JP2004186510A - Bubble removing device for viscous fluid - Google Patents

Bubble removing device for viscous fluid Download PDF

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Publication number
JP2004186510A
JP2004186510A JP2002353063A JP2002353063A JP2004186510A JP 2004186510 A JP2004186510 A JP 2004186510A JP 2002353063 A JP2002353063 A JP 2002353063A JP 2002353063 A JP2002353063 A JP 2002353063A JP 2004186510 A JP2004186510 A JP 2004186510A
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Prior art keywords
viscous fluid
resist solution
cylindrical body
resist
storage tank
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JP2002353063A
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JP4196372B2 (en
Inventor
Yoichi Shindo
洋一 眞道
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MECHA ENJI KK
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MECHA ENJI KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a bubble removing device for viscous fluid which can reliably remove bubbles in a resist agent, etc. and can perform a quick bubble removing work. <P>SOLUTION: The bubble removing device for viscous fluid is used in a cycling resist agent supply mechanism, etc. in a resist agent applicator, and has a viscous fluid storage vessel, a supply port for a viscous fluid formed above the viscous fluid storage vessel, and a cylinder having a ceiling fitted in the viscous fluid storage vessel. The cylinder is formed in a tapered shape which enlarges its diameter toward downward, and then the viscous fluid is released from the supply port. While the viscous fluid flows down on an outer wall of the cylinder, bubbles included in the viscous fluid are removed. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】この発明は、レジスト液塗布装置における循環式レジスト液供給機構等において使用される粘性流体の気泡除去装置に関し、気泡を確実かつ効率よく除去することができる粘性流体の気泡除去装置を提供しようとするものである。
【0002】
【従来の技術】この種の粘性流体の気泡除去装置の一例として、プリント基板などのレジスト液塗布装置における循環式レジスト液供給機構に用いられる粘性流体の気泡除去装置を挙げることができる。
【0003】すなわち、プリント基板製造工程のうちのレジスト液塗布工程では、プリント基板にレジスト液を均一に塗布する必要があり、このため例えばロールコーティングやカーテンコーティングが行われている。そして、このレジスト液塗布の際には、レジスト液のプリント基板上への供給、使用済みレジスト液の回収および再利用という循環式レジスト液供給機構がレジスト液塗布工程のライン中に組み込まれている。この理由は、レジストは非常に高価な材料であり、消費量を少なくすることが望まれるからである。
【0004】従来の循環式レジスト液供給機構においては、複数の仕切りを備えたレジスト液貯留槽内にレジスト液を滞留させ、それぞれの仕切りからレジスト液をオーバーフローまたは仕切り下部より流すことにより、気泡を除去する粘性流体の気泡除去装置が付設されている。
【0005】
【発明が解決しようとする課題】しかしながら、上述のような単なるオーバーフローおよび下部流水方式の粘性流体の気泡除去装置においては、レジスト液の粘性のために気泡を除去する効果が低く、塗布したプリント基板の表面にレジスト液層にピンホール等の不良が発生するおそれがあった。
【0006】そこで出願人は先に、レジスト液貯留槽と、レジスト液貯留槽の側壁上部に形成された回収レジスト液の供給口、およびホッパの供給ノズルからそれぞれ吐出されるレジスト液を滞留させ、その後オーバーフローさせる隔室と、レジスト液貯留槽を複数のスペースに仕切り、かつレジスト液を通過させる無数の気孔を備えた仕切りを有するレジスト液の気泡除去装置を提案した(特開2002−55460参照)。
【0007】ところが、上述のようにレジスト液を通過させる無数の気孔を備えた仕切りを有するレジスト液の気泡除去装置においても、仕切りの気孔部分から気泡が液面上に迅速に上がってこないという問題があり、このようなタイプのレジスト液の気泡除去装置においては、気泡を除去する速度を向上させることが難しいという欠点があった。
【0008】この発明の目的とするところは、上述した従来の問題点を解決し、レジスト液の気泡の除去を確実に行うことができ、かつ迅速な気泡除去作業を実行することができる粘性流体の気泡除去装置を提供することにある。
【0009】
