-06-20 | メタローテクノロジーズジャパン株式会社 | ワイヤーボンディング接合用の金めっき皮膜形成用無電解金めっき液 |
| JP4932542B2 (ja) * | 2007-03-05 | 2012-05-16 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 無電解金めっき液 |
| KR101483599B1 (ko) | 2008-07-04 | 2015-01-16 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | 무전해 금 도금 용액 |
| JP5466600B2 (ja) * | 2010-08-27 | 2014-04-09 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 置換金めっき液及び接合部の形成方法 |
| JP5897406B2 (ja) * | 2012-05-28 | 2016-03-30 | 株式会社石飛製作所 | 電解研磨用電解液 |
| WO2016208340A1 (ja) * | 2015-06-26 | 2016-12-29 | メタローテクノロジーズジャパン株式会社 | 電解硬質金めっき液用置換防止剤及びそれを含む電解硬質金めっき液 |
| KR101857596B1 (ko) * | 2018-01-31 | 2018-05-14 | (주)엠케이켐앤텍 | 질소-함유 헤테로아릴카복실산을 함유하는 치환형 무전해 금 도금액 및 이를 사용한 치환형 무전해 금 도금 방법 |
| KR101996915B1 (ko) | 2018-09-20 | 2019-07-05 | (주)엠케이켐앤텍 | 카보닐 산소를 갖는 퓨린 또는 피리미딘계 화합물을 함유하는 치환형 무전해 금 도금액 및 이를 이용한 치환형 무전해 금 도금 방법 |
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2002
- 2002-12-11 JP JP2002359458A patent/JP2004190093A/ja active Pending
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2003
- 2003-03-11 KR KR1020030015066A patent/KR20040051470A/ko not_active Application Discontinuation