JP2004148180A - Ink-jet coating apparatus - Google Patents

Ink-jet coating apparatus Download PDF

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Publication number
JP2004148180A
JP2004148180A JP2002315211A JP2002315211A JP2004148180A JP 2004148180 A JP2004148180 A JP 2004148180A JP 2002315211 A JP2002315211 A JP 2002315211A JP 2002315211 A JP2002315211 A JP 2002315211A JP 2004148180 A JP2004148180 A JP 2004148180A
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JP
Japan
Prior art keywords
coating
substrate
discharge
ejection
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2002315211A
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Japanese (ja)
Inventor
Kazuharu Sato
Tsuneyoshi Shimizu
Hironobu Toyoshima
Naoki Watase
和治 佐藤
恒芳 清水
直樹 渡瀬
広宣 豊島
Original Assignee
Hitachi Industries Co Ltd
株式会社 日立インダストリイズ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2002315211A priority Critical patent/JP2004148180A/en
Publication of JP2004148180A publication Critical patent/JP2004148180A/en
Application status is Abandoned legal-status Critical

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Abstract

Conventionally, in a coating apparatus using an ink-jet head, corrections for variations in nozzle positions, variations in ejection amount, and the like have not been made, resulting in deterioration in image quality.
The present invention measures a discharge amount, a discharge angle variation, and the like of an inkjet head, and based on the measurement result, corrects a nozzle driving voltage, corrects a head height, corrects a rotation direction of a nozzle, and performs pixel correction. Each time the nozzle could apply a predetermined amount of coating material.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a thin film manufacturing apparatus and a coating method using an inkjet method.
[0002]
[Prior art]
As a thin film forming method using a conventional ink jet printer, as described in JP-A-2001-52861, a light emitting layer forming coating liquid is discharged using an ink jet printer head, and then formed by heating and drying. It is disclosed that this coating may be performed under atmospheric pressure or under reduced pressure.
[0003]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2001-52861
[Problems to be solved by the invention]
Patent Document 1 discloses that a coating liquid is discharged from a plurality of discharge nozzles into a predetermined frame formed on a substrate, but does not disclose a specific configuration of a manufacturing apparatus. Therefore, there is no disclosure of how to set the positional relationship between the frame and the nozzle.
[0005]
Therefore, the present invention realizes a position of a plurality of nozzles (discharge holes) provided in an ink jet head and a thin film forming apparatus for accurately discharging a coating liquid into a frame formed on a substrate side, and a coating method thereof. It is proposed.
[0006]
[Means for Solving the Problems]
It has been confirmed that the variation of the diameter variation of the droplet particles of the ink jet head 1, the variation of the ejection direction, and the like are relatively good in each nozzle alone if the reproducibility of the ejection characteristics is constant under the operating conditions. In the present invention, the tolerance due to the manufacturing tolerance of each nozzle is very large, or the environment changes when coating is performed, that is, for example, a temperature change, a viscosity change of a material to be coated, a temporal characteristic of the inkjet head 1. Focusing on the large influence of the change, immediately before performing coating, for example, using an empty space of the substrate, measuring the ejection characteristics of each nozzle, converting the data for each nozzle, The control parameters are changed on the basis of the data measured for each nozzle, so that a coating amount for each pixel is made constant and a variation in coating position is minimized.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of an organic EL manufacturing apparatus will be described as an example of a thin film forming apparatus of the present invention.
[0008]
FIG. 1 shows a schematic configuration of an organic EL manufacturing apparatus.