【課題を解決するための手段】すなわち、この発明に係る粘性流体の気泡除去装置は、レジスト液塗布装置における循環式レジスト液供給機構等において使用される粘性流体の気泡除去装置であって、粘性流体貯留槽と、粘性流体貯留槽の上部に形成された粘性流体の供給口と、粘性流体貯留槽内に取り付けた天板部を有する筒状体とを有し、上記筒状体を下方に向かってその径を拡大するテーパ状に形成した上、上記供給口から粘性流体を放出して、粘性流体が筒状体の外壁を流下する間に、粘性流体に含まれる気泡を除去するようにしたことを特徴とするものである。
【0010】この発明に係る粘性流体の気泡除去装置は、上記筒状体が、その天板部に粘性流体を貯留しつつ筒状体の外壁側に向かって越流させる凹部を設けたことをも特徴とするものである。
【0011】この発明の粘性流体の気泡除去装置によれば、レジスト液をテーパ状に径を拡大するようにした筒状体表面を膜状に流下させるようにしたので、薄い膜厚と表面張力とが相まってレジスト液中の気泡の除去を効率よく行うことができ、またレジスト液中の気泡を確実に除去することができるので、より経済的な粘性流体の気泡除去装置を提供できるようになった。
【0012】さらに、この発明の粘性流体の気泡除去装置によれば、構造が簡単なために粘性流体貯留槽をコンパクトにすることが可能であり、なおかつ粘性流体貯留槽の分解や洗浄が簡単に行なえるようになった。
【0013】
【発明の実施の形態】以下、この発明をプリント基板に対するレジスト液塗布装置に使用される循環式レジスト液供給機構に付設した粘性流体の気泡除去装置に適用した実施の形態を、図面を参照して具体的に説明する。
【0014】図1はこの発明の粘性流体の気泡除去装置の1実施例を示す概略断面図、図2は粘性流体が筒状体の外壁を流下する間に気泡が除去される状態を示す説明図である。
【0015】この発明の粘性流体の気泡除去装置はレジスト液塗布装置における循環式レジスト液供給機構(図示せず)において使用されるものであり、循環式レジスト液供給機構に付設した皿状容器からなるレジスト液貯留槽11を備えている。このレジスト液貯留槽11は、その上部に回収レジスト液(粘性流体)12の供給口13を形成されており、プリント基板上へレジスト液12を供給し、そして使用済みレジスト液12を回収して供給口13からレジスト液貯留槽11へ投入して再利用される。
【0016】上記供給口13には、レジスト液12の稀釈液の供給管14が付設され、またその近傍には新鮮なレジスト液の供給ノズル15が取り付けられている。新しいレジスト液は、レジスト液貯留槽11内のレジスト液12の液面が所定の高さになった時点で自動的に補充されるように、供給ノズル15の開閉弁等を制御することが望ましい。
【0017】このようにして、レジスト液貯留槽11内には供給口13から回収して再利用されるレジスト液12と、必要に応じて補充されるレジスト液12とが適宜貯留される。
【0018】また、ハウジング16内に配置した皿状容器からなる上記レジスト液貯留槽11上には、天板部18を有する筒状体17が搭載されている。この筒状体17は、外壁を下方に向かってその径を拡大するようテーパ状に形成してある。またその天板部18には、レジスト液12を貯留しつつ筒状体17の外壁側に向かって越流させる凹部19が設けてある。図において22はレジスト液貯留槽11の底部に設けた排出口、23は排出ポンプである。
【0019】気泡を除去する作用を図2に基いて説明すると、レジスト液12は先ず天板部18の凹部19から筒状体17の外壁に向かって越流する際に内部に含まれる気泡21をレジスト液12の表面に移動させて取り除くことができる。その後レジスト液12は、末広がりとなるようにテーパ状とした筒状体17の外壁を流下するのであるが、その際レジスト液12は膜状で斜めに流下するので、レジスト液12中の気泡21は速やかにレジスト膜表面に移動する。また、レジスト液貯留槽11に向かって流下するレジスト液12は、筒状体17の外壁に沿って移動する間に表面張力によって膜厚をより薄くして、レジスト液12中から気泡21をレジスト膜表面に浮かび上がらせるよう作用しており、その作用によっても気泡21をより迅速にレジスト膜表面に浮かび上がらせることができる。そのような、気泡21を除去する作用を生み出す流下速度は、レジスト液12の粘度、筒状体17の径や高さ、あるいはその他の条件を勘案して適宜決定することができる。
【0020】上記レジスト液貯留槽11は、筒状体17の外壁を流下するレジスト液12を受け止める際、レジスト液12は末広がりとなるようにテーパ状とした筒状体17の外壁を流下してきているので、気泡21を巻き込んでしまうおそれはない。
【0021】以上の構成からなる粘性流体の気泡除去装置においては、レジスト液12は筒状体17の天板部18から筒状体17の壁面を流下し、レジスト液貯留槽11に貯留される。その後、レジスト液貯留槽11の底部に設けた排出口22から循環式レジスト液供給機構の配管系へ給送され、レジスト液塗布工程に供給される。得たレジスト液塗布層は、塗布膜中に気泡によるピンホール等の発生もなく、非常に高品質のプリント基板を得ることができるようになった。
【0022】
【発明の効果】この発明の粘性流体の気泡除去装置によれば、レジスト液を筒状体表面を膜状に流下させるようにしたので、薄い膜厚と表面張力とが相まってレジスト液中の気泡の除去を効率よく行うことができ、またレジスト液中の気泡を確実に除去することができるので、より経済的な粘性流体の気泡除去装置を提供できるようになった。
【0023】さらに、この発明の粘性流体の気泡除去装置によれば、構造が簡単なために粘性流体貯留槽をコンパクトにすることが可能であり、なおかつ粘性流体貯留槽の分解や洗浄が簡単に行なえるようになった。
【図面の簡単な説明】
【図1】この発明の粘性流体の気泡除去装置の1実施例を示す概略断面図である。
【図2】粘性流体が筒状体の外壁を流下する間に気泡が除去される状態を示す説明図である。
【符号の説明】
11 レジスト液貯留槽
12 レジスト液
13 供給口
14 稀釈液の供給管
15 レジスト液の供給ノズル
16 テーブル
17 筒状体
18 天板部
19 凹部
21 気泡
22 排出口
23 排出ポンプ
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a viscous fluid bubble removing apparatus used in a circulating resist solution supply mechanism in a resist solution applying apparatus, and more particularly to a viscous fluid bubble removing apparatus capable of removing bubbles reliably and efficiently. It is intended to provide a removing device.
