JP2004151119A - パターン欠陥検査方法および検査装置 - Google Patents

パターン欠陥検査方法および検査装置 Download PDF

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Publication number
JP2004151119A
JP2004151119A JP2003432567A JP2003432567A JP2004151119A JP 2004151119 A JP2004151119 A JP 2004151119A JP 2003432567 A JP2003432567 A JP 2003432567A JP 2003432567 A JP2003432567 A JP 2003432567A JP 2004151119 A JP2004151119 A JP 2004151119A
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Japan
Prior art keywords
image
sample
electron beam
inspection
area
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JP2003432567A
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Japanese (ja)
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JP2004151119A5 (enExample
Inventor
Hiroyuki Shinada
博之 品田
Yusuke Yajima
裕介 矢島
Hisaya Murakoshi
久弥 村越
Masaki Hasegawa
正樹 長谷川
Mari Nozoe
真理 野副
敦子 ▲高▼藤
Atsuko Takato
Katsuya Sugiyama
勝也 杉山
Katsuhiro Kuroda
勝廣 黒田
Kaoru Umemura
馨 梅村
Yasutsugu Usami
康継 宇佐美
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Hitachi Ltd
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Hitachi Ltd
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Priority to JP2003432567A priority Critical patent/JP2004151119A/ja
Publication of JP2004151119A publication Critical patent/JP2004151119A/ja
Publication of JP2004151119A5 publication Critical patent/JP2004151119A5/ja
Withdrawn legal-status Critical Current

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  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2003432567A 2003-12-26 2003-12-26 パターン欠陥検査方法および検査装置 Withdrawn JP2004151119A (ja)

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JP2003432567A JP2004151119A (ja) 2003-12-26 2003-12-26 パターン欠陥検査方法および検査装置

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JP2003432567A JP2004151119A (ja) 2003-12-26 2003-12-26 パターン欠陥検査方法および検査装置

Related Parent Applications (1)

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JP26950097A Division JP3534582B2 (ja) 1997-10-02 1997-10-02 パターン欠陥検査方法および検査装置

Related Child Applications (1)

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JP2004289636A Division JP4028864B2 (ja) 2004-10-01 2004-10-01 パターン欠陥検査方法および検査装置

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JP2004151119A true JP2004151119A (ja) 2004-05-27
JP2004151119A5 JP2004151119A5 (enExample) 2005-05-26

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JP2003432567A Withdrawn JP2004151119A (ja) 2003-12-26 2003-12-26 パターン欠陥検査方法および検査装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7288948B2 (en) 2003-12-24 2007-10-30 Hitachi High-Technologies Corporation Patterned wafer inspection method and apparatus therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7288948B2 (en) 2003-12-24 2007-10-30 Hitachi High-Technologies Corporation Patterned wafer inspection method and apparatus therefor

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