This apparatus includes a gantry 40, an inkjet head mechanism provided on a stage provided on the gantry, a substrate mounting unit including a group of tables capable of mounting the substrate 6 and moving the substrate position in XYθ. A detection mechanism for detecting the discharge amount, the substrate position, and the like. The ink jet head 1 (hereinafter, sometimes abbreviated as a head) includes a plurality of ejection holes for ejecting a hole transport layer material and a light emitting layer material, and a piezo drive mechanism for ejecting the material from each ejection hole. I have. The inkjet head 1 is mounted on a Z-axis stage provided on a cross beam 19 of a portal stage provided on a gantry. The Z-axis stage is provided with a rotation driving means for rotating the head 1 about a Z-axis perpendicular to the surface of the substrate 6 as a rotation axis in order to align a nozzle interval with a pixel interval of the substrate 6. A head rotation shaft 20 such as a shaft or a gonio rotation shaft is provided. The head 1 is attached to the head rotation shaft 20. Further, the Z-axis stage is provided with a Z-axis drive mechanism (Z-axis drive motor) for moving the head 1 in the Z-axis direction. The Z-axis drive mechanism adjusts the height of the head 1 based on the measurement value of the displacement meter 8 which is a part of the detection mechanism for measuring the height from the ejection hole of the head 1 to the surface of the substrate to the substrate and the ejection hole. Is maintained at a predetermined amount.
[0009]
Further, as a detection mechanism, a camera 21 which is attached to the side surface of the substrate suction table 10 below the head 1 and moves to the lower part of the head 1 to recognize the discharge particle diameter 3, a droplet applied on the substrate and And a camera 18 for recognizing the pixel matrix. Further, an optical sensor as a displacement meter 8 for measuring the distance between the substrate 6 and the head 1 is provided. When the camera 21 recognizing the ejection particle diameter 3 is moved to the lower part of the head, a tray for receiving the application material is provided at the application material ejection position on the gantry side below the head ejection hole. The camera 21 is configured to measure the state (particle diameter, discharge angle) of the coating material when the coating material is discharged from the head 1 toward this tray.
[0010]
The substrate mounting section includes a suction table 10 for setting and vacuum-fixing a coated substrate, an X-axis stage 23, a Y-axis stage 24, and a θ-axis stage 22 each having a driving mechanism for moving the substrate to a coating position during coating. Become. Each drive mechanism is controlled by the control device 25 and the PC 26. The control device 25 and the PC 26 control each unit and calculate data based on the measurement data of the detection mechanism unit.
[0011]
The organic EL manufacturing apparatus according to the present invention is adapted to cope with a displacement of a discharge hole with respect to a coating groove provided on the substrate and a displacement of a discharge angle of the discharge hole.
[0012]
Next, a configuration of an organic EL panel will be described as an embodiment with reference to FIG.
[0013]
The glass substrate 6 used as the organic EL substrate has a Corning # 1737 thickness of 0.7 mm. On the substrate 6, indium tin oxide (ITO) 11 which is a transparent electrode having a sheet resistance of 80Ω / □ and a thickness of 45 nm is formed. In an actual display substrate, it is necessary to perform patterning for each pixel in an active matrix and for each pixel column in a passive matrix. However, in this embodiment, an indium tin oxide (ITO) 11 film was formed on the entire surface of the substrate without patterning. Next, using photosensitive polyimide, the partition walls 5 were formed by photolithography in a lattice shape having a film thickness of 3 μm, a width of 20 μm, and a vertical and horizontal interval of 50 μm. The partition 5 is formed so that the applied material does not flow and mix.
[0014]
Further, as shown in FIG. 2, the organic EL is constituted by a multilayer film. In this structure, the indium tin oxide (ITO) layer 11 serving as an anode is formed on the glass substrate 6 as described above. A plurality of partition walls 5 are formed thereon, and a hole transport layer 12 is provided on the ITO layer 11 in each partition wall 5 for the purpose of reducing an electric barrier and smoothing supply of holes. Further, a light emitting layer 13 for emitting visible light by recombination of holes and electrons injected from both electrodes is provided thereon. An electron injection electrode 14 made of a metal having a small work function, such as Ca, is provided thereon to alleviate an electrical barrier and smoothly inject electrons. Further thereon, there is provided a low-resistance and chemically stable electrode 15 of, for example, Al. Furthermore, since the luminescent layer material generally deteriorates when it comes into contact with moisture or oxygen, the organic EL element is sealed in a sealing can 17 that shuts off moisture and oxygen in an atmosphere of an inert gas 16 such as N 2 .