[0002]
2. Description of the Related Art As one example of this type of viscous fluid bubble removing device, there is a viscous fluid bubble removing device used in a circulating resist solution supply mechanism in a resist solution application device such as a printed circuit board.
[0003] That is, in the resist liquid application step in the printed circuit board manufacturing process, it is necessary to uniformly apply the resist liquid to the printed circuit board. For this reason, for example, roll coating or curtain coating is performed. When applying the resist solution, a circulating resist solution supply mechanism of supplying the resist solution onto the printed circuit board, collecting and reusing the used resist solution is incorporated in the line of the resist solution applying process. . The reason is that the resist is a very expensive material, and it is desired to reduce the consumption.
In the conventional circulation type resist solution supply mechanism, the resist solution is retained in a resist solution storage tank having a plurality of partitions, and the resist solution overflows from each partition or flows from the lower portion of the partition to remove bubbles. A device for removing bubbles of the viscous fluid to be removed is provided.
[0005]
However, in the above-described viscous fluid bubble removing apparatus of the mere overflow and bottom water type, the effect of removing bubbles due to the viscosity of the resist solution is low, and the coated printed circuit board is not so effective. There was a risk that defects such as pinholes would occur in the resist liquid layer on the surface of the resist.
Therefore, the applicant first deposits a resist liquid storage tank, a supply port of a recovered resist liquid formed on the upper side wall of the resist liquid storage tank, and a resist liquid discharged from a supply nozzle of a hopper, respectively. Thereafter, an apparatus for removing bubbles of a resist solution having a partition for overflowing and a resist solution storage tank into a plurality of spaces, and having a partition having countless pores for allowing the resist solution to pass therethrough was proposed (see JP-A-2002-55460). .
However, even in the resist liquid bubble removing apparatus having a partition having a myriad of pores through which the resist liquid passes as described above, there is a problem that bubbles do not quickly rise to the liquid surface from the pores of the partition. However, such a type of resist liquid bubble removing apparatus has a disadvantage that it is difficult to improve the speed of removing bubbles.
SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned conventional problems, to reliably remove bubbles in a resist solution, and to perform a rapid bubble removal operation. To provide an air bubble removing device.
[0009]
That is, a viscous fluid bubble removing device according to the present invention is a viscous fluid bubble removing device used in a circulating resist solution supply mechanism or the like in a resist solution applying device. A fluid storage tank, a supply port for the viscous fluid formed in the upper part of the viscous fluid storage tank, and a tubular body having a top plate attached in the viscous fluid storage tank; After forming a tapered shape whose diameter increases toward the end, the viscous fluid is discharged from the supply port, and while the viscous fluid flows down the outer wall of the cylindrical body, bubbles contained in the viscous fluid are removed. It is characterized by having done.
In the viscous fluid bubble removing apparatus according to the present invention, the cylindrical body is provided with a concave portion in its top plate for allowing the viscous fluid to flow toward the outer wall side of the cylindrical body while storing the viscous fluid. Is also a feature.
According to the viscous fluid bubble removing apparatus of the present invention, the resist liquid is caused to flow down in a film form on the surface of the cylindrical body whose diameter is enlarged in a tapered shape. In combination with this, the bubbles in the resist solution can be efficiently removed, and the bubbles in the resist solution can be surely removed, so that a more economical viscous fluid bubble remover can be provided. Was.
Further, according to the viscous fluid bubble removing apparatus of the present invention, the viscous fluid storage tank can be made compact because of its simple structure, and the viscous fluid storage tank can be easily disassembled and cleaned. I can do it.
[0013]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, an embodiment in which the present invention is applied to a viscous fluid bubble removing device attached to a circulation type resist solution supply mechanism used in a resist solution applying device for a printed circuit board will be described below. This will be specifically described.
FIG. 1 is a schematic sectional view showing one embodiment of a viscous fluid bubble removing apparatus according to the present invention, and FIG. 2 is an explanatory view showing a state in which bubbles are removed while a viscous fluid flows down an outer wall of a cylindrical body. FIG.
The apparatus for removing bubbles of a viscous fluid according to the present invention is used in a circulating resist solution supply mechanism (not shown) in a resist solution applying apparatus. A resist solution storage tank 11 is provided. The resist liquid storage tank 11 has a supply port 13 for a recovered resist liquid (viscous fluid) 12 formed at an upper portion thereof, supplies the resist liquid 12 onto a printed circuit board, and collects the used resist liquid 12. It is put into the resist solution storage tank 11 through the supply port 13 and reused.
The supply port 13 is provided with a supply pipe 14 for a diluting liquid of the resist liquid 12, and a nozzle 15 for supplying a fresh resist liquid is provided in the vicinity thereof. It is desirable to control the open / close valve of the supply nozzle 15 so that the new resist solution is automatically replenished when the liquid level of the resist solution 12 in the resist solution storage tank 11 reaches a predetermined level. .
In this manner, in the resist solution storage tank 11, the resist solution 12 collected from the supply port 13 and reused, and the resist solution 12 replenished as needed are stored appropriately.
A cylindrical body 17 having a top plate 18 is mounted on the resist solution storage tank 11 formed of a dish-shaped container disposed in a housing 16. The cylindrical body 17 is formed in a tapered shape such that the diameter of the outer wall increases downward. The top plate portion 18 is provided with a concave portion 19 that stores the resist solution 12 and allows the resist solution 12 to overflow toward the outer wall of the cylindrical body 17. In the figure, reference numeral 22 denotes a discharge port provided at the bottom of the resist solution storage tank 11, and reference numeral 23 denotes a discharge pump.
The operation of removing bubbles will be described with reference to FIG. 2. When the resist solution 12 first flows from the concave portion 19 of the top plate portion 18 toward the outer wall of the cylindrical body 17, bubbles 21 contained in the resist solution 12 are contained therein. Can be moved to the surface of the resist solution 12 and removed. Thereafter, the resist liquid 12 flows down the outer wall of the cylindrical body 17 which is tapered so as to spread out. At this time, since the resist liquid 12 flows obliquely in a film form, the bubbles 21 in the resist liquid 12 Quickly move to the resist film surface. The resist solution 12 flowing down to the resist solution storage tank 11 is made thinner by surface tension while moving along the outer wall of the cylindrical body 17, and the bubbles 21 are removed from the resist solution 12. The air bubbles 21 are caused to emerge on the resist film surface more quickly by the action. The flow velocity that produces such an action of removing the bubbles 21 can be appropriately determined in consideration of the viscosity of the resist solution 12, the diameter and height of the cylindrical body 17, and other conditions.