[0015]
In this embodiment, the film is formed by the inkjet method on both or any of the hole transport layer 12 and the light emitting layer 13 in FIG. As a polymer-based hole transport layer material, for example, polyaniline (PANI) and 3,4-polyethylenedioxythiofin / polystyrene sulfonate (PEDOT / PSS) are well known. Examples of the polymer organic light emitting layer material include polyparaphenylene vinylene (PPV), polyfluorene (PFO), and polyvinyl carbazole (PVK). In the embodiment of the present invention, an aqueous solution of polyaniline (PANI) is used as the material of the hole transport layer 12, and a mixed xylene solution of polyparaphenylene vinylene (PPV) is used as the material of the light emitting layer 13.
These thin films are formed by using an ink jet type head. As the ink jet type, any of a bubble jet type, a type using a piezo, an electromagnetic actuator, or the like may be used. In addition, in order to efficiently and accurately apply the light-emitting pixels to the light-emitting pixels of the display substrate 6 in which the light-emitting pixels are arranged in a matrix, the present embodiment employs an on-demand method, in which 128 nozzles are linearly arranged at 100 μm intervals. It was done.
[0016]
By the way, in the inkjet head 1, as initial manufacturing variations, variations in the shape of each ejection hole, variations in the spacing between each ejection hole, variations in the polarization characteristics of the piezos corresponding to each ejection hole, and variations in the volume of the ink chamber corresponding to each nozzle. And so on. Further, there is a discharge variation in which the discharge amount changes for each discharge hole with aging. Therefore, the present invention provides a film forming apparatus capable of preventing a decrease in film forming accuracy due to such a variation and maintaining a highly accurate film forming.
[0017]
Next, a correction method corresponding to various variations will be described.
[0018]
FIG. 3 shows a correction method when the interval between the ejection holes of the head and the interval between the pixels on the substrate are different. In this embodiment, the head 1 is provided with a plurality of ejection holes 2 in a row at substantially uniform intervals. The interval between the adjacent ejection holes 2 is provided so as to substantially coincide with the interval (pixel interval) substantially at the center between adjacent pixels 36 partitioned by the partition walls 5 formed on the substrate 6. However, the pixel interval 35 on the substrate side may be formed smaller than the interval 34 between the ejection holes 2 of the head 1. As a correction method in this case, as shown in FIG. 3, by rotating by a predetermined angle 33 around the center (head center) 32 of the ejection hole provided with a plurality of heads 1, the position of the ejection hole is It is to match. In this case, the discharge time from each discharge hole is shifted in accordance with the correction rotation amount, and control is performed so that the film forming material is applied to the corresponding pixel 36 on the substrate 6. In this embodiment, as shown in FIG. 3, the coating is performed by moving the table on which the substrate 6 is mounted in the direction of the arrow 37 with the head 1 fixed. When the pixel interval is larger than the ejection hole interval (especially when the ejection hole position is out of the corresponding pixel range even if a plurality of ejection holes are shifted laterally), the head needs to be replaced.
[0019]
Next, FIG. 4 shows a state of variation in the size of the droplet particles. The variation in the size of the droplet particles 3 is caused by the variation in the shape of the ejection holes (nozzles) 2 provided in the head 1, the variation in the polarization characteristics of the piezo elements, and the variation in the volume of the ink chamber corresponding to each nozzle 2. appear. In FIG. 4, it is ideal that a film of the same amount of the coating material is formed in the partition wall 5 provided on the substrate 6, but the film pressure is different depending on the variation of the discharge amount as shown in the figure. Hereinafter, a method of correcting the variation will be described.