When the resist liquid storage tank 11 receives the resist liquid 12 flowing down the outer wall of the cylindrical body 17, the resist liquid 12 flows down the outer wall of the cylindrical body 17 which is tapered so as to spread out. Therefore, there is no possibility that the bubbles 21 may be involved.
In the viscous fluid bubble removing apparatus having the above-described structure, the resist liquid 12 flows down the wall of the cylindrical body 17 from the top plate 18 of the cylindrical body 17 and is stored in the resist liquid storage tank 11. . Thereafter, the resist solution is supplied from a discharge port 22 provided at the bottom of the resist solution storage tank 11 to a piping system of a circulation type resist solution supply mechanism, and is supplied to a resist solution application step. The obtained resist solution coating layer was able to obtain a very high quality printed board without generating pinholes or the like due to bubbles in the coating film.
[0022]
According to the apparatus for removing bubbles of a viscous fluid of the present invention, since the resist solution is caused to flow down on the surface of the cylindrical body in a film form, the bubbles in the resist solution are combined with the thin film thickness and the surface tension. Can be efficiently removed, and the bubbles in the resist solution can be reliably removed, so that a more economical viscous fluid bubble removing device can be provided.
Further, according to the viscous fluid bubble removing apparatus of the present invention, the viscous fluid storage tank can be made compact because of its simple structure, and the viscous fluid storage tank can be easily disassembled and cleaned. I can do it.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view showing one embodiment of a viscous fluid bubble removing device according to the present invention.
FIG. 2 is an explanatory view showing a state in which bubbles are removed while a viscous fluid flows down an outer wall of a cylindrical body.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Resist liquid storage tank 12 Resist liquid 13 Supply port 14 Diluent supply pipe 15 Resist liquid supply nozzle 16 Table 17 Cylindrical body 18 Top plate 19 Depression 21 Bubbles 22 Discharge port 23 Discharge pump

Claims (2)

レジスト液塗布装置における循環式レジスト液供給機構等において使用される粘性流体の気泡除去装置であって、粘性流体貯留槽と、粘性流体貯留槽の上部に形成された粘性流体の供給口と、粘性流体貯留槽内に取り付けた天板部を有する筒状体とを有し、上記筒状体を下方に向かってその径を拡大するテーパ状に形成した上、上記供給口から粘性流体を放出して、粘性流体が筒状体の外壁を流下する間に、粘性流体に含まれる気泡を除去するようにしたことを特徴とする粘性流体の気泡除去装置。A viscous fluid bubble removing device used in a circulation type resist solution supply mechanism or the like in a resist solution application device, comprising: a viscous fluid storage tank; a viscous fluid supply port formed in an upper part of the viscous fluid storage tank; A cylindrical body having a top plate portion mounted in the fluid storage tank, and forming the cylindrical body in a tapered shape whose diameter increases downward, and discharging the viscous fluid from the supply port. And removing bubbles contained in the viscous fluid while the viscous fluid flows down the outer wall of the cylindrical body. 筒状体が、その天板部に粘性流体を貯留しつつ筒状体の外壁側に向かって越流させる凹部を設けてなる請求項1に記載の粘性流体の気泡除去装置。2. The device for removing bubbles of a viscous fluid according to claim 1, wherein the cylindrical body is provided with a concave portion for allowing the viscous fluid to flow toward the outer wall side of the cylindrical body while storing the viscous fluid in a top plate portion thereof.
JP2002353063A 2002-12-04 2002-12-04 Bubble removal device for viscous fluid Expired - Fee Related JP4196372B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7879140B2 (en) 2005-12-28 2011-02-01 Metso Paper, Inc. Method and apparatus for degassing coating material
US7935179B2 (en) 2005-06-02 2011-05-03 Metso Paper, Inc. Method and arrangement for exhausting gas from a coating material
JP2013058655A (en) * 2011-09-09 2013-03-28 Tokyo Electron Ltd Liquid processing device and liquid processing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7935179B2 (en) 2005-06-02 2011-05-03 Metso Paper, Inc. Method and arrangement for exhausting gas from a coating material
US7879140B2 (en) 2005-12-28 2011-02-01 Metso Paper, Inc. Method and apparatus for degassing coating material
JP2013058655A (en) * 2011-09-09 2013-03-28 Tokyo Electron Ltd Liquid processing device and liquid processing method

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