[0020]
FIG. 5 shows the size variation of the droplet particles 3 of the inkjet head 1 used in the present embodiment. FIG. 5A shows the number of ejections of the droplet particles 3 of the same nozzle (ejection hole) 2 and the state of change in the ejection amount (volume variation). FIG. 5B shows the difference between different nozzles (piezoelectricity of each nozzle). The voltage of the same size and the same width is applied to the element.) The result of measuring the volume variation of the droplet particles 3 is shown. As shown in (a), the variation amount in the same nozzle 2 is relatively small. On the other hand, the volume variation of the droplet particles 3 generated between different nozzles 2 is very large. By the way, as described above, the variation that occurs between different nozzles 2 is caused by the initial characteristic variation of each nozzle 2 that occurs when the inkjet head 1 is manufactured.
[0021]
Further, as a factor affecting the volume variation of the droplet particles 3, besides the initial characteristic variation of the nozzle 2, the influence of a change in the coating environment may be considered. For example, if the temperature of the atmosphere in which the coating is performed changes, the viscosity of the coating material changes, and the volume of the droplet particles 3 changes even if the same ejection control is performed. Also, when the characteristics of the ejection material change, that is, when the solute content and the solute molecular weight change, for example, the volume of the droplet particles 3 also changes.
[0022]
Therefore, the same voltage is applied to the piezo element of each nozzle, the size of the droplet particles 3 immediately before application is measured, and recorded in the database of the control device 25. Then, by controlling the coating based on the recorded data, it is possible to reduce the variation in the coating amount between the pixels or the predetermined film thickness. In other words, by varying the magnitude of the voltage applied to the piezo element and the duration of the application based on the size of the droplet particles, a predetermined amount (predetermined size) of droplets can be ejected from the nozzle. . Thus, it is possible to provide a thin film forming apparatus capable of manufacturing a high-quality organic EL having no defective application pixels 9.
[0023]
As a method of measuring the size of the droplet particles 3, there is a method of measuring the flying droplet particle diameter 50 with the camera 21, as shown in FIG. In this method, the magnitude of the voltage 29 applied to each piezo element provided in the inkjet head 1 and the application time (width) 30 are made the same by the camera 21, and the particle diameter of the droplet ejected from the nozzle 2 at that time 50 is measured. In this embodiment, the camera 21 for measuring the droplet particle diameter is provided at a position where the droplet range 27 ejected from all nozzles can be seen.
[0024]
As another method, as shown in FIG. 7, the voltage 29 applied to each of the piezo elements provided in the inkjet head 1 and the application time (width) 30 are made equal to each other to discharge from each nozzle 2. The weight of the droplet is measured by the electronic weighing machine 31. In addition to this, a method of measuring the volume with a mass cylinder or the like, image recognition of an area spread by coating on a plane having a constant wettability, or measuring a film thickness by, for example, an optical interferometer, a transmitted light absorption method, a UV irradiation PL It can also be measured by a strength measuring method, a stylus type film thickness measuring method, or the like. Further, it is also possible to perform a combination of the upper two measurement methods.
[0025]
Further, as one of the major factors of the variation, there is variation due to the shape of the discharge hole, particularly the inclination of the discharge hole. FIG. 8 shows a state of variation due to this inclination. FIG. 8A shows the position of ejection of the application material when the application is performed at a predetermined head height (ejection height: distance from the ejection hole to the substrate) h with the ejection hole inclined. FIG. 8B shows the ejection position when the ejection height is changed to h ′.
[0026]
As shown in FIG. 8A, when the ejection holes have an inclination, the application material cannot be ejected into a predetermined pixel, and the application material is ejected to the 5th partition and, in the worst case, the next pixel. Become. FIG. 8A shows a state in which the ejection angle 47 is provided with respect to the normal ejection trajectory so that the application is performed on the top of the partition wall 5 as in the application trajectory 7. This ejection state can be corrected by bringing the coating head closer to the substrate side as shown by the arrow in FIG. 8B and minimizing the influence of the ejection angle of the ejection holes. However, if the ejection height is too small, there is a case where the ejection amount control is well performed (the ejection liquid does not become droplets but continuously flows). For this reason, when the limit is exceeded, the problem is dealt with by replacing the head. The height of the head 1 is measured using an optical displacement meter 8 provided beside the head 1.
[0027]
Next, the operation in the case of actually applying using the above thin film coating apparatus will be described. 9 and 10 show flowcharts of the operation at the time of coating.
[0028]
First, interval data of the partition walls 5 formed on the substrate 6 to be used, interval data of the nozzles 2 of the head 1 and the like are input (step 100). Next, the input partition interval is compared with the nozzle interval (step 101). If the partition interval is larger than the nozzle interval, the head is replaced with a head having a larger nozzle interval (step 102). When the head interval is equal to or smaller than the substrate partition interval, the substrate 6 is loaded onto the suction table 10 of the thin film coating apparatus without replacing the head (step 103). At this time, when an instruction to carry in the substrate is input to the control device, the control device operates each of the drive motors for moving the X, Y, and θ stages constituting the substrate mounting portion so that the suction table is positioned at the substrate carry-in position. Move to Thereafter, the substrate is set on the suction table, and a negative pressure is supplied to a plurality of suction ports provided in the suction table to fix the suction (step 104).
[0029]
Next, a calibration operation is performed according to a command from the control device (step 105). This calibration operation will be described with reference to FIG.
[0030]
First, the controller issues a command to the Z-axis drive motor to drive the Z-axis stage so that the glass substrate does not interfere with the ink-jet head no matter where the suction table moves in the horizontal direction. It is raised to a predetermined evacuation position (step 110). Next, the X, Y, and θ stages are moved by the camera 21 which is positioned below the suction table side surface and the suction stage upper surface and is supported on the suction table side surface or the θ axis stage upper surface, and observes the ejection state of the head. It is moved to the position (step 111). Here, when the droplets corresponding to all the nozzles do not fit in the field of view of the camera 21, the position where the droplet particles corresponding to one end nozzle in the X-axis direction fits in the field of view is set as a predetermined reference position, Move the camera position and observe the droplet ejection state of all nozzles. When all the nozzles fall within the field of view, the position where the center position of the nozzle interval between the nozzles at both ends of the ink jet head is at the center of the visual field in the X-axis direction of the camera 21 is set as a predetermined position, and all the discharge states are observed by one discharge. I do.
[0031]
Next, a command is issued from the control device to the Z-axis motor, and the Z-axis stage is operated until the inkjet head 1 at the predetermined retreat position reaches the predetermined position for measuring the droplet particles. Here, the predetermined position is, for example, a position where the ejected droplet particles become completely spherical due to surface tension in the visual field range of the camera 21.
[0032]
An electric signal of a predetermined initial discharge parameter is sent from the control device to a discharge actuator corresponding to a nozzle for calibrating the ink jet head (the nozzle is initially a nozzle at the end in the minus direction of the X axis), and discharge is performed.
[0033]
The shutter of the camera 1 is kept open, and after a predetermined delay time from the electric signal, a command is given from the control device to a flash strobe light source (omitted in the figure) installed opposite to the camera 1 so that the flash strobe light source emits light for a sufficiently short period of time. The stationary droplet particles are imaged. Although not shown in the figure, the ejected droplet receiving container is provided below the current head position of the suction table or the θ-axis stage so that the ejected particles do not stain the apparatus or the like.
[0034]
Subsequently, the image data of the droplet particles of the camera 1 is taken into the PC from the camera 1, and binarized by, for example, setting a predetermined luminance value to a threshold value on the PC or an image processing board inside the PC to perform the binarization of the droplet particles. Image processing such as obtaining a diameter value or an area value is performed, and data of desired droplet particles prepared in advance is divided from the value. If the absolute value of the division is larger than the predetermined threshold, the ejection amount is kept within the threshold by slightly changing the ejection parameter (decreasing the ejection voltage) in the direction in which the absolute value of the division becomes smaller. After that, the voltage is overwritten on the initial ejection parameter.
[0035]
On the other hand, when the absolute value of the division is smaller than the predetermined threshold, the ejection is performed by increasing the ejection parameter (by increasing the ejection voltage) so that the ejection amount falls within the threshold, and the correction ejection is performed. Each nozzle is individually stored in a storage device such as a PC memory or a hard disk as a parameter. At this time, if the droplet particles corresponding to the nozzle to be measured do not completely enter the field of view of the camera 1, a command is given to the X-axis motor from the control device, and the measurement is not performed for the field of view of the camera 1 in the X-axis direction. The X-axis stage is moved to the nozzle side so that the field of view of the camera 1 is at a position where the droplet particles to be imaged next can be imaged, and discharge is performed from the nozzle. When the corrected ejection parameter data of all the nozzles is stored in the storage device of the PC, the measurement of the correction amount of the droplet particle size ends (step 112). As a method of changing the ejection parameters, for example, there is a method of slightly changing the ejection drive voltage or the ejection drive pulse width.
[0036]
When the measurement and calculation of each correction amount are completed, first, an operation (head tilt correction) of adjusting the inkjet nozzle interval projected on the X axis to the pixel interval is performed (step 113).
[0037]
In the head tilt correction, a known pixel interval of the substrate in the X-axis projection direction is input to the PC 26, and an operation for prompting the adjustment of the inkjet head rotation axis angle is performed. Subsequently, in the PC 26, assuming that the known nozzle interval is d 1 , the input pixel interval is d 2 , and the head rotation angle is θ 1 , the PC 26 calculates the angle θ 1 by the equation θ 1 = acos (d 2 / d 1 ). decide. The value obtained by the PC 26 is transmitted to the control device 25. From the control unit 25 provides an instruction to the head rotation axis driving motor, the nozzle arrangement rotates the head rotation axis by an angle theta 1 counterclockwise from the position which is parallel to the X axis. At this time, the discharge start time and the end time of each nozzle are set according to the rotation angle.
[0038]
Next, the head height is corrected (step 114). As described with reference to FIG. 8, this correction has a variation in the discharge angle of each nozzle, and depending on the nozzle height, the coating liquid may be applied to the partition wall 5 or the adjacent pixel area. Is calculated using the result of detection of the application state, and the head height is adjusted (measured by the displacement gauge 8) so that the nozzle can be applied to a predetermined pixel area. .
[0039]
Next, the ejection driving voltage corrected for each nozzle is set using the detection result of the application state (step 115). In this case, the correction is performed by changing only the discharge voltage. However, when the discharge amount is considerably smaller than the reference value, it is also possible to discharge a predetermined amount of the coating material by increasing the number of discharges. .
[0040]
When the above correction is completed, the substrate position is moved to the coating start position, and the calibration is completed.
[0041]
When the calibration is completed, the coating operation is performed in the state of the corrected control amount, and the coating is performed on all the determined areas of the substrate (Step 106).
[0042]
When the coating is completed, the suction force of the suction table holding the substrate is reduced to zero so that the substrate can be removed from the suction table (step 107). Thereafter, the substrate is unloaded from the coating apparatus (Step 108), and the coating operation is completed.
[0043]
When a voltage of 5 V was applied to the organic EL element formed by the above-described method, it was confirmed that the organic EL element exhibited high-quality characteristics without defective pixels and color unevenness. In this example, the organic EL manufacturing apparatus has been described as an example. However, using a head having a plurality of nozzles, a predetermined amount of a coating material is applied to a predetermined area to obtain a high-quality image. It goes without saying that the present invention can be applied to a coating apparatus.
[0044]
【The invention's effect】
In the present invention, the variation in the ejection amount, the ejection angle, etc. of the inkjet head is such that the variation in the ejection characteristics of each single nozzle is relatively small, and the variation in the initial characteristics generated during manufacturing between different nozzles is very small. It is important to note that the effect of environmental changes during application, that is, for example, changes in temperature, changes in viscosity of the material to be applied, and changes in the aging characteristics of the inkjet head is large, and immediately before application. By measuring and converting the ejection characteristics of each nozzle into data and controlling the application based on the data, it is possible to minimize variations in the thickness and application position of the coating film for each pixel and to manufacture a high-quality panel without defective pixels. .
[Brief description of the drawings]
FIG. 1 is a diagram showing an overall configuration of a thin film forming apparatus.
FIG. 2 shows a cross-sectional view of the organic EL element.
FIG. 3 is a diagram illustrating a method of correcting a difference between a nozzle interval and a pixel interval.
FIG. 4 is a diagram showing a difference in nozzle discharge amount.
FIG. 5 illustrates variations in the discharge amount from a nozzle.
FIG. 6 is a diagram illustrating a method of measuring the discharge amount from a nozzle.
FIG. 7 is a diagram illustrating a method of measuring the discharge amount from a nozzle by weight.
FIG. 8 is a diagram illustrating a method of correcting a variation in nozzle ejection angle.
FIG. 9 is a flowchart illustrating the operation of the coating apparatus of the present invention.
FIG. 10 is a flowchart illustrating details of a calibration operation in FIG. 9;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Ink-jet head, 2 ... Nozzle, 3 ... Droplet particles, 4 ... Coating film, 5 ... Partition wall, 6 ... Glass substrate, 7 ... Discharge direction, 8 ... Displacement meter, 9 ... Poorly applied pixel, 10 ... Substrate suction table , 11: indium tin oxide (ITO), 12: hole transport layer, 13: light emitting layer, 14: electron injection electrode, 15: electrode, 16: inert gas (N2), 17: sealing can, 18: coating Position recognition camera, 19: Z axis stage, 20: Head rotation axis, 21: Application particle diameter recognition camera, 22: θ axis stage, 23: X axis stage, 24: Y axis stage, 25: control device, 26: PC , 27: Applied particle recognition position, 28: Ejection drive waveform, 29: Ejection drive voltage, 30: Ejection drive pulse width, 31: Electronic weighing scale, 32: Head rotation center, 33: Head rotation angle, 34: Nozzle interval , 35 ... pixel Distance, 36 pixels, 37 application direction, 38 application position, 39 application orthogonal direction shift, 40 application direction shift, 41 application position recognition board, 42 application position recognition marking, 43 correction amount, 44 ... Nozzle center, 45 ... Pixel center, 46 ... Discharge timing shift time, 47 ... Discharge angle, 48 ... Distance between substrate nozzles, 49 ... Head height correction amount, 50 ... Droplet particle diameter.

Claims (4)

  1. An inkjet head having a plurality of ejection holes for ejecting the application material, and having an ejection unit for ejecting the application material for each of the ejection holes, and a substrate on which an application area is divided and provided; A substrate suction table provided with a drive mechanism for moving the substrate to a coating position, a detector for discharging the coating material from the inkjet head to a test area on the substrate, and detecting the discharge state, and the detector An ink jet coating apparatus, comprising: a correction unit that corrects a coating condition based on the detection result.
  2. The inkjet coating device according to claim 1,
    The detector detects a discharge amount of the coating material from the plurality of discharge holes, and the correction unit changes the drive voltage of the discharge unit provided for each of the plurality of discharge holes, thereby applying the coating material to each of the discharge holes. An ink jet coating apparatus characterized in that a discharge amount of a material is made substantially uniform.
  3. The inkjet coating device according to claim 1,
    The ink jet coating apparatus according to claim 1, wherein said correcting means varies a horizontal tilt angle of said ink jet head in accordance with a displacement amount between said plurality of discharge holes and a discharge area provided on said substrate.
  4. The inkjet coating device according to claim 1,
    The detector detects a direction in which the coating material is discharged from the plurality of discharge holes, and the correction unit controls the inkjet head and the substrate so that the coating material can be discharged from the discharge hole into a coating region on the substrate. An ink-jet coating apparatus characterized in that the distance between the ink-jet coating apparatus and the ink jet coating apparatus is variable.
JP2002315211A 2002-10-30 2002-10-30 Ink-jet coating apparatus Abandoned JP2004148180A (en)

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